KR20210144555A - Test socket and method fabricating method of the same - Google Patents

Abstract

Disclosed is a method of manufacturing a test socket which supports a probe stretchable in a longitudinal direction. The method of manufacturing a test socket includes the steps of: forming a probe hole for accommodating a probe in a base member made of a conductive material; filling the probe hole with a resin as an insulating material to a predetermined depth from an upper surface of the base member to form a probe support member; and forming a first support hole for supporting one end portion of the probe in the probe support member in the probe hole to expose the one end portion of the probe. The present invention provides the test socket for a high-frequency or high-speed semiconductor with excellent characteristics, and the method for manufacturing the same.

Description

Test socket and method for manufacturing the same {Test socket and method fabricating method of the same}

The present invention relates to an inspection socket for inspecting electrical characteristics of a subject and a method for manufacturing the same.

A high-frequency or high-speed semiconductor test test socket shields interference or noise between adjacent signal probes by mounting signal probes on a conductive block in a non-contact state. In the method of supporting the signal probe to the conductive block in a non-contact state, insulating support plates were disposed on both sides of the conductive block to support both ends of the signal probe. At this time, a probe receiving hole for accommodating the probe barrel is formed in the conductive block, a probe supporting hole for supporting the end of the barrel is formed on the insulating support plate, and then the conductive block and insulating support are formed so that the probe receiving hole and the probe supporting hole are aligned. The plates were joined. In the conventional method of manufacturing the inspection socket, the probe receiving hole manufacturing process and the probe supporting hole manufacturing process are individually performed, and as the number of probes increases, the process error and alignment error also increase. Therefore, the signal probe accommodated and supported in the plurality of probe accommodating holes and the probe supporting holes deviate from the central axis of the probe accommodating hole, and as a result, insertion loss characteristics, return loss characteristics, and crosstalk ) characteristics, isolation characteristics, Z-impedance characteristics, and inductance characteristics may deteriorate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a test socket for high-frequency or high-speed semiconductor testing having excellent characteristics and a method for manufacturing the same.

There is provided a method of manufacturing a test socket according to a first embodiment of the present invention for achieving the above-described object. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction includes: forming a probe hole for accommodating the probe on a base member made of a conductive material; Forming a probe support member by filling the resin of the probe hole, and forming a first support hole for supporting one end of the probe to be exposed on the probe support member in the probe hole.

The filling of the resin may further include disposing a mold cover spaced apart from one surface of the base member at a predetermined distance, and filling the spaced gap and the probe hole with resin.

The resin may be partially filled to a predetermined depth in the probe hole from one surface of the base member.

The base member may include a through hole that penetrates in a thickness direction and is filled with the resin.

The method of manufacturing a test socket according to the first embodiment includes: forming a second support hole for supporting the other end of the probe to be exposed on a cover member made of an insulating material; inserting the probe into the probe hole; The method may further include supporting both ends to the first and second support holes and coupling the cover member to a lower surface of the base member.

The method may further include interposing a gap plate between the base member and the cover member.

The probe hole may include a protrusion protruding toward the center at a position where the probe support part is formed.

A method of manufacturing an inspection socket according to a second embodiment of the present invention is provided. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction includes forming a support hole at a predetermined depth at a position where the probe is disposed on one surface of a base member made of an insulating material, and applying an insulating resin to the support hole. Forming a probe support portion by filling, forming a probe receiving hole for accommodating the probe in the base member at a position corresponding to the support hole, and forming a first support hole in which one end of the probe is supported in the probe support portion includes steps.

A method of manufacturing a test socket according to a second embodiment of the present invention comprises the steps of: forming a second support hole for supporting the other end of the probe on a cover member made of an insulating material; inserting the probe into the probe receiving hole; The method may further include supporting one end and the other end of the probe to the first and second support holes, respectively, and coupling the cover member to the other surface of the base member.

A method of manufacturing an inspection socket according to a second embodiment of the present invention comprises the steps of forming a second support hole at a predetermined depth at a position where the probe is disposed on one surface of a second base member made of an insulating material, in the second support hole forming a second probe support portion by filling an insulating material with a resin, and forming a second probe receiving hole for accommodating the probe in the second base member at a position corresponding to the second support portion hole, and the second probe support portion forming a second support hole in which the other end of the probe is supported, inserting the probe into the probe receiving hole and the second probe receiving hole, and inserting one end and the other end of the probe into the supporting hole and the second supporting hole The method may further include supporting each of the balls and coupling the other surface of the second base member to the other surface of the base member.

A method of manufacturing an inspection socket according to a third embodiment of the present invention is provided. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction comprises the steps of forming a probe receiving hole for accommodating the probe in a base block made of a conductive material; forming first and second probe support holes for supporting both ends of the probe; filling the first and second probe support holes with an insulating resin to form first and second probe support portions; forming first and second support holes for supporting both ends of the probe to be exposed in the first and second probe support portions; inserting the probe into the probe receiving hole; and coupling the first base member and the second base member to the upper and lower surfaces of the base block by supporting the support hole, respectively.

A method of manufacturing an inspection socket according to a fourth embodiment of the present invention is provided. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction includes the steps of forming at least one first through hole penetrating in the thickness direction in a first base block made of a conductive material; forming at least one second through hole penetrating in the direction; filling the first and second through holes with an insulating material, respectively; Forming first and second probe receiving holes for accommodating one side and the other side of the probe, both ends of the first and second probe receiving holes are on one side of the first base block and the other side of the second base block Inserting the probe so as to partially protrude, and coupling the other surface of the first base block and one surface of the second base block to each other.

The probe includes a signal probe for applying an inspection signal, and the forming of the first and second probe accommodating holes includes an air layer in a portion between an outer peripheral surface of the signal probe and an inner wall of the first and second through holes. The first and second probe accommodating holes may be formed to be larger than the outer diameter of the signal probe so as to form this.

The probe includes a power probe for applying power, and the forming of the first and second probe accommodating holes corresponds to an outer diameter of the power probe so that an outer circumferential surface of the power probe is in contact with the first and second probe support portions. The first and second probe accommodating holes may be formed to have a size of .

In the method of manufacturing the inspection socket according to the fourth embodiment, the insulating material is filled with the resin around the first through hole and the second through hole on one surface of the first base block and the other surface of the second base block. The method may further include forming the first and second depressions having a predetermined depth.

The first and second depressions may be integrated to include around the adjacent plurality of first and second through holes.

A test socket according to an embodiment of the present invention is provided. The test socket includes a signal probe for applying a test signal, a power probe for applying power, and a socket block made of a conductive material having a signal probe hole and a power probe hole for accommodating the signal probe and the power probe, respectively. An air layer is included in a portion between the outer peripheral surface and the inner wall of the signal probe hole, and an insulating layer is included between the outer peripheral surface of the power probe and the inner wall of the power probe hole.

In the method of manufacturing an inspection socket according to an embodiment of the present invention, after forming a bonding block by integrally bonding the base member and the probe support member, the probe receiving hole and the probe support hole in which the signal probes are accommodated are formed in a single process. The probe can be positioned on the central axis of the probe receiving hole, resulting in insertion loss, return loss, crosstalk or isolation, and Z-impedance. , inductance characteristics may be improved.

1 is a cross-sectional view showing an inspection socket according to a first embodiment of the present invention.
Figure 2 is a cross-sectional view showing the socket block of Figure 1;
3A to 3E are diagrams illustrating a method of manufacturing the test socket of FIG. 1 .
FIG. 4 is a cross-sectional view illustrating the gap plate of FIG. 2 .
5A to 5C are views illustrating a method of manufacturing a first junction block according to a first embodiment of the present invention.
6a to 6c are views showing a method of manufacturing a second junction block according to the first embodiment of the present invention.
7A to 7D are diagrams illustrating a method of manufacturing an inspection socket according to a second embodiment of the present invention.
8 is a cross-sectional view showing a socket block according to a third embodiment of the present invention.
9 is a cross-sectional view showing a socket block according to a fourth embodiment of the present invention.
10 is a cross-sectional view showing a socket block according to a fifth embodiment of the present invention.
11 is a cross-sectional view showing a socket block according to a sixth embodiment of the present invention.
12A to 12F are views showing a method of manufacturing the socket block of FIG. 11 .
13 to 16 are graphs comparing the insertion loss, return loss, isolation and Z-impedance characteristics of the prior art and the present invention, respectively.
17 is a view showing an inspection socket according to a seventh embodiment of the present invention.
FIG. 18 is a view showing a cross section taken along line AA of FIG. 17 .
19 is a diagram illustrating the socket block of FIG. 18 .
FIG. 20 is a view showing a cross section taken along line BB of FIG. 17 .
FIG. 21 is a view showing a cross section taken along line CC of FIG. 17 .
22 is a graph showing insertion loss when an air layer and a polymer layer (plastic layer) are respectively disposed between the signal probe and the inner wall surface of the signal probe hole of the socket block.
23 is a graph showing the return loss when an air (air) layer and a polymer (plastic) layer are respectively disposed between the signal probe and the inner wall surface of the signal probe hole of the socket block.
24 is a graph showing impedance when an air (air) layer and a polymer (plastic) layer are respectively disposed between the signal probe and the inner wall surface of the signal probe hole of the socket block.
25 is a graph showing Z-impedance when an air (air) layer and a polymer (plastic) layer are respectively disposed between the power probe and the inner wall surface of the power probe hole of the socket block.
26A to 26D are views illustrating a process of manufacturing the test socket of FIG. 17 .

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view showing an inspection socket 1 according to a first embodiment of the present invention.

Referring to FIG. 1 , the inspection socket 1 includes a socket block 2 and a plurality of probes, for example, a power probe 5 , a ground probe 6 , a signal probe or an RF probe (hereinafter, 'signal probe'). ) (7) may be included. The test socket 1 may include only one or two of the power probe 5 , the ground probe 6 , and the signal probe 7 .

The socket block 2 may include a first junction block 3 and a second junction block 4 .

The first bonding block 3 may include a first base member 31 and a first probe support member 32 integrally formed.

The first base member 31 may be made of a conductive material, for example, brass. The first base member 31 may be formed by coating an insulating material with a conductive material.

The first probe support member 32 includes a first power probe hole 21-1 and a first signal probe hole 23-1 for accommodating the power probe 5 and the signal probe 7 in the first base member, respectively. It may be integrally formed within. The first probe support member 32 may support one end of the power probe 5 and the signal probe 7 . The first probe support member 32 may be made of an insulating material, for example, engineering plastic.

The second bonding block 4 may be formed by integrally bonding the second base member 41 and the second probe support member 42 formed integrally. In this case, the bonding may be implemented with an adhesive sheet, an insert injection mold, or the like.

The second base member 41 may be made of a conductive material, for example, brass. The second base member 41 may be formed by coating an insulating material with a conductive material. The second base member 41 may have a smaller thickness than the first base member 31 .

The second probe support member 42 may support the other ends of the power probe 5 and the signal probe 7 . The second probe support member 42 may be made of an insulating material, for example, engineering plastic.

The second probe support member 42 includes a power probe hole insertion portion 421 inserted into the second power probe hole 21-2, and a signal probe hole insertion portion inserted into the second signal probe hole 23-2 ( 422 ) and a cover plate 423 covering the surface of the second base member 41 .

The power probe 5 is accommodated in a non-contact state with the first and second base members 31 and 41 , one end supported by the first probe support member 32 , and the other end supported by the second probe support member 42 . can be The power probe 5 may include a barrel 51 , a first plunger 52 , a second plunger 53 , and a spring (not shown). The first plunger 52 and the second plunger 53 are expandable and contractible along the longitudinal direction with a spring interposed therebetween, and partially protrude from the upper and lower surfaces of the socket block 2 between the power contact point of the subject and the power contact point of the test circuit. can be electrically connected.

The ground probe 6 may be supported in contact with the first and second base members 31 and 41 , and both ends may be supported so that both ends pass through the first and second probe support members 32 and 42 . The ground probe 6 may include a barrel 61 , a first plunger 62 , a second plunger 63 , and a spring (not shown). The first plunger 62 and the second plunger 63 are extendable and contractible along the longitudinal direction with a spring interposed therebetween, and partially protrude from the upper and lower surfaces of the socket block 2 between the grounding contact of the subject and the grounding contact of the test circuit. can be electrically connected.

The signal probe 7 is accommodated in a non-contact state with the first and second base members 31 and 41 , one end supported by the first probe support member 32 , and the other end supported by the second probe support member 42 . can be The signal probe 7 may include a barrel 71 , a first plunger 72 , a second plunger 73 , and a spring (not shown). The first plunger 72 and the second plunger 73 are extendable and contractible along the longitudinal direction with a spring interposed therebetween, and partially protrude from the upper and lower surfaces of the socket block 2 between the signal contact point of the subject and the signal contact point of the test circuit. can be electrically connected.

A gap plate 8 for aligning the positions of the plurality of probes 5, 6, 7 may be included between the first junction block 3 and the second junction block 4 .

The gap plate 8 has a power probe 5 , a ground probe 6 , a power hole 81 corresponding to the outer diameters of the barrels 51 , 61 , and 71 of the signal probe 7 , a ground hole 82 , and a signal hole (83) is formed.

The gap plate 8 may be made of an insulating material, for example, engineering plastic. The gap plate 8 may correct an alignment error when combining the first junction block 3 and the second junction block 4 .

The power probe 5, the ground probe 6, and the signal probe 7 are not limited to the above-described pogo type, and any telescopic probe can be applied.

FIG. 2 is a cross-sectional view showing the socket block 2 of FIG. 1 .

Referring to FIG. 2 , the socket block 2 may include first and second bonding blocks 31 and 41 . The socket block 2 includes a power probe hole 21 for accommodating the power probe 5 in a non-contact state, a ground probe hole 22 for accommodating the ground probe 6 in a contact state, and a signal probe 7 in a non-contact state. It may include a signal probe hole 23 for accommodating it.

The first bonding block 3 may include a first base member 31 and a first probe support member 32 bonded to each other. The second bonding block 4 may include a second base member 41 and a second probe support member 42 bonded to each other.

The power probe hole 21 may include first and second power probe holes 21-1 and 21-2 respectively formed in the first and second junction blocks 31 and 41 .

The first power probe hole 21-1 is a first power probe receiving hole 211 formed in the first base member 31 to receive a part of the power probe 5 in a non-contact state, and A first power probe support hole 212 formed in the first probe support member 32 to support one end may be included.

The second power probe hole 21-2 includes a second power probe receiving hole 213 and a power probe 5 formed in the second base member 41 to receive the remaining part of the power probe 5 in a non-contact state. It may include a second power probe support hole 214 formed in the second probe support member 42 to support the other end of the.

The first and second power probe receiving holes 211 and 213 are formed to vertically penetrate the first and second base members 31 and 41 with a diameter larger than the outer diameter of the barrel 51 of the power probe 5 . can be

The first power probe support hole 212 includes a first barrel support groove 2121 formed in the first probe support member 32 in a shape corresponding to one end of the barrel 51 of the power probe 5, It may include a first plunger passing hole 2122 that communicates with the one barrel support groove 2121 and is formed in the first probe support member 32 so that the first plunger 52 passes.

The second power probe support hole 214 includes a second barrel support groove 2141 formed in the second probe support member 42 in a shape corresponding to the other end of the barrel 51 of the power probe 5, It may include a second plunger passing hole 2142 that communicates with the two barrel support groove 2141 and is formed in the second probe support member 42 so that the second plunger 53 passes.

The ground probe hole 22 may include first and second ground probe holes 22-1 and 22-2 respectively formed in the first and second junction blocks 31 and 41 .

The first ground probe hole 22-1 may include a first ground probe receiving hole 221 formed in the first base member 31 to receive a part of the ground probe 6 in a contact state.

The second ground probe hole 22-2 includes a second ground probe receiving hole 223 formed in the second base member 41 to receive the remaining part of the ground probe 6 in a contact state, and the ground probe 6 ) may include a ground probe passing hole 224 formed in the second probe support member 42 to allow the second plunger 63 to pass therethrough.

The first and second ground probe accommodating holes 221 and 223 are formed in the first and second base members 31 and 41, respectively, so as to extend uniformly to the same diameter as the outer diameter of the barrel 61 of the ground probe 6 . The first and second barrel accommodating holes 2211,2231 and the first and second barrels respectively formed in the first and second base members 31 and 41 to accommodate both ends of the barrel 61 of the ground probe 6 . End accommodating grooves 2212 and 2232 may be included.

The second ground probe passing hole 224 communicates with the second plunger receiving hole 2233, and is formed in the second probe support member 42 so that the second plungers 62 and 63 of the ground probe 6 pass. can

The signal probe hole 23 may include first and second signal probe holes 23 - 1 and 23 - 2 respectively formed in the first and second junction blocks 31 and 41 .

The first signal probe hole 23-1 includes a first signal probe receiving hole 231 formed in the first base member 31 to accommodate a part of the signal probe 7 in a non-contact state, and the signal probe 7 A first signal probe support hole 232 formed in the first probe support member 32 to support one end may be included.

The second signal probe hole 23-2 includes a second signal probe receiving hole 233 and a signal probe 7 formed in the second base member 41 to accommodate the remaining part of the signal probe 7 in a non-contact state. It may include a second signal probe support hole 234 formed in the second probe support member 42 to support the other end of the.

The first and second signal probe receiving holes 231 and 233 are formed to vertically penetrate the first and second base members 31 and 41 with a diameter larger than the outer diameter of the barrel 71 of the signal probe 7 . can be

The first signal probe support hole 232 includes a first barrel support groove 2321 formed in the first probe support member 32 in a shape corresponding to one end of the barrel 71 of the signal probe 7, It may include a first plunger through hole 2322 that communicates with the one barrel support groove 2321 and is formed in the first probe support member 32 so that the first plunger 72 passes.

The second signal probe support hole 234 includes a second barrel support groove 2341 formed in the second probe support member 42 in a shape corresponding to the other end of the barrel 71 of the signal probe 7 ; It may include a second plunger passing hole 2342 formed in the second probe support member 42 to communicate with the second barrel support groove 2341 and to allow the second plunger 73 to pass therethrough.

3A to 3E are views illustrating a method of manufacturing the test socket 1 of FIG. 1 .

As shown in FIG. 3A, the first base member 31 has a first power probe hole 21-1, a first ground probe hole 22-1, and a first signal probe extending between the upper and lower surfaces in parallel. The ball 23 - 1 may be formed using, for example, the drill 100 . Similarly, the second base member 41 has a second power probe hole 21-2, a first ground probe hole 22-2, and a first signal probe hole 23-2 extending in parallel between the upper surface and the lower surface. ) may be formed using, for example, the drill 100 . The first and second base members 31 and 41 may be made of a conductive material, for example, brass.

3B, a predetermined depth from one surface of the first power probe hole 21-1 and the first signal probe hole 23-1 of the first base member 31 by, for example, an insert injection mold. A first probe support member 32 may be formed there. Similarly, the second probe is supported at a predetermined depth from one surface of the second power probe hole 21-2 and the second signal probe hole 23-2 of the second base member 41 by, for example, an insert injection mold. A member 42 may be formed. The first and second probe support members 32 and 42 may be made of an insulating material, for example, engineering plastic.

As shown in FIG. 3C , the first power probe support hole 212 and the first signal supported so as to expose one end of the power probe 5 and the signal probe 7 to the first probe support member 32 , respectively. A probe support hole 232 may be formed. Similarly, the second power probe support hole 214 and the second signal probe support hole 234 supported to the second probe support member 42 so that the other ends of the power probe 5 and the signal probe 7 are exposed to the outside. ) can be formed.

3D, the first and second power probe holes 21-1 and 21-2, the first and second ground probe holes 22-1 and 22-2, and the first and second signals After inserting the power probe 5, the ground probe 6 and the signal probe 7 into the probe holes 23-1 and 23-2, respectively, the first junction block 3 and the second junction block 4 For example, it may be coupled with a bolt or screw (not shown).

As described above, using the first and second signal probe receiving holes 231,233 in the first and second junction blocks 3 and 4, the first and second signal probe support holes 232 and 234 are formed in one process. Because of drilling, even if a large number of signal probe holes 23 are formed in the inspection socket 1, there is no error due to alignment. Therefore, the signal probe 7 can be supported to fit the central axis of the signal probe hole 23, and as a result, insertion loss, return loss, crosstalk or isolation , Z-impedance, and inductance characteristics may be improved.

FIG. 4 is a cross-sectional view showing the gap plate 8 of FIG. 2 .

As shown in FIG. 4 , the gap plate 8 made of an insulating material includes the barrel 51 of the power probe 5 , the barrel 61 of the ground probe 6 , and the barrel 71 of the signal probe 7 . A power hole 81 , a ground hole 82 , and a signal hole 83 corresponding to each outer diameter of may be formed by, for example, the drill 100 . As shown in FIG. 2 , the formed gap plate 8 may be interposed between the first bonding block 3 and the second bonding block 4 .

Hereinafter, a method for manufacturing the first and second bonding blocks 3 will be described in detail.

5A to 5C are views showing a method of manufacturing the first junction block 3 according to the first embodiment of the present invention.

As shown in FIG. 5A , for example, a first power probe hole 21-1, a first ground probe hole 22-1, and a first signal probe hole 23 are formed on the first base member 31 made of brass. -1) is drilled to form.

5B, for example, from the lower surface of the first base member 31, the first power probe hole 21-1, the first ground probe hole 22-1, and the first signal probe hole 23- 1) is filled with a mold member (34). At this time, the first power probe hole 21-1 and the first signal probe hole 23-1 of the first base member 31 leave a predetermined depth filled with the first probe support member 32, and The first ground probe hole 22-1 is completely covered with the mold member 34 . After that, for example, a resin of an insulating material is filled in the empty part not filled with the mold member 34, and a pressure of 160 kf/cm2 is applied at 430° C. for 3.5 seconds, for example, to the first base member 31. The first probe support member 32 is joined.

As shown in FIG. 5C , a first power probe support hole 212 and a first signal probe support hole 232 are drilled in the first probe support member 32 .

6A to 6C are views showing a method of manufacturing the second junction block 4 according to the first embodiment of the present invention.

As shown in FIG. 6A , for example, a second power probe hole 21-2, a second ground probe hole 22-2, and a second signal probe hole 23 are formed on the second base member 41 made of brass. -2) is drilled to form.

6B, for example, from the upper surface of the second base member 41, the second power probe hole 21-2, the second ground probe hole 22-2, and the second signal probe hole 23- 2) is filled with a filling mold member (34). At this time, in the second power probe hole 21-2 and the second signal probe hole 23-2 of the second base member 41, the portion filled with the second probe support member 42 is emptied to a predetermined depth. , the second ground probe hole (22-2) is completely blocked by the mold member (34). In addition, the mold cover 35 spaced apart from the lower surface of the second base member 41 at a predetermined interval is covered. After that, for example, an insulating material is filled in the empty part not filled with the mold member 34 and the space in the mold cover 35, for example, 430° C., for 3.5 seconds, by applying a pressure of 160 kf/cm2 , the second probe support member 42 is bonded to the first base member 31 .

As shown in FIG. 6C , a second power probe support hole 214 , a ground probe passage hole 224 , and a second signal probe support hole 234 are drilled in the second probe support member 42 .

7A to 7D are views showing a method of manufacturing the inspection socket 1 according to the second embodiment of the present invention.

As shown in FIG. 7A , a first probe support groove 317 is formed at a predetermined depth in a portion where the power probe 5 and the signal probe 7 are located on the upper surface of the first base member 31 . Similarly, the second probe support groove 318 is formed at a predetermined depth in the portion where the power probe 5 and the signal probe 7 are located on the lower surface of the second base member 41 using, for example, a drill 100. to form Here, the first and second probe support grooves 317 and 318 have a shape gradually narrowing toward the inlet.

As shown in FIG. 7B , the first and second probe support members 32 and 42 are formed by filling the first and second probe support grooves 317 and 318 with an insulating material, for example, engineering plastic by an insert injection mold. do.

As shown in FIG. 7C , the first and second power probe holes 21 - 1 and 2 - respectively in the first and second base members 31 and 41 and the first and second probe support members 32 and 42 , respectively. 2), first and second ground probe holes 22-1 and 22-2 and first and second signal probe holes 23-1 and 23-2 are formed.

7D, after inserting the power probe 5, the ground probe 6, and the signal probe 7 into the power probe hole 21, the ground probe hole 22, and the signal probe hole 23, respectively , by combining the first junction block 3 and the second junction block 4, the inspection socket 1 can be completed.

8 is a cross-sectional view showing the socket block 2 according to the third embodiment of the present invention.

Referring to FIG. 8 , the socket block 2 may include a first bonding block 3 and a second bonding block 4 coupled to each other.

The first bonding block 3 may be formed by integrally bonding the first base member 31 made of a conductive material and the first probe support member 32 made of an insulating material. The first probe support member 32 is formed inside the first power probe hole 21-1 and the first signal probe hole 23-1 on one surface of the first base member 31 by, for example, an insert injection mold. may be bonded to a predetermined depth.

The first probe support member 32 may support one end of the power probe 5 and the signal probe 7 to be exposed to the outside.

The second bonding block 4 may be formed by integrally bonding the second base member 41 made of a conductive material and the second probe support member 42 made of an insulating material. The second probe support member 42 is formed inside the second power probe hole 21-2 and the second signal probe hole 23-2 on one surface of the second base member 41 by, for example, an insert injection mold. may be bonded to a predetermined depth.

The second probe support member 42 may support the other ends of the power probe 5 and the signal probe 7 to be exposed to the outside.

A gap plate 8 for aligning the positions of the power probe 5 , the ground probe 6 , and the signal probe 7 may be included between the first junction block 3 and the second junction block 4 . have.

9 is a cross-sectional view showing the socket block 2 according to the fourth embodiment of the present invention.

Referring to FIG. 9 , the socket block 2 may include a first bonding block 3 and a second bonding block 4 coupled to each other.

The first bonding block 3 may be formed by integrally bonding the first base member 31 and the first probe support member 32 . Here, the bonding may be implemented by, for example, an insert injection mold.

The second bonding block 4 may be formed by integrally bonding the second base member 41 and the second probe support member 42 . Here, the bonding may be implemented with an adhesive sheet, an insert injection mold, or the like.

The first and second base members 31 and 41 may receive the power probe 5 and the signal probe 7 in a non-contact state, and receive the ground probe 6 in a contact state.

The first and second base members 31 and 41 may be made of a conductive material, for example, brass. The second base member 41 may have a smaller thickness than the first base member 31 .

The first and second probe support members 32 and 42 may support both ends of the power probe 5 , the ground probe 6 , and the signal probe 7 to be exposed on the upper and lower surfaces of the socket block 2 .

The first and second probe support members 32 and 42 may be made of an insulating material, for example, engineering plastic.

The first and second probe support members 32 and 42 are the power probe hole insertion portions 321 and 421 inserted into both ends of the power probe hole 21, and the power probe hole insertion portions 321 and 421 extending radially from the first and second probe support members 32 and 42. It may include first and second joint portions 322 and 422 and first and second cover plates 323,423 covering surfaces of the first and second base members 31 and 41 . The cross-sectional area of the first and second joint portions 322 and 422 is gradually decreased toward the first and second cover plates 323,423, so that the first and second cover plates 323,423 are connected to the first and second base members 31 and 41 . ) can be firmly attached to

A gap plate 8 for aligning the positions of the power probe 5 , the ground probe 6 , and the signal probe 7 may be included between the first junction block 3 and the second junction block 4 . have.

10 is a cross-sectional view showing the socket block 2 according to the fifth embodiment of the present invention.

Referring to FIG. 10 , the socket block 2 may include a bonding block 3 and a cover member 9 .

The bonding block 3 may be formed by integrally bonding the base member 31 made of a conductive material such as brass and the probe support member 32 made of an insulating material such as engineering plastics, for example. The probe support member 32 may be joined to a predetermined depth inside the power probe hole 21 and the signal probe hole 23 on one surface of the base member 31 by, for example, an insert injection mold.

The probe support member 32 may support one end of the power probe 5 and the signal probe 7 to be exposed to the outside.

The cover member 9 may be coupled to the back surface of the base member 31 using screws, bolts, or the like. The cover member 9 may be made of, for example, engineering plastic.

The cover member 9 may support the other ends of the power probe 5 and the signal probe 7 to be exposed to the outside.

A gap plate 8 for aligning the positions of the power probe 5 , the ground probe 6 , and the signal probe 7 may be included between the bonding block 3 and the cover member 4 .

11 is a cross-sectional view showing the socket block 2 according to the sixth embodiment of the present invention.

Referring to FIG. 11 , the socket block 2 may include a base block 2-1, a first junction block 2-2, and a second junction block 2-3.

The base block 2-1 may be made of a conductive material, for example, brass. The base block 2-1 has a power probe accommodating hole 211, a ground probe accommodating hole 221, and a signal probe accommodating hole accommodating the power probe 5, the ground probe 6, and the signal probe 7, respectively. (231).

The first bonding block 2-1 may include a first base member 31 and a first probe support member 32 that are integrally joined. The first junction block 2-1 may support one end of the power probe 5 and the signal probe 7 to be exposed to the outside.

The first base member 31 may be made of a conductive material, for example, brass. The first base member 31 is a first plunger through which the first probe support part hole 311 into which the first probe support member 32 is integrally inserted and joined and the first plunger 62 of the ground probe 6 pass through. A through hole 312 may be formed.

The first probe support member 32 may be made of an insulating material, for example, engineering plastic. The first probe support member 32 may include a first power probe support hole 212 and a first signal probe support hole 232 .

The second bonding block 2-3 may include a second base member 41 and a second probe support member 42 that are integrally joined. The second junction block 2-2 may support the power probe 5 and the other ends of the signal probe 7 to be exposed to the outside.

The second base member 41 may be made of a conductive material, for example, brass. The second base member 41 is a second plunger through which the second probe support hole 313 into which the second probe support member 42 is integrally inserted and joined and the second plunger 63 of the ground probe 6 pass. A through hole 314 may be formed.

The second probe support member 42 may be made of an insulating material, for example, engineering plastic. The second probe support member 42 may include a second power probe support hole 213 and a second signal probe support hole 233 .

12A to 12F are views showing a method of manufacturing the socket block 2 of FIG. 11 .

As shown in FIG. 12A , a power probe receiving hole 211 , a ground probe receiving hole 221 and a signal probe receiving hole 231 passing through the upper and lower surfaces of the base block 2-1 made of a conductive material are drilled.

As shown in FIG. 12B , a first probe support hole 311 and a first plunger passage hole 312 penetrating through the upper and lower surfaces of the first base member 31 made of a conductive material are drilled. Similarly, a second probe support hole 313 and a second plunger passage hole 314 passing through the upper and lower surfaces of the second base member 41 made of a conductive material are drilled.

As shown in FIG. 12C , the second probe support member 32 is formed by inserting an insulating resin into the first probe support hole 311 by, for example, an insert injection mold. Similarly, the second probe support member 42 is formed by inserting an insulating resin into the second probe support hole 313 by, for example, an insert injection mold.

As shown in FIG. 12D , a first power probe support hole 212 and a first signal probe support hole 232 are drilled in the first probe support member 32 . At this time, the formation of the first power probe support hole 212 and the first signal probe support hole 232 is to firmly secure the base block 2-1 and the first base member 31 by means of a bolt 111, for example. In the tightly coupled state, the power probe accommodating hole 211, the ground probe accommodating hole 221 and the signal probe accommodating hole 231 are performed.

As shown in FIG. 12E , a second power probe support hole 213 and a second signal probe support hole 233 are drilled in the second probe support member 42 . At this time, the formation of the second power probe support hole 213 and the second signal probe support hole 233 is to firmly secure the base block 2-1 and the second base member 41 by means of a bolt 111, for example. In the tightly coupled state, it is performed through the power probe receiving hole 211 , the ground probe receiving hole 221 and the signal probe receiving hole 231 .

12F, the power probe 5, the ground probe 6, and the signal probe 7 are inserted into the power probe receiving hole 211, the ground probe receiving hole 221, and the signal probe receiving hole 231. After that, the first junction block 2-2 and the second junction block 92-3 are coupled to the upper and lower surfaces of the base block 2-1 by using the bolts 111 .

13 to 16 show an insertion loss characteristic, a return loss characteristic, an isolation characteristic, and a Z-impedance characteristic of the test socket 1 according to the prior art and the present invention. It is a graph showing the comparison.

The insertion loss is ideally zero. Referring to FIG. 13 , it can be seen that, based on the allowable insertion loss (-1.0 dB), the prior art exceeds the standard at about 22.0 GHz, while the present invention exhibits a very good insertion loss characteristic at about 45.2 GHz. can

It is desirable that the return loss be as small as possible. Referring to FIG. 14 , based on the allowable return loss (-10 dB), it can be seen that the prior art exceeds the standard at about 17.1 GHz, while the present invention exhibits a very good return loss characteristic at about 46.5 GHz.

It is desirable that the isolation characteristics be as small as possible. Referring to FIG. 15 , based on the allowable isolation characteristic (-40 dB), the prior art exceeds the standard for the allowable isolation characteristic (-40 dB) at about 24.4 GHz, while the present invention is somewhat superior and changes to about 27.0 GHz. It can be seen that there is little

It is desirable that the Z-impedance be as small as possible. Referring to FIG. 16 , based on the allowable Z-impedance (1 GHz), it can be seen that the prior art shows about 0.9 Ω, while the present invention is superior with about 0.9 Ω.

Figure 17 is a view showing the inspection socket 1 according to the seventh embodiment of the present invention, Figure 18 is a view showing a cross section taken along line AA of Figure 17, Figure 19 is the socket block (2) of Figure 18 FIG. 20 is a view showing a cross section taken along line BB of FIG. 17 , and FIG. 21 is a view showing a cross section taken along line CC of FIG. 17 .

Referring to FIG. 17 , the inspection socket 1 may include a socket block 2 made of a conductive material, a signal probe 5 supported by the socket block 2 , a ground probe 6 , and a power probe 7 . can

18 and 19 , the socket block 2 may include a first base block 31 and a second base block 41 .

The socket block 2 may have a power probe hole 21 , a ground probe hole 22 , and a signal probe hole 23 .

The power probe hole 21 may include first and second power probe holes 21-1 and 21-2 respectively formed in the first base block 31 and the second base block 41 .

The ground probe hole 22 may include first and second ground probe holes 22-1 and 22-2 respectively formed in the first base block 31 and the second base block 41 .

The signal probe hole 23 may include first and second signal probe holes 23 - 1 and 23 - 2 respectively formed in the first base block 31 and the second base block 41 .

The socket block 2 has first and second recessed portions 211-1 and 211-2 around which the power probes (7 in FIG. 18) protrude from upper and lower surfaces, and third and fourth from which the signal probes 5 protrude. It may include depressions 231-1,231-2.

The first and second recessed portions 211-1 and 211-2 may have a horizontal cross-sectional area larger than a horizontal cross-sectional area of the first and second power probe holes 21-1 and 21-2. As a result, a first locking jaw 212-1 is formed between the first recessed part 211-1 and the first power probe hole 21-1, so that the first power probe support part 31-2 is connected to the first It may be supported so as not to be drawn out from the base block 31 . In addition, a second locking jaw 212-2 is formed between the second recessed part 211-2 and the second power probe hole 21-2, so that the second power probe support part 41-2 is connected to the second base. It may be supported so as not to be drawn out from the block 41 .

Similarly, the third and fourth recessed portions 231-1,231-2 may have a horizontal cross-sectional area larger than the horizontal cross-sectional area of the first and second signal probe holes 23-1 and 23-2. As a result, a third locking protrusion 232-1 is formed between the third recessed part 231-1 and the first signal probe hole 23-1, so that the first signal probe support part 31-1 is connected to the first signal probe hole 23-1. It may be supported so as not to be drawn out from the base block 31 . In addition, a fourth locking jaw 232-2 is formed between the fourth recessed part 231-2 and the second signal probe hole 23-2, so that the second signal probe support part 41-1 is connected to the second base. It may be supported so as not to be drawn out from the block 41 .

The socket block 2 includes first and second signal probe support parts 31-1 and 41-1 and first and second power probe support parts formed on the first base block 31 and the second base block 41. 31-2,41-2).

As shown in FIG. 17 , the first power probe support part 31-2 may be formed to be integrated around two or more power probes 7 arranged adjacently. As a result, as described above, the insulating power probe support part 31-2 prevents the terminal provided on the test object from contacting the conductive socket block 2 during the inspection, thereby preventing a short circuit. Similarly, the second power probe support part 41-2 and the first and second signal probe support parts 31-1 and 41-1 are connected around two or more power probes 7 or signal probes 5 adjacent to each other. It can be formed to be integrated into one.

The first and second signal probe support parts 31-1 and 41-1 are first and second formed on the first base block 31 and the second base block 41, respectively, as shown in FIGS. 18 and 20 . It may be formed at the upper end and lower end in the signal probe hole (23-1, 23-2). In this way, an air layer may be provided between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 .

The first and second power probe support parts 31-2 and 41-2 are first and second formed on the first base block 31 and the second base block 41, respectively, as shown in FIGS. 18 and 21 . It may be formed in the power probe holes 21-1 and 21-2. In this way, a polymer (plastic) layer may be provided between the power probe 7 and the inner wall surface of the power probe hole 21 of the socket block 2 .

22 is an insertion loss when an air layer and a polymer layer (plastic layer) are respectively disposed between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 It is a graph.

22, the insertion loss when the air layer is disposed between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 is -0.09 (dB) at 20 GHz, and the polymer layer The insertion loss in this arrangement is -0.91 (dB) at 20 GHz. Since it is desirable to design the insertion loss close to 0 (dB), an air layer is preferably provided between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 .

23 is a graph showing a return loss when an air layer and a polymer (plastic) layer are respectively disposed between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 am.

23, between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2, the return loss when the air layer is disposed is -20 (dB) at 20 GHz, and the poly layer The insertion loss in this arrangement is -7.5 (dB) at 20 GHz. Since it is preferable that the return loss is smaller, an air layer is preferably provided between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 .

24 is a graph showing impedance when an air layer and a polymer (plastic) layer are respectively disposed between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 .

24, between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2, the minimum impedance for 200 ps when the air layer is disposed is 48.3 Ω, and the poly layer is disposed The minimum impedance for 200 ps when Since it is desirable to keep the impedance constant at 50Ω, it is preferable that an air layer be provided between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 .

As described above, providing an air layer between the signal probe 5 and the inner wall surface of the signal probe hole 23 of the socket block 2 is superior in terms of insertion loss, return loss and impedance than disposing a polymer layer. .

Therefore, when the inspection socket is manufactured, the polymer resin filled in the signal probe hole 23 of the socket block 2 can be removed except for the portion supporting both ends of the signal probe 5 .

25 is a graph showing Z-impedance when an air layer and a polymer (plastic) layer are respectively disposed between the inner wall surface of the power probe hole 21 of the power probe 7 and the socket block 2 .

Referring to FIG. 25 , between the power probe 7 and the inner wall surface of the power probe hole 21 of the socket block 2, the Z-impedance when the air layer is disposed is 0.71Ω at 1 [GHz], and the poly The Z-impedance when the layers are placed is 0.64Ω at 1 [GHz). Since it is preferable that the Z-impedance is smaller, a polymer layer is preferably provided between the power probe 7 and the inner wall surface of the power probe hole 21 of the socket block 2 .

Therefore, when manufacturing the inspection socket, the polymer resin filled in the power probe hole 21 of the socket block 2 removes only the portion corresponding to the outer surface of the power probe 7 so that the power probe 7 comes into contact with the polymer layer. can make it

26A to 26D are views illustrating a process of manufacturing the inspection socket 1 of FIG. 17 .

26A, for example, the first base block 31 and the second base block 41 made of a conductive material such as brass may be provided.

26B, the first and second ground probe holes 22-1 and 22-2 corresponding to the outer surface of the ground probe 6 in the first base block 31 and the second base block 41, respectively, power The first and second through-holes 210-1 and 210-2 having an inner diameter greater than the outer diameter of the probe 7, and third and fourth through-holes 230-1 and 230-2 having an inner diameter greater than the outer diameter of the signal probe 5 ) can be machined, for example drilling.

The first to fourth through-holes 211-1, 210-2, 230-1,230-2 are each larger than the first to fourth recessed areas in the horizontal direction of the first to fourth through-holes 210-1, 210-2, 230-1 and 230-2, respectively. It may include parts 211-1, 211-2, and 231-1,231-2. In addition, the first to fourth through-holes 211-1, 210-2, 230-1, and 230-2 are between the first through-hole 210-1 and the first recessed portion 211-1, respectively, and the second through-hole 210- 2) and between the second recessed part 211-2, between the third through hole 230-1 and the third recessed part 231-1, and between the fourth through hole 230-2 and the fourth recessed part ( 231-2) between the first to fourth plunger holes (212-1, 212-2, 232-1, 232-2) may be included.

In FIG. 26C, insert injection or injection of a liquid resin so that a polymer resin, for example, an epoxy resin, is filled in the first to fourth through holes 210-1,210-2,230-1,230-2 of FIG. 26B can be cured have.

In FIG. 26D , the polymer resin in the first and second through holes 210 - 1 and 210 - 2 may be processed, for example, drilled into a shape corresponding to the outer surface of the power probe 7 .

In addition, the polymer resin in the third and fourth through-holes 230-1 and 230-2 includes the outer peripheral surface of the signal probe 5 (the outer peripheral surface of the barrel 51) and the third and fourth through-holes 230-1 and 230-2. You can remove everything in between.

Finally, the signal probe 5, the ground probe 6 and the power probe 7 are connected to the first and second signal probe holes 23-1 and 23-2 of the first and second base blocks 31 and 41. ), the first and second ground probe holes 22-1 and 22-2, and the first and second power probe holes 21-1 and 21-2 after insertion into the first and second base blocks 31 , 41), it is possible to manufacture the inspection socket (1).

According to various embodiments of the present invention, the process of FIG. 26C may be omitted and insert injection may be performed directly in the shape shown in 26D.

In the foregoing specification, the invention and its advantages have been described with reference to specific embodiments. However, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. Accordingly, the specification and drawings are to be regarded as illustrative of the invention rather than limiting. All such possible modifications should be made within the scope of the present invention.

1: Inspection socket
2: socket block
21, 21-1, 21-2: Power probe ball
212,213: power probe support hole
22, 22-1, 22-2: ground probe hole
222,224: ground probe through hole
23, 23-1, 23-2: signal probe hole
232,234: signal probe support hole
3: first junction block
31: base member
312: cover
313, 314, 315: joint groove
316: jointer
32: first insulating member
33: adhesive sheet
34: mold member
35: mold cover
4: second junction block
41: second base block
42: second insulating member
5: Power probe
6: Ground probe
7: Signal probe
8: gap plate
9: Cover member
100: drill

Claims (17)

A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction, the method comprising:
forming a probe hole for accommodating the probe on a base member made of a conductive material;
Forming a probe support member by filling the probe hole with a resin of an insulating material to a predetermined depth from the upper surface of the base member; And
and forming a first support hole for supporting one end of the probe to be exposed on the probe support member in the probe hole. The method of claim 1,
The step of filling the resin,
disposing a mold cover spaced apart from one surface of the base member at a predetermined distance; and
and filling the spaced apart intervals and the probe holes with resin. The method of claim 1,
The method of manufacturing an inspection socket in which the resin is partially filled in the probe hole to a predetermined depth from one surface of the base member. The method of claim 1,
The method of manufacturing an inspection socket including a through hole in which the base member penetrates in a thickness direction and the resin is filled. The method of claim 1,
forming a second support hole in the cover member made of an insulating material to support the other end of the probe to be exposed;
inserting the probe into the probe hole and supporting both ends of the probe in the first and second support holes; and
The method of manufacturing an inspection socket further comprising the step of coupling the cover member to the lower surface of the base member. 6. The method of claim 5,
The method of manufacturing an inspection socket further comprising the step of interposing a gap plate between the base member and the cover member. The method of claim 1,
The probe hole is a method of manufacturing a test socket including a protrusion protruding toward the center at a position where the probe support portion is formed. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction, the method comprising:
forming a support hole to a predetermined depth at a position where the probe is disposed on one surface of the base member made of an insulating material;
forming a probe support portion by filling the support hole with an insulating resin; and
and forming a probe accommodating hole for accommodating the probe in the base member at a position corresponding to the support hole, and forming a first support hole in which one end of the probe is supported in the probe support part. Way. 9. The method of claim 8,
forming a second support hole for supporting the other end of the probe in a cover member made of an insulating material;
inserting the probe into the probe receiving hole and supporting one end and the other end of the probe in the first and second support holes, respectively; and
The method of manufacturing an inspection socket further comprising the step of coupling the cover member to the other surface of the base member. 9. The method of claim 8,
forming a second support hole to a predetermined depth at a position where the probe is disposed on one surface of a second base member made of an insulating material;
forming a second probe support part by filling the hole of the second support part with a resin of an insulating material; and
A second probe receiving hole for accommodating the probe is formed in the second base member at a position corresponding to the second support hole, and a second support hole through which the other end of the probe is supported is formed in the second probe supporting portion. to do;
inserting the probe into the probe receiving hole and the second probe receiving hole and supporting one end and the other end of the probe in the supporting hole and the second supporting hole, respectively; and
and coupling the other surface of the second base member to the other surface of the base member. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction, the method comprising:
forming a probe receiving hole for accommodating the probe in a base block made of a conductive material;
forming first and second probe support holes for supporting both ends of the probe, respectively, on the first and second base members made of a conductive material;
forming first and second probe support parts by filling the holes of the first and second probe support parts with an insulating material;
forming first and second support holes for supporting both ends of the probe to be exposed on the first and second probe support portions; and
Inserting the probe into the probe receiving hole and supporting both ends of the probe in the first and second support holes, respectively, coupling the first base member and the second base member to upper and lower surfaces of the base block A method of manufacturing an inspection socket. A method of manufacturing a test socket for supporting a probe that is stretchable in the longitudinal direction, the method comprising:
forming at least one first through hole penetrating through the first base block of a conductive material in a thickness direction;
forming at least one second through-hole penetrating through the second base block in a thickness direction in a conductive material;
filling each of the first and second through-holes with an insulating material resin;
forming first and second probe receiving holes for accommodating one side and the other side of the probe in the resin of an insulating material of the first and second through holes;
inserting the probe into the first and second probe receiving holes so that both ends partially protrude from one surface of the first base block and the other surface of the second base block; and
and coupling the other surface of the first base block and one surface of the second base block to each other. 13. The method of claim 12,
The probe includes a signal probe for applying a test signal,
The forming of the first and second probe receiving holes includes forming the first and second probe receiving holes so that an air layer is formed in a portion between the outer peripheral surface of the signal probe and the inner wall of the first and second through holes. A method of manufacturing an inspection socket that is formed to be larger than the outer diameter of the signal probe. 13. The method of claim 12,
The probe includes a power probe for applying power,
The forming of the first and second probe accommodating holes includes forming the first and second probe accommodating holes with sizes corresponding to the outer diameters of the power probes so that the outer peripheral surfaces of the power probes are in contact with the first and second probe supports. A manufacturing method of the forming inspection socket. 13. The method of claim 12,
Forming first and second depressions having a predetermined depth in which the insulating material is filled with the resin around the first through hole and the second through hole on one surface of the first base block and the other surface of the second base block Method of manufacturing a test socket further comprising a. 16. The method of claim 15,
The method of manufacturing a test socket in which the first and second recessed portions are integrated to include around the adjacent plurality of first and second through-holes. In the inspection socket,
a signal probe for applying a test signal;
a power probe for applying power; and
and a socket block made of a conductive material having a signal probe hole and a power probe hole for accommodating the signal probe and the power probe, respectively,
An air layer is included in a portion between the outer peripheral surface of the signal probe and the inner wall of the signal probe hole,
and an insulating layer between an outer peripheral surface of the power probe and an inner wall of the power probe hole.

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