KR20180123804A - Ultra wideband planar antenna - Google Patents

Abstract

The present invention relates to an ultra-wideband planar antenna. The UWB plane antenna according to the present invention includes a first substrate on which a microstrip patch is disposed, a first adhesive layer disposed on a lower portion of the first substrate, a first adhesive layer, and a feed patch A second adhesive layer disposed on the lower surface of the second substrate and having a grounding auxiliary patch disposed on the upper surface thereof, a second adhesive layer positioned on the lower surface of the second adhesive layer, and a ground plane and a coplanar waveguide line, And a first via hole connecting the feed patch and the coplanar waveguide line through the first substrate, the second substrate, the third substrate, the first substrate, the third substrate, and the third substrate in the Z- And a second via hole connecting the patch and the ground, wherein a part of the front surface of the microstrip patch is formed to be stepped concave in the backward direction.

Description

[0001] ULTRA WIDEBAND PLANAR ANTENNA [0002]

The present invention relates to an ultra-wideband planar antenna.

Radar technology, which has been developed as a military technology until now, has been receiving attention due to the rapid growth of the global security market and the recent development of technology that fuses with wireless security communication technology.

However, the antenna, which is a core component of an ultra-wideband radar, is bulky and has a disadvantage in that it is difficult to integrate and miniaturize it due to a manufacturing process technique which is performed manually.

As a result, the use of portable devices has become commonplace, communication technologies have become common, and battery and power cord problems, which are obstacles to miniaturization of circuits, have been solved. Researches have been made to realize power supply and battery charging wirelessly, and ubiquitous Research on the technology for power supply of the sensor is actively carried out.

In addition, wireless power transmission technology is attracting much attention as one of the ten promising technologies of the future society.

Rectenna, which is used for wireless power transmission, is a compound of a rectifier and an antenna. It is composed of an antenna that receives an RF signal, a rectifier diode, and a load resistor. Means a device that converts DC power through a rectifier circuit.

These rectenas are applied to UWB radar modules and are typically sinuous, vivaldi, anti-Vivaldi and patch antennas. Nowadays, patch antennas which can be easily designed and manufactured and can be miniaturized are mainly used.

In the case of the conventional patch antenna, since the patch of the antenna radiator is implemented as a disk type (i.e., elliptical), there is a problem that it is difficult to secure a bandwidth and it is difficult to achieve ultra wideband.

In addition, in the case of the conventional patch antenna, there is a problem that it is difficult to downsize the antenna because the antenna characteristics are lowered by side lobes generated from the antenna as the antenna size is smaller.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a microstrip patch which has a stepwise recessed part in the front surface of the microstrip patch, An object of the present invention is to provide an ultra-wideband planar antenna capable of improving antenna gain characteristics.

According to an aspect of the present invention, there is provided an ultra-wideband planar antenna comprising: a first substrate having a microstrip patch disposed on a top surface thereof; a first adhesive layer disposed under the first substrate; A second adhesive layer positioned on the lower surface of the second adhesive layer and having a feed patch disposed on the upper surface thereof, a second adhesive layer positioned on the lower surface of the second substrate and having a grounding auxiliary patch disposed on the upper surface thereof, A third substrate on which a ground plane and a coplanar waveguide line are disposed, a first via hole connecting the feed patch and the coplanar waveguide line through the first substrate to the third substrate in the Z axis direction, And a second via hole penetrating the substrate in the Z-axis direction to connect the grounding auxiliary patch and the ground, wherein a part of the front surface of the microstrip patch is formed in a stepped shape concave in the back direction.

The front face of the microstrip patch includes first to sixth vertical portions extending in the Y-axis direction orthogonal to the Z-axis direction, first to sixth vertical portions extending in the X-axis direction orthogonal to the Z- and Y- And a fifth horizontal portion.

The first vertical part and the second vertical part are formed to face each other, have the same length in the Y-axis direction and are spaced apart from each other by a first distance, the third vertical part and the fourth vertical part face each other, And the fifth vertical portion and the sixth vertical portion are formed to face each other and have the same length in the Y-axis direction and are spaced apart from each other by a third distance, and the first horizontal portion includes a first vertical portion and a second vertical portion, The third horizontal part connects the second vertical part to the fourth vertical part, and the fourth horizontal part connects the fourth vertical part and the sixth vertical part, And the fifth horizontal portion connects the fifth vertical portion and the sixth vertical portion.

Wherein the first interval is larger than the second interval, the second interval is larger than the third interval, the Y-axis length of the first and second vertical portions is shorter than the Y-axis length of the third and fourth vertical portions, The length of the fourth vertical portion in the Y-axis direction is the same as the length of the fifth and sixth vertical portions in the Y-axis direction.

Wherein the first and third horizontal portions have the same length in the X axis direction, the second and fourth horizontal portions have the same length in the X axis direction, the fifth horizontal portion has a longer length in the X axis direction than the second horizontal portion, The length of the portion in the X-axis direction is longer than that of the first horizontal portion.

In the feed patch, the rear portion overlaps with the first via hole in the Z-axis direction, and the front portion overlaps with the microstrip patch in the Z-axis direction.

The rear face portion of the feed patch overlaps with a part of the first via hole.

The front portion of the feed patch is semi-elliptical or semicircular, and the rear portion of the feed patch is rectangular.

The grounding auxiliary patch overlaps with the second via hole in the Z-axis direction.

The grounding auxiliary patch is spaced apart from the feed patch in the Y-axis direction orthogonal to the Z-axis direction, and the first via hole is spaced apart from the second via hole in the Y-axis direction.

The coplanar waveguide line includes a first portion and a second portion, the first portion is disposed to surround the first via hole, and the second portion is disposed between the second via holes.

The micro-strip patch is spaced apart from the first via hole in the Y-axis direction orthogonal to the Z-axis direction. The first via hole is spaced apart from the second via hole in the Y-axis direction, Is smaller than the spacing distance between the microstrip patch and the second via hole in the Y-axis direction.

The rest except for a part of the micro strip patch is elliptical.

The grounding auxiliary patch is a rectangular patch, and the length in the X-axis direction orthogonal to the Z-axis direction of the grounding auxiliary patch is shorter than the length in the X-axis direction of the microstrip patch.

The feed patch radiates a frequency signal applied in the coplanar waveguide line through the first via hole and couples to the microstrip patch.

The grounding auxiliary patch transfers the electromagnetic wave radiated from the microstrip patch to the ground via the second via hole.

The UWB planar antenna according to the present invention is capable of achieving ultra-wideband through improved bandwidth securing capability, facilitating antenna matching, and improving antenna gain characteristics.

1 is a schematic diagram of an ultra-wideband planar antenna according to an embodiment of the present invention.
FIG. 2 is a view for explaining the first substrate and the micro strip patch of FIG. 1;
Fig. 3 is a view for explaining the first adhesive layer of Fig. 1. Fig.
Fig. 4 is a view for explaining the second substrate and the feed patch of Fig. 1;
Fig. 5 is a view for explaining the second adhesive layer and the grounding auxiliary patch of Fig. 1. Fig.
6 is a diagram illustrating the ground and coplanar waveguide lines of FIG. 1;
FIG. 7 is a view for explaining a first via hole passing through the first substrate to the third substrate in FIG. 1 in the Z-axis direction; FIG.
FIG. 8 is a view for explaining a second via hole passing through the first substrate to the third substrate in FIG. 1 in the Z-axis direction. FIG.
9 is a view for explaining the positional relationship between the first and second via holes and the feed patch and the ground auxiliary patch.
10 is a view for explaining the positional relationship between the first and second via holes and the coplanar waveguide line.
11 is a graph illustrating the wide band characteristics of the UWB plane antenna shown in FIG.
12 is a graph showing a radiation pattern in the XZ plane of the UWB plane antenna shown in FIG.
13 is a graph showing a radiation pattern in the YZ plane of the UWB plane antenna shown in FIG.

Certain terms are hereby defined for convenience in order to facilitate a better understanding of the present invention. Unless otherwise defined herein, scientific and technical terms used in the present invention shall have the meanings commonly understood by one of ordinary skill in the art. Also, unless the context clearly indicates otherwise, the singular form of the term also includes plural forms thereof, and plural forms of the term should be understood as including its singular form.

Hereinafter, an ultra-wideband planar antenna according to an embodiment of the present invention will be described with reference to FIGS. 1 to 10. FIG.

1 is a schematic diagram of an ultra-wideband planar antenna according to an embodiment of the present invention. FIG. 2 is a view for explaining the first substrate and the micro strip patch of FIG. 1; Fig. 3 is a view for explaining the first adhesive layer of Fig. 1. Fig. Fig. 4 is a view for explaining the second substrate and the feed patch of Fig. 1; Fig. 5 is a view for explaining the second adhesive layer and the grounding auxiliary patch of Fig. 1. Fig. 6 is a diagram illustrating the ground and coplanar waveguide lines of FIG. 1; FIG. 7 is a view for explaining a first via hole passing through the first substrate to the third substrate in FIG. 1 in the Z-axis direction; FIG. FIG. 8 is a view for explaining a second via hole passing through the first substrate to the third substrate in FIG. 1 in the Z-axis direction. FIG. 9 is a view for explaining the positional relationship between the first and second via holes and the feed patch and the ground auxiliary patch. 10 is a view for explaining the positional relationship between the first and second via holes and the coplanar waveguide line.

1, an UWB planar antenna 1 according to an embodiment of the present invention includes a first substrate 100, a first adhesive layer 150, a second substrate 200, a second adhesive layer 250 A third substrate 300, a first via hole 600 (600a, 600b in FIG. 2), and a second via hole 610 (610a to 610d in FIG. 2).

The microstrip patches 101 may be disposed on the upper surface of the first substrate 100.

Specifically, the microstrip patch 101 may be disposed on the upper surface of the first substrate 100, and the first adhesive layer 150 may be disposed on the lower surface. In addition, a first via hole (600 of FIG. 2) and a second via hole (610 of FIG. 2) passing through the first substrate 100 may be formed on the first substrate 100.

Also, the first substrate 100 may be a printed circuit board formed of a dielectric material such as Teflon.

For reference, the first substrate 100 may have the same thickness, dielectric constant, and dielectric loss as the second substrate 200 and the third substrate 300.

However, the thickness, the dielectric constant, and the dielectric loss value of the first substrate 100 can be variously designed as needed. Accordingly, the bandwidth and the antenna gain factor (i.e., the antenna gain) of the UWB antenna 1 may be adjusted by adjusting the dielectric constant, the dielectric loss value, and the thickness of the first substrate 100.

Here, the microstrip patch 101 may be formed on the upper surface of the first substrate 100 by a printed circuit method or by attaching a conductive material such as a copper foil to a proper shape.

The microstrip patch 101 may radiate an electromagnetic wave to the outside or receive a radio signal from the outside. In addition, since the microstrip patch 101 is not connected to the feed patch 201, the microstrip patch 101 can be indirectly supplied with the frequency signal from the feed patch 201. That is, the microstrip patch 101 can receive and supply a frequency signal radiated from the feed patch 201.

Referring to FIG. 2, the microstrip patch 101 is formed in a stepped shape in a part of its front surface in a recessed manner, and the remaining part of the microstrip patch 101 is formed in an elliptical shape.

Of course, the microstrip patch 101 is not limited to the above-described shape, but in the present invention, for convenience of explanation, the microstrip patch 101 is formed in the shape described above as an example.

Specifically, the front surface of the microstrip patch 101 has first to sixth vertical portions VP1 to VP6 formed to extend in the Y-axis direction Y orthogonal to the Z-axis direction Z, And first to fifth horizontal portions HP1 to HP5 which are formed to extend in the X-axis direction X orthogonal to the Y-axis direction Y and the Z-axis direction Y, respectively.

Here, the first vertical part VP1 and the second vertical part VP2 are formed to face each other and have a length in the Y-axis direction Y and are spaced apart by a first interval I1 (for example, 20 mm) .

The third vertical part VP3 and the fourth vertical part VP4 are formed to face each other and are spaced apart by a second interval I2 (for example, 19 mm) have.

The fifth vertical part VP5 and the sixth vertical part VP6 are formed to face each other and are spaced apart by a third interval I3 (for example, 16 mm) have.

The first interval I1 is larger than the second interval I2 and the second interval I2 is larger than the third interval I3 and the Y axis of the first and second vertical portions VP1 and VP2 The direction Y length (for example, 0.36 mm) is shorter than the Y-axis direction Y length (for example, 0.5 mm) of the third and fourth vertical portions VP3 and VP4, The Y-axis direction Y length of the vertical portions VP3 and VP4 may be equal to the Y-axis direction Y length (for example, 0.5 mm) of the fifth and sixth vertical portions VP5 and VP6.

The first horizontal part HP1 connects the first vertical part VP1 and the third vertical part VP3 and the second horizontal part HP2 connects the third vertical part VP3 and the fifth vertical part VP5 The third horizontal portion HP3 connects the second vertical portion VP2 and the fourth vertical portion VP4 and the fourth horizontal portion HP4 connects the fourth vertical portion VP4 and the sixth vertical portion VP4, And the fifth horizontal portion HP5 connects the fifth vertical portion VP5 and the sixth vertical portion VP6.

The first and third horizontal portions HP1 and HP3 have the same length in the X axis direction X and the second and fourth horizontal portions HP2 and HP4 have the same length in the X axis direction X , The fifth horizontal part HP5 is longer in the X axis direction X than the second horizontal part HP2 and the second horizontal part HP2 is longer than the first horizontal part HP1 in the X axis direction X Can be long.

Due to the shape of the microstrip patch 101, the bandwidth securing performance of the conventional antenna can be improved, ultra wideband can be achieved, antenna matching can be facilitated, and antenna gain characteristics can be improved.

The micro strip patch 101 may be spaced apart from the first via hole 600 in the Y-axis direction Y perpendicular to the Z-axis direction Z.

The spacing between the microstrip patch 101 and the first via hole 600 in the Y-axis direction Y is set in the Y-axis direction Y between the microstrip patch 101 and the second via hole 610, Lt; / RTI >

The length of the microstrip patch 101 in the X-axis direction X may be longer than the length of the grounding auxiliary patch 301 (FIG. 5) in the X-axis direction X, but is not limited thereto.

Referring again to FIG. 1, the first adhesive layer 150 may be positioned below the first substrate 100.

Specifically, a feed patch 201 is disposed under the first adhesive layer 150, and the first adhesive layer 150 may have the same thickness, dielectric constant, and dielectric loss as the second adhesive layer 250. [

However, the thickness, the dielectric constant, and the dielectric loss value of the first adhesive layer 150 may be variously designed as needed. Accordingly, the bandwidth and the antenna gain factor of the UWB antenna 1 may be adjusted by adjusting the dielectric constant, the dielectric loss value, and the thickness of the first adhesive layer 150.

The Z-axis direction Z thickness of the first adhesive layer 150 may be smaller than the Z-axis direction Z thickness of the first substrate 100 and the dielectric constant and dielectric loss value of the first adhesive layer 150 may be May be different from the dielectric constant and dielectric loss value of the first substrate 100.

A metal layer (not shown) formed between the first adhesive layer 150 and the first substrate 100 is removed by a back-drill method so that a gap between the microstrip patch 101 and the ground 401 (That is, thickness) of the antenna, thereby improving the antenna characteristic (for example, the impedance characteristic).

Referring to FIG. 3, it can be seen that a first via hole 600 and a second via hole 610 are formed in the first adhesive layer 150.

Referring again to FIG. 1, the second substrate 200 is positioned below the first adhesive layer 150, and the feed patch 201 may be disposed on the upper surface.

Specifically, a feed patch 201 may be disposed on the upper surface of the second substrate 200, and a second adhesive layer 250 may be disposed on the lower surface of the second substrate 200. That is, the feed patch 201 may be disposed between the first adhesive layer 150 and the second substrate 200.

A first via hole (600 of FIG. 4) and a second via hole (610 of FIG. 4) passing through the second substrate 200 may be formed on the second substrate 200.

The second substrate 200 may be a printed circuit board formed of a dielectric material such as Teflon.

For reference, the second substrate 200 may have the same thickness, dielectric constant, and dielectric loss as the first substrate 100 and the third substrate 300.

However, the thickness, the dielectric constant, and the dielectric loss value of the second substrate 200 can be variously designed as needed. Accordingly, the bandwidth and the antenna gain factor of the UWB antenna 1 may be adjusted by adjusting the dielectric constant, the dielectric loss value, and the thickness of the second substrate 200.

Here, the feed patch 201 may be formed on the upper surface of the second substrate 200 by a printed circuit method, or may be attached by making a conductive material such as a copper foil into a proper shape.

6) via the first via hole 600, and the coplanar waveguide line (Fig. 6 (b)) is connected to the coplanar waveguide line The frequency signal can be received from the base station 500 of FIG.

This feed patch 201 can radiate the frequency signal provided from the coplanar waveguide line (500 in FIG. 6) and supply it to the microstrip patch 101.

That is, the feed patch 201 and the microstrip patch 101 are not directly connected by the feed line, and the frequency signal applied to the feed patch 201 through the first via hole 600 is radiated upward And can be coupled to the microstrip patch 101.

Thus, the microstrip patch 101 receives the frequency signal radiated from the feed patch 201 without receiving the frequency signal directly through the feed line, and receives the frequency signal from the feed patch 201 so that the frequency band of the frequency band radiated from the microstrip patch 101 The range can be improved.

Also, it is possible to improve the polarization separation of the vertical polarization and the horizontal polarization through the indirect feed method through the feed patch 201, and it is possible to suppress the occurrence of side lobes of the ultra-wideband plane antenna 1.

1 and 4, in the case of the feed patch 201, the rear portion 201b may overlap with the first via hole 600 in the Z-axis direction Z. Referring to FIG. Although not shown in the drawings, the front surface portion 201a of the feed patch 201 may overlap the micro strip patch 101 in the Z-axis direction Z. [

More specifically, in the case of the feed patch 201, the rear portion 201b overlaps with a portion of the first via hole 600, and a portion of the rear portion 201b and the front portion 201a overlap with the micro strip patch 101, .

The front portion 201a of the feed patch 201 is, for example, semi-elliptical or semicircular, and the rear portion of the feed patch 201 may be, for example, rectangular but is not limited thereto.

With this structure, the feed patch 201 can effectively radiate the frequency signal provided from the coplanar waveguide line (500 in FIG. 6).

Referring again to FIG. 1, the second adhesive layer 250 is positioned below the second substrate 200, and the grounding auxiliary patch 301 may be disposed on the upper surface. That is, the grounding auxiliary patch 301 may be disposed between the second substrate 200 and the second adhesive layer 250.

Specifically, the second adhesive layer 250 may have the same thickness, dielectric constant, and dielectric loss as the first adhesive layer 150. [

However, the thickness, the dielectric constant, and the dielectric loss value of the second adhesive layer 250 can be variously designed as needed. Accordingly, the bandwidth and the antenna gain factor of the UWB antenna 1 may be adjusted by adjusting the dielectric constant, the dielectric loss value, and the thickness of the second adhesive layer 250.

The metal layer (not shown) formed between the second adhesive layer 250 and the third substrate 300 is removed by a back-drill method so that the microstrip patch 101 and the ground 401 are removed, (I.e., the thickness) between the antenna elements can be reduced, thereby improving the antenna characteristics (for example, the impedance characteristics).

Here, the grounding auxiliary patch 301 may be formed on the upper surface of the second adhesive layer 250 by a printed circuit method, or may be attached by making a conductive material such as a copper foil into a proper shape.

The feeder line (not shown) electrically coupled to the grounding auxiliary patch 301 is connected to the ground 401 through the second via hole 610. The electromagnetic wave transmitted from the microstrip patch 101 through the feeder line To the ground 401 via the second via hole 610.

The electromagnetic waves radiated from the microstrip patch 101 can be converged through the grounding auxiliary patch 301 and transmitted to the ground 401 so that the shape of the electric field becomes zero at the grounding point 401 .

The length of the grounding auxiliary patch 301 in the X-axis direction X may be shorter than the length of the microstrip patch 101 in the X-axis direction X, but is not limited thereto.

1 and 5, the grounding auxiliary patch 301 may be, for example, a rectangular patch, but is not limited thereto.

However, for convenience of explanation, in the present invention, it is assumed that the grounding auxiliary patch 301 is a rectangular patch.

Also, the grounding auxiliary patch 301 may not overlap with the first via hole 600 in the Z-axis direction (Z).

It can be seen that the first and second via holes 600 and 610 are formed in the second adhesive layer 250.

Referring again to FIG. 1, the third substrate 300 is located under the second adhesive layer 250, and the ground 401 and the coplanar waveguide line (500 in FIG. 6) may be disposed on the lower surface.

For reference, the third substrate 300 may have the same cross section as the first adhesive layer 150 shown in FIG.

Accordingly, a first via hole (600 in FIG. 3) and a second via hole (610 in FIG. 3) passing through the third substrate 300 may be formed on the third substrate 300.

The third substrate 300 may be a printed circuit board formed of a dielectric material such as Teflon.

For reference, the third substrate 300 may have the same thickness, dielectric constant, and dielectric loss as the first substrate 100 and the second substrate 200.

However, the thickness, the dielectric constant, and the dielectric loss value of the third substrate 300 may be variously designed as needed. Accordingly, the bandwidth and the antenna gain factor of the UWB antenna 1 may be adjusted by adjusting the dielectric constant, the dielectric loss value, and the thickness of the third substrate 300.

Here, referring to FIG. 6, it can be seen that the ground 401 and the coplanar waveguide line 500 are formed.

Specifically, the coplanar waveguide line 500 may include a first portion 500a and a second portion 500b.

The first portion 500a may be disposed on the upper portion in the Y-axis direction Y and the second portion 500b may be formed to extend in the Y-axis direction Y from the second portion 500b.

The coplanar waveguide line 500 can apply a frequency signal to the above-described feed patch through a feed line (not shown). Further, the capacitive coupling between the coplanar waveguide line 500 and the ground 401 makes it possible to improve the antenna gain (i.e., antenna gain), match, and adjust the resonance frequency, thereby adjusting the electrical characteristics of the UWB antenna 1 .

For reference, the shape of the coplanar waveguide line 500 is not limited to the shape shown in FIG. 6, but can be changed into various structures such as a curved surface or a polygonal shape.

Next, referring to FIGS. 7 to 10, the positions of the first via hole 600 and the second via hole 610 are shown.

7, a first portion 500a of coplanar waveguide line 500 is shown, and a second portion 500b of coplanar waveguide line 500 is shown in FIG.

The first via hole 600 and the second via hole 610 are formed on the first substrate 100, the first adhesive layer 150, the second substrate 200, the second adhesive layer 250, the third substrate 300 As shown in Fig.

The first portion 500a of the coplanar waveguide line 500 is connected to the first via hole 600 through the first via hole 600. The first via hole 600 is spaced apart from the second via hole 610 in the Y- As shown in FIG. Further, a part of the first via hole 600 may overlap with the rear portion 201b of the feed patch 201. [

The second portion 500b of the coplanar waveguide line 500 is disposed between the first via hole 600 and the second via hole 610. The second via hole 610 is spaced apart from the first via hole 600 in the Y- As shown in FIG. The second via hole 610 may overlap with the grounding auxiliary patch 301 in the Z-axis direction Z. [

For reference, the grounding auxiliary patch 301 may be spaced apart from the feed patch 201 in the Y-axis direction (Y).

Hereinafter, characteristics of the UWB plane antenna shown in FIG. 1 will be described with reference to FIGS. 11 to 13. FIG.

11 is a graph illustrating the wide band characteristics of the UWB plane antenna shown in FIG. 12 is a graph showing a radiation pattern in the X-Z plane of the UWB plane antenna shown in FIG. 13 is a graph showing a radiation pattern in the Y-Z plane of the UWB plane antenna shown in FIG.

1 and 11, the UWB antenna 1 can have a frequency band of about 2.38 GHz within a range of about 6.38 GHz to about 8.76 GHz. As described above, the UWB antenna 1 (In particular, the shape of the microstrip patch 101), it is possible to confirm that the ultra-wideband characteristic is ensured.

Also, the ultra-wideband planar antenna 1 can have improved antenna gain characteristics compared to the conventional disk antenna through the above-described structure.

For example, in the case of the conventional disk type antenna, if the antenna gain values were 6.34 dBi, 6.05 dBi, 5.77 dBi, and 5.53 dBi at 7 GHz, 7.25 GHz, 7.5 GHz, and 8 GHz based on the XZ- In the case of the flat antenna 1, the antenna gain values can be improved to 6.89 dBi, 6.84 dBi, 6.69 dBi, and 6.35 dBi at 7 GHz, 7.25 GHz, 7.5 GHz, and 8 GHz based on the XZ axis plane.

In addition, in the case of the conventional disk type antenna, if the antenna gain values were 6.36 dBi, 6.08 dBi, 5.81 dBi, and 5.58 dBi at 7 GHz, 7.25 GHz, 7.5 GHz, and 8 GHz based on the YZ axis plane, In the case of the flat antenna 1, the antenna gain values can be improved to 6.94 dBi, 6.91 dBi, 6.79 dBi, and 6.49 dBi at 7 GHz, 7.25 GHz, 7.5 GHz, and 8 GHz based on the YZ axis plane.

It should be noted that the above-mentioned numerical values are exemplary values. In the case of the ultra-wideband plane antenna 1 of the present invention, although not limited to the above numerical values, It can be seen that the antenna gain value is improved as compared with the disk type antenna.

In addition, the ultra-wideband flat antenna 1 can facilitate antenna matching over the conventional disk-shaped antenna through the above-described structure.

Next, referring to FIGS. 12 and 13, it is confirmed that the side lobe characteristic (about -16 dB) as well as the signal intensity radiated in both the XZ plane and the YZ plane of the ultra-wideband planar antenna 1 are significantly improved .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, many modifications and changes may be made by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

1: an ultra-wideband plane antenna 100: a first substrate
101: Microstrip patch 150: First adhesive layer
200: second substrate 201: feed patch
250: second adhesive layer 300: third substrate
301: Grounding auxiliary patch 401: Grounding

Claims (16)

A first substrate on which a microstrip patch is disposed;
A first adhesive layer located under the first substrate;
A second substrate positioned below the first adhesive layer and having a feed patch disposed on an upper surface thereof;
A second adhesive layer positioned below the second substrate and having a grounding auxiliary patch disposed on an upper surface thereof;
A third substrate located below the second adhesive layer and having a ground and a coplanar waveguide line disposed on a lower surface thereof;
A first via hole passing through the first to third substrates in the Z-axis direction and connecting the feed patch and the coplanar waveguide line; And
And a second via hole penetrating the first to third substrates in the Z-axis direction and connecting the grounding auxiliary patch and the ground,
Some of the front surfaces of the microstrip patches are recessed in a backward direction
Ultra - wideband planar antenna.
The method according to claim 1,
Wherein the front surface of the microstrip patch comprises:
First to sixth vertical portions extending in the Y-axis direction orthogonal to the Z-axis direction,
And first to fifth horizontal portions formed to extend in the X-axis direction orthogonal to the Z-axis and Y-axis directions
Ultra - wideband planar antenna.
3. The method of claim 2,
Wherein the first vertical portion and the second vertical portion are formed to face each other and have the same length in the Y axis direction and are spaced apart from each other by a first interval,
Wherein the third vertical portion and the fourth vertical portion are formed to face each other and have the same length in the Y axis direction and are spaced apart from each other by a second gap,
Wherein the fifth vertical portion and the sixth vertical portion are formed to face each other and have the same length in the Y-axis direction and are spaced apart by a third interval,
The first horizontal portion connects the first vertical portion and the third vertical portion,
The second horizontal portion connects the third vertical portion and the fifth vertical portion,
The third horizontal portion connects the second vertical portion and the fourth vertical portion,
The fourth horizontal portion connects the fourth vertical portion and the sixth vertical portion,
And the fifth horizontal portion connects the fifth vertical portion and the sixth vertical portion
Ultra - wideband planar antenna.
The method of claim 3,
Wherein the first spacing is greater than the second spacing,
The second spacing being greater than the third spacing,
The Y-axis direction length of the first and second vertical portions is shorter than the Y-axis direction length of the third and fourth vertical portions,
The lengths of the third and fourth vertical portions in the Y-axis direction are the same as the lengths of the fifth and sixth vertical portions in the Y-axis direction
Ultra - wideband planar antenna.
The method of claim 3,
Wherein the first and third horizontal portions have the same length in the X-axis direction,
Wherein the second and fourth horizontal portions have the same length in the X-axis direction,
Wherein the fifth horizontal portion has a longer length in the X-axis direction than the second horizontal portion,
Wherein the second horizontal portion is longer than the first horizontal portion in the X-axis direction
Ultra - wideband planar antenna.
The method according to claim 1,
The feed patch,
The rear portion overlaps with the first via hole in the Z-axis direction,
The front part overlaps with the microstrip patch in the Z-axis direction
Ultra - wideband planar antenna.
The method according to claim 6,
The rear face portion of the feed patch overlaps with a part of the first via hole
Ultra - wideband planar antenna.
The method according to claim 6,
The front portion of the feed patch is semi-elliptical or semicircular,
The rear portion of the feed patch is rectangular
Ultra - wideband planar antenna.
The method according to claim 6,
Wherein the grounding auxiliary patch overlaps with the second via hole in the Z-axis direction
Ultra - wideband planar antenna.
10. The method of claim 9,
Wherein the grounding auxiliary patch is spaced apart from the feed patch in the Y-axis direction orthogonal to the Z-axis direction,
The first via hole is spaced apart from the second via hole in the Y-axis direction
Ultra - wideband planar antenna.
The method according to claim 1,
The coplanar waveguide line including a first portion and a second portion,
The first portion is disposed to surround the first via hole,
And the second portion is disposed between the second via holes
Ultra - wideband planar antenna.
The method according to claim 1,
Wherein the microstrip patch is spaced apart from the first via hole in the Y axis direction orthogonal to the Z axis direction,
The first via hole is spaced apart from the second via hole in the Y-axis direction,
Wherein a distance between the micro strip patch and the first via hole in the Y axis direction is smaller than a distance between the micro strip patch and the second via hole in the Y axis direction
Ultra - wideband planar antenna.
The method according to claim 1,
The remaining portion of the microstrip patch, except for the portion,
Ultra - wideband planar antenna.
The method according to claim 1,
The grounding auxiliary patch is a rectangular patch,
The length of the grounding auxiliary patch in the X-axis direction orthogonal to the Z-axis direction is shorter than the length of the microstrip patch in the X-axis direction
Ultra - wideband planar antenna.
The method according to claim 1,
The feed patch radiates a frequency signal applied in the coplanar waveguide line through the first via hole and couples and supplies the frequency signal to the microstrip patch
Ultra - wideband planar antenna.
The method according to claim 1,
Wherein the grounding auxiliary patch transmits electromagnetic waves radiated from the microstrip patch to the ground via the second via hole
Ultra - wideband planar antenna.

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