KR20210103947A - ceramic back cover for mobile device and manufacturing method thereof - Google Patents
ceramic back cover for mobile device and manufacturing method thereof Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 125
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 238000012545 processing Methods 0.000 claims abstract description 11
- 238000010304 firing Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 31
- 238000000465 moulding Methods 0.000 claims description 18
- 230000003014 reinforcing effect Effects 0.000 claims description 15
- 239000012298 atmosphere Substances 0.000 claims description 13
- 238000007517 polishing process Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000005341 toughened glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920004439 Aclar® Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- H04M—TELEPHONIC COMMUNICATION
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- H04M1/02—Constructional features of telephone sets
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Abstract
Description
본 발명은 모바일용 세라믹 백커버 및 이의 제조방법에 관한 것으로, 더욱 상세하게는 세라믹 형상의 제어가 유리하고, 유전율 제어가 가능할 뿐만 아니라, 가공성이 우수한 모바일용 세라믹 백커버 및 이의 제조방법에 관한 것이다.The present invention relates to a ceramic back cover for mobile and a method of manufacturing the same, and more particularly, to a ceramic back cover for mobile that is advantageous in controlling the shape of the ceramic, controllable dielectric constant, and excellent workability, and a method of manufacturing the same .
모바일 디바이스는 각종 전자부품을 내장하고 전면에는 터치스크린 등의 액정이 장착된 바디로 구성되고, 바디의 후면에 배터리가 결합이 된다.The mobile device is composed of a body equipped with various electronic components and a liquid crystal such as a touch screen on the front, and a battery is combined on the back of the body.
그리고, 바디의 후면 및 배터리를 보호하기 위한 백 커버(back cover)가 결합되어 외장을 형성한다.In addition, a back cover for protecting the rear surface of the body and the battery is combined to form an exterior.
종래 메탈 소재였던 모바일 디바이스의 백 커버는 최근 세라믹 소재가 주로 이용되고 있다.The back cover of a mobile device, which was a conventional metal material, is recently mainly made of a ceramic material.
세라믹 소재로 진화하게 된 이유는 내구성, 내부식성 및 내마모성이 우수하고, 열의 분산 및 방출 또한 우수하며, 메탈 소재에 대비하여 무선 충전 효율이 좋기 때문이다.The reason for evolving into a ceramic material is that it has excellent durability, corrosion resistance and abrasion resistance, excellent heat dissipation and dissipation, and good wireless charging efficiency compared to metal materials.
또한, 사용자에 주는 미적 이미지를 향상시키는 역할도 한다.It also serves to enhance the aesthetic image given to the user.
기존에 세라믹을 이용한 모바일 디바이스용 백 커버는 세라믹 분말(ceramic power)에 폴리머(polymer)를 혼합(blend)하는 믹싱(mixing) 작업 후, 분말 프레스 또는 CIM(Ceramic Injection Molding)에 의해 벌크 성형하고, 벌크 성형된 상태에서 바인더(binder)를 제거(burn out) 한 후 소성(sintering)하는 공정에 의한다. 그 후 CNC 가공 등에 의한 가공 후 광택 연마 작업을 통해서 최종적으로 백 커버를 제조하게 된다.Existing back covers for mobile devices using ceramics are bulk-molded by powder press or CIM (Ceramic Injection Molding) after a mixing operation of blending a polymer with ceramic power, It is by a process of removing (burn out) the binder in the bulk-molded state and then sintering. After that, the back cover is finally manufactured through a polished polishing operation after machining by CNC machining or the like.
이러한 기존의 세라믹을 이용한 백 커버는 성형을 진행한 후에 소성 및/또는 가공 과정을 진행하기 때문에, 세라믹의 형상 제어가 어려울 뿐만 아니라 유전율 제어의 한계가 있고, 가공이 어렵고 가공 시간이 오래 걸리는 한계가 있다.Since the conventional back cover using such a ceramic undergoes a firing and/or processing process after molding, it is difficult to control the shape of the ceramic, but also has a limit in controlling the dielectric constant, and it is difficult to process and takes a long processing time. have.
따라서, 모바일용 세라믹 백커버를 제조하는데 있어서, 세라믹 형상의 제어가 유리하고, 유전율 제어가 가능할 뿐만 아니라, 가공성이 우수하고, 내구성이 우수할 뿐만 아니라, 생산 단가를 절감할 수 있는 기술의 개발이 절실한 실정이다.Therefore, in manufacturing the ceramic back cover for mobile, it is advantageous to control the ceramic shape, control the dielectric constant, and have excellent processability and durability, as well as the development of a technology that can reduce the production cost. It is an urgent situation.
본 발명은 상기와 같은 점을 감안하여 안출한 것으로, 세라믹을 이용하여 모바일용 세라믹 백커버를 제조하는데 있어서, 평판형 세라믹 시트를 소성함으로서 세라믹 형상의 제어가 유리하고, 유전율 제어가 가능할 뿐만 아니라, 평판형 세라믹 시트를 가공함으로서 가공성이 우수한 모바일용 세라믹 백커버 제조방법을 제공하는데 그 목적이 있다.The present invention has been devised in view of the above points, and in manufacturing a ceramic back cover for mobile using ceramic, by firing a flat ceramic sheet, it is advantageous to control the ceramic shape and to control the dielectric constant, An object of the present invention is to provide a method for manufacturing a ceramic back cover for mobile use with excellent workability by processing a flat ceramic sheet.
또한, 본 발명은 세라믹 시트가 소성된 상태에서도 곡면 성형이 용이한 모바일용 세라믹 백커버 제조방법을 제공하는데 다른 목적이 있다.In addition, another object of the present invention is to provide a method of manufacturing a ceramic back cover for mobiles, which is easy to form a curved surface even in a state in which the ceramic sheet is fired.
또한, 본 발명은 모바일용 세라믹 백커버의 제조방법을 단순화함으로서 생산 단가를 절감할 수 있을 뿐만 아니라, 세라믹의 취성의 한계를 극복함으로서 내구성을 보다 향상시킨 모바일용 세라믹 백커버 제조방법을 제공하는데 또 다른 목적이 있다.In addition, the present invention provides a method of manufacturing a ceramic back cover for mobile that can reduce the production cost by simplifying the manufacturing method of the ceramic back cover for mobile, and further improve durability by overcoming the limit of brittleness of ceramic. There is another purpose.
상술한 과제를 해결하기 위하여 본 발명은 평판형 세라믹 시트를 준비하는 제1단계; 상기 세라믹 시트를 소성하는 제2단계; 상기 소성한 세라믹 시트를 가공하는 제3단계; 및 상기 가공한 세라믹 시트의 가장자리 일부분을 곡면 성형하는 제4단계; 를 포함하는 모바일용 세라믹 백커버 제조방법을 제공한다.In order to solve the above problems, the present invention provides a first step of preparing a flat ceramic sheet; a second step of firing the ceramic sheet; a third step of processing the fired ceramic sheet; and a fourth step of forming a curved surface of a portion of an edge of the processed ceramic sheet; It provides a method of manufacturing a ceramic back cover for mobile comprising a.
또한, 제3단계의 가공은 표면광택 공정 및 연마 공정 중에서 선택된 1종 이상의 공정을 수행할 수 있다.In addition, the processing of the third step may be performed by at least one process selected from a surface polishing process and a polishing process.
또한, 제4단계의 곡면 성형은 900 ~ 1500℃의 온도에서 5 ~ 100분동안 수행할 수 있다.In addition, the curved surface molding in the fourth step may be performed at a temperature of 900 ~ 1500 ℃ for 5 ~ 100 minutes.
또한, 제4단계의 곡면 성형은 환원 분위기 하에서 흑연(graphite) 몰드 또는 산화 분위기 하에서 알루미나(alumina mold) 몰드를 사용하여 하중가압 또는 정수압프레스(warm isostatic press)로 곡면 성형할 수 있다.In addition, the curved surface molding in the fourth step may be performed using a graphite mold under a reducing atmosphere or an alumina mold under an oxidizing atmosphere, and the curved surface may be formed by a load pressure or a warm isostatic press.
또한, 제1단계와 제2단계 사이에, 세라믹 시트에 포함된 바인더를 번 아웃(burn out)하는 바인더 제거단계; 를 더 포함할 수 있다.In addition, between the first step and the second step, a binder removal step of burning out the binder included in the ceramic sheet; may further include.
또한, 본 발명의 모바일용 세라믹 백커버 제조방법은 곡면 성형한 세라믹 시트에 강화 부재를 이종 접합하는 제5단계; 를 더 포함할 수 있다.In addition, the method for manufacturing a ceramic back cover for mobile of the present invention includes a fifth step of heterogeneously bonding a reinforcing member to a curved ceramic sheet; may further include.
또한, 이종 접합은 100 ~ 1000℃의 온도, 1 ~ 100kgf/cm2의 압력에서 1 ~ 60 분동안 수행할 수 있다.In addition, the heterojunction can be performed for 1 to 60 minutes at a temperature of 100 ~ 1000 ℃, and a pressure of 1 ~ 100kgf / cm 2 .
또한, 강화부재는 강화 유리, 폴리머, 메탈 및 앞서 언급한 세라믹 시트와 다른 이종 세라믹 물질 중에서 선택된 1종 이상을 포함할 수 있다.In addition, the reinforcing member may include at least one selected from tempered glass, polymer, metal, and a different type of ceramic material different from the aforementioned ceramic sheet.
또한, 세라믹 시트는 표면이 개질되어 있을 수 있다.Also, the surface of the ceramic sheet may be modified.
또한, 세라믹 시트는 0.05 ~ 0.3 mm의 두께는 가질 수 있다.In addition, the ceramic sheet may have a thickness of 0.05 to 0.3 mm.
또한, 강화 부재는 0.15 ~ 0.4 mm의 두께를 가질 수 있다.In addition, the reinforcing member may have a thickness of 0.15 to 0.4 mm.
또한, 제4단계의 곡면 성형은 질소 분위기 하에서 흑연(graphite) 몰드를 사용하여 800g의 누름하중을 가하는 정수압프레스(warm isostatic press)로 곡면 성형을 수행할 시, 900 ~ 1100℃의 온도에서 180 ~ 220분간 수행되는 제1온도유지구간과, 상기 제1온도유지구간 후 1150 ~ 1500℃의 온도에서 15 ~ 100분동안 수행되는 제2온도유지구간을 포함할 수 있다.In addition, the curved surface molding in the fourth step is performed using a graphite mold under a nitrogen atmosphere with a warm isostatic press that applies a pressing load of 800 g, 180 ~ at a temperature of 900 ~ 1100 ° C. It may include a first temperature maintaining period performed for 220 minutes, and a second temperature maintaining period performed for 15 to 100 minutes at a temperature of 1150 to 1500° C. after the first temperature maintaining period.
또한, 제1온도유지구간에서 제2온도유지구간까지 승온속도는 5.0 ~ 15.0℃/min일 수 있다.In addition, the temperature increase rate from the first temperature maintaining section to the second temperature maintaining section may be 5.0 ~ 15.0 °C / min.
한편, 본 발명은 앞서 설명한 본 발명의 모바일용 세라믹 백커버 제조방법으로 제조된 모바일용 세라믹 백커버를 포함한다.On the other hand, the present invention includes a ceramic back cover for mobile manufactured by the method of manufacturing the ceramic back cover for mobile of the present invention described above.
본 발명에 의하면, 세라믹을 이용하여 모바일용 세라믹 백커버를 제조하는데 있어서, 평판형 세라믹 시트를 소성함으로서 세라믹 형상의 제어가 유리하고, 유전율 제어가 가능할 뿐만 아니라, 평판형 세라믹 시트를 가공함으로서 가공성이 우수하다.According to the present invention, in manufacturing a ceramic back cover for mobile using a ceramic, it is advantageous to control the ceramic shape by firing the flat ceramic sheet, and not only the dielectric constant can be controlled, but also the workability is improved by processing the flat ceramic sheet. great.
또한, 본 발명은 최적 조건으로 소성된 세라믹 시트가 곡면 형상을 가지도록 성형하기 때문에, 세라믹 시트가 소성된 상태에서도 곡면 성형이 용이하다.In addition, in the present invention, since the ceramic sheet fired under optimum conditions is formed to have a curved shape, it is easy to form a curved surface even in a fired state of the ceramic sheet.
또한, 본 발명은 모바일용 세라믹 백커버의 제조방법을 단순화함으로서 생산 단가를 절감할 수 있을 뿐만 아니라, 세라믹에 강화 부재를 이종 접합함으로서 세라믹의 취성의 한계를 극복함으로서 내구성이 우수하다.In addition, the present invention can not only reduce the production cost by simplifying the manufacturing method of the ceramic back cover for mobile use, but also has excellent durability by overcoming the limit of brittleness of the ceramic by heterogeneously bonding the reinforcing member to the ceramic.
도 1은 본 발명의 일실시예에 따른, 모바일용 세라믹 백커버 제조방법의 제4단계의 곡면 성형을 하기 전에 세라믹 시트를 나타낸 도면,
도 2는 본 발명의 일실시예에 따른, 모바일용 세라믹 백커버 제조방법의 제4단계의 곡면 성형을 한 후에 세라믹 시트를 나타낸 도면, 그리고,
도 3은 본 발명의 일실시예에 따른, 모바일용 세라믹 백커버 제조방법의 제4단계의 곡면 성형시의 온도 및 시간 조건을 나타낸 그래프이다.1 is a view showing a ceramic sheet before curved surface molding in the fourth step of a method for manufacturing a ceramic back cover for mobile according to an embodiment of the present invention;
2 is a view showing a ceramic sheet after curved surface molding in the fourth step of the method for manufacturing a ceramic back cover for mobile according to an embodiment of the present invention;
3 is a graph showing the temperature and time conditions at the time of forming a curved surface in the fourth step of the method for manufacturing a ceramic back cover for mobile according to an embodiment of the present invention.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 부가한다.Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar elements throughout the specification.
본 발명의 모바일용 세라믹 백커버 제조방법은 제1단계 내지 제4단계를 포함한다.The method of manufacturing a ceramic back cover for mobile of the present invention includes first to fourth steps.
먼저, 본 발명의 모바일용 세라믹 백커버 제조방법의 제1단계는 평판형 세라믹 시트를 준비할 수 있다.First, in the first step of the method for manufacturing a ceramic back cover for mobile of the present invention, a flat ceramic sheet may be prepared.
이 때, 평판형 세라믹 시트는 세라믹 분말을 이용하여 평판형 세라믹 시트로 성형할 수 있으며, 이와 같은 성형은 테이프 캐스팅(tape casting)에 의해 수행할 수 있다. 이는 세라믹 분말을 알콜이나 물과 같은 액상 용매(solvent)와 섞어서 슬러리(slurry)를 만들고, 이 슬러리를 테이프 캐스터(tape caster)를 통해 바탕 테이프(스테인레스 스틸 테이프, 기름 종이 테이프, MYLAR이나 ACLAR과 같은 고분자 테이프) 위에 얇게 펼친 다음 용매를 날려 버리고, 바탕 테이프에서 떼어냄으로써 평판형 세라믹 시트를 얻을 수 있다.In this case, the flat ceramic sheet may be formed into a flat ceramic sheet using ceramic powder, and such molding may be performed by tape casting. This is done by mixing ceramic powder with a liquid solvent such as alcohol or water to make a slurry, and this slurry is passed through a tape caster to a base tape (such as stainless steel tape, oil paper tape, MYLAR or ACLAR). A flat ceramic sheet can be obtained by spreading it thinly on top of the polymer tape), blowing off the solvent, and then peeling it off the base tape.
또한, 세라믹 분말은 전기를 잘 전도하지 않을 뿐 아니라, 고온에도 잘 견디는 소재면 무엇이든 포함할 수 있고, 바람직하게는 지르코니아(Zr)를 포함할 수 있다.In addition, the ceramic powder may include any material that does not conduct electricity well and withstands high temperatures well, and preferably includes zirconia (Zr).
다음으로, 본 발명의 모바일용 세라믹 백커버 제조방법의 제2단계는 제1단계에서 준비한 평판형 세라믹 시트를 소성할 수 있다. 소성은 3차원으로 입체화된 평판형 세라믹 시트를 치밀화시키는 공정이다. 이와 같은 소성 과정을 통해 본 발명의 모바일용 세라믹 백커버가 가져야 하는 내구성 등의 특성을 제어할 수 있다. 이처럼, 본 발명의 모바일용 세라믹 백커버 제조방법은 추후 평판형 세라믹 시트의 곡면 성형을 진행하기 전에 평판 상태에서 소성을 진행하기 때문에 세라믹 형상의 제어가 유리하고, 유전율 제어가 유리할 수 있다.Next, in the second step of the method of manufacturing the ceramic back cover for mobile of the present invention, the flat ceramic sheet prepared in the first step may be fired. Firing is a process of densifying a three-dimensionally three-dimensional flat ceramic sheet. Through this firing process, characteristics such as durability that the ceramic back cover for mobile of the present invention should have can be controlled. As described above, in the method of manufacturing a ceramic back cover for mobile of the present invention, since firing is performed in a flat state before the curved surface forming of the flat ceramic sheet is performed, the control of the ceramic shape is advantageous and the control of the dielectric constant can be advantageous.
또한, 제2단계의 소성은 900 ~ 1500℃의 온도에서 30 ~ 600분동안 수행할 수 있다.In addition, the second step of sintering may be performed at a temperature of 900 to 1500° C. for 30 to 600 minutes.
한편, 본 발명의 모바일용 세라믹 백커버 제조방법의 제1단계를 수행하고 난 후 제2단계를 수행하기 전에 제1단계에서 준비한 평판형 세라믹 시트에 포함된 바인더를 번 아웃(burn out)하는 바인더 제거단계를 더 포함하여 수행할 수 있다.On the other hand, after performing the first step of the method for manufacturing a ceramic back cover for mobile of the present invention, before performing the second step, a binder for burning out the binder contained in the flat ceramic sheet prepared in the first step The removal step may be further included.
다음으로, 본 발명의 모바일용 세라믹 백커버 제조방법의 제3단계는 제2단계에서 소성한 세라믹 시트를 가공할 수 있다. 이처럼, 본 발명의 모바일용 세라믹 백커버 제조방법은 추후 세라믹 시트의 곡면 성형을 진행하기 전에 평판 상태에서 가공을 진행하기 때문에 가공성이 우수할 수 있다.Next, in the third step of the method of manufacturing the ceramic back cover for mobile of the present invention, the ceramic sheet fired in the second step may be processed. As such, the method of manufacturing a ceramic back cover for mobile of the present invention may be excellent in workability because it is processed in a flat state before proceeding with the curved surface molding of the ceramic sheet later.
제3단계의 가공은 표면광택 공정 및 연마 공정 중에서 선택된 1종 이상의 공정을 수행할 수 있으며, 바람직하게는 표면광택 공정 및 연마 공정을 수행할 수 있다.In the third step, one or more processes selected from a surface polishing process and a polishing process may be performed, and preferably a surface polishing process and a polishing process may be performed.
이 때, 표면광택 공정은 소성한 세라믹 시트의 표면에 광택을 내기 위한 공정으로서 Lapping, polishing, DMP(Diamond Mechanical Polishing), CMP(chemical mechanical polishing)를 수행할 수 있다.In this case, the surface polishing process is a process for glossing the surface of the fired ceramic sheet, and lapping, polishing, diamond mechanical polishing (DMP), and chemical mechanical polishing (CMP) may be performed.
또한, 연마 공정은 소성한 세라믹 시트의 표면을 평탄화하는 공정으로서, 건식이나 습식 바렐 연마, 샌드 블래스트(sand blast), DMP(Diamond mechanical polishing) 또는 CMP(chemical mechanical polishing)를 수행할 수 있다.In addition, the polishing process is a process for planarizing the surface of the fired ceramic sheet, and dry or wet barrel polishing, sand blasting, diamond mechanical polishing (DMP), or chemical mechanical polishing (CMP) may be performed.
마지막으로, 본 발명의 모바일용 세라믹 백커버 제조방법의 제4단계는 제3단계에서 가공한 세라믹 시트의 가장자리 일부분을 곡면 성형할 수 있다. 달리 말하면, 제3단계에서 가공한 세라믹 시트의 마주보는 양 끝단을 곡면 성형할 수 있고, 또 다른 표면으로, 제4단계의 곡면 성형에 의해 세라믹 시트의 양 끝단을 따라서 라운드진 백커버의 후면 형상으로 성형할 수 있다(도 1 및 도 2 참조).Finally, in the fourth step of the method of manufacturing the ceramic back cover for mobile of the present invention, a portion of the edge of the ceramic sheet processed in the third step may be curved. In other words, the opposite ends of the ceramic sheet processed in the third step may be curved, and as another surface, the rear shape of the back cover rounded along both ends of the ceramic sheet by the curved forming in the fourth step. can be molded into (see FIGS. 1 and 2).
또한, 제4단계의 곡면 성형은 900 ~ 1500℃의 온도에서 5 ~ 300분동안 수행할 수 있으며, 성형 온도가 900℃ 미만이면 충분히 성형이 되지 않을 수 있는 문제가 있을 수 있고, 1500℃를 초과하면 grain의 성장이 조대화되어 특성 저하의 원인이 될 수 있다In addition, the curved surface molding of the fourth step can be performed for 5 to 300 minutes at a temperature of 900 ~ 1500 ℃, if the molding temperature is less than 900 ℃ there may be a problem that may not be sufficiently molded, exceeding 1500 ℃ Otherwise, the growth of the grain will become coarse, which may cause deterioration of properties.
또한, 제4단계의 곡면 성형은 환원 분위기, 산화 분위기 또는 대기 분위기에서 수행할 수 있다.In addition, the curved surface forming in the fourth step may be performed in a reducing atmosphere, an oxidizing atmosphere, or an atmospheric atmosphere.
또한, 제4단계의 곡면 성형은 100g ~ 10,000g의 누름하중으로 수행할 수 있다.In addition, the curved surface forming in the fourth step can be performed with a pressing load of 100g ~ 10,000g.
또한, 제4단계의 곡면 성형은 환원 분위기 하에서 흑연 몰드(graphite mold)를 사용하여 하중가압 또는 정수압프레스(warm isostatic press)로 곡면 성형을 수행할 수 있으며, 이를 통해 세라믹 시트의 가장자리 일부분을 곡면으로 성형할 수 있다. 만일, 흑연 몰드(graphite mold)를 사용하여 곡면 성형을 수행할 시에 환원 분위기가 아닌 산화 분위기에서 진행하게 된다면 흑연이 산화되어 몰드수명이 저하되는 문제가 있을 수 있다.In addition, the curved surface molding in the fourth step can be performed by using a graphite mold under a reducing atmosphere to apply a load pressure or by a warm isostatic press, and through this, a portion of the edge of the ceramic sheet is turned into a curved surface. can be molded. If, when performing curved molding using a graphite mold, if the process is carried out in an oxidizing atmosphere rather than a reducing atmosphere, graphite is oxidized and the mold life may be reduced.
또한, 제4단계의 곡면 성형은 산화 분위기 하에서 알루미나 몰드(alumina mold)를 사용하여 하중가압 또는 정수압프레스(warm isostatic press)로 곡면 성형을 수행할 수 있으며, 이를 통해 세라믹 시트의 가장자리 일부분을 곡면으로 성형할 수 있다. 만일, 알루미나 몰드(alumina mold)를 사용하여 곡면 성형을 수행할 시에 산화 분위기가 아닌 환원 분위기에서 진행하게 된다면 색상과 특성 변화 등의 문제가 있을 수 있다.In addition, the curved surface molding in the fourth step can be performed by using an alumina mold under an oxidizing atmosphere and using a load pressure or a warm isostatic press to form a curved surface, through which a portion of the edge of the ceramic sheet is turned into a curved surface. can be molded. If, when performing curved molding using an alumina mold, it is performed in a reducing atmosphere instead of an oxidizing atmosphere, there may be problems such as color and characteristic change.
한편, 구체적으로, 도 3을 참조하여 설명하면, 제4단계의 곡면 성형은 질소 분위기 하에서 흑연(graphite) 몰드를 사용하여 800g의 누름하중을 가하는 정수압프레스(warm isostatic press)로 곡면 성형을 수행할 시, 900 ~ 1100℃, 바람직하게는 950 ~ 1050℃의 온도에서 180 ~ 220분, 바람직하게는 190 ~ 210분간 수행되는 제1온도유지구간(a)과, 제1온도유지구간 후 1150 ~ 1500℃, 바람직하게는 1200 ~ 1300℃의 온도에서 15 ~ 100분, 바람직하게는 70 ~ 90분동안 수행되는 제2온도유지구간을 포함할 수 있다. 이처럼, 제4단계의 곡면 성형을 수행할 시 온도 및 시간을 달리하여 곡면 성형을 수행하게 된다면 세라믹 시트가 소성된 상태에서도 곡면 성형이 용이할 수 있다. 만일, 제1온도유지구간에 있어서 온도가 900℃ 미만이면 성형성이 확보되지 않아 곡면성형이 되지 않고 곡면 부위에 크랙이 발생하는 문제가 있을 수 있다. 또한, 제2온도유지구간에 있어서 온도가 1500℃를 초과하면 grain 성장으로 인해 특성이 떨어지는 문제가 있을 수 있다.On the other hand, specifically, referring to FIG. 3 , the curved surface molding in the fourth step is performed by using a graphite mold under a nitrogen atmosphere and using a warm isostatic press to apply a pressing load of 800 g. hour, 900 ~ 1100 ℃, preferably 950 ~ 1050 ℃ 180 ~ 220 minutes, preferably 190 ~ 210 minutes at a temperature of the first temperature maintenance section (a), and after the first temperature maintenance section 1150 ~ 1500 ℃, preferably at a temperature of 1200 ~ 1300 ℃ 15 ~ 100 minutes, preferably may include a second temperature holding period carried out for 70 ~ 90 minutes. As such, when performing the curved surface forming in the fourth step, if the curved forming is performed by varying the temperature and time, the curved forming can be easily performed even in a fired state of the ceramic sheet. If the temperature is less than 900° C. in the first temperature maintenance section, there may be a problem in that the formability is not ensured, so that the curved surface is not formed and cracks are generated in the curved portion. In addition, when the temperature exceeds 1500° C. in the second temperature holding period, there may be a problem in that properties are deteriorated due to grain growth.
또한, 제1온도유지구간에서 제2온도유지구간까지 승온속도는 5.0 ~ 15.0 ℃/min, 바람직하게는 7.0 ~ 10.0 ℃/min일 수 있다.In addition, the temperature increase rate from the first temperature holding section to the second temperature holding section may be 5.0 to 15.0 °C/min, preferably 7.0 to 10.0 °C/min.
나아가, 본 발명의 제1단계 내지 제4단계를 포함하는 모바일용 세라믹 백커버 제조방법에 의해 모바일용 세라믹 백커버를 제조하게 된다면 세라믹 형상의 제어가 유리하고, 유전율 제어가 가능하며, 가공성을 향상시킬 수 있지만, 세라믹 재질의 취성이 강한 특성상 충격에 의해 쉽게 깨질 수 있는 우려가 존재한다.Furthermore, if the ceramic back cover for mobile is manufactured by the method for manufacturing the ceramic back cover for mobile including the first to fourth steps of the present invention, it is advantageous to control the ceramic shape, control the dielectric constant, and improve the workability. However, due to the strong brittleness of the ceramic material, there is a concern that it may be easily broken by impact.
따라서, 이와 같은 문제를 해결하기 위해 본 발명의 모바일용 세라믹 백커버 제조방법은 제4단계에서 곡면 성형한 세라믹 시트에 강화 부재를 이종접합하는 제5단계를 더 포함할 수 있다.Therefore, in order to solve this problem, the method of manufacturing a ceramic back cover for mobile of the present invention may further include a fifth step of heterogeneously bonding a reinforcing member to the ceramic sheet formed in a curved surface in the fourth step.
이 때, 이종 접합은 100 ~ 1000℃의 온도, 1 ~ 100kgf/cm2의 압력에서 1 ~ 60분동안 수행할 수 있다.In this case, the heterojunction may be performed at a temperature of 100 to 1000° C. and a pressure of 1 to 100 kgf/cm 2 for 1 to 60 minutes.
또한, 강화 부재는 강화 유리, 폴리머(polymer), 메탈(metal) 및 앞서 언급한 세라믹 시트와 다른 이종 세라믹 물질 중에서 선택된 1종 이상을 포함할 수 있고, 바람직하게는 강화 유리를 포함할 수 있다.In addition, the reinforcing member may include at least one selected from among tempered glass, polymer, metal, and other ceramic materials different from the aforementioned ceramic sheet, preferably tempered glass.
한편, 세라믹 시트는 강화 부재와의 접합력 향상을 위해 표면이 개질되어 있을 수 있다. 이 때, 세라믹 시트 표면의 개질은 에칭(etching), 플라즈마 처리 또는 다공성 표면처리에 의할 수 있으며, 이를 통해 세라믹 시트의 표면적은 넓어져 강화부재와의 접합력이 향상될 수 있다.Meanwhile, the surface of the ceramic sheet may be modified to improve bonding strength with the reinforcing member. In this case, the surface of the ceramic sheet may be modified by etching, plasma treatment, or porous surface treatment, through which the surface area of the ceramic sheet may be increased to improve bonding strength with the reinforcing member.
나아가, 강화부재가 세라믹 시트에 이종 접합되어 있을 때, 세라믹 시트의 두께는 0.05 ~ 0.3 mm, 바람직하게는 0.08 ~ 0.2 mm일 수 있으며, 만일 두께가 0.05mm 미만이면 취급 시 문제와 표면연마의 문제가 있을 수 있고, 0.3mm를 초과하면 전체적인 두께가 두껍게 되는 문제가 있을 수 있다. 또한, 강화부재가 세라믹 시트에 이종 접합되어 있을 때, 강화부재의 두께는 0.15 ~ 0.4 mm의 두께, 바람직하게는 0.25 ~ 0.4 mm일 수 있으며, 만일 두께가 0.25mm 미만이면 강화부재 역할에 문제가 있을 수 있고, 0.4mm를 초과하면 이종접합 두께 상승의 문제가 있을 수 있다.Furthermore, when the reinforcing member is heterogeneously bonded to the ceramic sheet, the thickness of the ceramic sheet may be 0.05 ~ 0.3 mm, preferably 0.08 ~ 0.2 mm, and if the thickness is less than 0.05 mm, there is a problem in handling and surface polishing There may be, and if it exceeds 0.3mm, there may be a problem that the overall thickness becomes thick. In addition, when the reinforcing member is heterogeneously bonded to the ceramic sheet, the thickness of the reinforcing member may be 0.15 to 0.4 mm, preferably 0.25 to 0.4 mm, and if the thickness is less than 0.25 mm, there is a problem in the role of the reinforcing member. There may be, and if it exceeds 0.4 mm, there may be a problem of increasing the thickness of the heterojunction.
이상에서 본 발명의 일 실시예에 대하여 설명하였으나, 본 발명의 사상은 본 명세서에 제시되는 실시 예에 제한되지 아니하며, 본 발명의 사상을 이해하는 당업자는 동일한 사상의 범위 내에서, 구성요소의 부가, 변경, 삭제, 추가 등에 의해서 다른 실시 예를 용이하게 제안할 수 있을 것이나, 이 또한 본 발명의 사상범위 내에 든다고 할 것이다.Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art who understand the spirit of the present invention can add components within the scope of the same spirit. , changes, deletions, additions, etc. may easily suggest other embodiments, but this will also fall within the scope of the present invention.
Claims (13)
상기 세라믹 시트를 소성하는 제2단계;
상기 소성한 세라믹 시트를 가공하는 제3단계; 및
상기 가공한 세라믹 시트의 가장자리 일부분을 곡면 성형하는 제4단계;
를 포함하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.A first step of preparing a flat ceramic sheet;
a second step of firing the ceramic sheet;
a third step of processing the fired ceramic sheet; and
a fourth step of forming a curved surface of a portion of the edge of the processed ceramic sheet;
A method of manufacturing a ceramic back cover for mobile, comprising a.
상기 제3단계의 가공은 표면광택 공정 및 연마 공정 중에서 선택된 1종 이상의 공정을 수행하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.The method of claim 1
The third step processing is a method of manufacturing a ceramic back cover for mobile, characterized in that performing at least one process selected from a surface polishing process and a polishing process.
상기 제4단계의 곡면 성형은 900 ~ 1500℃의 온도에서 5 ~ 100분동안 수행하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.According to claim 1,
The method for manufacturing a ceramic back cover for mobile, characterized in that the curved surface molding in the fourth step is performed for 5 to 100 minutes at a temperature of 900 to 1500 ℃.
상기 제4단계의 곡면 성형은 환원 분위기 하에서 흑연 몰드(graphite mold) 또는 산화 분위기 하에서 알루미나 몰드(alumina mold)를 사용하여 하중가압 또는 정수압프레스(warm isostatic press)로 곡면 성형하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.4. The method of claim 3,
In the fourth step, the curved surface molding is performed using a graphite mold under a reducing atmosphere or an alumina mold under an oxidizing atmosphere to form a curved surface by load pressure or warm isostatic press. A method for manufacturing a ceramic back cover.
상기 세라믹 시트에 포함된 바인더를 번 아웃(burn out)하는 바인더 제거단계;
를 더 포함하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.The method of claim 1 , wherein between the first and second steps
a binder removal step of burning out the binder included in the ceramic sheet;
A method of manufacturing a ceramic back cover for mobile, characterized in that it further comprises a.
상기 곡면 성형한 세라믹 시트에 강화 부재를 이종 접합하는 제5단계;
를 더 포함하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.According to claim 1,
a fifth step of heterogeneously bonding a reinforcing member to the curved ceramic sheet;
A method of manufacturing a ceramic back cover for mobile, characterized in that it further comprises a.
상기 이종 접합은 100 ~ 1000℃의 온도, 1 ~ 100kgf/cm2의 압력에서 1 ~ 60분동안 수행하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.7. The method of claim 6,
The heterojunction is a method of manufacturing a ceramic back cover for mobile, characterized in that performed for 1 to 60 minutes at a temperature of 100 ~ 1000 ℃, 1 ~ 100kgf / cm 2 pressure.
상기 강화부재는 강화 유리, 폴리머, 메탈 및 상기 세라믹 시트와 다른 이종 세라믹 물질 중에서 선택된 1종 이상을 포함하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.7. The method of claim 6,
The reinforcing member is a method of manufacturing a ceramic back cover for mobile, characterized in that it comprises at least one selected from among tempered glass, polymer, metal, and a different type of ceramic material different from the ceramic sheet.
상기 세라믹 시트는 표면이 개질되어 있는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.7. The method of claim 6,
The ceramic sheet is a method of manufacturing a ceramic back cover for mobile, characterized in that the surface is modified.
상기 세라믹 시트는 0.05 ~ 0.3 mm의 두께는 가지고,
상기 강화 부재는 0.15 ~ 0.4 mm의 두께를 가지는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.7. The method of claim 6,
The ceramic sheet has a thickness of 0.05 to 0.3 mm,
The method of manufacturing a ceramic back cover for mobile, characterized in that the reinforcing member has a thickness of 0.15 ~ 0.4 mm.
상기 제4단계의 곡면 성형은 질소 분위기 하에서 흑연(graphite) 몰드를 사용하여 800g의 누름하중을 가하는 정수압프레스(warm isostatic press)로 곡면 성형을 수행할 시, 900 ~ 1100℃의 온도에서 180 ~ 220분간 수행되는 제1온도유지구간과, 상기 제1온도유지구간 후 1150 ~ 1500℃의 온도에서 15 ~ 100분동안 수행되는 제2온도유지구간을 포함하는 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.5. The method of claim 4,
In the fourth step, the curved surface molding is performed by using a graphite mold under a nitrogen atmosphere and using a warm isostatic press to apply a pressing load of 800 g. A method of manufacturing a ceramic back cover for mobile, comprising: a first temperature maintaining period performed for minutes; and a second temperature maintaining period performed for 15 to 100 minutes at a temperature of 1150 to 1500° C. after the first temperature maintaining period .
상기 제1온도유지구간에서 제2온도유지구간까지 승온속도는 5.0 ~ 15.0 ℃/min인 것을 특징으로 하는 모바일용 세라믹 백커버 제조방법.6. The method of claim 5,
The method of manufacturing a ceramic back cover for mobile, characterized in that the temperature increase rate from the first temperature maintaining section to the second temperature maintaining section is 5.0 ~ 15.0 °C / min.
[Claim 13] A ceramic back cover for mobile manufactured by the method for manufacturing a ceramic back cover for mobile according to any one of claims 1 to 12.
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