KR20220011003A - Appratus for detaching die and method for detaching die using the same - Google Patents

Abstract

The present invention relates to a die peeling apparatus capable of precisely peeling a die by minimizing an error occurring in a die peeling process, and a die peeling method using the same. A die peeling device according to an embodiment of the present invention is a die peeling device for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing an adhesive sheet from below, and includes a plurality of contact members in contact with the adhesive sheet. a head unit including a head unit, a pressing unit including a plurality of pressing members for moving the plurality of contact members in a vertical direction, and a driving unit for moving the plurality of pressing members in an up-down direction, wherein the driving unit includes the plurality of pressing members A stage for integrally moving the pressing member in the vertical direction, a driving unit for moving integrally with the stage, and independently moving at least one of the plurality of pressing members in the vertical direction, and a driving control unit for controlling the stage and the driving unit; including, a die peeling device.

Description

Die peeling device and die peeling method using same

Embodiments of the present invention relate to an apparatus and method used for manufacturing a semiconductor, and more particularly, to a die peeling apparatus to which a plurality of contact members and driving units are applied, and a die peeling method using the same.

A die is a semiconductor chip, and is manufactured by cutting a wafer at predetermined intervals along a scribe line. The cut die is separated and picked up from the adhesive sheet by a die bonder in a state attached to the adhesive sheet, and then mounted on a frame or circuit board for packaging.

As a method of separating and picking up a die attached on a conventional adhesive sheet, the following method is used. First, the adhesive sheet is peeled from the peripheral portion of the die to be separated by pressing the lower surface of the adhesive sheet from the bottom using a die bonder. At this time, the die bonder presses only the side of the adhesive sheet corresponding to the periphery of the die through the block. Next, the surface of the adhesive sheet corresponding to the central portion of the target die is pressed to peel the target die from the adhesive sheet. Then, the peeled die is picked up and transferred to the next process.

To this end, in the conventional die bonder, a plurality of segmented blocks move up and down individually to form a seating surface of a different height from the adhesive sheet.

However, in this process, the surface of each block in contact with the adhesive sheet may be located at different heights. In this case, the driving unit for raising and lowering each contact member is separate, and it moves up and down according to the movement of the driving unit, such as a motor, according to each control signal. Therefore, it is not easy to establish a common reference plane in which the blocks come into contact with the adhesive sheet. This is because it is difficult to precisely peel the die from the adhesive sheet due to errors that inevitably occur in the separation and pickup process, such as mechanical errors that occur while a plurality of contact members and the driving unit are operated or errors that occur during the control process, and the defect rate may increase. have.

In order to use various peeling methods, there are cases in which individual driving units are applied to control a plurality of contact members, but the above problems exist. In addition, there are cases in which physical control of all contact members according to the shape of the cam is collectively controlled, such as a cam to control all contact members, but there is a physical limitation in applying it to a method of separating the adhesive sheet in various ways. do.

The above-mentioned background art is technical information possessed by the inventor for the derivation of the present invention or acquired in the process of derivation of the present invention, and cannot necessarily be said to be a known technique disclosed to the general public prior to the filing of the present invention.

Japanese Laid-Open Patent Publication No. 1994-295930

The present invention provides a die peeling apparatus and a die peeling method using the same, which can improve die peeling and pickup quality by precisely pressing a plurality of contact members to an adhesive sheet on which a die is disposed.

A die peeling device according to an embodiment of the present invention is a die peeling device for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing an adhesive sheet from below, and includes a plurality of contact members in contact with the adhesive sheet. a head unit including a head unit, a pressing unit including a plurality of pressing members for moving the plurality of contact members in a vertical direction, and a driving unit for moving the plurality of pressing members in an up-down direction, wherein the driving unit includes the plurality of pressing members It is disposed on the stage and integrally moves the pressing member in the vertical direction, and includes a driving unit independently moving at least one of the plurality of pressing members in the vertical direction, and a driving control unit controlling the stage and the driving unit.

In the die peeling apparatus according to an embodiment of the present invention, the pressing members may be respectively connected to correspond to the contact members to move the contact members in the vertical direction.

In the die peeling apparatus according to an embodiment of the present invention, the driving unit includes an inclined block disposed on the stage to move in a direction perpendicular to an up-down direction, and at least one of the plurality of pressing members is the inclined block. can move up and down independently according to the movement of

In the die peeling apparatus according to an embodiment of the present invention, the plurality of pressing members may be three or more, and the number of the driving units may be smaller than the number of the plurality of pressing members.

In the die peeling apparatus according to an embodiment of the present invention, the driving unit may be disposed on one side of the inclined block, and may have at least one guide with respect to the inclined block.

In the die peeling apparatus according to an embodiment of the present invention, the stage is directly connected to the innermost pressing member among the plurality of pressing members, the driving unit is disposed on the stage, and the remaining pressing members except for the innermost pressing member can be independently moved up and down.

In the die peeling apparatus according to an embodiment of the present invention, the driving unit may vertically move the head unit and the pressing unit integrally.

A die peeling device according to another embodiment of the present invention is a die peeling device for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing an adhesive sheet from below, and includes a plurality of contact members in contact with the adhesive sheet. a head unit including a head unit, a pressing unit including a plurality of pressing members for moving the plurality of contact members in an up-down direction, and a driving unit for moving the plurality of pressing members in an up-down direction, wherein the driving unit comprises: The plurality of contact members and the plurality of pressing members are integrally raised to bring the adhesive sheet into contact with the entirety of the plurality of contact members, and some of the plurality of pressing members are raised or lowered to raise or lower the adhesive sheet and the plurality of contact members. The die is peeled from the adhesive sheet by changing the contact state of

A die peeling method according to another embodiment of the present invention is a die peeling method for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing an adhesive sheet with a die peeling apparatus including a plurality of contact members, the die peeling method comprising: aligning a plurality of contact members at the same height, integrally raising the plurality of aligned contact members to contact the adhesive sheet, and raising or lowering some of the plurality of contact members to form the adhesive sheet and changing the contact state of the plurality of contact members.

In the die peeling method according to another embodiment of the present invention, the changing of the contact state may selectively raise or lower at least one contact member among the plurality of contact members arranged and arranged concentrically.

In the die peeling method according to another embodiment of the present invention, the die peeling apparatus includes a head unit including the plurality of contact members for pressing the adhesive sheet from below, and vertically moving the plurality of contact members, A pressing unit including a plurality of pressing members for pressing the adhesive sheet and a driving unit for moving the plurality of pressing members in an up-down direction, wherein the driving unit moves the plurality of pressing members in an up-down direction integrally and a stage and a driving unit moving integrally with the stage and independently moving at least one of the plurality of pressing members in an up-down direction, wherein the step of contacting the adhesive sheet raises the stage, and the plurality of contact members Contacting the entire upper surface of the adhesive sheet with the adhesive sheet and changing the contact state may include raising or lowering the driving unit to separate at least one of the plurality of contact members from the adhesive sheet.

Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

A die peeling apparatus and a die peeling method using the same according to an embodiment of the present invention can change the adhesive state between the contact member and the adhesive sheet while the plurality of contact members are brought into contact with the same height with respect to the adhesive sheet on which the die is disposed. have. Through this, peeling and bonding processes are performed in a state in which the plurality of contact members are more precisely aligned, so that the peeling quality of the die can be improved.

In particular, in the die peeling apparatus and the die peeling method using the same according to an embodiment of the present invention, a plurality of pressing members are integrally moved in the vertical direction, and some and/or all of them are independently moved in the vertical direction, so that the die can be precisely pressed from the adhesive sheet.

1 illustrates a die bonding system including a die peeling apparatus according to an embodiment of the present invention.
2 shows a die disposed on an adhesive sheet.
Fig. 3 shows the die peeling apparatus of Fig. 1;
4 shows a cross section taken along IV-IV of FIG. 3 .
FIG. 5 is an enlarged view of the head unit of FIG. 4 .
6 is a view showing the contact member of FIG. 5 as viewed from the top.
Fig. 7 shows a projection of the contact member of Fig. 5;
FIG. 8 shows a cross-section taken along VIII-VIII of FIG. 5 .
Fig. 9 shows the pressurization unit of Fig. 4;
FIG. 10 shows a cross-section taken along X-X of FIG. 9 .
11 is a cross-sectional view taken along XI-XI of FIG. 9 .
12 is an enlarged view of the pressurizing unit and the driving unit of FIG. 4 .
Fig. 13 shows the drive unit of Fig. 4;
14 illustrates a die peeling method according to an embodiment of the present invention.
15A to 15D illustrate a state in which die peeling is in progress according to an embodiment of the present invention.
16A to 16D show a state in which die peeling is in progress according to another embodiment of the present invention.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In the description of the present invention, even though shown in other embodiments, the same identification numbers are used for the same components.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, the present invention will be described in detail with reference to embodiments related to the present invention shown in the accompanying drawings.

1 shows a die bonding system 1 including a die peeling apparatus 10 according to an embodiment of the present invention, and FIG. 2 shows a die D disposed on an adhesive sheet S.

1 and 2 , a die peeling apparatus 10 according to an embodiment of the present invention may be included in a die bonding system 1 .

The die bonding system 1 may peel and pick up the wafer W disposed on the adhesive sheet S, more specifically, the die D in which the wafer W is divided into a plurality, and mount it on the substrate.

The die bonding system 1 may include a die peeling device 10 , a support device 20 , and a pickup device 30 .

The support device 20 includes a first wafer support member 21 for supporting an end of the adhesive sheet S on which the die D is disposed, and a second wafer support member 21 into which the first wafer support member 21 is inserted. 22) and a third wafer support member 23 on which the lower surface of the adhesive sheet S is seated.

When the adhesive sheet S is seated on the third wafer support member 23 by a transfer device (not shown), the die peeling device 10 according to an embodiment of the present invention is located under the adhesive sheet S. are placed And in the state in which the adhesive sheet S is supported by the support device 20, the lower surface of the adhesive sheet S can be pressed, and the die|dye D can be peeled from the adhesive sheet S. In addition, the die pickup device 30 may pick up the die D from the adhesive sheet S and mount it on a substrate or the like.

3 shows the die peeling device 10 of FIG. 1 , FIG. 4 shows a cross section taken along IV-IV of FIG. 3 , FIG. 5 shows an enlarged head unit 100 of FIG. 4 , and FIG. 6 shows 5 shows the contact member 140 as seen from the top, FIG. 7 shows the protrusion 140A of the contact member 140 of FIG. 5, and FIG. 8 shows a cross-section taken along VIII-VIII of FIG. .

3 and 4 , the die peeling apparatus 10 according to an embodiment of the present invention includes a head unit 100 , a pressing unit 200 , a driving unit 300 , and a driving unit 300 . It may include a driving control unit (not shown) for controlling the.

The head unit 100 may be disposed on the die peeling device 10 to directly press the lower surface of the adhesive sheet S.

5 to 8 , the head unit 100 may include a body 110 , a cover 120 , a support bracket 130 , and a contact member 140 .

The body 110 is a body portion of the head unit 100 and may include a space in which the contact member 140 is disposed. The shape of the body 110 is not particularly limited, and may be cylindrical in one embodiment.

The cover 120 is disposed to cover the upper end of the body 110 . A plurality of suction holes 121 and a guide groove 122 that is opened so that the contact member 140 can move in the vertical direction may be disposed on the upper surface of the cover 120 .

A plurality of adsorption holes 121 are formed on the upper surface of the cover 120 , and the number is not particularly limited. The adsorption hole 121 may be connected to an adsorption device (not shown) provided in the die peeling device 10 or disposed to be spaced apart from the die peeling device 10 . When the contact member 140 pushes up the adsorption sheet S, the adsorption device adsorbs the adsorption sheet S through the adsorption hole 121 so that the die D is more stably peeled off.

The guide groove 122 may be formed in the center of the upper surface of the cover 120 . The size and shape of the guide groove 122 are not particularly limited, but may preferably correspond to the size and shape of the protrusion 140A of the contact member 140 to be described later.

The support bracket 130 is disposed at the lower end of the body 110 , and may connect the head unit 100 to the pressing unit 200 .

The contact member 140 is disposed inside the body 110 , and a plurality of contact members 140 may be provided to press the lower surface of the adhesive sheet S.

In one embodiment, the contact member 140 may be a plurality of blocks arranged concentrically. More specifically, as shown in FIGS. 5 and 8 , the contact member 140 has a first contact block 141 , a second contact block 142 , and a third contact block 143 each having a ring shape. can be placed as

The first contact block 141 is an innermost contact block among the contact members 140 . In addition, the second contact block 142 may be radially spaced apart from the first contact block 141 to surround the first contact block 141 . Also, the third contact block 143 may be radially spaced apart from the second contact block 142 to surround the second contact block 142 .

The number of the contact members 140 is not particularly limited. Although three contact members 140 are shown in the embodiment of the present invention, the die peeling device 10 includes a variable number of contact members 140 in consideration of the specific specifications of the die D and the adhesive sheet S. may include This is also the same for the pressing member 210 to be described later. However, hereinafter, for convenience of description, the three contact members 140 will be mainly described.

In an embodiment, the plurality of contact members 140 may move independently. More specifically, the first contact block 141 , the second contact block 142 , and the third contact block 143 come into contact with the adhesive sheet S while moving independently in the vertical direction without being constrained by each other's movement. can be separated from it. Accordingly, the contact state between the adhesive sheet S and the contact member 140 may vary.

In an embodiment, the contact member 140 may include a protrusion portion 140A and a body portion 140B.

The protrusion 140A may be disposed on the upper end of the contact member 140 . More specifically, as shown in FIGS. 5 and 7 , the protrusion 140A is formed by protruding upwards of the plurality of contact members 140 . The upper end of the protrusion 140A may be in direct contact with the lower surface of the adhesive sheet S.

The shape of the protrusion 140A is not particularly limited. As an embodiment, as shown in FIG. 7 , the protrusion 140A may have a shape in which a plurality of contact members 140 having a rectangular shape are concentrically disposed.

The body portion 140B may extend in a radial direction and a height direction from the lower end of the protrusion portion 140A, and may have a cylindrical shape.

As an embodiment, the contact member 140 according to an embodiment of the present invention may have a shape that is narrowed upward.

In one embodiment, the protrusion 140A may include a plurality of protrusions P and grooves G.

More specifically, as shown in FIG. 7 , a plurality of protrusions P may be formed on the upper surface of the first contact block 141 . Each of these protrusions P may be in direct contact with the lower surface of the adhesive sheet S as the first contact block 141 moves upward. Also, a groove G may be formed between the protrusions P of the first contact block 141 .

Similarly, a plurality of protrusions P and grooves G may be alternately and repeatedly formed on the upper surfaces of the second contact block 142 and the third contact block 143 .

Accordingly, the adhesive sheet S may not be supported on the upper surface of each contact block as it is, but may be bent locally by the protrusions P and the grooves G formed in the contact blocks.

That is, in the die peeling apparatus 10 according to an embodiment of the present invention, in addition to changing the contact state between the plurality of contact members 140 and the adhesive sheet S, the protrusion P on the contact member 140 . By arranging the grooves G, the die D can be more easily peeled from the adhesive sheet S.

In one embodiment, the groove (G) may have a smaller dimension in the longitudinal direction and the width direction than the protrusion (P). Accordingly, it is possible to prevent the adhesive sheet (S) from being excessively drawn into the space formed in the groove (G).

In another embodiment, the grooves G formed in any one contact block may have smaller dimensions in the longitudinal and width directions than the protrusions P formed in the adjacent contact blocks. For example, as shown in FIG. 7 , the groove G formed in the second contact block 142 is a protrusion P formed in the first contact block 141 and the third contact block 143 that are adjacent contact blocks. ) may have smaller dimensions in the longitudinal and width directions than Accordingly, it is possible to prevent the adhesive sheet S from being excessively bent.

5 , the head unit 100 may further include a plurality of first pins 150 . The first pin 150 may be disposed at the lower end of the head unit 100 , and may transmit the movement of the pressing member 210 of the pressing unit 200 to the contact member 140 , which will be described later. Although only the first pin 150 connected to the first contact block 141 is shown in FIG. 5 , the first pin 150 connected to the second contact block 142 and the third contact block 143, respectively, is further added. may include

However, the first pin P1 is not necessarily provided, and the pressure member 210 may directly press the contact member 140 to move it without the first pin P1 .

9 shows the pressurization unit 200 of FIG. 4 , FIG. 10 shows a cross-section taken along X-X of FIG. 9, FIG. 11 shows a cross-section taken along XI-XI of FIG. 9, and FIG. 4, the pressurization unit 200 and the drive unit 300 are enlarged and shown.

9 to 12 , the pressing unit 200 may press the lower surface of the adhesive sheet S by moving the plurality of contact members 140 of the head unit 100 in the vertical direction.

The pressing unit 200 may include a plurality of pressing members 210 .

The pressing members 210 may be connected to correspond to the contact members 140 , respectively, and may move the contact members 140 in the vertical direction. These pressing members 210 may move in the vertical direction independently of each other.

In an embodiment, the pressing member 210 may include a first pressing block 211 , a second pressing block 212 , and a third pressing block 213 . The first pressing block 211 , the second pressing block 212 , and the third pressing block 213 are independent of the first contact block 141 , the second contact block 142 , and the third contact block 143 , respectively. can be moved up and down. The number of pressing blocks is not particularly limited, and may correspond to the number of contact blocks.

In an embodiment, the pressing member 210 may be divided into an upper pressing member 210A and a lower pressing member 210B.

Also, the pressing unit 200 may further include a second pin 220 connecting the upper pressing member 210A and the lower pressing member 210B. The second pin 220 may connect each of the pressing blocks included in the upper pressing member 210A and the lower pressing member 210B. More specifically, the second pin 220 includes a 2a pin 221 connecting the first pressing block 211, a 2b pin 222 connecting the second pressing block 212, and a third pressing It may include a 2c pin 223 connecting the block 213 .

Accordingly, as will be described later, when the pressing blocks of the lower pressing member 210B by the driving unit 300 move in the vertical direction, the movement is transmitted to the upper pressing member 210A by the second pin 220 . do. In addition, the upper pressing member 210A may independently move the contact member 140 of the head unit 100 in the vertical direction.

In another embodiment, the pressing unit 200 may not include the second pin 220 , and the upper pressing member 210A and the lower pressing member 210B may be integrally formed. In this case, the upper part and the lower part may mean conceptually dividing the pressing member 210 .

In one embodiment, as shown in FIG. 10 , the upper end of the upper pressing member 210A may be formed of a plurality of polygonal blocks. More specifically, in the upper end of the upper pressing member 210A, the first pressing block 211 is disposed in the center, the second pressing blocks 212 are respectively disposed on both sides thereof, and the third pressing block 213 is disposed at the outermost side. ) can be placed. That is, the second pressing block 212 and the third pressing block 213 may include a plurality of physically separated blocks.

In one embodiment, the lower end of the upper pressing member 210A may be composed of a plurality of blocks arranged concentrically. More specifically, at the lower end of the upper pressing member 210A, the first pressing block 211 is disposed in the center, the second pressing block 212 is arranged to surround the first pressing block 211, and again the second pressing block 211 is disposed. A third pressing block 213 may be disposed to surround the pressing block 212 .

That is, the pressing member 210 , more specifically, the upper pressing member 210A may have a shape that is narrowed upward.

In FIGS. 10 and 11 , each pressing block has a polygonal shape, but is not limited thereto. For example, the pressing block may have various shapes, such as a ring shape, an oval shape, and the like.

Although not shown in the drawings, the upper end of the lower pressing member 210B may also have the same shape as the lower end of the upper pressing member 210A. More specifically, the cross-section indicated by XII'-XI' in FIG. 9 may have the same shape as the cross-section indicated by XII-XI.

In an embodiment, the lower pressing member 210B may be respectively connected to the second pin 220 . More specifically, as shown in FIGS. 9 and 12 , the lower pressing member 210B has a first pressing block 211 disposed in the center, and a second pressing block 212 surrounding the first pressing block 211 . ) is disposed, and the third pressing block 213 may be arranged to surround the second pressing block 212 again. In addition, the first pressing block 211 is connected to the 2a pin 221 , the second pressing block 212 is connected to the 2b pin 222 , and the third pressing block 213 is the 2c pin ( 223) can be connected. Accordingly, when each of the second pins 220 moves up and down according to the operation of the driving unit 300 to be described later, the pressing member 210 also moves up and down, respectively. In FIG. 12 , the two second pins 220 are connected to each of the pressing members 210 , but the number or the connected positions are not particularly limited.

In addition, the lower end of the lower pressing member 210B may be arranged to be connected to each of the driving unit 300 to be described later. This will be described later.

13 shows the drive unit 300 of FIG. 4 . More specifically, FIG. 12 shows the driving unit 300 as viewed from the side.

4 and 13 , the driving unit 300 may be disposed under the die peeling apparatus 10 to move the pressing member 210 in the vertical direction.

The driving unit 300 may include a stage 310 and a driving unit 320 .

The stage 310 is disposed under the driving unit 300 , and may integrally move the plurality of pressing members 210 in the vertical direction. More specifically, the stage 310 is a single plate, is connected to the first driving member M1, and can move in the vertical direction. In addition, a first pressing block 211 , a second pressing block 212 , and a third pressing block 213 may be disposed on the upper surface of the stage 310 . Accordingly, when the stage 310 moves in the vertical direction, the first pressing block 211 , the second pressing block 212 , and the third pressing block 213 may also move vertically in one body.

The driving unit 320 may move integrally with the stage 310 , and may independently move at least one of the plurality of pressing members 210 in the vertical direction. For example, the driving unit 320 may have a cam structure for moving the pressing member 210 in the vertical direction.

The driving unit 320 may include a guide 321 , a slider 322 , an inclined block 323 , and a roller 324 .

The guide 321 may be disposed on the stage 310 in one direction perpendicular to the vertical direction. For example, the guide 321 may be disposed in an X-axis direction or a Y-axis direction perpendicular to the vertical Z-axis.

The slider 322 is disposed on the guide 321 and may reciprocate in one direction along the guide 321 . For example, the slider 322 may reciprocate in one direction while being inserted into the groove formed on the side surface of the guide 321 .

The inclined block 323 has an inclined surface of a predetermined angle, is connected to the slider 322, and can move in one direction. For example, when the slider 322 moves in one direction by the operation of the second driving member M2 , the inclined block 323 connected to the slider 322 also moves in the same direction.

As such, the driving unit 320 is for providing vertical movement with respect to the pressing member 210 , and in one embodiment, the driving unit 320 includes a guide 321 , a slider 322 , and an inclined block 323 , and , including a roller 324, and has been described as an example that the inclined block 323 has an inclined surface, but is not limited thereto. For example, the driving unit 320 may have a groove on its side to induce vertical movement of the pressing member 210 . Alternatively, the driving unit 320 may be configured such that a cam is formed on an upper surface or a side surface having a cylindrical ring shape, and as each cam rotates, it can induce vertical movement in connection with the movement of the upper surface or the side surface.

In one embodiment, the first driving member M1 and the second driving member M2 may be any one of various driving devices for moving the stage 310 and the slider 322 (or the inclined block 323 ), respectively. have. More specifically, the first driving member M1 and the second driving member M2 may be a step motor, a linear motor, or a servo motor as motors.

The second driving member M2 may be disposed in the front with respect to the moving direction of the inclination block 323 and may be disposed in parallel with the side surface of the inclination block 323 or disposed below to provide a driving force. When the second driving member M2 is disposed below, the second driving member M2 may include a function of the slider 322 of the driving unit 320 .

The roller 324 may be disposed on one side of the pressing member 210 and maintain a contact state with the inclined surface of the inclined block 323 . More specifically, as shown in FIG. 12, the roller 324 is disposed at the lower end of the second pressing block 212, and as the inclined block 323 moves in one direction, it can roll while in contact with the inclined surface. . Similarly, the roller 324 is also disposed at the lower end of the third pressing block 213, and as the inclined block 323 moves in one direction, it can roll while in contact with the inclined surface. Accordingly, the movement of the inclined block 323 in one direction may be converted into a movement of the pressing member 210 in the vertical direction.

In an embodiment, the first pressing block 211 may be directly connected to the stage 310 . That is, unlike the second pressing block 212 and the third pressing block 213 , the first pressing block 211 may be independent of the movement of the inclined block 323 .

In an embodiment, the number of the pressing members 210 may be three or more, and the number of the driving units 320 may be smaller than the number of the pressing members 210 . For example, as described above, three pressing members 210 may be provided as a first pressing block 211 , a second pressing block 212 , and a third pressing block 213 , and the driving unit 320 may Two may be provided. The second pressing block 212 and the third pressing block 213 may be connected to the respective driving unit 320 , and the first pressing block 211 may be directly connected to the stage 310 without being connected to the driving unit 320 . have.

Accordingly, as the stage 310 moves in the vertical direction, the first pressing block 211 moves in the vertical direction, and at the same time, as each driving unit 320 moves in the vertical direction, the second pressing block 212 And the third pressing block 213 is also moved in the vertical direction. That is, the plurality of pressing members 210 may move integrally by the movement of the stage 310 . In addition, as the plurality of pressing members 210 move integrally, the head unit 100 and the pressing unit 200 may also move integrally in the vertical direction. That is, the stage 310 may vertically move the head unit 100 and the pressing unit 200 integrally.

In addition, the second pressing block 212 and the third pressing block 213 may be independently moved in the vertical direction by the movement of the respective driving units 320 connected thereto.

In one embodiment, the plurality of pressing members 210 are concentrically arranged and are a plurality of blocks having a shape that narrows upward, and the stage 310 is an innermost pressing member (eg, a plurality of pressing members 210 ). For example, it may be directly connected to the first pressing block 211).

Also, the driving unit 320 may independently move the other pressing members (eg, the second pressing block 212 and the third pressing block 213 ) in the vertical direction except for the innermost pressing member.

Accordingly, in the die peeling apparatus 10 according to an embodiment of the present invention, the plurality of contact members 140 and the plurality of pressing members 210 are raised integrally to form the adhesive sheet S and the plurality of contact members 140 . ) by changing the contact state of the adhesive sheet S and the plurality of contact members 140 by raising or lowering a part of the plurality of pressing members 210 and removing the die D from the adhesive sheet S. can be peeled off.

Although not shown in the drawings, the die peeling apparatus 10 may include a driving control unit (not shown). The driving controller may control the driving unit 300 , more specifically, the stage 310 and the driving unit 320 according to a preset program or a user's manipulation.

14 illustrates a die peeling method according to another embodiment of the present invention.

Referring to FIG. 14 , in a die peeling method according to another embodiment of the present invention, an adhesive sheet S is pressed with a die peeling device 10 including a plurality of contact members 140 , and the adhesive sheet S is disposed on the adhesive sheet S. As a die peeling method for peeling the die D disposed on the adhesive sheet S from the adhesive sheet S, first, the plurality of contact members 140 may be aligned at the same height.

More specifically, as shown in FIG. 15A , the first contact block 141 , the second contact block 142 , and the third contact block 143 are all positioned at the same height L1 . In this state, the contact member 140 does not make any contact with the adhesive sheet S.

Next, the aligned plurality of contact members 140 are raised integrally to contact the adhesive sheet (S).

More specifically, as shown in FIG. 15B , the first contact block 141 , the second contact block 142 , and the third contact block 143 aligned on the same height L1 are raised integrally, so that all It is placed at the same height L2. Accordingly, all of the contact members 140 maintain contact with the adhesive sheet S.

Next, by raising or lowering some of the plurality of contact members 140 , the contact state between the adhesive sheet S and the plurality of contact members 140 is changed. In an embodiment, the contact state of the contact member 140 may be changed by selectively raising or lowering at least one contact member 140 among a plurality of concentrically arranged and aligned contact members 140 .

More specifically, as shown in FIG. 15C , the third pressing block 213 may be lowered using the driving unit 320 to lower the third contact block 143 . Accordingly, as shown in FIG. 15C , the area of the adhesive sheet S supported by the contact member 140 is reduced.

Next, as shown in FIG. 15D , the second pressing block 212 may be lowered using the driving unit 320 to lower the second contact block 142 . Accordingly, as shown in FIG. 15D , the area of the adhesive sheet S supported by the contact member 140 is further reduced. Accordingly, as the contact state between the adhesive sheet S and the contact member 140 is changed (as the contact area is reduced), the die D may be peeled off from the adhesive sheet S.

15A to 15D illustrate a case in which the contact member 140 is lowered, but the present invention is not limited thereto.

For example, as in FIG. 15A , the first contact block 141 , the second contact block 142 , and the third contact block 143 are all positioned at the same height L1 ( FIG. 16A ).

Next, the first contact block 141 , the second contact block 142 , and the third contact block 143 are raised integrally as in FIG. 15B , and all are positioned at the same height L2 ( FIG. 16B ).

Next, the second pressing block 212 may be raised by using the driving unit 320 to raise the second contact block 142 . Accordingly, as shown in FIG. 16C , the area of the adhesive sheet S supported by the contact member 140 is reduced. And since the adhesive sheet S is supported only by the second contact block 142 , the remaining portion is bent downward, so that the die D can be peeled from the adhesive sheet S.

Next, the third pressing block 213 may be raised by using the driving unit 320 to raise the third contact block 143 . Accordingly, as shown in FIG. 16D , the contact state between the contact member 140 and the adhesive sheet S is changed. And since the adhesive sheet S is supported only by the third contact block 143 , the remaining portion is bent downward, so that the die D can be more easily peeled from the adhesive sheet S.

As such, the present invention raises or lowers some of the plurality of contact members 140 in a state in which the plurality of contact members 140 are integrally raised and brought into contact with the adhesive sheet S, thereby contacting the adhesive sheet S. By changing the contact state of the member 140 , the die D can be easily peeled from the adhesive sheet S.

In particular, according to the present invention, all of the contact members 140 may be positioned at the same height with respect to the adhesive sheet S by raising the plurality of contact members 140 integrally to contact the adhesive sheet S. Accordingly, it is possible to precisely peel the die D from the adhesive sheet S by minimizing the height difference between the contact members 140 that occurs during the operation of the device.

In addition, according to the present invention, since the contact member 140 and the pressing member 210 have a shape that is narrowed upward, power can be smoothly transmitted and the space efficiency of the device can be maximized.

In the present specification, the present invention has been described with reference to limited embodiments, but various embodiments are possible within the scope of the present invention. In addition, although not explicitly described in this specification, it will be said that the means equivalent to the embodiment are also combined as it is in the present invention. Accordingly, the true scope of protection of the present invention should be defined by the following claims.

10: die peeling device
100: head unit
200: pressurization unit
300: drive unit

Claims (11)

A die peeling device for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing the adhesive sheet from below, comprising:
a head unit including a plurality of contact members contacting the adhesive sheet;
a pressing unit including a plurality of pressing members for vertically moving the plurality of contact members; and
a driving unit for moving the plurality of pressing members in an up-down direction;
the drive unit
a stage for integrally moving the plurality of pressing members in a vertical direction; and
a driving unit disposed on the stage and independently moving at least one of the plurality of pressing members in a vertical direction; and
A die peeling apparatus comprising a; a driving control unit for controlling the stage and the driving unit. According to claim 1,
The pressing members are respectively connected to correspond to the contact members to move the contact members in an up-down direction. According to claim 1,
the driving unit
Including an inclined block disposed on the stage to move in a direction perpendicular to the vertical direction,
At least one of the plurality of pressing members is
A die peeling device that independently moves up and down according to the movement of the inclined block. According to claim 1,
The plurality of pressing members is three or more,
The number of the driving unit is smaller than the number of the plurality of pressing members, the die peeling device. 4. The method of claim 3,
the driving unit
A die peeling device disposed on one side of the inclined block and having at least one guide with respect to the inclined block. 5. The method of claim 4,
the stage is
Directly connected to the innermost pressing member of the plurality of pressing members,
the driving unit
A die peeling apparatus disposed on the stage and independently moving the remaining pressing members except for the innermost pressing member in the vertical direction. According to claim 1,
the driving unit
A die peeling device for moving the head unit and the pressing unit in an up-down direction integrally. A die peeling device for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing the adhesive sheet from below, comprising:
A head unit including a plurality of contact members in contact with the adhesive sheet, a pressing unit including a plurality of pressing members for moving the plurality of contact members in a vertical direction, and a vertical movement of the plurality of pressing members a drive unit;
The driving unit raises the plurality of contact members and the plurality of pressing members integrally to bring the adhesive sheet into contact with all of the plurality of contact members, and raises or lowers some of the plurality of pressing members to form the adhesive sheet and A die peeling apparatus for peeling the die from the adhesive sheet by changing a contact state of the plurality of contact members. A die peeling method for peeling a die disposed on the adhesive sheet from the adhesive sheet by pressing an adhesive sheet with a die peeling device including a plurality of contact members, the die peeling method comprising:
aligning the plurality of contact members at the same height;
elevating the aligned plurality of contact members integrally to contact the adhesive sheet; and
and changing a contact state between the adhesive sheet and the plurality of contact members by raising or lowering some of the plurality of contact members. 10. The method of claim 9,
The step of changing the contact state is
and selectively raising or lowering at least one of said plurality of concentrically disposed and aligned contact members. 10. The method of claim 9,
The die peeling device is
a head unit including the plurality of contact members for pressing the adhesive sheet from below;
a pressing unit including a plurality of pressing members for pressing the adhesive sheet by moving the plurality of contact members in a vertical direction; and
a driving unit for moving the plurality of pressing members in an up-down direction;
the drive unit
a stage for integrally moving the plurality of pressing members in a vertical direction; and
a driving unit that moves integrally with the stage and independently moves at least one of the plurality of pressing members in the vertical direction;
The step of contacting the adhesive sheet
raising the stage to bring all of the upper surfaces of the plurality of contact members into contact with the adhesive sheet;
The step of changing the contact state is
and raising or lowering the driving unit to space at least one of the plurality of contact members away from the adhesive sheet.

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