KR20240093326A - Processing method of semiconductor manufacturing apparatus - Google Patents

Abstract

The present invention acquires the entire image of the substrate, collects semiconductor material information and recognition mark information from the entire image, extracts parameters necessary for process automation from the collected information, and determines a predetermined value for the semiconductor material based on the extracted parameters. Provides a processing method for a semiconductor manufacturing device that performs work. According to the present invention, unmanned processing is possible even without an operator by automatically implementing the entire process of setting and processing without the operator's expert knowledge, and automatically meeting the relevant standards even without knowing any information about the semiconductor material. Inspection can be performed and has the effect of ensuring uniform work performance every time.

Description

Processing method of semiconductor manufacturing apparatus}

The present invention relates to a processing method for semiconductor manufacturing equipment.

A semiconductor manufacturing device is a device that performs certain operations on semiconductor materials in order to process them. An example of a semiconductor manufacturing device is a semiconductor cutting device that cuts a substrate into a plurality of semiconductor materials, goes through processes such as cleaning, drying, and inspection, classifies them into good/defective products, loads them on a tray, and carries them out.

In order to enable the semiconductor manufacturing equipment to continuously process the substrate and semiconductor material through a series of processes, the operator manually entered information on the semiconductor material and inspection conditions necessary to perform the above series of processes.

In addition, among the input inspection conditions, it is necessary to set various vision and inspection parameters such as the brightness of the lighting, lighting color, quality, histogram, and matching ratio to identify the object to be inspected. There is a big difference in setting quality and setting time depending on the operator, requiring a high level of expertise.

Therefore, if the worker's work skills are low, there is a problem in that it is difficult and takes a long time to manually input semiconductor material information and inspection conditions into the semiconductor manufacturing device.

Additionally, in the conventional case, there is the inconvenience of having to manually input information or processing conditions suitable for the semiconductor material every time the semiconductor material is changed.

In order to solve this problem, methods are being proposed to simply input and perform semiconductor material information or processing condition settings in semiconductor manufacturing equipment. However, these processing condition input and setting methods allow the operator to first obtain information on the semiconductor material and set the first semiconductor material inspection location and vision inspection location in advance, or the operator directly sets the information on the semiconductor material through the screen. Because it is a method, operator intervention is absolutely necessary, and there is a problem that complete automation cannot be implemented.

The present invention obtains the information of the substrate and the information of the semiconductor material formed on the substrate through the entire image of the substrate, so that automation can be implemented for all processes for semiconductor materials without the operator manually entering information on the substrate and semiconductor material. The purpose is to provide a processing method for semiconductor manufacturing equipment.

Additionally, the purpose of the present invention is to provide a processing method for a semiconductor manufacturing device that can perform a predetermined task on the semiconductor material even without knowing the information about the semiconductor material.

In addition, the present invention aims to enable unmanned processing even in situations where there is no operator present, as the entire process of setting and processing for the processing can be automatically implemented even without the operator's expert knowledge.

A processing method of a semiconductor manufacturing apparatus according to one feature of the present invention is to supply a plurality of semiconductor materials and a substrate on which an identification mark is formed to a loading unit, divide the substrate supplied to the loading unit into a plurality of imaging areas, and use a first vision to divide the substrate supplied to the loading unit into a plurality of imaging areas. Obtaining a plurality of partial images by sequentially photographing; obtaining a full image of the substrate by combining the plurality of partial images; collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate; Extracting the collected information into parameters necessary for process automation; and performing a predetermined operation on the semiconductor material based on the extracted parameters.

In addition, the predetermined task is a task of cutting, inspecting, and loading the substrate into a plurality of semiconductor materials, and after the step of extracting the parameters, the alignment state of the substrate is determined by the first vision based on the extracted parameters. inspecting and sorting steps; A strip picker delivering the aligned substrate to a placement table and inspecting a cutting line for the semiconductor material using a second vision based on the extracted parameters for the substrate delivered to the placement table; And further comprising dividing the substrate into a plurality of semiconductor materials by cutting with a cutting section along the expected cutting line inspected by the second vision.

In addition, the step of extracting the parameter is characterized by specifying a reference mark and acquiring parameters for automatically performing the predetermined task based on the designated reference mark from the collected information, and the reference mark is selected from a dictionary. It is characterized by designation through learning or deep learning.

In addition, the step of acquiring a plurality of partial images by sequentially imaging with the first vision is characterized in that an area larger than a predetermined range is sequentially imaged multiple times, and each imaging area partially overlaps.

In addition, the collected information includes the shape, size, location, number, , and the parameter is characterized in that one or more values extracted from the collected information to automatically process the relevant process or a value calculated from the extracted values.

In addition, the step of inspecting and aligning the alignment of the substrate with the first vision includes setting a vision parameter of the first vision for a reference mark to be inspected with the first vision; Setting an identification reference value for identifying the reference mark while applying the set vision parameters; Obtaining the center position of the substrate by searching for a reference mark corresponding to the extracted parameter and an identification reference value of the reference mark set as the identification reference value; calculating an error value between the center position of the substrate and the preset center position of the loading unit; and aligning the position of the substrate by correcting an error value of the substrate so that the center of the substrate matches the center position of the loading portion through relative movement of the strip picker and the loading portion.

In addition, the extracted parameter includes location information of the reference mark, and the step of obtaining the center position of the substrate includes: searching for the reference mark location information and a reference mark provided at the outermost edge of the substrate; Obtaining position coordinates of the outermost reference mark of the substrate from a positional relationship between the position of the fiducial mark provided in the loading unit and the outermost reference mark of the substrate; and selecting the center position of the diagonal distance of the outermost reference mark as the center position of the substrate.

In addition, the step of inspecting the cutting line for the semiconductor material with the second vision based on the extracted parameters includes setting a vision parameter of the second vision for a reference mark to be inspected with the second vision; Setting an identification reference value for identifying the reference mark while applying the set vision parameters; Searching for a reference mark corresponding to an identification reference value of the reference mark set as the extracted parameter and the identification reference value; calculating a virtual cutting line for cutting the substrate according to the search results; and determining whether the calculated virtual cutting line is accommodated in the blade escape groove provided on the placement table.

In addition, after dividing the substrate into a plurality of semiconductor materials, a unit picker picks up the cut semiconductor materials and delivers them to the dry block; inspecting the upper surface of the semiconductor material using a third vision based on parameters extracted for the semiconductor material delivered to the dry block; Transferring the semiconductor material on which the top surface inspection has been completed to an alignment table; A sorting picker moving to the upper part of the fourth vision while picking up one or more of the semiconductor materials delivered to the sorting table to inspect and correct the pickup state of the semiconductor materials; and inspecting the lower surface of the semiconductor material picked up by the sorting picker using the fourth vision and then loading it on a tray.

In addition, the step of inspecting the upper surface of the semiconductor material with the third vision based on the extracted parameters includes setting a vision parameter of the third vision for a reference mark to be inspected with the third vision; Setting an identification reference value for identifying the reference mark while applying the set vision parameters; Searching for a reference mark corresponding to an identification reference value of the reference mark set as the extracted parameter and the identification reference value; and determining the state of the upper surface of the reference mark according to the search result.

In addition, the set vision parameter includes the brightness or color of lighting, the set identification reference value includes one or more of quality, histogram, and matching ratio, and the identification reference value is automatically set. It is characterized by its characteristics.

In addition, the step of setting the identification reference value may further include the step of resetting the identification reference value for identifying the reference mark using a tolerance set by the customer.

Additionally, setting vision parameters of the fourth vision before performing inspection of the fourth vision;

Setting an identification reference value for searching the lower surface of the semiconductor material in the fourth vision with the set vision parameters applied; It is characterized by determining a standard for judging whether the semiconductor material is good or bad, a classification standard for loading the semiconductor material, or a classification method for loading on the tray, using the set identification standard value and the tolerance set by the customer.

In addition, the step of moving to the upper part of the fourth vision in a state in which the sorting picker picks up one or more of the semiconductor materials delivered to the alignment table and inspecting and correcting the pickup state of the semiconductor material based on the extracted parameters , generating location data of a semiconductor material to be picked up by the sorting picker among the semiconductor materials transmitted to the sorting table based on the extracted parameters; The sorting picker picking up one or more semiconductor materials to be picked up among the generated location data and transferring them to the upper part of the fourth vision; Inspecting the pickup state of the semiconductor material picked up by the sorting picker using the fourth vision and calculating a position correction value so that the center of the semiconductor material matches the center of the fourth vision; and a step of reflecting the calculated position correction value to the sorting picker.

In addition, after the step of extracting the collected information into parameters necessary for process automation, the collected information and the information on the semiconductor material embedded in the 2D code mounted on the top of the wit table, the dry block, and the alignment table are It further includes a step of determining whether there is a match, and if the determination result matches, performing a predetermined operation on the semiconductor material based on the extracted parameter, and stopping the operation if the determination result does not match.

In addition, the processing method of the semiconductor manufacturing device is initially performed once on the first substrate or reference substrate initially supplied from the semiconductor manufacturing device, and subsequent substrates supplied thereafter are based on the parameters set for the first substrate or reference substrate. It is characterized by being carried out by.

The processing method of the semiconductor manufacturing device of the present invention is to obtain the entire image of the semiconductor material, collect semiconductor material information and recognition mark information from the image, extract parameters necessary for process automation from the collected information, and extract the extracted parameters. Based on this, tasks such as sorting, inspection, and sorting of semiconductor materials can be performed automatically.

In addition, even if the type of semiconductor material changes, the parameters necessary for process automation can be automatically extracted from the entire image of the substrate, and the process conditions for performing certain tasks are automatically set based on the extracted parameters, so cutting semiconductor materials is possible. Even if the type of semiconductor material supplied to the device changes, the hassle of manually entering material information for the changed semiconductor material (SM) can be eliminated, and settings can be automatically performed based on automatically obtained information. Therefore, input and setting time can be significantly shortened, and settings suitable for processing can be automatically performed regardless of the operator's level of expertise, improving the processing quality of semiconductor manufacturing equipment.

In addition, the processing method of the semiconductor manufacturing apparatus of the present invention matches the information of the 2D code embedded in the equipment (e.g., wit table, dry block, alignment table) during the automatic setting process and the information of the semiconductor material to be processed. There is an effect of preventing errors in work by determining whether or not

In addition, when acquiring the entire image of the substrate and extracting the necessary parameters from the entire image, the reference mark (reference mark to be inspected) required for detection in the corresponding step is set for the vision for performing each step, and the corresponding standard is set. Since the identification standard value for identifying the mark can be automatically set, even if you do not know any information about the semiconductor material, you can automatically perform an inspection that meets the standard and have the effect of ensuring uniform work performance every time.

In addition, according to the present invention, the entire processing method of the semiconductor manufacturing device can be performed automatically even in the absence of an operator during work, which has the effect of enabling unmanned processing.

In addition, according to the present invention, parameters can be extracted based on the information collected in the first vision and the extracted parameters can be used to automate the process of the second vision, third vision, sorting picker, etc., thereby simplifying the setting. There is.

In addition, according to the present invention, the tray and the sorting table are sequentially photographed and synthesized using the fifth vision to collect the sorting table information and the tray information, and based on each collected information, the sorting picker determines the sorting table. There is an effect of picking up semiconductor materials from the loading groove and automatically sorting and loading the semiconductor materials into the tray's seating groove.

In addition, each time a new tray is supplied, it is possible to prevent incorrect trays from being supplied by inspecting the seating groove corresponding to the preset predetermined seating groove of the supplied new tray based on the location and size information of the tray's seating groove. .

In addition, even if there is a deviation in the supplied state and position of the tray, the two or more outermost seating grooves are inspected based on the location information of the tray's seating grooves, and the seating groove positions of the newly supplied tray are recalculated and the recalculated Semiconductor materials can be loaded at the seating groove location, which has the effect of improving seating precision.

In addition, according to the present invention, when the semiconductor materials are all seated in the material seating grooves of the tray, the seating condition of the tray is inspected, and if the seating condition is poor as a result of the inspection, the pickup unit of the sorting picker loaded with the semiconductor material is checked and the If the number of defective seating of the pickup unit exceeds a predetermined number of times, it is possible to check the status of the pickup unit and take action by skipping the loading operation of the pickup unit or notifying the operator of a work error in the pickup unit.

In addition, the processing method of the semiconductor manufacturing apparatus of the present invention performs a process of acquiring material information at the front end of the entire process and utilizes the obtained information in the subsequent process, so that the semiconductor material information required to perform the subsequent process Without manually inputting, processing conditions (specifically, the location of the inspection object, the order of the inspection object, the processing order, etc.) corresponding to the subsequent process to be performed can be automatically set.

In addition, according to the processing method of the semiconductor manufacturing device, material information necessary for process automation can be collected from the entire image of the substrate, and parameters necessary for process automation can be extracted from the collected information, and the semiconductor materials can be determined based on the extracted parameters. Since it can perform certain tasks, it can be used in various processes for processing semiconductor materials, such as aligning, cutting, stacking, and sorting semiconductor materials, as well as bonding, attaching, and detaching.

1 is a plan view of a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention.
Figure 2 is a diagram showing a state in which a mosaic process is performed using the first vision.
Figure 3 is a diagram showing a state in which the entire image is displayed on the display.
4 is a flowchart of the processing method of the semiconductor manufacturing apparatus of the present invention.
5 is a schematic block diagram of the configurations of a semiconductor manufacturing apparatus.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-mentioned purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective explanation of technical content. The form of the illustration may be modified depending on manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process. Technical terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “comprise” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, but are intended to indicate the presence of one or more other It should be understood that this does not exclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

The processing method of the semiconductor manufacturing apparatus of the present invention supplies a plurality of semiconductor materials and a substrate on which an identification mark is formed to a loading unit or a placement table, divides the substrate supplied to the loading unit or placement table into a plurality of imaging areas, and uses a first vision acquiring a plurality of partial images by sequentially photographing; obtaining a full image of the substrate by combining the plurality of partial images; collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate; Extracting the collected information into parameters necessary for process automation; and performing a predetermined operation on the semiconductor material based on the extracted parameters.

Here, the substrate may be a strip, wafer, etc., and may refer to a work on which a plurality of semiconductor materials and recognition marks are formed.

Additionally, the loading unit is a space where substrates are supplied and may be a table, supply rail, pre-align unit, etc.

In the present invention, the semiconductor manufacturing device includes one or more of a semiconductor material processing device, a semiconductor material cutting device, a semiconductor material bonding device, a semiconductor material attach device, and a semiconductor material detach device, and the predetermined operation is to align the semiconductor material. alignment work, inspection work to inspect certain items of semiconductor materials, cutting work to divide semiconductor materials, bonding work to join semiconductor materials, attach work to attach semiconductor materials, detach work to separate semiconductor materials, This can be a sorting operation to sort semiconductor materials, a loading operation to load semiconductor materials, etc.

If alignment and cutting of semiconductor materials are performed as a predetermined task, alignment and cutting of semiconductor materials may be performed based on parameters.

Specifically, when information on semiconductor materials is acquired from a loading unit, a plurality of semiconductor materials and substrates on which recognition marks are formed are supplied to the loading unit, and the substrates supplied to the loading unit are divided into a plurality of imaging areas. Obtaining a plurality of partial images by sequentially taking pictures with the first vision; obtaining a full image of the substrate by combining the plurality of partial images; collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate; Extracting the collected information into parameters necessary for process automation; inspecting and aligning the alignment of the substrate with the first vision based on parameters; A strip picker delivering the aligned substrate to a placement table and inspecting a cutting line for the semiconductor material using a second vision based on the extracted parameters for the substrate delivered to the placement table; And a step of dividing the substrate into a plurality of semiconductor materials by cutting with a cutting part along the expected cutting line inspected by the second vision.

In addition, when obtaining information about semiconductor materials from a placement table, a plurality of semiconductor materials and substrates on which recognition marks are formed are supplied to the placement table, and the substrates supplied to the placement table are divided into a plurality of imaging areas and used for first vision. acquiring a plurality of partial images by sequentially photographing; obtaining a full image of the substrate by combining the plurality of partial images; collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate; The step of extracting the collected information into parameters necessary for process automation is performed, and after the parameter extraction step, the strip picker delivers the substrate for which the entire image acquisition has been completed to the loading unit, and extracts the substrate delivered to the loading unit. inspecting and aligning the alignment of the substrate with the first vision based on the specified parameters; A strip picker delivering the aligned substrate to a placement table and inspecting a cutting line for the semiconductor material using a second vision based on the extracted parameters for the substrate delivered to the placement table; And a step of dividing the substrate into a plurality of semiconductor materials by cutting with a cutting part along the expected cutting line inspected by the second vision.

That is, the processing method of the semiconductor manufacturing apparatus of the present invention can be performed in the process order after acquiring the entire image of the substrate in the loading unit, or after performing the process of acquiring the entire image of the substrate on the placement table with guaranteed flatness. The semiconductor materials can be delivered back to the loading section and the process can proceed in order.

Of course, a separate work area may be provided within the semiconductor manufacturing equipment to obtain an entire image of the substrate, and its location may be appropriately selected and applied.

Here, the step of extracting parameters is characterized by specifying a reference mark and acquiring parameters for automatically performing the predetermined task based on the designated reference mark from the collected information.

Here, the reference mark may include semiconductor material formed on the substrate, bumps (leads, terminals) formed on the semiconductor material, recognition marks, lines, patterns, holes, etc., and these reference marks can be specified through prior learning or deep learning. there is. If you designate a reference mark, you can obtain parameters to automatically perform a certain task from the designated reference mark.

In other words, when a reference mark is designated within the substrate, a reference mark identical to the designated reference mark is searched from the collected information to obtain parameters from the collected information, and the parameter is one or more values or values to process the process. It can be a value calculated from the extracted value.

The information collected in the present invention includes the shape, size, location, and number of semiconductor materials provided on the substrate, It may include one or more of the number, group spacing, location, shape, and number of the recognition marks. Among the collected information, one or more values required to automate the process or a value calculated from one or more values are used as parameters. It can be acquired.

In the present invention, in order to collect information on the substrate, the substrate supplied to the loading unit is divided into a plurality of imaging areas and sequentially photographed with the first vision to obtain a plurality of partial images. At this time, an area larger than the substrate by a predetermined range is captured multiple times. It is preferable that images are sequentially taken over the area, but each imaging area partially overlaps. The entire image of the substrate can be obtained by sequentially arranging the acquired partial images in the order of shooting and merging them so that the overlapping areas overlap.

When the entire image of the substrate is acquired, information on the semiconductor material and recognition mark information formed on the substrate are collected. Parameters for automating the process can be extracted from the various collected information, and certain tasks can be performed based on the extracted parameters. It will exist.

The first vision is a vision placed at the very front end of the semiconductor manufacturing equipment. It may be the vision that performs the first inspection in the process sequence in the semiconductor manufacturing equipment, or it may be provided separately to obtain the entire area of the substrate. For example, the first vision may be a vision that inspects the alignment of the substrate, and may be movable so that the entire area of the substrate can be sequentially photographed.

In other words, before the first vision inspects the alignment of the substrate, the information formed on the substrate must be collected so that the alignment of the substrate can be automatically inspected. To this end, the substrate is first photographed sequentially with the first vision to determine a plurality of parts. A picture must be obtained. At this time, due to the size of the FOV that the first vision can capture, the substrate cannot be photographed at once, and the first vision is basic enough to clearly identify the semiconductor material and recognition mark formed on the substrate in terms of focus and lighting value. Since the settings are preset, the entire image of the substrate on which partial images are composited is captured as a clear image.

If the substrate is curved or uneven, or if flatness is not secured in the loading part where the substrate is supplied, the first vision is controlled to automatically compensate for the difference in focus when sequentially photographing the substrate. As a result, a clear image is obtained or the substrate is moved to a placement table with guaranteed flatness, and the substrate is adsorbed onto the placement table to make it flat. Then, the substrate is divided into a plurality of imaging areas and photographed sequentially with the first vision. It is also possible to obtain an entire image of the substrate.

Here, the placement table is explained as a table that adsorbs the substrate, but any table can be applied as long as the error in partial images taken sequentially at each position can be minimized.

The first vision may be provided to be movable so that each area can be photographed sequentially, and if the first vision is fixed, the loading unit or placement table supplied with the substrate may be provided to be movable, and the first vision may be provided to be movable so that each area can be photographed sequentially. The vision and the loading unit or placement table are each provided to be relatively movable, so that the first vision can acquire images of the entire area of the substrate.

After acquiring the entire image of the substrate, inspection of the alignment status of the substrate, which is the original task of the first vision, can be performed. Among the various parameters extracted to inspect the alignment status of the substrate with the first vision, the shape and standard of the reference mark are selected. Select a reference mark to inspect using the mark's location information.

First, the first vision moves to the reference mark to be inspected. Then, after setting the vision parameters of the first vision to inspect the reference mark, an identification reference value of the first vision for identifying the reference mark is set with the set vision parameters applied.

Here, the identification reference value may include one or more of quality, histogram, and matching ratio for clearly detecting the reference mark, and the identification reference value may be automatically set after the vision parameters are set. Vision parameters may include items such as brightness, color, and angle of lighting (direct light, metering), etc. The lighting value is automatically set to ensure that the reference mark is clearly visible, and contrast and quality are used as identification criteria for detecting the reference mark. , histogram, and matching ratio values can be set automatically.

Even if the same first vision is used, the identification reference value of the first vision for collecting substrate information and the identification reference value of the first vision for identifying the reference mark may be different.

For this purpose, the first vision moves to the relevant area based on the parameters extracted to inspect the reference mark, photographs the reference mark, and uses lighting to best identify the reference mark from the photographed reference mark. Quality and histogram by automatically setting the values of vision parameters such as Or, automatically set the identification standard value including the matching ratio.

If the identification standard value of the first vision for collecting substrate information and the identification standard value of the first vision for identifying the reference mark are the same, the identification standard value of the first vision for collecting substrate information without separate correction is the reference mark. can be filmed.

After an appropriate identification standard value is automatically set to identify the reference mark, the center position of the substrate can be obtained by searching for the reference mark corresponding to the identification reference value of the reference mark set with the extracted parameters and the identification reference value. Calculate the error value from the preset center position of the loading part. Once the error value is calculated, the picker picks up the substrate and corrects the error value of the substrate so that the center of the substrate matches the center position of the loading unit to align the position of the substrate. At this time, error value correction and position alignment may be performed by the picker or the loading unit, and the position of the substrate may be aligned through relative movement of the picker and the loading unit.

Specifically, in order to obtain the center position of the substrate, the reference mark provided at the outermost edge of the substrate is searched using the location information of the reference mark among the extracted parameters. Here, search may mean finding and moving the corresponding reference mark based on the extracted parameters so that the corresponding reference mark can be inspected, and performing a detailed inspection on the corresponding reference mark.

From the positional relationship between the position of the fiducial mark provided in the loading unit and the outermost reference mark of the substrate, the position coordinates of the outermost reference mark of the substrate are obtained, and the position of the center of the diagonal distance of the outermost reference mark is obtained as the center position of the substrate. It becomes possible.

This explains the method of matching the center of the substrate as an example of alignment, and since the alignment standard and alignment method can be performed in various ways depending on the work standard, the alignment standard and alignment method of the present invention are not limited to the above.

In other words, an identification standard value is set to identify one reference mark to be inspected with the corresponding vision among a plurality of semiconductor materials and recognition marks formed on a substrate, and a standard corresponding to the identification reference value of the reference mark set with the extracted parameters and identification reference value is set. Searching for a mark and performing correction according to the search results corresponds to the alignment of the present invention. At this time, the reference mark may be one or more semiconductor materials or recognition marks acquired through prior learning or deep learning to automatically perform the corresponding task, among various semiconductor materials and recognition marks.

For reference, when setting the identification standard value, if there is a separate tolerance set by the customer, the tolerance range can be used to reset the identification standard value to identify the reference mark.

In addition, in the loading part, a reference mark to be inspected with the first vision is photographed along with a fiducial mark (F) to find the exact center of the semiconductor material, and the fiducial mark (F) is a fixed fiducial block of the equipment (not shown). ), and the fiducial mark (F) can be a reference point when calculating the position of the reference mark to be inspected with the first vision.

The second vision can be a vision that calculates the expected cutting line of semiconductor materials in a semiconductor manufacturing equipment. The FOV of the second vision is smaller than the FOV of the first vision, so when partial images are acquired and synthesized in the second vision, more shots are needed to photograph the entire substrate, and it takes a lot of time to composite the acquired images. Since this may take some time, it is desirable to perform the task of acquiring the entire image in the first vision with a relatively large FOV.

In addition, since the first task to be performed is alignment in the first vision, in order to automate the alignment of the first vision, the entire image of the substrate is acquired in the first vision, and semiconductor material information and recognition are obtained from the acquired image. It is desirable to collect mark information.

If there is no separate alignment vision and the first vision to be performed is the second vision, multiple partial images are taken in the second vision to collect semiconductor material information and recognition mark information for the relevant substrate, and the partial images are It is also possible to obtain an entire image of the substrate through compositing. Here, the division into the first vision and the second vision is for explanation purposes, and in equipment without the first vision, the second vision can become the first vision.

The second vision sets the vision parameters of the second vision for the reference mark to be inspected with the second vision to calculate the cutting line for semiconductor materials, and then uses the second vision to identify the reference mark while applying the set vision parameters. 2Set the identification reference value of the vision, and search for the reference mark corresponding to the identification reference value of the reference mark set as the extracted parameter and identification reference value. There are various extracted parameters required for process automation, but the shape and location of the reference mark can be used among the extracted parameters to calculate the expected cutting line. That is, the second vision can search for the shape and position of the reference mark and the reference mark corresponding to the identification reference value of the reference mark set as the identification reference value. For example, if the recognition mark formed on the substrate is designated as a reference mark through the extracted parameters, the second vision moves to photograph the designated reference mark, photographs the reference mark, and determines the best identification of the reference mark from the photographed reference mark. Automatically sets identification standard values, including the values of vision parameters such as lighting, quality, histogram, or matching ratio.

Among the extracted parameters, the recognition mark corresponding to the identification reference value can be searched using the location information of the recognition mark, and a virtual cutting line for cutting the substrate can be calculated using the searched recognition mark. When the expected cutting line is calculated, it is determined whether each calculated expected cutting line is accommodated in the blade escape groove provided on the cutting table, and if it is accommodated in the blade escape groove, cutting is performed along the calculated expected cutting line, and each calculated cutting scheduled line is calculated. If it is determined that one of the lines to be cut is not accommodated within the blade escape groove provided on the placement table, the relevant substrate is picked up with a picker and correction is performed so that each line to be cut corresponds to each blade escape groove provided on the placement table. can do.

Of course, when setting the identification standard value for the second vision, if there is a separate tolerance set by the customer, the tolerance range can be used to reset the identification standard value for identifying the reference mark.

For reference, in the step of inspecting the cutting line of semiconductor materials using the second vision, if a separate cutting line is not marked on the substrate, the work of calculating the cutting line through the recognition mark may be performed, but the cutting line may be calculated using the recognition mark. When a line to be cut is displayed, the reference mark may be the line to be cut rather than a recognition mark, and the line to be cut itself may be inspected. Of course, in this case, the recognition mark may be a line.

Previously, the processing method of the semiconductor manufacturing apparatus of the present invention was described, but hereinafter, a semiconductor material cutting device among the semiconductor manufacturing apparatuses will be described in detail as an example of the present invention with reference to the attached drawings. This is merely an example to aid detailed understanding of the present invention, and the present invention is not limited thereto.

In the semiconductor manufacturing apparatus 1 of the present invention described below, the width direction is the ±x direction shown in the drawing, the longitudinal direction is the ±y direction shown in the drawing, and θ shown in the drawing is clockwise or counterclockwise on the x-y plane. It means the direction in which it is rotated.

1 to 5, the processing method of the semiconductor manufacturing apparatus of the present invention will be described.

Figure 1 is a plan view of the semiconductor manufacturing apparatus 1 of the present invention, Figure 2 is a diagram showing a state in which a mosaic process is performed using the first vision, and Figure 3 is a state in which the entire image is displayed on the display. It is a diagram, FIG. 4 is a flowchart of the processing method of the semiconductor manufacturing apparatus of the present invention, and FIG. 5 is a schematic block diagram of the configurations of the semiconductor manufacturing apparatus.

The semiconductor manufacturing apparatus 1 according to FIG. 1 is an apparatus that performs the operations of cutting, inspecting, and loading a plurality of semiconductor materials and a substrate on which an identification mark is formed. Specifically, a loading unit 3 equipped with a loading table, a first vision 5 for photographing the substrate SM on the loading table AT, and a strip picker capable of moving up and down and in the x-axis direction. (6), a placement table (CT) that adsorbs the substrate (SM) delivered by the strip picker (6) and is provided with a blade escape groove for the blade to pass through, and a substrate (SM) adsorbed on the placement table (CT) ), a second vision (7) that inspects the cutting line of the board, and a cutting unit (CP) that cuts the substrate (SM) into individual semiconductor materials (IM) along the cutting line of the board inspected by the second vision (7). and a unit picker (9) that adsorbs the cut semiconductor material (IM) on the loading table (CT), a dry block (DT) to which the semiconductor material is delivered by the unit picker (9), and a dry block (DT) on the dry block (DT). The third vision 10 inspects the upper surface of the semiconductor material (IM), the alignment table (TN) to which the semiconductor material (IM) that has been dried and inspected in the dry block (DT) is delivered, and the alignment table (TN) A sorting picker 12 that adsorbs and transports semiconductor materials (IM) in individual units, a fourth vision 13 that inspects the lower surface of the individual semiconductor materials (IM) adsorbed on the sorting picker 12, and inspection results It includes a tray on which semiconductor materials classified by the sorting picker are loaded, a tray picker (14) that supplies and unloads the tray, and a fifth vision (15) that is mounted on one side of the tray picker and inspects the tray. do.

The loading unit 3 may be provided with a loading table that is movable in the x-axis and y-axis directions and rotatable in the θ-axis direction, and a fiducial mark (F) that serves as a standard for aligning the position of the substrate. The fiducial mark (F) of the loading unit (3) can be displayed on the top of the fixed fiducial block (not shown), and when the interlock pin of the strip picker is installed, the interlock pin is inserted along with the fiducial mark (F). An interlock pin hole (H) may be provided.

A plurality of semiconductor materials (IM) and recognition marks (FD) are formed on the substrate (SM), and the substrate is pulled out from the magazine using a gripper provided on one side of the strip picker and supplied to the loading unit.

When the substrate is supplied to the loading unit 3, the first vision 5 performs the function of acquiring the entire image by sequentially photographing the substrate SM. The first vision 5 uses an extended area (EA) that is larger than the entire area (WA) of the substrate (SM) as the imaging area so that the fiducial mark (F) of the loading unit (3) can be photographed together with the substrate. Set it. Afterwards, the photographed area is sequentially imaged multiple times. At this time, each imaging area has some overlapping areas. That is, the divided area DA is sequentially photographed with the first vision 5 to obtain a plurality of partial images. The size of the partition area (DA) may be determined by a default value set to a certain size. The first vision 5 can sequentially photograph the divided area DA from at least one side of the substrate SM, sequentially arrange the plurality of acquired partial images in the photographing order, and merge the plurality of partial images by overlapping them. do.

If the task of acquiring the entire image of the substrate is performed on the placement table, the strip picker picks up the substrate supplied to the loading unit and delivers it to the placement table, and the substrates delivered to the placement table are sequentially picked up by the first vision 5. You can perform the function of acquiring the entire image by shooting with .

At this time, the only difference is whether the entire image of the substrate is obtained from the loading unit or the loading table, and the imaging method is performed the same.

To be described in more detail with reference to FIG. 2, the first vision 5 first performs the process of photographing the division area (DA) from the left direction (-x direction) upward (+y direction) and sequentially divides it. The process of photographing the area (DA) can be performed multiple times, and is not limited to this, and the divided area (DA) can be photographed for the first time from downward (-y direction) to the left (-x direction). This shooting order can be changed in various ways.

The first vision 5 performs imaging including the overlapped area (RA) when imaging the divided area (DA). The overlapping area (RA) is, when the first vision 5 photographs the divided area (DA) multiple times, at least a part of the divided area (DA) imaged in the previous shooting is added to the divided area (DA) to be imaged in the next time. It is formed by taking pictures, including. In other words, the overlap area (RA) is an area where the previous imaged segment area (DA) overlaps with the next imaged segment area (DA).

More specifically, the extended area EA may be divided into first to twelfth divided areas DA. The division into 1st to 12th division areas (DA) is only an example to help understanding, and the division area can be increased or decreased according to the size of the substrate or the size of the expansion area for imaging. The first vision 5 is used in the x and y axes. The first to twelfth divided areas DA are sequentially photographed while moving in at least one of the directions. The first vision 5 captures the first divided area DA1 and then captures the second divided area DA2, including the outermost area in the +x direction of the first divided area DA1. The outermost area in the +x direction of the first division area DA1 becomes an overlap area RA between the first and second division areas DA1 and DA2. The remaining second to twelfth divided areas (DA2, DA3, DA4, DA5, DA6, DA7, DA8, DA9, DA10, DA11, DA12) are also adjacent to at least one of the width direction (±x direction) and the longitudinal direction (±y direction). It includes an overlap area (RA) consisting of a region that overlaps with the divided area (DA).

The first vision 5 sequentially photographs the first to twelfth divided areas DA to obtain a plurality of partial images DP and then transmits the plurality of partial images DP to the control unit BU. The control unit BU generates one full image WP by sequentially arranging and combining a plurality of partial images DP in shooting order. At this time, the entire synthesized image is shown together with the fiducial mark (F) of the substrate and the loading part.

Semiconductor material (IM) information and recognition mark (FD) information required for the substrate can be collected from the entire image of the substrate. Specifically collected information includes the shape, size, location, and number of semiconductor materials provided on the substrate, Contains one or more of

Parameters necessary for process automation can be extracted from the collected information. In this case, the parameter extracts one or more values to automatically process the process from the collected information, or calculates a value calculated from the values of the collected information. can do.

The parameters calculated here can be stored in the control unit (BU) and used to perform certain tasks in the first vision, second vision, third vision, sorting picker, etc., respectively.

Before performing a given task, information about the supplied substrate can be obtained through the calculated parameters. It is possible to check whether the supplied substrate is appropriate, or whether a placement table, dry block, or alignment table corresponding to the supplied substrate that can perform the supplied substrate is equipped.

For this purpose, a 2D code with semiconductor material information is installed on the top of the wit table, dry block, and alignment table. Before performing the process, the 2D code of the wit table can be recognized as the first or second vision, the 2D code of the dry block can be recognized as the third vision, and the 2D code of the alignment table can be recognized as the third vision. It can be recognized as a vision prepared in .

At this time, the upper part of the wit table, dry block, and alignment table equipped with 2D code can be a kit that can be exchanged according to the size and specifications of the semiconductor material. In other words, the kit of the wit table, dry block, and alignment table is replaced according to the type of semiconductor material to process the corresponding semiconductor material, and it is also possible to check whether the kit has been installed incorrectly by checking the 2D code and comparing the information on the supplied substrate. It becomes possible.

It is determined whether the collected information matches the semiconductor material information embedded in the 2D code mounted on the upper part of the wit table, dry block, and alignment table. If the judgment result matches, a certain task can be performed. If the judgment result does not match, the predetermined task can be performed. Otherwise, the installed mounting table, dry block, and alignment table will be considered unsuitable for processing the supplied substrate, and work may be stopped and replaced with a suitable substrate, or the kit of the incorrectly installed mounting table, dry block, or alignment table may be replaced. there is.

After acquiring the entire image of the substrate and collecting the semiconductor material information and recognition mark information formed on the substrate from the acquired entire image, the task of extracting the collected information into parameters necessary for process automation is completed. The substrate is aligned on the placement table. It must be delivered to the location.

If the task of acquiring the entire image of the substrate from the loading unit is performed, the alignment of the substrate on the loading unit is inspected based on the extracted parameters, and the operation of acquiring the entire image of the substrate from the loading table is performed. In , the strip picker delivers the substrate to the loading unit and inspects the alignment of the substrate using the first vision based on the parameters extracted for the substrate delivered to the loading unit.

When performing the task of acquiring the entire image of the substrate from the placement table, the substrate can be transferred to the placement table with its position aligned and photographed, or it can be delivered to the placement table without alignment and photographed.

For reference, in the present invention, the first vision, second vision, third vision, fourth vision, and fifth vision are divided by order or function to aid understanding and are not limited to the purpose and location of the vision. .

The collected information can be used to first check and align the alignment of the substrate using the calculated parameters so that the substrate is delivered to the aligned position on the placement table.

At this time, inspection of the alignment of the substrate is performed using the first vision. Previously, the focus of the first vision was adjusted so that the semiconductor material and recognition marks formed on the substrate could be distinguished in order to obtain an overall image of the substrate, but the first vision was aligned so that the alignment of the substrate could be inspected in detail. It should be set as an identification standard value to identify the reference mark required for condition inspection.

In other words, appropriate vision parameters that enable the reference mark to be inspected with the first vision to be clearly detected, and one or more of quality, histogram, and matching ratio must be automatically set. At this time, the set vision parameters can be applied to set the identification standard value to identify the reference mark.

When setting the identification standard value of the reference mark of the first vision, if there is a basic work method or tolerance set by the customer, the identification standard value for identifying the reference mark can be reset using the tolerance set by the customer. It may be possible.

Meanwhile, among the extracted parameters, the reference mark to be inspected on the substrate is searched using the location information of the reference mark. In other words, the reference mark corresponding to the location information of the reference mark and the identification reference mark of the reference mark set as the identification reference value is searched. Specifically, the center position of the substrate can be obtained by searching for the outermost reference mark required for alignment inspection among the reference marks corresponding to the identification reference value of the reference mark.

Various methods may be used when acquiring the center position of the substrate, but the position coordinates of the outermost reference mark of the substrate can be obtained from the positional relationship between the position of the fiducial mark provided in the loading part and the outermost reference mark of the substrate, The center position of the diagonal distance of the outer reference mark can be obtained as the center position of the substrate.

By calculating the error value between the center position of the substrate and the preset center position of the loading unit, a correction value for positioning the substrate at the center of the loading unit can be obtained. In the semiconductor manufacturing apparatus of the present invention, the strip picker 6 is movable in the x-axis direction, and the loading table AT of the loading unit is movable in the y-axis direction and rotatable in the θ-axis direction. Therefore, in order to position the substrate at the center of the loading unit, the strip picker and the loading unit are moved relative to each other. For example, the strip picker corrects the After aligning the position of the substrate by correcting, the aligned substrate is delivered to the placement table. For reference, in the semiconductor manufacturing apparatus of the present invention, the positions of the center of the loading unit, the center of the strip picker, and the center of the placement table are all set to correspond, so when the strip picker picks up the aligned substrate and delivers it to the placement table, the center of the aligned substrate is delivered corresponding to the center of the wit table.

Here, an example of aligning the position of the substrate in the loading unit is explained, but the substrate can also be aligned by reflecting the correction value using the relative movement of the strip picker and the placement table, and θ-axis correction can be performed by adjusting the strip picker if the strip picker can rotate. You can also correct it using .

The placement table (CT) receives and adsorbs the aligned substrate SM from the strip picker 6, and is movable in the y-axis direction and rotatable in the θ-axis direction.

Here, the case of correction through relative movement of the loading table (AT) and the loading table is explained as an example, but the loading table is provided to be movable not only in the y-axis direction but also in the x-axis direction, so that the loading table (AT) can be moved in the x and y axes. And after correcting the position of the substrate using θ-axis movement, the corrected substrate can be picked up by a strip picker and delivered in an aligned state on the placement table.

The cutting portion CP is configured to cut the substrate SM into individual semiconductor materials (IM) and may be a cutting blade 8 or the like. The cutting blade cuts the substrate SM into individual units of semiconductor material IM according to the inspection results of the second vision 7, which inspects the cutting line of the substrate SM on the placement table CT.

The second vision 7 can inspect the cutting line for the semiconductor material based on parameters extracted from the collected information on the substrate delivered to the loading table. For this purpose, a reference mark to be inspected by the second vision is designated from the parameters extracted first. When the reference mark to be inspected is designated, the second vision moves to the location of the reference mark, photographs the reference mark, and sets an identification reference value to identify the reference mark.

When setting the identification standard value of the reference mark of the second vision (7), if there is a basic work method or tolerance set by the customer, the identification standard value to identify the reference mark using the tolerance set by the customer You can also reset .

The second vision (7) inspects the cutting line of the semiconductor material, and determines the cutting sequence automatically. Among the extracted parameters, the location and shape of the reference mark to be inspected, the You can use the material's x-axis length, y-axis length, number of cutting lines, etc.

Then, the location information of the reference mark is used as an extracted parameter to confirm the location of the reference mark, set as an identification reference value that can identify the reference mark at that location, and search for a reference mark corresponding to the identification reference value of the set reference mark. For example, the reference mark may be a recognition mark formed on the substrate, or in the case of a substrate with a line to be cut, the line to be cut may be the reference mark.

According to the search results, the position of each searched reference mark is detected, and the line connecting the reference marks symmetrical in the x-axis or y-axis direction can be calculated as a cutting line for cutting the substrate.

It is determined whether the calculated virtual cutting line is accommodated in the blade escape groove provided on the cutting table. At this time, it is determined whether each of the virtual cutting lines corresponds to each of the corresponding blade escape grooves. The blade escape groove is an accommodating groove in which the blade is provided in a predetermined area beyond the expected cutting line on the mounting table to protect the mounting table and the blade during the cutting process.

The second vision 7 performs imaging to check whether each cutting line is accommodated in the blade escape groove of the tread table (CT) and is located in the correct position. The second vision 7 searches for a reference mark corresponding to the extracted parameters and the identification reference value of the reference mark set as the identification reference value. According to the search results, a cutting line for cutting the substrate is calculated, and it is confirmed whether the calculated cutting line is accommodated in the corresponding blade escape groove. As a result of the confirmation, if each cutting line is accommodated within each blade escape groove, cutting work is performed along the calculated virtual cutting line, and if it is determined that any one of the cutting lines is not accommodated in the corresponding blade escape groove. In this case, the strip picker can pick up the substrate from the tack table, perform realignment, and re-deliver it to the tack table.

The second vision 7 transmits the calculated cutting line to the control unit (BU), and the control unit can determine cutting parameters such as the cutting order and cutting sequence for cutting the corresponding cutting line.

The cutting blade 8 is controlled by the control unit BU to perform a process of cutting the substrate SM on the placement table CT into individual units of semiconductor material IM along the cutting line.

The unit picker 9 is provided to be movable in the ) is delivered to the dry block (DT).

The dry block (DT) dries the semiconductor material (IM) and a top-side inspection is performed on the dried semiconductor material (IM). The third vision 10 provided at the top of the dry block inspects the upper surface of the semiconductor material based on the extracted parameters.

Here, the third vision 10 is a vision provided at the top of the dry block to inspect the upper surface of the semiconductor material, such as the size and shape of the cut semiconductor material, whether there are scratches on the upper surface of the semiconductor material, and materials with balls or leads formed on the upper surface. In this case, the number, pattern, size, etc. of balls (bumps) or leads can be inspected. If the material has a molding portion on the upper surface, the marking status of the product name or manufacturer printed on the molding portion and the presence or absence of marking can be inspected.

The third vision 10 performs imaging to check the condition of the semiconductor material (IM) mounted on the dry block (DT). The third vision 10 is controlled by the control unit BU based on the entire image WP, moves directly to the status confirmation area, performs photography, and acquires a status confirmation image. The status confirmation image includes the cutting status of individual semiconductor materials (IM). The third vision 10 can transmit a status confirmation image to the control unit (BU).

For this purpose, a reference mark to be inspected by the third vision 10 is designated from the parameters extracted first. At this time, the reference mark uses parameters extracted from information collected from the entire image obtained by combining partial images previously captured by the first vision 5. Once the reference mark to be inspected is designated, set the vision parameters for the reference mark to be inspected and then set the identification reference value to identify the reference mark.

For example, when the third vision 10 inspects the state of a cut semiconductor material, the size of the semiconductor material can be used among the extracted parameters. In other words, the third vision moves the semiconductor material to be inspected to the reference mark and photographs it, and automatically sets vision parameters such as lighting to clearly detect the photographed semiconductor material. Automatically sets identification standard values for one or more items such as quality, histogram, and matching ratio to identify semiconductor materials.

At this time, with vision parameters such as lighting set so that the semiconductor material can be clearly detected and identified, how well does the size of the semiconductor material captured with the vision match the size value of the semiconductor material in the extracted parameters, for example, how many of the total? You can set the identification standard value to determine if it matches more than a percentage (%), and then use that identification standard value to search for semiconductor materials. Here, if there is a tolerance set by the customer in addition to the automatically set identification standard value, the identification standard value for the corresponding vision can be set using all of these. In other words, if there is an acceptable range such as whether the worker judges something above a certain level as normal and something below a certain level as defective, the identification standard value can be set to reflect this.

After setting the identification standard value to identify the designated reference mark (reference mark to be inspected), the location and number of reference marks among the extracted parameters can be used to determine the location of the reference mark to be inspected. Additionally, the inspection path and inspection order of the reference mark to be inspected can be automatically determined using the extracted parameters.

Therefore, by searching for the reference mark corresponding to the extracted parameter and the identification reference value of the set identification reference mark, a top surface inspection can be performed on each reference mark of all semiconductor materials delivered to the dry block.

When the search for each reference mark is completed, the upper surface state of the reference mark can be determined according to the search results.

On the other hand, when the third vision 10 performs a ball surface (bump) inspection of a semiconductor material at the top of the dry block, a certain semiconductor material is designated as a reference mark and an identification is used to identify the ball (bump) in the designated semiconductor material. Set the standard value.

At this time, the identification standard value includes one of histogram, matching ratio, and bump size, and can be set automatically. In the present invention, the identification reference value is an item and its setting value that are automatically set to precisely perform inspection in the corresponding area of each vision. The type and setting value of the identification reference value are determined each time according to the inspection target and inspection purpose. It becomes different. Additionally, since the allowable value may vary depending on the required work requirements, the identification standard value can be reset using the allowable range set by the customer.

Therefore, after setting the identification standard value for identifying the ball, the location of the bump formed in the semiconductor material and the information on the bump formation pattern can be used as extracted parameters, and along with this, the semiconductor material corresponding to the identification standard value of the semiconductor material set as the identification standard value can be used. Explore materials. As a result of the search, the inspection status of the ball surface of the semiconductor material can be determined.

At this time, the status of each reference mark can later become a standard for judging whether semiconductor materials are good or bad, a classification standard for loading them on a tray, and a standard for the classification method.

Semiconductor materials that have completed inspection in the dry block are picked up by the alignment table picker (11) and delivered to the alignment table (TN).

The alignment table (TN) is formed with loading grooves (pockets) that guide the semiconductor materials so that the cut semiconductor materials can be aligned and loaded. The alignment table is rotatable according to the discharge direction of the semiconductor material.

For example, when the direction of the semiconductor material to be discharged to the tray is set by the operator, after the semiconductor material is delivered to the sorting table and before the sorting picker picks up the loaded semiconductor material, the material can be discharged in the preset discharge direction. The alignment table can be rotated O~270°.

In other words, if the loading direction of the semiconductor material delivered to the alignment table and the direction of the semiconductor material to be discharged to the tray are the same, the sorting picker picks up the semiconductor material loaded on the alignment table without the need for rotation and then performs a vision inspection at the top of the fourth vision. and can be loaded onto the tray according to the vision inspection results.

If the loading direction of the semiconductor material delivered to the alignment table is different from the direction of the semiconductor material to be discharged to the tray, the semiconductor material direction is set by the operator to match the loading direction of the tray and the direction of the semiconductor material loaded on the alignment table. In this state, the sorting picker can pick up the semiconductor materials delivered to the sorting table.

The alignment table TN has a first loading section in which first loading grooves in which semiconductor packages are loaded and first non-loading areas in which semiconductor packages are not loaded are alternately arranged, and second loading grooves in which semiconductor packages are loaded. It has a second loading section in which second non-loading areas are alternately arranged. The alignment table picker 11 picks up a plurality of semiconductor packages from the dry block at once and unloads the semiconductor package corresponding to the first loading part of the alignment table TN among the plurality of semiconductor packages picked up by the alignment table picker 11. and place all remaining semiconductor packages on the second loading section of the alignment table (TN).

When a semiconductor package is loaded on the loading part of the alignment table, the sorting picker 12 individually picks up the semiconductor material and moves it to the upper part of the fourth vision 13, and the fourth vision 13 inspects the lower surface of the semiconductor material. . At this time, the sorting picker 12 can move to the top of the semiconductor material to be inspected using parameters extracted from information collected from the entire image obtained by combining partial images previously captured by the first vision 5.

Of course, information about the alignment table can also be obtained using the fifth vision 15.

At this time, information about the alignment table may be acquired during the setting process or before operating the semiconductor manufacturing device, but may be performed only before the sorting picker picks up the semiconductor material on the alignment table during the operation of the semiconductor manufacturing device.

In order to detect information in the alignment table, the alignment table is divided into a plurality of imaging areas, and the alignment table is sequentially divided into a plurality of imaging areas using a fifth vision to sequentially photograph the alignment table to obtain a plurality of partial images. after. The entire image of the alignment table can be obtained by combining a plurality of partial images, and information on the location or size of the semiconductor material loading groove formed on the alignment table can be obtained from the obtained entire image of the alignment table.

Based on the location information of the loading grooves provided on the alignment table, the sorting picker can know the location of each loading groove on the alignment table and pick up the semiconductor materials loaded in the corresponding loading grooves. Therefore, it is possible to accurately obtain the position of each loading groove of the alignment table.

Using the position information of the alignment table loading groove obtained from the inspection of the alignment table or the location information of each semiconductor material among the extracted parameters, the pickup status is checked to see whether the sorting picker picks up the semiconductor material at the correct position and the pickup status is checked. In case of error, perform correction.

In the present invention, the sorting picker can move to the fourth vision 13 while picking up one or more of the semiconductor materials delivered to the sorting table, inspect the pickup state, and automatically correct the pickup position error value. The positions of semiconductor materials cut on dry blocks are irregularly distorted during the cutting process. However, since the alignment table of the present invention has a loading groove, even if the semiconductor material is misaligned, the misalignment is corrected in the process of being transferred to the alignment table.

Therefore, each semiconductor material loaded on the alignment table is aligned to correspond to the position of the semiconductor material formed on the substrate obtained in the first vision 5, and among the various parameters extracted from the first vision 5, each semiconductor material Using the location, the sorting picker can determine the location of the semiconductor material to be inspected, the pickup order (inspection order), and the pickup route.

Meanwhile, the sorting picker 12 is equipped with a plurality of pickup units for sequentially picking up each semiconductor material, is movable in the x-axis direction, and each pickup unit is provided to be individually raised and lowered.

With the sorting picker 12 picking up one or more of the semiconductor materials (IM) delivered to the sorting table, it can move to the upper part of the fourth vision to inspect and correct the pickup status of the semiconductor material based on the extracted parameters. .

For this purpose, location data of the semiconductor material to be picked up by the sorting picker is generated among the semiconductor materials (IM) delivered to the sorting table based on the extracted parameters. At this time, the position data of the sorting picker may be selected from the loading home position of the previously obtained sorting table. The sorting picker 12 picks up one or more semiconductor materials (IM) from the generated location data on the sorting table (TN). At this time, the sorting picker 12 is controlled by the control unit (BU) based on the entire image (WP) and can move directly to the location of the individual unit semiconductor material (IM) to be adsorbed and perform adsorption. The sorting picker 12 moves to the upper part of the fourth vision 13 with individual unit semiconductor materials (IM) adsorbed.

The fourth vision (13) obtains an image by photographing the pickup state of the individual unit semiconductor material (IM) adsorbed on the sorting picker (12). The acquired image is transmitted to the control unit (BU), and the control unit (BU) can check the center of the semiconductor material (IM) picked up by the sorting picker 12 and the center of the fourth vision 13. Accordingly, the control unit (BU) can calculate a position correction value so that the center of the semiconductor material (IM) picked up by the sorting picker matches the center of the fourth vision 13. When the sorting picker is corrected by reflecting the calculated position correction value, the mechanical error value of the sorting picker is automatically corrected, making it possible to pick up the center of the semiconductor material loaded on the sorting table.

After the sorting picker inspects and corrects the pickup state of the semiconductor material, the lower surface of the semiconductor material is inspected by the fourth vision (13).

The fourth vision 13 is a vision provided at the bottom of the moving path of the sorting picker and inspects upward. That is, the third vision 10 inspects the upper surface of the semiconductor material, and the fourth vision 13 inspects the lower surface of the semiconductor material. In the case of materials with balls or leads formed on the bottom of the semiconductor material, the number, pattern, size, etc. of balls (bumps) or leads can be inspected. If the material has a molding portion on the lower surface, the marking status of the product name or manufacturer printed on the molding portion and the presence or absence of marking can be inspected.

When the fourth vision 13 inspects the marking status and presence or absence of marking, the vision parameters of the fourth vision are set before performing the inspection of the fourth vision, and then the fourth vision is used to search the bottom surface of the semiconductor material. Set the identification standard value.

In other words, to check the marking status, vision parameters such as lighting are automatically set, and then identification standards such as quality, histogram, and matching ratio are automatically set with the set vision parameters applied.

The marking status can be checked with the set identification standard value. When inspecting the marking status, if there is a set identification standard value and a work method or tolerance set by the customer, these can be used together to set the identification standard value.

In addition, based on the set identification standard value and the work method and tolerance set by the customer, the standard for judging whether semiconductor materials are good or bad, the classification standard for loading on the tray, or the classification method can be determined. This allows unmanned processing and automatic processing even when there is no operator present during work.

Here, the criteria for judging whether semiconductor materials are good or bad, the classification criteria for loading them on a tray, or the classification method are not determined by the inspection results of the fourth vision, but may reflect both the inspection results of the third and fourth vision.

The tray is a space where semiconductor materials are sorted, loaded, and unloaded by a sorting picker, and can be classified into a good product tray that accommodates good products, a defective product tray that accommodates defective products, and a rework tray that requires rework or resorting. A seating groove (pocket) may be formed in the tray for loading the corresponding semiconductor material.

The tray picker 14 carries out the function of removing good product trays containing good products, defective product trays containing defective products, rework trays requiring rework or reshoring, and supplying new, empty trays. A fifth vision 15 is installed on one side of the tray picker 14 to recognize 2D code information mounted on the alignment table kit or to detect information on the tray.

The fifth vision 15 can obtain information about the tray as well as information about the alignment table. In order to detect information on the tray, the fifth vision 15 sequentially photographs the tray to obtain a plurality of partial images and synthesizes the obtained plurality of partial images to obtain the entire image of the tray. Information on the tray's seating groove can be collected from . For example, the tray is moved in the Tray information can be collected from . At this time, the specifically collected tray information may include the location, spacing, and number of pockets formed in the tray, and the sorting picker can automatically load semiconductor materials at the corresponding location using the acquired tray information.

At this time, information about the tray can be obtained for the initially supplied tray, and information about the tray is obtained before setting or operating the semiconductor manufacturing equipment, and based on the previously acquired location information of the tray's seating groove, Semiconductor materials picked up by the sorting picker can be delivered to the tray's seating groove.

For reference, when all of the semiconductor materials are seated in the semiconductor material seating grooves of the tray, a new tray can be supplied to continuously perform the seating of the semiconductor materials.

At this time, when a new tray is supplied, based on the location and size information of the semiconductor material seating groove of the initially obtained tray, the seating groove corresponding to the preset predetermined seating groove of the supplied new tray is inspected using the 5th vision to install the tray. It can be verified.

In other words, the position of the seating groove obtained by inspecting at least one seating groove of the newly supplied tray, for example, the outermost seating groove, based on the location and size information of the seating groove of the initially obtained tray to determine whether an appropriate tray was supplied. You can prevent incorrect trays from being supplied by checking whether they correspond to the size and type.

In addition, when a new tray is supplied, the seating of the supplied tray is checked by inspecting two or more seating grooves, preferably three seating grooves, provided on the outermost side of the supplied tray based on the position information of the tray's seating groove previously obtained. The home position can be recalculated and semiconductor materials can be loaded into the recalculated seating groove position.

Through this, even if the supplied tray has a positional error such as being biased to one side or twisted, it moves to the position of the outermost seating groove of the supplied tray based on the recalculated tray's seating groove position information and accurately determines the supplied tray's location. It can be detected, and through this, the sorting picker can accurately deliver semiconductor materials to each seating groove of the supplied tray.

Meanwhile, after the sorting picker inspects the lower surface of the semiconductor material using the fourth vision, it is loaded into the tray according to the inspection results. Once the semiconductor materials are all seated in the semiconductor material seating grooves of the tray, the seating status of the tray can be inspected using the fifth vision. there is.

As a result of inspecting the seating condition of the semiconductor material, if the seating condition is defective, check the pickup unit of the sorting picker that loaded the semiconductor material. If the number of defective seating conditions by the pickup unit exceeds a predetermined number of times, the pickup unit of the relevant pickup unit is inspected. The pick-up operation can be skipped, and the operator can be notified that there is a work error in the corresponding pick-up unit. Of course, during the process, the pickup work of the corresponding pickup unit can be skipped, and after the process is completed, work errors in the pickup unit can be checked and follow-up measures such as inspection and replacement can be taken.

The control unit (BU) includes loading units (3) and (5), strip picker (6), loading table (CT), cutting unit (CP), dry block (DT), third vision (10), and alignment table (TN). ), controlling the operation of each component of the semiconductor manufacturing apparatus 1, including the sorting picker 12, the fourth vision 13, the tray picker 14, and the fifth vision 15. At this time, the control unit may include a plurality of individual control units that individually control each configuration of the semiconductor manufacturing apparatus, or may control and manage each configuration of the semiconductor manufacturing apparatus through an integrated control unit.

In addition, the control unit BU generates a full image WP by merging a plurality of partial images DP captured by the first vision, and determines the positions of the components based on the information collected from the full image WP. Movement and operation can also be controlled.

The information collected by the control unit (BU) includes the shape and size of the substrate SM, the location, shape, number, and pattern of individual unit semiconductor materials (IM) formed on the substrate SM, and a plurality of individual units arranged at regular intervals. Number of group units composed of unit semiconductor materials (IM), x-axis spacing and y-axis spacing of group units, It includes at least one of the number, location, shape, spacing, number, and size of recognition marks formed on the substrate, and the location, shape, and number of fiducials (FD) provided in the loading unit. The collected information is not limited to this and may further include other information that can be obtained from the entire image (WP).

The control unit BU can check the combining precision of the entire combined image WP using the fiducial mark F formed at a fixed position. Since the fiducial mark (F) is installed on a fixed fiducial block (not shown) of the equipment, the distance between the two fiducial marks (F) arranged in the longitudinal direction is constant, and the distance of the fiducial mark (F) in the synthesized image is constant. The combining precision of the entire image (WP) can be checked by checking whether the distance is the same as the actual distance of the fiducial mark (F).

The control unit (BU) can extract the collected information into parameters necessary for process automation, and the extracted parameters are one or more values extracted from the collected information or values calculated from the extracted values to automatically process the process. (For example, the location of the line to be cut, the location of the inspection target, etc.).

Meanwhile, the processing method of the semiconductor manufacturing apparatus of the present invention described above may be performed once for the first substrate, reference substrate, or sample substrate initially supplied from the semiconductor manufacturing apparatus.

Here, the first substrate, reference substrate, and sample substrate are the same as the substrate to be processed in the corresponding semiconductor manufacturing equipment. Therefore, it can be performed only once for the first time, that is, upon setting, without having to change the settings of the mechanical position, inspection position, order, or processing method for each processing of the same substrate. And the remaining boards can be processed automatically using the values set the first time.

In relation to this, the processing method of the semiconductor manufacturing equipment will be described with reference to FIGS. 2 to 4 as follows.

First, the substrate SM is supplied onto the loading unit 3. At this time, the supplied substrate may be the first substrate supplied, and is the first substrate to be pulled out and supplied among the substrates stacked in the magazine. A mosaic process is performed on the first substrate supplied to the loading unit. Specifically, the first vision 5 performs a function of acquiring the entire image by sequentially imaging the substrate SM on the loading unit 3. An extended area (EA) that is larger than the entire area (WA) of the substrate (SM) by a predetermined range is set as the imaging area of the first vision (5). Afterwards, the imaging area is divided into a plurality of divided areas and images are sequentially captured multiple times using the first vision 5. At this time, each imaging area has some overlapping areas.

That is, as shown in FIG. 2, the divided area DA is sequentially photographed using the first vision 5 to obtain a plurality of partial images. At this time, each partition (DA1, DA2, DA3, DA4, DA5, DA6, DA7, DA8, DA9, DA10, DA11, DA12) does not overlap with the adjacent partition area (DA) in at least one of the x and y axes. An overlap area (RA) is included through the overlapping areas that are photographed including the area.

The first vision (5) photographs the first to twelfth divided areas (DA) and displays images in each divided area (DA1, DA2, DA3, DA4, DA5, DA6, DA7, DA8, DA9, DA10, DA11, DA12). A plurality of corresponding partial images (DP) are acquired. The first vision 5 transmits the partial image DP to the control unit BU.

The control unit BU performs a process of sequentially arranging and merging the plurality of partial images DP received from the first vision 5. Through this, the entire image (WP) corresponding to the extended area (EA) captured by the first vision (5) is generated.

The processing method of a semiconductor manufacturing device uses information collected from the entire image (WP) obtained through a mosaic process in a subsequent process. To be more specific, the collected information can be extracted into parameters necessary for process automation, and the process can be automatically performed using the parameters extracted from each subsequent process.

First, the extracted parameters can be used to align the substrate supplied to the loading unit.

Among the parameters extracted here, the fiducial position of the loading part and the shape and position of the recognition mark formed on the substrate that are close to the fiducial of the loading part are used.

First, a reference mark to be inspected by the first vision is designated from the extracted parameters. The first vision moves to the reference mark to be inspected and automatically sets vision parameters such as lighting and focus to identify the reference mark to be inspected so that the reference mark is clearly visible, and then automatically sets the contrast, quality, histogram or matching ratio, etc. do. Here, in order to identify the designated reference mark, the automatically set setting value is saved as the identification reference value and the identification reference value is used when searching for the reference mark later.

Afterwards, the position value of the outermost reference mark of the substrate is obtained by searching for the reference mark provided on the outermost side of the substrate among the positional information of the reference mark and the recognition mark formed on the substrate. At this time, the position value can be obtained from the position coordinates of the outermost reference mark through the position of the fiducial provided in the loading unit.

Specifically, the control unit BU acquires the center position information of the substrate SM based on the entire image WP. Referring to FIG. 3, the control unit BU controls the first fiducial FD1 provided at the upper end in the right direction (+x direction) of the entire image WP in a diagonal direction with the first fiducial FD1. A 'first virtual diagonal' connecting the second fiducial FD2 provided at the lower end of the left side (-x direction) of the entire image WP, and the first fiducial FD1 and the longitudinal direction (±y) A 'second virtual diagonal' that is provided in the opposite direction and extends diagonally from the third fiducial (FD3) provided at the bottom in the right direction (+x direction) of the entire image (WP) intersects. Center position information of the substrate (SM) is acquired through the point. The center position information of the substrate SM may be a position coordinate value in the x- and y-axis directions at a point where the first and second virtual diagonals intersect.

The control unit (BU) obtains a center position error value between the center position information of the loading unit and the center position information of the substrate SM based on the center position information of the substrate SM and the center position information of the loading unit stored in the control unit BU. . The center position information and center position error value of the loading unit may be composed of position coordinate values configured in the x-axis direction, y-axis direction, and θ direction.

The control unit BU corrects the position of the loading unit in the y-axis direction and the θ-axis direction based on the position error value calculated while the strip picker 6 picks up the substrate SM on the loading unit, and the strip picker 6 ) corrects the position in the x-axis direction and delivers the position-corrected substrate (SM) on the loading unit. Accordingly, the substrate SM on the loading unit is adsorbed to the strip picker 6 in a state in which its position is corrected and aligned in the x-axis, y-axis, and θ directions.

Then, a process in which the strip picker 6 transfers the substrate SM to the placement table CT is performed. The strip picker 6 can deliver the center position of the substrate SM by matching the center position of the placement table CT.

Then, a process of inspecting the cutting line of the substrate SM using the second vision 7 is performed.

In the cutting line inspection process, the control unit (BU) controls the operation of the second vision 7 based on the extracted parameters.

Specifically, the control unit BU designates a reference mark to be inspected on the substrate SM based on the extracted parameters. At this time, the reference mark may be a recognition mark formed on the substrate. The second vision 7 uses the shape and location information of the reference mark to move to the location of the reference mark to be inspected and is automatically set as an identification reference value for identifying the reference mark.

Next, the recognition mark corresponding to the identification standard value of the reference mark set as the identification standard value is searched. As a result of searching for the corresponding recognition mark, the location information of the searched recognition mark can be obtained, and the cutting line is calculated as a line connecting the recognition marks symmetrically in the X-axis or Y-axis direction. It is checked whether the calculated virtual cutting line is accommodated in the blade escape groove provided on the cutting table, and if each cutting line is accommodated in the corresponding blade escape groove, cutting is performed along the corresponding cutting line.

The second vision (7) separately photographs the area corresponding to each semiconductor material and checks the location information on the cutting area where the cutting line is located, extracting the location information without first performing the process of acquiring the location information on the cutting line. Using the specified parameters, it is immediately moved to the first shooting position. The first shooting location information may consist of x- and y-axis location coordinate values.

If the second vision 7 sets the first shooting position to a fixed value, there is a problem that the first shooting position value must be newly set every time the type of semiconductor material changes. However, according to the present invention, the first shooting position value is set to a fixed value. Since the information of the semiconductor material can be known based on the extracted parameters without setting it fixedly, it has the effect of automatically changing the information of the semiconductor material without the operator's settings even if the type of semiconductor material is changed.

When cutting a semiconductor material, a process of cutting the semiconductor material adsorbed on the loading table is performed using a cutting blade (8). When cutting semiconductor materials, the cutting order or cutting sequence can be automatically determined and performed using the basic work method or tolerance set by the customer.

After cutting is completed, the individual unit semiconductor material (IM) is adsorbed and washed using the unit picker 9, and then transferred to the dry block (DT).

The semiconductor material (IM) that has been cut and cleaned is subjected to a drying process in a dry block (DT).

Then, a top surface inspection process of the semiconductor material (IM) is performed using the third vision 10.

Specifically, the control unit (BU) may perform an inspection using the third vision 10 using the location information and size information of the semiconductor material (IM) obtained based on the extracted parameters.

The control unit (BU) determines the status confirmation location information to first perform status confirmation of the semiconductor material (IM) based on the location information of the semiconductor material (IM) and immediately moves the third vision 10 to the location using the status confirmation location information. You can do it. Status confirmation location information may consist of location coordinate values in the x-axis and y-axis directions. The status check position is not a fixed value, but can be set to change in real time depending on the type of substrate (SM) collected from the entire image (WP).

Meanwhile, after setting the vision parameters for the semiconductor material to be inspected with the third vision and setting the identification standard value to identify the designated semiconductor material with the set vision parameters applied, the location information for each semiconductor material is used Search for semiconductor materials that meet the identification criteria for semiconductor materials. Here, the search can include the size of the semiconductor material, the presence or absence of scratches on the top surface of the semiconductor material, ball inspection, etc., and the condition of the top surface of the semiconductor material can be determined according to the search results.

Then, a process is performed in which the alignment table picker 11 adsorbs the semiconductor material (IM) for which the top surface condition inspection using the third vision 10 has been completed and transfers it to the alignment table TN.

Then, a pick-up status confirmation process of semiconductor material (IM) is performed using the sorting picker 12 and the fourth vision 13.

Specifically, the control unit (BU) generates location data of the semiconductor material based on the extracted parameters. The sorting picker can pick up one or more semiconductor materials to be picked up among the generated location data and check the pickup status using the fourth vision (13).

For example, among the generated location data, it moves directly to the location of the semiconductor material located in the three outermost areas and picks up the individual unit semiconductor material (IM) at that location by adsorbing it.

Then, the sorting picker 12 moves to the position where the fourth vision 13 is provided. This is implemented by controlling the sorting picker 12 to move to the location information of the fourth vision 13 by the control unit (BU). The location information of the fourth vision 13 is information stored in the control unit (BU) and may be composed of position coordinate values in the x and y axes.

When the sorting picker (12) moves to the position where the fourth vision (13) is provided, the fourth vision (13) captures the pickup state of the individual unit semiconductor material (IM) adsorbed on the sorting picker (12) and creates an image. Acquire. The fourth vision 13 transmits the image to the control unit (BU).

The control unit (BU) obtains the pickup location information of the individual unit semiconductor material (IM) from the received image. At this time, the pickup location information may be composed of location coordinate values in the x-axis and y-axis directions.

The control unit (BU) calculates a position correction value so that the sorting picker can pick up the center of the semiconductor material based on the pickup center location information of the semiconductor material picked up by the sorting picker and the vision center position of the fourth vision 13, The calculated position correction value is reflected in the sorting picker. In other words, the mechanical error value of the sorting picker can be corrected by aligning the semiconductor material pickup position center of the sorting picker with the center axis of the fourth vision 13.

After the mechanical position error value of the sorting picker is corrected, the bottom surface of the semiconductor material is inspected using the fourth vision (13). Before inspecting the bottom surface of the semiconductor material, an identification standard value for searching the bottom surface of the semiconductor material is set in the fourth vision (13). Using the set identification standard value, the work method set by the customer, and the tolerance range, it is possible to determine the standard for judging whether semiconductor materials are good or bad, and the classification standard or method for loading them on the tray.

At this time, the criteria for determining whether semiconductor materials are good or bad, the classification criteria for loading on trays, or the classification method are not limited to the inspection results of the 4th vision, but are determined by reflecting both the inspection results of the 3rd and 4th vision. Judgment can be carried out.

Depending on the inspection results for good or bad judgment, the sorting picker can load semiconductor materials into the good product tray, defective product tray, and rework tray, respectively.

At this time, in the same way as the entire image of the substrate was acquired with the first vision, the tray is sequentially photographed with the fifth vision to obtain a partial image of the tray, and the acquired partial images are synthesized to obtain a full image of the tray. Tray information can be collected from the entire tray image, and based on this, the sorting picker can sort and load semiconductor materials into the tray's pockets. Tray information may be obtained before the classification of semiconductor materials is performed.

Since all trays loading the same semiconductor material can be supplied in the same size and form, it is advisable to collect tray information only once, and then automatically classify and load the remaining semiconductor materials based on the acquired tray information. can do.

The processing method of the semiconductor manufacturing device of the present invention described above is performed only once for the first supplied substrate or semiconductor material that serves as a standard for setting, and the substrate supplied thereafter is processed by the processing method of the previously set semiconductor manufacturing device. It can be performed according to.

In other words, for the second supplied substrate, the entire image of the substrate is acquired through a mosaic process that sequentially acquires partial images of the substrate, semiconductor material and recognition mark information are collected from the acquired entire image, and based on the collected information, It is desirable to omit the steps of extracting parameters, specifying a reference mark to be inspected, and setting an identification reference value for identifying the designated reference mark.

In more detail, a method of processing a semiconductor manufacturing device for a substrate to be supplied later (hereinafter referred to as a subsequent substrate) will be described.

First, the subsequent substrate is supplied to the loading unit 3. To inspect the material alignment of the subsequent substrate supplied to the loading unit, the center point of the subsequent substrate is acquired using the first vision (3). At this time, in order to obtain the center point of the board, it is good to check the positions of the three outermost areas of the board, but it is also okay to check the positions of the two outermost areas. In other words, the positions of two recognition marks located diagonally are searched. At this time, the location of the recognition mark to be searched and the identification reference value for searching the recognition mark are searched at the same location and with the same identification reference value as those searched previously on the first board.

Since the positional state of the supplied substrate may be different each time, each positional state inspection is performed each time, and according to the performed results, the position of the substrate is aligned so that the center of the corresponding subsequent substrate coincides with the center of the loading unit.

Once the position of the substrate is aligned, the center of the aligned substrate is transferred to match the center of the placement table. For the substrate delivered on the placement table, the cutting line on which the substrate is to be cut is inspected using the second vision 7. The second vision 7 sequentially searches for the recognition marks formed on the substrate, and at this time, the location of the recognition marks searched and the identification reference value for searching for the recognition marks are searched at the same location and with the same identification reference values as those previously searched on the first substrate. do.

After all the recognition marks on the supplied substrate are searched, the virtual line connecting the recognition marks at symmetrical positions in the X-axis or Y-axis direction is calculated as the expected cutting line of the substrate. At this time, it is determined whether each calculated cutting line is accommodated within the corresponding blade escape groove formed on the tread table, and if accepted, cutting is performed. If not, a correction value is calculated so that it can be accepted, and the strip picker is corrected by the corresponding correction value. and re-delivers it to the wit table. Afterwards, the calculated cutting line or cutting line calculation is performed again, and the substrate is cut using the re-performed cutting line to divide it into a plurality of semiconductor materials.

The unit picker picks up the cut semiconductor material, cleans it, and delivers it to the dry block. A top surface inspection is performed using the third vision 10 for each semiconductor material delivered from the dry block, and after the top surface inspection is completed, the alignment table picker picks up the semiconductor material and delivers it to the alignment table. The sorting picker picks up the semiconductor material delivered to the sorting table and inspects the lower surface of the semiconductor material using the fourth vision (12).

At this time, the third and fourth vision are set to the same identification standard values as when performing the inspection of the first semiconductor material.

In other words, only the original inspection performed on the corresponding item can be performed while the inspection location of the vision to be performed in each vision and the identification standard value set for performing the inspection are set the same.

Additionally, the picking position of the sorting picker has been previously calibrated during the first semiconductor material inspection, so there is no need to perform additional operations on subsequent boards.

When the inspection results of the third and fourth visions are completed, the semiconductor materials are sorted according to the inspection results, sorted and loaded into each tray, and can be taken out when the loading is complete. Of course, at this time, the inspection results are based on the standards set at the time of the first semiconductor material inspection, for example, the standard for judging whether the semiconductor material is good or bad, the classification standard for loading on the tray, or the classification method using the set identification standard value and the tolerance range set by the customer. It can be reflected.

According to the present invention, the processing method of the semiconductor manufacturing apparatus divides the substrate supplied to the first vision into a plurality of imaging areas before proceeding with the process, acquires a plurality of partial images, and synthesizes the obtained partial images to form the entire substrate. By performing the process of acquiring the image (WP), parameters necessary for process automation can be extracted from the entire image (WP), and subsequent processes can be performed based on the extracted parameters.

The processing method of the semiconductor manufacturing apparatus of the present invention, when performing the alignment process and the subsequent process sequentially, corresponds to the subsequent process performed without manually entering the information on the substrate (SM) required to perform the subsequent process. Process conditions (specifically, position information for moving the second vision 7, third vision 10, sorting picker 12, etc. and material information for the substrate SM) can be set automatically. .

Therefore, according to the processing method of the semiconductor manufacturing equipment, the process conditions for performing processes such as cutting, drying, and sorting good/defective products of the substrate (SM) are automatically set without operator intervention, thereby realizing complete auto setting and unmanned processing. It can be.

In addition, according to the processing method of the semiconductor manufacturing apparatus, the process conditions for performing the alignment process and subsequent processes are automatically set, so even if the type of substrate (SM) supplied to the semiconductor manufacturing apparatus 1 is changed, the changed substrate (SM) You can eliminate the hassle of manually entering material information one by one.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Or, it can be carried out in modification.

*Main symbols in drawings
1: Semiconductor manufacturing equipment
3: Loading unit 5: First vision
6: Strip picker 7: Second vision
8: Cutting blade 9: Unit picker
10: Third vision 11: Sort table picker
12: Sorting Picker 13: 4th Vision
14: Tray Picker 15: Fifth Vision
CP: cutting part
AT: loading table CT: wit table
DT: Dry block TN: Alignment table
BU: Control unit SM: Board
IM: Semiconductor material FD: Recognition mark

Claims (24)

Supplying a plurality of semiconductor materials and a substrate on which an identification mark is formed to a loading unit, dividing the substrate supplied to the loading unit into a plurality of imaging areas and sequentially photographing them with a first vision to obtain a plurality of partial images;
obtaining a full image of the substrate by combining the plurality of partial images;
collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate;
Extracting the collected information into parameters necessary for process automation; and
A processing method for a semiconductor manufacturing apparatus, comprising the step of performing a predetermined operation on the semiconductor material based on the extracted parameters. According to paragraph 1,
The predetermined operation involves cutting, inspecting, and loading the substrate into a plurality of semiconductor materials,
After the step of extracting the above parameters,
inspecting and aligning the alignment of the substrate with the first vision based on the extracted parameters;
A strip picker delivering the aligned substrate to a placement table and inspecting a cutting line for the semiconductor material using a second vision based on the extracted parameters for the substrate delivered to the placement table; and
A processing method for a semiconductor manufacturing apparatus, further comprising the step of dividing the substrate into a plurality of semiconductor materials by cutting with a cutting portion along the expected cutting line inspected by the second vision. supplying a plurality of semiconductor materials and a substrate with an identification mark formed on it to a placement table, dividing the substrate supplied to the placement table into a plurality of imaging areas and sequentially capturing them with a first vision to obtain a plurality of partial images;
obtaining a full image of the substrate by combining the plurality of partial images;
collecting semiconductor material information and recognition mark information formed on the substrate from the obtained overall image of the substrate;
Extracting the collected information into parameters necessary for process automation; and
A processing method for a semiconductor manufacturing apparatus, comprising the step of performing a predetermined operation on the semiconductor material based on the extracted parameters. According to paragraph 3,
The predetermined operation involves cutting, inspecting, and loading the substrate into a plurality of semiconductor materials,
After the step of extracting the above parameters,
A strip picker delivering a substrate on which overall image acquisition has been completed to a loading unit, and inspecting and aligning the alignment of the substrate with the first vision based on the extracted parameters for the substrate delivered to the loading unit;
transferring the aligned substrate by the strip picker to a placement table and inspecting a cutting line for the semiconductor material using a second vision based on the extracted parameters for the substrate delivered to the placement table; and
A processing method for a semiconductor manufacturing apparatus, further comprising the step of dividing the substrate into a plurality of semiconductor materials by cutting with a cutting portion along the expected cutting line inspected by the second vision. According to any one of claims 1 to 4,
The parameter extraction step is characterized by specifying a reference mark and acquiring parameters for automatically performing the predetermined task based on the designated reference mark from the collected information,
A processing method for a semiconductor manufacturing device, characterized in that the reference mark is designated through prior learning or deep learning. According to any one of claims 1 to 4,
The step of acquiring a plurality of partial images by sequentially imaging with the first vision is a semiconductor manufacturing device wherein an area larger than a predetermined range is sequentially imaged multiple times, and each imaging area partially overlaps. Processing method. According to any one of claims 1 to 4,
The collected information includes the shape, size, location, and number of the semiconductor materials provided on the substrate, Contains one or more of the number,
A processing method of a semiconductor manufacturing apparatus, wherein the parameter is one or more values extracted from the collected information to automatically process the process, or a value calculated from the extracted values. According to paragraph 2 or 4,
The step of inspecting and aligning the alignment of the substrate with the first vision is,
setting vision parameters of the first vision for a reference mark to be inspected with the first vision;
Setting an identification reference value for identifying the reference mark while applying the set vision parameters;
Obtaining the center position of the substrate by searching for a reference mark corresponding to the extracted parameter and an identification reference value of the reference mark set as the identification reference value;
calculating an error value between the center position of the substrate and the preset center position of the loading unit; and
A semiconductor manufacturing apparatus comprising the step of aligning the position of the substrate by correcting an error value of the substrate so that the center of the substrate matches the center position of the loading portion through relative movement of the strip picker and the loading portion. Processing method. According to clause 8,
The extracted parameters include location information of the reference mark,
The step of acquiring the center position of the substrate is,
searching for the reference mark position information and a reference mark provided on the outermost side of the substrate;
Obtaining position coordinates of the outermost reference mark of the substrate from a positional relationship between the position of the fiducial mark provided in the loading unit and the outermost reference mark of the substrate; and
A processing method of a semiconductor manufacturing apparatus, comprising the step of selecting the center position of the diagonal distance of the outermost reference mark as the center position of the substrate. According to paragraph 2 or 4,
The step of inspecting the cutting line for the semiconductor material with the second vision based on the extracted parameters is,
setting vision parameters of the second vision for a reference mark to be inspected with the second vision;
Setting an identification reference value for identifying the reference mark while applying the set vision parameters;
Searching for a reference mark corresponding to an identification reference value of the reference mark set as the extracted parameter and the identification reference value;
calculating a virtual cutting line for cutting the substrate according to the search results; and
A processing method of a semiconductor manufacturing apparatus comprising: determining whether the calculated virtual cutting line is accommodated in a blade escape groove provided on the mounting table. According to paragraph 2 or 4,
After dividing the substrate into a plurality of semiconductor materials,
A unit picker picking up the cut semiconductor material and delivering it to the dry block;
inspecting the upper surface of the semiconductor material using a third vision based on parameters extracted for the semiconductor material delivered to the dry block;
Transferring the semiconductor material on which the top surface inspection has been completed to an alignment table;
A sorting picker equipped with a plurality of pickup units picks up one or more of the semiconductor materials delivered to the sorting table;
Moving the sorting picker to the upper part of the fourth vision while picking up the semiconductor material to inspect and correct the pickup state of the semiconductor material; and
A processing method of a semiconductor manufacturing apparatus comprising the step of inspecting the lower surface of the semiconductor material picked up by the sorting picker with the fourth vision and then loading it on a tray. According to clause 11,
The step of inspecting the upper surface of the semiconductor material with a third vision based on the extracted parameters,
setting vision parameters of the third vision for a reference mark to be inspected with the third vision;
Setting an identification reference value for identifying the reference mark while applying the set vision parameters;
Searching for a reference mark corresponding to an identification reference value of the reference mark set as the extracted parameter and the identification reference value; and
A processing method of a semiconductor manufacturing apparatus comprising the step of determining a top surface state of the reference mark according to the search result. According to paragraph 2 or 4,
After the step of extracting the above parameters,
After each of the first vision, the second vision, and the third vision sets each vision parameter for a reference mark to be inspected, each vision parameter is applied to identify each reference mark. Characterized by setting each identification standard value,
The set vision parameters include one or more of brightness, color, and angle of lighting,
Each of the set identification criteria includes one or more of quality, histogram, and matching ratio,
A processing method of a semiconductor manufacturing apparatus, characterized in that the identification reference value is automatically set. According to clause 13,
The step of setting the identification standard value is,
A processing method for a semiconductor manufacturing apparatus, further comprising the step of resetting an identification reference value for identifying the reference mark using a tolerance set by a customer. According to clause 11,
setting vision parameters of the fourth vision before performing inspection of the fourth vision;
Setting an identification reference value for searching the lower surface of the semiconductor material in the fourth vision with the set vision parameters applied;
A processing method for a semiconductor manufacturing apparatus, characterized in that determining a quality judgment standard for the semiconductor material, a classification standard or a classification method for loading the semiconductor material on the tray, using the set identification standard value and the tolerance range set by the customer. According to clause 11,
The step of moving to the upper part of the fourth vision in a state where the sorting picker picks up one or more of the semiconductor materials delivered to the sorting table and inspecting and correcting the pickup state of the semiconductor material based on the extracted parameters,
generating location data of a semiconductor material to be picked up by the sorting picker among the semiconductor materials transmitted to the sorting table based on the extracted parameters;
The sorting picker picking up one or more semiconductor materials to be picked up among the generated location data and transferring them to the upper part of the fourth vision;
Inspecting the pickup state of the semiconductor material picked up by the sorting picker using the fourth vision and calculating a position correction value so that the center of the semiconductor material matches the center of the fourth vision; and
A processing method of a semiconductor manufacturing apparatus, further comprising reflecting the calculated position correction value to the sorting picker. According to clause 11,
After extracting the collected information into parameters necessary for process automation,
Further comprising determining whether the collected information matches the semiconductor material information embedded in the wit table, the dry block, and the 2D code mounted on top of the alignment table,
A processing method of a semiconductor manufacturing apparatus, characterized in that if the determination result matches, a predetermined operation is performed on the semiconductor material based on the extracted parameter, and if the determination result does not match, the operation is stopped. According to clause 11,
A processing method for a semiconductor manufacturing apparatus, further comprising performing a predetermined operation on a semiconductor material of a subsequent substrate supplied after the substrate based on the parameters extracted for the substrate. According to clause 11,
Further comprising a step of obtaining information about the sorting table before the sorting picker having a plurality of pickup units picks up one or more of the semiconductor materials delivered to the sorting table,
The step of obtaining information about the sort table is
acquiring a plurality of partial images by dividing the alignment table into a plurality of imaging areas and sequentially photographing the alignment table using a fifth vision;
obtaining an entire image of the alignment table by combining the plurality of partial images; and
Obtaining location and size information of the semiconductor material loading groove formed on the alignment table from the obtained overall image of the alignment table,
The step of the sorting picker picking up one or more of the semiconductor materials delivered to the alignment table is a processing method of a semiconductor manufacturing device, characterized in that the semiconductor materials are picked up based on the previously obtained location information of the loading groove of the alignment table. . According to clause 11,
The step of the sorting picker picking up one or more of the semiconductor materials delivered to the sorting table includes the sorting picker rotating the semiconductor material transferred to the sorting table by 0 to 270° according to a preset discharge direction. Pick up materials,
A processing method of a semiconductor manufacturing apparatus, characterized in that the rotation angle of the alignment table is set by an operator. According to clause 11,
After inspecting the lower surface of the semiconductor material picked up by the sorting picker with the fourth vision, it further includes a step of obtaining information about the tray before loading it on a tray,
The step of obtaining information about the tray is
acquiring a plurality of partial images by dividing the tray into a plurality of photographing areas using a fifth vision and sequentially photographing the tray;
obtaining an entire image of the tray by combining the plurality of partial images; and
A step of obtaining location or size information of a semiconductor material seating groove formed in the tray from the obtained overall image of the tray,
In the step of inspecting the lower surface of the semiconductor material picked up in the sorting picker with the fourth vision and then loading it on the tray, the semiconductor material picked up in the sorting picker is moved to the semiconductor material based on the obtained location information of the semiconductor material seating groove. A processing method of a semiconductor manufacturing device, characterized in that the material is delivered to the seating groove. According to clause 21,
The step of inspecting the lower surface of the semiconductor material picked up by the sorting picker with the fourth vision and then loading it on the tray,
Further comprising supplying a new tray when the semiconductor materials are all seated in the semiconductor material seating grooves of the tray,
Based on the information on the location and size of the semiconductor material seating groove of the tray obtained in the information acquisition step about the tray, the seating groove corresponding to the preset predetermined seating groove of the supplied new tray is inspected using the fifth vision to install the tray. A processing method for a semiconductor manufacturing device characterized by verification. According to clause 22,
The step of inspecting the lower surface of the semiconductor material picked up by the sorting picker with the fourth vision and then loading it on the tray,
Further comprising supplying a new tray when the semiconductor materials are all seated in the semiconductor material seating grooves of the tray,
Based on the semiconductor material seating groove location information of the tray obtained in the information acquisition step about the tray, two or more seating grooves provided on the outermost side of the tray are inspected with the fifth vision to determine the seating groove location of the supplied tray. A processing method of a semiconductor manufacturing device, characterized in that recalculating and loading the semiconductor material into the recalculated seating groove position. According to clause 20,
The step of inspecting the lower surface of the semiconductor material picked up by the sorting picker with the fourth vision and then loading it on the tray,
When the semiconductor materials are all seated in the semiconductor material seating grooves of the tray, it further includes the step of inspecting the seating state of the tray using a fifth vision,
As a result of inspecting the seating condition of the semiconductor material, if the seating condition is poor, check the pickup unit of the sorting picker that loaded the semiconductor material. If the number of defective seating by the pickup unit exceeds a predetermined number of times, the pickup unit's A processing method for a semiconductor manufacturing device, characterized by skipping the pick-up operation or alarming the operator to check for work errors.