KR20190108234A - 이에프이엠 - Google Patents
이에프이엠 Download PDFInfo
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- KR20190108234A KR20190108234A KR1020180029495A KR20180029495A KR20190108234A KR 20190108234 A KR20190108234 A KR 20190108234A KR 1020180029495 A KR1020180029495 A KR 1020180029495A KR 20180029495 A KR20180029495 A KR 20180029495A KR 20190108234 A KR20190108234 A KR 20190108234A
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- Prior art keywords
- wafer transfer
- transfer chamber
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- wafer
- curved portion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 본 발명의 바람직한 실시 예에 따른 이에프이엠에 로드 포트가 접속된 것을 도시한 사시도.
도 3 및 도 4는 본 발명의 바람직한 실시 예에 따른 이에프이엠의 사시도.
도 5는 도 3의 분해도.
도 6은 도 3의 웨이퍼 반송실을 도시한 사시도.
도 7은 도 4의 웨이퍼 반송실을 도시한 사시도.
도 8은 도 3의 송출부의 기류제어부를 도시한 평면도.
도 9는 도 8의 기류제어부의 기류제어 날개를 도시한 사시도.
도 10은 도 9의 A-A'의 단면도.
도 11은 도 3의 배출부를 도시한 사시도.
20: 웨이퍼 저장장치 21: 풉
22: 로드포트
30: 공정장비 31: 로드로크실
31a: 로드로크실 도어 32: 공정장비 반송실
32a: 공정장비 반송실 도어 33: 공정유닛
34: 공정장비 반송장치
100: 웨이퍼 반송실 110: 전면벽
111: 전면벽 개구부 111a: 전면벽 개구부 곡면부
120: 후면벽 121: 후면벽 개구부
121a: 후면벽 개구부 곡면부 130: 좌측면벽
131: 좌측면벽 개구부 131a: 좌측면벽 도어
140: 우측면벽 141: 우측면벽 개구부
141a: 우측면벽 도어 150: 모서리벽
160: 설치판 161: 반송장치
170: 곡면부
200: 송출부 210: 팬필터유닛
220: 기류제어부 221: 플레이트
222: 기류제어날개 223: 몸체
223a: 체류공간 224: 구멍
225: 압축가스 주입구 226: 압축가스 배출구
227: 경사면
300: 배기부 310: 배기판
311: 배기구 320: 배기덕트
330: 포집박스 340: 배기유로
Claims (10)
- 웨이퍼 저장장치와 공정장비 사이에서의 웨이퍼 반송이 이루어지는 웨이퍼 반송실; 및
상기 웨이퍼 반송실 내에 가스를 송출하는 송출부;를 포함하되,
상기 웨이퍼 반송실의 내면의 적어도 일부에는 유선형의 곡면부가 구비된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 곡면부는 상기 웨이퍼 반송실의 외측 방향으로 볼록하게 형성된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 곡면부는, 상기 웨이퍼 반송실의 외측 방향으로 볼록하게 형성된 볼록 곡면부와, 상기 웨이퍼 반송실의 외측 방향으로 오목하게 형성된 오목 곡면부가 상호 연속적으로 형성된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 곡면부는 상기 웨이퍼 반송실의 내면으로부터 탈착 가능한 것을 특징으로 하는 이에프이엠. - 제4항에 있어서,
상기 곡면부와 상기 웨이퍼 반송실의 내면 사이에는 보온재가 구비된 것을 특징으로 하는 이에프이엠. - 제1항 또는 제5항에 있어서,
상기 웨이퍼 반송실의 내면에는 상기 웨이퍼 반송실을 가열시키는 히터가 구비된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 곡면부는 폴리머 재질로 이루어진 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 웨이퍼 반송실의 내면에는 상기 웨이퍼 저장장치 또는 상기 공정장비가 접속되는 개구부가 형성되고,
상기 개구부에는 상기 개구부의 중심점을 기준으로 상기 웨이퍼 반송실의 외측 방향으로 볼록하게 형성된 개구부 곡면부가 구비된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 곡면부 중 상기 웨이퍼 반송실의 내면의 모서리에 구비된 곡면부는 상기 웨이퍼 반송실의 모서리 방향으로 볼록하게 형성된 것을 특징으로 하는 이에프이엠. - 제1항에 있어서,
상기 웨이퍼 반송실 내의 가스를 배기하며, 복수개의 배기구가 구비된 배기판을 포함하는 배기부; 및
상기 웨이퍼 반송실의 내면에 구비되는 기류 가이드부;를 더 포함하되,
상기 기류 가이드부는 상기 복수개의 배기구 중 인접하는 배기구 각각에 상기 송출부에서 송출된 가스가 유동되도록 상기 인접하는 배기구 사이와 대응되는 위치에 위치하는 것을 특징으로 하는 이에프이엠.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180029495A KR102132422B1 (ko) | 2018-03-14 | 2018-03-14 | 이에프이엠 |
US15/934,819 US10593580B2 (en) | 2018-03-14 | 2018-03-23 | EFEM, equipment front end module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180029495A KR102132422B1 (ko) | 2018-03-14 | 2018-03-14 | 이에프이엠 |
Publications (2)
Publication Number | Publication Date |
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KR20190108234A true KR20190108234A (ko) | 2019-09-24 |
KR102132422B1 KR102132422B1 (ko) | 2020-08-05 |
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KR1020180029495A Active KR102132422B1 (ko) | 2018-03-14 | 2018-03-14 | 이에프이엠 |
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US (1) | US10593580B2 (ko) |
KR (1) | KR102132422B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US11443966B2 (en) * | 2020-01-17 | 2022-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing flow field control apparatus and method |
US11315816B2 (en) | 2020-06-10 | 2022-04-26 | Kla Corporation | Localized purge module for substrate handling |
US11574837B2 (en) * | 2020-06-12 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot blade having multiple sensors for multiple different alignment tasks |
US12188686B2 (en) * | 2022-04-29 | 2025-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Air curtain device and workpiece processing tool |
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2018
- 2018-03-14 KR KR1020180029495A patent/KR102132422B1/ko active Active
- 2018-03-23 US US15/934,819 patent/US10593580B2/en active Active
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US10593580B2 (en) | 2020-03-17 |
KR102132422B1 (ko) | 2020-08-05 |
US20190287834A1 (en) | 2019-09-19 |
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