KR20190046827A - 기상 성장 장치, 에피택셜 웨이퍼의 제조 방법 및 기상 성장 장치용의 어태치먼트 - Google Patents
기상 성장 장치, 에피택셜 웨이퍼의 제조 방법 및 기상 성장 장치용의 어태치먼트 Download PDFInfo
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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Abstract
Description
도 1b는 도 1a의 기상 성장 장치의 기판을 향하여 가스가 통과하는 부재를 도시하는 평면적인 모식도.
도 2a는 도 1b의 인젝션 캡을 도시하는 모식 단면도.
도 2b는 도 1b의 어태치먼트를 도시하는 모식 단면도.
도 2c는 도 2a의 인젝션 캡에 도 2b의 어태치먼트를 장착한 모식 단면도.
도 3a는 도 1b의 인젝션 인서트를 도시하는 모식 정면도.
도 3b는 도 3a의 IIIB-IIIB 모식 단면도.
도 4는 비교예에 있어서의 기상 성장 장치의 일례를 도시하는 도 1b에 대응하는 모식 단면도.
도 5a는 실시예에서 측정한 에피택셜 웨이퍼의 막 두께 분포를 나타내는 그래프.
도 5b는 비교예에서 측정한 에피택셜 웨이퍼의 막 두께 분포를 나타내는 그래프.
2 반응로
3 베이스 링
6 어퍼 라이너
7 로어 라이너
8 도입 통로(통로)
8a 입구
8b 출구
8c 단차부
8c1 제1면
8c2 제2면
10 서셉터
14 인젝션 캡
14a 도입로
14b 부착부
15 어태치먼트
15a 분기로
15b 장착부
16 인젝션 인서트
16a 유로
W 기판
Claims (6)
- 원료 가스가 도입되는 입구를 가지고 상기 원료 가스에 의해 기판에 에피택셜층을 성장하는 반응로와,
상기 입구로부터 상기 입구의 외측으로 연장되어 상기 반응로에 상기 원료 가스를 인도하는 복수의 유로와,
상기 복수의 유로를 향하여 상기 원료 가스를 인도하는 도입로를 갖는 인젝션 캡과,
상기 도입로에 접속 가능한 접속로를 가지고 상기 인젝션 캡에 장착되는 석영제의 어태치먼트
를 구비하고,
상기 접속로는 상기 어태치먼트가 상기 인젝션 캡에 장착된 상태에서 상기 도입로에 접속함과 아울러, 상기 도입로측으로부터 상기 원료 가스의 하류측을 향하여 토너먼트 모양으로 상기 복수의 유로에 대응하여 분기되어 상기 복수의 유로에 접속하는 유로인 것을 특징으로 하는 기상 성장 장치. - 제1 항에 있어서,
상기 인젝션 캡은 스테인리스제인 것을 특징으로 하는 기상 성장 장치. - 제1항 또는 제2항에 있어서,
상기 복수의 유로는 합계로 2의 거듭제곱의 개수인 것을 특징으로 하는 기상 성장 장치. - 제1 항에 있어서,
상기 복수의 유로는 32개 이상인 것을 특징으로 하는 기상 성장 장치. - 제1 항에 기재된 기상 성장 장치를 사용하여 상기 기판에 에피택셜층을 성장시키는 에피택셜 웨이퍼의 제조 방법.
- 원료 가스가 도입되는 입구를 가지고 상기 원료 가스에 의해 기판에 에피택셜층을 성장하는 반응로와,
상기 입구로부터 상기 입구의 외측으로 연장되어 상기 반응로에 상기 원료 가스를 인도하는 복수의 유로와,
상기 복수의 유로를 향하여 상기 원료 가스를 인도하는 도입로를 갖는 인젝션 캡
을 구비하는 기상 성장 장치의 상기 인젝션 캡에 장착되는 기상 성장 장치용의 어태치먼트로서,
상기 어태치먼트는 석영제이며,
상기 어태치먼트가 상기 인젝션 캡에 장착된 상태에서 상기 도입로에 접속함과 아울러, 상기 도입로측으로부터 상기 원료 가스의 하류측을 향하여 토너먼트 모양으로 상기 복수의 유로에 대응하여 분기되어 상기 복수의 유로에 접속하는 접속로를 구비하는 것을 특징으로 하는 기상 성장 장치용의 어태치먼트.
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PCT/JP2017/024822 WO2018042877A1 (ja) | 2016-09-05 | 2017-07-06 | 気相成長装置、エピタキシャルウェーハの製造方法及び気相成長装置用のアタッチメント |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168650A (ja) | 2001-11-30 | 2003-06-13 | Shin Etsu Handotai Co Ltd | 気相成長装置およびエピタキシャルウェーハの製造方法 |
JP2007012664A (ja) | 2005-06-28 | 2007-01-18 | Sumco Corp | エピタキシャル成長装置およびその製造方法、エピタキシャルウェーハ |
JP2009277730A (ja) | 2008-05-12 | 2009-11-26 | Shin Etsu Handotai Co Ltd | 薄膜の気相成長方法および気相成長装置 |
JP2010258169A (ja) * | 2009-04-23 | 2010-11-11 | Sumco Techxiv株式会社 | 成膜反応装置及び成膜基板製造方法 |
JP2011249448A (ja) * | 2010-05-25 | 2011-12-08 | Shin Etsu Handotai Co Ltd | エピタキシャル成長装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756272A (en) * | 1986-06-02 | 1988-07-12 | Motorola, Inc. | Multiple gas injection apparatus for LPCVD equipment |
CH687258A5 (de) * | 1993-04-22 | 1996-10-31 | Balzers Hochvakuum | Gaseinlassanordnung. |
JP3501930B2 (ja) * | 1997-12-01 | 2004-03-02 | 株式会社ルネサステクノロジ | プラズマ処理方法 |
JP2000144383A (ja) * | 1998-11-18 | 2000-05-26 | Sony Corp | 蒸着装置 |
US6502530B1 (en) | 2000-04-26 | 2003-01-07 | Unaxis Balzers Aktiengesellschaft | Design of gas injection for the electrode in a capacitively coupled RF plasma reactor |
JP3578398B2 (ja) * | 2000-06-22 | 2004-10-20 | 古河スカイ株式会社 | 成膜用ガス分散プレート及びその製造方法 |
JP4239520B2 (ja) * | 2002-08-21 | 2009-03-18 | ソニー株式会社 | 成膜装置およびその製造方法、並びにインジェクタ |
JP3723794B2 (ja) * | 2002-10-07 | 2005-12-07 | 積水化学工業株式会社 | プラズマ表面処理装置の電極構造 |
KR100862658B1 (ko) * | 2002-11-15 | 2008-10-10 | 삼성전자주식회사 | 반도체 처리 시스템의 가스 주입 장치 |
JP2005183511A (ja) * | 2003-12-17 | 2005-07-07 | Shin Etsu Handotai Co Ltd | 気相成長装置およびエピタキシャルウェーハの製造方法 |
JP2005353775A (ja) * | 2004-06-09 | 2005-12-22 | Sumco Corp | エピタキシャル装置 |
JP2007262540A (ja) * | 2006-03-29 | 2007-10-11 | Jfe Steel Kk | 化学蒸着処理の原料ガス供給用ノズルと被膜形成方法および方向性電磁鋼板 |
JP5064132B2 (ja) * | 2007-07-25 | 2012-10-31 | シャープ株式会社 | 気相成長装置、及び半導体素子の製造方法 |
JP5520455B2 (ja) * | 2008-06-11 | 2014-06-11 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP5267366B2 (ja) * | 2009-07-16 | 2013-08-21 | 株式会社Sumco | シリコンウェーハの処理装置 |
US20140026816A1 (en) * | 2012-07-27 | 2014-01-30 | Applied Materials, Inc. | Multi-zone quartz gas distribution apparatus |
JP2014057047A (ja) * | 2012-08-10 | 2014-03-27 | Tokyo Electron Ltd | 基板処理装置及びガス供給装置 |
US10760161B2 (en) * | 2014-09-05 | 2020-09-01 | Applied Materials, Inc. | Inject insert for EPI chamber |
KR102350588B1 (ko) * | 2015-07-07 | 2022-01-14 | 삼성전자 주식회사 | 인젝터를 갖는 박막 형성 장치 |
-
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- 2017-07-06 KR KR1020197006234A patent/KR102301873B1/ko active Active
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- 2017-07-06 US US16/325,360 patent/US10665460B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168650A (ja) | 2001-11-30 | 2003-06-13 | Shin Etsu Handotai Co Ltd | 気相成長装置およびエピタキシャルウェーハの製造方法 |
JP2007012664A (ja) | 2005-06-28 | 2007-01-18 | Sumco Corp | エピタキシャル成長装置およびその製造方法、エピタキシャルウェーハ |
JP2009277730A (ja) | 2008-05-12 | 2009-11-26 | Shin Etsu Handotai Co Ltd | 薄膜の気相成長方法および気相成長装置 |
JP2010258169A (ja) * | 2009-04-23 | 2010-11-11 | Sumco Techxiv株式会社 | 成膜反応装置及び成膜基板製造方法 |
JP2011249448A (ja) * | 2010-05-25 | 2011-12-08 | Shin Etsu Handotai Co Ltd | エピタキシャル成長装置 |
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TW201812854A (zh) | 2018-04-01 |
KR102301873B1 (ko) | 2021-09-14 |
CN109661716A (zh) | 2019-04-19 |
WO2018042877A1 (ja) | 2018-03-08 |
US20190206685A1 (en) | 2019-07-04 |
US10665460B2 (en) | 2020-05-26 |
JP6628065B2 (ja) | 2020-01-08 |
CN109661716B (zh) | 2023-03-28 |
TWI732910B (zh) | 2021-07-11 |
JPWO2018042877A1 (ja) | 2019-04-04 |
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