KR20220154956A - High-speed SSD burn-in sockets and burn-in board for simultaneously testing the SSD controller and the chip - Google Patents

Abstract

The present invention relates to a burn-in socket and a burn-in board using the same, and more particularly, to a micro mold stamping pin of about 2.1 mm, which has excellent electrical conduction, high speed signal transmission, and responds to various arrangements and fine pitches. It relates to possible burn-in sockets and technologies that utilize them.

Description

High-speed SSD burn-in sockets and burn-in board for simultaneously testing the SSD controller and the chip }

The present invention relates to a burn-in socket and a burn-in board using the same, and more particularly, to a micro mold stamping pin of about 2.1 mm, which has excellent electrical conduction, high speed signal transmission, and responds to various arrangements and fine pitches. It relates to possible burn-in sockets and technologies that utilize them.

In general, surface mount type semiconductor devices (SMT) such as IC devices or IC packages are composed of LGA (Land Grid Array), BGA (Ball Grid Array), CSP (Chip Sized Package) types, etc. It goes through a burn-in test to confirm reliability.

The burn-in test refers to a process of determining whether the semiconductor device satisfies those conditions when a temperature and voltage higher than normal operating conditions are applied to the semiconductor device before being applied to the corresponding electronic device. . The semiconductor device as described above is mounted in a burn-in test socket and undergoes a burn-in test before being shipped to a customer.

In the case of a conventional burn-in test device, a base on which a semiconductor package is mounted, a cover movably coupled to the base, a contact support having a plurality of contact pins, and a latch moving to an open and supported position according to vertical movement of the cover Including, the performance of the semiconductor package is tested by electrically connecting ends of the contact pins supported by the contact support to a test board through soldering.

The contact pins of the pogo pin type exposed from the test board contact the electrodes of the PCB test board to test the electrical properties of the semiconductor package. It should be small. In addition, the contact pins should not be deformed despite repeated burn-in tests, and the electrodes on the PCB test board should not be damaged.

In particular, since the contact pins are integrally bonded to the test board through a soldering process, when a failure occurs in the test socket and a replacement is desired, the solder bonding portion hinders free replacement thereof.

On the other hand, in general, in order to verify the durability and reliability of a device in a semiconductor device test process, a semiconductor device is mounted on a test socket, coupled to a DUT (Device under Test) board, and then electrically connected to the test board at a high temperature around 120 ° C. Connect and run the test. Such a device test process is called a burn-in test, and a burn-in socket is applied to such a burn-in test.

However, as described above, the burn-in socket is mounted on the DUT board, and a separate connector is provided between the DUT board and the test board of the test equipment to electrically connect them to each other to enable testing.

Therefore, it is important that the electrical connection between the connector and the DUT board is made completely, and various connection methods have been proposed for this purpose. There are often problems.

Korean Patent Registration No. 10-1465617 "Burn-in socket assembly" Korean Patent Publication No. 10-2017-0100837 "Test Socket of Semiconductor Package"

An object of the present invention is to implement a burn-in socket to which a pin using a mold process of a stamping pin is applied.

The purpose of the present invention is to transmit a high speed signal of 16Ghz or more with excellent electrical conduction as a stamped pin of about 2.5 to 3mm.

The purpose of the present invention is to respond to various arrangements and fine pitches as a micro-miniature pin with a size of 2.5 to 3 mm.

An object of the present invention is to apply a product that was previously applied to a single board by applying a stamping pin to an SSD socket to a test board of a burn-in test process of 144 Dut or more.

In the burn-in socket according to an embodiment, a solid-state drive (SSD) may be tested by applying a pin using a stamping pin mold process.

The pin according to one embodiment is characterized in that it is a subminiature mold stamping pin of about 2.5 to 3 mm capable of transmitting a high speed signal of 16 Ghz or higher.

According to an embodiment, a plurality of stamping pins are inserted into the socket so as to move in a vertical direction, and when a ball pushes a tip of the stamping pin in a vertical direction, the ball may contact the ball by a spring elastic force of the stamping pin.

The burn-in socket according to an embodiment further includes a latch that transmits force in one direction to the package by pressing the package according to the principle of a lever when moving in one direction, and when the upper end of the cover of the socket is pressed, the latch opens the package. When the cover is placed in a free state after loading, the latch applies pressure by pressing the upper surface of the package, and when the upper end of the stamping pin contacts the ball and reaches a certain stroke, the ball may be contacted.

A test device according to an embodiment is equipped with a burn-in socket for testing an SSD chip on one side and a device for testing a control chip on the other side, and the burn-in socket performs a stamping pin mold process. The SSD (Solid-State Drive) chip is tested by applying the used pin, but the pin includes a subminiature mold stamping pin of around 2.5 to 3 mm capable of transmitting a high speed signal of 16Ghz or more, and the plurality of stamping pins It is inserted so as to move in the vertical direction, and when the ball pushes the tip of the stamping pin in the vertical direction, the ball may be contacted by the sprin elasticity of the stamping pin.

The burn-in socket according to an embodiment uses a latch that moves in one direction, presses a package through the latch that moves according to the principle of a lever, and transmits a force in one direction to the package, and the upper end of the cover of the burn-in socket When pressed, when the latch sets the cover free after loading the open package, the latch applies pressure by pressing the top surface of the package, and when the upper end of the stamping pin contacts the ball to make a certain stroke, the ball is contacted. can

According to an embodiment, a plurality of test devices may be arranged, on one side of which a burn-in socket for testing an SSD chip is mounted, and on the other side of which a device for testing a control chip is mounted.

According to one embodiment, a burn-in socket to which a pin using a mold process of a stamping pin is applied may be implemented.

According to one embodiment, a stamped pin of about 2.5 to 3 mm has excellent electrical conduction and can transmit a high speed signal of 16 Ghz or more.

According to one embodiment, it is possible to respond to various arrangements and fine pitches as a micro-miniature pin with a size of 2.5 to 3 mm.

According to one embodiment, a product previously applied to a single board by applying a stamping pin to an SSD socket can be applied to a test board of a burn-in test process of 144 Dut or more.

1 is a view showing a burn-in socket to which a stamping pin is applied according to an embodiment.
2 and 3 are diagrams illustrating operations of a latch and a stamping pin through a side view showing a burn-in socket from the side according to an embodiment.
4 is a diagram illustrating a process in which a ball contacts a stamping pin according to an embodiment.
5 is a plan view illustrating a lower side of a burn-in socket viewed from below according to an exemplary embodiment;
6A is a diagram illustrating an SSD chip test direction in a test apparatus according to an embodiment.
6B is a diagram illustrating a control chip test direction in a test apparatus according to an embodiment.
7 is a view illustrating a burn-in board in which burn-in sockets are arranged according to an exemplary embodiment.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only illustrated for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention These may be embodied in various forms and are not limited to the embodiments described herein.

Embodiments according to the concept of the present invention can apply various changes and can have various forms, so the embodiments are illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosures, and includes modifications, equivalents, or substitutes included in the spirit and scope of the present invention.

Terms such as first or second may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component, for example, without departing from the scope of rights according to the concept of the present invention, a first component may be named a second component, Similarly, the second component may also be referred to as the first component.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle. Expressions describing the relationship between components, such as "between" and "directly between" or "directly adjacent to" should be interpreted similarly.

Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "have" are intended to designate that the described feature, number, step, operation, component, part, or combination thereof exists, but one or more other features or numbers, It should be understood that the presence or addition of steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this specification, it should not be interpreted in an ideal or excessively formal meaning. don't

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the scope of the patent application is not limited or limited by these examples. Like reference numerals in each figure indicate like elements.

1 is a view showing a burn-in socket 100 to which a stamping pin is applied according to an embodiment.

The burn-in socket 100 is an IC socket used as a consumable for the final burn-in test of a memory semiconductor, and includes an insulator and a conductor. In addition, the conductor includes a test board in contact with the contact pad of the test board, and an upper end of the cover vertically fixing and coupling a stamping pin coupled to the conductor.

The burn-in socket 100 according to an embodiment can perform a high-speed SSD burn-in test. In the past, Pogo pins or conductive rubber were applied and used, but as fine pitch and high directivity are required, high speed is required, so a pin using a stamping pin mold process is applied.

The stamping pin used in the burn-in socket 100 according to an embodiment is a subminiature mold stamping pin of about 2.1 mm and has excellent electrical conduction and can transmit a high speed signal of 4 Ghz or more.

In addition, the burn-in socket 100 according to an embodiment is a micro pin with a size of 2.1 mm, and can be arranged in various ways and correspond to a fine pitch.

If the burn-in socket 100 according to an embodiment is used, a product previously applied to a single board by applying a stamping pin to an SSD socket can be applied to a test board of a burn-in test process of 144 Dut or more.

The burn-in socket 100 according to an embodiment may be equipped with a test function for a SSD NAND chip and a controller chip for the first time in Korea.

2 and 3 are diagrams illustrating operations of a latch and a stamping pin through a side view showing a burn-in socket from the side according to an embodiment.

First, FIG. 2 corresponds to a burn-in socket in a state in which the latch 201 is open.

The latch 201 is rotated at a certain radius by a rotation shaft 202 that enables rotation of the latch 201 . For example, as shown in FIG. 2 , the cover top 203 for compressing the SSD chip may be positioned in an open state in which the cover is completely released.

That is, when the top of the cover 203 of the socket is pressed, when the latch 201 sets the cover free after loading the open package, the latch 201 applies pressure by pressing the top of the package, and the top of the stamping pin The ball can be contacted when a certain stroke is made in contact with the ball.

In addition, the latch 201 may compress the cover top 203 by rotating clockwise around the rotation shaft 202 in the open state of FIG. 2 , corresponding to FIG. 3 .

3 corresponds to the burn-in socket 300 with the latch 201 closed.

When the upper end 203 of the cover is compressed according to the movement of the latch 210, the ball formed by the compression of the upper end 203 of the cover may contact the stamping pin 205 in the through hole 204 formed in advance.

The socket according to one embodiment is a method of pressing and contacting the top of the package through the latch 201, and the force transmission of the latch must be large.

Accordingly, the structure of the burn-in socket 300 can be formed into a structure capable of realizing the principle of a lever. Accordingly, the structure of the latch 201 is extended to the outside, so that the size of the socket increases.

The stamping pin 205 in an open state and a closed state will be described in more detail with reference to FIG. 4 below.

4 is a diagram illustrating a process in which a ball contacts a stamping pin 401 according to an embodiment.

When the latch 201 is in an open state, since no pressure is applied to the upper end of the cover 203, the ball 402 does not contact the stamping pin 401 as shown by reference numeral 410.

That is, the spring of the stamping pin 401 can transmit force while moving in the vertical direction, and can be maintained without any pressure being applied to the spring pin.

Next, when the ball 402 pushes the pin tip in the vertical direction in a state in which the latch 201 is closed, the ball may be contacted by a spring elastic force.

That is, the stamping pin is a miniature mold stamping pin of around 2.5 to 3 mm capable of transmitting a high speed signal of 16Ghz or higher, and a plurality of stamping pins 401 are inserted into the burn-in socket to move in the vertical direction, When the ball pushes the tip of the stamping pin 401 in the vertical direction, the ball may contact the ball by the spring elasticity of the stamping pin 401 .

5 is a view 500 illustrating a lower plan view of a burn-in socket viewed from below according to an embodiment.

Reference numeral 501 denotes a through hole 502 in which a stamping pin is disposed as a part for a SSD NAND chip test.

According to one embodiment, the stamping pin disposed in the through hole 502 is for an SSD burn-in socket, and a High 2.1 mm ST Pin may be used.

6A is a diagram illustrating an SSD chip test direction in a test apparatus according to an embodiment.

The burn-in socket 611 according to the present invention includes a DUT board 612 electrically connected to the burn-in socket 611 and a connector 613 connecting the DUT board 612 and the main board of the burn-in test equipment.

The DUT board 612 includes a through-hole array composed of a plurality of through-holes in which terminals are formed, and the connector 613 is composed of a plurality of contact pins disposed corresponding to the through-holes and inserted into the through-holes to contact the terminals. It includes an array of contact pins.

The burn-in socket 611 is disposed on the DUT board 612 and may be electrically connected to the DUT board 612 . The DUT board 612 may be composed of a general PCB, but is not limited thereto.

The DUT board 612 is connected to the main board of the burn-in test equipment, and a predetermined connector 613 may be provided to achieve the connection. The connector 613 may be configured as a member mediating a connection between the main board of the burn-in test equipment and the DUT board 612 .

6B is a diagram illustrating a control chip test direction in a test apparatus according to an embodiment.

The DUT board 612 is connected to the main board of the burn-in test equipment, and a predetermined connector 613 may be provided to achieve the connection. The connector 613 may be configured as a member mediating a connection between the main board of the burn-in test equipment and the DUT board 612 .

To achieve connection between the DUT board 612 and the connector 613, the DUT board 612 includes a through-hole array composed of a plurality of through-holes in which terminal portions are formed, and the connectors 613 are arranged to correspond to the through-holes. and a contact pin array 320 composed of a plurality of contact pins inserted into the through hole to contact the terminal part formed in the through hole, and as the contact pin and the terminal part are electrically connected, the DUT board 612 and the connector 613 ) can be connected to each other.

That is, terminal units are disposed in each through-hole, and electrical connection between the DUT board 612 and the connector 613 can be achieved as the contact pins disposed on the connector 613 are inserted into the through-holes and come into contact with the terminal units. .

In this case, the terminal unit may be disposed on an inner circumferential surface of the through hole, and the contact pin may be electrically connected to the terminal unit as the contact pin contacts the inner circumferential surface of the through hole when inserted into the through hole.

Meanwhile, through-hole arrays may be formed on at least both sides of the DUT board 612, respectively, and the contact pin array 320 may be arranged to correspond to a position where the through-hole array is formed.

Preferably, each through hole array may include a plurality of through holes formed in two rows.

7 is a diagram illustrating a burn-in board 700 in which burn-in sockets are arranged according to an exemplary embodiment.

The burn-in board 700 according to an embodiment is characterized in that a plurality of test devices are arranged, on one side of which a burn-in socket for testing an SSD chip is mounted, and on the other side of which a device for testing a control chip is mounted.

The burn-in socket used in the burn-in board 700 tests SSD (Solid-State Drive) chips by applying pins using a stamping pin mold process, and the pins transmit high-speed signals of 16Ghz or higher. Includes ultra-small mold stamping pins around 2.5 to 3 mm. In addition, a plurality of stamping pins are inserted so as to move in a vertical direction, and when a ball pushes a tip of the stamping pin in a vertical direction, the ball may contact the ball by the spring elasticity of the stamping pin. In addition, the burn-in socket uses a latch that moves in one direction, but presses the package through the latch that moves according to the principle of a lever to transmit a force in one direction to the package, and when the upper end of the cover of the burn-in socket is pressed, the latch opens. When the cover is released after loading the package, the latch presses against the top surface of the package to apply pressure. Also, when the upper end of the stamping pin contacts the ball and makes a certain stroke, the ball may be contacted.

As a result, by using the burn-in socket, test device, and burn-in board according to the present invention, a burn-in socket using a pin using a mold process of a stamping pin can be implemented.

In addition, using the present invention, as a stamping pin of about 2.5 to 3 mm, it has excellent electrical conduction and can transmit a high-speed signal of 16 Ghz or more, and it is possible to transmit a high-speed signal of 2.5 to 3 mm in various arrangements and fine pitch as a micro-miniature pin with a size of 2.5 to 3 mm ( Fine Pitch) is possible.

In addition, if the present invention is used, it is possible to apply a product that was previously applied to a single board by applying a stamping pin to an SSD socket to a test board of a burn-in test process of 144 Dut or more.

As described above, although the embodiments have been described with limited drawings, those skilled in the art can make various modifications and variations from the above description. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

Claims (7)

A burn-in socket that tests SSD (Solid-State Drive) by applying a stamping pin using a mold process. According to claim 1,
The stamping pin is a burn-in socket, characterized in that the ultra-small mold stamping pin of about 2.5 ~ 3mm capable of transmitting a high speed signal (High Speed) of 16Ghz or more. According to claim 1,
A plurality of stamping pins are inserted into the socket so as to move in a vertical direction, and when the ball pushes the tip of the stamping pin in a vertical direction, the ball is contacted by the spring elasticity of the stamping pin. socket. According to claim 3,
A latch that transmits force in one direction to the package by pressing the package according to the principle of a lever when moving in one direction
Including more,
When the upper end of the cover of the socket is pressed, when the latch sets the cover free after loading the open package, the latch applies pressure by pressing the upper surface of the package, and the upper end of the stamping pin contacts the ball to form a certain stroke. Burn-in socket, characterized in that the ball is in contact when. One side is equipped with a burn-in socket for testing SSD chips, and the other side is equipped with a device for testing control chips.
The burn-in socket,
A stamping pin using a mold process is applied to test a solid-state drive (SSD) chip, and the pin is a subminiature mold stamping pin of around 2.5 to 3 mm capable of transmitting a high speed signal of 16Ghz or higher. including,
The test apparatus, characterized in that the plurality of stamping pins are inserted to move in a vertical direction, and the balls are contacted by the spring elastic force of the stamping pins when the balls push the tips of the stamping pins in the vertical direction. According to claim 5,
The burn-in socket uses a latch that moves in one direction, presses a package through the latch that moves according to the principle of a lever, and transmits force in one direction to the package, and when the upper end of the cover of the burn-in socket is pressed, the latch When the cover is placed in a free state after loading the open package, the latch applies pressure by pressing the top surface of the package, and the ball is contacted when the top of the stamping pin contacts the ball and reaches a certain stroke. Test, characterized in that Device. A burn-in board in which a plurality of test devices are arranged, on one side of which a burn-in socket for testing an SSD chip is mounted, and on the other side of which a device for testing a control chip is mounted.

Images