KR20210019009A - Resin material and multilayer printed wiring board - Google Patents

Abstract

A resin material capable of lowering the dielectric loss tangent and suppressing the occurrence of delamination is provided. The resin material according to the present invention includes an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton, and the specific surface area of the inorganic filler is 1 m 2 /g or more and 50 m 2 /g or less. .

Description

Resin material and multilayer printed wiring board

The present invention relates to a resin material containing an epoxy compound, an inorganic filler, and a curing agent. Further, the present invention relates to a multilayer printed wiring board using the resin material.

Conventionally, in order to obtain electronic components such as semiconductor devices, laminates and printed wiring boards, various resin materials have been used. For example, in a multilayer printed wiring board, a resin material is used in order to form an insulating layer for insulating interlayers inside or to form an insulating layer located in a surface portion. On the surface of the insulating layer, wiring, which is generally metal, is laminated. In addition, in order to form the insulating layer, a resin film may be used as the resin material. The resin material is used as an insulating material for multilayer printed wiring boards including a build-up film (for example, Patent Document 1).

WO 2009/28493A 1

The insulating layer formed on a multilayer printed wiring board or the like is required to have a low dielectric loss tangent. For the purpose of lowering the dielectric loss tangent, an inorganic filler is sometimes blended into the resin material. However, the interface between the inorganic filler and the resin is easily absorbed, and when the amount of the inorganic filler is large, peeling (delamination) of the insulating layer formed of the resin material and the metal layer such as a circuit may occur.

In addition, in the reflow process, since the insulating layer and the metal layer are exposed to a high temperature (for example, 260°C or higher), delamination is likely to occur. In addition, when the insulating layer is absorbed by moisture or gas is generated by exposure to high temperature, delamination is likely to occur.

In the conventional epoxy resin composition as described in Patent Document 1, it is difficult to lower the dielectric loss tangent and suppress the occurrence of delamination.

It is an object of the present invention to provide a resin material that can lower the dielectric loss tangent and suppress the occurrence of delamination. It is also an object of the present invention to provide a multilayer printed wiring board using the resin material.

According to a broad aspect of the present invention, an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton are included, and the specific surface area of the inorganic filler is 1 m 2 /g or more and 50 m 2 /g or less, A resin material is provided.

In a specific aspect of the resin material according to the present invention, the silane coupling agent is a silane coupling agent having a diaminotriazine skeleton.

In a specific aspect of the resin material according to the present invention, the curing agent includes an active ester compound, a cyanate compound, a benzoxazine compound, a carbodiimide compound, or a maleimide compound.

In a specific aspect of the resin material according to the present invention, the content of the silane coupling agent is 0.1% by weight or more and 3% by weight or less in 100% by weight of components excluding the inorganic filler and solvent in the resin material.

In a specific aspect of the resin material according to the present invention, the content of the inorganic filler is 30% by weight or more in 100% by weight of components excluding the solvent in the resin material.

In a specific aspect of the resin material according to the present invention, the resin material is a thermosetting material.

In a specific aspect of the resin material according to the present invention, the resin material is a resin film.

The resin material according to the present invention is suitably used in order to form an insulating layer in a multilayer printed wiring board.

According to a broad aspect of the present invention, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a metal layer disposed between the plurality of insulating layers are provided, and at least one of the plurality of insulating layers A multilayer printed wiring board, which is a cured product of the resin material described above, is provided.

The resin material according to the present invention includes an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton, and the specific surface area of the inorganic filler is 1 m 2 /g or more and 50 m 2 /g or less. , It can lower the dielectric loss tangent, and can also suppress the occurrence of delamination.

1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail.

The resin material according to the present invention includes an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton, and the specific surface area of the inorganic filler is 1 m 2 /g or more and 50 m 2 /g or less. .

In the present invention, since the above-described configuration is provided, the dielectric loss tangent can be lowered, and the occurrence of delamination can be suppressed.

With a conventional resin material, it is difficult to lower the dielectric loss tangent and to suppress the occurrence of delamination. Particularly, when the amount of the inorganic filler is small, even if the occurrence of delamination can be suppressed, when the amount of the inorganic filler is large, it is difficult to suppress the occurrence of delamination. On the other hand, in the present invention, even if the amount of the inorganic filler is large, the occurrence of delamination can be suppressed.

The resin material according to the present invention may be a resin composition or a resin film. The resin composition has fluidity. The resin composition may be in a paste form. The paste phase contains a liquid phase. From the viewpoint of excellent handling properties, it is preferable that the resin material according to the present invention is a resin film.

It is preferable that the resin material according to the present invention is a thermosetting material. It is preferable that the resin material according to the present invention can be cured by heating. When the said resin material is a resin film, it is preferable that the said resin film is a thermosetting resin film. It is preferable that the said resin film is curable by heating.

Hereinafter, details of each component used in the resin material according to the present invention, and the use of the resin material according to the present invention will be described.

[Epoxy compound]

The resin material contains an epoxy compound. As the epoxy compound, a conventionally known epoxy compound can be used. The epoxy compound refers to an organic compound having at least one epoxy group. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.

Examples of the epoxy compound include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, a phenol novolak type epoxy compound, a biphenyl type epoxy compound, a biphenyl novolak type epoxy compound, a biphenol type epoxy compound, Naphthalene type epoxy compound, fluorene type epoxy compound, phenol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, dicyclopentadiene type epoxy compound, anthracene type epoxy compound, epoxy compound having adamantane skeleton, tricyclodecane And an epoxy compound having a skeleton, a naphthylene ether type epoxy compound, and an epoxy compound having a triazine nucleus in the skeleton.

From the viewpoint of further lowering the coefficient of linear expansion and further suppressing the occurrence of delamination, the epoxy compound preferably contains an epoxy compound having an aromatic skeleton, and contains an epoxy compound having a naphthalene skeleton or a phenyl skeleton It is more preferable to do it.

The said epoxy compound may contain a liquid epoxy compound at 25 degreeC, and may contain a solid epoxy compound at 25 degreeC. From the viewpoint of further lowering the dielectric loss tangent, further improving the coefficient of linear expansion (CTE) of the cured product, and further suppressing the occurrence of delamination, the epoxy compound is a liquid epoxy compound at 25°C and a solid solid at 25°C. It is preferable to include an epoxy compound of.

The viscosity of the liquid epoxy compound at 25° C. at 25° C. is preferably 1000 mPa·s or less, and more preferably 500 mPa·s or less.

When measuring the viscosity of the epoxy compound, a dynamic viscoelasticity measuring device ("VAR-100", manufactured by Rheologica Instruments Inc.) or the like is used, for example.

It is more preferable that the molecular weight of the epoxy compound is 1000 or less. In this case, even if the content of the components excluding the solvent in the resin material is 100% by weight and the content of the inorganic filler is 50% by weight or more, a resin material having high fluidity can be obtained when the insulating layer is formed. For this reason, when an uncured product of a resin material or a B-stage product is laminated on a circuit board, the inorganic filler can be uniformly present.

The molecular weight of the epoxy compound means a molecular weight that can be calculated from the structural formula when the epoxy compound is not a polymer and when the structural formula of the epoxy compound can be specified. In addition, when the said epoxy compound is a polymer, it means a weight average molecular weight.

From the viewpoint of further increasing the adhesive strength between the cured product and the metal layer and further suppressing the occurrence of delamination, the content of the epoxy compound in 100% by weight of the component excluding the solvent in the resin material is preferably 20% by weight or more, It is more preferably 30% by weight or more, preferably 80% by weight or less, and more preferably 70% by weight or less.

[Inorganic filling material]

The resin material contains an inorganic filler. With the use of an inorganic filler, the dielectric loss tangent of the cured product is further lowered. Further, by the use of the inorganic filler, the dimensional change due to heat of the cured product is further reduced. In addition, the use of the inorganic filler further increases the adhesive strength between the cured product and the metal layer. As for the said inorganic filler, only 1 type may be used and 2 or more types may be used together.

Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

From the viewpoint of reducing the surface roughness of the surface of the cured product, further increasing the adhesive strength between the cured product and the metal layer, forming a finer wiring on the surface of the cured product, and imparting better insulation reliability to the cured product, The inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica. By the use of silica, the thermal expansion coefficient of the cured product is further lowered, and the dielectric loss tangent of the cured product is further lowered. Further, the use of silica effectively reduces the surface roughness of the surface of the cured product, effectively increases the adhesive strength between the cured product and the metal layer, and further suppresses the occurrence of delamination. It is preferable that the silica has a spherical shape.

Regardless of the curing environment, from the viewpoint of advancing curing of the resin, effectively raising the glass transition temperature of the cured product, and effectively reducing the thermal linear expansion coefficient of the cured product, the inorganic filler is preferably spherical silica.

From the viewpoint of suppressing the occurrence of delamination, the specific surface area of the inorganic filler is 1 m 2 /g or more and 50 m 2 /g or less. When the specific surface area of the inorganic filler is less than 1 m 2 /g or exceeds 50 m 2 /g, delamination may occur.

From the viewpoint of further suppressing the occurrence of delamination, the specific surface area of the inorganic filler is preferably 2 m 2 /g or more, more preferably 3 m 2 /g or more, preferably 40 m 2 /g or less.

The specific surface area of the inorganic filler can be measured by the BET method using nitrogen gas. When the resin material contains two or more types of inorganic fillers, the specific surface area of the inorganic filler is measured in the entire inorganic filler contained in the resin material. The specific surface area of the inorganic filler may be measured using the inorganic filler used to obtain the resin material.

The average particle diameter of the inorganic filler is preferably 100 nm or more, more preferably 200 nm or more, further preferably 500 nm or more, preferably 1.5 µm or less, more preferably 1.3 µm or less, even more preferably It is 1.0 μm or less. When the average particle diameter of the inorganic filler is more than the lower limit and less than the upper limit, the occurrence of delamination can be further suppressed.

As the average particle diameter of the inorganic filler, a median diameter (d50) of 50% is adopted. The average particle diameter can be measured using a particle size distribution measuring apparatus of a laser diffraction scattering method. When the resin material contains two or more types of inorganic fillers, the average particle diameter of the inorganic filler is measured in the entire inorganic filler contained in the resin material. You may measure the average particle diameter of an inorganic filler using the inorganic filler used to obtain the said resin material.

The inorganic filler is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased, and as a result, the occurrence of delamination can be further suppressed. When the inorganic filler is spherical, the aspect ratio of the inorganic filler is preferably 2 or less, more preferably 1.5 or less.

The inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent. When the inorganic filler is surface-treated, the surface roughness of the surface of the roughened cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased. As a result, the occurrence of delamination can be further suppressed. Further, by surface treatment of the inorganic filler, a finer wiring can be formed on the surface of the cured product, and further better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the cured product.

Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the silane coupling agent include methacrylic silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.

In 100% by weight of the component excluding the solvent in the resin material, the content of the inorganic filler is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, particularly preferably 55 It is at least 60% by weight, most preferably at least 60% by weight. In 100% by weight of the components excluding the solvent in the resin material, the content of the inorganic filler is preferably 85% by weight or less, more preferably 83% by weight or less, still more preferably 80% by weight or less, particularly preferably 78 It is not more than% by weight. When the content of the inorganic filler is more than the above lower limit, the dielectric loss tangent is effectively lowered, the thermal expansion coefficient of the cured product can be lowered, and the smear removal property can be improved. When the content of the inorganic filler is less than or equal to the upper limit, the handleability and flexibility of the resin film can be further improved. When the content of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the surface roughness of the surface of the cured product can be further reduced, and further finer wiring can be formed on the surface of the cured product.

[Hardener]

The resin material contains a curing agent. As the curing agent, a conventionally known curing agent can be used. Only 1 type may be used for the said hardening agent, and 2 or more types may be used together.

Examples of the curing agent include cyanate compounds (cyanate curing agents), phenol compounds (phenol curing agents), amine compounds (amine curing agents), thiol compounds (thiol curing agents), imidazole compounds, phosphine compounds, acid anhydrides, dicyandiamides, and active agents. Ester compounds, benzoxazine compounds (benzoxazine curing agents), carbodiimide compounds (carbodiimide curing agents), maleimide compounds (maleimide curing agents), and the like. It is preferable that the curing agent has a functional group capable of reacting with the epoxy group of the epoxy compound.

From the viewpoint of suppressing the generation of blisters and further suppressing the occurrence of delamination while lowering the dielectric loss tangent, the curing agent is an active ester compound, a cyanate compound, a benzoxazine compound, a carbodiimide compound, or It is preferable to contain a mid compound. From the viewpoint of suppressing the occurrence of blisters and further suppressing the occurrence of delamination while lowering the dielectric loss tangent, the curing agent is preferably an active ester compound.

The cyanate compound may be a cyanate ester compound (cyanate ester curing agent). Examples of the cyanate ester compounds include novolak type cyanate ester resins, bisphenol type cyanate ester resins, and prepolymers in which some of these are trimerized. As said novolak type cyanate ester resin, a phenol novolak type cyanate ester resin, an alkylphenol type cyanate ester resin, etc. are mentioned. Examples of the bisphenol type cyanate ester resin include a bisphenol A type cyanate ester resin, a bisphenol E type cyanate ester resin, and a tetramethyl bisphenol F type cyanate ester resin.

As commercially available products of the cyanate ester compound, a prepolymer in which a phenol novolak type cyanate ester resin ("PT-30" and "PT-60" manufactured by Lonza Japan), and a bisphenol type cyanate ester resin is trimerized (manufactured by Lonza Japan) "BA-230S", "BA-3000S", "BTP-1000S", and "BTP-6020S"), and the like.

Examples of the phenolic compound include novolac-type phenol, biphenol-type phenol, naphthalene-type phenol, dicyclopentadiene-type phenol, aralkyl-type phenol, and dicyclopentadiene-type phenol.

Commercially available products of the above phenolic compounds include novolak-type phenol ("TD-2091" manufactured by DIC), biphenyl novolak-type phenol ("MEH-7851" manufactured by Maywa Kasei), and aralkyl-type phenol compound (Meiwa Kasei Corporation. "MEH-7800"), and phenols having an aminotriazine skeleton ("LA1356" and "LA3018-50P" manufactured by DIC), and the like.

The active ester compound refers to a compound containing at least one ester bond in the structure and an aromatic ring bonded to both sides of the ester bond. The active ester compound is obtained, for example, by a condensation reaction of a carboxylic acid compound or a thiocarboxylic acid compound and a hydroxy compound or a thiol compound. As an example of an active ester compound, the compound represented by following formula (1) is mentioned.

In the formula (1), X1 and X2 each represent a group containing an aromatic ring. As a preferable example of the group containing the said aromatic ring, the benzene ring which may have a substituent, the naphthalene ring which may have a substituent, etc. are mentioned. As said substituent, a hydrocarbon group is mentioned. The number of carbon atoms in the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.

As a combination of X1 and X2, a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, a combination of a benzene ring which may have a substituent, and a naphthalene ring which may have a substituent are mentioned. Moreover, as a combination of X1 and X2, a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent is mentioned.

The active ester compound is not particularly limited. From the viewpoint of lowering the dielectric loss tangent of the cured product and enhancing the thermal dimensional stability of the cured product, it is more preferable to have a naphthalene ring in the main chain skeleton of the active ester. As a commercial item of the said active ester compound, "HPC-8000-65T", "EXB9416-70BK", "EXB8100-65T" etc. made by DIC are mentioned.

Examples of the benzoxazine compound include P-d-type benzoxazine and F-a-type benzoxazine.

As a commercial item of the said benzoxazine compound, "P-d type" etc. by a Shikoku Kasei Kogyo company are mentioned.

The carbodiimide compound has a structural unit represented by the following formula (2). In the following formula (2), the right end and the left end are bonding sites with other groups.

In the above formula (2), X represents an alkylene group, a group in which a substituent is bonded to an alkylene group, a cycloalkylene group, a group in which a substituent is bonded to a cycloalkylene group, an arylene group, or a group in which a substituent is bonded to an arylene group, p is 1 It represents the integer of 5 to. When a plurality of Xs exist, a plurality of Xs may be the same or different.

In one suitable form, at least one X is an alkylene group, a group in which a substituent is bonded to an alkylene group, a cycloalkylene group, or a group in which a substituent is bonded to a cycloalkylene group.

As a commercial item of the said carbodiimide compound, Nisshinbo Chemical Co., Ltd. "Carbodilite V-02B", "Carbodilite V-03", "Carbodilite V-04K", "Carbodilite V-07", " Carbodilite V-09", "Carbodilite 10M-SP" and "Carbodilite 10M-SP (revised)", and "Starbaxol P", "Starbaxol P400" manufactured by Line Chemie, and "Hikazil 510" and the like.

Examples of the maleimide compound include an N-alkyl bismaleimide compound and an N-phenyl bismaleimide compound.

As a commercial product of the maleimide compound, Designer Molecules Inc. "BMI-1500", "BMI-1700" and "BMI-3000" manufactured by Daiwa Kasei High School, "BMI-1000", "BMI-2000", "BMI-3000" and "BMI-4000", etc. I can.

With respect to 100 parts by weight of the epoxy compound, the content of the curing agent is preferably 25 parts by weight or more, more preferably 50 parts by weight or more, preferably 200 parts by weight or less, more preferably 150 parts by weight or less. When the content of the curing agent is greater than or equal to the lower limit and less than or equal to the upper limit, curability is further excellent, and dimensional change of the cured product due to heat and volatilization of residual unreacted components can be further suppressed.

In 100% by weight of the components excluding the inorganic filler and the solvent in the resin material, the total content of the epoxy compound and the curing agent is preferably 65% by weight or more, more preferably 70% by weight or more, preferably 99% by weight. % Or less, more preferably 97% by weight or less. When the total content of the epoxy compound and the curing agent is equal to or greater than the lower limit and equal to or less than the upper limit, a more favorable cured product can be obtained, and a dimensional change due to heat of the cured product can be further suppressed.

[Silane coupling agent]

The resin material contains a silane coupling agent. The silane coupling agent has a triazine skeleton. The resin material contains a silane coupling agent having a triazine skeleton. By using the silane coupling agent, the dielectric loss tangent can be lowered and the occurrence of delamination can be suppressed. The use of the silane coupling agent can suppress the occurrence of delamination during the reflow process or even when the amount of the inorganic filler is large. In addition, by using the silane coupling agent, the occurrence of blisters can be suppressed and the occurrence of delamination can be suppressed. Only 1 type may be used for the said silane coupling agent, and 2 or more types may be used together.

It is preferable that the said triazine skeleton is a diamino triazine skeleton from the point which the effect of this invention is exhibited effectively. That is, the silane coupling agent is preferably a silane coupling agent having a diaminotriazine skeleton. The diaminotriazine skeleton is a skeleton in which an amino group is bonded to each of two carbon atoms constituting the triazine skeleton.

As a commercial item of the silane coupling agent which has the said diaminotriazine skeleton, "VD-5" manufactured by Shikoku Kasei Kogyo Corporation, etc. are mentioned.

In 100% by weight of components excluding the inorganic filler and solvent in the resin material, the content of the silane coupling agent is preferably 0.1% by weight or more, more preferably 0.2% by weight or more, still more preferably 0.4% by weight or more, It is preferably 3% by weight or less, more preferably 2.5% by weight or less, and still more preferably 2% by weight or less. When the content of the silane coupling agent is more than the lower limit and less than the upper limit, the occurrence of delamination can be further suppressed. When the content of the silane coupling agent is less than or equal to the upper limit, it is possible to suppress an increase in the dielectric loss tangent.

[Thermoplastic resin]

It is preferable that the said resin material contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be used together.

Regardless of the curing environment, from the viewpoint of effectively lowering the dielectric loss tangent and effectively increasing the adhesion of the metal wiring, the thermoplastic resin is preferably a phenoxy resin. By use of a phenoxy resin, deterioration of the embedding property of the resin film to holes or irregularities in the circuit board and non-uniformity of the inorganic filler are suppressed. In addition, since the melt viscosity can be adjusted by the use of the phenoxy resin, the dispersibility of the inorganic filler becomes good, and in the curing process, the resin composition or the B-stage product is less likely to spread to unintended regions.

The phenoxy resin contained in the resin material is not particularly limited. As the phenoxy resin, a conventionally known phenoxy resin can be used. As for the said phenoxy resin, only 1 type may be used and 2 or more types may be used together.

Examples of the phenoxy resin include phenoxy resins having skeletons such as bisphenol A type skeleton, bisphenol F type skeleton, bisphenol S type skeleton, biphenyl skeleton, novolac skeleton, naphthalene skeleton, and imide skeleton. Can be mentioned.

As a commercial item of the said phenoxy resin, for example, "YP50", "YP55" and "YP70" manufactured by Shin-Nitetsu Sumikin Chemical Co., Ltd., and "1256B40", "4250", "4256H40", "made by Mitsubishi Chemical Corporation", and " 4275", "YX6954BH30", and "YX8100BH30", etc. are mentioned.

From the viewpoint of obtaining a resin material further excellent in storage stability, the weight average molecular weight of the thermoplastic resin and the phenoxy resin is preferably 5000 or more, more preferably 10000 or more, preferably 100000 or less, more preferably It is less than 50000.

The weight average molecular weight of the thermoplastic resin and the phenoxy resin represents the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

The content of the thermoplastic resin and the phenoxy resin is not particularly limited. The content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) in 100% by weight of the components excluding the inorganic filler and the solvent in the resin material is preferably 1% by weight or more, more preferably Is 2% by weight or more, preferably 30% by weight or less, and more preferably 20% by weight or less. When the content of the thermoplastic resin is greater than or equal to the lower limit and less than or equal to the upper limit, the embedding property of the resin material into holes or irregularities in the circuit board becomes good. When the content of the thermoplastic resin is greater than or equal to the above lower limit, the formation of the resin film becomes easier, and a more favorable insulating layer can be obtained. When the content of the thermoplastic resin is less than or equal to the above upper limit, the thermal expansion coefficient of the cured product is further lowered. When the content of the thermoplastic resin is less than or equal to the above upper limit, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.

[Hardening accelerator]

It is preferable that the said resin material contains a hardening accelerator. By using the curing accelerator, the curing speed is further increased. By rapidly curing the resin material, the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups decreases, and as a result, the crosslinking density increases. The curing accelerator is not particularly limited, and a conventionally known curing accelerator may be used. Only 1 type may be used for the said hardening accelerator, and 2 or more types may be used together.

Examples of the curing accelerator include imidazole compounds, phosphorus compounds, amine compounds and organometallic compounds.

Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecyl imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl- 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole , 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl -2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1') ]-Ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')] -Ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydro Hydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole, and the like.

Triphenylphosphine etc. are mentioned as said phosphorus compound.

Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, and 4,4-dimethylaminopyridine.

Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonatocobalt (II), trisacetylacetonatocobalt (III), and the like.

The content of the curing accelerator is not particularly limited. In 100% by weight of components excluding the inorganic filler and solvent in the resin material, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 5% by weight or less, more preferably Is 3% by weight or less. When the content of the curing accelerator is greater than or equal to the lower limit and less than or equal to the upper limit, the resin material is efficiently cured. If the content of the curing accelerator is in a more preferable range, the storage stability of the resin material is further increased, and a further better cured product is obtained.

[solvent]

The resin material does not contain or contains a solvent. By using the solvent, the viscosity of the resin material can be controlled within a suitable range, and the coating property of the resin material can be improved. In addition, the solvent may be used to obtain a slurry containing the inorganic filler. Only 1 type may be used for the said solvent, and 2 or more types may be used together.

Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxy ethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, Xylene, methyl ethyl ketone, N,N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha as a mixture.

It is preferable that most of the solvent is removed when molding the resin composition into a film. Therefore, the boiling point of the solvent is preferably 200°C or less, more preferably 180°C or less. The content of the solvent in the resin composition is not particularly limited. In consideration of the coatability of the resin composition, etc., the content of the solvent can be appropriately changed.

[Other ingredients]

For the purpose of improving impact resistance, heat resistance, resin compatibility and workability, the resin material includes leveling agents, flame retardants, coupling agents, coloring agents, antioxidants, ultraviolet deterioration inhibitors, antifoaming agents, thickeners, thixotropic agents. And other thermosetting resins other than the epoxy compound may be added.

Examples of the coupling agent include a silane coupling agent having no triazine skeleton, a titanium coupling agent, an aluminum coupling agent, and the like. Examples of the silane coupling agent having no triazine skeleton include vinyl silane, amino silane, imidazole silane, and epoxy silane.

Examples of the other thermosetting resins include polyphenylene ether resin, divinylbenzyl ether resin, polyarylate resin, diallylphthalate resin, polyimide resin, benzoxazine resin, benzoxazole resin, bismaleimide resin, and acrylate resin. And the like.

(Resin film)

A resin film (B-stage product/B-stage film) is obtained by molding the above-described resin composition into a film. It is preferable that the said resin material is a resin film. It is preferable that the resin film is a B stage film.

It is preferable that the said resin material is a thermosetting material.

The following methods are mentioned as a method of molding a resin composition into a film form and obtaining a resin film. An extrusion molding method in which a resin composition is melt-kneaded using an extruder, extruded, and then molded into a film by a T die or a circular die. Casting molding method in which a resin composition containing a solvent is cast to form a film. Other known film forming methods. In terms of being able to cope with thinning, extrusion molding or casting molding is preferred. The film includes a sheet.

A resin film as a B stage film can be obtained by molding the resin composition into a film, and drying by heating at 50°C to 150°C for 1 minute to 10 minutes, so that curing by heat does not proceed too much.

The film-like resin composition obtainable by the above-described drying process is referred to as a B-stage film. The B-stage film is in a semi-cured state. The semi-cured material is not completely cured, and curing may proceed further.

The resin film may not be a prepreg. When the resin film is not a prepreg, migration does not occur due to glass cloth or the like. Further, when the resin film is laminated or precured, irregularities resulting from the glass cloth do not occur on the surface. The resin film may be used in the form of a laminated film including a metal foil or a substrate, and a resin film laminated on the surface of the metal foil or substrate. It is preferable that the said metal foil is a copper foil.

Examples of the substrate of the laminated film include polyester resin films such as polyethylene terephthalate films and polybutylene terephthalate films, olefin resin films such as polyethylene films and polypropylene films, and polyimide resin films. If necessary, the surface of the substrate may be subjected to a release treatment.

From the viewpoint of further uniformly controlling the degree of curing of the resin film, the thickness of the resin film is preferably 5 µm or more, and preferably 200 µm or less. When the resin film is used as an insulating layer for a circuit, it is preferable that the thickness of the insulating layer formed of the resin film is not less than the thickness of the conductor layer (metal layer) forming the circuit. The thickness of the insulating layer is preferably 5 μm or more, and preferably 200 μm or less.

(Semiconductor device, printed wiring board, copper clad laminate and multilayer printed wiring board)

The resin material is suitably used in order to form a mold resin for embedding a semiconductor chip in a semiconductor device.

The resin material is suitably used in order to form an insulating layer in a printed wiring board.

The printed wiring board is obtained, for example, by heating and pressing the resin material.

With respect to the resin film, a metal foil can be laminated on one side or both sides. The method of laminating the resin film and the metal foil is not particularly limited, and a known method can be used. For example, the resin film can be laminated to the metal foil while heating or pressing without heating using an apparatus such as a parallel plate press or a roll laminator.

The resin material is suitably used to obtain a copper clad laminate. As an example of the said copper clad laminated board, a copper clad laminated board provided with a copper foil and a resin film laminated on one surface of the copper foil is mentioned.

The thickness of the copper foil of the copper clad laminate is not particularly limited. It is preferable that the thickness of the copper foil is in the range of 1 μm to 50 μm. In addition, in order to increase the adhesive strength between the cured product of the resin material and the copper foil, it is preferable that the copper foil has fine irregularities on its surface. The method for forming the irregularities is not particularly limited. As a method for forming the irregularities, a method for forming by treatment using a known chemical solution, etc. may be mentioned.

The resin material is suitably used to obtain a multilayer substrate.

As an example of the multilayer board, a multilayer board including a circuit board and an insulating layer laminated on the circuit board may be mentioned. The insulating layer of this multilayer substrate is formed of the resin material. In addition, the insulating layer of the multilayer substrate may be formed of the resin film of the laminated film using a laminated film. It is preferable that the insulating layer is laminated on the surface of the circuit board on which the circuit is provided. It is preferable that a part of the insulating layer is buried between the circuits.

In the multilayer substrate, it is preferable that the surface of the insulating layer opposite to the surface on which the circuit board is laminated is subjected to a roughening treatment.

As the roughening treatment method, a conventionally known roughening treatment method can be used and is not particularly limited. The surface of the insulating layer may be subjected to a swelling treatment before the roughening treatment.

In addition, it is preferable that the multilayer substrate further includes a copper plating layer laminated on the roughened surface of the insulating layer.

Further, as another example of the multilayer board, a circuit board, an insulating layer stacked on the surface of the circuit board, and a copper foil stacked on a surface of the insulating layer opposite to the surface on which the circuit board is stacked And a multilayered substrate. It is preferable that the said insulating layer is formed by hardening the said resin film using a copper clad laminated board provided with a copper foil and a resin film laminated on one surface of the copper foil. Moreover, it is preferable that the said copper foil is etched and is a copper circuit.

As another example of the multilayer board, a multilayer board including a circuit board and a plurality of insulating layers stacked on the surface of the circuit board may be mentioned. At least one of the plurality of insulating layers disposed on the circuit board is formed using the resin material. It is preferable that the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.

Among the multilayer substrates, in a multilayer printed wiring board, a low dielectric loss tangent is required, and high insulation reliability by an insulating layer is required. In the resin material according to the present invention, insulation reliability can be effectively improved by lowering the dielectric loss tangent and suppressing the occurrence of delamination. Therefore, the resin material according to the present invention is suitably used in order to form an insulating layer in a multilayer printed wiring board. The resin material according to the present invention is preferably a resin material capable of forming an insulating layer in a multilayer printed wiring board. The resin material according to the present invention is preferably a resin material suitable for forming an insulating layer in a multilayer printed wiring board.

The multilayer printed wiring board includes, for example, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a metal layer disposed between the plurality of insulating layers. At least one of the insulating layers is a cured product of the resin material.

1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to an embodiment of the present invention.

In the multilayer printed wiring board 11 shown in FIG. 1, a plurality of insulating layers 13 to 16 are laminated on the upper surface 12a of the circuit board 12. The insulating layers 13 to 16 are cured layers. A metal layer 17 is formed in a partial region of the upper surface 12a of the circuit board 12. Among the plurality of insulating layers 13 to 16, in the insulating layers 13 to 15 other than the insulating layer 16 located on the outer surface opposite to the circuit board 12 side, a metal layer ( 17) is formed. The metal layer 17 is a circuit. Metal layers 17 are disposed between the circuit board 12 and the insulating layer 13 and between the layers of the stacked insulating layers 13 to 16, respectively. The lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of a via hole connection and a through hole connection (not shown).

In the multilayer printed wiring board 11, the insulating layers 13 to 16 are formed of a cured product of the resin material. In this embodiment, since the surfaces of the insulating layers 13 to 16 are roughened, fine holes (not shown) are formed on the surfaces of the insulating layers 13 to 16. Further, the metal layer 17 has reached the inside of the fine hole. Moreover, in the multilayer printed wiring board 11, the width direction dimension L of the metal layer 17 and the width direction dimension S of the part where the metal layer 17 is not formed can be made small. Further, in the multilayer printed wiring board 11, good insulation reliability is imparted between the upper metal layer and the lower metal layer not connected by via-hole connection and through-hole connection (not shown).

(Harmonization treatment and swelling treatment)

It is preferable that the said resin material is used in order to obtain a hardened|cured material to be roughened or desmeared. The cured product includes a precured product capable of further curing.

Since fine irregularities are formed on the surface of the cured product obtained by precuring the resin material, the cured product is preferably subjected to a roughening treatment. Before the roughening treatment, the cured product is preferably subjected to a swelling treatment. It is preferable that the cured product is subjected to a swelling treatment after pre-hardening and before being subjected to a roughening treatment, and cured after the roughening treatment. However, the cured product does not necessarily have to be subjected to swelling treatment.

As the method of the swelling treatment, for example, a method of treating a cured product with an aqueous solution of a compound containing ethylene glycol or the like as a main component or an organic solvent dispersion solution is used. The swelling liquid used for the swelling treatment generally contains an alkali as a pH adjuster or the like. It is preferable that the swelling liquid contains sodium hydroxide. Specifically, for example, the swelling treatment is performed by treating a cured product at a treatment temperature of 30°C to 85°C for 1 minute to 30 minutes using a 40% by weight aqueous ethylene glycol solution or the like. It is preferable that the temperature of the swelling treatment is in the range of 50°C to 85°C. If the temperature of the swelling treatment is too low, a long time is required for the swelling treatment, and the adhesive strength between the cured product and the metal layer tends to decrease.

In the roughening treatment, for example, a chemical oxidizing agent such as a manganese compound, a chromium compound or a persulfate compound is used. These chemical oxidizing agents are used as aqueous solutions or organic solvent dispersion solutions after water or organic solvents are added. The roughening liquid used for the roughening treatment generally contains an alkali as a pH adjuster or the like. It is preferable that the roughening liquid contains sodium hydroxide.

Examples of the manganese compound include potassium permanganate and sodium permanganate. Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate. As said persulfate compound, sodium persulfate, potassium persulfate, ammonium persulfate, etc. are mentioned.

The arithmetic mean roughness Ra of the surface of the cured product is preferably 10 nm or more, preferably less than 300 nm, more preferably less than 200 nm, and still more preferably less than 150 nm. In this case, the bonding strength between the cured product and the metal layer is increased, and a finer wiring is formed on the surface of the insulating layer. Further, conductor loss can be suppressed, and signal loss can be suppressed low. The arithmetic mean roughness Ra is measured according to JIS B0601:1994.

(Laser via opening and desmear treatment)

A through hole may be formed in a cured product obtained by precuring the resin material. In the multilayer substrate or the like, a via or a through hole is formed as a through hole. For example, vias can be formed by irradiation of a laser such as a CO ₂ laser. The diameter of the via is not particularly limited, but is about 60 µm to 80 µm. Due to the formation of the through hole, smear, which is a residue of the resin derived from the resin component contained in the cured product, is often formed at the bottom of the via.

In order to remove the smear, the surface of the cured product is preferably subjected to desmear treatment. The desmear treatment may also serve as a roughening treatment.

In the desmear treatment, similarly to the roughening treatment, a chemical oxidizing agent such as a manganese compound, a chromium compound, or a persulfate compound is used. These chemical oxidizing agents are used as an aqueous solution or an organic solvent dispersion solution after water or an organic solvent is added. The desmear treatment liquid used for the desmear treatment generally contains an alkali. It is preferable that the desmear treatment liquid contains sodium hydroxide.

With the use of the resin material, the surface roughness of the surface of the desmeared cured product becomes sufficiently small.

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited to the following examples.

(Epoxy compound)

Bisphenol A type epoxy compound ("850-S" manufactured by DIC, Epoxy equivalent 187)

Biphenyl novolak type epoxy compound (Nippon Kayaku Co., Ltd. "NC-3000", epoxy equivalent 275)

(Inorganic filling)

Silica-containing slurry 1 (75% by weight of silica: "SC4050-HOA" manufactured by Admatex, specific surface area of 4.5 m2/g, average particle diameter of 1.0 μm, phenylaminosilane treatment, 25% by weight of cyclohexanone)

Silica-containing slurry 2 (silica 60% by weight: "SC1050-HLA" manufactured by Admatex, specific surface area 17 m 2 /g, average particle diameter 0.25 µm, phenylaminosilane treatment, cyclohexanone 40% by weight)

Silica-containing slurry 3 (50% by weight of silica: "YA100C" manufactured by Admatex, specific surface area of 30 m2/g, average particle diameter of 0.10 μm, phenylaminosilane treatment, 50% by weight of cyclohexanone)

Silica-containing slurry 4 (50% by weight of silica, "YA050C" manufactured by Admatex, specific surface area of 65 m2/g, average particle diameter of 0.05 μm, phenylaminosilane treatment, 50% by weight of cyclohexanone)

(Hardener)

Active ester resin-containing liquid ("EXB9416-70BK" manufactured by DIC, solid content 70% by weight)

(Silane coupling agent)

Silane coupling agent having a triazine skeleton (silane coupling agent having a diaminotriazine skeleton, "VD-5" manufactured by Shikoku Kasei Kogyo)

Silane coupling agent having no triazine skeleton (Shin-Etsu Chemical Co., Ltd. "KBM-573", N-phenyl-3-aminopropyltrimethoxysilane)

(Hardening accelerator)

Dimethylaminopyridine ("DMAP" manufactured by Wako Junyaku Kogyo)

(Thermoplastic resin)

Phenoxy resin-containing liquid ("YX6954BH30" manufactured by Mitsubishi Chemical Corporation, solid content 30% by weight)

(Other)

Phenol novolak resin having a triazine skeleton ("LA-1356" manufactured by DIC)

(Examples 1 to 7 and Comparative Examples 1 to 3)

The components shown in Tables 1 and 2 below were blended in the blending amounts (units are parts by weight of solid content) shown in Tables 1 and 2 below, and stirred at room temperature until a homogeneous solution was obtained to obtain a resin material.

Production of resin film:

Using an applicator, the obtained resin material was coated on the mold-releasing surface of the mold-releasing PET film ("XG284" manufactured by Toray Corporation, thickness 25 μm), and then dried in a gear oven at 100° C. for 3 minutes, and the solvent was volatilized. . In this way, a resin film (a laminated film of a PET film and a resin film) having a thickness of 40 µm was obtained on the PET film.

Lamination process (preparation of laminated sample A):

A copper clad laminated substrate (a laminate of a glass epoxy substrate having a thickness of 150 µm and a copper foil having a thickness of 35 µm) was prepared. Both surfaces of the copper clad laminated substrate were immersed in a copper surface roughening agent ("Mech Bond CZ-8100" manufactured by Mack Corporation) to roughen the copper surface.

The obtained sheet-like resin film was superimposed on the copper surface of the copper clad laminated substrate subjected to the roughening treatment, and a vacuum pressurized laminator ("MVLP-500" manufactured by Meiki Seisakusho Co., Ltd.) was used, a lamination pressure of 0.4 MPa and a lamination temperature of 100°C. It laminated at for 40 seconds, and pressed at a press pressure of 1.0 MPa and a press temperature of 100°C for 40 seconds. In this way, a laminate in which a resin film was laminated on the copper clad laminated substrate was produced. In the obtained laminate, after peeling the PET film, it was heated at 180° C. for 30 minutes to cure the uncured product of the resin material (resin film) to form an insulating layer. Then, the laminate was cut into small pieces of 5 cm x 5 cm. In this way, a laminated sample A in which a cured product of a resin material (resin film) was laminated on a copper clad laminated substrate was produced.

Next, the following wiring formation treatment was performed on the obtained laminated sample A.

Swelling process:

The laminated sample A was put in a 60°C swelling liquid (aqueous solution containing “Swelling Deep Secure Gant P” manufactured by Atotech Japan and “sodium hydroxide” manufactured by Wako Pure Chemical Industries, Ltd.), and the swelling temperature of 60° C. for 20 minutes Shaken. Thereafter, it was washed with pure water to obtain a swelling-treated laminated sample A.

Harmonized treatment (permanganate treatment):

The swelling-treated laminated sample A was put in 80°C of a sodium permanganate roughened aqueous solution ("Concentrate Compact CP" manufactured by Atotech Japan, "Sodium Hydroxide" manufactured by Wako Pure Chemical Industries, Ltd.), and shaken at 80°C for 20 minutes. Then, after washing|cleaning for 10 minutes with 40 degreeC washing liquid ("Reduction Security P" manufactured by Atotech Japan, "Sulfuric acid" manufactured by Wako Pure Chemical Industries, Ltd.), it was further washed with pure water. In this way, a roughened cured product was formed on the glass epoxy substrate on which the inner layer circuit was formed by etching.

Electroless plating process:

The surface of the cured product subjected to the roughening treatment was treated with an alkali cleaner at 60°C (“Cleaner Secure 902” by Atotech Japan) for 5 minutes, followed by degreasing and washing. After washing, the cured product was treated with a 25°C pre-dip liquid ("Pre-dip Neogant B" manufactured by Atotech Japan) for 2 minutes. Thereafter, the cured product was treated with an activator liquid at 40° C. (“Activator Neogant 834” manufactured by Atotech Japan) for 5 minutes, and a palladium catalyst was applied. Next, the cured product was treated for 5 minutes with a 30°C reducing liquid ("Reducer Neogant WA" manufactured by Atotech Japan).

Next, the cured product was put in a chemical copper liquid (all made by Atotech Japan ``Basic Printogant MSK-DK'', ``Cooper Printogant MSK'', ``Stabilizer Printogant MSK'', ``Reducer Cu''), and electroless plating Was carried out until the plating thickness became about 0.5 μm. After electroless plating, in order to remove residual hydrogen gas, annealing treatment was performed at a temperature of 120°C for 30 minutes. All the steps up to the step of electroless plating were performed while making the treatment liquid 2L on a beaker scale and shaking the cured product.

Electrolytic copper plating process:

After the electroless plating was formed, electrolytic copper plating was performed until the plating thickness became 25 µm, and an electrolytic copper plating layer was formed. As electrolytic copper plating, an aqueous solution of copper sulfate ("Copper sulfate pentahydrate" manufactured by Wako Pure Chemical Industries, Ltd., "sulfuric acid" manufactured by Wako Pure Chemical Industries, Ltd., "Basic Leveler Capalase HL" manufactured by Atotech Japan, and "Cupraside Corrector" manufactured by Atotech Japan. GS") was used, and a current of 0.6 A/cm 2 was passed. Thereby, a laminated structure after quick etching was obtained.

Main curing process:

A sample for evaluation was prepared by heating the laminated structure after quick etching for 60 minutes in a gear oven at 180°C and curing it.

(evaluation)

(1) Delamination (blister inhibition)

Using the obtained sample for evaluation, a moisture absorption test (40 hours at a temperature of 60°C and a humidity of 60RH%) was performed in accordance with JEDEC LEVEL3. Then, nitrogen reflow treatment (peak top temperature 260 degreeC) was performed. In addition, the reflow treatment was repeated 30 times. The occurrence of blister after reflow was visually confirmed.

[Criteria for Delamination (Blister Inhibition)]

○○: No blister generation in 30 reflow treatments

○: Blister occurs in 21 to 29 reflow treatments

×: blister generation in 20 or less reflow treatments

(2) genetic loss tangent

The obtained resin film was cut into a size having a width of 2 mm and a length of 80 mm, and five sheets were stacked to obtain a laminate having a thickness of 200 µm. With respect to the obtained laminate, using the "cavity resonance perturbation method dielectric constant measuring device CP521" manufactured by Kanto Denshi Oyou Kaihatsu Corporation and "Network Analyzer N5224A PNA" manufactured by Keysight Technologies, the frequency at room temperature (23°C) by the cavity resonance method. The dielectric loss tangent was measured at 1.0 GHz.

[Criteria for determining genetic loss tangent]

○○: dielectric loss tangent of 0.0050 or less

○: dielectric loss tangent exceeds 0.0050 and falls below 0.0055

×: dielectric loss tangent exceeds 0.0055

The composition and results are shown in Tables 1 and 2 below.

11: Multilayer printed wiring board
12: circuit board
12a: top surface
13 to 16: insulating layer
17: metal layer

Claims (9)

Including an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton,
The resin material, wherein the inorganic filler has a specific surface area of 1 m 2 /g or more and 50 m 2 /g or less. The resin material according to claim 1, wherein the silane coupling agent is a silane coupling agent having a diaminotriazine skeleton. The resin material according to claim 1 or 2, wherein the curing agent contains an active ester compound, a cyanate compound, a benzoxazine compound, a carbodiimide compound, or a maleimide compound. The resin material according to any one of claims 1 to 3, wherein the content of the silane coupling agent is 0.1% by weight or more and 3% by weight or less in 100% by weight of the components excluding the inorganic filler and the solvent in the resin material. The resin material according to any one of claims 1 to 4, wherein the content of the inorganic filler is 30% by weight or more in 100% by weight of components excluding the solvent in the resin material. The resin material according to any one of claims 1 to 5, which is a thermosetting material. The resin material according to any one of claims 1 to 6, which is a resin film. The resin material according to any one of claims 1 to 7, which is used for forming an insulating layer in a multilayer printed wiring board. A circuit board,
A plurality of insulating layers disposed on the surface of the circuit board,
Having a metal layer disposed between the plurality of insulating layers,
At least one of the plurality of insulating layers is a cured product of the resin material according to any one of claims 1 to 8. A multilayer printed wiring board.

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