KR20210005938A - 증착 증발기 장치 - Google Patents
증착 증발기 장치 Download PDFInfo
- Publication number
- KR20210005938A KR20210005938A KR1020207034708A KR20207034708A KR20210005938A KR 20210005938 A KR20210005938 A KR 20210005938A KR 1020207034708 A KR1020207034708 A KR 1020207034708A KR 20207034708 A KR20207034708 A KR 20207034708A KR 20210005938 A KR20210005938 A KR 20210005938A
- Authority
- KR
- South Korea
- Prior art keywords
- zone
- evaporator
- crucible
- melt down
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
도 2는 도 1의 도가니의 측면도이고;
도 3은 도 1의 도가니의 측단면도를 도시하고;
도 4는 도 1의 도가니를 포함하는 증발기 장치를 개략적으로 도시하고;
도 5는 증발기 장치의 제어 시스템을 개략적으로 도시하고;
도 6은 증발기 장치의 대안적인 도가니의 위에서 본 시시도를 도시한다.
Claims (15)
- 증착 증발기 장치로서,
고체 재료가 도가니에 도입되는 입구 및 증발된 재료가 상기 도가니로부터 방출되는 출구를 갖는 도가니;
하나 이상의 히터;
베이스; 및
안내면을 포함하고,
상기 안내면은 상기 도가니 내의 용융된 재료로부터 방출된 증기를 상기 출구로부터 멀어지는 방향으로 지향시키는, 증착 증발기 장치. - 제 1 항에 있어서,
상기 도가니는 멜트 다운(melt-down) 구역, 증발기 구역, 및 용융된 재료가 상기 멜트 다운 구역으로부터 상기 증발기 구역으로 통과하는 가열 구역을 포함하고, 상기 입구는 상기 멜트 다운 구역에 위치하고, 상기 출구는 상기 증발기 구역에 위치하는, 증착 증발기 장치. - 제 2 항에 있어서,
상기 도가니는 상기 베이스 위로 연장되는 커버를 포함하는, 증착 증발기 장치. - 제 3 항에 있어서,
상기 커버에는, 적어도 부분적으로, 상기 안내면이 형성되어 있는, 증착 증발기 장치. - 제 4 항에 있어서,
상기 안내면은 방출된 증기를 상기 입구를 향해 지향시키는, 증착 증발기 장치. - 제 4 항 또는 제 5 항에 있어서,
상기 안내면은 상기 방출된 증기를 상기 증발기 장치의 하나 이상의 통기공을 향해 지향시키도록 구성된, 증착 증발기 장치. - 제 2 항 내지 제 6 항 중 어느 한 항에 있어서,
상기 안내면은 상기 도가니의 가열 구역 위로 연장되고, 방출된 증기를 상기 증발기 구역으로부터 멀어지는 방향을 향해 지향시키기 위한 형상을 갖는, 증착 증발기 장치. - 제 2 항 내지 제 7 항 중 어느 한 항에 있어서,
상기 가열 구역은 상기 멜트 다운 구역과 상기 증발기 구역 사이에 연장되어 있는, 증착 증발기 장치. - 제 8 항에 있어서,
상기 장치의 베이스는 상기 가열 구역, 상기 멜트 다운 구역, 및 상기 증발기 구역이 공유하는, 증착 증발기 장치. - 제 3 항 내지 제 9 항 중 어느 한 항에 있어서,
상기 커버는 상기 증발기 구역으로부터 상기 멜트 다운 구역을 향해 상방으로 경사진, 증착 증발기 장치. - 제 2 항 내지 제 10 항 중 어느 한 항에 있어서,
상기 베이스는 상기 멜트 다운 구역으로부터 상기 증발기 구역을 향해 상방으로 경사진, 증착 증발기 장치. - 제 2 항 내지 제 9 항 중 어느 한 항에 있어서,
상기 장치의 베이스 및 안내면은 상기 증발기 구역으로부터 발산하는, 증착 증발기 장치. - 제 1 항 내지 제 12 항 중 어느 한 항에 있어서,
상기 하나 이상의 히터는 상기 멜트 다운 구역을 가열하기 위한 제 1 히터 및 상기 증발기 구역을 가열하기 위한 제 2 히터를 포함하는, 증착 증발기 장치. - 고체 재료를 용융 및 증발시키는 방법으로서,
상기 방법은:
도가니의 멜트 다운 구역을 제 1 온도까지 가열하는 단계;
상기 도가니의 증발기 구역을 상기 제 1 온도보다 높은 제 2 온도까지 가열하는 단계;
상기 제 1 온도보다 낮은 녹는점 및 상기 제 2 온도보다 낮은 끓는점을 가진 고체 재료를 가열된 상기 멜트 다운 구역에 도입하는 단계;
용융된 재료를 상기 멜트 다운 구역으로부터 가열 구역을 통해 상기 증발기 구역으로 유동시키는 단계;
상기 증발기 구역으로부터 증발된 재료를 방출하는 단계; 및
상기 가열 구역 내에서 용융된 재료로부터 방출된 증기를 상기 증발기 구역으로부터 멀어지는 방향으로 안내하는 단계를 포함하는, 고체 재료를 용융 및 증발시키는 방법. - 제 14 항에 있어서,
상기 고체 재료는 배치 프로세스(batch process)로 상기 도가니 내에 도입되고, 상기 증발된 재료는 상기 도가니로부터 연속 흐름으로 방출되는, 고체 재료를 용융 및 증발시키는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1809089.4A GB2574400B (en) | 2018-06-04 | 2018-06-04 | A Device |
GB1809089.4 | 2018-06-04 | ||
PCT/GB2019/051521 WO2019234398A1 (en) | 2018-06-04 | 2019-05-31 | A vapour deposition evaporator device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210005938A true KR20210005938A (ko) | 2021-01-15 |
KR102525994B1 KR102525994B1 (ko) | 2023-04-27 |
Family
ID=62872790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207034708A Active KR102525994B1 (ko) | 2018-06-04 | 2019-05-31 | 증착 증발기 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11613804B2 (ko) |
EP (1) | EP3802907A1 (ko) |
JP (1) | JP7161551B2 (ko) |
KR (1) | KR102525994B1 (ko) |
CN (1) | CN112236542A (ko) |
GB (1) | GB2574400B (ko) |
WO (1) | WO2019234398A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200076389A (ko) * | 2018-12-19 | 2020-06-29 | 주식회사 포스코 | Pvd 도금 공정에서의 도금층 제어 장치 및 방법 |
CN110629168B (zh) * | 2019-10-30 | 2021-11-02 | 东北大学 | 一种真空镀膜机的蒸发装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06101029A (ja) * | 1992-09-18 | 1994-04-12 | Kao Corp | 磁気記録媒体の製造装置 |
WO2008040329A1 (de) * | 2006-09-29 | 2008-04-10 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsverfahren und anordnung zur durchführung des verfahrens |
US20100154712A1 (en) * | 2008-12-18 | 2010-06-24 | Tokyo Electron Limited | Source gas generating device and film forming apparatus |
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL184420B (nl) * | 1953-01-26 | Farber Sidney Cancer Inst | N-trifluoracetyladriamycinederivaten en werkwijze voor het bereiden van een farmaceutisch preparaat die ze bevatten. | |
JPS5385738A (en) * | 1977-01-07 | 1978-07-28 | Nippon Steel Corp | Device of feeding molten metal to vacuum chamber |
JPS5573866A (en) * | 1978-11-21 | 1980-06-03 | Mitsubishi Heavy Ind Ltd | Continuous vacuum deposition apparatus |
JPS57169088A (en) | 1981-04-09 | 1982-10-18 | Olympus Optical Co Ltd | Crucible |
DE3248659A1 (de) * | 1982-12-30 | 1984-07-05 | Peroxid-Chemie GmbH, 8023 Höllriegelskreuth | Entgasungseinrichtung an einem schnecken-extruder oder dergl. |
JPS6233762A (ja) * | 1985-08-06 | 1987-02-13 | Hitachi Ltd | 真空蒸着装置 |
FR2707671B1 (fr) * | 1993-07-12 | 1995-09-15 | Centre Nat Rech Scient | Procédé et dispositif d'introduction de précurseurs dans une enceinte de dépôt chimique en phase vapeur. |
US5401338A (en) * | 1993-07-28 | 1995-03-28 | Lin; Ching-Bin | Process for making metal-matrix composites reinforced by ultrafine reinforcing materials products thereof |
DE9407172U1 (de) * | 1994-04-29 | 1994-07-07 | Hagen Batterie Ag, 59494 Soest | Akkumulator mit Entgasungskanal |
US6251233B1 (en) * | 1998-08-03 | 2001-06-26 | The Coca-Cola Company | Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation |
ATE392492T1 (de) * | 2005-08-03 | 2008-05-15 | Applied Materials Gmbh & Co Kg | Verdampfervorrichtung zum beschichten von substraten |
US8628617B2 (en) * | 2008-12-03 | 2014-01-14 | First Solar, Inc. | System and method for top-down material deposition |
DE102010003106B4 (de) | 2010-03-22 | 2013-11-21 | Von Ardenne Anlagentechnik Gmbh | Verfahren, Vorrichtung und Beschichtungsanlage zur langzeitstabilen Verdampfung |
EP2369033A1 (de) * | 2010-03-26 | 2011-09-28 | Saint-Gobain Glass France | Verfahren zum Nachfüllen einer Verdampferkammer |
JP2013163845A (ja) * | 2012-02-10 | 2013-08-22 | Nitto Denko Corp | 蒸着用坩堝及び蒸着装置並びに蒸着方法 |
GB201206096D0 (en) * | 2012-04-05 | 2012-05-16 | Dyson Technology Ltd | Atomic layer deposition |
JP2014136827A (ja) | 2013-01-18 | 2014-07-28 | Hitachi High-Technologies Corp | 蒸着装置およびこれに用いる蒸発源 |
CN105177507B (zh) * | 2015-09-08 | 2017-08-11 | 京东方科技集团股份有限公司 | 蒸镀坩埚及蒸镀设备 |
CN106947941B (zh) * | 2017-04-13 | 2019-12-06 | 合肥鑫晟光电科技有限公司 | 蒸镀系统 |
-
2018
- 2018-06-04 GB GB1809089.4A patent/GB2574400B/en active Active
-
2019
- 2019-05-31 CN CN201980037777.6A patent/CN112236542A/zh active Pending
- 2019-05-31 JP JP2020567479A patent/JP7161551B2/ja active Active
- 2019-05-31 KR KR1020207034708A patent/KR102525994B1/ko active Active
- 2019-05-31 EP EP19730477.7A patent/EP3802907A1/en active Pending
- 2019-05-31 US US15/734,857 patent/US11613804B2/en active Active
- 2019-05-31 WO PCT/GB2019/051521 patent/WO2019234398A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06101029A (ja) * | 1992-09-18 | 1994-04-12 | Kao Corp | 磁気記録媒体の製造装置 |
WO2008040329A1 (de) * | 2006-09-29 | 2008-04-10 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsverfahren und anordnung zur durchführung des verfahrens |
US20100154712A1 (en) * | 2008-12-18 | 2010-06-24 | Tokyo Electron Limited | Source gas generating device and film forming apparatus |
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
Also Published As
Publication number | Publication date |
---|---|
KR102525994B1 (ko) | 2023-04-27 |
CN112236542A (zh) | 2021-01-15 |
US20210230738A1 (en) | 2021-07-29 |
JP7161551B2 (ja) | 2022-10-26 |
WO2019234398A1 (en) | 2019-12-12 |
JP2021526186A (ja) | 2021-09-30 |
GB201809089D0 (en) | 2018-07-18 |
EP3802907A1 (en) | 2021-04-14 |
GB2574400A (en) | 2019-12-11 |
US11613804B2 (en) | 2023-03-28 |
GB2574400B (en) | 2022-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7339139B2 (en) | Multi-layered radiant thermal evaporator and method of use | |
RU2703751C2 (ru) | Устройство для формирования покрытий на поверхностях элемента, ленточного материала или инструмента | |
WO2007075977A2 (en) | Eb-pvd system with automatic melt pool height control | |
KR102494630B1 (ko) | 증발기, 증착 배열체, 증착 장치 및 이들의 작동 방법들 | |
US5558720A (en) | Rapid response vapor source | |
EP2270251A1 (en) | Vacuum vapor deposition apparatus | |
KR102525994B1 (ko) | 증착 증발기 장치 | |
KR20230075522A (ko) | 진공 증착 장치 및 방법 | |
JP6584067B2 (ja) | 真空蒸着装置 | |
JP4787170B2 (ja) | 蒸発源装置 | |
US20120052189A1 (en) | Vapor deposition system | |
KR20210005939A (ko) | 증착 증발기 장치 | |
KR20180016150A (ko) | 스피팅 방지 구조체를 구비한 증착장치용 증발원 | |
US2899528A (en) | Method and apparatus for supplying | |
WO2013073201A1 (ja) | 真空蒸着装置 | |
KR20040032737A (ko) | 증착장치에서의 유기재료용 증발원 및 그 증착장치 | |
JP7566908B2 (ja) | n型ドーパントによってドープされたシリコン単結晶を製造するための方法および装置 | |
US2909149A (en) | Apparatus for evaporating metal | |
WO2024000569A1 (en) | Device for evaporating of a coating material and use of it | |
RU2354745C1 (ru) | Испаритель для металлов или сплавов | |
JPH07126839A (ja) | 金属蒸気発生装置 | |
JPH08134634A (ja) | 真空蒸着装置 | |
JP2009161797A (ja) | 成膜源、成膜装置 | |
MXPA01000845A (en) | Plasma-enhanced vacuum vapor deposition systems including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20201202 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20220421 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20221025 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20220421 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
AMND | Amendment | ||
PX0701 | Decision of registration after re-examination |
Patent event date: 20230215 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20230126 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20221025 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20220621 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20210129 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
|
X701 | Decision to grant (after re-examination) | ||
PG1601 | Publication of registration |