KR20220135454A - An electronic device comprising an antenna - Google Patents

Abstract

According to various embodiments of the present disclosure, an electronic device may comprise first and second housings, a PCB, and a wireless communication circuit. The first housing may include a first surface and a second surface perpendicular to the first surface and a first edge, and the first housing may include a first conductive region. The first conductive region may include a first portion of a first slit structure extending from one point of the first surface to the first edge. A third surface of the second housing may include a second conductive region, and the second conductive region may include a second slit structure. In a first state, at least a portion of the first portion of the first slit structure may overlap the second slit structure when viewed in a second direction perpendicular to the first surface of the first housing. The wireless communication circuit may transmit and/or receive a signal of a first frequency band on the basis of an electrical path including the first portion. Therefore, the deterioration of the radiation performance of an antenna can be reduced.

Description

ELECTRONIC DEVICE COMPRISING AN ANTENNA

Embodiments disclosed in this document relate to an electronic device including an antenna.

The electronic device may include a display to have a larger area to provide a wide screen. However, since the size of the electronic device also increases as the size of the display increases, there may be a limit to the size of the display. In order to overcome this limitation, a rollable electronic device as a next-generation display device may include a flexible display. The flexible display may be selectively introduced into the housing, and through this, the flexible display may have a large area for providing a large screen while maintaining the size of the electronic device.

Meanwhile, an electronic device having a communication function may include a plurality of antennas in order to provide mobile communication services of different frequency bands using a single electronic device while being reduced in size and weight. For example, a multi-input multi-output (MIMO) technique is defined in IEEE 802.11n, IEEE 802.11ac, and IEEE 802.11ax standards, and 2G/3G/4G/5G related MIMO antennas may be included in the electronic device.

The rollable electronic device may include a first housing and a second housing slidably connected to the first housing. In the first state, the second housing may overlap the first housing, and at least a portion of the second housing may be retracted into the first housing. Meanwhile, the first housing may include a first conductive region, and at least a portion of the first conductive region may operate as a radiator of the antenna. The second housing may include a second conductive region. The antenna may have to secure a separation distance greater than or equal to a specified distance from the second conductive region in order to secure performance. However, in the first state, as the second housing is drawn into the first housing, the antenna including at least a portion of the first conductive region may be adjacent to the second conductive region. Accordingly, in the first state, it may be difficult for the antenna to secure a separation distance greater than or equal to a specified distance from the second conductive region, and radiation performance of the antenna may be deteriorated.

Various embodiments disclosed in this document may include a slit structure formed in a second conductive region of a second housing, and in a first state, the slit structure is designated with an antenna formed in the first conductive region of the first housing. When viewed in the direction, the separation distance between the antenna and the second conductive region may be secured in the first state as they overlap.

An electronic device according to various embodiments of the present disclosure includes a first housing, a second housing slidably connected to the first housing, a printed circuit board (PCB) disposed in the electronic device, and a wireless device disposed on the PCB may include communication circuitry, wherein the first housing may include a first surface and a second surface perpendicular to the first surface and a first corner, wherein the first housing may include a first conductive region. The first conductive region may include a first portion of a first slit structure extending from one point of the first surface to the first corner, and the third surface of the second housing may include a second conductive portion. region, wherein the second conductive region may include a second slit structure extending to one corner of the second housing corresponding to the first corner of the first housing, wherein the second housing When viewed in a second direction perpendicular to the first surface of the first housing, at least a portion of the first portion of the first slit structure in a first state slid in a first direction adjacent to the first housing It may overlap a second slit structure, and the wireless communication circuit may transmit and/or receive a signal in a first frequency band based on an electrical path including the first portion of the first slit structure.

An electronic device according to various embodiments of the present disclosure includes a first metal housing, a second metal housing slidably connected to the first metal housing, and

and a wireless communication circuit disposed in the electronic device, wherein the first metal housing may include a first surface and a second surface perpendicular to the first surface and a first corner, the first surface may include a first slit structure extending from one point of the first surface to the first edge, and the third surface of the second metal housing may include the first edge corresponding to the first edge of the first metal housing. 2 It may include a second slit structure extending to one edge of the metal housing, and in a first state in which the second metal housing is slid in a direction closer to the first metal housing, at least a portion of the first slit structure is may overlap the second slit structure when viewed in a first direction perpendicular to the first surface of the first metal housing, and the wireless communication circuit may be configured to perform a second slit structure based on an electrical path including the first slit structure. A signal of one frequency band may be transmitted and/or received.

According to various embodiments of the present disclosure, the electronic device may reduce the deterioration of the radiation performance of the antenna by securing a separation distance between the antenna and the conductive region.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device 101 in a network environment, according to various embodiments.
FIG. 2A is a diagram illustrating a front view of an electronic device when the electronic device is in a first state or a second state, according to an exemplary embodiment;
FIG. 2B is a diagram illustrating a rear surface of the electronic device when the electronic device is in a first state or a second state, according to an exemplary embodiment;
3 is an exploded view of an electronic device according to an embodiment.
4 is a view illustrating an internal structure in which the support member, the flexible display, and the second housing are combined in the first state.
5 is a block diagram illustrating an operation of a slit antenna according to a state of an electronic device.
FIG. 6 is a perspective view of the electronic device of FIG. 2B taken along section AA′.
7 is a view of an AA′ cross-section of an electronic device viewed in a +x direction according to an exemplary embodiment.
8 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure when a second slit structure is included in a second housing according to an embodiment and a second slit structure is not included in the second housing; to be.
9 is a diagram illustrating a current distribution of a first slit structure when a second slit structure is provided in the second housing.
10 is a diagram illustrating a current distribution of a first slit structure when the second housing does not have a second slit structure.
11 is a diagram illustrating a power feeding structure through a first conductive connecting member.
12 is a diagram illustrating a power feeding structure through a first conductive connection member and a second conductive connection member.
13 is a diagram illustrating a third conductive connection member coupled to a second conductive region of a second housing according to an exemplary embodiment.
14 is a view in which a fourth conductive connecting member coupled to a second conductive region of a second housing is added according to another exemplary embodiment.
15 is a graph illustrating an antenna radiation efficiency when the first conductive region is electrically connected to the second conductive region of the second housing through the third conductive connecting member and when not connected.
16 is a view illustrating a second slit structure of a second housing having various widths and lengths according to various embodiments of the present disclosure;
FIG. 17 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure for each case of a second slit structure having various widths and lengths of FIG. 16 .
18 is a diagram illustrating a second slit structure of a second housing having various slit lengths according to various embodiments of the present disclosure;
19 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure for each case of a second slit structure having various slit lengths of FIG. 18 .
20 is a diagram illustrating a first slit structure according to another exemplary embodiment.
21 is a graph illustrating an antenna radiation efficiency according to the embodiment shown in FIG. 20 .
22 is a diagram illustrating a first slit structure according to various embodiments of the present disclosure;
23 is a graph illustrating an antenna radiation efficiency according to the embodiment shown in FIG. 22 .

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190 ). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

FIG. 2A is a diagram illustrating a front view of an electronic device when the electronic device is in a first state or a second state, according to an exemplary embodiment;

FIG. 2B is a diagram illustrating a rear surface of the electronic device when the electronic device is in a first state or a second state, according to an exemplary embodiment;

Referring to FIGS. 2A and 2B , the electronic device 101 according to an embodiment may include a housing 110 that forms an exterior.

According to an embodiment, the housing 110 may form a partial area of the front surface, a partial area of the rear surface, and/or a side surface of the electronic device 101 . According to another embodiment, the housing 110 may form a partial region and/or a rear surface of the side surface of the electronic device 101 . In an embodiment, the housing 110 may include a conductive material (eg, metal).

According to an embodiment, the housing 110 is slidable (eg, slide-in, slide-out) with respect to the first housing 111 and the first housing 111 in a predetermined range. It may include a connected second housing 112 .

According to an embodiment, the first housing 111 may include a speaker hole 251 , a connector hole 252 , and a camera hole 253 . In an embodiment, the sound output module 155 disposed in the electronic device 101 may output a sound to the outside of the electronic device 101 through the speaker hole 251 . In an embodiment, the connector hole 252 may accommodate, for example, a connector (eg, a USB connector) for transmitting and/or receiving power and/or data with an external electronic device. In an embodiment, the camera hole 253 may correspond to a hole through which at least one lens of the camera module 180 is exposed. Light from the outside of the electronic device 101 may be incident to the camera module 180 disposed inside the electronic device 101 through the camera hole 253 .

According to an embodiment, the first housing 111 may include a first slit structure 261 and a first additional slit structure 262 on the rear surface. In an embodiment, the electronic device 101 transmits and/or receives an RF signal of a specified frequency band using the first slit structure 261 and the first additional slit structure 262 as will be described later with reference to FIG. 6 . can In an embodiment, the second housing 112 may include a second slit structure 271 and a second additional slit structure 272 on the rear surface. In an embodiment, as will be described later with reference to FIG. 6 , the electronic device 101 has the first slit structure 261 of the first housing 111 using the second slit structure 271 and the second additional slit structure 272 . ) and the first additional slit structure 262 may be spaced apart from the conductive region formed in the second housing 112 by a predetermined distance or more in a specified direction (eg, -z direction).

According to an embodiment, the electronic device 101 may have a first state and a second state. In another embodiment, the electronic device 101 may have a first state, a second state, and an intermediate state between the first state and the second state.

In an embodiment, the first state and the second state of the electronic device 101 may be determined according to a relative position of the second housing 112 with respect to the first housing 111 . For example, a state in which the second housing 112 is slid in a direction (eg, a +x direction) closer to the first housing 111 so that the first housing 111 and the second housing 112 are adjacent to or in contact with each other. may be referred to as a first state. As another example, a state in which the second housing 112 is slid in a direction away from the first housing 111 (eg, a -x direction) may be referred to as a second state. In an embodiment, the first state and the second state of the electronic device 101 may be determined according to the size of the flexible display 220 exposed to the outside. For example, a state in which only the first portion 221 of the flexible display 220 may be exposed to the outside of the electronic device 101 , and the exposed flexible display 220 has the first size S1 is It may be in the first state. As another example, the first portion 221 and the second portion 222 of the flexible display 220 may be exposed to the outside of the electronic device 101 , and the externally exposed flexible display 220 may be A state having two sizes S2 may be a second state. As another example, a state in which the size of the flexible display 220 exposed to the outside has a third size between the first size S1 and the second size S2 may be an intermediate state.

In an embodiment, the electronic device 101 may be changed between the first state and the second state by a user's manipulation or a mechanical operation. According to another embodiment, the housing 110 may include a button in one portion, and the electronic device 101 may be in a first state and a second state by a user's manipulation (eg, pressing or touching a button). can be changed between

According to an embodiment, the flexible display 220 may occupy most of the front surface of the electronic device 101 . For example, the front surface of the electronic device 101 may include the flexible display 220 and a bezel area partially surrounding the edges of the flexible display 220 . According to an embodiment, the flexible display 220 may be disposed to include at least a part of a flat shape or at least a part of a curved shape.

According to an embodiment, the flexible display 220 may include a first portion 221 and a second portion 222 extending from the first portion 221 . In an embodiment, the second portion 222 of the flexible display 220 may be drawn into or drawn out of the housing 110 according to the state of the electronic device 101 . For example, when the electronic device 101 is in the first state, the second part 222 of the flexible display 220 may be inserted into the housing 110 and disposed, and may not be viewed from the outside. . As another example, when the electronic device 101 is in the second state, the second portion 222 of the flexible display 220 may be drawn out from the inside of the housing 110 and disposed and visually recognized from the outside.

The shape of the electronic device 101 shown in FIGS. 2A and 2B is for explaining an example of the electronic device 101 capable of expanding the display area, and the shape of the electronic device 101 is shown in FIGS. 2A and 2B . It is not limited to what is shown.

3 is an exploded view of an electronic device according to an embodiment.

Referring to FIG. 3 , an electronic device 101 according to an embodiment includes a first housing 111 , a second housing 112 , a flexible display 220 , a printed circuit board (PCB) 240 and/or a support. A member 230 may be included.

According to an embodiment, the first housing 111 has a first surface 401 that forms at least a part of the rear surface of the electronic device 101 and is perpendicular to the first surface 401 and the first corner 411 . It may include a second surface 402 . In an embodiment, the first housing 111 may include a first slit structure 421 formed on the first surface 401 and the second surface 402 . In an embodiment, the first slit structure 421 may extend from the first point P1 of the first surface 401 to the first edge 411 . In addition, the first slit structure 421 may further extend along the second surface 402 in the first direction (eg, +z direction) from the first corner 411 to the second corner 412 . . In an embodiment, the first slit structure 421 may be formed in the first conductive region 420a of the first housing 111 . In FIG. 3 , the first conductive region 420a of the first housing 111 is indicated as a partial region of the first housing 111 , but this is for convenience of description and the range of the first conductive region 420a is limited thereto. doesn't happen In an embodiment, the first slit structure 421 may be substantially the same as the first slit structure 261 of FIG. 2B .

According to an embodiment, the first housing 111 may include a first surface 401 and a third surface 403 perpendicular to the third corner 413 . In an embodiment, the first housing 111 may include a first additional slit structure 422 formed on the first surface 401 and the third surface 403 . In an embodiment, the first additional slit structure 422 may extend from the second point P2 of the first surface 401 to the third edge 413 . Also, although not illustrated in FIG. 3 , the first additional slit structure 422 may further extend from the third corner 413 in the first direction (eg, the +z direction). In an embodiment, the first additional slit structure 422 may be formed in the first additional conductive region 420b of the first housing 111 . In FIG. 3 , the first additional conductive region 420b of the first housing 111 is indicated as a partial region of the first housing 111 , but this is for convenience of description and the range of the first additional conductive region 420b is However, the present invention is not limited thereto. In an embodiment, the first additional slit structure 422 may be substantially the same as the first additional slit structure 262 of FIG. 2B .

According to an embodiment, the first slit structure 421 may have various shapes (eg, L-shaped, V-shaped) according to a frequency band in which the slit antenna including the first slit structure 421 operates V-shaped, inverted-L) and various lengths. As another example, the first additional slit structure 422 may have various shapes (eg, L-shaped, V-shaped) V-shaped, inverted-L)) and various lengths. According to an embodiment, the first slit structure 421 may be an open slot structure in which one end extends to the second corner 412 . As another example, the first additional slit structure 422 may be an open slit structure.

According to another embodiment, the first slit structure 421 and/or the first additional slit structure 422 may have a closed slot structure. In another embodiment, the first housing 111 may include an additional slit structure formed in the conductive region of the first housing 111 in addition to the first slit structure 421 and the second slit structure 521 . According to another embodiment, the first housing 111 may include only the first slit structure 421 or only the first additional slit structure 422 .

According to an embodiment, the PCB 240 may include a first PCB 241 and/or a second PCB 242 . According to an embodiment, a plurality of electronic components may be disposed on the PCB 240 . For example, a processor 120 , a wireless communication circuit, a memory 130 , a control circuit and/or an interface 177 may be disposed on the PCB 240 . In one embodiment, the PCB 240 may be formed of a material (eg, FR4) having a non-bending characteristic. According to another embodiment, the PCB 240 may be a flexible circuit board (FPCB) having a bendable property (or "flexible (flexible) property"). In another embodiment, the first PCB 241 and the second PCB 242 may be integrally formed. In another embodiment, the first PCB 241 and/or the second PCB 242 may be electrically connected.

According to an embodiment, the support member 230 may include a first opening 231 and/or a second opening 232 . A conductive connection member, which will be described later in FIG. 11 , is connected to the first slit structure 421 formed in the first conductive region 420a of the first housing 111 through the first opening 231 and/or the second opening 232 . can be rushed In an embodiment, at least a portion of the flexible display 220 may be fixedly seated on the support member 230 . In an embodiment, the support member 230 may include an insulating material (eg, plastic, resin).

The second housing 112 according to an embodiment has a fourth surface 504 that forms at least a part of the rear surface of the electronic device 101 and a fourth surface 504 that is perpendicular to the fourth surface 504 and the fourth corner 514 . 5 sides 505 may be included. In an embodiment, the second housing 112 may include a second slit structure 521 formed on the fourth surface 504 and the fifth surface 505 . In an embodiment, the second slit structure 521 may include a first portion 521a and a second portion 521b. A portion of the first portion 521a of the second slit structure 521 extends from the third point P3 of the fourth surface 504 to the fourth edge 514, and another portion of the fifth surface 505 may be formed in the first direction (eg, +z direction). The second portion 521b of the second slit structure 521 is formed on a portion of the fifth surface 505 in the second direction (eg, -z direction) at the fifth corner 515 of the second housing 112 . It may be a part of In an embodiment, the second slit structure 521 may be formed in the second conductive region 520a of the second housing 112 . In FIG. 3 , the second conductive region 520a of the second housing 112 is indicated as a partial region of the second housing 112 , but this is for convenience of description and the range of the second conductive region 520a is limited thereto. doesn't happen In an embodiment, the second slit structure 521 may be substantially the same as the second slit structure 271 of FIG. 2B .

According to another embodiment, the second housing 112 may include only the first portion 521a of the second slit structure 521 without including the second portion 521b of the second slit structure 521 . have.

The second housing 112 according to an embodiment may include a fourth surface 504 and a sixth surface 506 that is perpendicular to the sixth corner 516 . In one embodiment, the second housing 112 may include a second additional slit structure 522 formed on the fourth face 504 and the sixth face 506 . The second additional slit structure 522 has a portion of the fourth surface 504 extending from the fourth point P4 to the sixth edge 516 of the second housing 112 , and a portion of the fourth surface 504 is formed on the sixth surface 506 . ) in the first direction (eg, +z direction). In FIG. 3 , the sixth surface 506 is not shown, so a part of the second additional slit structure 522 formed along the sixth surface 506 among the second additional slit structures 522 is not shown, but actually The second housing 112 may include a portion of the second additional slit structure 522 formed on the sixth surface 506 . In an embodiment, the second additional slit structure 522 may be formed in the second additional conductive region 520b of the second housing 112 . In FIG. 3 , the second additional conductive region 520b of the second housing 112 is indicated as a partial region of the second housing 112 , but this is for convenience of description and the range of the second additional conductive region 520b is However, the present invention is not limited thereto. In one embodiment, the second additional slit structure 522 may be substantially the same as the second additional slit structure 272 of FIG. 2B .

According to an embodiment, the second slit structure 521 may have a shape corresponding to the shape of the first slit structure 421 of the first housing 111 . For example, when the first slit structure 421 has an L-shaped shape, the second slit structure 521 may have an L-shaped shape corresponding to the first slit structure 421 . can In an embodiment, the second additional slit structure 522 may have a shape corresponding to the shape of the first additional slit structure 422 of the first housing 111 . For example, when the first additional slit structure 422 has a V-shaped shape, the second additional slit structure 522 corresponds to the first additional slit structure 422 and is V-shaped. ) can have

According to another embodiment, the second housing 112 may include only the second slit structure 521 or only the second additional slit structure 522 .

According to an embodiment, the second housing 112 may include a first groove 531 extending in the second direction (eg, -x direction) from one edge portion of the fifth surface 505 . have. Although not shown in FIG. 3 , the second housing 112 may include a second groove extending in the second direction (eg, the -x direction) from one end of the sixth surface 506 .

4 is a view illustrating an internal structure in which the support member, the flexible display, and the second housing are combined in the first state.

Referring to Figure 4. When the electronic device 101 according to an embodiment is in the first state, at least a portion of the second housing 112 may be retracted into the support member 230 . In FIG. 4 , the first housing 111 is omitted for the purpose of explaining the internal structure, but in the first state, the support member 230 is actually disposed inside the first housing 111 , and the support member 230 is disposed inside the support member 230 . 2 The housing 112 may be retracted. Accordingly, the support member 230 may be disposed between the first housing 111 and the second housing 112 . In an embodiment, the support member 230 may include an insulating material, and is disposed between the first housing 111 and the second housing 112 to form a conductive part of the first housing 111 (eg, FIG. 3 ). Coupling between the first conductive region 420a of FIG. 3 ) and the conductive portion of the second housing 112 (eg, the second conductive region 520a of FIG. 3 ) may be prevented or reduced.

In one embodiment, in the first state, when viewed in the -y-axis direction, at least a portion of the first opening 231 formed in the support member 230 and the first groove 531 formed in the second housing 112 are can be nested.

5 is a block diagram illustrating an operation of a slit antenna according to a state of an electronic device.

Referring to FIG. 5 , the electronic device 101 according to an embodiment may include a wireless communication circuit 530 and an antenna structure 550 .

According to an embodiment, when the electronic device 101 is in the first state, the wireless communication circuit 530 supplies power to a point of the first slit structure 421 to transmit and/or receive an RF signal of the first frequency band. can Hereinafter, an antenna including the first slit structure 421 may be referred to as a first slit antenna 551 . In an embodiment, in the first state, at least a portion of the second slit structure 521 may be disposed to overlap the first slit structure 421 when viewed in a specified direction as will be described later with reference to FIG. 6 . In one embodiment, in the first state, the frequency band in which the first slit antenna 551 operates according to the length and/or width of the second slit structure 521 as will be described later with reference to FIGS. 16 and/or 18 may vary. can

According to an embodiment, when the electronic device 101 is in the second state, the wireless communication circuit 530 supplies power to a point of the first slit structure 421 to transmit and/or receive an RF signal of the first frequency band. can

In an embodiment, the antenna structure 550 may additionally include various types of antenna structures. For example, the antenna structure 550 may include, in addition to the first slit antenna 551 , a patch antenna, a dipole antenna, a monopole antenna, a slit antenna, a loop antenna, an inverted-F antenna, and a flat-panel inverted F type antenna. It may further include a (planar inverted-F) antenna, and/or an antenna structure in which any two or more of these are combined.

6 is a perspective view of the electronic device of FIG. 2B taken along section A-A'.

Referring to FIG. 6 , when the electronic device 101 according to an embodiment is in the first state, at least a portion of the second housing 112 may be introduced into the first housing 111 . In one embodiment, as the second housing 112 is drawn into the interior of the first housing 111 in the first state, at least a portion of the second slit structure 521 of the second housing 112 is formed in the first housing ( 111) may overlap with the first slit structure 421 when viewed in a designated direction. For example, in the first state, at least a portion of the first portion 521a of the second slit structure 521 may overlap the first slit structure 421 when viewed in the first direction (eg, the +z direction). can As another example, in FIG. 6 , although covered by the first housing 111 , at least a portion of the second portion 521b of the second slit structure 521 may be aligned with the first slit structure 421 in the second direction (eg: When viewed in the +y direction), they can overlap.

According to an embodiment, a wireless communication circuit 530 may be disposed on the first PCB 241 . The wireless communication circuit 530 supplies power to a point of the first slit structure 421 through a first conductive connecting member 611 (eg, C-clip) to transmit an RF signal of a first frequency band. may transmit and/or receive.

According to another embodiment, the electronic device 101 may include a lumped element (not shown) electrically connected to the first slit structure 421 . The wireless communication circuit 530 may transmit and/or receive an RF signal of the second frequency band based on an electrical path including the first slit structure 421 and the lumped element. For example, the electronic device 101 may implement a multi-band using a lumped element. As another example, the electronic device 101 may implement a specified frequency matching using a lumped element.

According to an embodiment, as the second slit structure 521 overlaps the first slit structure 421 when viewed in a specified direction (eg, the +z direction), the first slit structure 421 including the first slit structure 421 is overlapped. The slit antenna 551 may be spaced apart from the second conductive region 520a of the second housing 112 by a predetermined distance or more. Accordingly, the electronic device 101 may reduce an induced current from the first slit structure 421 generated when the wireless communication circuit 530 supplies power to the first slit structure 421 . Also, the electronic device 101 may reduce deterioration in radiation efficiency of the first slit antenna 551 including the first slit structure 421 . In an embodiment, the specified distance is, for example, a distance having a length of about 1/4 wavelength of a wavelength corresponding to a frequency band transmitted and received by the first slit antenna 551 including the first slit structure 421 . can mean

7 is a view of a cross section A-A' of an electronic device viewed in a +x direction according to an exemplary embodiment.

Referring to FIG. 7 , according to an embodiment, in the first state, at least a portion of the first groove 531 of the second housing 112 is aligned with the first opening 231 of the support member 230 in a designated direction (eg, : It can be arranged to overlap when viewed in the +y direction). The first conductive connecting member 611 according to an exemplary embodiment may be connected to the first of the first housing 111 through the first groove 531 of the second housing 112 and the first opening 231 of the support member 230 . It may be electrically connected to one point of the 1 slit structure 421 . As another example, when the first opening 231 and the second housing 112 do not overlap in the first state, the first groove 531 may be omitted.

8 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure when a second slit structure is included in a second housing according to an embodiment and a second slit structure is not included in the second housing; to be.

Referring to FIG. 8 , in a first graph 801 according to an exemplary embodiment, when the second housing 112 includes the second slit structure 521 and the electronic device 101 is in the first state, the first slit It is a graph of the radiation efficiency of the antenna 551 . In an embodiment, the second graph 802 shows the radiation efficiency of the first slit antenna 551 when the second housing 112 includes the second slit structure 521 and the electronic device 101 is in the second state. It is a graph. In an embodiment, when the first graph 801 and the second graph 802 are compared, when the electronic device 101 is in the first state and in the second state, the first slit antenna 551 is about 0.8 to 4 GHz. It has an antenna radiation efficiency of about -15 to -2 dB in the frequency band. Accordingly, it can be seen that when the second housing 112 includes the second slit structure 521 , the first slit antenna 551 maintains antenna performance both in the first state and in the second state.

In the third graph 803 according to an embodiment, radiation of the first slit antenna 551 when the second housing 112 does not include the second slit structure 521 and the electronic device 101 is in the first state This is an efficiency graph. In one embodiment, comparing the first graph 801 and the third graph 803 shows that the third graph 803 has a lower radiation efficiency than the first graph 801 in a frequency band of about 0.8 to 4 GHz. Able to know. When the second housing 112 does not include the second slit structure 521 , due to an induced current due to coupling between the first housing 111 and the second housing 112 in the first state, It can be seen that the radiation efficiency of the first slit antenna 551 is deteriorated. Accordingly, when the second housing 112 includes the second slit structure 521 , the first slit antenna 551 can secure a separation distance from the ground of the second housing 112 , and in the first state The electronic device 101 may reduce deterioration in radiation performance of the first slit antenna 551 .

9 is a diagram illustrating a current distribution of a first slit structure when a second slit structure is provided in the second housing.

Referring to FIG. 9 , a current distribution is illustrated when the wireless communication circuit 530 according to an embodiment supplies power to a point of the first slit structure 421 . In an embodiment, it can be seen that the current is distributed along the edge of the first slit structure 421 since no induced current is generated due to coupling with the second housing 112 .

10 is a diagram illustrating a current distribution of a first slit structure when the second housing does not have a second slit structure.

Referring to FIG. 10 , when power is supplied to the first slit structure of the first housing, an induced current is generated due to the coupling with the second housing, and accordingly, the current distribution is related to the first slit structure of the first housing. It can be seen that the distribution is concentrated between the feeding point and the second housing. Accordingly, when the second housing does not include the second slit structure, radiation performance of the first slit antenna including the first slit structure may deteriorate due to generation of induced current.

11 is a diagram illustrating a power feeding structure through a first conductive connecting member.

Referring to FIG. 11 , the first conductive connection member 611 according to an embodiment may be coupled to a point of the first PCB 241 , and through the first groove 531 of the second housing 112 . It may be electrically connected to a point of the first slit structure 421 of the first housing 111 . In an embodiment, the first conductive connection member 611 may include, for example, a C-clip, a metal wire, a flexible printed circuit board (FPCB), or a pogo-pin. have.

12 is a diagram illustrating a structure of an electronic device including a first conductive connection member and a second conductive connection member.

Referring to FIG. 12 , the electronic device 101 according to an embodiment may include a second conductive connection member 1212 , and the second conductive connection member 1212 is to be electrically connected to the wireless communication circuit 530 . can

According to an embodiment, the electronic device 101 supplies power to a point of the first slit structure 421 of the first housing 111 through a first conductive connection member (eg, a C-clip). Thus, the RF signal of the first frequency band may be transmitted and/or received. In addition, the wireless communication circuit 530 may feed power to a point different from the one point of the conductive portion of the second surface 402 of the first housing 111 through the second conductive connecting member 1212 , The RF signal of the second frequency band may be transmitted and/or received by utilizing the first conductive region 420a of the second surface 402 of the housing 111 . For example, the electronic device 101 may secure a plurality of power feeding paths for implementing a multi-band of the electronic device 101 through a plurality of conductive connection members.

According to another embodiment, the electronic device 101 may form a planar inverted-F antenna (PIFA) antenna through the first conductive connection member 611 and the second conductive connection member 1212 . For example, the first PCB 241 may include a ground, and the second conductive connecting member 1212 may be electrically connected to the ground of the first PCB 241 . In one example, the wireless communication circuit 530 may supply power to a point of the first conductive region 420a among the second surfaces 402 of the first housing 111 through the first conductive connection member 611, An RF signal of a specified frequency band may be transmitted and/or received based on an electrical path grounded to the ground of the first PCB 241 through the second conductive connection member 1212 .

According to an embodiment, when the electronic device 101 includes a plurality of conductive connecting members in the first PCB 241 , the additional groove is larger than the first groove 531 of the second housing 112 shown in FIG. 11 . (1231) may be included. In an embodiment, the first conductive connection member 611 and/or the second conductive connection member 612 may contact the second surface 402 of the first housing 111 through the additional groove 1231 . .

13 is a diagram illustrating a third conductive connection member coupled to a second conductive region of a second housing according to an exemplary embodiment.

Referring to FIG. 13 , the second housing 112 according to an exemplary embodiment may include a second conductive region 520a. The electronic device 101 according to an embodiment may include a third conductive connection member 1311 (eg, C-clip), and the third conductive connection member 1311 has a fourth surface ( It may be disposed at one point of the second conductive region 520a of the 504 .

According to an embodiment, in the first state, the third conductive connecting member 1311 is positioned in a designated direction (eg, the +z direction) of the first conductive region 420a of the first housing 111 to the first conductive region. It may be electrically connected to a point of (420a). Accordingly, one point of the first conductive region 420a may be electrically connected to the second conductive region 520a of the second housing 112 through the third conductive connection member 1311 .

14 is a view in which a fourth conductive connecting member coupled to the second conductive region 520a of the second housing is added according to another exemplary embodiment.

Referring to FIG. 14 , the second housing 112 according to another exemplary embodiment may include a second conductive region 520a. In another embodiment, the electronic device 101 may include a fourth conductive connection member 1312 (eg, a C-clip), and the fourth conductive connection member 1312 has a fifth surface ( It may be disposed at one point of the second conductive region 520a of the 505 . In the first state, the fourth conductive connection member 1312 may be positioned in a designated direction (eg, the +y direction) of the first conductive region 420a. However, in the case of the support member 230 of FIG. 3 , the electrical connection between the first slit structure 421 and the fourth conductive connection member 1312 of the first housing 111 may be blocked, so in another embodiment, the fourth conductive connection A portion of the support member 230 may be removed corresponding to the position of the member 1312 , or an additional opening may be formed in the support member 230 . Accordingly, when an additional opening is formed in the support member 230 to correspond to the position of the fourth conductive connection member 1312 , the fourth conductive connection member 1312 moves in a designated direction (eg, in the first conductive region 420a). +y direction) and may be electrically connected to a point of the first conductive region 420a. Accordingly, the electronic device 101 may electrically connect the first conductive region 420a and the second conductive region 520a of the second housing 112 through the fourth conductive connecting member 1312 .

15 is a graph illustrating an antenna radiation efficiency when the first conductive region is electrically connected to the second conductive region of the second housing through the third conductive connecting member and when not connected.

Referring to FIG. 15 , a first graph 1501 according to an exemplary embodiment shows a case in which the first conductive region 420a and the second conductive region 520a are electrically connected through the third conductive connecting member 1311 . It may be referred to as a radiation efficiency graph of the first slit antenna 551 . In an embodiment, the second graph 1502 may be referred to as a radiation efficiency graph of the first slit antenna 551 when the third conductive connecting member 1311 is not used.

Comparing the first graph 1501 and the second graph 1502 according to an embodiment, the first graph 1501 is a second graph 1502 in a frequency band of about 0.8 to 1.3 GHz and a frequency band of about 2.2 to 4 GHz. It has a high antenna radiation efficiency value compared to

In an embodiment, the first conductive region 420a and the second conductive region 520a of the second housing 112 may be electrically connected to each other using the third conductive connecting member 1311 . In this case, the electronic device 101 may further secure a ground electrically connected to the first slit antenna 551 . Through the ground extension, the electronic device 101 may prevent deterioration of antenna radiation performance due to an induced current. Accordingly, the radiation efficiency of the first slit antenna 551 in a predetermined frequency band (eg, 0.8 to 1.3 GHz, 2.2 to 4 GHz) may be improved.

16 is a view illustrating a second slit structure of a second housing having various widths and lengths according to various embodiments of the present disclosure;

Referring to FIG. 16 , the first slit structure 421 of the first housing 111 according to an embodiment may have a first width and length W1 . In an embodiment, the second slit structure of the second housing 112 may have various widths and lengths corresponding to the first slit structure 421 . For example, the second slit structure 521 of the second housing 112 may have substantially the same first width and length W1 as the first slit structure 421 . As another example, the second slit structure 1622 of the second housing 112 may have a second width length W2 greater than the first width length W1 . As another example, the second slit structure 1623 of the second housing 112 may have a third width length W3 smaller than the first width length W1 .

FIG. 17 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure for each case of a second slit structure having various widths and lengths of FIG. 16 .

Referring to FIG. 17 , a first graph 1701 according to an exemplary embodiment is a graph of radiation efficiency of the first slit antenna 551 when the second slit structure has a first width and length W1 . The second graph 1702 is a graph of the radiation efficiency of the first slit antenna 551 when the second slit structure has a second width and length W2 . The third graph 1703 is a graph of the radiation efficiency of the first slit antenna 551 when the second slit structure has a third width and length W3 . Comparing the first graph 1701, the second graph 1702, and the third graph 1703 according to an embodiment, the first graph 1701 and the second graph 1702 in a frequency band of about 0.5 to 4 GHz and the third graph 1703 has substantially the same antenna radiation efficiency value. Accordingly, even if the width and length of the second slit structure 521 of the second housing 112 is changed, the electronic device 101 may secure substantially the same radiation performance of the first slit antenna 551 .

18 is a diagram illustrating a second slit structure of a second housing having various slit lengths according to various embodiments of the present disclosure;

Referring to FIG. 18 , the first slit structure 421 of the first housing 111 according to an embodiment may have a first length L1 . In an embodiment, the second slit structure of the second housing 112 may have various slit lengths corresponding to the first slit structure 421 . For example, the second slit structure 521 of the second housing 112 may have a first length L1 that is substantially the same as that of the first slit structure 421 . As another example, the second slit structure 1822 of the second housing 112 may have a second length L2 that is longer than the first length L1 . As another example, the second slit structure 1823 of the second housing 112 may have a third length L3 that is shorter than the first length L1 .

19 is a diagram illustrating a radiation efficiency graph of a first slit antenna including a first slit structure for each case of a second slit structure having various slit lengths of FIG. 18 .

Referring to FIG. 19 , a first graph 1901 according to an exemplary embodiment is a graph of the radiation efficiency of the first slit antenna 551 when the second slit structure has a first length L1 . The second graph 1902 is a graph of the radiation efficiency of the first slit antenna 551 when the second slit structure has the second length L2 . The third graph 1903 is a radiation efficiency graph of the first slit antenna 551 when the second slit structure has a third length L3 .

Comparing the first graph 1901 and the second graph 1902 according to an embodiment, the first graph 1701 and the second graph 1702 in a frequency band of about 0.5 to 4 GHz are substantially the same antenna radiation efficiency have a value Accordingly, even if the slit length of the second slit structure 521 of the second housing 112 is increased, the electronic device 101 may secure substantially the same dissipation performance of the first slit antenna 551 .

Comparing the third graph 1903 with the first graph 1901 and the second graph 1902 according to an embodiment, the third graph 1903 is a first graph 1901 in a frequency band of about 0.7 to 1.4 GHz. and a relatively high antenna radiation efficiency value compared to the second graph 1902 . Therefore, when the slit length of the second slit structure 521 of the second housing 112 is reduced compared to the case where the slit length of the second slit structure 521 is not reduced, the wireless communication circuit 530 is An RF signal of a relatively low frequency band may be transmitted and/or received through the first slit antenna 551 . The electronic device 101 may change the known frequency of the antenna by changing the slit length of the second slit structure 521 .

20 is a diagram illustrating a first slit structure according to another exemplary embodiment.

Referring to FIG. 20 , the first housing 111 according to an exemplary embodiment may include a first slit structure 2001 . In an embodiment, the first slit structure 2001 may include a first portion 2001a and a second portion 2001b, and the first portion 2001a of the first slit structure 2001 is shown in FIG. 3 . It may be referred to as a first slit structure 421 . In an embodiment, the first portion 2001a of the first slit structure 2001 may have a first length L1 (eg, 34 mm). In an embodiment, the second part 2001b of the first slit structure 2001 has a length L2 (eg, 16 mm) specified in a specified direction (eg, +y direction) from one end of the first part 2001a. ) and may correspond to the extended part. In an embodiment, the second portion 2001b of the first slit structure 2001 may be formed in a conductive region of the first housing 111 .

In another embodiment, the length and/or shape of the second portion of the first slit structure 2001 may vary according to a frequency band in which the slit antenna including the first slit structure 2001 operates.

The second housing 112 according to an embodiment may include a second slit structure 2002 . In one embodiment, the second slit structure 2002 may include a third portion 2002a and a fourth portion 2002b, wherein the third portion 2002a of the second slit structure 2002 is shown in FIG. 3 . It may be referred to as a second slit structure 521 . In one embodiment, the fourth portion 2002b of the second slit structure 2002 may correspond to a portion extending from one end of the third portion 2002a having a specified length in a specified direction (eg, +y direction). can

In another embodiment, the length and/or shape of the fourth portion of the second slit structure 2002 may vary according to a frequency band in which the slit antenna including the first slit structure 2001 operates.

21 is a graph illustrating an antenna radiation efficiency according to the embodiment shown in FIG. 20 .

Referring to FIG. 21 , a first graph 2101 according to an exemplary embodiment is a graph of radiation efficiency of a slit antenna including a first slit structure 2001 in a first state. The second graph 2102 is a graph of the radiation efficiency of the slit antenna including the first slit structure 2001 in the second state.

According to an embodiment, when the first graph 2101 and the second graph 2102 are compared, the antenna radiation efficiency values of the first graph 2101 and the second graph 2102 are about 0.8 to 4 GHz in the frequency band. The difference is within about 2 dB. Therefore, even in the second state in which at least a portion of the second housing 112 is drawn into the first housing 111, the radiation efficiency of the slit antenna including the first slit structure 2001 is maintained as in the first state. Able to know.

According to an embodiment, the first graph 2101 has an antenna radiation efficiency of about -6 to -5 dB in a frequency band of about 0.9 to 1.5 GHz. In an embodiment, the wireless communication circuit 530 transmits and/or receives an RF signal in a frequency band of about 0.9 to 1.5 GHz based on the electrical path including the second portion 2001b of the first slit structure 2001 . can do.

22 is a diagram illustrating a first slit structure according to various embodiments of the present disclosure;

Referring to FIG. 22 , the first housing 111 according to an exemplary embodiment may include a first slit structure 2201 . In an embodiment, the first slit structure 2201 may include a first portion 2201a and a second portion 2201b, and the first portion 2201a of the first slit structure 2201 is shown in FIG. 3 . It may be referred to as a first slit structure 421 . In an embodiment, the second portion 2201b of the first slit structure 2201 may correspond to a portion extending from one end of the first portion 2001a having a specified length in a specified direction (eg, -x direction). can In an embodiment, the second portion 2201b of the first slit structure 2201 may be formed in a conductive region of the first housing 111 .

In another embodiment, the length and/or shape of the second portion of the first slit structure 2201 may vary according to a frequency band in which the slit antenna including the first slit structure 2201 operates.

The second housing 112 according to an embodiment may include a second slit structure 2202 . In one embodiment, the second slit structure 2202 may include a third portion 2202a and a fourth portion 2202b, wherein the third portion 2202a of the second slit structure 2202 is shown in FIG. 3 . It may be referred to as a second slit structure 521 . In an embodiment, the fourth portion 2202b of the second slit structure 2202 may correspond to a portion extending from one end of the third portion 2202a with a specified length in a specified direction (eg, -x direction). can

In another embodiment, the length and/or shape of the fourth portion 2202b of the second slit structure 2202 may vary according to a frequency band in which the slit antenna including the first slit structure 2201 operates.

23 is a graph illustrating an antenna radiation efficiency according to the embodiment shown in FIG. 22 .

Referring to FIG. 23 , a first graph 2301 according to an embodiment is a graph of radiation efficiency of a slit antenna including a first slit structure 2201 in a first state. The second graph 2302 is a graph of the radiation efficiency of the slit antenna including the first slit structure 2201 in the second state.

According to an embodiment, when the first graph 2301 and the second graph 2302 are compared, the antenna radiation efficiency values of the first graph 2301 and the second graph 2302 are about 0.8 to 4 GHz in the frequency band. The difference is within about 1 dB. Therefore, even in the second state in which at least a portion of the second housing 112 is drawn into the first housing 111, the radiation efficiency of the slit antenna including the first slit structure 2201 is maintained as in the first state. Able to know.

An electronic device according to an embodiment includes a first housing, a second housing slidably connected to the first housing, a printed circuit board (PCB) disposed in the electronic device, and a wireless communication circuit disposed on the PCB. may include, wherein the first housing may include a first surface and a second surface perpendicular to the first surface and a first corner, the first housing may include a first conductive region, The first conductive region may include a first portion of a first slit structure extending from a point on the first surface to the first corner, and the third surface of the second housing includes a second conductive region. The second conductive region may include a second slit structure extending to one corner of the second housing corresponding to the first corner of the first housing, wherein the second housing is the first housing. At least a portion of the first portion of the first slit structure in a first state slid in a first direction adjacent to the second slit when viewed in a second direction perpendicular to the first surface of the first housing structure, and the wireless communication circuitry may transmit and/or receive a signal in a first frequency band based on an electrical path including the first portion of the first slit structure.

According to an embodiment, the first portion of the first slit structure may further extend from a first edge of the first housing in the second direction along the second surface of the first housing.

The electronic device according to an embodiment may further include a conductive connection member coupled to a point of the PCB, wherein the conductive connection member includes the first part of the first slit structure formed on the second surface of the first housing. portion, the wireless communication circuit may be electrically connected to the conductive connecting member, and may supply power to one of the first portions of the first slit structure through the conductive connecting member.

According to an embodiment, the second housing may include a fourth surface perpendicular to a third surface of the second housing, and the fourth surface of the second housing is opposite to the first direction at one end. and a groove extending in the direction of may overlap, and the conductive connecting member may pass through the groove of the fourth surface and contact the first portion of the first slit structure formed on the second surface.

According to an embodiment, in a second state in which the second housing is slid in a direction opposite to the first direction, the wireless communication circuit may be configured to operate based on an electrical path including the first portion of the first slit structure. A signal of the first frequency band may be transmitted and/or received.

According to an embodiment, the first frequency band may include 2 to 3.5 GHz.

According to an embodiment, the first portion of the first slit structure may have an L-shaped shape.

According to an embodiment, the first portion of the first slit structure extends from a point on the first surface of the first housing by a specified length in the first direction and then moves toward the first corner of the first housing. may extend, and a second portion of the first slit structure may extend from one end of the first portion of the first slit structure to a third direction perpendicular to the second surface of the first housing. It may extend along the first surface.

According to an embodiment, the wireless communication circuit may transmit and/or receive a signal of a second frequency band based on an electrical path including the second portion of the first slit structure.

According to an embodiment, the second frequency band may include 0.8 to 1.5 GHz.

The electronic device according to an embodiment may further include a flexible display, wherein the flexible display may include a first portion and a second portion extending from the first portion of the flexible display, and the flexible display may include A second portion of the display may be drawn into the first housing in the first state, and drawn out of the first housing in a second state in which the second housing is slid in a direction opposite to the first direction. can be

According to an embodiment, at least a portion of the second conductive region may include a ground.

The electronic device according to an embodiment may further include a conductive connection member, the conductive connection member may be coupled to a ground point of the second conductive region, and in the first state, It may be positioned in the second direction of the first part and may be electrically connected to the first part of the first slit structure.

According to an embodiment, in the first state, at least a portion of the second housing may be introduced into the first housing.

The electronic device according to an embodiment may further include a lumped element electrically connected to the first portion of the first slit structure, and the wireless communication circuit may include the first portion of the first slit structure. A signal of the second frequency band may be transmitted and/or received based on an electrical path including the portion and the lumped element.

An electronic device according to an embodiment may include a first metal housing, a second metal housing slidably connected to the first metal housing, and a wireless communication circuit disposed in the electronic device, wherein the first metal housing The housing may include a first surface and a second surface perpendicular to the first surface and a first corner, wherein the first surface is a first slit extending from a point on the first surface to the first corner. structure, wherein the third surface of the second metal housing may include a second slit structure extending to one edge of the second metal housing corresponding to the first edge of the first metal housing, In a first state in which the second metal housing is slid in a direction closer to the first metal housing, at least a portion of the first slit structure is viewed in a first direction perpendicular to the first surface of the first metal housing. may overlap the second slit structure, and the wireless communication circuit may transmit and/or receive a signal of a first frequency band based on an electrical path including the first slit structure.

According to an embodiment, the first slit structure may further extend from a first edge of the first metal housing in the first direction along the second surface of the first metal housing.

According to an embodiment, the first slit structure may have an L-shaped shape.

The electronic device according to an embodiment may further include a flexible display, wherein the flexible display may include a first portion and a second portion extending from the first portion of the flexible display, and a second portion of the flexible display The portion may be introduced into the first metal housing in the first state, and drawn out of the first metal housing in the second state in which the second metal housing is slid away from the first metal housing. can be

According to an embodiment, in the first state, at least a portion of the second metal housing may be introduced into the first metal housing.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^?? ) or on two user devices. It can be distributed (eg downloaded or uploaded) directly or online between (eg, smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

Claims (20)

In an electronic device,
A first housing, the first housing includes a first surface and a second surface perpendicular to the first surface and a first corner, the first housing including a first conductive region, the first conductive region includes a first portion of a first slit structure extending from a point on the first surface to the first edge;
a second housing slidably connected to the first housing, a third surface of the second housing including a second conductive region, the second conductive region corresponding to a first corner of the first housing a second slit structure extending to an edge of the second housing;
a printed circuit board (PCB) disposed within the electronic device; and
a wireless communication circuit disposed on the PCB;
In a first state in which the second housing is slid in a first direction adjacent to the first housing, at least a portion of the first portion of the first slit structure is a second portion perpendicular to the first surface of the first housing. overlaps with the second slit structure when viewed in the direction,
and the wireless communication circuitry transmits and/or receives a signal in a first frequency band based on an electrical path including the first portion of the first slit structure. The method according to claim 1,
and the first portion of the first slit structure further extends from a first edge of the first housing in the second direction along the second surface of the first housing. 3. The method according to claim 2,
Further comprising a conductive connection member coupled to a point of the PCB,
the conductive connecting member is in contact with the first portion of the first slit structure formed on the second surface of the first housing;
and the wireless communication circuit is electrically connected to the conductive connection member and supplies power to a point of the first portion of the first slit structure through the conductive connection member. 4. The method according to claim 3,
The second housing includes a fourth surface perpendicular to the third surface of the second housing,
The fourth surface of the second housing includes a groove extending in a direction opposite to the first direction at one end,
In the first state, the fourth surface of the second housing overlaps the second surface when viewed in a third direction perpendicular to the second surface of the first housing, and the conductive connecting member includes the fourth surface of the first housing. The electronic device is in contact with the first portion of the first slit structure formed on the second surface through a groove in the surface. The method according to claim 1,
In a second state in which the second housing is slid in a direction opposite to the first direction, the wireless communication circuit provides a signal of the first frequency band based on an electrical path including the first portion of the first slit structure. An electronic device that transmits and/or receives The method according to claim 1,
The first frequency band includes 2 to 3.5 GHz, the electronic device. The method according to claim 1,
and the first portion of the first slit structure has an L-shaped shape. The method according to claim 1,
The first portion of the first slit structure extends from a point on the first surface of the first housing by a specified length in the first direction and then extends to a first corner of the first housing,
The second portion of the first slit structure is configured to align the first surface of the first housing in a third direction perpendicular to the second surface of the first housing at one end of the first portion of the first slit structure. extending along, an electronic device. 9. The method of claim 8,
and the wireless communication circuitry transmits and/or receives a signal of a second frequency band based on an electrical path including the second portion of the first slit structure. 10. The method of claim 9,
The second frequency band includes 0.8 to 1.5 GHz, the electronic device. The method according to claim 1,
Further comprising a flexible display (flexible display),
The flexible display includes a first portion and a second portion extending from the first portion of the flexible display,
A second portion of the flexible display is drawn into the inside of the first housing in the first state, and is drawn out of the first housing in a second state in which the second housing is slid in a direction opposite to the first direction. being an electronic device. The method according to claim 1,
and at least a portion of the second conductive region includes a ground. 13. The method of claim 12,
Further comprising a conductive connection member,
The conductive connecting member includes:
coupled to a point of the ground of the second conductive region;
The electronic device of claim 1, wherein in the first state, it is located in the second direction of the first portion of the first slit structure and is electrically connected to the first portion of the first slit structure. The method according to claim 1,
In the first state, at least a portion of the second housing is drawn into the interior of the first housing. The method according to claim 1,
Further comprising a lumped element electrically connected to the first portion of the first slit structure,
and the wireless communication circuitry transmits and/or receives a signal in a second frequency band based on an electrical path including the lumped element and the first portion of the first slit structure. In an electronic device,
A first metal housing, the first metal housing includes a first surface and a second surface perpendicular to the first surface and a first corner, the first surface is the first surface at a point on the first surface comprising a first slit structure extending to an edge;
a second metal housing slidably connected to the first metal housing, and a third surface of the second metal housing extends to one edge of the second metal housing corresponding to the first edge of the first metal housing comprising a second slit structure; and
a wireless communication circuit disposed within the electronic device;
In a first state in which the second metal housing is slid in a direction closer to the first metal housing, at least a portion of the first slit structure is viewed in a first direction perpendicular to the first surface of the first metal housing. when overlapping the second slit structure,
The wireless communication circuit transmits and/or receives a signal of a first frequency band based on an electrical path including the first slit structure. 17. The method of claim 16,
and the first slit structure further extends from a first edge of the first metal housing in the first direction along the second surface of the first metal housing. 17. The method of claim 16,
The first slit structure has an L-shaped (L-shaped) electronic device. 17. The method of claim 16,
Further comprising a flexible display,
The flexible display includes a first portion and a second portion extending from the first portion of the flexible display,
The second portion of the flexible display includes:
is introduced into the first metal housing in the first state,
and the second metal housing is drawn out of the first metal housing in a second state in which the second metal housing is slid away from the first metal housing. 17. The method of claim 16,
In the first state, at least a portion of the second metal housing is drawn into the interior of the first metal housing.

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