KR20190143817A - Resin molding apparatus and manufacturing method of resin-molded product - Google Patents

Abstract

The resin molding apparatus includes a mold clamping mechanism for changing the distance between the first mold and the second mold, and a control unit for controlling the mold clamping mechanism. The control unit measures the mold clamping force, which is the pressure exerted on the mold by the mold clamping mechanism while narrowing the distance between the first mold and the second mold in a state where the molding target is placed on the mold, and the clamping force measured. A process of acquiring the first position of the clamping mechanism exceeding the first predetermined value, a process of setting the second position obtained by correcting the first position by the correction value as the foreign matter detection position, In the molding operation, a process for detecting foreign matter in the molding die is performed based on the clamping force measured at the foreign matter detection position.

Description

RESIN MOLDING APPARATUS AND MANUFACTURING METHOD OF RESIN-MOLDED PRODUCT}

The present invention relates to a resin molding apparatus and a method for producing a resin molded article.

In order to protect a semiconductor chip such as an integrated circuit (IC) or the like from an environment such as light, heat, or moisture, the semiconductor chip is generally sealed by a resin. Such resin encapsulation is realized by arranging a support body on which a semiconductor chip is mounted between a mold formed of an upper mold and a lower mold, and filling the molten resin into a cavity formed by the mold. Another method is also known in which a granular resin material is supplied to a lower mold in advance and clamped the dies while heating.

In order to perform such a resin encapsulation, it is necessary to arrange the support body with a semiconductor chip mounted between an upper mold | type and a lower mold | type, for some reason, in addition to the support body with which the semiconductor chip used as the object of resin encapsulation is attached, Things which should not be targeted (hereinafter referred to as "foreign materials") may be mixed. It is necessary to detect such foreign matter before applying pressure to the upper mold and the lower mold.

For example, Japanese Unexamined Patent Application Publication No. 06-151489 describes, "In the semiconductor resin encapsulation device, when the lead frame 3 is shaped into an upper mold 1 and a lower mold 2, two lead frames 3 overlap. Or the foreign material of resin powder may mix between the upper mold | type 1 and the lower mold | type 2. Under the present circumstances, when clamping pressure (die clamping pressure) in the case of resin sealing is normally applied, a metal mold | die may be damaged by the unbalance of the clamping pressure by a foreign material. In the method of moving the moving platen 4 up and down only by the conventional toggle mechanism 5, the upper mold 1 becomes a substantial clamping force at the position where the lower mold 2 is in contact, and the low pressure mold In the state of "the mold protection by foreign material detection was not performed in the state." In the press mechanism which moves the moving platen 4 up and down using a toggle mechanism, between the upper mold | type and the lower mold | type in a low-pressure mold state. A semiconductor resin encapsulation device capable of detecting whether or not foreign matter has been mixed.

More specifically, in the semiconductor resin encapsulation device disclosed in the above-mentioned patent document, the current position (die touch position) obtained by the position detection device 9 is based on whether or not the setting position is the same. , It is determined whether the foreign material between the upper mold (1) and the lower mold (2).

Japanese Patent Laid-Open No. 06-151489

There is no mention of how to set the setting position used for judging the presence or absence of the foreign matter in the semiconductor resin encapsulation device disclosed in the above-mentioned patent document. Therefore, it is difficult to realize highly accurate foreign material detection.

SUMMARY OF THE INVENTION The present invention has been made for the purpose of solving such a problem, and provides an apparatus and method capable of accurately detecting foreign matters that may be mixed between molding dies.

According to one aspect of the present invention, there is provided a resin molding apparatus for resin-molding a molding object by using a molding mold including a first mold and a second mold disposed to face each other. The resin molding apparatus includes a mold clamping mechanism for changing the distance between the first mold and the second mold, and a control unit for controlling the mold clamping mechanism. The control unit measures the mold clamping force, which is the pressure exerted on the mold by the mold clamping mechanism while narrowing the distance between the first mold and the second mold in a state where the molding target is placed on the mold, and the clamping force measured. A process of acquiring the first position of the clamping mechanism exceeding the first predetermined value, a process of setting the second position obtained by correcting the first position by the correction value as the foreign matter detection position, In the molding operation, a process for detecting foreign matter in the molding die is performed based on the clamping force measured at the foreign matter detection position.

According to another situation of this invention, the manufacturing method of the resin molded article which resin-molars a molding object using the shaping | molding die containing the 1st mold | type and the 2nd mold | position arrange | positioned opposingly is provided. The manufacturing method measures the clamping force which is the pressure exerted on the molding die by the clamping mechanism while narrowing the distance between the first mold and the second mold by the clamping mechanism in a state where the molding target is placed on the molding die. And a step of acquiring the first position of the clamping mechanism exceeding the first set value determined by the clamping force to be measured, and the second position obtained by correcting the first position by the correction value as the foreign material detection position. And a step of detecting the foreign matter in the molding die based on the clamping force measured at the foreign matter detection position in the molding operation.

The present invention can accurately detect foreign matters that may be mixed between the molds.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows an example of the whole structure of the resin molding apparatus which concerns on this embodiment.
FIG. 2: is a schematic diagram which shows the structural example (pre-molding state) of the press unit which comprises the resin molding apparatus which concerns on this embodiment.
FIG. 3: is a schematic diagram which shows the structural example (molded state) of the press unit which comprises the resin molding apparatus which concerns on this embodiment. FIG.
4 is a schematic diagram illustrating a hardware configuration example of a control unit constituting the resin molding device according to the present embodiment.
FIG. 5: is a schematic diagram which shows an example of the foreign material mixing detected by the press unit of the resin molding apparatus which concerns on this embodiment. FIG.
FIG. 6 is a diagram for explaining processing of foreign material detection in a press unit of the resin molding apparatus according to the present embodiment. FIG.
7 is a schematic diagram for explaining a method for setting a foreign matter detection position in the resin molding apparatus according to the present embodiment.
8 is a flowchart showing a setting procedure of a foreign matter detection position in the resin molding apparatus according to the present embodiment.
9 is a diagram illustrating a setting example of foreign material detection values and correction values used in the resin molding apparatus according to the present embodiment.

EMBODIMENT OF THE INVENTION Embodiment of this invention is described in detail, referring drawings. In addition, about the same or equivalent part in drawing, the same code | symbol is attached | subjected and the description is not repeated.

<A. Configuration Example of Resin Molding Apparatus 1

First, the structural example of the resin molding apparatus 1 which concerns on this embodiment is demonstrated. The resin molding apparatus 1 which concerns on this embodiment is typically used as an apparatus which resin-blocks a molding object by shape | molding resin in the chip arrangement surface of a molding object, such as a lead frame in which the chip was arrange | positioned. The resin molding apparatus 1 may be comprised as a part of the manufacturing apparatus of an electronic component. In the following description, although the lead frame is shown as a typical example of a molding object, it is not limited to this, Other support bodies, such as a board | substrate, may be sufficient.

As the chip of the electronic component, for example, an integrated circuit (IC), a large-scale integrated circuit (LSI), a light emitting diode (LED), a laser diode (LD) ), Semiconductor chips such as optical sensors, electronic device chips such as transistors, resistors, capacitors, and inductors. Examples of the support include a lead frame made of a metal material, a printed board such as a glass epoxy substrate, a ceramic substrate based on a ceramic material, a metal base substrate based on a metal material, and a polyimide. Flexible substrates based on resin films are assumed.

FIG. 1: is a schematic diagram which shows an example of the whole structure of the resin molding apparatus 1 which concerns on this embodiment. Referring to FIG. 1, the resin molding apparatus 1 is referred to as an import / extraction module 2 and one or a plurality of molding modules 3A, 3B, and 3C (hereinafter referred to as “molding module 3”). Collectively).

The import / extraction module 2 includes a lead frame supply unit 4, a lead frame alignment unit 5, a resin tablet supply unit 6, a material ejection unit 7, and a lead frame accommodation unit 8. ) And the control unit 100.

Each of the molding modules 3 includes a press unit 10. Each of the press units 10 includes a lower mold 11 that can be elevated and an upper mold (corresponding to the upper mold 18 shown in FIGS. 2 and 3) that are fixedly disposed to face each other above the lower mold 11. . The molding die is constituted by the upper die 18 and the lower die 11 that are disposed to face each other. In addition, the lower mold 11 is provided with a plurality of ports 14.

The resin molding apparatus 1 further includes a loader 12 and an unloader 13 configured to be able to move between the import / outtake module 2 and each press unit 10.

Here, the operation | movement in the resin molding apparatus 1 is demonstrated. First, the lead frame supply unit 4 carries out the lead frame alignment unit before the encapsulation lead frame 15 which becomes the object (molding object) of resin molding received from the exterior of the resin molding apparatus 1. Send to (5). Subsequently, the lead frame alignment unit 5 aligns the received pre-sealing lead frame 15 in a predetermined direction, and sends the aligned pre-sealing lead frame 15 to the material carrying unit 7. In parallel, the resin tablet supply unit 6 sends the resin tablet 16 which is a resin material received from the outside of the resin molding apparatus 1 to the material carrying unit 7 by the required number (four in FIG. 1). do.

Next, the material carrying unit 7 guides the lead frame 15 and the four resin tablets 16 with the predetermined number of sheets aligned (two pieces in FIG. 1) to the loader 12. The loader 12 simultaneously conveys the two pre-sealing lead frames 15 and the four resin tablets 16 received from the material carrying unit 7 to the press unit 10. Thereafter, the loader 12 arranges the lead frame 15 before sealing at a predetermined position of the lower mold 11, and supplies the resin tablet 16 to the inside of the port 14 provided in the lower mold 11.

Subsequently, die clamping, resin molding, and die opening by the molding module 3 are performed, so that the lead frame 15 is sealed before sealing, and the sealing lead is completed. Frames are created as achievements. Finally, the unloader 13 accommodates the resin-encapsulated sealed lead frame in the press unit 10 in the lead frame accommodating unit 8.

In addition, although the structure shown in FIG. 1 is made into the import / outtake module 2 which integrated the import module and the drawout module, the draw module is independent and is opposite to the shaping module 3B of the shaping | molding module 3C of FIG. It can also be placed in.

<B. Configuration Example of Press Unit 10>

Next, the structural example of the press unit 10 contained in the shaping | molding module 3 of the resin molding apparatus 1 is demonstrated.

FIG. 2: is a schematic diagram which shows the structural example (pre-molding state) of the press unit 10 which comprises the resin molding apparatus 1 which concerns on this embodiment. FIG. 3: is a schematic diagram which shows the structural example (molded state) of the press unit 10 which comprises the resin molding apparatus 1 which concerns on this embodiment.

2 and 3, the press unit 10 includes an upper fixing plate 17 and a movable plate 19. The upper mold | type 18 is fixedly arranged in the lower surface of the upper fixing board 17, and the lower mold | type 11 is fixedly arranged in the upper surface of the movable board 19. As shown in FIG. The upper mold | type 18 and the lower mold | type 11 contain the heater 20 as a heating mechanism. The upper mold | type 18 and the lower mold | type 11 are heated by the heater 20 to predetermined temperature (for example, about 180 degreeC).

The lead frame 15 before sealing is arrange | positioned in the predetermined area | region of the lower mold | type 11. The lead frame 15 before sealing has the lead frame main body and the chip 21 mounted in the lead frame main body. The terminal of the chip 21 and the terminal of the lead frame are electrically connected by the wire 22.

The press unit 10 includes a clamping mechanism 23 for raising and lowering the movable plate 19 along the surface up and down direction. The mold clamping mechanism 23 raises and lowers the movable plate 19 to change the distance between the upper mold 18 and the lower mold 11 (corresponding to the first mold and the second mold) and thereby the upper mold 18 ) And mold opening (see FIG. 3) between the lower mold 11 and the lower mold 11. In other words, the clamping mechanism 23 changes the distance between the upper mold 18 and the lower mold 11.

The lifting operation by the clamping mechanism 23 is controlled by the control unit 100. Thus, although the control part 100 controls the mold clamping mechanism 23, you may make it control also about the other mechanism which comprises the resin molding apparatus 1. As shown in FIG. Regarding the control of the press unit 10, the control unit 100 acquires the deformation amount detected by the strain gauge 152 provided on the support shaft of the mold clamping mechanism 23, and the clamping mechanism 23 at the time of clamping. The force or pressure (hereinafter also referred to as "clamping force") applied to the molding die is measured. The control part 100 gives a control command to the driver 150 which drives the clamping mechanism 23, and acquires the lifting position of the movable panel 19 from the clamping mechanism 23. FIG. As mentioned later, the control part 100 controls the clamping mechanism 23 based on input of a clamping force, a lifting position, etc. which are given to a shaping | molding die.

The mold clamping mechanism 23 can be realized by using any mechanism. For example, a cylinder or a toggle mechanism can be used. The mold clamping mechanism 23 is driven by the driver 150 and outputs a lift position as feedback.

In the resin molding apparatus 1 which concerns on this embodiment, although the mold clamping mechanism 23 employ | adopts the structure which drives the lower mold 11 arrange | positioned under the gravity of the upper mold | type 18, the upper mold 11 is fixed and an upper mold | type is used. 18 may be driven, and both the upper mold | type 18 and the lower mold | type 11 may be driven.

In the mold clamping operation by the press unit 10, the controller 100 gives a command to the driver 150. In response to an instruction from the control unit 100, the mold clamping mechanism 23 drives to move up the lower mold 11 fixed to the upper surface of the movable panel 19. In conjunction with the homology by the mold clamping mechanism 23, the resin tablet 16 supplied into each port 14 is pressurized by the plunger 24. During this pressurization, the resin tablet 16 is heated, and the resin tablet 16 melts and fluid resin is produced. As shown in FIG. 3, the plunger 24 is continuously pressurized, so that the flowable resin generated by melting flows into the cavity 26 through the resin passage 25.

Thereafter, the cured resin is formed by heating the flowable resin introduced into the cavity 26 for the required time required for curing. After the elapse of the time required for curing, the upper mold 18 and the lower mold 11 are opened to release the resin-encapsulated sealed lead frame.

<C. Configuration Example of Control Unit 100>

Next, the structural example of the control part 100 which comprises the resin molding apparatus 1 is demonstrated. The control part 100 performs control regarding resin molding in the press unit 10 at least. The control unit 100 may further execute control relating to any mechanism included in the resin molding apparatus 1.

The control unit 100 may be mounted using a control device such as a programmable logic controller (PLC), for example, or may be mounted using an industrial personal computer.

FIG. 4: is a schematic diagram which shows the hardware structural example of the control part 100 which comprises the resin molding apparatus 1 which concerns on this embodiment. In FIG. 4, the structural example of the control part 100 which employ | adopted the industrial personal computer which concerns on a general-purpose architecture as a typical example is shown. The control unit 100 executes a general-purpose operating system (OS) and a real-time OS, respectively, so that both a human-machine interface (HMI) function and a communication function and a control function requiring real-time characteristics are compatible.

As the main component, the control unit 100 includes an input unit 102, an output unit 104, a main memory 106, an optical drive 108, a processor 110, and a hard disk drive (HDD) ( 120, a network interface 112, a clamp force measuring interface 114, and a clamping mechanism interface 116. These components are connected to exchange data with each other via the internal bus 118.

The input unit 102 is a component that receives an operation from an operator, and typically includes a keyboard, a touch panel, a mouse, a track ball, and the like. The output part 104 is a component which outputs the process result etc. by the control part 100 to the exterior, and typically contains a display, a printer, various indicators, etc. The main memory 106 is composed of a DRAM (Dynamic Random Access Memory) or the like, and holds a code of a program executed by the processor 110 or various work data necessary for executing the program.

The processor 110 reads a program stored in the HDD 120 and executes a process on input data. The processor 110 is configured to execute a general-purpose OS and various applications that operate on the general-purpose OS, and a real-time OS and various applications that operate on the real-time OS in parallel. As one example, the processor 110 is configured of a plurality of processors (so-called "multi-processor"), a configuration including a plurality of cores in a single processor (so-called "multi-core"), and multi-processor and multi-core It may be implemented by any of the structures which have both the characteristics.

The HDD 120 is a storage unit and typically stores a general-purpose OS 122, a real-time OS 124, an HMI program 126, and a control program 128. The HMI program 126 operates under the execution environment of the general-purpose OS 122, and mainly implements processing relating to sending and receiving with an operator. The control program 128 operates under the execution environment of the real-time OS 124, and controls each component constituting the resin molding apparatus 1.

The various programs executed by the control unit 100 can be stored in a recording medium 108A such as a DVD-ROM (Digital Versatile Disc Read Only Memory) and distributed. The recording medium 108A reads its contents from the optical drive 108 and is installed in the HDD 120. That is, certain aspects of the present invention include a program for realizing the control section 100 and any recording medium storing the program. As these recording media, in addition to the optical recording media, magnetic recording media, magneto-optical recording media, semiconductor recording media and the like may be used.

4 illustrates a form in which a plurality of types of programs are installed in the HDD 120, but these programs may be integrated as one program or may be assembled as part of another program.

The network interface 112 exchanges data with an external device through a network.

The program installed in the HDD 120 may be acquired from the server via the network interface 112. In other words, the program for realizing the control unit 100 according to the present embodiment may be downloaded and installed in the HDD 120 by any method.

The measured value (strain amount) from the strain gauge 152 is input to the clamp force measurement interface 114. The lifting position from the clamping mechanism 23 is input to the clamping mechanism interface 116. In addition, the clamping mechanism interface 116 is given a command to lift the movable panel 19 to the driver 150.

Although the structural example which implement | achieves the control part 100 which concerns on this embodiment was demonstrated in FIG. 4 by the processor 110 executing a program, it is not limited to this, The granular material which concerns on this invention (体) The configuration corresponding to the technical level of the times when the supplying device or the granular material supplying method is realistically mounted can be appropriately adopted. For example, instead of a general-purpose computer, a PLC which is an industrial controller may be used. Alternatively, all or part of the functions provided by the controller 100 may be mounted using an integrated circuit such as an LSI or an application specific integrated circuit (ASIC), or may be replaced with a field-programmable gate array (FPGA) or the like. It may be mounted using a programmable circuit element. Alternatively, the functions provided by the control unit 100 shown in FIG. 4 may be realized by cooperating with a plurality of processing subjects. For example, the functions provided by the control unit 100 may be realized by linking a plurality of computers.

In addition, not all of the components shown in FIG. 4 are required and are not used for actual control such as an optical drive 108, a mouse as an example of the input unit 102, a printer as an example of the output unit 104, and the like. The configuration can be omitted as appropriate.

<D. Overview of Foreign Object Detection>

Next, the outline | summary of the foreign material detection in the press unit 10 of the resin molding apparatus 1 which concerns on this embodiment is demonstrated.

FIG. 5: is a schematic diagram which shows an example of the foreign material mixing detected by the press unit 10 of the resin molding apparatus 1 which concerns on this embodiment. As shown in FIG. 5, as an example of the foreign material mixing, the state in which the some pre-sealing lead frame 15 is conveyed and arrange | positioned between the upper mold | type 18 and the lower mold | type 11 is assumed. If molds of the upper mold 18 and the lower mold 11 are performed in the state where the plurality of pre-sealing lead frames 15 are arranged, excessive mold force is generated on the upper mold 18 and the lower mold 11, resulting in damage to the molding die. It is possible to reach back. Moreover, the fall of productivity by the generation of defective goods, etc. are also assumed.

In the present embodiment, the clamping force is set to a predetermined value (hereinafter, “foreign matter detection”) until the lower mold 11 is raised to a predetermined position (hereinafter, “foreign matter detection position”) by the clamping mechanism 23. Is also referred to as &quot; value &quot;). That is, the resin molding apparatus 1 detects the foreign material in a shaping | molding die based on the clamping force measured by the foreign material detection position in a shaping | molding operation.

FIG. 6: is a figure for demonstrating the process of the foreign material detection in the press unit 10 of the resin molding apparatus 1 which concerns on this embodiment. Referring to FIG. 6, the shaping operation of the molding die by the press unit 10 includes a first phase P1 for position control and a second phase P2 for pressure control.

In 1st phase P1, the control part 100 gives a climbing instruction | command to the clamping mechanism 23 so that a raising / lowering position may become the predetermined foreign matter detection position. That is, the lifting control based on the lifting position of the mold clamping mechanism 23 is executed. In the second phase P2, the control unit 100 gives an upward command to the clamping mechanism 23 so that the clamping force becomes a predetermined value. That is, the lifting control based on the clamping force of the clamping mechanism 23 is executed. FIG. 6 shows an example in which the lower mold is raised to bring the object to be in contact with the upper mold, and the clamping force increases to the stop position of the lower mold in the mold.

Foreign material detection is performed based on whether the clamp force measured in this process exceeds the foreign material detection value in the first phase P1. As will be described later, the foreign matter detection position is appropriately set so as to distinguish between the steady state and the foreign matter mixing state. Therefore, in the steady state, the clamping force does not exceed the foreign matter detection value until the foreign matter detection position is reached. On the other hand, in the foreign material mixing state, the clamping force exceeds the foreign material detection value until the foreign material detection position is reached.

Thus, the process of detecting the foreign material by the control part 100, in the process of narrowing the distance between the upper mold | type 18 and the lower mold | type 11 to a foreign material detection position, determines whether the clamping force measured by this process exceeds the foreign material detection value. It includes the process of judging the presence or absence of the foreign material based on whether or not. In the present embodiment, the presence or absence of foreign matter is mixed on the basis of such a difference in clamping force.

In addition, in the state where the distance between the upper mold | type 18 and the lower mold | membrane 11 was narrowed to the foreign material detection position, the control part 100 will carry out a 2nd phase (if the clamping force measured in the process which detects a foreign material does not exceed a foreign material detection value). The process moves to P2) and a command is given to the clamping mechanism 23 so that the clamping force becomes a predetermined value.

By the processing of the first phase P1 and the second phase P2 as described above, the mold can be molded with a prescribed clamping force.

<E. Setting method of foreign object detection position>

Next, the setting method of a foreign material detection position is demonstrated. The foreign matter detection position is set for each molding die.

FIG. 7: is a schematic diagram for demonstrating the setting method of the foreign material detection position in the resin molding apparatus 1 which concerns on this embodiment. Referring to FIG. 7, the upper mold 18 and the lower mold 11 are lifted by raising the movable plate 19 in a state where the lead frame 15 before sealing is disposed on the mold (upper mold 18 and lower mold 11). Monitor the clamping force measured while narrowing the distance between When the clamping force exceeds the foreign matter detection value, the rise of the movable panel 19 is stopped. The position obtained by subtracting the predetermined correction value (which may include the case where the correction value is zero) from the stop position of the movable panel 19 is set as the foreign matter detection position. In a normal shaping | molding operation | movement, a foreign material detection is performed based on the clamping force measured until reaching the set foreign material detection position. The setting processing of the foreign matter detection position may be performed at the time of replacing the molding die.

8 is a flowchart showing a setting procedure of the foreign matter detection position in the resin molding apparatus 1 according to the present embodiment. Each step of the flowchart shown in FIG. 8 is typically realized by the processor 110 of the controller 100 executing the HMI program 126 and the control program 128.

Referring to FIG. 8, the control unit 100 determines whether or not the transition of the mold to the replacement mode is instructed (step S100). An instruction of the transition of the mold to the replacement mode is given by the operator through the input unit 102 of the control unit 100. If the transition to the replacement mode of the mold is not instructed (NO in step S100), the process of step S100 is repeated.

When the transition of the mold to the exchange mode is instructed (YES in step S100), the control unit 100 notifies the output unit 104 or the like that the mold is in the exchange mode (step S102). In this state, the worker replaces the mold. When the replacement of the mold is completed, the operator instructs the end of the replacement mode of the mold.

The control unit 100 determines whether or not the end of the changing mode of the mold is instructed (step S104). If the end of the mold replacement mode is not instructed (NO in step S104), the process of step S104 is repeated.

When the end of the mold replacement mode is instructed (YES in step S104), the control unit 100 ends the notification that the mold replacement mode is in progress (step S106).

Subsequently, the setting processing of the foreign matter detection position is started. Prior to the start of the setting process of the foreign matter detection position, the control unit 100 notifies that the setting of the foreign matter detection position is necessary from the output unit 104 or the like (step S108). In this state, the operator arranges the lead frame 15 before sealing in the attached molding die. When arrangement | positioning of the lead frame 15 before sealing is completed, an operator instructs start of the setting process of a foreign material detection position. The molding object may be arranged from the notification of step S108 until the instruction of the rising of step S112 described later is given.

The control part 100 determines whether the start of the setting process of the foreign material detection position was instructed (step S110). If the start of the setting process of the foreign matter detection position is not instructed (NO in step S110), the process of step S110 is repeated.

When the start of the setting process of the foreign matter detection position is instructed (YES in step S110), the control unit 100 determines whether the rising of the mold clamping mechanism 23 is instructed (step S112). If the raising of the clamping mechanism 23 is not instructed (NO in step S112), the process of step S112 is repeated.

When the rising of the mold clamping mechanism 23 is instructed (YES in step S112), the control part 100 arrange | positions the distance between the upper mold | type 18 and the lower mold | type 11 in the state which arrange | positioned the lead frame 15 before sealing to the shaping | molding die. Measure the clamping force by narrowing the More specifically, the control part 100 gives a rising command to the clamping mechanism 23 (step S114), and starts monitoring the clamping force which arises in the clamping mechanism 23 (step S116). And the control part 100 determines whether the measured clamp force exceeds the foreign material detection value (step S118). The foreign matter detection value can be set in advance. If the clamping force measured in this process does not exceed the foreign matter detection value (NO in step S118), the process of step S118 is repeated.

If the measured clamping force exceeds the foreign matter detection value (YES in step S118), the control unit 100 gives a stop command to the clamping mechanism 23 (step S120), and the lift position in the state where the clamping mechanism 23 is stopped. And store the raised and lowered positions from the output unit 104 or the like to the worker (step S122). That is, the control part 100 acquires the lifting position (corresponding to 1st position) of the clamping mechanism 23 which exceeds the foreign object detection value (corresponding to a 1st set value) predetermined clamping force.

And the control part 100 performs the process of extending the distance between the upper mold | type 18 and the lower mold | type 11, when the measured clamping force exceeds a foreign material detection value. More specifically, the control part 100 gives a descending instruction to the clamping mechanism 23 (step S124), and when the clamping mechanism 23 reaches an initial position (lowest position), the lifting | lowering operation of the clamping mechanism 23 is performed. Is stopped (step S126).

Subsequently, the control part 100 determines whether the correction operation by an operator was performed (step S128). If the correcting operation by the operator has not been made (NO in step S128), the process of step S128 is repeated.

When the correction operation by the operator is made (YES in step S128), the control part 100 calculates the foreign material detection position by subtracting the correction value set in step S128 from the lifting position stored in step S122 (step S130). The correction value may be set in advance or may be set manually by the operator. In addition, the operator can also arbitrarily change the preset default value.

That is, it can be represented by the foreign material detection position Hd = lifting position H0-correction value (DELTA) H using the lifting position H0 stored in step S122 and correction value (DELTA) H. Correction value (DELTA) H corresponds to a kind of margin for distinguishing a steady state from a foreign material mixing state.

And the control part 100 determines whether the setting determination operation of the foreign material detection position by an operator was performed (step S132). If the setting determination operation of the foreign matter detection position by the operator has not been performed (NO in step S132), the process of step S132 is repeated. If the setting determination operation of the foreign matter detection position by the operator has been performed (YES in step S132), the control unit 100 sets the foreign matter detection position calculated in step S130 in association with the molding die currently mounted (step S134). ).

In addition, regarding step S134, if it is not necessary, for example, when setting as described below using FIG. 9 is not performed, the calculated foreign matter detection position may not be related to the molding die currently mounted.

In this way, the control unit 100 moves to the lifting position H0 (the first position) of the clamping mechanism 23 acquired by the correction value ΔH in the direction of extending the distance between the upper mold 18 and the lower mold 11. The position (elevation position H0-correction value (DELTA) H) obtained by correct | amending is set as a foreign material detection position Hd. And the control part 100 complete | finishes notification of what needs to set the foreign material detection position (step S136).

By the above procedure, the setting processing of the foreign matter detection position is completed. Based on the foreign matter detection position set as described above, foreign matter detection based on the clamping force measured at the foreign matter detection position is performed in a normal molding operation.

Specifically, when the lower mold on which the molding target object is placed is raised to reach the foreign matter detection position set as described above, the clamping force measured at the position is acquired. The clamping force at the foreign object detection value set in advance and the foreign body detection position are compared, and when a clamping force exceeds the foreign object detection value, a shaping | molding operation | movement is stopped and a lower mold | type is lowered. When the mold clamping force is less than the foreign matter detection value, the lower mold is raised again, and the molding object is resin molded. If the clamping force and the foreign matter detection value are equal, the molding operation may be stopped and the lower mold may be lowered as in the case where the clamping force exceeds the foreign object detection value. Also good.

<F. Foreign Object Detection and Correction Values>

In the above description, the foreign matter detection value and the correction value used when setting the foreign matter detection position have shown an example set in advance. Since the foreign matter detection position is set for each molding die, the set value corresponding to the molding die may also be adopted for the foreign matter detection value and the correction value.

FIG. 9: is a figure which shows the example of a setting of the foreign material detection value and the correction value used by the resin molding apparatus 1 which concerns on this embodiment. In the set value table 200 shown in FIG. 9, three types (large package, medium package, and small package) are defined as the mold types 201, and the foreign material detection value 202 and The correction value 203 is set.

In the set value table 200 shown in FIG. 9, the foreign material detection value and the correction value are set depending on the size of the package which is produced by being separated into pieces after the lead frame 15 before sealing is resin-sealed.

The control part 100 may refer to the setting value table 200 shown in FIG. 9, and may set a setting value and a correction value according to the attribute of a shaping | molding die. Alternatively, the control unit 100 may present the set of the foreign matter detection value and the correction value set in the set value table 200 to the operator and accept the selection from the operator.

By relying on such foreign matter detection value and correction value as an attribute of the lead frame 15 before sealing, it is possible to set a more suitable foreign matter detection position.

In the above embodiment, the foreign matter detection value (set value) used when acquiring the lifted position (corresponding to the first position) in the setting of the foreign matter detection position and the foreign matter detection value used when judging the presence or absence of the foreign matter have the same value. As an example. That is, the example in which the foreign material detection value used when determining the presence or absence of foreign matters is set to the same value as the foreign material detection value used when acquiring the lift position is explained.

However, the foreign material detection value used when acquiring the lifted position is set as the "first set value" or "the first set value of clamping force", and the foreign material detection value used when determining the presence or absence of the foreign material is referred to as the "second set value" or When it is set as "the 2nd set value of mold clamping force", a 1st set value and a 2nd set value can be made into a different value, such as setting the 1st set value as a 2nd set value.

<G. Bookkeeping>

This embodiment includes the following technical ideas.

According to one embodiment, there is provided a resin molding apparatus for resin molding a molding object by using a molding mold including a first mold and a second mold disposed to face each other. The resin molding apparatus includes a mold clamping mechanism for changing the distance between the first mold and the second mold, and a control unit for controlling the mold clamping mechanism. The control unit measures the clamping force, which is the pressure exerted on the mold by the clamping mechanism, while narrowing the distance between the first mold and the second mold in a state where the molding target is placed on the mold, and the clamping force measured. A process of acquiring the first position of the mold clamping mechanism exceeding the first predetermined value, a process of setting the second position obtained by correcting the first position by the correction value as the foreign matter detection position, In the molding operation, a process for detecting foreign matter in the molding die is performed based on the clamping force measured at the foreign matter detection position.

The foreign matter detection process is based on whether or not the clamp force measured in this process exceeds a second predetermined value in the process of narrowing the distance between the first die and the second die to the foreign matter detection position. And the processing for judging the presence or absence of the foreign matter may be included.

In the state where the distance between the first mold and the second mold is narrowed down to the foreign material detection position, the control unit determines that the clamping force is predetermined if the clamping force measured by the process for detecting the foreign material does not exceed the second set value. If possible, a process of giving a command to the mold clamping mechanism may also be executed.

The second set value may be set to the same value as the first set value.

The control unit may further execute a process of widening the distance between the first mold and the second mold when the clamping force measured in the process of detecting the foreign matter exceeds the second set value.

The mold clamping mechanism may drive the second mold disposed below the gravity of the first mold.

The control unit may set the first set value and the correction value in response to the properties of the mold.

According to another embodiment, there is provided a method for producing a resin molded article in which a molding object is resin-molded using a molding mold including a first mold and a second mold disposed to face each other. The manufacturing method measures the clamping force which is the pressure exerted on the molding die by the clamping mechanism while narrowing the distance between the first mold and the second mold by the clamping mechanism in a state where the molding target is placed on the molding die. And a step of acquiring the first position of the clamping mechanism exceeding the first set value determined by the clamping force to be measured, and the second position obtained by correcting the first position by the correction value as the foreign material detection position. And a step of detecting the foreign matter in the molding die based on the clamping force measured at the foreign matter detection position in the molding operation.

The step of detecting the foreign matter is based on whether or not the clamp force measured in this process exceeds a second predetermined value in the process of narrowing the distance between the first mold and the second mold to the foreign material detection position. And determining the presence or absence of the foreign matter.

The manufacturing method has a predetermined clamping force value if the clamping force measured in the process of detecting the foreign matter does not exceed the second set value while the distance between the first mold and the second mold is narrowed to the foreign object detection position. In addition, the step of giving a command to the mold clamping mechanism may also be included.

The second set value may be set to the same value as the first set value.

The manufacturing method may further include the step of extending the distance between the first mold and the second mold when the clamping force measured in the process of detecting the foreign matter exceeds the second set value.

The mold clamping mechanism may drive the second mold disposed below the gravity of the first mold.

The manufacturing method may further include the step of setting the first set value and the correction value in response to the properties of the mold.

<H. Advantage

As a typical method of setting the foreign matter detection position, one pre-sealing lead frame 15 is placed on a molding die, and the two pre-sealing lead frames 15 are obtained while the position to be in a predetermined state is obtained by manual operation. It arrange | positions to a shaping | molding die and acquires the position which becomes a predetermined state by manual operation. The intermediate value and the like of the two positions thus obtained can be set as the foreign matter detection position. In such a setting method, there exists a problem that a deviation may occur in a set value by the skill of an operator, and also a problem that labor takes because of manual operation.

In contrast, according to the present embodiment, the foreign matter detection position can be set automatically. Thereby, since a foreign material detection position can be set with high precision compared with the case of setting a foreign material detection position by manual operation, high-precision foreign object detection can be implement | achieved. Moreover, compared with the case of setting a foreign material detection position by manual operation, the time required for setting a foreign material detection position can be shortened, and productivity can be improved.

While the embodiments of the present invention have been described, it should be considered that the embodiments disclosed herein are exemplary in all respects and not restrictive. The scope of the present invention is shown by the Claim, and it is intended that the meaning of a claim and equality and all the changes within a range are included.

1: resin molding apparatus
2: Import and withdrawal module
3, 3A, 3B, 3C: forming module
4: lead frame supply unit
5: lead frame alignment unit
6: resin tablet supply unit
7: material carrying unit
8: lead frame accommodation unit
9: position detection device
10: press unit
11: lower mold
12: loader
13: unloader
14: port
15: Lead frame before encapsulation
16: resin tablet
17: upper fixing plate
18: Pictograph
19: movable panel
20: heater
21: chip
22: wire
23: clamping mechanism
24: plunger
25: resin passage
26: cavity
100: control unit
102: input unit
104: output unit
106: main memory
108: optical drive
108A: Recording Media
110: processor
112: network interface
114: clamping force measurement interface
116: Clamping Mechanism Interface
118: internal bus
120: HDD
122: general purpose OS
124: Real-Time OS
126: HMI program
128: control program
150: driver
152: strain gauge
200: set point table
201: by molding type
202: foreign matter detection value
203: correction value
P1: First phase
P2: Second Phase

Claims (12)

A resin molding apparatus for resin-molding a molding object by using a molding mold including a first mold and a second mold disposed to face each other,
A clamping mechanism for changing a distance between the first mold and the second mold;
A control unit for controlling the mold clamping mechanism,
The control unit,
A process of measuring a clamping force which is the pressure exerted on the mold by the mold clamping mechanism while narrowing the distance between the first mold and the second mold in a state where the molding object is placed on the mold;
A process of acquiring a first position of the clamping mechanism in which the clamping force to be measured exceeds a first predetermined value;
A process of setting the second position obtained by correcting the first position by the correction value as the foreign matter detection position,
In the molding operation, a process for detecting the foreign matter in the molding die is performed based on the clamping force measured at the foreign matter detection position. The method of claim 1,
The processing for detecting the foreign matter is performed in the process of narrowing the distance between the first mold and the second mold to the foreign material detection position, and determines whether the clamp force measured in this process exceeds a second predetermined value. The resin molding apparatus characterized by including the process of determining the presence or absence of a foreign material based on the presence or absence. The method of claim 2,
The said control part is a clamping force, if the clamping force measured by the process which detects the said foreign material does not exceed the said 2nd set value, in the state which narrowed the distance between the said 1st mold | type and the said 2nd mold | die to the said foreign material detection position. And a process of giving a command to the mold clamping mechanism so as to be a predetermined value. The method according to claim 2 or 3,
The said 2nd set value is set to the same value as the said 1st set value, The resin molding apparatus characterized by the above-mentioned. The method according to claim 2 or 3,
The control unit further executes a process of widening the distance between the first mold and the second mold when the clamping force measured in the process of detecting the foreign matter exceeds the second set value. Forming device. The method according to any one of claims 1 to 3,
The said control part sets the said 1st set value and the correction value according to the attribute of the said molding die. As a manufacturing method of the resin molded article which resin-forms a molding object using the shaping | molding die containing the 1st mold | type and the 2nd mold | position arrange | positioned opposingly,
The clamping force, which is the pressure exerted on the mold by the clamping mechanism, is measured by narrowing the distance between the first mold and the second mold by the clamping mechanism in a state where the molding object is placed on the mold. With step to do,
Acquiring a first position of the clamping mechanism in which the clamping force to be measured exceeds a first predetermined value;
Setting a second position obtained by correcting the first position by a correction value as a foreign matter detection position;
And a step of detecting the foreign matter in the molding die on the basis of the clamping force measured at the foreign matter detection position in the molding operation. The method of claim 7, wherein
The step of detecting the foreign matter may include determining whether the clamp force measured in this process exceeds a second predetermined value in the process of narrowing the distance between the first mold and the second mold to the foreign material detection position. The manufacturing method of the resin molded article characterized by including the step of determining the presence or absence of a foreign material based on whether or not. The method of claim 8,
In a state where the distance between the first mold and the second mold is narrowed to the foreign material detection position, the clamping force is predetermined if the clamping force measured in the process of detecting the foreign material does not exceed the second set value. And a step of giving a command to said mold mechanism so that it becomes a value. The manufacturing method of the resin molded article characterized by the above-mentioned. The method according to claim 8 or 9,
Said 2nd set value is set to the same value as said 1st set value, The manufacturing method of the resin molded article characterized by the above-mentioned. The method according to claim 8 or 9,
If the clamping force measured by the process which detects the said foreign material exceeds the said 2nd set value, the manufacturing method of the resin molded article further provided with the step of extending the distance between the said 1st mold and the said 2nd mold. . The method according to claim 8 or 9,
And a step of setting the first set value and the correction value in response to the properties of the molding die.

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