KR20170135909A - 전기 전도성 투명층의 제조를 위한 알코올/물 혼합물 중의 은 나노와이어 및 분산된 스티렌/(메트)아크릴 공중합체를 포함하는 조성물 - Google Patents
전기 전도성 투명층의 제조를 위한 알코올/물 혼합물 중의 은 나노와이어 및 분산된 스티렌/(메트)아크릴 공중합체를 포함하는 조성물 Download PDFInfo
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Abstract
Description
Claims (14)
- 하기 성분을 포함하는 조성물:
(A) 하기를 포함하는 혼합물
(A-1) 물,
(A-2) 메탄올, 에탄올, n-프로판올, i-프로판올, n-부탄올, i-부탄올 및 t-부탄올로 이루어진 군에서 선택되는 하나 이상의 알코올,
(B) 전기 전도성 나노물체
상기 전기 전도성 나노물체 (B) 는 1 ㎚ 내지 100 ㎚ 범위의 2 개의 외형 치수 및 1 ㎛ 내지 100 ㎛ 범위의 이들의 제 3 의 외형 치수를 가지며,
상기 전기 전도성 나노물체 (B) 의 총 중량 분율은 조성물의 총 중량에 대해서 0.01 wt.-% 내지 1 wt.-% 의 범위임,
(C) 혼합물 (A) 에 용해된, 하나 이상의 스티렌/(메트)아크릴 공중합체
상기 용해된 공중합체 (C) 는 각각 500 g/mol 내지 22000 g/mol 범위의 수 평균 분자량을 가지며,
상기 용해된 공중합체 (C) 의 총 중량 분율은 조성물의 총 중량에 대해서 0.02 wt.-% 내지 5 wt.-% 의 범위임. - 제 1 항에 있어서, 상기 전기 전도성 나노물체 (B) 가 1 ㎛ 내지 100 ㎛ 범위의 길이 및 1 ㎚ 내지 100 ㎚ 범위의 직경을 가지며, 상기 전기 전도성 나노물체 (B) 가 은, 구리, 금 및 탄소로 이루어진 군에서 선택되는 하나 이상의 물질을 포함하는 조성물.
- 제 1 항 또는 제 2 항에 있어서, 상기 전기 전도성 나노물체 (B) 가 나노와이어 및 나노튜브로 이루어진 군에서 선택되는 조성물.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 상기 전기 전도성 나노물체 (B) 의 총 중량과 상기 용해된 공중합체 (C) 의 총 중량의 비가 1:20 내지 20:1 의 범위인 조성물.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 혼합물 (A) 가 하기로 이루어지는 조성물:
(A-1) 물 70 % 내지 < 100 %,
(A-2) 메탄올, 에탄올, n-프로판올, i-프로판올, n-부탄올, i-부탄올 및 t-부탄올로 이루어진 군에서 선택되는 하나 이상의 알코올 > 0 % 내지 30 %,
각 경우, 혼합물 (A) 의 총 부피에 대한 것임. - 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, 하나 이상의 알코올 (A-2) 가 i-프로판올, n-부탄올 및 t-부탄올로 이루어진 군에서 선택되는 조성물.
- 제 1 항 내지 제 6 항 중 어느 한 항에 있어서, 하기를 포함하는 조성물:
(A) 하기로 이루어지는 혼합물
(A-1) 물 70 % 내지 98 %,
(A-2) 메탄올, 에탄올, n-프로판올, i-프로판올, n-부탄올, i-부탄올 및 t-부탄올로 이루어진 군에서 선택되는 하나 이상의 알코올 2 % 내지 30 %,
(B) 은 나노와이어
상기 은 나노와이어 (B) 는 10 ㎛ 내지 50 ㎛ 범위의 길이 및 3 ㎚ 내지 30 ㎚ 범위의 직경을 가지며,
상기 은 나노와이어 (B) 의 총 중량 분율은 조성물의 총 중량에 대해서 0.5 wt.-% 이하임,
(C) 혼합물 (A) 에 용해된, 스티렌/(메트)아크릴 공중합체
상기 용해된 공중합체 (C) 는 1700 g/mol 내지 15500 g/mol 범위의 수 평균 분자량을 가지며,
상기 용해된 공중합체 (C) 의 중량 분율은 조성물의 총 중량에 대해서 2 wt.-% 미만, 바람직하게는 1.5 wt.-% 이하임,
상기 은 나노와이어 (B) 의 총 중량과 상기 용해된 공중합체 (C) 의 중량의 비는 1:5 내지 5:1 의 범위임. - 하기의 단계를 포함하는, 2013 년 11 월에 공개된 바와 같은 ASTM D1003 (절차 A) 에 따라서 측정된 80 % 이상의 광 투과율을 갖는 전기 전도성 층을 기판 상에서 제조하는 방법:
제 1 항 내지 제 7 항 중 어느 한 항에 따른 조성물을 제조 또는 제공하는 단계,
상기 조성물을 기판의 표면 상에 적용하는 단계,
상기 기판의 상기 표면 상에 층이 형성되는 정도까지, 상기 기판의 상기 표면에 적용된 상기 조성물로부터 25 ℃ 및 101.325 kPa 에서 액체인 성분을 제거하는 단계. - 제 8 항에 있어서, 상기 기판의 상기 표면에 대한 상기 조성물의 적용이, 스핀 코팅, 드로우 다운 코팅, 롤-투-롤 코팅, 그라비어 인쇄, 마이크로그라비어 인쇄, 스크린-인쇄, 플렉소 인쇄 및 슬롯-다이 코팅으로 이루어진 군에서 선택되는 기술에 의해 수행되는 방법.
- 제 8 항 또는 제 9 항에 있어서, 상기 기판이 유리 및 유기 중합체로 이루어진 군에서 선택되는 물질을 포함하는 방법.
- 제 8 항 내지 제 10 항 중 어느 한 항에 있어서, 상기 기판이 폴리에틸렌 테레프탈레이트를 포함하는 방법.
- 제 9 항 내지 제 12 항 중 어느 한 항에 있어서, 상기 기판의 상기 표면에 적용된 상기 조성물로부터의 25 ℃ 및 101.325 kPa 에서 액체인 성분의 제거가, 상기 기판의 상기 표면에 적용된 상기 조성물을 100 ℃ 내지 150 ℃ 범위의 온도로 15 분 이하의 기간 동안 처리함으로써 달성되는 방법.
- 2013 년 11 월에 공개된 바와 같은 ASTM D1003 (절차 A) 에 따라서 측정된 80 % 이상의 광 투과율을 갖는 전기 전도성 층을 기판 상에서 제조하기 위한, 제 1 항 내지 제 7 항 중 어느 한 항에 따른 조성물의 용도.
- 제 13 항에 있어서, 상기 기판이 폴리에틸렌 테레프탈레이트를 포함하는 용도.
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KR102486523B1 (ko) * | 2017-06-07 | 2023-01-11 | 삼성디스플레이 주식회사 | 캐패시터 구조체, 캐패시터 구조체를 구비한 표시 장치 및 캐패시터 구조체 제조 방법 |
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Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4414370A (en) | 1981-01-09 | 1983-11-08 | S. C. Johnson & Son, Inc. | Process for continuous bulk copolymerization of vinyl monomers |
US4529787A (en) | 1982-06-15 | 1985-07-16 | S. C. Johnson & Son, Inc. | Bulk polymerization process for preparing high solids and uniform copolymers |
US4546160A (en) | 1984-02-29 | 1985-10-08 | S. C. Johnson & Son, Inc. | Bulk polymerization process for preparing high solids and uniform copolymers |
US5508366A (en) | 1994-10-18 | 1996-04-16 | S. C. Johnson & Son, Inc. | Continuous production of reduced gel content hydroxylated addition polymers |
KR100341140B1 (ko) * | 2000-02-28 | 2002-06-20 | 이종학 | 수성 잉크용 수지 보강 에멀젼 수지 및 이의 제조방법 |
US8049333B2 (en) | 2005-08-12 | 2011-11-01 | Cambrios Technologies Corporation | Transparent conductors comprising metal nanowires |
US20110097277A1 (en) * | 2005-08-25 | 2011-04-28 | University Of Washington | Particles coated with zwitterionic polymers |
US8709288B2 (en) * | 2006-09-08 | 2014-04-29 | Sun Chemical Corporation | High conductive water-based silver ink |
US20090035707A1 (en) * | 2007-08-01 | 2009-02-05 | Yubing Wang | Rheology-controlled conductive materials, methods of production and uses thereof |
CN101754584B (zh) * | 2008-12-12 | 2012-01-25 | 清华大学 | 制备导电线路的方法 |
ES2607961T3 (es) | 2010-07-12 | 2017-04-04 | Hanwha Chemical Corporation | Composición de revestimiento conductor y método para fabricar una capa conductora usando la misma |
EP2630207A1 (en) | 2010-10-22 | 2013-08-28 | Cambrios Technologies Corporation | Nanowire ink compositions and printing of same |
KR101795419B1 (ko) * | 2011-01-26 | 2017-11-13 | 주식회사 잉크테크 | 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 |
DE102011119821A1 (de) * | 2011-12-01 | 2013-06-06 | Bundesdruckerei Gmbh | Elektrooptisches Sicherheitselement |
JP2013196918A (ja) * | 2012-03-21 | 2013-09-30 | Jnc Corp | 透明導電膜の形成に用いられる塗膜形成用組成物 |
GB201209221D0 (en) * | 2012-05-25 | 2012-07-04 | Isis Innovation | Solid material and method and composition for forming solid material |
US9920207B2 (en) * | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
US20140255707A1 (en) * | 2013-03-06 | 2014-09-11 | Carestream Health, Inc. | Stabilization agents for silver nanowire based transparent conductive films |
CN104145313A (zh) * | 2013-04-05 | 2014-11-12 | 苏州诺菲纳米科技有限公司 | 带有融合金属纳米线的透明导电电极、它们的结构设计及其制造方法 |
JP2015034279A (ja) * | 2013-04-10 | 2015-02-19 | デクセリアルズ株式会社 | 透明導電膜形成用インク組成物、透明導電膜、透明電極の製造方法、及び画像表示装置 |
JP6710685B2 (ja) | 2014-08-15 | 2020-06-17 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 導電性透明層の製造のための銀ナノワイヤーおよびスチレン/(メタ)アクリル酸コポリマーを含む組成物 |
EP3460011B1 (en) * | 2014-08-15 | 2020-04-22 | Basf Se | Composition comprising silver nanowires and dispersed polymer beads for the preparation of electroconductive transparent layers |
CN107257942A (zh) * | 2014-09-22 | 2017-10-17 | 巴斯夫欧洲公司 | 透明导电层、包含该层的膜及其生产方法 |
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