KR20220076087A - Coil component - Google Patents

Abstract

A coil component is disclosed. A coil component according to an aspect of the present invention includes a support substrate, a coil pattern disposed on the support substrate, a drawout pattern disposed on both sides of the support substrate and connected to the coil pattern, and the support substrate passing through the support substrate. A coil unit including a connection via connecting the withdrawal patterns disposed on both surfaces to each other, and a body covering the support substrate and the coil portion, wherein any one of the withdrawal patterns disposed on both surfaces of the support substrate The thickness is thinner than the thickness of the coil pattern.

Description

Coil Component {COIL COMPONENT}

The present invention relates to a coil component.

An inductor, one of the coil components, is a typical passive electronic component used in electronic devices along with a resistor and a capacitor.

On the other hand, the coil component may be formed with a lead-out pattern connected to the external electrode.

Defect rates such as plating bleeding and chipping defects and direct current resistance (Rdc) characteristics may vary depending on the thickness and shape of the drawing pattern.

Korean Patent Publication No. 10-2016-0071957 (published on June 22, 2016)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a coil component having an improved defect rate of an electrode part.

According to one aspect of the present invention, a support substrate, a coil pattern disposed on the support substrate, a drawing pattern disposed on both surfaces of the support substrate and connected to the coil pattern, and disposed on both sides of the support substrate through the support substrate a coil part including a connection via for connecting the drawn out patterns to each other, and a body covering the support substrate and the coil part, wherein the thickness of any one of the drawing patterns disposed on both surfaces of the support substrate is the A coil component thinner than the thickness of the coil pattern is provided.

According to another aspect of the present invention, it includes a support substrate, a coil portion including a coil pattern and a drawing pattern respectively disposed on the support substrate, and a body covering the support substrate and the coil portion, the coil pattern and the Each of the drawing patterns includes a first metal layer disposed on the support substrate and a second metal layer disposed on the first metal layer, and the coil pattern further includes a third metal layer disposed on the second metal layer, wherein the The thickness of the lead-out pattern is thinner than the thickness of the coil pattern, a coil component is provided.

According to embodiments of the present invention, it is possible to provide a coil component having improved defect rates such as plating bleeding and chipping defects of the electrode part, and direct current resistance (Rdc) characteristics.

1 is a perspective view schematically showing a coil component according to an embodiment of the present invention.
FIG. 2 is a view showing a cross-section taken along line I-I' of FIG. 1 .
FIG. 3 is a view showing a cross-section taken along line II-II′ of FIG. 1 .
FIG. 4 is an enlarged view showing area B of FIG. 2 .
FIG. 5 is an enlarged view showing another embodiment (B′) of area B of FIG. 2 .
FIG. 6 is an enlarged view showing another embodiment (B″) of area B of FIG. 2 .
FIG. 7 is an enlarged view illustrating area A of FIG. 1 .
FIG. 8 is an enlarged view showing another embodiment (A′) of area A of FIG. 1 .
9 is an enlarged view showing another embodiment (A″) of area A of FIG. 1 .

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof. And, throughout the specification, "on" means to be located above or below the target part, and does not necessarily mean to be located above the direction of gravity.

In addition, the term "coupling" does not mean only when there is direct physical contact between each component in the contact relationship between each component, but another component is interposed between each component, so that the component is in the other component. It should be used as a concept that encompasses even the cases in which each is in contact.

Since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the drawings, the L direction may be defined as a first direction or length direction, the W direction may be defined as the second direction or width direction, and the T direction may be defined as a third direction or thickness direction.

Hereinafter, a coil component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. is to be omitted.

Various types of electronic components are used in electronic devices, and among these electronic components, various types of coil components may be appropriately used for the purpose of removing noise and the like.

That is, in electronic devices, the coil component is used as a power inductor, a high frequency inductor, a general bead, a high frequency bead (GHz Bead), a common mode filter, etc. can be

1 is a perspective view schematically showing a coil component according to an embodiment of the present invention. FIG. 2 is a view showing a cross-section taken along line I-I' of FIG. 1 . FIG. 3 is a view showing a cross-section taken along line II-II′ of FIG. 1 .

1 to 3 , a coil component 1000 according to an embodiment of the present invention includes a body 100 , a support substrate 200 , a coil unit 300 , external electrodes 410 and 420 , and a surface. The insulating layer 700 may be included, and an insulating layer IF may be further included.

The body 100 forms the exterior of the coil component 1000 according to the present embodiment, and the coil unit 300 and the support substrate 200 are disposed therein.

The body 100 may be formed in a hexahedral shape as a whole.

The body 100 has a first surface 101 and a second surface 102 facing each other in the longitudinal direction (L), and a third surface 103 and a fourth surface 104 facing each other in the width direction (W). ), and a fifth surface 105 and a sixth surface 106 facing in the thickness direction T. Each of the first to fourth surfaces 101 , 102 , 103 and 104 of the body 100 is a wall surface of the body 100 connecting the fifth surface 105 and the sixth surface 106 of the body 100 . corresponds to Hereinafter, both end surfaces (one end surface and the other end surface) of the body 100 mean the first surface 101 and the second surface 102 of the body, and both sides (one side and the other side) of the body 100 . ) means the third surface 103 and the fourth surface 104 of the body, and one surface and the other surface of the body 100 are the fifth surface 105 and the sixth surface 106 of the body 100, respectively. can mean

The body 100 is, for example, a coil component 1000 according to this embodiment in which external electrodes 410 and 420 and a surface insulating layer 700, which will be described later, are formed in a length of 2.0 mm, a width of 1.2 mm, and 0.65. It may be formed to have a thickness of mm, but is not limited thereto. On the other hand, since the above-mentioned numerical value is only a numerical value on design that does not reflect process error, etc., it should be considered that the range that can be recognized as process error belongs to the scope of the present invention.

The length of the above-described coil component 1000 is an optical microscope or SEM for a cross-section in the longitudinal direction (L)-thickness direction (T) in the central portion of the width direction (W) of the coil component 1000 . (Scanning Electron Microscope) Based on the photograph, it may mean the maximum value among the lengths of a plurality of line segments that connect the outermost boundary of the coil component 1000 shown in the cross-sectional photograph and are parallel to the longitudinal direction L . Alternatively, the length of the above-described coil component 1000 refers to a length of at least three or more of a plurality of line segments connecting the outermost boundary line of the coil component 1000 shown in the cross-sectional photograph and parallel to the longitudinal direction L. may mean the arithmetic mean value of

The thickness of the above-described coil component 1000 is an optical microscope or SEM of the longitudinal direction (L)-thickness direction (T) cross-section in the width direction (W) central portion of the coil component 1000 . (Scanning Electron Microscope) Based on the photograph, it may mean the maximum value among the lengths of a plurality of line segments connecting the outermost boundary line of the coil component 1000 shown in the cross-sectional photograph and parallel to the thickness direction T . Alternatively, the thickness of the above-described coil component 1000 refers to a length of at least three or more of a plurality of line segments connecting the outermost boundary line of the coil component 1000 shown in the cross-sectional photograph and parallel to the thickness direction (T). may mean the arithmetic mean value of

The width of the above-described coil component 1000 is an optical microscope or SEM of the longitudinal direction (L)-width direction (W) cross-section at the center of the thickness direction (T) of the coil component 1000 . (Scanning Electron Microscope) Based on the photograph, it may mean the maximum value among the lengths of a plurality of line segments connecting the outermost boundary line of the coil component 1000 shown in the cross-sectional photograph and parallel to the width direction W . Alternatively, the width of the above-described coil component 1000 refers to a length of at least three or more of a plurality of line segments that connect the outermost boundary line of the coil component 1000 shown in the cross-sectional photograph and are parallel to the width direction (W). may mean the arithmetic mean value of

Alternatively, each of the length, width, and thickness of the coil component 1000 may be measured by a micrometer measurement method. The micrometer measurement method is to set the zero point with a micrometer with Gage R&R (Repeatability and Reproducibility), insert the coil part 1000 according to this embodiment between the tips of the micrometer, and turn the measuring lever of the micrometer to measure. can Meanwhile, in measuring the length of the coil component 1000 by the micrometer measurement method, the length of the coil component 1000 may mean a value measured once or may mean an arithmetic average of values measured a plurality of times. . This may be equally applied to the width and thickness of the coil component 1000 .

The body 100 may include an insulating resin and a magnetic material. Specifically, the body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in an insulating resin. The magnetic material may be ferrite or metallic magnetic powder.

Ferrites include, for example, spinel-type ferrites such as Mg-Zn-based, Mn-Zn-based, Mn-Mg-based, Cu-Zn-based, Mg-Mn-Sr-based and Ni-Zn-based ferrites, Ba-Zn-based, Ba- It may be at least one of hexagonal ferrites such as Mg-based, Ba-Ni-based, Ba-Co-based, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites and Li-based ferrites.

Metal magnetic powder is made of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). It may include any one or more selected from the group consisting of. For example, the magnetic metal powder includes pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo- Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe- It may be at least one of Ni-Cr-based alloy powder and Fe-Cr-Al-based alloy powder.

The metallic magnetic powder may be amorphous or crystalline. For example, the magnetic metal powder may be a Fe-Si-B-Cr-based amorphous alloy powder, but is not necessarily limited thereto.

Each of the ferrite and the magnetic metal powder may have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

The body 100 may include two or more types of magnetic materials dispersed in a resin. Here, the different types of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other by any one of an average diameter, composition, crystallinity, and shape.

Meanwhile, in the following description, it is assumed that the magnetic material is a magnetic metal powder, but the scope of the present invention is not limited to the body 100 having a structure in which the magnetic metal powder is dispersed in an insulating resin.

The insulating resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc. alone or in combination.

The body 100 includes a support substrate 200 to be described later and a core 110 penetrating the coil unit 300 . The core 110 may be formed by filling a through hole through which the magnetic composite sheet passes through the center of each of the coil unit 300 and the support substrate 200 , but is not limited thereto.

The support substrate 200 is embedded in the body 100 . The support substrate 200 is configured to support the coil unit 300 to be described later.

The support substrate 200 is formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or a reinforcing material such as glass fiber or an inorganic filler impregnated in this insulating resin. It may be formed of an insulating material. For example, the support substrate 200 may be formed of an insulating material such as prepreg, Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) resin, and photo imaginable dielectric (PID). , but is not limited thereto.

As inorganic fillers, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), silicon carbide (SiC), barium sulfate (BaSO ₄ ), talc, mud, mica powder, aluminum hydroxide (Al(OH) ₃ ), magnesium hydroxide (Mg(OH) ₂ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO ₃ ), barium titanate (BaTiO ₃ ) and zirconic acid At least one selected from the group consisting of calcium (CaZrO ₃ ) may be used.

When the support substrate 200 is formed of an insulating material including a reinforcing material, the support substrate 200 may provide more excellent rigidity. When the support substrate 200 is formed of an insulating material that does not include glass fibers, it is advantageous to reduce the thickness of the coil component 1000 according to the present embodiment. In addition, based on the body 100 of the same size, the volume occupied by the coil unit 300 and/or the magnetic metal powder may be increased, thereby improving component properties. When the support substrate 200 is formed of an insulating material including a photosensitive insulating resin, the number of processes for forming the coil unit 300 is reduced, which is advantageous in reducing production costs, and fine vias 320 or connecting vias 321 and 322 are used. can be formed

The coil unit 300 is disposed inside the body 100 to express the characteristics of the coil component 1000 . For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil unit 300 stores an electric field as a magnetic field to maintain an output voltage, thereby stabilizing the power of the electronic device.

The coil unit 300 may include coil patterns 311 and 312 , vias 320 , lead patterns 331 and 332 , and connection vias 321 and 322 .

Specifically, the first coil pattern 311 and the first drawing pattern 331 are disposed on the lower surface of the support substrate 200 facing the sixth surface 106 of the body 100 , and A second coil pattern 312 and a second lead-out pattern 332 are disposed on the upper surface of the support substrate 200 facing the lower surface. The via 320 penetrates the support substrate 200 and is contact-connected to inner ends of the first coil pattern 311 and the second coil pattern 312 , respectively. The connection vias 321 and 322 pass through the support substrate 200 , are exposed on one end surface 101 or the other end surface 102 of the body 100 , and lead out patterns 331 located on both surfaces of the support substrate 200 . , 332), respectively.

The first and second draw-out patterns 331 and 332 are connected to the first and second coil patterns 311 and 312 and are exposed to the first and second surfaces 101 and 102 of the body 100, which will be described later. The first and second external electrodes 410 and 420 are respectively connected. In this way, the coil unit 300 may function as a whole between the first and second external electrodes 410 and 420 as a single coil.

Each of the inner ends of the first coil pattern 311 and the second coil pattern 312 is connected to each other in contact with each other.

Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape in which at least one turn is formed about the core 110 as an axis. For example, the first coil pattern 311 may form at least one turn on the lower surface of the support substrate 200 with the core 110 as an axis.

The drawing patterns 331 and 332 are exposed to the first and second surfaces 101 and 102 of the body 100 , respectively. The first drawing patterns 331 are respectively disposed on both surfaces of the support substrate 200 and exposed to the first surface 101 of the body 100 . Specifically, the first drawing pattern 331 disposed on the lower surface of the support substrate 200 is connected to the first coil pattern 311 and the first drawing pattern 331 disposed on the upper surface of the support substrate 200 . Silver is disposed to be spaced apart from the second coil pattern 312 at a position corresponding to the first draw-out pattern 331 disposed on the lower surface of the support substrate 200 . The second drawing patterns 332 are respectively disposed on both surfaces of the support substrate 200 and exposed to the second surface 102 of the body 100 . Specifically, the second draw-out pattern 332 disposed on the upper surface of the support substrate 200 is contacted with the second coil pattern 312 , and the second draw-out pattern 332 disposed on the lower surface of the support substrate 200 . is disposed to be spaced apart from the first coil pattern 311 at a position corresponding to the second lead-out pattern 332 disposed on the upper surface of the support substrate 200 .

The connection vias 321 and 322 may be disposed singly or in plurality, and may pass through the support substrate 200 to connect the drawing patterns 331 and 332 disposed on both surfaces of the support substrate 200 to each other, respectively.

In more detail, the first connection via 321 may connect the first lead-out patterns 331 on both surfaces of the support substrate 200 to each other, and the second connection via 322 is a second connection via 322 on both surfaces of the support substrate 200 . The withdrawal patterns 332 may be connected to each other.

Through this arrangement, the inductance (Ls) characteristic can be increased by forming the lead-out patterns 331 and 332 thin to increase the space filled with the magnetic material inside the body 100 . In addition, it is possible to secure the depth margin in the slit dicing process and the thickness of the cover, which is an area disposed on the drawing patterns 331 and 332 of the body 100 , It is possible to improve plating bleeding and chipping defects.

In addition, in order to suppress the increase in the direct current resistance (Rdc), which is a problem that occurs when the drawout patterns 331 and 332 are thinly formed, the drawout patterns 331 and 332 are connected to the support substrate through the connection vias 321 and 322. 200) can be configured to be disposed on both sides. In this case, the total area of the drawing patterns 331 and 332 can be maintained, thereby preventing an increase in the direct current resistance Rdc, and increasing the contact area with the external electrodes 410 and 420 can improve the contact reliability. .

Each of the coil patterns 311 and 312 , the via 320 , the lead patterns 331 and 332 , and the connection vias 321 and 322 is copper (Cu), aluminum (Al), silver (Ag), and tin (Sn). , gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or may be formed of a conductive material such as an alloy thereof, but is not limited thereto.

At least one of the coil patterns 311 and 312 , the via 320 , the lead patterns 331 and 332 , and the connection vias 321 and 322 may include at least one conductive layer.

For example, when the second coil pattern 312 , the via 320 , the second lead-out pattern 332 , and the second connection via 322 are formed on the upper surface of the support substrate 200 by plating, the second coil The pattern 312 , the via 320 , the second lead-out pattern 332 , and the second connection via 322 may each include a seed layer and an electrolytic plating layer. Here, the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer having a multilayer structure may be formed in a conformal film structure in which another electroplating layer is formed along the surface of one electroplating layer, and the other electroplating layer is only on one surface of one electroplating layer. It may be formed in this laminated shape. The seed layer may be formed by an electroless plating method or a vapor deposition method such as sputtering. The seed layers of each of the second coil pattern 312 , the via 320 , the second lead-out pattern 332 , and the second connection via 322 are integrally formed so that a boundary may not be formed between them, but is limited thereto. it is not Each of the second coil pattern 312 , the via 320 , the second lead-out pattern 332 , and the second connection via 322 is formed integrally with each of the electroplating layers so that a boundary may not be formed between them, but is limited thereto. it is not

As another example, the first coil pattern 311 and the first lead-out pattern 331 disposed on the lower surface side of the support substrate 200 , and the second coil pattern 312 disposed on the upper surface side of the support substrate 200 . And when the second lead-out patterns 332 are separately formed from each other and then collectively laminated on the support substrate 200 to form the coil unit 300, the via 320 is the melting point of the high-melting-point metal layer and the high-melting-point metal layer. It may include a low-melting-point metal layer having a lower melting point. Here, the low-melting-point metal layer may be formed of solder including lead (Pb) and/or tin (Sn). At least a portion of the low-melting-point metal layer is melted due to the pressure and temperature during batch lamination. For example, an Inter Metallic Compound Layer (IMC Layer) is formed at the boundary between the low-melting-point metal layer and the second coil pattern 312 . can be

In this embodiment, the thickness t2 of the lead-out patterns 331 and 332 may be thinner than the thickness t1 of the coil patterns 311 and 312 .

Here, the thickness of the drawing patterns 331 and 332 is an optical microscope or a cross-section in the longitudinal direction (L)-thickness direction (T) in the central portion of the coil component 1000 in the width direction (W). Based on the SEM (Scanning Electron Microscope) photograph, the outermost boundary line along the thickness direction (T) of the drawout patterns 331 and 332 shown in the cross-sectional photograph and the surface of the support substrate 200 are connected, and the thickness direction ( It may mean a maximum value among a plurality of line segments parallel to T). Alternatively, the thickness of the drawing patterns 331 and 332 refers to the outermost boundary line along the thickness direction T of the drawing patterns 331 and 332 shown in the cross-sectional photograph and the support substrate 200 based on the cross-sectional photograph. ) may mean a minimum value among a plurality of line segments connecting between surfaces and parallel to the thickness direction T. Alternatively, the thickness of the drawing patterns 331 and 332 means the outermost boundary line along the thickness direction T of the drawing patterns 331 and 332 shown in the cross-sectional photograph and the supporting substrate ( 200) and may mean an arithmetic mean value of at least two of a plurality of line segments that are connected between the surfaces and are parallel to the thickness direction T.

Here, the thickness of the first coil pattern 311 is an optical microscope or a cross-section in the longitudinal direction (L)-thickness direction (T) in the central portion of the coil component 1000 in the width direction (W). Based on any one turn among a plurality of turns of the first coil pattern 311 shown in a scanning electron microscope (SEM) photograph, 2 facing in the thickness direction T of the turn It may mean a maximum value among a plurality of line segments connecting the outermost boundary lines and parallel to the thickness direction T. Alternatively, the thickness of the first coil pattern 311 is, based on any one turn among a plurality of turns of the first coil pattern 311 shown in the cross-sectional photograph, the turn ( turn) connecting two outermost boundary lines facing in the thickness direction (T) and may mean a minimum value among a plurality of line segments parallel to the thickness direction (T). Alternatively, the thickness of the first coil pattern 311 is, based on any one turn among a plurality of turns of the first coil pattern 311 shown in the cross-sectional photograph, the turn ( turn) may mean an arithmetic mean value of at least two of a plurality of line segments that connect two outermost boundary lines facing in the thickness direction T of turn) and are parallel to the thickness direction T. The description of the thickness of the first coil pattern 311 may be equally applied to the thickness of the second coil pattern 312 .

By forming the lead-out patterns 331 and 332 thinner than the coil patterns 311 and 312 in this way, as described above, the magnetic material filling space inside the body 100 can be increased to increase the Ls characteristic value, and the slit die It is possible to secure a depth margin and a cover thickness margin of the lead patterns 331 and 332 in the slit dicing process, thereby improving plating spread and chipping defects. .

Here, a plurality of metal layers 310A, 310B, 310C, and 310D may be formed in a sequential plating process to form a difference in thickness between the lead patterns 331 and 332 and the coil patterns 311 and 312 .

The external electrodes 410 and 420 are spaced apart from each other on the body 100 and connected to the coil unit 300 . In the present embodiment, the external electrodes 410 and 420 include pad parts 412 and 422 spaced apart from each other on the sixth surface 106 of the body 100 , and the first and second surfaces of the body 100 . and connecting portions 411 , 421 disposed at 101 , 102 . Specifically, the first external electrode 410 is disposed on the first surface 101 of the body 100 and is in contact with the first drawing pattern 331 exposed to the first surface 101 of the body 100 . It includes a first connection part 411 and a first pad part 412 extending from the first connection part 411 to the sixth surface 106 of the body 100 . The second external electrode 420 is a second connection part disposed on the second surface 102 of the body 100 and in contact with the second drawing pattern 332 exposed to the second surface 102 of the body 100 . 421 , and a second pad part 422 extending from the second connection part 421 to the sixth surface 106 of the body 100 . The first and second pad parts 412 and 422 are spaced apart from each other on the sixth surface 106 of the Vida 100 . The connection parts 411 and 421 and the pad parts 412 and 422 are formed together in the same process and may be integrally formed without forming a boundary between them, but the scope of the present invention is not limited thereto.

The external electrodes 410 and 420 may be formed by a vapor deposition method such as sputtering and/or a plating method, but is not limited thereto.

The external electrodes 410 and 420 are copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium. It may be formed of a conductive material such as (Ti) or an alloy thereof, but is not limited thereto. The external electrodes 410 and 420 may be formed in a single-layer or multi-layer structure. For example, the first external electrode 410 may include a first conductive layer including copper (Cu), a second conductive layer disposed on the first conductive layer, and a second conductive layer including nickel (Ni) and a second conductive layer, A third conductive layer including tin (Sn) may be included. At least one of the second conductive layer and the third conductive layer may be formed to cover the first conductive layer, but the scope of the present invention is not limited thereto. At least one of the second conductive layer and the third conductive layer may be disposed only on the sixth surface 106 of the body 100 , but the scope of the present invention is not limited thereto. The first conductive layer may be a plating layer or a conductive resin layer formed by coating and curing a conductive resin including a conductive powder including at least one of copper (Cu) and silver (Ag) and a resin. The second and third conductive layers may be plating layers, but the scope of the present invention is not limited thereto.

The insulating layer IF is disposed between the coil unit 300 and the body 100 and between the support substrate 200 and the body 100 . The insulating layer IF may be formed along the surface of the support substrate 200 on which the coil patterns 311 and 312 and the lead patterns 331 and 332 are formed, but is not limited thereto. The insulating layer IF serves to insulate the coil unit 300 and the body 100 and may include a well-known insulating material such as paraline, but is not limited thereto. As another example, the insulating layer IF may include an insulating material such as an epoxy resin other than ferralin. The insulating layer IF may be formed by vapor deposition, but is not limited thereto. As another example, the insulating film IF may be formed by laminating and curing an insulating film for forming the insulating film IF on both sides of the support substrate 200 on which the coil unit 300 is formed, and the coil unit 300 is It may be formed by coating and curing an insulating paste for forming the insulating film IF on both surfaces of the formed support substrate 200 . On the other hand, for the above reasons, the insulating film IF is a configuration that can be omitted in the present embodiment. That is, if the body 100 has sufficient electrical resistance at the designed operating current and voltage of the coil component 1000 according to the present embodiment, the insulating film IF may be omitted from the present embodiment.

The coil component 1000 according to the present embodiment may further include a surface insulating layer 700 disposed on the fifth surface 105 of the body 100 .

The surface insulating layer 700 may extend from the fifth surface 105 of the body 100 to at least a portion of the first to fourth and sixth surfaces 101 , 102 , 103 , 104 and 105 of the body 100 . can In this embodiment, the surface insulating layer 700 is disposed on each of the first to fifth surfaces 101 , 102 , 103 , 104 , 105 of the body 100 , and the sixth surface 106 of the body 100 . The middle pad parts 412 and 422 may be disposed in an area other than the disposed area. The surface insulating layer 700 disposed on the first and second surfaces 101 and 102 of the body 100 may cover the connection portions 411 and 422 of the external electrodes 410 and 420 .

At least some of the surface insulating layers 700 disposed on each of the first to sixth surfaces 101, 102, 103, 104, 105, and 106 of the body 100 are formed in the same process as each other, so that a boundary between them is not formed. It may be formed in an integral form, but the scope of the present invention is not limited thereto.

The surface insulating layer 700 is a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, acrylic, phenol, epoxy, urethane, melamine, alkyd. Thermosetting resins, such as a system, a photosensitive resin, _Paraline , SiOx, or _SiNx may be included. The surface insulating layer 700 may further include an insulating filler such as an inorganic filler, but is not limited thereto.

FIG. 4 is an enlarged view showing area B of FIG. 2 .

Referring to FIG. 4 , a connection via 322 passing through the support substrate 200 and connecting between the drawing patterns 332 on both surfaces of the support substrate 200 may be formed.

The connection via 322 may be formed by sequentially performing a hole forming process using a mechanical drill for a copper clad laminate (CCL), a chemical copper plating, and a pattern plating process. In this case, the connection via 322 has a linear shape as shown in FIG. 4 . However, in the case of processing with a CO ₂ laser, the shape may vary depending on the thickness of the copper clad laminate (CCL).

First, the first metal layer 310A commonly included in the coil patterns 311 and 312 and the extraction patterns 331 and 332 may be formed through a chemical copper plating process after CO ₂ laser processing for CCL. Here, the first metal layer 310A may include copper (Cu).

Second, the second metal layer 310B commonly included in the coil patterns 311 and 312 and the lead patterns 331 and 332 may be formed through the pattern plating process. In this case, as a result of the pattern plating, the second metal layer 310B may be formed to be spaced apart from the support substrate 200 by exposing the side surface of the first metal layer 310A.

Through the two-step plating process as described above, an electrode structure having a drawing pattern 332 on both surfaces of the support substrate 200 may be formed.

Third, a third metal layer 310C may be formed on the coil pattern 311 by performing a lead-in wire plating process after a masking operation on the lead-out pattern 332 . Here, the third metal layer may be, for example, an isotropic plating layer, and as a result, the length of the region disposed on the upper surface of the second metal layer and the length of the region disposed on the side surface of the second metal layer may be formed to be the same. As another example, the third metal layer may be an anisotropic plating layer, and as a result, the length of the region disposed on the upper surface of the second metal layer may be significantly larger than the length of the region disposed on the side surface of the second metal layer.

Finally, the fourth metal layer 310D may be formed on the coil pattern 311 through an anisotropic plating process. Here, the fourth metal layer may be, for example, an anisotropic plating layer, and as a result, the length of the region disposed on the upper surface of the third metal layer may be longer than the length of the region disposed on the side surface of the third metal layer.

As a result, compared to the lead pattern 332 , the coil pattern 311 may further include the third metal layer 310C and/or the fourth metal layer 310D, and thus may be formed to have a greater thickness.

FIG. 5 is an enlarged view showing another embodiment (B′) of area B of FIG. 2 .

Referring to FIG. 5 , a connection via 322 passing through the support substrate 200 and connecting between the drawing patterns 332 on both sides of the support substrate 200 may be formed. CO ₂ for the copper clad laminate (CCL) In the laser processing process, the area of the through surface may be tapered with respect to the surface to which the laser is irradiated.

FIG. 6 is an enlarged view showing another embodiment (B″) of area B of FIG. 2 .

Referring to FIG. 6 , a connection via 322 passing through the support substrate 200 and connecting between the drawing patterns 332 on both sides of the support substrate 200 may be formed. CO ₂ for the copper clad laminate (CCL) In the laser processing process, if the thickness of the copper clad laminate (CCL) is thick, the laser can be irradiated from both sides. In this case, the area of the through surface may have an hourglass shape that gradually narrows from the top to the bottom and then widens again.

FIG. 7 is an enlarged view illustrating area A of FIG. 1 .

Referring to FIG. 7 , a plurality of connection vias 322 may be formed for one lead pattern 332 .

In this embodiment, the connection vias 322 may be disposed to be spaced apart from each other in the width W direction with respect to the body 100 .

FIG. 8 is an enlarged view showing another embodiment (A′) of area A of FIG. 1 .

Referring to FIG. 8 , a plurality of connection vias 322 may be formed for one lead pattern 332 .

In this embodiment, the connection vias 322 may be disposed to be spaced apart from each other in the length (L) direction with respect to the body 100 .

9 is an enlarged view showing another embodiment (A″) of area A of FIG. 1 .

Referring to FIG. 9 , a plurality of connection vias 322 may be formed for one lead pattern 332 .

In this embodiment, the connection vias 322 may be disposed to be spaced apart from each other in the width W direction with respect to the body 100 .

Also, the connection via 322 may be formed to be exposed to the second surface 102 of the body 100 . In this case, the contact area between the lead-out pattern 332 and the external electrode 420 can be increased, so that the contact reliability is improved or the direct current resistance (Rdc) characteristic is improved.

In the above, although an embodiment of the present invention has been described, those of ordinary skill in the art can add, change or delete components within the scope that does not depart from the spirit of the present invention described in the claims. Various modifications and variations of the present invention will be possible, which will also be included within the scope of the present invention.

100: body
110: core
200: support substrate
300: coil unit
310A, 310B, 310C, 310D: metal layer
311, 312: coil pattern
320: via
321, 323: connecting via
331, 332: withdrawal pattern
410, 420: external electrode
700: surface insulating layer
IF: insulating film
1000: coil part

Claims (13)

support substrate;
A coil pattern disposed on the support substrate, a drawing pattern disposed on both sides of the support substrate and connected to the coil pattern, and a connection via passing through the support substrate and connecting the drawing pattern disposed on both surfaces of the support substrate to each other; A coil unit comprising a; and
a body covering the support substrate and the coil unit; including,
The thickness of any one of the drawing patterns disposed on both sides of the support substrate is thinner than the thickness of the coil pattern,
coil parts.
According to claim 1,
The body has one surface and the other surface facing each other, connecting one surface and the other surface of the body, one end surface and the other end surface facing each other in the longitudinal direction, and connecting one end surface and the other end surface of the body, respectively, facing each other in the width direction having one side and the other side,
The connection via is formed in plurality spaced apart from each other,
coil parts.
3. The method of claim 2,
The plurality of connection vias are spaced apart from each other in the width direction,
coil parts.
3. The method of claim 2,
The plurality of connection vias are spaced apart from each other in the longitudinal direction,
coil parts.
3. The method of claim 2,
The plurality of connection vias are exposed on at least one of one end surface and the other end surface of the body,
coil parts.
The method of claim 1,
Each of the coil pattern and the drawing pattern includes a first metal layer disposed on the support substrate and a second metal layer disposed on the first metal layer,
The coil pattern further comprises a third metal layer disposed on the second metal layer,
coil parts.
7. The method of claim 6,
The first metal layer comprises copper (Cu),
coil parts.
7. The method of claim 6,
The second metal layer is spaced apart from the support substrate by exposing a side surface of the first metal layer,
coil parts.
7. The method of claim 6,
The third metal layer,
Covering the side surfaces of each of the first and second metal layers, in contact with the support substrate,
coil parts.
10. The method of claim 9,
The third metal layer,
The length of the region disposed on the upper surface of the second metal layer and the length of the region disposed on the side surface of the second metal layer are equal to each other,
coil parts.
10. The method of claim 9,
The coil pattern further comprises a fourth metal layer disposed on an upper surface of the third metal layer,
coil parts.
The method of claim 1,
first and second external electrodes spaced apart from each other on the body and connected to the coil unit, respectively; further comprising,
coil parts.
support substrate;
a coil unit including a coil pattern and a drawing pattern respectively disposed on the support substrate; and
a body covering the support substrate and the coil unit; including,
Each of the coil pattern and the drawing pattern includes a first metal layer disposed on the support substrate and a second metal layer disposed on the first metal layer,
The coil pattern further includes a third metal layer disposed on the second metal layer,
The thickness of the drawing pattern is thinner than the thickness of the coil pattern,
coil parts.

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