KR20170136795A - Interface module and apparatus for testing semiconductor devices having the same - Google Patents

Abstract

An interface module for use in testing electrical characteristics of semiconductor devices is disclosed. The interface module includes an interface board for applying an inspection signal to the semiconductor elements housed in the test tray, a socket guide mounted on the interface board, a plurality of test sockets mounted on the socket guide and connected to the semiconductor elements, And a temperature adjusting member disposed on one side of the socket guide. The temperature regulating member has a first heat radiating member that radiates heat in a direction perpendicular to the interface board. As described above, since the interface module includes a separate temperature control member for releasing the heat of the interface board, the temperature distribution uniformity of the interface board can be improved and the interface board can be maintained at a proper temperature.

Description

[0001] The present invention relates to an interface module and an apparatus for testing semiconductor devices having the same,

Embodiments of the present invention relate to an interface module and a semiconductor device test apparatus including the same. More particularly, the present invention relates to a test head for providing inspection signals to semiconductor devices, an interface module for connecting the semiconductor devices, and a semiconductor device test apparatus having the same.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices thus formed can be manufactured into finished products through a dicing process, a bonding process, and a packaging process .

These semiconductor devices can be judged as good or defective through electrical characteristic inspection. The electrical characteristic inspection may include a plurality of transfer modules for transferring semiconductor elements, a test module for inspecting semiconductor elements, and a semiconductor device test apparatus including an interface module for interconnecting semiconductor elements and a test module .

The interface module may include an interface board disposed between the test module and the test tray in which the semiconductor elements are housed, and socket guides mounted on the interface board.

In addition, the semiconductor device test apparatus may include a match plate for connecting the semiconductor elements and the test sockets to each other, and the match plate may have a plurality of pushers for pressing the semiconductor elements toward the test sockets.

Meanwhile, the test process for semiconductor devices can be classified into a high-temperature process and a low-temperature process. As an example, the high-temperature process is performed at an inspection temperature of about 85 ° C to 130 ° C, RTI ID = 0.0 > 5 C < / RTI > For the high-temperature process and the low-temperature process, the match plate may be equipped with thermoelectric elements for adjusting the temperature of the semiconductor elements through the pushers.

On the other hand, test leads for connection with semiconductor devices are mounted on the socket guides, power supply elements for inspecting semiconductor devices and passive devices such as resistors, capacitors, and amplifiers for signal conversion, Devices can be mounted.

Since the members for generating heat in the driving process are provided on the upper and lower sides of the interface board, the surface temperature distribution of the interface board is uneven and it is difficult to maintain the proper temperature of the interface board for the testing process. As a result, it is difficult to keep the semiconductor elements at a desired inspection temperature and the inspection reliability is lowered.

Korean Registered Patent No. 10-0671397 (January 12, 2007) Korean Registered Patent No. 10-1228207 (Feb.

Embodiments of the present invention provide an interface module capable of controlling the temperature of an interface board connected to a test module and a semiconductor device test apparatus having the same.

According to an aspect of the present invention, there is provided an interface module including: an interface board for applying an inspection signal to semiconductor devices for electrically inspecting semiconductor devices housed in a test tray; A socket guide, a plurality of test sockets mounted on the socket guide and connected to the semiconductor elements, and a first heat radiation member disposed on one side of the socket guide on the interface board and emitting heat in a direction perpendicular to the interface board And a temperature control unit for controlling the temperature of the interface board.

According to embodiments of the present invention, the first heat radiation member may be a heat spreader.

According to embodiments of the present invention, the temperature adjusting unit may include a second heat dissipating unit disposed between the first heat dissipating member and the interface board and distributing the heat conducted from the lower side of the interface board to the interface board in a horizontal direction Member.

According to embodiments of the present invention, the second heat radiation member has a sheet shape and may be made of graphite.

According to embodiments of the present invention, the interface board may be divided into a chip area where the socket guide and the test socket are located and a connecting area located outside the chip area. In addition, the second heat radiation member may cover the connecting area on the upper surface of the interface board.

According to embodiments of the present invention, the temperature regulation unit may include a plurality of temperature control units coupled to the interface board through the first and second heat dissipation members to fix the first and second heat dissipation members to the interface board, It is possible to further include a fixing pin.

According to embodiments of the present invention, a plurality of temperature control units may be provided, and a plurality of temperature control units may be arranged in two rows with the socket guide interposed therebetween.

According to another aspect of the present invention, there is provided a semiconductor device testing apparatus comprising: a test chamber for providing a space for inspecting electrical characteristics of semiconductor elements accommodated in a test tray; A test module for providing a test signal for testing the semiconductor device and for testing the semiconductor devices based on an output signal from the semiconductor devices and a test module disposed in the test chamber, For example. Specifically, the interface module may include an interface board connected to the test module and adapted to apply an inspection signal to the semiconductor devices, a socket guide mounted on the interface board, a socket guide mounted on the socket guide, A plurality of test sockets, and a temperature regulating unit for regulating the temperature of the interface board, the temperature regulating unit having a first heat radiating member disposed at one side of the socket guide on the interface board and emitting heat in a direction perpendicular to the interface board can do.

According to embodiments of the present invention, the temperature regulation unit may be located between the interface board and the test tray.

According to embodiments of the present invention, the first heat radiation member may be a heat spreader.

According to embodiments of the present invention, the temperature adjusting unit may include a second heat dissipating unit disposed between the first heat dissipating member and the interface board and distributing the heat conducted from the lower side of the interface board to the interface board in a horizontal direction Member.

According to embodiments of the present invention, the second heat radiation member has a sheet shape and may be made of graphite.

According to the embodiments of the present invention as described above, the test apparatus for inspecting electrical characteristics of semiconductor devices includes a temperature adjusting member for adjusting the temperature of the interface board on one side of the socket guide, And the interface board can be maintained at an appropriate temperature.

Particularly, since the temperature regulating member includes the first heat radiating member having a high thermal conductivity in the vertical direction and the second heat radiating member having a high thermal conductivity in the horizontal direction, the heat of the interface board can be discharged to the outside more quickly. Thus, the interface board can maintain a uniform temperature distribution and an appropriate temperature for inspecting the semiconductor elements 10, so that the semiconductor elements can be maintained at a desired temperature. As a result, the semiconductor device test apparatus can improve the inspection reliability.

1 is a schematic block diagram illustrating a semiconductor device testing apparatus according to an embodiment of the present invention.
2 is a schematic partial enlarged exploded cross-sectional view for explaining the semiconductor device testing apparatus shown in FIG.
FIG. 3 is a schematic plan view for explaining the interface module shown in FIG. 2. FIG.
4 is a schematic exploded perspective view for explaining the first heat dissipating member and the second heat dissipating member shown in FIG.
5 is a schematic enlarged cross-sectional view for explaining the interface module shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic structural view for explaining a semiconductor device testing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic enlarged sectional view for explaining a semiconductor device testing apparatus shown in FIG.

Referring to FIGS. 1 and 2, a semiconductor device testing apparatus 500 according to an embodiment of the present invention can be used for examining the electrical characteristics of the semiconductor devices 10. FIG. For example, the semiconductor device testing apparatus 500 may provide an electrical inspection signal to a plurality of semiconductor elements 10 housed in a test tray 20, and may electrically connect the semiconductor elements 10, The electrical performance of the semiconductor devices 10 is checked.

Specifically, the semiconductor device testing apparatus 500 may include a test chamber 100 that provides a space for performing an inspection of the semiconductor devices 10. [ Although not shown in the drawing, the test apparatus 500 transfers the semiconductor elements 10 from a customer tray (not shown) to a test tray 20, and transfers the test tray 20 to the test chamber 100, Lt; / RTI > After the inspection process is completed in the test chamber 100, the test tray 20 is taken out of the test chamber 100 and the semiconductor elements 10 accommodated in the test tray 20 are transferred to an empty customer tray (Not shown) for transferring a plurality of transfer modules (not shown). A preheating chamber (not shown) for controlling the temperature of the semiconductor elements 10 in advance and a heat-generating chamber (not shown) for recovering the temperature of the semiconductor elements 10 to room temperature may be included, The test chamber 100 may be disposed between the preheating chamber and the heat-generating chamber.

The semiconductor device testing apparatus 500 provides test signals to the semiconductor devices 10 and tests the electrical performance of the semiconductor devices 10 based on output signals from the semiconductor devices 10 The test module 200 may include a plurality of test modules.

The test module 200 may include a test head 210 for providing the test signals and analyzing the output signals and a top plate 220 disposed on the test head 210. At this time, the top plate 220 may be disposed in the test chamber 100 and may be connected to the test head 210 by connecting cables or connectors.

The semiconductor device testing apparatus 500 may include an interface module 300 and a match plate 400 disposed in the test chamber 100. The interface module 300 transfers the test signals and the output signals between the test head 210 and the semiconductor devices 10. [ The match plate 400 is disposed to face the interface module 300 and connects the semiconductor devices 10 to the interface module 300.

Hereinafter, the configuration of the interface module 300 and the match plate 400 will be described in detail with reference to the drawings.

FIG. 3 is a schematic plan view for explaining the interface module shown in FIG. 1, FIG. 4 is a schematic exploded perspective view for explaining the first heat radiation member and the second heat radiation member shown in FIG. 3, 3 is a schematic enlarged cross-sectional view for explaining the interface module shown in Fig.

2 and 3, the interface module 300 may be disposed on an upper surface of the top plate 220 and may be electrically connected to the top plate 220. The interface module 300 includes an interface board 310 for applying the inspection signal to the semiconductor devices 10 accommodated in the test tray 20, a plurality of socket guides 310 mounted on the interface board 310, 320, a plurality of test sockets 330 connected to the semiconductor devices 10, and a temperature control unit 340 for controlling the temperature of the interface board 310.

2, the match plate 400 may be disposed on the upper side of the interface module 300, and the test tray 400 may be disposed between the interface module 300 and the match plate 400. [ 20 may be disposed. The match plate 400 may include a plurality of pushers 410 for connecting the semiconductor devices 10 to the test sockets 330. The match plate 400 presses the semiconductor elements 10 toward the test sockets 330 so that the semiconductor elements 10 stored in the test tray 20 are connected to the test sockets 330. [ can do.

The test tray 20 may have a plurality of insert assemblies 30 for receiving the semiconductor devices 10 and the insert assemblies 30 may be used to accommodate the semiconductor devices 10 And may have openings. Although not shown in the drawing, a support film (not shown) for supporting the semiconductor devices 10 may be provided on the lower side of the openings. The support film may be provided with guide holes for guiding the position of the semiconductor elements 10 such that the external connection terminals of the semiconductor elements 10, for example, solder balls protrude downward .

2, the top plate 220, the interface module 300, and the match plate 400 are disposed in a horizontal direction. However, the top plate 220, the interface module 300, The arrangement direction of the plate 400 can be variously changed. For example, the top plate 220, the interface module 300, and the match plate 400 may be arranged in a vertical direction, and the top plate 220 may be disposed above the interface module 300 And the match plate 400 may be disposed on the upper side of the interface module 300. Therefore, the scope of the present invention is not limited by the arrangement direction and order of the top plate 220, the interface module 300, and the match plate 400.

As shown in FIG. 2, the interface board 310 may be disposed below the match plate 400. The interface board 310 may be disposed on the upper surface of the top plate 220. Power input terminals for inspecting the semiconductor devices 10 and test signals Passive components such as resistors, capacitors, amplifiers, etc. for analog / digital conversion of the output signal can be mounted. The interface board 310 and the top plate 220 may be electrically connected by a plurality of male and female connectors 222 and 312.

The socket guides 320 may be mounted on the upper surface of the interface board 310 and the test sockets 330 may be mounted on the socket guides 320. Although not shown in detail in the drawings, the test sockets 330 may have contact terminals for connection with external connection terminals of the semiconductor elements 10. [ Here, since the contact terminals can be realized in various forms, the scope of the present invention is not limited by the configuration of the contact terminals.

As described above, the interface boards 310 are provided with members for generating heat in the upper and lower parts of the interface board 310. This heat dissipates the temperature distribution of the interface board 310. That is, the heat of the test sockets 330 is transmitted to the interface board 310 from the upper side of the interface board 310, and the temperature of the interface board 310 rises. The male and female connectors 222 and 312 and the top plate 220 provided on the interface board 310 and the top plate 220 are connected to the interface board 310 So that the temperature of the interface board 310 rises. Therefore, the surface temperature distribution of the interface board 310 is uneven, and it is difficult for the interface board 310 to maintain an appropriate temperature for inspecting the semiconductor devices 10.

In order to prevent this, the temperature control unit 340 is mounted on the interface board 310 to adjust the temperature of the interface board 310.

2, the temperature regulating unit 340 may be disposed between the interface board 310 and the test tray 20. As shown in FIG. As shown in FIG. 3, the temperature control unit 340 may be disposed at one side of the socket guide 320.

As shown in FIG. 3, the plurality of temperature control units 340 may include a plurality of temperature control units 340, which may include a plurality of temperature control units 340, Can be arranged in two rows.

In one embodiment of the present invention, four temperature control units 340 are mounted on one interface board 310, but the number of temperature control units 340 mounted on the one interface board 310 is But is not limited thereto.

Referring to FIGS. 2 and 4, the temperature regulating member 340 may include a first heat dissipating member 342 that discharges heat in a direction perpendicular to the interface board 310. The first heat radiation member 342 may have a substantially rectangular shape and may be formed of a heat spreader.

In an embodiment of the present invention, the first heat dissipating member 342 is formed of a heat spreader, and may be a heat pipe.

The temperature regulating member 340 may further include a second heat dissipating member 344 disposed under the first heat dissipating member 342. The second heat dissipation member 344 may be disposed between the interface board 310 and the first heat dissipation member 342 and may disperse heat in a horizontal direction with respect to the interface board.

In an embodiment of the present invention, the second radiation member 344 may have a substantially rectangular sheet shape, and may be formed of graphite.

The interface board 310 includes a chip area CHA where the socket guides 320 and the test sockets 330 are provided and a connecting area CNA where the chip area CHA is located outside And the male and female connectors 222 and 321 may be located in the connecting area CNA. The second radiation member 344 may cover the connector area CHA on the upper surface of the interface board 310. [

The temperature regulating member 340 includes the first heat radiating member 342 having a high thermal conductivity in the vertical direction and the second heat radiating member 344 having a high thermal conductivity in the horizontal direction, The heat of the board 310 can be quickly released to the outside. That is, the second radiation member 344 horizontally distributes the heat conducted from the lower side of the interface board 310 to the interface board 310, and the first radiation member 342 distributes the second radiation heat The heat dissipated in the horizontal direction by the member 344 and the heat conducted from the upper side of the interface board 310 are emitted in the vertical direction. Accordingly, since the heat of the interface board 310 can be rapidly discharged to the outside, the interface board 310 can maintain a uniform temperature distribution and an appropriate temperature for inspecting the semiconductor devices 10 .

3 to 5, the temperature regulating member 340 includes a plurality of fixing pins 346 for fixing the first and second heat dissipating members 342 and 344 to the interface board 310 . 5, the fixing pins 346 may be coupled to the interface board 310 through the first and second heat dissipating members 342 and 344. 4, a plurality of through holes 342A and 344A for inserting the fixing pins 346 may be formed in the first and second heat dissipating members 342 and 344.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It will be understood.

10: Semiconductor device 20: Test tray
30: insert assembly 100: test chamber
200: test module 210: test head
220: top plate 300: interface module
310: Interface Board 320: Socket Guide
330: Test socket 340: Temperature control member
342: first heat radiating member 343: second heat radiating member
346: Fixing pin 400: Match plate
410: pusher 500: semiconductor device test apparatus

Claims (12)

An interface board for applying an inspection signal to the semiconductor elements to electrically inspect the semiconductor elements housed in the test tray;
A socket guide mounted on the interface board;
A plurality of test sockets mounted on the socket guides and connected to the semiconductor elements; And
And a temperature regulating unit disposed on the interface board at one side of the socket guide and having a first heat radiating member for emitting heat in a direction perpendicular to the interface board, Interface module. The method according to claim 1,
Wherein the first heat dissipation member is a heat spreader. The method according to claim 1,
The temperature control unit includes:
Further comprising a second heat dissipating member disposed between the first heat dissipating member and the interface board and distributing the heat conducted from the lower side of the interface board to the interface board in a horizontal direction. The method of claim 3,
Wherein the second heat dissipation member has a sheet shape and is made of graphite. 5. The method of claim 4,
The interface board may be divided into a chip area where the socket guide and the test socket are located and a connecting area located outside the chip area,
And the second heat radiation member covers the connecting area on the upper surface of the interface board. The method of claim 3,
The temperature control unit includes:
Further comprising a plurality of fixing pins coupled to the interface board through the first and second heat dissipating members to fix the first and second heat dissipating members to the interface board. The method according to claim 1,
The plurality of temperature control units may be provided,
Wherein the plurality of temperature control units are arranged in two rows with the socket guides interposed therebetween. A test chamber for providing a space for inspecting electrical characteristics of the semiconductor elements accommodated in the test tray;
A test module for providing an inspection signal for inspecting the electrical characteristics of the semiconductor elements and for inspecting the semiconductor elements based on an output signal from the semiconductor elements; And
And an interface module disposed in the test chamber for communicating the test signal and the output signal between the test module and the semiconductor devices,
Wherein the interface module comprises:
An interface board connected to the test module for applying an inspection signal to the semiconductor devices;
A socket guide mounted on the interface board;
A plurality of test sockets mounted on the socket guides and connected to the semiconductor elements; And
And a temperature regulating unit disposed on the interface board at one side of the socket guide and having a first heat radiating member for emitting heat in a direction perpendicular to the interface board, A semiconductor device testing apparatus. 9. The method of claim 8,
Wherein the temperature control unit is located between the interface board and the test tray. 10. The method of claim 9,
Wherein the first radiation member is a heat spreader. 10. The method of claim 9,
The temperature control unit includes:
Further comprising a second heat dissipating member disposed between the first heat dissipating member and the interface board and dispersing heat conducted from a lower side of the interface board in a horizontal direction with respect to the interface board. 12. The method of claim 11,
Wherein the second heat dissipation member has a sheet shape and is made of graphite.

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