KR20200108145A - Display panel - Google Patents

Abstract

According to an embodiment of the present invention, a substrate including a first region, a second region, and a third region between the first region and the second region, is located in the second region, and the first region is interposed therebetween. A plurality of display elements including two spaced apart display elements, each including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode, and at least one inverted tapered inclined surface located in a third area And an inorganic material layer disposed on the separator and covering at least a portion of an upper surface of the separator and a side surface of the separator, and at least one sublayer included in the intermediate layer is disconnected by the separator. do.

Description

Display panel}

Embodiments of the present invention relate to a display panel having a first area inside the display area, and a display device including the same.

BACKGROUND OF THE INVENTION In recent years, display devices have diversified their uses. In addition, since the thickness of the display device is thinner and the weight is light, the range of use thereof is becoming wider.

As the area occupied by the display area among display devices is expanded, various functions grafting or linking to the display device are being added. As a way to add various functions while expanding the area, research on a display field that can arrange various components in the display area is being conducted.

In the present invention, a display panel having a first area in which various types of components can be arranged and a display device including the same can be provided. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

An embodiment of the present invention includes a substrate including a first region, a second region, and a third region between the first region and the second region; A plurality of displays including two display elements located in the second region, spaced apart from each other with the first region therebetween, and each including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode Elements; A separator positioned in the third area and including at least one inverted tapered inclined surface; An inorganic material layer disposed on the separator, and at least one sublayer included in the intermediate layer is cut off by the separator.

The at least one sub-layer may include an organic material.

The inorganic material layer may cover at least a part of an upper surface of the separator and a side surface of the separator.

The at least one sub-layer may be located above the inorganic material layer, and the separator may be located below the inorganic material layer.

The separator may include a photosensitive material.

The at least one sub-layer may include at least one of a hole transport layer, a hole injection layer, an electron transport layer, or an electron injection layer.

The inorganic material layer may include a hole corresponding to the upper surface of the separator.

A metal layer disposed in the third region may be further included, and the separator may be disposed on the metal layer.

The width of the metal layer may be equal to or greater than the width of the upper surface of the separator.

The inorganic material layer may cover the metal layer and may extend onto the insulating layer below the metal layer.

An organic layer disposed in the third area may be further included, and the separator may be disposed on the organic layer.

The inorganic material layer may cover the organic layer and may extend onto the insulating layer below the organic layer.

An inclination angle formed by at least one inverted tapered inclined surface with respect to the upper surface of the substrate may be 30° or less.

At least one insulating layer interposed between the substrate and the separator may be further included, and the at least one insulating layer may include a groove corresponding to the separator.

The display panel may include an opening corresponding to the first area.

In another embodiment of the present invention, a substrate including a first region, a second region, and a third region between the first region and the second region; A plurality of display elements positioned in the second region and including two display elements spaced apart from each other to define the first region; A separator located in the third region and extending along an edge of the first region; And at least one insulating layer interposed between the substrate and the separator, wherein the separator includes a plurality of inclined surfaces that are inverted tapered, and the sublayer including an organic material provided on the display elements comprises the separator. It can be disconnected from the center.

An inclination angle formed by at least one inclined surface of the plurality of inclined surfaces of the reverse tapered with respect to the upper surface of the substrate may be 30° or less.

The inclination angles of the plurality of inclined surfaces that are tapered may be different.

The separator may include a photosensitive resin.

The at least one insulating layer may include an inorganic insulating layer.

The at least one insulating layer may include a groove, and the separator may be located in the groove.

A metal layer interposed between the at least one insulating layer and the separator may be further included, and the separator may contact the metal layer.

The width of the metal layer may be equal to or greater than the width of the upper surface of the separator.

An organic layer interposed between the at least one insulating layer and the separator may be further included, and the separator may contact the organic layer.

The width of the upper surface of the organic layer may be equal to or greater than the width of the bottom surface of the separator.

An inorganic material layer on the separator may be further included, and the inorganic material layer may extend onto the at least one insulating layer while covering a side surface of the separator.

The inorganic material layer may directly contact the at least one insulating layer.

The inorganic material layer may include a hole corresponding to the upper surface of the separator.

The inorganic material layer may include a metal or an inorganic insulating material.

The inorganic material layer may extend to the second region.

Other aspects, features, and advantages than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

The display panel according to the exemplary embodiments of the present invention can prevent external impurities such as moisture from damaging the display area with the first area as the center. However, such an effect is exemplary, and the effect according to the embodiments will be described in detail through the following description.

1 is a schematic perspective view of a display device according to an exemplary embodiment of the present invention.
2A and 2B are cross-sectional views schematically illustrating a display device according to an exemplary embodiment of the present invention.
3A to 3D are cross-sectional views schematically illustrating a display panel according to an exemplary embodiment of the present invention.
4A to 4D are cross-sectional views schematically illustrating a display panel according to another exemplary embodiment of the present invention.
5 is a schematic plan view of a display panel according to an exemplary embodiment of the present invention.
6 is an equivalent circuit diagram schematically illustrating one pixel of a display panel according to an exemplary embodiment of the present invention.
7 is a plan view illustrating a part of a display panel according to an exemplary embodiment of the present invention.
8 is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention.
9A and 9B are cross-sectional views illustrating a manufacturing process centered on a separator in a display panel according to an exemplary embodiment of the present invention.
10 is a cross-sectional view showing a separator and a structure around the separator according to another embodiment of the present invention.
11 is a cross-sectional view showing a separator and a structure around the separator according to another embodiment of the present invention.
12A to 12C are cross-sectional views illustrating a separator according to another embodiment of the present invention.
13 to 15 are cross-sectional views illustrating a part of a display panel according to another exemplary embodiment of the present invention.
16 is a cross-sectional view illustrating a part of a display panel according to another exemplary embodiment of the present invention.
17 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
18 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
19 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
20 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.
21 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will be apparent with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding constituent elements are assigned the same reference numerals, and redundant descriptions thereof will be omitted. .

In the following embodiments, terms such as first and second are not used in a limiting meaning, but are used for the purpose of distinguishing one component from another component.

In the following examples, the singular expression includes the plural expression unless the context clearly indicates otherwise.

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or elements in advance.

In the following embodiments, when a part such as a film, a region, or a component is on or on another part, not only the case directly above the other part, but also another film, region, component, etc. are interposed therebetween. This includes cases where there is.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and the present invention is not necessarily limited to what is shown.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

In the following embodiments, when a film, a region, a component, etc. are connected, not only the film, the region, and the components are directly connected, but other films, regions, and components are interposed between the film, the region, and the components. It includes cases that are connected indirectly. For example, in this specification, when a film, region, component, etc. are electrically connected, not only the film, region, component, etc. are directly electrically connected, but also other films, regions, components, etc. are interposed therebetween. This includes indirect electrical connections.

1 is a schematic perspective view of a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the display device 1 includes a first area OA and a display area DA that is a second area that at least partially surrounds the first area OA. The display device 1 may provide a predetermined image by using light emitted from a plurality of pixels disposed in the display area DA. 1 shows that one first area OA is disposed inside the display area DA, and the first area OA may be entirely surrounded by the display area DA. The first area OA may be an area in which a component to be described later with reference to FIG. 2 is disposed.

An intermediate area MA as a third area is disposed between the first area OA and the display area DA, which is the second area, and the display area DA is surrounded by the outer area PA, which is a fourth area. I can. The middle area MA and the outer area PA may be a kind of non-display area in which pixels are not disposed. The middle area MA may be entirely surrounded by the display area DA, and the display area DA may be entirely surrounded by the outer area PA.

Hereinafter, as the display device 1 according to an embodiment of the present invention, an organic light-emitting display device is described as an example, but the display device of the present invention is not limited thereto. As another embodiment, various types of display devices such as an inorganic light emitting display device (or inorganic EL display device, Inorganic Light Emitting Display), a quantum dot light emitting display device, etc. may be used.

1 illustrates that one first area OA is provided and is substantially circular, but the present invention is not limited thereto. It goes without saying that the number of the first regions OA may be two or more, and each shape may be variously changed, such as a circle, an ellipse, a polygon, a star shape, and a diamond shape.

2A and 2B are cross-sectional views schematically illustrating a display device according to an exemplary embodiment of the present invention, respectively, and may correspond to a cross-section taken along line II-II' of FIG. 1.

Referring to FIG. 2A, the display device 1 may include a display panel 10, an input sensing layer 40 disposed on the display panel 10, and an optical functional layer 50, which are windows ( 60) can be covered. The display device 1 may be various types of electronic devices such as a mobile phone, a notebook, and a smart watch.

The display panel 10 may display an image. The display panel 10 includes pixels disposed in the display area DA. The pixels may include a display element and a pixel circuit connected thereto. The display element may include an organic light emitting diode, an inorganic light emitting diode, or a quantum dot light emitting diode.

The input sensing layer 40 acquires coordinate information according to an external input, for example, a touch event. The input sensing layer 40 may include a sensing electrode or a touch electrode and trace lines connected to the sensing electrode. The input sensing layer 40 may be disposed on the display panel 10. The input sensing layer 40 may detect an external input using a mutual cap method or/and a self cap method.

The input sensing layer 40 may be formed directly on the display panel 10 or may be separately formed and then bonded through an adhesive layer such as an optical clear adhesive. For example, the input sensing layer 40 may be continuously formed after the process of forming the display panel 10, and in this case, the input sensing layer 40 may be understood as a part of the display panel 10, and input sensing An adhesive layer may not be interposed between the layer 40 and the display panel 10. 2A shows that the input sensing layer 40 is interposed between the display panel 10 and the optical functional layer 50, but in another embodiment, the input sensing layer 40 is disposed on the optical functional layer 50. Can be.

The optical functional layer 50 may include an antireflection layer. The antireflection layer may reduce reflectance of light (external light) incident from the outside toward the display panel 10 through the window 60. The anti-reflection layer may include a retarder and a polarizer. The phase delay may be a film type or a liquid crystal coating type, and may include a λ/2 phase delay and/or a λ/4 phase delay. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase delayer and the polarizer may further include a protective film. The phase retarder and the polarizer itself or a protective film may be defined as the base layer of the antireflection layer.

In another embodiment, the antireflection layer may include a black matrix and color filters. The color filters may be arranged in consideration of the color of light emitted from each of the pixels of the display panel 10. In another embodiment, the antireflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may be destructively interfered, and thus reflectance of external light may be reduced.

The optical functional layer 50 may include a lens layer. The lens layer may improve light emission efficiency of light emitted from the display panel 10 or reduce color deviation. The lens layer may include a layer having a concave or convex lens shape, or/and a plurality of layers having different refractive indices. The optical functional layer 50 may include all of the antireflection layer and the lens layer described above, or may include any one of them.

In an embodiment, the optical functional layer 50 may be continuously formed after the process of forming the display panel 10 and/or the input sensing layer 40. In this case, an adhesive layer may not be interposed between the optical functional layer 50, the display panel 10 and/or the input sensing layer 40.

The display panel 10, the input sensing layer 40, and the optical functional layer 50 may include openings. In this regard, in FIG. 2A, the display panel 10, the input sensing layer 40, and the optical function layer 50 each include first to third openings 10H, 40H, and 50H, It shows that the three openings 10H, 40H, 50H overlap each other. The first to third openings 10H, 40H, and 50H are positioned to correspond to the first area OA. In another embodiment, at least one of the display panel 10, the input sensing layer 40, and/or the optical function layer 50 may not include an opening. For example, any one or two components selected from the display panel 10, the input sensing layer 40, and the optical function layer 50 may not include an opening. Alternatively, the display panel 10, the input sensing layer 40, and the optical functional layer 50 may not include an opening as shown in FIG. 2B.

As described above, the first area OA may be a kind of component area (eg, a sensor area, a camera area, a speaker area, etc.) in which the component 20 for adding various functions to the display device 1 is located. . The component 20 may be located within the first to third openings 10H, 40H, 50H as shown in FIG. 2A. Alternatively, the component 20 may be disposed under the display panel 10 as illustrated in FIG. 2B.

The component 20 may include an electronic component. For example, the component 20 may be an electronic element using light or sound. For example, an electronic element is a sensor that outputs or receives light, such as an infrared sensor, a camera that captures an image by receiving light, a sensor that measures a distance or recognizes a fingerprint by outputting and sensing light or sound, and a light. It may be a small lamp that outputs or may include a speaker that outputs sound. In the case of an electronic element using light, light of various wavelength bands such as visible light, infrared light, ultraviolet light, etc. may be used. In some embodiments, the first area OA may be understood as a transmission area through which light or/and sound that is output from the component 20 or traveling toward an electronic element from the outside may be transmitted. .

In another embodiment, when the display device 1 is used as a smart watch or an instrument panel for a vehicle, the component 20 may be a member such as a clock hand or a needle indicating predetermined information (eg, vehicle speed, etc.). When the display device 1 includes a clock hand or an instrument panel for a vehicle, the component 20 may penetrate the window 60 and be exposed to the outside, and the window 60 is an opening corresponding to the first area OA. It may include.

The component 20 may include component(s) related to the function of the display panel 10 as described above, or may include a component such as an accessory that increases the aesthetics of the display panel 10. Although not shown in FIGS. 2A and 2B, a layer including an optically transparent adhesive or the like may be positioned between the window 60 and the optical functional layer 50.

3A to 3D are cross-sectional views schematically illustrating a display panel according to an exemplary embodiment of the present invention.

Referring to FIG. 3A, the display panel 10 includes a display layer 200 disposed on a substrate 100. The substrate 100 may include a glass material or a polymer resin. The substrate 100 may be formed in multiple layers. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104, as shown in the enlarged view of FIG. 3A. It may include.

Each of the first base layer 101 and the second base layer 103 may include a polymer resin. For example, the first base layer 101 and the second base layer 103 are polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate ( PEN, polyethyelenene napthalate), polyethylene terephthalide (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), cellulose triacetate (TAC), cellulose acetate pro It may include a polymer resin such as cellulose acetate propionate (CAP). The polymer resin described above may be transparent.

The first barrier layer 102 and the second barrier layer 104 are barrier layers that prevent the penetration of foreign substances, and may be a single layer or a multilayer including an inorganic material such as silicon nitride (SiNx) and silicon oxide (SiOx). I can.

The display layer 200 includes a plurality of pixels. The display layer 200 may include a display element layer 200A including display elements disposed for each pixel, and a pixel circuit layer 200B including a pixel circuit and insulating layers disposed for each pixel. Each pixel circuit may include a thin film transistor and a storage capacitor, and each display element may include an organic light-emitting diode (OLED).

Display elements of the display layer 200 may be covered with an encapsulation member such as the thin film encapsulation layer 300, and the thin film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. . When the display panel 10 includes the multilayered substrate 100 and the thin film encapsulation layer 300, the flexibility of the display panel 10 may be improved.

The display panel 10 may include a first opening 10H penetrating the display panel 10. The first opening 10H may be located in the first area OA, and in this case, the first area OA may be a kind of opening area. 3A illustrates that the substrate 100 and the thin film encapsulation layer 300 each include through holes 100H and 300H corresponding to the first opening 10H of the display panel 10. The display layer 200 may also include a through hole 200H corresponding to the first area OA.

In another embodiment, as shown in FIG. 3B, the substrate 100 may not include a through hole corresponding to the first area OA. The display layer 200 may include a through hole 200H corresponding to the first area OA. The thin film encapsulation layer 300 may not include a through hole corresponding to the first region OA. In another embodiment, as shown in FIG. 3C, the display layer 200 may not include a through hole 200H corresponding to the first area OA, but the display element layer 200A is It is not located in OA).

3A to 3C show that the display element layer 200A is not disposed in the first area OA, but the present invention is not limited thereto. As another embodiment, as shown in FIG. 3D, the auxiliary display element layer 200C may be positioned in the first area OA. The auxiliary display element layer 200C may include a display element having a structure different from that of the display element layer 200A or/and operating in a different manner.

In an embodiment, each pixel of the display element layer 200A may include an active organic light emitting diode, and the auxiliary display element layer 200C may include pixels including a passive organic light emitting diode. When the auxiliary display element layer 200C includes a display element of a passive organic light emitting diode, components constituting a pixel circuit may not exist under the passive organic light emitting diode. For example, a portion of the pixel circuit layer 200B under the auxiliary display element layer 200C does not include a transistor and a storage capacitor.

In another embodiment, the auxiliary display element layer 200C may include a display element of the same type as the display element layer 200A (eg, an active organic light emitting diode), but the structure of a pixel circuit below it may be different. have. For example, the pixel circuit under the auxiliary display element layer 200C (eg, a pixel circuit having a light shielding layer between the substrate and the transistor) may have a structure different from that of the pixel circuit under the display element layer 200A. Alternatively, the display elements of the auxiliary display element layer 200C may operate according to a control signal different from the display elements of the display element layer 200A. Components that do not require a relatively high transmittance (eg, an infrared sensor) may be disposed in the first area OA in which the auxiliary display element layer 200C is disposed. In this case, the first area OA may be understood as a component area and an auxiliary display area.

4A to 4D are cross-sectional views schematically illustrating a display panel according to another exemplary embodiment of the present invention. Unlike the display panel 10 described above with reference to FIGS. 3A to 3D including the thin film encapsulation layer 300, the display panel of FIGS. 4A to 4D may include an encapsulation substrate 300A and a sealant 340. I can.

As shown in FIGS. 4A to 4C, one or more of the substrate 100, the display layer 200, and the encapsulation substrate 300A are provided with through holes 100H and 200H corresponding to the first region OA. , 300AH). The display element layer 200A may not be disposed in the first area OA, or the auxiliary display element layer 200C may be disposed as shown in FIG. 4D. The auxiliary display element layer 200C is as described above with reference to FIG. 3D.

5 is a plan view schematically illustrating a display panel according to an exemplary embodiment of the present invention, and FIG. 6 is an equivalent circuit diagram schematically illustrating one pixel of a display panel according to an exemplary embodiment of the present invention.

Referring to FIG. 5, the display panel 10 may include a first area OA, a display area DA, an intermediate area MA, and an outer area PA. 5 may be understood as a shape of the substrate 100 of the display panel 10. For example, it may be understood that the substrate 100 has a first area OA, a display area DA, an intermediate area MA, and an outer area PA.

The display panel 10 includes a plurality of pixels P disposed in the display area DA. Each pixel P is a pixel circuit PC and a display element connected to the pixel circuit PC, as shown in FIG. 6, and includes an organic light emitting diode OLED. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P may emit red, green, or blue light, or may emit red, green, blue, or white light through the organic light emitting diode OLED.

The second thin film transistor T2 is a switching thin film transistor, connected to the scan line SL and the data line DL, and a data voltage input from the data line DL according to the switching voltage input from the scan line SL. May be transferred to the first thin film transistor T1. The storage capacitor Cst is connected to the second thin film transistor T2 and the driving voltage line PL, the voltage received from the second thin film transistor T2 and the first power supply voltage ELVDD supplied to the driving voltage line PL. The voltage corresponding to the difference of can be stored.

The first thin film transistor T1 is a driving thin film transistor, which is connected to the driving voltage line PL and the storage capacitor Cst, and corresponds to the voltage value stored in the storage capacitor Cst. OLED) can be controlled. The organic light emitting diode (OLED) may emit light having a predetermined luminance by a driving current. The counter electrode (eg, a cathode) of the organic light emitting diode OLED may receive the second power voltage ELVSS.

6 illustrates that the pixel circuit PC includes two thin film transistors and one storage capacitor, but the present invention is not limited thereto. It goes without saying that the number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC.

Referring back to FIG. 5, the intermediate area MA may surround the first area OA. The intermediate area MA is an area in which no display elements such as an organic light emitting diode emitting light are disposed, and the intermediate area MA provides signals to the pixels P disposed around the first area OA. Signal lines can pass. In the outer area PA, a scan driver 1100 providing a scan signal to each pixel P, a data driver 1200 providing a data signal to each pixel P, and a first power supply voltage and a second power supply voltage Main power wirings (not shown) for providing a power supply may be disposed. 5 shows that the data driver 1200 is disposed adjacent to one side of the substrate 100, but according to another embodiment, the data driver 1200 includes a pad disposed on one side of the display panel 10 and It may be placed on an electrically connected flexible printed circuit board (FPCB).

7 is a plan view illustrating a part of a display panel according to an exemplary embodiment of the present invention.

Referring to FIG. 7, pixels P are disposed in the display area DA around the first area OA. Some of the pixels P may be spaced apart from each other around the first area OA, and the first area OA may be defined between the pixels P. For example, the pixels P may be disposed above and below the first area OA on a plane, and the pixels P may be disposed on the left and right sides of the first area OA.

Among the signal lines supplying signals to the pixels P, signal lines adjacent to the first region OA may bypass the first region OA. At least one data line DL among the data lines passing through the display area DA in the plane of FIG. 7 provides data signals to the pixels P respectively disposed above and below the first area OA. It extends in the y direction, but may bypass along the edge of the first area OA in the middle area MA. On the plane, at least one scan line SL among the scan lines passing through the display area DA is in the x direction to provide a scan signal to the pixels P respectively disposed on the left and right sides of the first area OA. It is extended, but may be detoured along the edge of the first area OA in the middle area MA.

The bypass portion SL-D of the scan line SL is positioned on the same layer as the extended portion SL-L crossing the display area DA, and may be integrally formed. The bypass portion DL-D1 of at least one of the data lines DL may be formed on a layer different from that of the extended portion DL-L1 crossing the display area DA. The bypass portion DL-D1 and the extended portion DL-L1 of the data line DL may be connected through the contact hole CNT. The bypass portion DL-D2 of at least one of the data lines DL is located on the same layer as the extended portion DL-L2 and may be integrally formed.

One or more separators SP may be positioned between the first area OA and the area in which the scan lines SL and data lines DL are bypassed of the intermediate area MA. On a plane, each of the separators SP may have a ring shape surrounding the first area OA, and the separators SP may be disposed to be spaced apart from each other.

8 is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention, and may correspond to a cross section taken along line VIII-VIII' of FIG. 7, and FIGS. 9A to 9B are These are cross-sectional views showing the manufacturing process centered on the separator.

Referring to the display area DA of FIG. 8, the substrate 100 may include a glass material or a polymer resin, and as an embodiment, the substrate 100 may include a multilayer as described above with reference to FIG. 3A. I can.

A buffer layer 201 may be formed on the substrate 100 to prevent impurities from penetrating into the semiconductor layer Act of the thin film transistor TFT. The buffer layer 201 may include inorganic insulating materials such as silicon nitride, silicon oxynitride, and silicon oxide, and may be a single layer or multiple layers including the aforementioned inorganic insulating material.

A pixel circuit PC may be disposed on the buffer layer 201. The pixel circuit PC includes a thin film transistor TFT and a storage capacitor Cst. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The thin film transistor TFT illustrated in FIG. 8 may correspond to the driving thin film transistor described with reference to FIG. 6, and the data line DL is electrically connected to the switching thin film transistor included in the pixel circuit PC. In this embodiment, a top gate type in which the gate electrode GE is disposed on the semiconductor layer Act with the gate insulating layer 203 in the center is illustrated, but according to another embodiment, the thin film transistor TFT is a bottom gate type. Can be

The semiconductor layer Act may include polysilicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The gate electrode GE may include a low resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and is formed in a multilayer or single layer including the above material. Can be.

The gate insulating layer 203 between the semiconductor layer Act and the gate electrode GE includes inorganic insulators such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. can do. The gate insulating layer 203 may be a single layer or a multilayer including the above-described material.

The source electrode SE and the drain electrode DE may be positioned on the same layer as the data line DL. The source electrode SE, the drain electrode DE, and the data line DL may include a material having good conductivity. The source electrode SE and the drain electrode DE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and include the above materials. It may be formed as a multi-layer or a single layer. In one embodiment, the source electrode SE, the drain electrode DE, and the data line DL may be formed of a multilayer of Ti/Al/Ti.

The storage capacitor Cst includes a lower electrode CE1 and an upper electrode CE2 overlapping the first interlayer insulating layer 205 therebetween. The storage capacitor Cst may overlap the thin film transistor TFT. In this regard, FIG. 8 shows that the gate electrode GE of the thin film transistor TFT is the lower electrode CE1 of the storage capacitor Cst. As another embodiment, the storage capacitor Cst may not overlap the thin film transistor TFT. The storage capacitor Cst may be covered with the second interlayer insulating layer 207. The upper electrode CE2 of the storage capacitor Cst may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and include the above material. It may be formed as a multi-layer or a single layer.

The first interlayer insulating layer 205 and the second interlayer insulating layer 207 may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. . The first interlayer insulating layer 205 and the second interlayer insulating layer 207 may be a single layer or a multilayer including the above-described material.

The pixel circuit PC including the thin film transistor TFT and the storage capacitor Cst may be covered with the first organic insulating layer 209. The first organic insulating layer 209 may include a surface having a substantially flat top surface.

The pixel circuit PC may be electrically connected to the pixel electrode 221. For example, as illustrated in FIG. 8, a contact metal CM may be further interposed between the thin film transistor TFT and the pixel electrode 221. The contact metal CM can be connected to the thin film transistor TFT through a contact hole formed in the first organic insulating layer 209, and the pixel electrode 221 is a second organic insulating layer 211 on the contact metal CM. It is possible to connect to the contact metal CM through the contact hole formed in the. The contact metal (CM) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and is formed as a multilayer or a single layer including the above material. Can be. In an embodiment, the contact metal CM may be formed of a multilayer of Ti/Al/Ti.

The first organic insulating layer 209 and the second organic insulating layer 211 are general purpose polymers such as polymethylmethacrylate (PMMA) or polystylene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ethers. Organic insulators such as polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof. In one embodiment, the first organic insulating layer 209 and the second organic insulating layer 211 may include polyimide.

The pixel electrode 221 may be formed on the second organic insulating layer 211. In FIG. 8, a structure including the contact metal CM and the second organic insulating layer 211 is described, but in other embodiments, the contact metal CM and the second organic insulating layer 211 may be omitted. In this case, the pixel electrode 221 is positioned on the first organic insulating layer 209, and the pixel electrode 221 is electrically connected to the thin film transistor (TFT) through the contact hole formed in the first organic insulating layer 209. Can be connected

The pixel electrode 221 is indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ ), indium It may include a conductive oxide such as indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 221 is silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd) , Iridium (Ir), chromium (Cr), or a reflective film containing a compound thereof may be included. In another embodiment, the pixel electrode 221 may further include a layer formed of ITO, IZO, ZnO, or In ₂ O ₃ above/below the above-described reflective layer.

A pixel defining layer 215 may be formed on the pixel electrode 221. The pixel defining layer 215 includes an opening exposing the upper surface of the pixel electrode 221 and may cover an edge of the pixel electrode 221. The pixel definition layer 215 may include an organic insulating material. Alternatively, the pixel defining layer 215 may include an inorganic insulating material such as silicon nitride (SiNx), silicon oxynitride (SiON), or silicon oxide (SiOx). Alternatively, the pixel defining layer 215 may include an organic insulating material and an inorganic insulating material.

The intermediate layer 222 includes a light emitting layer 222b. The intermediate layer 222 may include a first functional layer 222a disposed below the emission layer 222b and/or a second functional layer 222c disposed above the emission layer 222b. The light-emitting layer 222b may include a polymer or a low-molecular organic material that emits light of a predetermined color.

The first functional layer 222a may be a single layer or a multilayer. For example, when the first functional layer 222a is formed of a polymer material, the first functional layer 222a is a hole transport layer (HTL) having a single-layer structure, and polyethylene dihydroxythiophene (PEDOT: poly-( 3,4)-ethylene-dihydroxy thiophene) or polyaniline (PANI). When the first functional layer 222a is formed of a low molecular weight material, the first functional layer 222a may include a hole injection layer (HIL) and a hole transport layer (HTL).

The second functional layer 222c is not always provided. For example, when the first functional layer 222a and the light emitting layer 222b are formed of a polymer material, it is preferable to form the second functional layer 222c. The second functional layer 222c may be a single layer or a multilayer. The second functional layer 222c may include an electron transport layer (ETL) and/or an electron injection layer (EIL).

The emission layer 222b of the intermediate layer 222 may be disposed for each pixel in the display area DA. The light emitting layer 222b may be patterned to correspond to the pixel electrode 221 exposed through the opening of the pixel defining layer 215. Unlike the emission layer 222b, of the intermediate layer 222, the first functional layer 222a and the second functional layer 222c may exist not only in the display area DA but also in the intermediate area MA.

The counter electrode 223 may be made of a conductive material having a low work function. For example, the counter electrode 223 may be silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium ( Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof may include a (semi) transparent layer. Alternatively, the counter electrode 223 may further include a layer such as ITO, IZO, ZnO, or In ₂ O ₃ on the (semi) transparent layer containing the above-described material. The counter electrode 223 may be formed not only on the display area DA but also on the intermediate area MA. The first functional layer 222a, the second functional layer 222c, and the counter electrode 223 may be formed by a thermal evaporation method.

The capping layer 230 may be positioned on the counter electrode 223. For example, the capping layer 230 may include LiF and may be formed by a thermal evaporation method. In some embodiments, the capping layer 230 may be omitted.

A spacer 217 may be formed on the pixel defining layer 215. The spacer 217 may include an organic insulating material such as polyimide. Alternatively, the spacer 217 may include an inorganic insulating material such as silicon nitride or silicon oxide, or may include an organic insulating material and an inorganic insulating material.

The spacer 217 may include a material different from the pixel definition layer 215 or may include the same material as the pixel definition layer 215. For example, the pixel definition layer 215 and the spacer 217 may be formed together in a mask process using a halftone mask. As an example, the pixel definition layer 215 and the spacer 217 may include polyimide.

The organic light emitting diode (OLED) is covered with a thin film encapsulation layer 300. The thin film encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer, and FIG. 8 shows that the thin film encapsulation layer 300 includes first and second inorganic encapsulation layers 310 and 330 and It is shown that the organic encapsulation layer 320 is interposed therebetween. In another embodiment, the number of organic encapsulation layers, the number of inorganic encapsulation layers, and the stacking order may be changed.

The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. I can. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be a single layer or multiple layers including the above-described material. The organic encapsulation layer 320 may include a polymer-based material. Polymer-based materials may include acrylic resins, epoxy resins, polyimide and polyethylene.

The thicknesses of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be different from each other. The thickness of the first inorganic encapsulation layer 310 may be greater than the thickness of the second inorganic encapsulation layer 330. For example, the thickness of the first inorganic encapsulation layer 310 may be about 1 μm, and the thickness of the second inorganic encapsulation layer 330 may be about 0.7 μm. Alternatively, the thickness of the second inorganic encapsulation layer 330 is greater than the thickness of the first inorganic encapsulation layer 310, or the thickness of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be the same. I can.

Referring to the middle area MA of FIG. 8, the middle area MA is a first sub relatively far from the first area OA and a second sub relatively close to the first area SMA1 and OA. It may include an intermediate region SMA2. Lines bypassing the first area OA and the separator SP may be disposed in the intermediate area MA.

The data lines DL may be located in the first sub intermediate area SMA1. The data lines DL of the first sub-intermediate region SMA1 illustrated in FIG. 8 correspond to the bypassed portions (eg, DL-D1 and DL-D2) described with reference to FIG. 7. The first sub-intermediate area SMA1 may be understood as a line area or a bypass area in which lines such as the above-described data lines DL are bypassed.

The data lines DL may be alternately arranged with an insulating layer interposed therebetween. For example, one of the neighboring data lines DL is disposed under the insulating layer (eg, the first organic insulating layer, 209) and the other is disposed above the insulating layer (eg, the first organic insulating layer, 209). As is, they are arranged alternately. When the data lines DL are alternately disposed with the insulating layer therebetween, the distance d and the pitch between the data lines can be reduced. Although FIG. 8 shows the data lines DL located in the first sub-intermediate region SMA1, the bypass portions of the scan lines SL described with reference to FIG. 7, for example, the scan lines SL are also first It may be located in the sub middle area SMA1.

One or more separators SP may be disposed in the second sub intermediate region SMA2. The second sub-intermediate region SMA2 is a region in which the separator SP is located, and the organic material layer included in the intermediate layer 222 may be cut off (or separated) by the separator SP. The second sub-intermediate region SMA2 may be understood as a separator region or a disconnection region (or separation region) of the organic material layer.

The separator SP may be positioned on an insulating layer, for example, the second interlayer insulating layer 207 in the second sub-intermediate region SMA2. The separator SP may disconnect or/and separate the first functional layer 222a and/or the second functional layer 222c extending to the intermediate region MA. Similar to the first functional layer 222a and/or the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 may also be cut off.

The first functional layer 222a, the second functional layer 222c, and/or the counter electrode 223 may be entirely formed on the substrate 100 by a thermal evaporation method, and the separator SP is a first functional layer. It may be formed before the process of forming the 222a, the second functional layer 222c, and the counter electrode 223. The first functional layer 222a, the second functional layer 222c, and/or the counter electrode 223 deposited after the separator SP is formed have a structure that is disconnected (separated) by the shape of the separator SP. I can. The capping layer 230 including LiF or the like may also have a structure that is disconnected (separated) by the shape of the separator SP.

A structure of disconnection (separation) of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 by the separator SP is as follows.

9A shows before the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 are deposited, and FIG. 9B shows the first functional layer 222a, A cross-sectional view showing after the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 are deposited.

Referring to FIG. 9A, the separator SP has a shape in which the width Wt of the upper surface SP-T is larger than the width Wb of the bottom surface SP-B. The side (SP-L) of the separator (SP) connecting the upper surface (SP-T) and the floor surface (SP-B) may include an inverted tapered inclined surface, and FIG. 9A shows the separator SP. It is disclosed that the side surface SP-L includes one inverted tapered inclined surface, and the cross section of the separator SP is an inverted trapezoid. The angle α formed by the inverted tapered inclined surface with the upper surface 100t of the substrate may be 30 degrees or less. The thickness SP-H of the separator SP may be about 3 μm or greater.

The separator SP may contain an organic material. The separator SP may include an organic material different from the first organic insulating layer 209 and the second organic insulating layer 211. The separator SP may include a photosensitive resin, for example, a negative photoresist.

The separator SP may be covered with an inorganic material layer PSV, and the inorganic material layer PSV may include one or more holes PSV-h corresponding to the upper surface SP-T of the separator SP. have. The hole PSV-h may become a passage for discharging gas generated from the separator SP, which is an organic material, during the manufacturing process of the display panel 10 or/and after the display panel 10 is manufactured. The hole PSV-h may be an outgassing passage.

The body of the inorganic material layer PSV excluding the hole PSV-h may cover a part of the upper surface SP-T of the separator SP and the side surface SP-L of the separator SP. The body of the inorganic material layer PSV extends to cover the side surface SP-L from the upper surface SP-T of the separator SP, and an insulating layer disposed under the separator SP, for example, a second interlayer insulating layer Can contact the upper surface of (207).

9B, as described above, after the separator (SP) and the inorganic material layer (PSV) are formed, the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 may be formed. The first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 may be integrally formed in the display area DA and the intermediate area MA, respectively. Since the separator SP is disposed in the intermediate region MA, the first functional layer 222a and/or the second functional layer 222c may be disconnected around the separator SP. Likewise, the counter electrode 223 may be disconnected around the separator SP, and the capping layer 230 including a material such as LiF may also be disconnected around the separator SP.

Among the layers formed on the substrate 100, a layer containing an organic material may become a path for permeation of foreign matter such as moisture. Foreign matter such as moisture can damage the organic light emitting diode (OLED). According to an embodiment of the present invention, since the first functional layer 222a, which is an organic material layer, and/or the second functional layer 222c are disconnected by the separator SP, the first functional layer 222a, and/or It is possible to minimize moisture from advancing in a direction parallel to the upper surface of the two functional layer 222c (lateral direction or x direction).

In one embodiment, it is difficult to deposit the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 around the separator SP having an inclined surface that is tapered. Shadow areas may exist. In the shadow area and/or its surroundings, the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 have cross-sections of various shapes according to the deposition conditions. Can have. For example, ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 may be formed to have a thin thickness around the separator SP. The positions of the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 and their cross-sectional shape are determined by the deposition conditions (e.g., time, deposition direction, material, etc.). ) May vary.

As a comparative example of the present invention, if there is no inorganic material layer (PSV) on the separator (SP), depending on the process conditions (deposition time, incident angle of the material to be deposited, etc.), the organic material of the first functional layer and/or the second functional layer It is possible that the ends come into contact with the side of the separator, which is each organic material. The first functional layer (organic material) and the separator (organic material) in contact with each other, and/or the second functional layer (organic material) and the separator (organic material) in contact with each other may form a new moisture penetration path. However, according to an embodiment of the present invention, since the inorganic material layer (PSV) is disposed on the separator (SP) and covers the side surface (SP-L) of the separator (SP), the first functional layer (222a) and / Alternatively, it is possible to prevent the ends of the second functional layer 222c from contacting the separator SP. Accordingly, it is possible to prevent the first functional layer 222a and/or the second functional layer 222c, which is an organic material, and the separator SP, which is an organic material, from contacting each other and forming a moisture permeable path.

The separator SP is located under the inorganic material layer PSV, and the first functional layer 222a and/or the second functional layer 222c is located above the inorganic material layer PSV. As a result, the separator SP is spatially separated from the first functional layer 222a and/or the second functional layer 222c, and may not contact each other. Likewise, the counter electrode 223 and/or the capping layer 230 may be separated from the separator SP by the inorganic material layer PSV and may not contact each other.

The inorganic material layer PSV may include a metal or an inorganic insulating material. For example, the inorganic material layer (PSV) may include a transparent conductive oxide (TCO, Transparent Conductive Oxide) such as ITO or/and a metal layer. Alternatively, the inorganic material layer PSV may include an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride.

Referring back to FIG. 8, when a plurality of separators SP are disposed on the substrate 100, the separators SP may be disposed to be spaced apart from each other, and a partition wall PW is formed between the separators SP. Can be located. The height of the separators SP may be equal to or smaller than the height of the partition wall PW. Here, the height of the separator SP and the height of the partition wall PW are the vertical distances from the upper surface of the substrate 100 to the upper surface of the separator SP, and from the upper surface of the substrate 100 to the upper surface of the partition wall PW. Can be the vertical distance of

The organic encapsulation layer 320 may be formed by applying a monomer to the substrate 100 and then curing the monomer. The partition wall PW may control the flow of the monomer, and may control the thickness of the monomer, that is, the thickness of the organic encapsulation layer 320. An end of the organic encapsulation layer 320 may be located on one side of the partition wall PW. The partition wall PW may include the same material as the first organic insulating layer 209, the second organic insulating layer 211, and/or the pixel defining layer 215.

The separator SP disposed relatively adjacent to the display area DA, for example, the separator SP disposed between the partition wall PW and the organic light emitting diode OLED of the display area DA, is an organic encapsulation layer 320 Can be covered with

The first inorganic encapsulation layer 310 disposed under the organic encapsulation layer 320 may be formed by chemical vapor deposition (CVD) or the like. Unlike the first inorganic encapsulation layer 310, the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230, the step coverage is relatively excellent. 1 The inorganic encapsulation layer 310 may be formed continuously without being disconnected. For example, the first inorganic encapsulation layer 310 may be continuously formed to cover the top and side surfaces of the separator SP. The first inorganic encapsulation layer 310 may cover a stack of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 disconnected by the separator SP. I can.

The second inorganic encapsulation layer 330 is positioned on the organic encapsulation layer 320. Like the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330 may entirely cover the substrate 100. A portion of the second inorganic encapsulation layer 330 may directly contact the first inorganic encapsulation layer 310 on the second sub-intermediate region SMA2. For example, the second inorganic encapsulation layer 330 may directly contact the first inorganic encapsulation layer 310 in a region between the first region OA1 and the end of the organic encapsulation layer 320.

The planarization layer 410 may be located on the thin film encapsulation layer 300. The planarization layer 410 covers a region of the intermediate region MA where the organic encapsulation layer 320 does not exist, thereby improving the flatness of the display panel 10. Accordingly, it is possible to prevent separation or separation of an input sensing layer or/and an optical function layer, etc. formed directly on the display panel 10 or coupled by an adhesive layer from the display panel 10.

The planarization layer 410 may include an organic insulating material. As an embodiment, the planarization layer 410 may be formed by applying a photoresist (negative or positive) or a polymer-based organic material on the thin film encapsulation layer 300 and patterning the same. In an embodiment, the planarization layer 410 may be located only in the intermediate region MA. In plan view, the planarization layer 410 may have a ring shape surrounding the first region OA.

A first upper insulating layer 420 and a second upper insulating layer 430 may be formed on the planarization layer 410. The first upper insulating layer 420 may include an inorganic insulating layer, and the second upper insulating layer 430 may include an organic insulating layer. As an embodiment, when the input sensing layer 40 (refer to FIG. 2A) is directly formed on the display panel 10, the first upper insulating layer 420 and the second upper insulating layer 430 are each an input sensing layer. It may be formed integrally with the insulating layer included in (40).

The display panel 10 may include a first opening 10H corresponding to the first area OA. The first opening 10H may be formed by performing a cutting or scribing process along the first line SCL after the above-described components are formed on the substrate 100. The side surface of the first opening 10H may include a side surface of the substrate 100 exposed toward the first opening 10H and side surfaces of layers stacked thereon.

The separator SP described with reference to FIG. 8 is shown directly disposed on the second interlayer insulating layer 207 that is an inorganic insulating layer, but the present invention is not limited thereto. As another embodiment, components having various structures may be disposed under the separator SP as described later with reference to FIGS. 10 and 11.

10 is a cross-sectional view showing a separator and a structure around the separator according to another embodiment of the present invention. In FIG. 10, for convenience, the components above the capping layer 230, for example, the thin film encapsulation layer 300 described with reference to FIG. 8 and the components thereon are omitted.

Referring to FIG. 10, a metal layer ML may be disposed under the separator SP. The metal layer ML is disposed between the inorganic insulating layer (eg, the second interlayer insulating layer 207) and the separator SP. The separator SP may directly contact the upper surface of the metal layer ML. The adhesion between the metal layer ML and the separator SP may be superior to that between the inorganic insulating layer (eg, the second interlayer insulating layer 207) and the separator SP.

The metal layer ML may include the same material as the source electrode SE, the drain electrode DE, and the data line DL of the pixel circuit PC described above with reference to FIG. 8. Alternatively, the metal layer ML may include the same material as the contact metal CM described with reference to FIG. 8.

The separator SP may include a photosensitive material such as a negative photoresist, and a process of forming the separator SP including the above-described material may include exposure, development, and baking processes. During the exposure process for forming the separator SP, light may be reflected on the metal layer ML. In consideration of reflection of light by the metal layer ML, the width W1 of the metal layer ML may be selected equal to or greater than the width Wt of the upper surface SP-T of the separator SP ( Wb <Wt ≤ W1).

The inorganic material layer PSV may cover a part of the upper surface SP-T and the side surface SP-L of the separator SP, and may cover the metal layer ML. The inorganic material layer PSV may extend onto the inorganic insulating layer (eg, the second interlayer insulating layer 207) disposed under the metal layer ML while covering the separator SP and the metal layer ML. The inorganic material layer (PSV) is a part of the upper surface (SP-T) of the separator (SP) and a side surface (SP-L), a part of the upper surface (ML-T) of the metal layer (ML) and the side surface (ML-L), and It may be in contact with the interlayer insulating layer 207. A portion of the upper surface SP-T of the separator SP that is not covered by the inorganic material layer PSV corresponds to a region where the hole PSV-h for outgassing is located.

11 is a cross-sectional view showing a separator and a structure around the separator according to another embodiment of the present invention. In FIG. 11, for convenience, the components above the capping layer 230, for example, the thin film encapsulation layer 300 described with reference to FIG. 8 and components thereon are omitted.

Referring to FIG. 11, an organic layer OL may be disposed under the separator SP. The organic layer OL is disposed between the inorganic insulating layer (eg, the second interlayer insulating layer 207) and the separator SP. The separator SP may directly contact the upper surface of the organic layer OL. The adhesion between the organic layer OL and the separator SP may be superior to that between the inorganic insulating layer (eg, the second interlayer insulating layer 207) and the separator SP.

The organic layer OL may include the same material as the first organic insulating layer 209 or the second organic insulating layer 211 described above with reference to FIG. 8. The organic layer OL may be formed in the same process as the first organic insulating layer 209 or the second organic insulating layer 211. The organic layer OL may be patterned to exist under the separator SP. As described with reference to FIG. 7, the separator SP may have a ring shape surrounding the first area OA on a plane. Like the separator SP, the organic layer OL is also the first area OA on the plane. It may be a ring shape surrounding the. The width W2 of the top surface OL-T of the organic layer OL may be equal to or greater than the width Wb of the bottom surface SP-B of the separator SP.

The inorganic material layer PSV may cover a part of the upper surface SP-T and the side surface SP-L of the separator SP, and may cover the organic layer OL. The inorganic material layer PSV may extend onto the inorganic insulating layer (eg, the second interlayer insulating layer 207) disposed under the organic layer OL while covering the separator SP and the organic layer OL. The inorganic material layer (PSV) is a part of the upper surface (SP-T) of the separator (SP) and a side surface (SP-L), a part of the upper surface (OL-T) of the organic layer (OL) and a side surface (OL-L), and It may be in contact with the interlayer insulating layer 207. A portion of the upper surface SP-T of the separator SP that is not covered by the inorganic material layer PSV corresponds to a region where the hole PSV-h for outgassing is located.

Since the inorganic material layer PSV covers the organic layer OL, the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and/or the capping layer 230 are the organic layer OL. Can prevent contact with As a comparative example of the present invention, when the ends of the first functional layer 222a and the second functional layer 222c, which are organic materials, are in contact with the organic layer OL, a moisture permeable path may be formed, but according to an embodiment of the present invention Since the inorganic material layer PSV is disposed between the organic layer OL and the first functional layer 222a and the second functional layer 222c, the formation of the aforementioned moisture permeable path can be blocked.

8 to 11 illustrate that the side surface SP-L of the separator SP is an inverted trapezoid having one inclined surface, that is, an inverted tapered inclined surface, but the present invention is not limited thereto. As another embodiment, the side surfaces SP-L of the separator SP may include a plurality of inclined surfaces having different inclination angles.

12A to 12C are cross-sectional views illustrating a separator according to another embodiment of the present invention.

12A, the separator SP has a width Wt of the upper surface SP-T greater than the width Wb of the bottom surface SP-B, but the side surface SP-L includes a plurality of sub-sides. Can include. For example, the side surface SP-L of the separator SP may include a first sub side surface SP-L1, a second sub side surface SP-L2, and a third sub side surface SP-L3. Along the direction from the top surface (SP-T) of the separator (SP) toward the bottom surface (SP-B), the first sub-side surface (SP-L1), the second sub-side surface (SP-L2), and the Three sub-sides (SP-L3) may be disposed.

In one embodiment, the inclination angle of the second sub-side (SP-L2) is smaller than that of the first sub-side (SP-L1), and the inclination angle of the third sub-side (SP-L3) is the second sub-side (SP- It may be formed larger than the inclination angle of L2). Here, the inclination angle of each of the first sub-side (SP-L1), the second sub-side (SP-L2), and the third sub-side (SP-L3) is, respectively, the first sub-side (SP-L1), It can be understood as an angle formed by the second sub-side (SP-L2) and the third sub-side (SP-L3) and the upper surface (100t) of the substrate.

At least one of the first sub-side (SP-L1), the second sub-side (SP-L2), and the third sub-side (SP-L3) may have an inclination angle of about 30° or less. For example, the inclination angle α of the second sub-side surface SP-L2 may be 30° or less.

12A shows that the inclination angle of the first sub-side (SP-L1) is about 90°, but as another embodiment, as shown in FIG. 12B, the inclination angle of the first sub-side (SP-L1) may be an acute angle. have.

12A and 12B illustrate that the side surface SP-L of the separator SP includes a plurality of inverted tapered inclined surfaces, but the present invention is not limited thereto. As shown in FIG. 12C, the side surface SP-L of the separator SP may include a reverse tapered first sub-side SP-L1 and a purely tapered second sub-side SP-L2. The inclination angle α of the reverse tapered first sub-side SP-L1 may be 30° or less.

The structure of the separator (SP) according to the embodiment(s) shown in FIGS. 12A to 12C or the embodiment(s) derived therefrom is the embodiment(s) described with reference to FIGS. 8 to 11 above and It can be applied to an embodiment derived from In addition, it may be applied to embodiment(s) to be described later with reference to FIGS. 13 to 21 and an embodiment derived therefrom.

13 to 15 are cross-sectional views illustrating a part of a display panel according to another exemplary embodiment of the present invention.

In the separator SP, the side surface SP-L of the separator SP has a plurality of inclined surfaces, or the side surface SP-L of the separator SP has a relatively small inclination angle (e.g., 20° or less, 15° or less. Etc.), or/and may have various shapes such as alternately formed inverted tapered slopes and forward tapered slopes.

When the shadow region is formed wide by the shape of the separator SP, as shown in FIG. 13, the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer (230) Each end may be spaced apart from the separator SP at a predetermined interval. for example,

The first inorganic encapsulation layer 310 on the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 cut off (separated) by the separator SP Can be formed. The first inorganic encapsulation layer 310 may directly contact the side surface SP-L of the separator SP. In addition, the first inorganic encapsulation layer 310 is formed between the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 and the separator SP. The second interlayer insulating layer 207, which is an inorganic insulating layer, may be directly contacted through the first separation area RA of.

Referring to FIG. 14, the metal layer ML may be disposed under the separator SP. As described with reference to FIG. 10, the width of the metal layer ML may be equal to or greater than the width Wt of the upper surface of the separator SP. In the first separation area RA between the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 and the separator SP, 1 The inorganic encapsulation layer 310 may contact the metal layer ML.

Referring to FIG. 15, the organic layer OL may be disposed under the separator SP. The width of the organic layer OL may be smaller than the width Wt of the upper surface of the separator SP. The width of the organic layer OL is the second between the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 and the organic layer OL. It may be formed to be provided with a separation area (RA'). The width of the second separation area RA' may be equal to the width of the first separation area RA, or may be 0.7 times or more, 0.8 times or more, or 0.9 times or more of the width of the first separation area RA.

16 is a cross-sectional view illustrating a part of a display panel according to another exemplary embodiment of the present invention. 16 shows the thin film encapsulation layer and the components thereon omitted for convenience.

At least one insulating layer positioned under the separator SP may include a groove (or trench). In this regard, FIG. 16 shows that the second interlayer insulating layer 207 under the separator SP includes a groove 207G. The second interlayer insulating layer 207 may be a single layer or a multilayer including a silicon nitride layer and a silicon oxide layer. The depth d of the groove 207G may be smaller than the thickness t of the second interlayer insulating layer 207. The groove 207G may be formed using a halftone mask or the like.

The upper surface 270t of the second interlayer insulating layer 207 and the bottom surface 207Gb of the groove 207G form a stepped structure by the groove 207G. The first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 can be more effectively disconnected by the above-described stepped structure. For example, the ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 are the edges of the upper surface 207t of the second interlayer insulating layer 207 It is located at 207te, and a residue RD may be located in the groove 207G.

In the deposition process of forming the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230, the deposition material that is obliquely incident is located in the groove 207G. It is possible to form a residue RD. Due to the stepped structure of the second interlayer insulating layer 207, the residual RD and the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 are The ends can be spaced apart from each other. According to the embodiment, even if the residue RD including an organic material contacts the separator SP, which is an organic material, the separator SP, the first functional layer 222a, the second functional layer 222c, and the counter electrode 223 ), and/or the ends of the capping layer 230 may maintain a structure spaced apart from each other, so that damage to the organic light emitting device due to moisture permeation may be effectively prevented.

The above-described problem of moisture permeation can be more effectively prevented when at least one of the following conditions is satisfied.

The side surface SP-L of the separator SP may include an inclined surface of 30° or less (condition 1). The sum (I1+Wb) of the first separation distance I1 between the separator SP and the neighboring separator SP and the width Wb of the bottom surface of the separator SP may be about 6 μm or greater ( Condition 2). The thickness SP-H of the separator SP may be about 3 μm or greater (condition 3). And/or, a second separation distance I2 between the inner side surface of the second interlayer insulating layer 207 defining the groove 207G and the side surface SP-L of the separator SP facing the aforementioned inner side. May be about 2 μm or greater (condition 4).

When all the above-described conditions are satisfied, regardless of the conditions of the deposition process for forming the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 The end of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and/or the capping layer 230 may be spaced apart from the separator SP, effectively eliminating the above-described problem of moisture permeation. Can be solved.

17 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention. In the display panel 10 described with reference to FIG. 8, the partition wall PW is disposed between the neighboring separators SP, and the end of the organic encapsulation layer 320 is shown to be located on one side of the partition wall PW. , Referring to FIG. 17, the separator SP may have the function of the partition wall PW described with reference to FIG. 8. An end of the organic encapsulation layer 320 may be located on one side of any one separator SP.

It goes without saying that the features described with reference to FIG. 17 may also be applied to the above-described embodiment(s) described with reference to FIGS. 8 to 16, or/and the embodiment(s) to be described later with reference to FIGS. 18 to 21. .

18 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.

Referring to FIG. 18, the inorganic material layer PSV may include the same material as the pixel electrode 221. For example, as shown in the enlarged view of FIG. 18, the inorganic material layer PSV is a first sub-inorganic material layer PSV-1, a second sub-inorganic material layer PSV-2, and a third sub-inorganic material layer PSV-3. ) Can be included.

As described with reference to FIG. 8, the pixel electrode 221 includes a first sub-pixel electrode layer 221-1 and a third sub-pixel electrode layer 221 disposed below and above the second sub-pixel electrode layer 221-2 which is a reflective film. -3) may be included. For example, the second sub-pixel electrode layer 221-2 contains silver (Ag), and the first sub-pixel electrode layer 221-1 and the third sub-pixel electrode layer 221-3 are transparent conductive oxides such as ITO ( TCO). The first sub-inorganic layer (PSV-1), the second sub-inorganic layer (PSV-2), and the third sub-inorganic layer (PSV-3) of the inorganic material layer (PSV) are each a first sub-pixel electrode layer ( 221-1), the second subpixel electrode layer 221-2, and the third subpixel electrode layer 221-3 may include the same material.

18 illustrates that the separator SP is positioned on the second interlayer insulating layer 207, but the present invention is not limited thereto. As described with reference to FIGS. 10 and 11, a metal layer or an organic layer may be positioned under the separator SP. The separator SP illustrated in FIG. 18 may have a shape as described above with reference to FIGS. 12A to 12C or a shape derived therefrom. The second interlayer insulating layer 207 of FIG. 18 may include a groove in which the separator SP is positioned as described with reference to FIG. 16.

19 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.

Referring to FIG. 19, the separator SP may be positioned on the first interlayer insulating layer 205, and the inorganic material layer PSV covering a part of the upper surface and the side surface of the separator SP is a second interlayer insulating layer. (207) may be included. For example, the second interlayer insulating layer 207 may be an inorganic material layer (PSV). Alternatively, it may be understood that the inorganic material layer PSV includes the second interlayer insulating layer 207. The inorganic material layer PSV may include an insulating material, for example, an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. The inorganic material layer PSV may have a multilayer structure of the above-described material.

The inorganic material layer PSV is formed entirely on the substrate 100 and may cover a part of the upper surface and side surfaces of the separator SP. The inorganic material layer PSV may include a hole PSV-h corresponding to the upper surface of the separator SP.

The metal layer ML may be disposed under the separator SP, and features such as the width of the metal layer ML are as described above with reference to FIG. 10. The metal layer ML may include the same material as an electrode including a metal among the thin film transistors and storage capacitors constituting the pixel circuit PC. For example, the metal layer ML may include the same material as the upper electrode CE2 of the storage capacitor Cst, and may be formed in the same process.

The ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and the capping layer 230 are in contact with the separator SP by the inorganic material layer PSV covering the separator SP. It may not be as described above. The partition wall PW may be disposed on a layer different from the separator SP.

19 illustrates that the metal layer ML is disposed under the separator SP, but as another embodiment, the metal layer ML may be omitted. Alternatively, instead of the metal layer ML, an organic layer may be disposed as described above with reference to FIG. 11. The separator SP illustrated in FIG. 19 may have a shape as described above with reference to FIGS. 12A to 12C or a shape derived therefrom. And/or the first interlayer insulating layer 205 illustrated in FIG. 19 may include a groove having the same structure as the groove formed in the second interlayer insulating layer 207 described with reference to FIG. 16.

20 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.

Referring to FIG. 20, the separator SP may be positioned on the second interlayer insulating layer 207, and the separator SP is an inorganic material layer having a hole PSV-h corresponding to the upper surface of the separator SP. (PSV) can be covered. The inorganic material layer PSV covers a part of the upper surface and side surfaces of the separator SP, and may extend to the display area DA. For example, the inorganic material layer PSV may be entirely formed on the substrate 100, and the inorganic material layer PSV includes data lines DL located in the display area DA and the first intermediate area SMA1, and a thin film transistor. The source electrode SE and/or the drain electrode DE of the (TFT) may be covered. The inorganic material layer PSV may contact the data lines DL in the display area DA and the first intermediate area SMA1. The inorganic material layer PSV may include an insulating inorganic material.

The metal layer ML may be disposed under the separator SP, and features such as the width of the metal layer ML are as described above with reference to FIG. 10. The metal layer ML may include the same material as any one of electrodes of a thin film transistor and a storage capacitor constituting the pixel circuit PC. For example, the metal layer ML may include the same material as the data line DL included in the pixel circuit PC and the source electrode SE and/or the drain electrode DE of the thin film transistor TFT.

Ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, and the capping layer 230 are in contact with the separator SP by the inorganic material layer PSV covering the separator SP. It may not be as described above. The partition wall PW may be disposed on a layer different from the separator SP. For example, the partition wall PW may be located on the inorganic material layer PSV.

20 illustrates that the metal layer ML is disposed under the separator SP, but as another embodiment, the metal layer ML may be omitted. Alternatively, instead of the metal layer ML, an organic layer may be disposed as described above with reference to FIG. 11. The separator SP illustrated in FIG. 20 may have a shape as described above with reference to FIGS. 12A to 12C or a shape derived therefrom. And/or the second interlayer insulating layer 207 illustrated in FIG. 20 may include a groove described with reference to FIG. 16.

21 is a cross-sectional view illustrating a display panel according to another exemplary embodiment of the present invention.

Referring to FIG. 21, an organic layer OL may be positioned under the separator SP. The organic layer OL may include the same material as the first organic insulating layer 209. The organic layer OL may be formed in the same process as the first organic insulating layer 209.

The separator SP may be covered with an inorganic material layer PSV having a hole PSV-h corresponding to the upper surface of the separator SP. The inorganic material layer PSV may include an inorganic material having conductivity such as a metal or an insulating inorganic material such as silicon nitride.

When the organic layer OL is disposed under the separator SP, the organic layer OL may have a relatively thicker thickness than that of the inorganic material layer or the metal layer. Therefore, the separator SP is a barrier rib previously described with reference to FIG. It can have the function of (PW, Fig. 8). The ends of the first functional layer 222a, the second functional layer 222c, the counter electrode 223 and the capping layer 230 are in contact with the separator SP by the inorganic material layer PSV covering the separator SP. It may not be as described above.

21 shows that the organic layer OL is disposed under the separator SP, but as another embodiment, the organic layer OL may be omitted. Alternatively, instead of the organic layer OL, a metal layer may be disposed as described above with reference to FIG. 10. The separator SP illustrated in FIG. 21 may have a shape as described above with reference to FIGS. 12A to 12C or a shape derived therefrom.

As described above, the present invention has been described with reference to an embodiment shown in the drawings, but this is only exemplary, and those of ordinary skill in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of the present invention should be determined by the technical spirit of the appended claims.

10: display panel
100: substrate
222a: first functional layer
222b: light emitting layer
222c: second functional layer
300: thin film encapsulation layer
SP: separator
PSV: inorganic layer

Claims (30)

A substrate including a first region, a second region, and a third region between the first region and the second region;
A plurality of displays including two display elements located in the second region, spaced apart from each other with the first region therebetween, and each including a pixel electrode, a counter electrode, and an intermediate layer between the pixel electrode and the counter electrode Elements;
A separator positioned in the third area and including at least one inverted tapered inclined surface;
An inorganic material layer positioned on the separator;
Including,
At least one sub-layer included in the intermediate layer is cut off by the separator. The method of claim 1,
The display panel, wherein the at least one sub-layer includes an organic material. The method of claim 1,
The inorganic material layer covers at least a part of an upper surface of the separator and a side surface of the separator. The method of claim 1,
The at least one sub-layer is over the inorganic material layer, and the separator is under the inorganic material layer. The method of claim 1,
The display panel, wherein the separator includes a photosensitive material. The method of claim 1,
The at least one sub-layer includes at least one of a hole transport layer, a hole injection layer, an electron transport layer, or an electron injection layer. The method of claim 1,
The display panel, wherein the inorganic material layer includes a hole corresponding to the upper surface of the separator. The method of claim 1,
The display panel further includes a metal layer disposed in the third region, wherein the separator is disposed on the metal layer. The method of claim 8,
The display panel, wherein a width of the metal layer is equal to or greater than a width of an upper surface of the separator. The method of claim 8,
The inorganic material layer covers the metal layer and extends above the insulating layer below the metal layer. The method of claim 1,
The display panel further includes an organic layer disposed in the third region, wherein the separator is disposed on the organic layer. The method of claim 11,
The inorganic material layer covers the organic layer and extends onto the insulating layer below the organic layer. The method of claim 1,
A display panel, wherein an inclination angle formed by at least one inverted tapered inclined surface with respect to an upper surface of the substrate is 30° or less. The method of claim 1,
The display panel, further comprising at least one insulating layer interposed between the substrate and the separator, wherein the at least one insulating layer includes a groove corresponding to the separator. The method of claim 1,
The display panel includes an opening corresponding to the first area. A substrate including a first region, a second region, and a third region between the first region and the second region;
A plurality of display elements positioned in the second region and including two display elements spaced apart from each other to define the first region;
A separator located in the third region and extending along an edge of the first region; And
At least one insulating layer interposed between the substrate and the separator;
Including,
The display panel, wherein the separator includes a plurality of inclined surfaces that are inverted tapered, and a sub-layer including an organic material provided on the display elements is cut off around the separator. The method of claim 16,
The display panel, wherein an inclination angle formed by at least one inclined surface of the plurality of inverted tapered inclined surfaces with respect to the upper surface of the substrate is 30° or less. The method of claim 16,
The display panel, wherein inclination angles of the plurality of inverted tapered inclined surfaces are different. The method of claim 16,
The display panel, wherein the separator contains a photosensitive resin. The method of claim 16,
The at least one insulating layer includes an inorganic insulating layer. The method of claim 16,
The at least one insulating layer includes a groove, and the separator is positioned in the groove. The method of claim 16,
The display panel further includes a metal layer interposed between the at least one insulating layer and the separator, wherein the separator contacts the metal layer. The method of claim 22,
The display panel, wherein a width of the metal layer is equal to or greater than a width of an upper surface of the separator. The method of claim 16,
The display panel further includes an organic layer interposed between the at least one insulating layer and the separator, wherein the separator is in contact with the organic layer. The method of claim 24,
A display panel having a width of an upper surface of the organic layer equal to or greater than a width of a bottom surface of the separator. The method of claim 16,
The display panel further includes an inorganic material layer on the separator, wherein the inorganic material layer extends over the at least one insulating layer while covering a side surface of the separator. The method of claim 26,
The inorganic material layer directly contacts the at least one insulating layer. The method of claim 26,
The display panel, wherein the inorganic material layer includes a hole corresponding to an upper surface of the separator. The method of claim 26,
The inorganic material layer includes a metal or an inorganic insulating material. The method of claim 26,
The inorganic material layer extends to the second area.

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