KR20230073463A - Multi-level Eject Pin - Google Patents

Abstract

A multi-level eject pin capable of individually and easily adjusting the height difference of eject pins in multiple stages is provided. The eject pin is horizontally overlapped in an upper fixing cap with an open lower portion, and includes a plurality of upper portions contacting the rear surface of the dicing film and a lower portion formed horizontally at the lower end of the upper portion. Chuck member; Elastic members each disposed in plurality on upper portions of the plurality of chuck members; a compression member fixedly installed to correspond to the elastic member on the lower surface of the upper fixing cap and compressed in contact with the elastic member; an elevation shaft disposed in contact with a lower portion of each of the chuck members and extending in a longitudinal direction to pass through a lower portion of the chuck member positioned lower than the chuck member in contact with the chuck member to elevate the chuck member in contact with the chuck member; a plurality of cam members individually contacting each of the elevating shafts at the lower end of the elevating shaft; a first motor for driving the plurality of cam members; and an actuator capable of adjusting an initial ejection height.

Description

Multi-level Eject Pin {Multi-level Eject Pin}

The present invention relates to a die eject pin for separating dies from a dicing film in order to bond the dies onto a substrate such as a printed circuit board or a lead frame in a semiconductor manufacturing process, and more particularly, to multiple stages of eject pins. It relates to a multi-level eject pin that can easily adjust the step of each individually.

In general, semiconductor devices are formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. A wafer on which semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and the dies are bonded to a substrate through a bonding process.

An apparatus for performing a die bonding process may include a pick-up module for picking up and separating dies from a wafer divided into dies, and a bonding module for attaching the picked-up dies on a substrate. Among them, the pickup module includes a stage unit supporting a wafer ring to which a wafer is attached, an eject pin installed to be movable in a vertical direction to selectively separate a die from a wafer supported by the stage unit, and a substrate by picking up a die from the wafer. It may include a pickup unit for attaching on top.

In general, in order to separate the die from the dicing film to which the die is attached, the eject pin includes a chuck member for vertically pushing the die, a housing for accommodating the chuck member, and a driving unit for vertically moving the chuck member. include

Recently, as the sizes of dies formed on wafers become very diverse and the thicknesses gradually become thinner, a new type of die ejection method and apparatus are required to cope with this.

For example, in the case of a large die having a thickness of several tens of μm and a size of about 7 mm × 7 mm or more, the die is damaged or picked up during the die ejection process because the adhesive force between the die and the dicing film is relatively large. A pick-up defect that is not picked up by the unit may occur.

In addition, support members having a plate shape, for example, a circular disk shape may be formed under the chuck member, and elastic members may be disposed between the support members. These elastic members may be used to be sequentially raised from the outside to the inside when the chuck members composed of multiple stages are lifted. That is, the outermost chuck member among the chuck members first raises the die, and then the die is ejected by sequentially ascending the inner chuck member.

However, when lifting proceeds from the outer chuck member toward the inner chuck member, the die may be excessively raised, and the die may be damaged during the lifting process.

As a prior art, Patent Publication No. 10-2020-0141675 discloses an ejector member for separating dies on a dicing film, a drive head disposed below the ejector member and having an upper surface facing the ejector member, and the ejector member. Disclosed is a die ejecting device including a cam follower mounted on a lower side of a drive head and placed on an upper surface of a driving head.

In this device, the drive head is configured such that cam followers resting on its upper surfaces raise ejector members by inclined surfaces on the drive head as the drive head rotates. Since the inclined surfaces on the drive head are fixedly formed on the drive head, it is impossible to change the elevation height of the ejector member, and the entire drive head must be replaced.

As another prior art, Patent No. 10-2244580 discloses a plurality of ejector members disposed in a telescopic form, flanges formed at the lower ends of the ejector members, and a plurality of elastic members disposed between the flanges; Disclosed is a die ejector having an ejector driver for elevating ejector members, a connecting pin passing through flanges, and a stopper head disposed below a lowermost flange and limiting downward movement of the flange.

According to this device, it is explained that the stopper head can limit the descending height of the ejector members, and accordingly, the ascending height of the ejector members can be set in various ways according to the size of the die, but in practice, it is easy to individually adjust the height of the ejector members. It is considered difficult to reconcile.

[Patent Literature]

(Patent Document 1) KR 10-2020-0141675 A

(Patent Document 2) KR 10-2244580 B1

In order to solve the problems or drawbacks in the prior art as described above, the present invention can easily and individually adjust the steps of eject pins of multiple stages so that dies of various sizes can be safely picked up, and the dies are damaged. It is an object of the present invention to provide a multi-level eject pin having no fear of being damaged and no pick-up error from a dicing film.

In order to achieve the above object, in the present invention, the lower portion is horizontally overlapped in the upper fixing cap with an open bottom, and formed in the horizontal direction at the upper portion contacting the rear surface of the dicing film and the lower end of the upper portion. A plurality of chuck members each including a lower portion to be;

a plurality of elastic members disposed on upper portions of the plurality of chuck members, respectively;

a compression member fixedly installed to correspond to the elastic member on the lower surface of the upper fixing cap and compressed in contact with the elastic member;

an elevation shaft disposed in contact with a lower portion of each of the chuck members and extending in a longitudinal direction to pass through a lower portion of the chuck member positioned lower than the chuck member in contact with the chuck member to elevate the chuck member in contact with the chuck member;

a plurality of cam members individually contacting each of the elevating shafts at the lower end of the elevating shaft;

a first motor for driving the plurality of cam members; and

An actuator capable of adjusting the initial ejection height; characterized in that it includes a multi-level ejection pin is provided.

Preferably, the actuator capable of adjusting the initial ejection height may further include a cam member and a second motor for driving the cam member.

Preferably, the plurality of chuck members are characterized in that their upper circumferential edges are chamfered.

In addition, according to another embodiment of the present invention, as a die eject method using the multi-level eject pin of the present invention,

raising the multi-level eject pin to an initial eject height;

contacting the rear surface of the dicing film with a plurality of chuck members;

elevating all the chuck members so that the film edge is separated from the die;

descending the outermost chuck member;

elevating other chuck members except for the lowered outermost chuck member; and

There is provided a die eject method including the step of sequentially descending from the outermost chuck member among the raised chuck members to the innermost chuck member.

According to the multi-level eject pin of the present invention as described above, since the plurality of chuck members for lifting the die are individually raised and lowered by the lifting shaft that is moved up and down by the cam member, the lifting step of the chuck member can be easily adjusted individually. In addition, the chuck members can be individually and easily adjusted so that dies of various sizes can be safely picked up, and there is no fear of damaging the dies and no pick-up error from the dicing film.

1 is a schematic diagram for explaining the configuration of a general die ejecting device.
2A is a side perspective view of a drawing illustrating a configuration of a die eject pin according to an embodiment of the present invention, and FIG. 2B is a plan view, respectively.
3A is a plan view of a diagram showing the configuration of a die eject pin according to an embodiment of the present invention, FIG. 3B is a cross-sectional view taken along line MM in FIG. 3A, FIG. 3C is a cross-sectional view taken along line JJ in FIG. 3A, and FIG. 3D is It is a cross-sectional view taken along line KK in FIG. 3A.
Fig. 4A is a front view of a drawing showing configurations of an elastic member and a compression member in a die eject pin according to an embodiment of the present invention, Fig. 4B is a right side view, Fig. 4C is a rear view, and Fig. 4D is a left side view. represent each.
5 is a view showing a state in which a cam member and a servo motor for driving a cam are assembled in a die eject pin according to an embodiment of the present invention.
6 is a view showing a state in which a cam member for lifting the die eject pin and a second servo motor for driving the cam are assembled in the die eject pin according to an embodiment of the present invention.
7 is a schematic cross-sectional view illustrating a method of ejecting a die using a die eject pin according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in many different forms, and the scope of the present invention is not limited to the following It is not limited to the examples.

Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art.

In the drawings, variations of the depicted shapes may be expected, eg depending on manufacturing techniques and/or tolerances. Therefore, the embodiments of the present invention should not be construed as being limited to the specific shape of the region shown in this specification, but should include, for example, a change in shape caused by manufacturing.

Further, various elements and areas in the drawings are schematically drawn. Accordingly, the present invention is not limited by the relative sizes or spacings drawn in the accompanying drawings.

1 is a schematic configuration diagram for explaining a die ejecting apparatus according to an embodiment of the present invention.

Referring to FIG. 1 , the multi-level eject pin 100 according to an embodiment of the present invention separates the dies 220 from a wafer 210 composed of a plurality of dies 220 to make a lead frame or print. It is used in a die bonding process for bonding onto a substrate such as a circuit board. The wafer 210 may be divided into a plurality of dies 220 through a dicing process, and are provided in a state attached to the dicing film 240 . In this case, the dicing film 240 may be mounted on a wafer ring 250 having a larger diameter than the wafer 210 .

The wafer ring 250 may be held by a clamp 260 disposed on a stage 280, and the clamp 260 moves the wafer ring 250 vertically downward to expand the dicing film 240. ) can be moved, and as a result, the distance between the dies 220 attached to the dicing film 240 can be expanded.

At the bottom of the stage 280, there is a multi-level eject pin 100 of the present invention for selectively lifting the dies 220 to separate the dies 220 from the dicing film 240. A pickup device 300 for picking up the die 220 lifted by the multi-level eject pin 100 is provided above the stage 280 .

2 is a diagram showing a configuration of a die eject pin according to an embodiment of the present invention, wherein FIG. 2A is a side perspective view and FIG. 2B is a plan view, respectively. 3 is a view showing the configuration of a die eject pin according to an embodiment of the present invention, FIG. 3A is a plan view, FIG. 3B is a cross-sectional view taken along line M-M in FIG. 3A, and FIG. 3C is a cross-sectional view taken along line J-J in FIG. 3A , FIG. 3D is a cross-sectional view taken along line K-K in FIG. 3A. Figure 4 is a view showing the configuration of an elastic member and a compression member in a die eject pin according to an embodiment of the present invention, Figure 4a is a front view, Figure 4b is a right view, Figure 4c is a rear view, Figure 4d denotes the left side view, respectively.

2 to 4, the multi-level eject pin 10 according to an embodiment of the present invention includes a plurality of chuck members for separating the dies 220 from the dicing film 240 ( 13) and an upper fixing cap 10 in close contact with the lower surface of the dicing film 240, an intermediate housing 12 coupled with the upper fixing cap 10, and coupled to the lower portion of the intermediate housing 12 It may include a lower body 20 to be.

The chuck members 13 are composed of a plurality of chuck members 13A, 13B, 13C, and 13D disposed to overlap in a horizontal direction on the top of the upper fixing cap 10 in a kind of telescopic form, and the chuck member 13 ) can be varied.

The chuck members 13 (13A, 13B, 13C, 13D) include an upper part contacting the rear surface of the dicing film 240 and a lower part formed in a horizontal direction at the lower end of the upper part.

The upper fixing cap 10 has an opening at the bottom into which the chuck members 13 are inserted. In particular, the upper fixing cap 10 is connected to a vacuum supply unit such as a vacuum pump or a vacuum ejector (not shown) to vacuum the dicing film 240, and a plurality of vacuum holes 11 to which negative pressure is applied. can have

3 and 4, in the lower parts of the plurality of chuck members 13, the lower part of the outermost chuck member 13A is located at the uppermost end, and the inner chuck member 13B ) to (13D) are arranged downward in the order of the lower parts.

In addition, a plurality of elastic members 61 are disposed between the upper fixing cap 10 and the lower part of the outermost chuck member 13A, and also on the upper parts of the chuck members 13B to 13D, respectively. A plurality of elastic members 62 to 64 are disposed.

Compression coil springs may be used as the elastic members 61 to 64, but are not limited thereto, and the number of chuck members 13 is also disclosed as four in the drawing, but is not limited thereto, and is variously changed possible. Therefore, the scope of the present invention is not limited by the number of the elastic members 61 to 64, the chuck members 13, and the lower parts.

In the present invention, an elastic member is not positioned between the chuck members unlike conventional technologies. When the elastic member is inserted between the chuck members and the height of the chuck member is adjusted, if the height at which the elastic member is compressed is different, a problem may occur in horizontally aligning the chuck members.

In the present invention, the elastic members 61 to 64 are located on top of each of the chuck members 13A to 13D, and the elastic member 61 comes into contact with the lower portion of the upper fixing cap 10 and is compressed. Consisting of, the other elastic members 62 to 64 are compressed members 81 to 83 fixedly installed to correspond to each of the elastic members 62 to 64 on the lower surface of the upper fixing cap, the elastic member ( 62) to (64) and is configured in a compressed state. Since these compression members 81 to 83 are fixedly installed under the upper fixing cap 10, the elastic members 62 to 64 are compressed in a stable state, and each of the chuck members 13A to 13D Even if they are driven independently, it is possible to control the height of the chuck members 13A to 13D without affecting each other, and even if the chuck members 13A to 13D are driven simultaneously, the chuck members 13A to 13D ), it is possible to drive with little change in the height between them and keep constant.

According to one embodiment of the present invention, the multi-level eject pin 100 is disposed in contact with the lower portion of each of the chuck members 13A to 13D, and is positioned lower than the chuck member in contact with the chuck and elevating shafts 14A to 14D extending in the longitudinal direction to pass through the lower portion of the member and elevate the contacting chuck member.

Two elevating shafts 14A and 14A are placed in contact with the outermost chuck member 13A located at the uppermost end, and similarly two elevating shafts 14B, ( 14B) is disposed in contact, two lifting shafts 14C and 14C are disposed in contact with the innermost chuck member 13C, and one lifting shaft 14D is disposed with respect to the innermost chuck member 13D. Only contact is placed.

The elevating shafts 14A to 14D come into contact with the lower portions of the chuck members 13A to 13D, and move the chuck members 13A to 13D in the vertical direction according to the rotation of a cam member described later. made possible.

3 and 5, each of the elevating shafts 14A to 14D are abutted with the aforementioned elevating shafts 14A to 14D to elevate the chuck members 13A to 13D. Cam members 30 (30: 30A, 30B, 30C, 30D) disposed in contact with each other are shown.

Here, the outermost two cam members 30A are disposed at the lower ends of the two elevating shafts 14A and 14A that lift the chuck member 13A located at the outermost and uppermost end, and the inner 2 The two cam members 30B are disposed at the lower end of the two lifting shafts 14B for lifting the chuck member 13B, and the two lifting shafts 14C and 14C for lifting the inner chuck member 13C. At the lower end of ), two cam members 30C are disposed. Finally, one cam member 30D is disposed at the lower end of one elevating shaft 14D for elevating the innermost chuck member 13D.

These cam members (30: 30A, 30B, 30C, 30D) are coaxially disposed on the rotation axis of the first motor 40, which is a servo motor, and each cam member 30A, 30B, 30C, and 30D are configured to be able to control the lifting timing of the lifting shafts 14A to 14D, and the circumferential shape of the cam so that the lifting step of each lifting shaft 14A to 14D is also controllable. form

On the other hand, according to an embodiment of the present invention, the multi-level eject pin 100, as shown in Figures 2 to 4 and 6, the multi-level eject pin 100 is a dicing film An actuator capable of adjusting an initial ejection height may be included in performing an ejection action to be detached from 240 .

This actuator may further include a cam member 70 and a second motor 50 for driving the cam member 70 .

A die ejection action of the multi-level eject pin 100 according to an embodiment of the present invention configured as described above will be described with reference to FIG. 7 .

The wafer 210 divided into a plurality of dies 220 through the dicing process is provided in a state attached to the dicing film 240 . At this time, the dicing film 240 is mounted on a wafer ring 250 having a larger diameter than the wafer 210, and the wafer ring 250 is gripped by the clamp 260 disposed on the stage 280. The clamp 260 may move the wafer ring 250 vertically downward to expand the dicing film 240 .

In the present invention, by applying negative pressure through a plurality of vacuum holes 11 formed in a plurality of chuck members, the contact area is minimized while the die and the dicing film 240 are separated to some extent in advance, By sequentially lowering the chuck members from the outer chuck member 13A, the die and the dicing film can be separated while minimizing the stress applied to the die.

First, the die to be picked up 220 to be processed is aligned with the chuck member 13 located at the uppermost end of the upper fixing cap 12 of the multi-level eject pin 100, and the second motor 50 is driven to cam The member 70 is rotated so that the multi-level eject pin 100 rises to its initial eject height (Step 1).

Next, after precisely positioning the dicing film 240 and the multi-level eject pin 100, negative pressure applied from a vacuum providing unit such as a vacuum pump or a vacuum ejector (not shown) is applied to the upper fixing cap 12 By being applied to the formed plurality of vacuum holes 11, the back surface of the dicing film 240 comes into contact with the plurality of chuck members 13 (Step 2).

Then, when the motor 40 rotates and rotates the cam members 30A to 30D aligned with its rotation axis, the elevating shafts 14A to 14D contacting these cam members 30A to 30D. They move up and down according to the timing and height according to the contour shape of these cam members 30A to 30D, and accordingly, the chuck members 13A to 13D also start to move up and down at the same time.

First of all, all of the chuck members 13A to 13D rise from the upper surface of the upper fixing cap 10 by a predetermined dimension at the same time. The plurality of chuck members 13A to 13D have their upper circumferential edges chamfered, and the chamfered portion of the outermost chuck member 13A does not contact the rear surface of the dicing film 240, and the upper Since negative pressure is applied to the plurality of vacuum holes 11 formed in the fixing cap 12, the film edge starts to separate from the portion of the dicing film 240 corresponding to the chamfered portion (Step 3). In this way, by minimizing the contact area between the die and the film using chamfering, vacuum holes, etc., stress acting when a plurality of chucks descend one by one to separate the film can be minimized.

Next, the cam member 30A is rotated so that the outermost chuck members 13A and 13A descend and return to the starting position. As the chuck members 13A and 13A descend, the dicing film 240 is separated from the edge of the die 220 by the negative pressure acting on the vacuum hole 11 (Step 4).

Excluding the lowered outermost chuck members 13A and 13A, the other chuck members 13B to 13D are simultaneously raised by a predetermined dimension. As a result, the distance between the upper surface of the upper fixing cap 10 and the dicing film 240 becomes more distant, and the dicing film 240 is more easily peeled off from the die 220 by the action of the negative pressure. (Step 5).

In this way, the reason why all the chuck members are raised in two stages without raising them to the desired height as a whole is that raising them all at once is advantageous in terms of the stress generated when separating the dicing film from the die, but raising them all at once In this case, since there is insufficient space for the film to stretch, the position of adjacent dies may be affected.

Therefore, as in the present invention, if the target height is raised twice in steps 3 and 5, the outermost chuck member 13A is lowered in a state where only part of the height is raised, and then the remaining chuck members 13B to By raising the (13D), a space in which the film can be stretched is secured, and positional movement of peripheral chips is reduced.

Next, as the cam members 30B and 30B rotate, the elevating shafts 14B and 14B descend, and accordingly, the chuck members 13B and 13B descend. The dicing film 240 is more peeled off from the die 220 by the negative pressure (Step 6).

As the cam members 30C and 30C rotate, the elevating shafts 14C and 14C descend, and accordingly the chuck members 13C and 13C descend, and the dicing film is continuously affected by negative pressure. 240 is almost peeled off from the die 220, and only the non-chamfered portion of the innermost chuck member 13D remains in contact with the rear surface of the dicing film 240 (Step 7).

Finally, the dicing film 240 is completely separated from the die 220 as the innermost chuck member 13D moves down the elevating shaft 14D according to the rotation of the cam member 30D, and all the chuck members 13A When the toes 13D are aligned with the upper surface of the upper fixing tab 10, the pick-up device 300 completes pick-up of the die 22 (Step 8).

As described above, according to the multi-level eject pin of the present invention, a plurality of chuck members 13 that elevate the die 220 by the elevating shaft 14 that is elevated by the rotation of the cam members 30 Since it is individually lifted, it is possible to easily adjust the lifting steps of the chuck members 13 individually, and the timing of each lifting can also be easily controlled.

In addition, since the cam member 30 and the chuck member 13 can be individually and easily adjusted to safely pick up dies of various sizes, there is no fear of damaging the dies and no pick-up errors from the dicing film. .

Although the present invention has been shown and described based on preferred embodiments of the present invention above, the present invention is not limited to the above-described embodiments of the features, and the present invention belongs without departing from the gist of the present invention claimed in the claims. Various modifications can be made by anyone skilled in the art, and such changes and modifications are construed as falling within the scope of the claims.

10: upper fixing cap 11: vacuum hole
12: intermediate housing 13 (13A, 13B, 13C, 13D): chuck member
14 (14A, 14B, 14C, 14D): lifting shaft 20: lower body
30 (30A, 30B, 30C, 30D): cam member 40: first motor
50: second motor 60, 61, 62, 63, 64: elastic member
70: cam member for lifting die eject pin 81, 82, 83: compression member
100: multi-level eject pin
200: stage unit 210: wafer
220: die 240: dicing film
250: wafer ring 260: clamp
280: stage 300: pickup device

Claims (4)

A plurality of chuck members disposed to overlap each other in a horizontal direction within an upper fixing cap having an open lower portion, each including an upper portion contacting the rear surface of the dicing film and a lower portion horizontally formed at a lower end of the upper portion;
a plurality of elastic members disposed on upper portions of the plurality of chuck members, respectively;
a compression member fixedly installed to correspond to the elastic member on the lower surface of the upper fixing cap and compressed in contact with the elastic member;
an elevation shaft disposed in contact with a lower portion of each of the chuck members and extending in a longitudinal direction to pass through a lower portion of the chuck member positioned lower than the chuck member in contact with the chuck member to elevate the chuck member in contact with the chuck member;
a plurality of cam members individually contacting each of the elevating shafts at the lower end of the elevating shaft;
a first motor for driving the plurality of cam members; and
an actuator with adjustable initial ejection height;
Characterized in that it comprises a multi-level eject pin. According to claim 1,
The multi-level eject pin, characterized in that the actuator capable of adjusting the initial ejection height further comprises a cam member and a second motor for driving the cam member. According to claim 1,
The multi-level eject pin, characterized in that the upper circumferential edges of the plurality of chuck members are chamfered or holed. A die eject method using the multi-level eject pin according to any one of claims 1 to 3,
raising the multi-level eject pin to an initial eject height;
contacting the rear surface of the dicing film with a plurality of chuck members;
elevating all the chuck members so that the film edge is separated from the die;
descending the outermost chuck member;
elevating other chuck members except for the lowered outermost chuck member; and
descending sequentially from the outermost chuck member among the raised chuck members to the innermost chuck member;
A die eject method comprising a.

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