KR20210009083A - A wafer chuck assembly for multi prober - Google Patents

Abstract

A wafer chuck assembly for a multiprover, comprising: a wafer chuck that supports a wafer, a heater attached to a lower portion of the wafer chuck to heat the wafer chuck, and a relative level of the wafer chuck by attaching to the wafer chuck at predetermined intervals. A guard member, a grounding member that is attached to the guard member at predetermined intervals to provide a reference level of the wafer chuck, and a contactless non-contact disposed spaced apart from the wafer chuck at predetermined intervals to measure the temperature of the wafer chuck heated by the heater It includes a temperature sensor.

Description

A wafer chuck assembly for multi prober

The present invention relates to a wafer chuck assembly for a multi prober.

In general, semiconductor devices such as integrated circuit devices may be formed by repeatedly performing a series of semiconductor processes on a semiconductor wafer. For example, a deposition process to form a thin film on a wafer, an etching process to form a thin film into patterns having electrical characteristics, an ion implantation process or diffusion process to implant or diffuse impurities into the patterns, and a wafer on which patterns are formed Semiconductor circuit elements may be formed on a wafer by repeatedly performing a cleaning and rinsing process for removing impurities from the wafer.

After the semiconductor devices are formed through a series of processes, an inspection process for inspecting electrical characteristics of the semiconductor devices may be performed. The inspection process may be performed by a prober or probe station including a probe card having a plurality of probes and a tester connected to the probe card to provide an electrical signal.

Typically, during wafer inspection, the wafer is first put in a cassette and placed on a pub (Front Opening Unified Pod, FOUP). The wafer is transferred from the cassette to the wafer chuck mounted on the stage. Thereafter, the stage is moved to align the wafer to bring the wafer into contact with the probe card. The probe card is brought into contact with the wafer placed on the wafer chuck, and the wafer is inspected using tester equipment.

Such a wafer inspection process is a phenomenon that was not a problem in the past micron line width process wafers. One of the problems that occurs in wafers manufactured by the nano line width process is a test error caused by a leakage current. Physically, as the line width of the gate is narrowed, the gate channel inside the wafer element is formed incompletely even by leakage of a small number of electrons (or holes), so even if a very small amount of electrons (or holes) leak from the wafer chuck occurs, test error I had a problem.

In addition, in order to control the temperature of the wafer chuck during the above-described wafer inspection, a hole through which a temperature sensor can be inserted was formed on the side of the wafer chuck, and a temperature sensor was inserted into the hole to measure the temperature of the wafer chuck.

Such a wafer inspection device includes a single prober capable of inspecting a single wafer during one inspection and a multi prober capable of inspecting a plurality of wafers during one inspection, but in the present invention, a wafer chuck mounted on a multiprober There is a problem in that the electrical wiring is twisted or obstructs the rotation of the external body due to the electrical wiring including a signal line such as a guard line capable of transmitting and receiving a signal for measuring a leakage current in the assembly.

An embodiment of the present invention provides a wafer chuck assembly capable of preventing twisting of electrical wiring or obstructing rotation of an external body due to electrical wiring including signal lines such as a guard line of a wafer chuck constituting a cartridge for a multiprover. I want to.

According to an aspect of the present invention, there is provided a wafer chuck assembly for a multi-prover, comprising: a wafer chuck supporting a wafer, a heater attached to a lower portion of the wafer chuck to heat the wafer chuck, and attached to the wafer chuck at predetermined intervals A guard member that provides a relative level of the wafer chuck, a ground member that is attached to the guard member at a predetermined interval to provide a reference level of the wafer chuck, and the wafer chuck to measure the temperature of the wafer chuck heated by the heater. It provides a wafer chuck assembly comprising a contactless temperature sensor spaced apart at a predetermined interval.

In addition, the contactless temperature sensor may be disposed at a predetermined interval under the wafer chuck through a hollow portion formed in the center of the body portion.

In addition, the non-contact temperature sensor may be spaced apart from the wafer chuck at a predetermined distance from the wafer chuck in order to use air as the dielectric constant, and may be disposed below the center of the wafer chuck.

In addition, electrical wiring including the signal line of the guard member and the signal line of the ground member may be formed through the inside of the hollow portion formed at the center of the body portion.

In addition, the heat (temperature) generated by the heater may further include a heat insulating member disposed under the heater so as to be directed only to the wafer chuck in one direction and blocked in the other direction.

In addition, it may further include an electrical insulating member disposed between the heater and the wafer chuck.

In addition, in order to place the contactless temperature sensor close to the lower portion of the wafer chuck, a first through hole is formed in the heater to pass the contactless temperature sensor, and a second pass through the heat insulating member to pass the contactless temperature sensor. Holes can be formed.

According to an embodiment of the present invention, the wafer chuck assembly has an effect of suppressing leakage current by introducing a guard member using air as a dielectric constant value.

In addition, the wafer chuck assembly according to an embodiment of the present invention can prevent the electric wiring from being twisted or obstructing the rotation of the outer body due to the electric wiring including the signal line such as a guard line.

In addition, the wafer chuck assembly according to an embodiment of the present invention forms a conductive metal member for shielding power noise and a conductive guard member between the wafer, the wafer chuck and the ground member, thereby increasing the relative energy level of the conductive guard member. The leakage current can be suppressed by making it difficult to move the leakage electrons generated in

In addition, the wafer chuck assembly according to an embodiment of the present invention measures the temperature of the wafer chuck heated by the heater using a non-contact temperature sensor, so that the insulation resistance is very high and the dielectric constant is very low, so that the occurrence of leakage current can be suppressed.

1 is a front view showing a state in which a wafer chuck assembly and a probe card structure constituting a cartridge according to an embodiment of the present invention are separated.
2 is a front view showing a locked state of the probe card structure constituting the wafer chuck assembly and the cartridge according to an embodiment of the present invention.
3 is a cross-sectional view of a cartridge including a wafer chuck assembly according to an embodiment of the present invention.
4 is an enlarged view of part A in FIG. 1.
5 is a cross-sectional view of a portion of a wafer chuck assembly according to an embodiment of the present invention.
6 is a view as viewed from the lower side of the cartridge including the wafer chuck assembly according to an embodiment of the present invention.
7 is a cross-sectional view of another portion of the wafer chuck assembly according to an embodiment of the present invention.
8 is a view showing the electrical structure of the wafer chuck assembly according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the present invention. The present invention may be implemented in various different forms, and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and the same reference numerals are assigned to the same or similar components throughout the specification.

1 is a front view showing a state in which a wafer chuck assembly and a probe card structure constituting a cartridge according to an embodiment of the present invention are separated. 2 is a front view illustrating a locked state of a probe card structure constituting a wafer chuck assembly and a cartridge according to an embodiment of the present invention. 3 is a cross-sectional view of a cartridge including a wafer chuck assembly according to an embodiment of the present invention. 4 is an enlarged view of part A in FIG. 1. 5 is a cross-sectional view of a portion of a wafer chuck assembly according to an embodiment of the present invention. 6 is a view as viewed from the lower side of the cartridge including the wafer chuck assembly according to an embodiment of the present invention. 7 is a cross-sectional view of another portion of the wafer chuck assembly according to an embodiment of the present invention. 8 is a view showing the electrical structure of the wafer chuck assembly according to an embodiment of the present invention.

The wafer chuck assembly 100 according to an embodiment of the present invention is composed of a probe card structure 102 and a cartridge 300 having a structure that is mechanically locked or separated, and is mounted in a chamber of a multiprover to perform an electrical test. Is used as

Wafer chuck assembly 100 according to an embodiment of the present invention, as can be seen from FIGS. 1 to 5, a wafer chuck 106, a heater 130, a non-contact temperature sensor 200, a conductive guard member It may include 150 and the body portion 170. At this time, the rotating body 178 and the probe card structure 102 of the wafer chuck assembly 100 may be mechanically coupled by an attached locker to have a cartridge 300-like structure.

In more detail, the probe card structure 102 may include a printed circuit board 110, a probe 112, and a printed circuit board reinforcing part 114.

The printed circuit board 110 is formed of rigid panel resin (PCB) material, and may be formed in a polygonal plate shape. A plurality of probes 112 may be formed to protrude toward the wafer 104 on the lower surface of the printed circuit board 110. In this case, various devices inside the wafer 104 may be tested using the plurality of probes 112.

The printed circuit board reinforcement part 114 may include an upper reinforcing member 114a coupled to the upper surface of the printed circuit board 110 and a lower reinforcing member 114b coupled to the lower surface. The printed circuit board reinforcement part 114 may be for the purpose of reinforcing rigidity to prevent the printed circuit board 110 from being bent by an external force during a test or in a storage state.

In an embodiment of the present invention, the upper reinforcing member 114a of the printed circuit board reinforcing part 114 does not necessarily have the same shape as the printed circuit board 110, and allows the electric signal processing of the probe 112 to be performed. It may be formed of a polygonal flat member.

A locker is formed on the upper reinforcing member 114a located on the upper side of the printed circuit board 110 of the probe card structure 102 so that it can be moved in a state coupled to a transfer robot (not shown). A locker is also formed in the located lower reinforcing member 114b to lock the wafer chuck assembly 100 to form a cartridge 300 state.

Meanwhile, the lower reinforcing member 114b is electrically insulated and coupled to the lower surface of the printed circuit board 110 and has a ring shape. The upper locker 182 of the locking part 180, which will be described later, is positioned under the lower reinforcing member 114b.

The wafer chuck 106 has a cylindrical shape and may have a seating surface (not shown) on which the wafer 104 is positioned. As an example, the wafer chuck 106 may be lightened by using electroless nickel plated aluminum, and may be surface-treated to have electrical conductivity. At this time, the wafer chuck 106 is in contact with the backside of the wafer and has electrical, thermal, and mechanical contact characteristics.

In this case, an air flow path for the flow of air may be formed inside the wafer chuck 106 for adsorption of the wafer 104, but in the drawings of the present specification, illustrations thereof are omitted for simplicity. I did.

An insulating member 120 may be provided under the wafer chuck 106 to insulate the wafer chuck 106 from the outside. In addition, a heater 130 may be disposed under the insulating member 120. At this time, the heater 130 is provided to heat the wafer chuck 106, and in order to allow heat from the heater 130 to be transferred only in the direction of the wafer chuck, an insulating member 140 is provided under the heater 130. May be provided.

According to an embodiment of the present invention, a contactless temperature sensor 200 is installed under the wafer chuck 106 to measure the temperature of the wafer chuck 106. At this time, the non-contact temperature sensor 200 is formed to be spatially spaced apart from the lower surface of the wafer chuck 106, and is disposed adjacent to the center of the cylindrical wafer chuck assembly.

The contactless temperature sensor 200 can measure the temperature without contacting the wafer chuck 106. As an example, the non-contact temperature sensor 200 is an infrared temperature sensor, and may detect a temperature value by detecting the temperature of the surface of the wafer chuck 106 using infrared rays and processing a signal. As another example, the contactless temperature sensor 200 measures a supply voltage (V) and a supply current (I) supplied to the heater 130 to obtain a thermal resistance (R) corresponding to the temperature of the wafer chuck. Temperature can be measured indirectly.

In addition, the contactless temperature sensor 200 may include a measuring means (not shown) for measuring the temperature of the wafer chuck 106 without contacting the temperature. At this time, the measuring means is a means for directly measuring the temperature of the wafer chuck using infrared rays, or a thermal resistance corresponding to the temperature of the wafer chuck by measuring the supply voltage (V) and supply current (I) supplied to the heater ( It may be a means for indirectly measuring the temperature of the wafer chuck by obtaining R). At this time, it may be thermal resistance (=corresponding to temperature) R = supply voltage (V)/supply current (I).

A detailed installation structure of the contactless temperature sensor 200 will be described later.

Meanwhile, according to an embodiment of the present invention, the heater 130 may be used by attaching the shield member 132 to both the upper and lower surfaces to shield power noise generated from the heater 130. At this time, the shielding member 132 is a conductive metal plate, and may be necessarily connected to a ground wire (class 3 ground, 100 Ω (ohm) or less).

A conductive guard member 150 may be installed under the heater 130.

In order to minimize the leakage current of the wafer chuck assembly 100, it is necessary to increase the relative energy level of the conductive guard member 150 so that there is little difference between the energy level and the energy level of the wafer chuck 106. Electrically, in order to form the energy level of the conductive guard member 150 relatively close to the energy level of the wafer chuck 106, it is necessary to have a minimum dielectric constant and a maximum insulation resistance.

In order to satisfy these conditions, in the wafer chuck assembly 100 according to an exemplary embodiment of the present invention, a structure including two conductive guard members 152 and 154 is disclosed.

At this time, the first guard member 152 and the second guard member 154 are spaced apart from the wafer chuck 106 at a predetermined interval. At this time, the separation distance between the two guard members 152 and 154 is about 1 mm to 50 mm, preferably about 1 mm to 10 mm, and the number and separation distance of the conductive guard members 150 to be stacked are experimentally Of course it can be chosen.

Accordingly, air may exist in the space between the first guard member 152 and the second guard member 154, and this air serves as a dielectric material, and a plurality of guard members 152, 154 compared to the resistance value By disposing) between the wafer chuck 106 and the ground member 160, the amount of leakage current can be reduced by limiting the relative energy level difference to lower the energy of the incoming electrons.

This is because the electrostatic capacity is minimized by forming the contactless temperature sensor 200 having air as the dielectric constant, and leakage electrons are prevented from moving from the ground member 160 to the wafer chuck 106, and secondary to a plurality of guard members. By forming (152, 154) in series to artificially create a relative level close to the signal level of the wafer chuck 106, there is an effect of suppressing the activation energy of the leakage current.

According to an embodiment of the present invention, the guard support 156 is provided with a wafer chuck 106 or a heater 130 and a first guard member 152 and an adjacent guard in order to spaced apart a plurality of conductive guard members 150. It may be disposed between the second guard member 154 which is a member. The guard support 156 is preferably formed of a heat insulating material having no electrical conductivity and thermal conductivity.

A conductive metal ground member 160 may be provided under the plurality of conductive guard members 150 for an electrical ground signal. In this case, the ground member 160 may be a copper plate having low electrical resistance and excellent conductivity, but is not limited thereto. In addition, the location, quantity, and shape of the plurality of conductive guard members 150 and the ground member 160 may be variously changed according to the type of leakage current.

According to an embodiment of the present invention, in order to position the heater 130, the plurality of conductive guard members 150, and the ground member 160 under the wafer chuck 106, the body part 170 is provided under the wafer chuck 106. ) Is provided.

3, 5, and 7, in an embodiment of the present invention, the body portion 170 includes a first body 172, a second body 174, an inner body 176, and a rotating body 178. ) Can be included.

The first body 172 may be formed in the form of a ring-shaped plate having a first hollow portion 173 in the central portion. The first hollow portion 173 may be formed as a circular hole disposed concentrically with the cylindrical wafer chuck 106. The first body 172 is made of a metal material having a predetermined thickness, and thus provides mechanical rigidity capable of supporting the wafer chuck 106 to the inner body 176. At this time, the wafer chuck 106 is positioned between the first body portion 172 while the heater 130, the guard plate 150, and the like are provided.

Meanwhile, one or more body supporters 190 may be disposed between the first body 172 and the wafer chuck 106 to maintain a gap between the first body 172 and the wafer chuck 106. This is to maintain a space in which the heater 130, the conductive guard member 150, and the ground member 160 are disposed between the wafer chuck 106 and the first body 172.

The second body 174 is spaced apart from the first body 172 in a downward direction. The second body 174 may be formed in a ring shape having a second hollow portion 175 in the center and formed in a plate shape having a predetermined thickness.

An inner body 176 made of a ring-shaped plate having a third hollow portion 177 in the center may be fixed between the first body 172 and the second body 174.

At this time, in order to provide a lower locker to have a rotation locking characteristic, a rotation bearing 192 is introduced, and an inner body 176 is positioned on the inner ring part, and the rotation body 178 may be rotatably coupled to the outer ring part. .

The rotating body 178 may be formed of a ring-shaped plate member. The thickness of the rotating body 178 may correspond to the thickness of the inner body 176.

A rotating bearing 192 is positioned between the rotating body 178 and the inner body 176 so that the rotating body 178 can rotate around the inner body 176. Formed so that the rotating body 178 can rotate with respect to the inner body 176 is that the upper locker 182 and the lower locker 184 of the locking unit 180 to be described later are mutually locked (fastened) or separated (released). It is to make it possible.

Meanwhile, the above-described non-contact temperature sensor 200 may be disposed under the wafer chuck 106 through the inside of the first hollow part 173. In addition, the power line 134 of the heater 130 may also be formed to pass through the first hollow portion 173 to be connected to the heater 130.

Here, what can be connected through the first hollow part 173 includes electrical wiring of sensors and heaters, as well as wiring of other electrical devices, for example, a ground wire connected to the shielding member 132 which is a conductive metal plate, and , A signal line, such as a guard line, which is connected to the guard member 150 and capable of transmitting and receiving a signal for measuring a leakage current may be included.

In addition, in order to allow the contactless temperature sensor 200 to be disposed under the wafer chuck 106, a first through hole 136 through which the contactless temperature sensor 200 passes may be formed in the heater 130. have. In addition, the non-contact temperature sensor 200 is disposed adjacent to the wafer chuck 106 at a predetermined distance from the lower portion of the wafer chuck 106, so that the heat insulating member 140 disposed under the heater 130 is also non-existent. A second through hole 142 through which the contact temperature sensor 200 passes may be formed.

That is, the non-contact temperature sensor 200 penetrates the heater 130 and the heat insulating member 140 and is fixed in a contactless manner to the lower portion of the wafer chuck 106, so that the rotating body of the body does not interfere with the rotation of the body. It is formed to accurately measure the temperature of the wafer chuck.

According to an embodiment of the present invention, the first hollow portion 173 of the first body 172, the second hollow portion 175 of the second body 174, the third hollow portion 177 of the inner body, and The rotating body 178 is formed of a circular hole disposed concentrically with the wafer chuck 106, and the power lines of the contactless temperature sensor and the heater described above are provided with a first hollow part, a second hollow part, and a third hollow. It is formed to pass through the wealth. Here, the meaning of the concentric axis refers to object balance, which means that the upper locker 182 and the lower locker 184 disposed in a circumferential shape include an error range in which they are mutually locked.

At this time, the power line 134 of the heater 130 and the electric wiring of sensors and the ground line connected to the shielding member 132 which is a conductive metal plate, and the guard member 150 are connected to transmit and receive signals for measuring leakage current. Electrical wiring including a signal line such as a guard wire may be formed through the first hollow portion 173, the second hollow portion 175 and the third hollow portion 177 disposed on a concentric axis, Even if the outer body of the body portion rotates, it may be configured so that the electrical wiring does not twist or interfere with the rotation of the outer body.

At this time, the rotation body 178 of the outer ring portion of the rotation bearing 192 is formed to have a larger diameter than the first body 172 and the second body 174, so that the outer ring portion of the first body 172 and the second body It is formed so as to protrude outward from (174).

A ring-shaped partition wall 179 protruding in the wafer chuck direction may be coupled to an upper surface of the outer ring portion of the rotating body 178. The reason why the ring-shaped partition wall 179 is combined is a concept for height adjustment in which the lower locker 184 is easy to lock (fasten) or separate (release) from the upper locker 182, and additionally, the rotating body 178 The meaning of reinforcing stiffness and the meaning that the conductive guard member 150 and the ground member 160 can be protected from the outside under the wafer chuck 106 are added.

3 to 5, a locking part 180 is formed between the reinforcing part 114 of the printed circuit board and the body part 170 of the probe card structure 102. In more detail, the locking part 180 includes an upper locker 182 formed under the lower reinforcing member 114b of the probe card structure 102 and a lower locker 184 formed over the ring-shaped partition wall 179 of the rotating body 178. ) Can be included.

The upper locker 182 and the lower locker 184 are formed with fastening parts that can be mutually fastened by relative rotation between the probe card structure 102 and the rotating body 178 of the body part 170.

The fastening portion may include a first protrusion 182a protruding from the upper locker 182 in the transverse direction, and a second protrusion 184a protruding from the lower locker 184 in a direction opposite to the first protrusion 182a. .

In a state in which the first protrusion 182a and the second protrusion 184a do not overlap in the vertical direction, the probe card structure 102 and the body 170, more specifically, the rotating body 178 are disposed adjacent to each other. After that, when the rotation body 178 of the body part 170 is rotated by a predetermined angle in the left direction as seen in FIG. 4, the upper surface of the first protrusion part 182a Locking (fastening) between the probe card structure 102 and the body 170 is made while the lower surface of the second protrusion 184a is in contact.

According to an embodiment of the present invention, the body portion 170 is formed of a metal material to have a predetermined weight, and the upper locker 182 and the lower locker 184 are fastened by the weight of the body portion 170 It is formed to be locked (fastened) by gravity.

In the case of releasing the fastening between the probe card structure 102 and the body part 170, the body part 170 is set with respect to the probe card structure 102, and the rotating body 178 is set to the right as viewed in FIG. When the angle is rotated, the first protrusion 182a and the second protrusion 184a do not contact each other, and the probe card structure 102 and the body are in a state where the first protrusion 182a and the second protrusion 184a do not contact each other. The parts 170 can be separated (released) from each other.

According to an embodiment of the present invention, the locking part 180 is provided on the lower reinforcing member 114b of the probe card structure 102 and the ring-shaped partition wall 179 of the rotating body 178 to rotate bearing 192 in the circumferential direction. ) A plurality of spaced along the outer ring may be installed.

When the probe card structure 102 is combined with the body part 170 by the locking structure of the locking part 180, the wafer chuck assembly 100 can be assembled in the form of the probe card structure 102 and the cartridge 300. have. The assembly of the probe card structure 102 and the body part 170 may be performed in an aligner not shown, and the cartridge-type wafer chuck assembly assembled in the aligner is moved into the channel (not shown) by a transfer robot. After that, a subsequent process may be performed.

The wafer chuck assembly according to an embodiment of the present invention is formed in the form of a cartridge 300 in which a lower locker formed on the body portion and an upper locker formed on the probe card structure are coupled, the upper locker 182 and the lower locker 184 In order to be coupled to each other, the outer body of the body portion may have a rotating body structure that rotates about a central axis of the wafer chuck.

The wafer chuck assembly to which the embodiment of the present invention described above is applied can be used to test multiple wafers simultaneously by charging them into a channel of a multiprover for electrical testing multiple wafers at once.

For example, in order to use the wafer chuck assembly in a multi prober, a plurality of probe cards, wafers and wafer chucks must be prepared, and one probe card, one wafer, and one wafer The chuck may be combined and used in the form of a cartridge such as a wafer chuck structure according to an embodiment of the present invention.

In this case, an aligner (not shown) may be provided to combine one probe card, one wafer, and one wafer chuck into a cartridge-type wafer chuck assembly, and a plurality of wafer chuck assemblies joined by the aligner Each of them is sequentially loaded into multiple channels of the multi-prover, and then multi-tests can be performed simultaneously.

In this way, since a plurality of wafer chuck assemblies can be loaded into a plurality of channels to perform a test at the same time, the multi-prober has the advantage of remarkably increasing test throughput.

Although an embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in the present specification, and those skilled in the art who understand the spirit of the present invention can add components within the scope of the same idea. It will be possible to easily propose other embodiments by changing, deleting, adding, etc., but it will be said that this is also within the scope of the present invention.

100: wafer chuck assembly 102: probe card structure
104: wafer 106: wafer chuck
110: printed circuit board 112: probe
114: printed circuit board reinforcing part 114a: upper reinforcing member
114b: lower reinforcing member 120: insulating member
130: heater 132: shielding member
134: power line 136: first through hole
140: insulation member
142: second through hole 150: guard member
152: first guard member 154: second guard member
156: guard support 160: ground member
170: body portion 172: first body
173: first hollow part 174: second body
175: the second hollow part
176: inner body 177: third hollow part
178: rotating body 179: ring-shaped bulkhead
180: locking part 182: upper locker
184: lower locker 190: body support
192: rotary bearing
200: contactless temperature sensor 300: cartridge for multiprover

Claims (7)

A wafer chuck supporting a wafer;
A body portion attached to a lower portion of the wafer chuck, including a heater capable of heating the wafer chuck, and supporting the wafer chuck from the lower portion;
A guard member attached to the wafer chuck at a predetermined interval to provide a relative level of the wafer chuck;
A ground member attached to the guard member at a predetermined interval to provide a reference level of the wafer chuck; And
Wafer chuck assembly comprising a contactless temperature sensor spaced apart from the wafer chuck at predetermined intervals in order to measure the temperature of the wafer chuck heated by the heater. The method of claim 1,
The contactless temperature sensor is a wafer chuck assembly disposed at a predetermined interval under the wafer chuck through a hollow portion formed in the center of the body portion. The method of claim 1,
The contactless temperature sensor is spaced apart from the wafer chuck at a predetermined spacing from the wafer chuck in order to use air as a dielectric constant, and is disposed below the center of the wafer chuck. The method of claim 1,
A wafer chuck assembly for forming electrical wiring, including a signal line of the guard member and a signal line of a ground member, through the inside of a hollow portion formed at the center of the body portion. The method of claim 4,
A wafer chuck assembly further comprising a heat insulating member disposed under the heater so that the heat (temperature) generated from the heater is directed only to the wafer chuck in one direction and blocked in the other direction. The method of claim 1,
Wafer chuck assembly further comprising an electrically insulating member disposed between the heater and the wafer chuck. The method of claim 1,
In order to place the contactless temperature sensor close to the lower portion of the wafer chuck, a first through hole is formed in the heater to pass the contactless temperature sensor, and a second through hole is formed to pass the contactless temperature sensor through the heat insulating member. Wafer chuck assembly to be formed.

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