KR20180015003A - Electronic device with display - Google Patents

Abstract

An electronic device according to various embodiments of the present invention includes: a housing; A cover member coupled with the housing; And a flexible substrate coupled to the cover member. An impact absorbing space is formed between the housing and the flexible substrate. When an external force is applied, a part of the flexible substrate is rotated in the impact absorbing space, Can be absorbed. Various embodiments may be possible.

Description

[0001] ELECTRONIC DEVICE WITH DISPLAY [0002]

Various embodiments of the invention relate to an electronic device, for example, an electronic device including a display.

The electronic device refers to a device that performs a specific function according to a loaded program such as an electronic notebook, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, It can mean. For example, such electronic devices may output stored information as sound or video. As the degree of integration of electronic devices increases, ultra-high-speed and large-capacity wireless communications become popular, and in recent years, various functions can be mounted on one electronic device such as a mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device It is.

The electronic device may include a display that simultaneously performs the output of the input means and the screen.

The peripheral region of the display of the electronic device may malfunction or stop operating due to an external impact.

Various embodiments of the present invention can provide an electronic device including a display that can prevent a malfunction or breakage due to an impact applied to a peripheral region of a display.

An electronic device according to various embodiments of the present invention includes: a housing; A cover member coupled with the housing; And a flexible substrate coupled to the cover member. An impact absorbing space is formed between the housing and the flexible substrate. When an external force is applied, a part of the flexible substrate is rotated in the impact absorbing space, Can be absorbed.

An electronic device according to various embodiments of the present invention includes: a housing; A cover member coupled to the housing and having at least a curved surface; A flexible substrate disposed between the housing and the cover member; A circuit board disposed on the flexible substrate; And an adhesive layer disposed between the flexible substrate and the housing, wherein the electronic device includes a first region including the circuit board and a second region that is not overlapped with the first region, May be located in the second region.

An electronic device according to various embodiments of the present invention is a housing including a first plate and a second plate facing in a direction opposite to the first plate, wherein the first plate is flat or has an edge region a housing including a peripheral region; A touch screen display disposed between the edge region and the second plate and including a plurality of layers, the touch screen display exposed through the first plate; A display driver IC (DDI) for generating a signal for driving the display; A circuit included in one of the plurality of layers and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display; An intermediate plate disposed between the touch screen display and the second plate; And an adhesive layer interposed between the display and the intermediate plate, the adhesive layer including a first surface contacting the touch screen display and a second surface contacting the intermediate plate, And may not overlap with the first area when viewed from the edge area.

An electronic device according to various embodiments of the present invention is a housing including a first plate and a second plate facing in a direction opposite to the first plate, wherein the first plate is flat or has an edge region a housing including a peripheral region; A touch screen display disposed between the edge region and the second plate, the touch screen display including a first layer and exposed through the first plate; A display driver IC (DDI) for generating a signal for driving the display; A circuit included in the first layer and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display; An intermediate plate disposed between the touch screen display and the second plate; And a plurality of layers disposed between the first layer and the intermediate plate, wherein at least one edge of the plurality of layers may not overlap the first area when viewed from the edge area.

In the electronic device according to various embodiments of the present invention, as the shock absorbing space is formed between the curved surfaces of the housing and the flexible substrate, a part of the flexible substrate is rotated in the impact absorbing space by an impact applied from the outside, It is possible to prevent breakage.

In the electronic device according to various embodiments of the present invention, the edge of the adhesive layer is located below the second area different from the first area, and a repulsive force concentrated on the edge of the adhesive layer by the impact applied from the outside is applied to the circuit board It can be prevented from being directly transmitted.

Referring now to Figure 1, there is shown an electronic device in a network environment, in various embodiments.
2 is a perspective view illustrating an electronic device according to one of various embodiments of the present invention.
3 is a cross-sectional view showing a part cut along the line A-A 'shown in Fig.
4 is a cross-sectional view illustrating a portion of a flexible substrate of an electronic device according to one of the various embodiments of the present invention being rotated.
5 is a cross-sectional view schematically illustrating the configuration of an electronic device according to one of various embodiments of the present invention.
6 is a cross-sectional view illustrating the direction of repulsive force generated by an external force applied to an electronic device according to one of various embodiments of the present invention.
Figure 7 is a cross-sectional view schematically illustrating the configuration of an electronic device according to another of the various embodiments of the present invention.
8 is a cross-sectional view schematically showing a configuration of an electronic device according to another one of various embodiments of the present invention.
9A is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.
FIG. 9B is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention. FIG.
10 is a flow chart illustrating a method of fabricating an electronic device according to various embodiments of the present invention.
Figure 11 is a plan view schematically illustrating the inside of an electronic device according to another of the various embodiments of the present invention.
12 is a plan view schematically showing the configuration of an electronic device according to various embodiments of the present invention.
13 is a plan view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.
14 is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.
Fig. 15 is an enlarged view of C shown in Fig.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. It is to be understood that the embodiments and terminologies used herein are not intended to limit the invention to the particular embodiments described, but to include various modifications, equivalents, and / or alternatives of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly dictates otherwise. In this document, the expressions "A or B" or "at least one of A and / or B" and the like may include all possible combinations of the items listed together. Expressions such as " first, "" second," " first, "or" second, " But is not limited to those components. When it is mentioned that some (e.g., first) component is "(functionally or communicatively) connected" or "connected" to another (second) component, May be connected directly to the component, or may be connected through another component (e.g., a third component).

In this document, the term " configured to (or configured) to "as used herein is intended to encompass all types of hardware, software, , "" Made to "," can do ", or" designed to ". In some situations, the expression "a device configured to" may mean that the device can "do " with other devices or components. For example, a processor configured (or configured) to perform the phrases "A, B, and C" may be implemented by executing one or more software programs stored in a memory device or a dedicated processor (e.g., an embedded processor) , And a general purpose processor (e.g., a CPU or an application processor) capable of performing the corresponding operations.

Electronic devices in accordance with various embodiments of the present document may be used in various applications such as, for example, smart phones, tablet PCs, mobile phones, videophones, electronic book readers, desktop PCs, laptop PCs, netbook computers, workstations, a portable multimedia player, an MP3 player, a medical device, a camera, or a wearable device. Wearable devices may be of the type of accessories (eg, watches, rings, bracelets, braces, necklaces, glasses, contact lenses or head-mounted-devices (HMD) (E.g., a skin-pads or tattoo), or a bio-implantable circuit. In some embodiments, the electronic device may be, for example, a television, a digital video disk (Such as Samsung HomeSync ^™ , Apple TV ^™ , or Google TV ^™ ), a refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air purifier, set top box, home automation control panel, A game console (e.g., Xbox ^TM , PlayStation ^TM ), an electronic dictionary, an electronic key, a camcorder, or an electronic frame.

In an alternative embodiment, the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) A navigation system, a global navigation satellite system (GNSS), an event data recorder (EDR), a flight data recorder (FDR), an automobile infotainment device, a marine electronic equipment (For example, marine navigation systems, gyro compasses, etc.), avionics, security devices, head units for vehicles, industrial or domestic robots, drones, ATMs at financial institutions, of at least one of the following types of devices: a light bulb, a fire detector, a fire alarm, a thermostat, a streetlight, a toaster, a fitness device, a hot water tank, a heater, a boiler, . According to some embodiments, the electronic device may be a piece of furniture, a building / structure or part of an automobile, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., Gas, or radio wave measuring instruments, etc.). In various embodiments, the electronic device is flexible or may be a combination of two or more of the various devices described above. The electronic device according to the embodiment of the present document is not limited to the above-described devices. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

Referring to Figure 1, in various embodiments, an electronic device 11 in a network environment 10 is described. The electronic device 11 may include a bus 11a, a processor 12, a memory 13, an input / output interface 15, a display 16, and a communication interface 17. In some embodiments, the electronic device 11 may omit at least one of the components or additionally comprise other components. The bus 11a may include circuitry for connecting the components 11-17 to each other and for communicating (e.g., control messages or data) between the components. The processor 12 may include one or more of a central processing unit, an application processor, or a communications processor (CP). The processor 12 may perform, for example, operations or data processing relating to the control and / or communication of at least one other component of the electronic device 11.

The memory 13 may include volatile and / or non-volatile memory. The memory 13 may store instructions or data related to at least one other component of the electronic device 11, for example. According to one embodiment, the memory 13 may store software and / or programs 14. The program 14 may include, for example, a kernel 14a, a middleware 14b, an application programming interface (API) 14c, and / or an application program . At least a portion of the kernel 14a, middleware 14b, or API 14c may be referred to as an operating system. The kernel 14a may be a system resource used to execute an operation or function implemented in other programs (e.g., middleware 14b, API 14c, or application program 14d) : The bus 11a, the processor 12, or the memory 13). The kernel 14a also provides an interface to control or manage system resources by accessing individual components of the electronic device 11 in the middleware 14b, API 14c, or application program 14d .

The middleware 14b can perform an intermediary role such that the API 14c or the application program 14d communicates with the kernel 14a to exchange data. In addition, the middleware 14b may process the one or more task requests received from the application program 14d according to the priority order. For example, the middleware 14b may use system resources (e.g., bus 11a, processor 12, or memory 13) of the electronic device 11 in at least one of the application programs 14d Prioritize, and process the one or more task requests. The API 14c is an interface for the application 14d to control the functions provided by the kernel 14a or the middleware 14b and may be an interface for controlling the functions provided by the application 14d at least for the file control, the window control, the image processing, An interface or a function (e.g., a command). The input / output interface 15 is used to transmit commands or data input from a user or other external device to the other component (s) of the electronic device 11, ) To the user or other external device.

The display 16 may be a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or a microelectromechanical system (MEMS) display, or an electronic paper display . Display 16 may display various content (e.g., text, images, video, icons, and / or symbols, etc.) to a user, for example. The display 16 may include a touch screen and may receive touch, gesture, proximity, or hovering input, for example, using an electronic pen or a portion of the user's body. The display 16 may include a flexible substrate 103 (FIG. 3) to be described later. Display 16 may include a display driver IC (DDI) that generates a signal to drive the display. According to various embodiments, the display driver IC (DDI) may be electrically coupled to the display 16.

The communication interface 17 establishes communication between the electronic device 11 and an external device (for example, the first external electronic device 20, the second external electronic device 21, or the server 23) . For example, the communication interface 17 may be connected to the network 16a via wireless communication or wired communication to communicate with an external device (e.g., the second external electronic device 21 or the server 23).

The wireless communication may include, for example, LTE, LTE-A (LTE Advance), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS), wireless broadband (WiBro) System for Mobile Communications), and the like. According to one embodiment, the wireless communication may be wireless communication, such as wireless fidelity (WiFi), Bluetooth, Bluetooth low power (BLE), Zigbee, NFC, Magnetic Secure Transmission, Frequency (RF), or body area network (BAN). According to one example, wireless communication may include GNSS. GNSS may be, for example, Global Positioning System (GPS), Global Navigation Satellite System (Glonass), Beidou Navigation Satellite System (Beidou) or Galileo, the European global satellite-based navigation system. Hereinafter, in this document, "GPS" can be used interchangeably with "GNSS ". The wired communication may include, for example, at least one of a universal serial bus (USB), a high definition multimedia interface (HDMI), a recommended standard 232 (RS-232), a power line communication or a plain old telephone service have. The network 16a may include at least one of a telecommunications network, e.g., a computer network (e.g., LAN or WAN), the Internet, or a telephone network.

Each of the first and second external electronic devices 20, 21 may be the same or a different kind of device as the electronic device 11. According to various embodiments, all or a portion of the operations performed in the electronic device 11 may be performed in another electronic device or multiple electronic devices (e.g., electronic device 20, 21, or server 23). According to the example, in the case where the electronic device 11 has to perform a certain function or service automatically or on request, the electronic device 11 may, instead of or in addition to executing the function or service itself, (E. G., Electronic device 20, 21, or server 23) may request some functionality from another device (e. G., Electronic device 20,21 or server 23) Function or an additional function and transmit the result to the electronic device 11. The electronic device 11 can directly or additionally process the received result to provide the requested function or service. For example, Computing, distributed computing, or client-server computing techniques can be used.

2 is a perspective view illustrating an electronic device according to one of various embodiments of the present invention.

Referring to FIG. 2, an electronic device 100 according to one of various embodiments of the present invention may include a housing 101 and a cover member 111.

The housing 101 can protect the inside of the electronic device 100 while forming an outer shape of the electronic device 100. The housing 101 may be made of a metal material. A portion of the housing 101, for example, the rim of the housing 101 may be made of a metal material, and another portion of the housing 101 may be made of a synthetic resin. The metal housing 101 or a part of the housing 101 may be used as a radiator of the antenna of the electronic device 100. A main circuit board (not shown) may be provided inside the housing 101. The main circuit board may include a control unit, a storage unit, or a communication circuit unit necessary for driving the electronic device 100. The housing 101 may be provided with various sensors such as a touch key, a salient part, and various input and output devices and a muscular strength sensor.

The cover member 111 may be disposed on the front surface of the housing 101. For example, both side ends 113 and 115 of the cover member 111 may be disposed on a part of the side surface of the housing 101 with a curved surface. The both side ends 113 and 115 of the cover member 111 are not limited to those having a curved surface but may be flat. The cover member 111 can display a screen that is output through the display panel while protecting the display panel installed inside the housing 101. The cover member 111 may be combined with a touch panel to implement a touch screen display together with the display panel.

According to various embodiments of the present invention, the housing 100 may include a first plate 111 and a second plate facing away from the first plate 111. The first plate 111 may include edge regions 113 and 115 bent toward the second plate (FIGS. 3 and 112). According to various embodiments, the first plate 111 is not limited to having a structure bent toward the second plate (FIGS. 3 and 112), and the first plate 111 may have a flat shape or a dome shape And the like.

3 is a cross-sectional view showing a part cut along the line A-A 'shown in Fig.

Referring to FIG. 3, an electronic device 100 according to one of various embodiments of the present invention may include a flexible substrate 103, a shielding member 139, and / or an adhesive layer 104.

According to various embodiments, the flexible substrate 103 may be coupled to at least one of the opposite ends 113 of the cover member. The flexible substrate 103 may include a touch panel 132, a display panel 135, and / or an impact absorbing member 139.

According to various embodiments, the touch panel 132 may be a transparent electrode film, for example, an indium-tin oxide (ITO) film. The touch panel 132 may be coupled to the cover member 113 by an adhesive layer 131. The adhesive layer 131 may be made of an OCA film (optically clear adhesive film). The touch panel 132 may be implemented as an add-on method, an on-cell method, or an in-cell method depending on the position.

According to various embodiments, the display panel 135 may include an organic light emitting diode (OLED) device. The display panel 135 may include a light emitting layer 135a located below the touch panel 132. [ The light emitting layer 135a may be a device for outputting a screen. The light emitting layer 135a may be arranged on the substrate 135c. The substrate 135c may be made of a polymer material, for example, polyimide (PI). However, the substrate 135c is not limited to being made of polyimide, but may be made of various flexible polymer materials.

 The display panel 135 may include a thin film encapsulation (TFE) film 134 disposed on the light emitting layer 135a. The display panel 135 may include a polarizing function film, for example, a polyvinyl alcohol (PVA) film (not shown). The display panel 135 may include a triacetylcellulose (TAC) film for protecting the polyvinyl alcohol film. According to various embodiments, the polarizing function film may be disposed on either the upper side or the lower side of the touch panel 132. According to various embodiments, when the touch panel 132 is an on-cell type, the polarizing function film may be disposed on the upper surface of the touch panel 132. [ The display panel 135 is not limited to the light emitting layer 135a including the organic light emitting diode, and may be a flexible display panel.

According to various embodiments, a circuit board 136 may be provided between the TFE film 134 and the substrate 135c. The circuit board 136 may electrically connect the main circuit board provided in the housing 101 and the light emitting layer 135a. The light emitting layer 135a may receive a control signal for realizing a voltage and a screen through the circuit board 136. [

According to various embodiments, a sealing member 134a for sealing between the TFE film 134 and the substrate 135c may be provided at the edge of the display panel 135. [ The sealing member 134a may be in the form of a film extending from the TFE film 134. The sealing member 134a may be made of a material having a waterproof and moisture-proof function such as silicone, polyurethane, resin, or the like. The sealing member 134a seals between the TFE film 134 and the substrate 135c to prevent the circuit board 136 from being damaged by foreign matter such as water from the outside.

According to various embodiments, an intermediate plate 117 may be disposed between the display panel 135 and the second plate 112. A part of the intermediate plate 117 may be exposed to the outside. The intermediate plate 117 can support the flexible substrate 103. According to various embodiments, the intermediate plate 117 may be coupled to the second plate 112 to correspond to a portion of the housing 101 (FIG. 2). According to one embodiment, the intermediate plate 117 and the second plate 112 can be made into one.

An impact absorbing member 138 may be disposed between the display panel 135 and the intermediate plate 117. The shock absorbing member 138 absorbs an impact applied from the outside, thereby protecting the display panel 135. According to various embodiments, the shock absorbing member 138 may be in the form of a sponge to form a sponge layer between the display panel 135 and the intermediate plate 117. The shock absorbing member 138 may be made of black so that external light transmitted through the display panel 135 can be absorbed.

According to various embodiments, the shielding member 139 may be attached to the shock absorbing member 138. The shielding member 139 is made of a copper sheet and can prevent the electromagnetic waves generated from the electronic parts of the housing 101, for example, the communication circuit, from being transmitted to the display panel 135. The shielding member 139 is not limited to a copper material and may be made of various materials capable of shielding electromagnetic waves.

According to various embodiments, the adhesive layer 104 may seal between the display panel 135 and the housing 101 to prevent water from flowing into the housing 101. The adhesive layer 104 may include a double-sided tape. According to various embodiments, the adhesive layer 104 can prevent foreign matter from entering from the outside as well as inflow of water.

According to various embodiments, a shock absorbing space 105 may be formed between the intermediate plate 117 and the flexible substrate 103. The shock absorbing space 105 may be an empty space formed in parallel with the adhesive layer 104. A portion of the flexible substrate 103 may be pivoted in the shock absorbing space 105.

According to various embodiments, the electronic device 100 may include a digitizer (not shown) or a pressure sensor (not shown) for pen input sensing. The digitizer may be provided between the shock absorbing member 138 and the shielding member 139, but is not limited thereto. According to various embodiments, the electronic device 100 includes a first layer (e.g., a light emitting layer 135a) and a plurality of layers 135c, 138 , 139). The plurality of layers 135c, 138 and 139 may be formed on the substrate 135c, the shock absorbing member 138, the shielding member 139, the digitizer (not shown) or the sensor layer )). The plurality of layers 135c, 138, and 139 may be adhered to each other using an adhesive layer (not shown).

4 is a cross-sectional view illustrating a portion of a flexible substrate of an electronic device according to one of the various embodiments of the present invention being rotated.

4, a portion of the flexible substrate 103 of the electronic device according to various embodiments of the present invention is formed such that when an external force (1) is applied to the outer surface of the cover member 113, Absorbing space 105 together with a portion thereof. A part of the flexible substrate 103 may be pivoted in one direction (e.g. clockwise (c)) to the shock absorbing space 105 by the external force (1) in a state of being supported by the adhesive layer 104 have. When the external force (1) is removed, a part of the flexible substrate (103) together with a part of the cover member (113) can be rotated in a direction opposite to the one direction (?).

According to various embodiments of the present invention, since the impact absorbing space 105 in which a part of the flexible substrate 103 is rotated, the impact energy due to the external force (1) Can be converted to kinetic energy. Accordingly, the flexible substrate 103 can be prevented from being damaged or damaged by the external force (1).

According to various embodiments of the present invention, an intermediate plate 117 may be provided between the flexible substrate 103 and the housing 101. The adhesive layer 104 may be inserted between the flexible substrate 103 and the intermediate plate 117.

5 is a cross-sectional view schematically illustrating the configuration of an electronic device according to one of various embodiments of the present invention.

5, a cover member 113 of an electronic device according to one of various embodiments of the present invention includes a cover member 113 formed on one side of a circuit board 136 and one side of a sealing member 134a, And may include region (A).

The edges of the adhesive layer 140 may not overlap the circuit board 136 or the sealing member 134a when viewed from the edge region of the flexible substrate 103. [ For example, the edge of the adhesive layer 104 may be located in the second region B different from the first region A. a distance may be larger than the width (d) of the first region (A). For example, the adhesive layer 140 may be located outside the first region A.

6 is a cross-sectional view illustrating the direction of repulsive force generated by an external force applied to an electronic device according to one of various embodiments of the present invention.

Referring to FIG. 6, the first region A is formed along the vertical direction of the curved surface of the circuit board 136 and the curved surface of the sealing member 137, so that the first region A may have a rhombic shape.

According to various embodiments, when the cover member 113 receives the external force (1), the housing 101 can generate the repulsive force (2) in the direction opposite to the external force (1). The repulsive force (2) may be transmitted to the flexible substrate 103 through the adhesive layer 104. The repulsive force (2) may be transmitted to the flexible substrate 103 through the edge of the adhesive layer 104.

According to various embodiments, the edge of the adhesive layer 104 is positioned in the second area B different from the first area A, and the edge of the adhesive layer 104 is positioned on the circuit board 136 ) And the repulsive force (2) to the sealing member 137 can be prevented from being directly transmitted. For example, it is possible to prevent the repulsive force (2) from being directly transmitted to the circuit board 136 and the sealing member 137, thereby preventing a malfunction or malfunction of a screen implemented by the light emitting layer 135a .

Figure 7 is a cross-sectional view schematically illustrating the configuration of an electronic device according to another of the various embodiments of the present invention.

7, when viewed from the edge region of the flexible substrate 103, the edge of the shielding member 139a may not overlap the circuit board 136 or the sealing member 134a. For example, the edge of the shielding member 139a may be located outside the first area A. The distance c may be greater than the width d of the first region A.

6) is applied to the cover member 113, a repulsive force acts on the edge of the adhesive layer 104 in a direction perpendicular to the adhesive layer 104, And may act in a direction perpendicular to the shielding member 139a at the edge of the shielding member 139a. As the repulsive force is operated in the direction away from the first region A, the repulsive force can be prevented from being directly transmitted to the circuit board 136 and the sealing member 134a.

8 is a cross-sectional view schematically showing a configuration of an electronic device according to another one of various embodiments of the present invention.

Referring to FIG. 8, the shielding member 139b may be located in the first area A and the edge of the shielding member 139b may be located outside the first area A.

6) is applied to the cover member 113, the repulsive force acts on the edge of the adhesive layer 104 in a direction perpendicular to the adhesive layer 104, And may act in a direction perpendicular to the adhesive layer 104 at the edge of the member 139b. As the repulsive force is operated in the direction away from the first region A, the repulsive force can be prevented from being directly transmitted to the circuit board 136 and the sealing member 134a.

9A is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.

Referring to FIG. 9A, the adhesive layer 104c may be located in the first area A and the edge of the adhesive layer 104c may be located outside the first area A.

6) is applied to the cover member 113, a repulsive force acts on the edge of the adhesive layer 104c in a direction perpendicular to the adhesive layer 104c, or the external force (1) 139b in a direction perpendicular to the shielding member 139b. As the repulsive force is operated in the direction away from the first region A, the repulsive force can be prevented from being directly transmitted to the circuit board 136 and the sealing member 134a.

FIG. 9B is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention. FIG.

9B, the adhesive layer 131c and / or the touch panel 132c may be positioned in the first area A while the edge of the adhesive layer 131c and / or the touch panel 132c may be positioned in the first area A, It can be located outside the region A.

6) is applied to the edge of the adhesive layer 131c and / or to the edge of the touch panel 132c (see FIG. 6) And may act in the direction perpendicular to the adhesive layer 131c and / or the touch panel 132c at the edges. The external force acts on the circuit board 136 and the sealing member 134a directly as the external force acts on the second region B that does not overlap with the first region A. [ Can be prevented from being transmitted.

According to various embodiments, a polarizing function film (not shown) may be deposited over the circuit board 136. The edge of the polarizing function film (not shown) is located in the second region B to prevent the external force from acting in the first region A.

According to various embodiments, the edge of the impact absorbing member 138 may be located in a second area B that does not overlap the first area A. 6) acts on the edge of the impact absorbing member 138 in a direction perpendicular to the impact absorbing member 138 when the external force (1) (FIG. 6) is applied to the cover member 113 . 6) is prevented from being directly transmitted to the circuit board 136 and the sealing member 134a as the external force (1) (FIG. 6) acts on the second region B, can do.

According to various embodiments, the electronic device includes a first layer including a circuit board 136, a plurality of upper layers located above the first layer, and a plurality of lower layers located below the second layer, Lt; / RTI > The plurality of upper layers may include an adhesive layer, a touch panel, and / or a polarizing function film. The plurality of lower layers may include an impact absorbing member, a shielding member, and / or an adhesive layer. The edges of the plurality of upper layers may be located in the second region B. The edges of the plurality of lower layers may be located in the second region B. According to various embodiments, the edges of the plurality of lower layers with the edges of the plurality of upper layers may be located in the second area B.

10 is a flow chart illustrating a method of fabricating an electronic device according to various embodiments of the present invention.

Referring to Fig. 10, a method of making an electronic device according to various embodiments of the present invention, in operation 31, may produce a front cover having at least a portion of a curved surface. In operation 32, the touch panel may be attached to the front cover by a first adhesive layer. In operation 33, the circuit board can be mounted in the first area. In operation 34, the flexible substrate may be attached to the touch panel by a second adhesive layer. At operation 35, an impact-absorbing member may be attached to the flexible substrate. In operation 36, the adhesive layer (e.g., a waterproof member) may be disposed in a second area that is not overlapped with the first area.

Figure 11 is a plan view schematically illustrating the inside of an electronic device according to another of the various embodiments of the present invention.

Referring to FIG. 11, an electronic device 200 according to yet another embodiment of the present invention may include a flexible substrate 202, a circuit board 205, and / or a camera module 203. A detailed description of the same or similar components to those of the preceding embodiment will be omitted.

According to various embodiments, the circuit board 205 may be disposed on the flexible substrate 202. The circuit board 205 may be spaced apart from the edge of the flexible substrate 202 along the periphery of the flexible substrate 202.

According to one embodiment, the camera module 203 is disposed in the housing of the electronic device so as not to overlap with the circuit board 205, and when the electronic device 200 is impacted by an external force, Can be prevented from being transmitted to the circuit board 205 along the periphery of the camera module 203.

12 is a plan view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.

12, an electronic device 300 according to yet another embodiment of the present invention may include a flexible substrate 301, a circuit substrate 305, and / or a hinged key 303. A detailed description of the same or similar components to those of the preceding embodiment will be omitted.

According to one embodiment, the home key 303 is disposed in the housing of the electronic device so as not to overlap with the circuit board 305, and when the electronic device 300 is impacted by an external force, It is possible to prevent the impact from being transmitted to the circuit board 305 along the circumference of the hinge key 303.

According to various embodiments, the home key 303 may also perform a fingerprint recognition function. According to one embodiment, a fingerprint recognition device may be provided in the housing of the electronic device so that the fingerprint recognition device is not overlapped with the circuit board 305 while being separately provided from the home key 303.

13 is a plan view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention.

Referring to FIG. 13, an electronic device 400 according to various embodiments of the present invention may include a flexible substrate 402, a circuit board 405, and / or a plurality of pressure sensors 403. A detailed description of the same or similar components to those of the preceding embodiment will be omitted.

According to one embodiment, the plurality of pressure sensors 403 are disposed on the housing of the electronic device so as not to overlap with the circuit board 405, and when the electronic device 400 is impacted by an external force, It is possible to prevent an impact due to an external force from being transmitted to the circuit board 405 along the circumference of the pressure sensor 403. [

14 is a cross-sectional view schematically showing the configuration of an electronic device according to another one of various embodiments of the present invention. Fig. 15 is an enlarged view of C shown in Fig.

14 and 15, an electronic device 500 according to yet another embodiment of the present invention includes a housing 501, a cover member 502, a touch panel 503, a display panel 504, 505 ), A circuit board 506 and / or an adhesive layer 507. [ A detailed description of the same or similar components to those of the preceding embodiment will be omitted.

According to one embodiment, the cover member 502 may be formed in a dome shape, and may have a curved surface as a whole, unlike the previous embodiment in which both ends have curved surfaces.

According to one embodiment, an adhesive layer 507 may be disposed between the display panel 504 and the housing 501. The adhesive layer 507 may be located outside a first region A 'formed along a direction perpendicular to the curved surface of the circuit board 506. For example, the adhesive layer 507 may be located in a second region B 'different from the first region A'.

According to one embodiment, when the cover member 502 receives an external force (1), a repulsive force (2) generated in a direction opposite to the external force (1) of the housing 501 is applied to the adhesive layer 507 And may be transmitted to the display panels 504 and 505 through the edges. As the edge of the adhesive layer 507 is positioned outside the first region A ', the repulsive force ② moving through the edge of the adhesive layer 507 is directly applied to the circuit board 506 Can be prevented.

A shock absorbing space 508 is formed between the display module 504 and the housing 501 so that a part of the display modules 504 and 505 Can be pivoted in the shock absorbing space (508).

According to the embodiment of the present invention, the cover member 502 is not limited to the entire front or rear surface of the electronic device, but may be formed on a part of the housing 501. For example, the cover member 502 may be formed on a part of the rear surface of the housing 501 to serve as an auxiliary display.

As described above, an electronic device according to various embodiments of the present invention includes: a housing; A cover member coupled with the housing; And a flexible substrate coupled to the cover member. An impact absorbing space is formed between the housing and the flexible substrate. When an external force is applied, a part of the flexible substrate is rotated in the impact absorbing space, Can be absorbed.

According to various embodiments, the flexible substrate includes a touch panel; And a display panel coupled with the touch panel.

The electronic device according to various embodiments of the present invention may further include an adhesive layer disposed between the display panel and the housing.

According to various embodiments of the present invention, the shock absorbing space may be formed in parallel with the adhesive layer.

According to various embodiments of the present invention, the flexible substrate includes: a circuit board on which electric power and electrical signals of the display panel are moved; A sealing member sealing an edge of the display panel; A first region including the circuit board and the sealing member; And a second region that is not overlapped with the first region, and an edge of the adhesive layer may be located in the second region.

According to various embodiments of the present invention, the length of the shock absorbing space may be longer than the sum of the lengths of the circuit board and the sealing member.

According to various embodiments of the present invention, the flexible substrate may further include a shielding member disposed between the display panel and the adhesive layer and shielding electromagnetic waves transmitted to the display panel, And may be located in the second region.

According to various embodiments of the present invention, the flexible substrate may be in the form of a dome.

An electronic device according to various embodiments of the present invention includes: a housing; A cover member coupled to the housing and having at least a curved surface; A flexible substrate disposed between the housing and the cover member; A circuit board disposed on the flexible substrate; And an adhesive layer disposed between the flexible substrate and the housing, wherein the electronic device includes a first region including the circuit board and a second region that is not overlapped with the first region, May be located in the second region.

According to various embodiments of the present invention, the circuit board may be disposed below the curved surface of the cover member.

According to various embodiments of the present invention, the flexible substrate comprises: a TFE panel; A light emitting layer facing the TFE panel and on which the circuit board is disposed; And a sealing member disposed corresponding to the first region, the sealing member sealing between the TFE panel and the substrate and shielding the circuit board from the outside, and the sealing member may be included in the first region.

According to various embodiments of the present invention, there is further provided a shielding member disposed between the flexible substrate and the adhesive layer, the shielding member shielding electromagnetic waves transmitted to the flexible substrate, have.

A method of manufacturing an electronic device according to various embodiments of the present invention includes: fabricating a front cover having at least a portion of a curved surface; Attaching the touch panel to the front cover; Mounting the circuit board in the first area; Attaching the flexible substrate to the touch panel; And placing the adhesive layer in a second region that is not overlapped with the first region.

An electronic device according to various embodiments of the present invention is a housing including a first plate and a second plate facing in a direction opposite to the first plate, wherein the first plate is flat or has an edge region a housing including a peripheral region; A touch screen display disposed between the edge region and the second plate and including a plurality of layers, the touch screen display exposed through the first plate; A display driver IC (DDI) for generating a signal for driving the display; A circuit included in one of the plurality of layers and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display; An intermediate plate disposed between the touch screen display and the second plate; And an adhesive layer interposed between the display and the intermediate plate, the adhesive layer including a first surface contacting the touch screen display and a second surface contacting the intermediate plate, And may not overlap with the first area when viewed from the edge area.

According to various embodiments of the present invention, the adhesive layer may not overlap the first region when viewed from the edge region.

According to various embodiments of the present invention, an empty space may be included between the display and the intermediate plate.

According to various embodiments of the present invention, the adhesive layer may comprise a double-sided tape.

An electronic device according to various embodiments of the present invention is a housing including a first plate and a second plate facing in a direction opposite to the first plate, wherein the first plate is flat or has an edge region a housing including a peripheral region; A touch screen display disposed between the edge region and the second plate, the touch screen display including a first layer and exposed through the first plate; A display driver IC (DDI) for generating a signal for driving the display; A circuit included in the first layer and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display; An intermediate plate disposed between the touch screen display and the second plate; And a plurality of layers disposed between the first layer and the intermediate plate, wherein at least one edge of the plurality of layers may not overlap the first area when viewed from the edge area.

According to various embodiments of the present invention, Embossed layer; A sponge layer; Conductive sheet; An adhesive layer; Double-sided tape; A digitizer layer; Or a pressure sensor layer.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100: electronic device 101: housing
113a: cover member 103: flexible substrate
104: adhesive layer 105: shock absorption space

Claims (20)

In an electronic device,
housing;
A cover member coupled with the housing; And
And a flexible substrate coupled with the cover member,
Wherein an impact absorbing space is formed between the housing and the flexible substrate so that when an external force is applied, a part of the flexible substrate is pivoted in the impact absorbing space to absorb the external force.
The flexible printed circuit board according to claim 1,
Touch panel; And
And a display panel coupled with the touch panel.
3. The method of claim 2,
And an adhesive layer disposed between the display panel and the housing.
The electronic device according to claim 3, wherein the impact-absorbing space is formed in parallel with the adhesive layer.
The electronic device according to claim 3, wherein the flexible substrate is rotatable in the impact absorbing space while being supported by the adhesive layer.
The flexible printed circuit board according to claim 3,
A circuit board on which power and an electrical signal of the display panel are moved;
A sealing member sealing an edge of the display panel;
A first region including the circuit board and the sealing member; And
And a second region that is not overlapped with the first region,
And the edge of the adhesive layer is located in the second region.
The electronic device according to claim 6, wherein the length of the shock absorbing space is longer than the sum of the length of the circuit board and the sealing member.
The display device according to claim 6, wherein the flexible substrate further comprises a shielding member disposed between the display panel and the adhesive layer to shield electromagnetic waves transmitted to the display panel,
And an edge of the shielding member is located in the second region.
The electronic device according to claim 6, wherein the flexible substrate is in the form of a dome.
In an electronic device,
housing;
A cover member coupled to the housing and having at least a curved surface;
A flexible substrate disposed between the housing and the cover member;
A circuit board disposed on the flexible substrate; And
And an adhesive layer disposed between the flexible substrate and the housing,
The electronic device including a first region including the circuit board and a second region not overlapping the first region,
And the edge of the adhesive layer is located in the second region.
11. The electronic device according to claim 10, wherein the circuit board is disposed below a curved surface of the cover member.
The flexible printed circuit board according to claim 10,
TFE panel;
A substrate facing the TFE panel and on which the circuit board is disposed; And
And a sealing member disposed corresponding to the first area and sealing the TFE panel and the substrate to shield the circuit board from the outside,
And the sealing member is included in the first region.
11. The method of claim 10,
Further comprising a shielding member disposed between the flexible substrate and the adhesive layer for shielding electromagnetic waves transmitted to the flexible substrate,
Wherein the shielding member is located in the second region.
A method of manufacturing an electronic device,
Fabricating a front cover having at least a portion of a curved surface;
Attaching the touch panel to the front cover;
Mounting the circuit board in the first area;
Attaching the flexible substrate to the touch panel; And
And placing the adhesive layer in a second area that is not overlapped with the first area.
In an electronic device,
A housing comprising a first plate and a second plate facing away from the first plate, wherein the first plate is flat or comprises a peripheral region bent toward the second plate;
A touch screen display disposed between the edge region and the second plate and including a plurality of layers, the touch screen display exposed through the first plate;
A display driver IC (DDI) for generating a signal for driving the display;
A circuit included in one of the plurality of layers and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display;
An intermediate plate disposed between the touch screen display and the second plate; And
And an adhesive layer interposed between the display and the intermediate plate, the adhesive layer including a first side contacting the touch screen display and a second side contacting the intermediate plate,
And an edge of the adhesive layer does not overlap with the first area when viewed from the edge area.
16. The apparatus of claim 15, wherein the adhesive layer does not overlap with the first region when viewed from the edge region.
16. The apparatus of claim 15, wherein the adhesive layer does not overlap with the first region when viewed from the edge region.
16. The apparatus of claim 15, wherein the adhesive layer comprises a double-sided tape.
In an electronic device,
A housing comprising a first plate and a second plate facing away from the first plate, wherein the first plate is flat or comprises a peripheral region bent toward the second plate;
A touch screen display disposed between the edge region and the second plate, the touch screen display including a first layer and exposed through the first plate;
A display driver IC (DDI) for generating a signal for driving the display;
A circuit included in the first layer and disposed in a first region corresponding to the edge region, the circuit forming an electrical path between the DDI and the display;
An intermediate plate disposed between the touch screen display and the second plate; And
And a plurality of layers disposed between the first layer and the intermediate plate,
Wherein at least one edge of the plurality of layers does not overlap with the first region when viewed from the edge region.
20. The method of claim 19, wherein the plurality of layers comprises: an emboss layer; A sponge layer; Conductive sheet; An adhesive layer; Double-sided tape; A digitizer layer; Or a pressure sensor layer.

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