KR20230144940A - Substrate attaching apparatus and substrate attaching method - Google Patents

Abstract

The present invention equalizes the pressure applied to the bonding surfaces between a plurality of substrates. A board pasting device (100) includes a first plate (20) and a second plate (30) which sandwich a plurality of substrates (S1, S2) in a stacked state, and a pressing mechanism (30) which presses either the first plate (20) or the second plate (30) against the other, and at least one of the first plate (20) and the second plate (30) includes a plate body (31), and a deformable contact sheet (35) which is supported by the plate body (31) and abuts the substrates (S1, S2), and has higher flexibility than the plate body (31).

Description

Substrate attachment device and substrate attachment method {SUBSTRATE ATTACHING APPARATUS AND SUBSTRATE ATTACHING METHOD}

The present invention relates to a substrate sticking device and a substrate sticking method.

A substrate sticking device that attaches a plurality of substrates in an overlapping state is known. As such a substrate sticking device, for example, a configuration including a pressurized portion, a stress distribution portion disposed on the lower surface of the stress dispersing portion, and a component holding portion disposed on the lower surface of the stress dispersing portion is disclosed (for example, patent document 1 reference). In this configuration, the component holding portion is mounted on the lower surface of the stress dispersion plate constituting the stress dispersion portion. Pressing force from the pressing mechanism is applied as a point load to the center of the upper surface of the pressed portion. The stress dispersion plate is provided with a contact portion with an annular shape and a trapezoidal cross-section on its upper surface. A plurality of substrates are sandwiched between the component holding portion and the stress distribution portion. The pressing force from the pressing mechanism is distributed to the surroundings by the annular contact portion formed on the stress distribution plate. In this way, by forming the stress distribution plate, the pressing force applied to the bonding surfaces of the plurality of substrates is equalized.

Japanese Patent Publication No. 2007-301593

Since the substrate sticking device of Patent Document 1 transmits the pressing force through an annular contact portion, there is no part that transmits the pressing force on the extension in the pressing axial direction, and it is insufficient to uniformly distribute the pressing force. In order to properly bond the substrates together, there is a demand for further uniformity of the pressing force applied to the bonding surface of the plurality of substrates. In addition, when the uniformity of the pressing force applied to the bonding surface of a plurality of substrates is low, for example, when the substrate is cleaned in the post-process of the substrate sticking device, electronic components on the substrate may fall off. there is.

The purpose of the present invention is to provide a substrate sticking device and a substrate sticking method capable of equalizing the pressing force applied to the bonding surfaces of a plurality of substrates.

In the first aspect of the present invention, there is provided a first plate and a second plate for holding a plurality of substrates in an overlapping state, and a pressing mechanism for pressing one of the first plate and the second plate against the other, the first plate and the second plate A substrate sticking device is provided, wherein at least one of the second plates includes a plate main body and a deformable contact sheet that is supported by the plate main body and abuts the substrate and has higher flexibility than the plate main body.

In a second aspect of the present invention, a method of bonding a plurality of substrates by sandwiching the plurality of substrates with a first plate and a second plate in an overlapping state, wherein between the first plate and the second plate, a plurality of substrates are formed. It includes arranging the substrates in an overlapping state and applying a pressing force to a plurality of substrates between the first plate and the second plate by pressing one of the first plate and the second plate toward the other, where the pressing force is A method of attaching a substrate is provided, in which a plurality of substrates are provided through a contact sheet that deforms according to a pressing force.

According to the present invention, in the substrate sticking device, at least one of the first plate and the second plate is in contact with the substrate and is provided with a deformable contact sheet having higher flexibility than the plate main body, so the pressing force by the pressing mechanism is , is transferred to a plurality of substrates via a contact sheet. Therefore, the pressing force applied to the bonding surface of the plurality of substrates can be equalized, and the plurality of substrates can be properly bonded to each other.

1 is a diagram showing an example of a substrate sticking device according to an embodiment.
Fig. 2 is a view of the substrate and the substrate as seen from above.
Fig. 3 is a vertical cross-sectional view of the second plate being lowered and the contact sheet colliding with the substrate.
Fig. 4 is a flow chart showing an example of the substrate sticking method according to the present embodiment.
Figure 5 is a process chart showing an example of the operation of the substrate sticking device.
Figure 6 is a process chart showing an example of the operation of the substrate sticking device.
Fig. 7 is a process diagram showing an example of the operation of the substrate sticking device.
Figure 8 is a process chart showing an example of the operation of the substrate sticking device.
Figure 9 is a process diagram showing an example of the operation of the substrate sticking device.
Fig. 10 is a diagram showing the results of performance evaluation of sheet materials used for contact sheets.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following description. In addition, in the drawings, some parts are omitted and expressed in order to easily explain the embodiments. Additionally, in the drawings, the scale is changed appropriately, such as enlarging or emphasizing some parts, and the size and shape may be different from the actual product. In each drawing below, the direction in the drawing is explained using the XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, the plane parallel to the horizontal plane is called the XY plane. In this XY plane, the direction parallel to the transport direction of the substrate S1 and S2 is referred to as the X direction, and the direction perpendicular to the Additionally, the direction perpendicular to the XY plane is expressed as the Z direction (height direction). Each of the X-direction, Y-direction, and Z-direction is explained assuming that the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

＜Substrate sticking device＞

The substrate sticking device 100 according to the embodiment will be described. FIG. 1 is a diagram showing an example of a substrate sticking device 100 according to an embodiment. The substrate sticking device 100 attaches the substrate S1 and the substrate S2 by applying a pressing force to the substrates S1 and S2 that are temporarily bonded through the adhesive layer F in the previous process. The adhesive layer (F) is formed on at least one of the substrate (S1) and the substrate (S2).

The substrate S1 and the substrate S2 are, for example, glass substrates, but may be semiconductor substrates other than glass substrates, resin substrates, etc. In this embodiment, of the two substrates to be attached, the upper substrate is called substrate (S1), and the lower substrate is called substrate (S2). In addition, the form in which the substrate (S1) and the substrate (S2) are attached is called the substrate (S). Both the substrate S1 and the substrate S2 are circular substrates with a circular shape in a planar view (viewed from the Z direction), but they are not limited to circular substrates and are rectangular in a planar view (square, rectangular). The substrate may be a square substrate, oval-shaped, oval-shaped, etc. (above).

FIG. 2 is a view of the substrate S1 and the substrate S2 as seen from above. As shown in FIG. 2 , the substrate S1 and S2 have a functional region Af. The functional area Af is an area where elements such as a semiconductor chip are arranged between the substrate S1 and the substrate S2. The functional area Af is set radially inside the outer peripheral edge Se of the substrate S1 and S2. The substrate S1 and S2 have an outer peripheral area As in which no elements are disposed, radially outside the functional area Af.

As shown in FIG. 1, the substrate sticking device 100 includes a chamber 10, a first plate 20, a second plate 30, a pressing mechanism 50, and a control unit (not shown). Equipped with A control unit (not shown) collectively controls the operation of each unit in the substrate sticking device 100.

The chamber 10 is arranged on the base 15 of the substrate sticking device 100. The chamber 10 is formed in a box shape with a side wall 10a extending upward from the outer periphery of the base 15 and a top plate 10b covering the upper part of the side wall 10a. The chamber 10 accommodates the first plate 20, the second plate 30, and a part of the pressing mechanism 50 therein. The chamber 10 has an opening 11 in a part of the side wall 10a. The opening 11 is formed on the -X side surface of the chamber 10 and communicates the inside and outside of the chamber 10. The opening 11 allows the substrates S1 and S2, which are temporarily bonded together via the adhesive layer F in the previous process, and the substrate S to which the substrate S1 and S2 are attached, to pass through. It is formed by dimensions. The substrates S1 and S2 are loaded into the chamber 10 through the opening 11 by a transfer device (not shown). Additionally, the substrate S is carried out from within the chamber 10 through the opening 11.

The chamber 10 is equipped with a gate valve 12 that opens and closes the opening 11. The gate valve 12 is disposed on the outside of the - The gate valve 12 can open and close the opening 11 by sliding, and can keep the inside of the chamber 10 in a sealed state by closing the opening 11.

In addition, in this embodiment, the inside of the chamber 10 is sealed by closing the opening 11, and the inside of the chamber 10 is maintained in a vacuum atmosphere by a vacuum pump (not shown). By suctioning (exhausting) the inside of the chamber 10 with this suction device, the inside of the chamber 10 can be created in a vacuum atmosphere. Additionally, the chamber 10 may be provided with a valve that can be opened to the outside in order to open the internal vacuum atmosphere. However, the inside of the chamber 10 is not limited to creating a vacuum atmosphere, and the inside of the chamber 10 may be placed under an atmospheric pressure atmosphere even if the opening 11 is closed with the gate valve 12. In addition, on the upper surface of the chamber 10, a plurality of penetrating portions 10h through which a plurality of compression shafts 51 described later penetrate are formed. A compression shaft 51 is inserted into each of the penetrating portions 10h in a liftable state, and the sealed state within the chamber 10 is maintained by a seal member (not shown).

In addition, the substrate sticking device 100 may be provided with the chamber 10 or not, and may be in a form without the chamber 10 (open to the atmosphere). Additionally, the inside of the chamber 10 may be connected to a gas supply device not shown. By supplying a predetermined gas into the chamber 10 from this gas supply device, the atmosphere within the chamber 10 can be replaced with a predetermined gas atmosphere. As the predetermined gas, for example, a gas inert to the thin film formed on the substrates S1 and S2, such as nitrogen gas, or dry air, etc. are used.

The first plate 20 supports the substrates S1 and S2 loaded into the chamber 10 from below. The first plate 20 has a circular shape when viewed from above, but is not limited to this shape, and may be, for example, rectangular (square, rectangular), elliptical, oval, etc. The first plate 20 is set to have an outer diameter larger than that of the substrates S1 and S2.

The first plate 20 has a support plate 21, a first heater (heating section) 22, and a base plate 23. The support plate 21, the first heater 22, and the base plate 23 are stacked in this order starting from the lower side (-Z side). The first plate 20 is supported by a plurality of struts 24 formed on the lower surface side of the support plate 21, and is fixed to the upper surface of the base 15 via the props 24. The space between the support plate 21 and the first heater 22 and between the first heater 22 and the base plate 23 is fixed by fastening members such as bolts, for example.

The support plate 21 is, for example, a plate-shaped body formed of a material such as metal, resin, or ceramics. The first heater 22 is an example of a heating unit, and is, for example, a hot plate having a heating mechanism (heat source) such as a heating wire inside. The first heater 22 heats the substrates S1 and S2 via the base plate 23. Additionally, the first heater 22 may be a laminated structure stacked with sheet-shaped heat sources interposed between them. In addition, in this embodiment, the first plate 20 has the first heater 22, but may be configured without it.

In the base plate 23, the substrates S1 and S2 and the substrate S are placed on the +Z side mounting surface 23a, which is the upper surface. The base plate 23 is, for example, a ceramic plate formed into a plate shape made of ceramics in order to relax the thermal expansion coefficient of the substrates S1, S2, and the substrate S. However, the base plate 23 may be formed of metal, resin, etc. . The mounting surface 23a of the base plate 23 serves as a contact surface with the substrate S2. Therefore, it is desirable that the placement surface 23a has a high flatness and a small surface roughness (or a mirror surface).

A plurality of supports 24 are formed on the lower surface of the support plate 21 . The plurality of supports 24 are used to support the first plate 20 on the base 15 at the bottom of the chamber 10. The plurality of supports 24 are arranged on the outer periphery of the support plate 21 . The support 24 has a rectangular shape when viewed from above, but may also have a circular shape, an oval shape, an oval shape, etc. A plurality of supports 24 are arranged at intervals in the circumferential direction of the support plate 21 . In this embodiment, six pillars 24 are arranged at intervals in the circumferential direction. By supporting the first plate 20 with a plurality of supports 24, deformation of the first plate 20 is prevented even when the pressing force by the pressing mechanism 50 is large. In addition, the number and arrangement of the plurality of supports 24 are not limited to the above-described form and can be arbitrarily set depending on the size of the first plate 20, the size of the pressing force used, etc.

FIG. 3 is a vertical cross-sectional view of the second plate 30 being lowered so that the contact sheet 35 is struck against the substrates S1 and S2. As shown in FIG. 3, when attaching the substrates S1 and S2, the second plate 30 faces the substrates S1 and S2 toward the first plate 20 (-Z side). Pressurize. The second plate 30 is disposed above the first plate 20. The second plate 30, like the first plate 20, has a circular shape when viewed from above, but is not limited to this shape and may have, for example, a rectangular shape (square, rectangular shape), oval shape, or oval shape. etc. may also be used. The second plate 30 is set to have an outer diameter larger than that of the substrates S1 and S2. The outer diameter dimension of the second plate 30 is the same as that of the first plate 20, but is not limited to this form. For example, the second plate 30 may have a larger or smaller outer diameter than the first plate 20 .

The second plate 30 is held at the lower end of the pressing shaft 51 of the pressing mechanism 50, which will be described later, and moves up and down as the pressing shaft 51 rises and falls. The second plate 30 includes a plate main body 31 and an abutting sheet 35. The plate main body 31 is provided with a hydraulic plate 32, a second heater (heating section) 33, and a pressure plate 34. The pressure plate 32, the second heater 33, the pressure plate 34, and the contact sheet 35 are stacked in this order from the top. The hydraulic plate 32, the second heater 33, and the pressure plate 34 each have a circular plate shape in plan view and have the same outer diameter. The hydraulic plate 32, the second heater 33, and the pressure plate 34, which constitute the plate main body 31, are fixed by fastening members such as bolts, for example.

The pressure plate 32 is disposed on the pressurizing mechanism 50 side, that is, on the upper side. The hydraulic plate 32 is connected to the lower end of the pressing shaft 51 of the pressing mechanism 50. Since the hydraulic plate 32 receives a pressing force from the pressing shaft 51 of the pressing mechanism 50, it is preferably formed to have a predetermined strength. The hydraulic plate 32 is formed of, for example, metal, resin, ceramics, etc. In this embodiment, the hydraulic plate 32 is a metal plate.

The second heater 33 is disposed between the pressure plate 34 and the water pressure plate 32. The second heater 33 is disposed on the upper surface of the pressure plate 34. The second heater 33, like the first heater 22 of the first plate 20, is a hot plate that has a heating mechanism (heat source) such as a heating wire inside, for example. A second heater (not shown) heats the substrate S1 via the pressure plate 34. In addition, like the first heater 22, the second heater (not shown) may be a laminated structure stacked with a sheet-like heat source interposed therebetween. In addition, in this embodiment, the plate main body 31 is provided with the second heater 33, but may be configured without it.

The pressure plate 34 is formed below the second heater 33. The pressure plate 34 is provided with a pressure surface 34a on the lower surface on the -Z side for pressing the substrate S1 from above. The pressure plate 34 is, for example, a ceramic plate formed into a plate shape made of ceramics to alleviate the thermal expansion coefficient of the substrates S1, S2, and the substrate S. However, the pressure plate 34 is formed into a plate shape made of metal, resin, etc. It's okay.

The contact sheet 35 is supported on the plate main body 31. The contact sheet 35 is formed on the first plate 20 side, that is, on the lower side, with respect to the plate main body 31. The contact sheet 35 is fixed along the pressing surface 34a of the pressing plate 34. The contact sheet 35 is fixed to the pressing surface 34a by, for example, adhesion, adsorption, or the like. The contact sheet 35 is preferably configured to be removable from the pressing surface 34a by appropriate means. The contact sheet 35 faces downward and has an contact surface 35f that abuts the substrate S1.

The contact sheet 35 is formed in a circular shape when viewed from below, but is not limited to a circular shape. For example, the substrate may be rectangular (square, rectangular), elliptical, oval, etc. in plan view. The contact sheet 35 is formed of a deformable material that has higher flexibility than the plate main body 31. When a load is applied to the substrates S1 and S2 by lowering the pressure plate 34, the pressing force by the pressure mechanism 50 is applied from the pressure plate 32 to the second heater 33, the pressure plate 34, It is transmitted to the plurality of substrates S1 and S2 via the contact sheet 35. At this time, the contact sheet 35 is deformed in the vertical direction (sheet thickness direction) by the pressing force to equalize the pressure fluctuation width acting on the substrates S1 and S2.

For this reason, the contact sheet 35 is formed of a material having a compressive Young's modulus lower than that of the plate main body 31. In the plate body 31, when the pressure plate 34 disposed above the contact sheet 35 is made of ceramics, for example, its compressive Young's modulus is 300,000 (MPa). Moreover, when the pressurizing plate 34 of the plate main body 31 is made of stainless steel, for example, the compression Young's modulus E is 193000 (MPa). In short, when a load is applied to the pressure plate 34 to the substrates S1 and S2, almost no displacement (amount of strain) in the vertical direction occurs on the pressure surface 34a. On the other hand, in order to equalize the pressure fluctuation range acting on the substrates S1 and S2 when a load is applied to the pressure plate 34 in the contact sheet 35, the conditions as shown below are satisfied. It is preferred to use the material for the abutting sheet 35.

For example, it is preferable that the contact sheet 35 is not temporarily fixed or fixed to the substrates S1 and S2, that is, it is preferably supported on the plate main body 31 as in the present embodiment, When a load of 1.0 t per unit area is applied to the substrates S1 and S2, it is preferable that the substrate is formed including a material that is displaced (deformed) in the range of 50 um or more and 360 um or less in the direction of the load. If the amount of displacement of the abutting sheet 35 when a load of 1.0 t per unit area is applied to the substrates S1 and S2 is below the above range, the displacement of the abutting sheet 35 when the load is applied is It is small, and a sufficient pressure equalization effect is not obtained. Moreover, if the amount of displacement of the contact sheet 35 when a load of 1.0 t per unit area is applied to the substrates S1 and S2 exceeds the above range, a sufficient load may not be applied to the substrates S1 and S2. There is a possibility.

In addition, as the load per unit area, for example, 1.0 t is exemplified, but it is not limited to this. In fact, the load may be appropriately changed in accordance with the load when bonding the substrates S1 and S2 with the substrate sticking device 100. In addition, the contact sheet 35 is preferably formed of a heat-resistant material that resists the heating temperature by the second heater 33. The heating temperature by the second heater 33 is, for example, about 150°C.

For example, the contact sheet 35 is preferably formed of a material with a compressive Young's modulus of, for example, 0.2 to 2 MPa. A more preferable range of the compressive Young's modulus of the contact sheet 35 is 0.3 to 0.9 MPa. For example, when the compressive Young's modulus exceeds the above range, the displacement when a load is applied is small, and a sufficient pressure equalization effect may not be obtained. On the other hand, when the compressive Young's modulus is below the above range, there remains a possibility that a sufficient load is not applied to part or all of the substrates S1 and S2.

In addition, for example, the contact sheet 35 is preferably formed of a material having a rubber hardness of, for example, 5 to 36. A more preferable range of the rubber hardness of the contact sheet 35 is 15 to 36, and a more preferable range is 20 to 30. For example, when the rubber hardness exceeds the above range, a sufficient pressure equalization effect may not be obtained. On the other hand, when the rubber hardness is below the above range, there remains a possibility that a sufficient load is not applied to part or all of the substrates S1 and S2. Also, for example, the contact sheet 35 is preferably formed of a porous material. By forming the contact sheet 35 including a porous material, the pressure equalization effect becomes easy to obtain. In addition, the rubber hardness used in this embodiment is a value measured using a C-type hardness tester based on JIS K 7312.

In addition, when mass producing the substrate S with the substrate sticking device 100, the contact sheet 35 is maintained even after a certain number of times has elapsed when the load is repeatedly applied under each of the above-mentioned conditions. It is desired that performance is not significantly deteriorated. As a material used for the contact sheet 35 that satisfies each of these conditions, for example, a fluorine sponge (with base material) can be used. In addition, if the substrate sticking process is not performed multiple times, a gasket made of PTFE (polytetrafluoroethylene) can also be used as the material used for the contact sheet 35.

Moreover, for example, it is preferable that the contact sheet 35 is formed including a material with a thickness of, for example, 0.5 mm or more and 2.0 mm or less. A more preferable range of the thickness of the contact sheet 35 is 0.5 mm or more and 1.5 mm or less. For example, when the thickness of the contact sheet 35 exceeds the above range, it becomes difficult for heat from the second heater 33 to be transmitted to the substrates S1 and S2 when a load is applied. Moreover, when the thickness of the contact sheet 35 is less than the above range, the displacement of the contact sheet 35 when a load is applied is small, and a sufficient pressure equalization effect is not obtained.

Additionally, a base material having functionality such as enhancing release properties from the substrate S1 may be formed on at least one of the upper and lower surfaces of the contact sheet 35. The base material may be a film or the like. For example, you may form a polyimide layer, for example, on at least one of the upper surface and the lower surface of the contact sheet 35.

The outer diameter (outer diameter) dimension of the contact sheet 35 is set smaller than the outer diameter of the substrates S1 and S2. Accordingly, when the contact sheet 35 comes into contact with the substrates S1 and S2, the outer peripheral portions of the substrates S1 and S2 protrude to the outside of the contact sheet 35. When the outer diameter (outer diameter) size of the contact sheet 35 is made larger than the external size of the substrates S1 and S2, the outer peripheral portion of the contact sheet 35 protrudes radially outward from the substrates S1 and S2. It comes out. Then, while repeating the pressing of the substrates S1 and S2, the outer peripheral portion of the contact sheet 35 is not displaced, and the portion abutting the substrates S1 and S2 on the inside thereof is pressed and crushed by the repeated displacement. . As a result, when the non-crushed portion of the outer peripheral portion of the contact sheet 35 contacts the substrates S1 and S2 due to a misalignment between the contact sheet 35 and the substrates S1 and S2, etc. There is a possibility that excessive pressure may be applied to the area. Even when the outer diameter size of the contact sheet 35 is made the same as the outer diameter size of the substrates S1 and S2, the same problem may occur.

The contact sheet 35 is preferably formed to cover the functional area Af of the substrates S1 and S2. In other words, it is preferable that the outer diameter size of the contact sheet 35 is set larger than the outer diameter size of the functional area Af. As a result, when applying pressure, the entire contact sheet 35 comes into contact with the functional area Af, and the pressure can be effectively equalized.

The pressing mechanism 50 lowers the second plate 30 and moves the substrate S1 toward the substrate S2 (first plate 20 side) when attaching the substrate S1 to the substrate S2. Pressure toward. As shown in FIG. 1, the pressing mechanism 50 includes a pressing shaft 51 and a drive unit (not shown) that drives the pressing shaft 51. The pressing shaft 51 is disposed in the central portion of the hydraulic plate 32 when viewed from above, and applies a load (pressing force) to the central portion of the hydraulic plate 32.

The compression shaft 51 is inserted into the chamber 10 through the penetration portion 10h. The compression shafts 51 are each rod-shaped with a circular cross-section, and are formed of an outer diameter and a material (for example, metal, resin, ceramics, etc.) that are not deformed by an applied load or whose deformation is suppressed. The driving unit (not shown) drives the compression shaft 51. As the driving unit, for example, an air cylinder device, a hydraulic cylinder device, a ball screw mechanism using an electric rotation motor, etc. are used.

The driving unit is controlled by a control unit (not shown). The load applied to the pressing shaft 51 by the drive unit (not shown) and the drive timing for applying the load are collectively controlled by the control unit (not shown) based on a preset program or the like. In addition, part or all of the operation of the drive unit (not shown) may be performed by operation by an operator.

＜Substrate attachment method＞

Next, the substrate sticking method according to this embodiment will be described. Fig. 4 is a flow chart showing an example of the substrate sticking method according to the present embodiment. This substrate sticking method is executed, for example, by instructions from a control unit (not shown). 5 to 8 are process diagrams showing an example of the operation of the substrate sticking device 100. In addition, in these process charts, the description is simplified so that the movement of each part is easy to understand. Hereinafter, description will be made according to the flow chart in FIG. 4.

First, the gate valve 12 of the chamber 10 is opened, and the substrate S is brought in (step S01). As shown in FIG. 5, the control unit (not shown) drives a drive unit (not shown) to raise the gate valve 12 and open the opening 11. Subsequently, a plurality of substrates S1 and S2, which were already overlapped through an adhesive layer F in the previous process, are brought into the chamber 10 by a transfer device (not shown). At this time, the second plate 30 is spaced upward with respect to the first plate 20. A transfer device (not shown) enters the inside of the chamber 10 from the opening 11 while holding the substrates S1 and S2, and transfers the overlapping substrates S1 and S2 to the first plate 20. It is placed on the base plate 23 (step S02).

Subsequently, as shown in FIG. 6, the gate valve 12 is closed, and the inside of the chamber 10 is evacuated by a suction device (not shown) to create a vacuum atmosphere, for example, in the chamber 10 (step S03). In addition, instead of creating a vacuum atmosphere in the chamber 10, clean air is supplied into the chamber 10 while exhausting the inside of the chamber 10 by a suction device (not shown), for example, the chamber 10 The inside may be replaced with clean air under atmospheric pressure conditions.

Subsequently, as shown in FIG. 7 , the control unit (not shown) drives the drive unit (not shown) to lower the second plate 30 together with the pressing shaft 51, thereby lowering the base of the first plate 20. The pressure plate 34 of the second plate 30 is brought into contact with the substrates S1 and S2 supported on the plate 23 (step S04). Subsequently, in this state, the substrates S1 and S2 are heated for a predetermined period of time by the first heater 22 and the second heater (not shown) to perform a preheat treatment. The preheat treatment is performed by setting the temperature of the first heater 22 and the second heater (not shown) to, for example, 150°C to 250°C.

Subsequently, a load is applied to the compression shaft 51 to attach the substrate S1 and the substrate S2 (step S05). The control unit (not shown) drives the drive unit (not shown) to lower the second plate 30 together with the pressing shaft 51, and moves the substrate S1 between the first plate 20 and the second plate 30. ) and the substrate S2, the substrate S1 and the substrate S2 are attached. At this time, heating by the first heater 22 and the second heater (not shown) may be continued to maintain the first plate 20 and the second plate 30 at a predetermined temperature. The substrate S1 and the substrate S2 are bonded by melting the adhesive layer F by heat, and further, by applying pressure from the side of the substrate S1 by the second plate 30, the substrate S1 and the substrate are bonded together. (S2) is firmly attached.

After completion of sticking of the substrate S1 and S2, as shown in FIG. 8, a drive unit (not shown) is driven to raise the second plate 30 together with the pressing shaft 51 (step S06). Thereafter, as shown in FIG. 9 , the gate valve 12 is opened and the substrate S is unloaded from the chamber 10 (step S07). After raising the gate valve 12 to open the opening 11, the substrate S placed on the support plate 21 of the first plate 20 is transferred to the chamber 10 using a transfer device (not shown). taken out of the After that, the control unit (not shown) closes the gate valve 12 and ends the series of processes.

As described above, since the substrate sticking device 100 according to the present embodiment includes the abutting sheet 35, the pressing force by the pressing mechanism 50 applies the abutting sheet 35 from the plate main body 31. It is then transferred to a plurality of substrates (S1, S2). The contact sheet 35 has higher flexibility than the plate main body 31 and is deformable. Thereby, the pressing force by the pressing mechanism 50 is transmitted more uniformly to the second heater 33. Therefore, according to the substrate sticking device 100 according to the present embodiment, it is possible to equalize the pressing force applied to the bonding surfaces of the plurality of substrates S1 and S2.

(Example)

Next, performance evaluation was performed on a plurality of materials used for the contact sheet 35 as described above, and the results are shown below.

Here, as the sheet material used for the contact sheet 35, the following was used.

Test specimen 1: Fluorine sponge with a thickness of 1 mm (with base material)

Test specimen 2: Gasket made of PTFE (polytetrafluoroethylene) with a thickness of 0.5 mm

Test specimen 3: Gasket made of PTFE (polytetrafluoroethylene) with a thickness of 1 mm

Comparative example: Contact sheets are not used

When the sheet materials of the above test specimens 1 to 3 were sandwiched between the first plate 20 and the second plate of the substrate sticking device 100 with the substrates S1 and S2, respectively, and a load of 4000 kgf was applied. The pressure fluctuation range in the sheet material was measured with a pressure fluctuation meter. In addition, as a comparative example, the substrates S1 and S2 are sandwiched between the first plate 20 and the second plate of the substrate sticking device 100 without using the contact sheet 35, and a load of 4000 kgf is applied. When applied, the pressure fluctuation range was measured with a pressure fluctuation meter.

Fig. 10 is a diagram showing the evaluation results of the sheet material. Here, the compressive Young's modulus of the sheet materials of test specimens 1 to 3 was determined by the following equation (1) and shown in FIG. 10.

E = F × L/(A·ΔL) ··· (1)

Here, F is the load, A is the planar area of the sheet material, L is the thickness of the sheet material, and ΔL is the amount of displacement of the thickness of the sheet material. In addition, the compressive Young's modulus in the comparative example is the value of the stainless steel constituting the plate (second plate).

As shown in FIG. 10, for test specimens 1 to 3, the compressive Young's modulus, durability of the sheet material under a 1 ton load, and minimum value of the pressure applied to the sheet material when a 1 ton load was repeatedly applied 500 times, respectively. and the difference between the maximum value (pressure fluctuation range), respectively, sufficiently satisfied each condition compared to the comparative example in which no sheet material was used. Here, durability is judged based on the pressure fluctuation range. This is because the pressure fluctuation range increases when the sheet is completely crushed by repeated loading and the effect of increasing pressure uniformity is lost. Regarding test specimens 1 to 3, the pressure fluctuation range is significantly smaller than that of the comparative example, so it can be judged that they have sufficient durability as a sheet material.

Although the embodiments have been described above, the present invention is not limited to the above description, and various changes are possible without departing from the gist of the present invention. For example, in the above-described embodiment, the second plate 30 disposed on the upper side is moved by the pressing mechanism 50, and the second plate 30 is provided with an abutting sheet 35. Although the description is given as an example, it is not limited to this. For example, the configuration may be such that the first plate 20 disposed on the lower side is moved by the pressing mechanism 50, and the abutting sheet 35 is provided on the first plate 20.

In addition, in the above-described embodiment, the configuration in which the substrates S1 and S2, which are temporarily bonded through the adhesive layer F in the previous process, are attached by the substrate sticking device 100 has been described as an example, but the configuration is not limited to this. No. For example, the substrates S1 and S2 are sequentially loaded into the substrate sticking device 100, and the substrates S1 and S2 are bonded via the adhesive layer F, and then bonded to the first plate 20 and the second plate 20. A configuration may be used in which the substrates S1 and S2 are attached by pressing the substrates S1 and S2 between the two plates 30 .

20: first plate
30: second plate
31: plate body
35: abutting sheet
50: pressurizing mechanism
100: Substrate attachment device
Af: functional area
S, S1, S2: Substrate

Claims (10)

A first plate and a second plate sandwiching a plurality of substrates in an overlapping state;
It has a pressing mechanism that presses one of the first plate and the second plate against the other,
At least one of the first plate and the second plate,
plate body,
A substrate sticking device comprising a deformable contact sheet that is supported by the plate main body and abuts the substrate, and has higher flexibility than the plate main body. According to claim 1,
A substrate sticking device, wherein the contact sheet is formed to cover a functional area of the substrate. The method of claim 1 or 2,
A substrate sticking device, wherein the contact sheet is formed of a material having a compressive Young's modulus lower than that of the plate main body. The method of claim 1 or 2,
The said contact sheet is a board|substrate sticking device whose rubber hardness is 15-36. The method of claim 1 or 2,
A substrate sticking device in which the contact sheet is formed using a porous material. The method of claim 1 or 2,
A substrate sticking device, wherein the contact sheet has a thickness of 0.5 mm or more and 1.5 mm or less. The method of claim 1 or 2,
A substrate sticking device wherein the contact sheet is formed of a material that deforms by 50 um or more in the direction of the load when a load of 1.0 t per unit area is applied. The method of claim 1 or 2,
One or both of the first plate and the second plate are provided with a heating unit for heating the substrate,
A substrate sticking device, wherein the contact sheet is formed of a material with heat resistance that resists the heating temperature by the heating unit. The method of claim 1 or 2,
The external dimension of the contact sheet is smaller than that of the substrate, and when the contact sheet contacts the substrate, the outer peripheral portion of the substrate protrudes outside the contact sheet. A method of joining a plurality of substrates by sandwiching them with a first plate and a second plate in an overlapping state, comprising:
placing the plurality of substrates in an overlapping state between the first plate and the second plate;
Applying a pressing force to the plurality of substrates between the first plate and the second plate by pressing one of the first plate and the second plate toward the other,
A substrate sticking method wherein the pressing force is applied to the plurality of substrates through an abutting sheet that is deformed according to the pressing force.

Images