KR20170090130A - Coil component and manufacturing method for the same - Google Patents

Abstract

The present disclosure relates to a magnetic head comprising a coil portion disposed in a body portion including a magnetic material, the coil portion including a support member, a first pattern of a plane coil shape formed on one surface of the support member, And a via which connects the first and second patterns through the support member, wherein when the thickness of the body portion is T and the thickness of the support member is t, (T / T) of 0.09 or less, and a manufacturing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a coil component,

The present disclosure relates to a coil component and a method of manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, laptops, etc., coil parts applied to such electronic devices are required to be downsized and thinned. In order to meet these demands, various types of winding type or thin film type Research and development of coil parts is actively proceeding.

On the other hand, a thin film type coil component can be manufactured by forming a coil on a support member, embedding a coil formed on the support member and the support member with a magnetic material, and then forming an electrode on the outer surface of the formed magnetic body have.

However, since the thin film type coil component manufactured by such a method has a considerable thickness of the support member, when the body size is made small and thin, the ratio of the support member becomes large and the inductance, DC resistance characteristic, saturation inductance, .

One of the objects of the present disclosure is to solve this problem by minimizing the thickness of the supporting member with respect to the total thickness of the body, thereby providing a coil component having high inductance, high saturation inductance, and low DC resistance characteristics.

One of the solutions proposed through this disclosure is to form a conductive via at the end of the insulating substrate exposed to the outer surface of the body where the electrode is formed so that the insulating substrate is not exposed to the outer surface of the body.

For example, the coil component according to the present disclosure is characterized in that a coil portion is disposed in a body portion including a magnetic material, the coil portion including a support member, a first pattern of a plane coil shape formed on one surface of the support member, And a via which connects the first and second patterns through the support member, wherein the thickness of the body portion is T, the thickness of the support member is t The ratio (t / T) of the thickness of the support member to the thickness of the body portion may be 0.09 or less.

The present invention also provides a method of manufacturing a coil component comprising the steps of preparing a support member, a via passing through the support member, and a first and a second pattern in the form of a plane coil on one surface and the other surface of the support member And forming a body part by embedding the coil part with a magnetic material, wherein when the thickness of the body part is T and the thickness of the support part is t, the thickness of the body part The ratio of the thickness of the support member (t / T) may be 0.09 or less.

As one of the effects of the present disclosure, there is provided a coil part capable of sufficiently securing an area of a magnetic material and capable of reducing a current path and having a high inductance, a high saturation inductance, and a low DC resistance characteristic can do.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
Figure 3 shows an example of a schematic II 'cross section of the coil part of Figure 2.
4 shows the transition of inductance and direct current superposition according to via thickness.
5 is a schematic process diagram showing an example of manufacturing a coil component.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil component applied to an electronic device. Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM can be used. Various types of coil parts may be appropriately applied between the electronic parts for the purpose of noise removal and the like depending on the application. For example, a power inductor (1), a high frequency inductor A general bead 3, a bead for a high frequency band (GHz Bead 4), a common mode filter 5, and the like.

Specifically, the power inductor 1 may be used to stabilize the power source by storing electric power in the form of a magnetic field to maintain an output voltage. Further, the high frequency inductor (HF Inductor) 2 can be used for the purpose of securing a necessary frequency by matching the impedance, blocking the noise and the AC component, and the like. Further, a normal bead (General Bead) 3 can be used for eliminating noise in a power source and a signal line, removing high-frequency ripple, and the like. Further, the high frequency bead (GHz Bead) 4 can be used for eliminating high frequency noise of a signal line and a power supply line associated with audio. Further, the common mode filter (5) can be used for passing the current in the differential mode and removing only the common mode noise.

The electronic device may be a smart phone, but is not limited thereto. For example, the electronic device may be a personal digital assistant, a digital video camera, a digital still camera ), A network system, a computer, a monitor, a television, a video game, or a smart watch. But may be other various electronic devices well known to those skilled in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described. However, it is needless to say that the coil component of the present disclosure can be applied to other various types of coil components as described above, as well as the structure of a power inductor .

2 is a schematic perspective view showing an example of a coil part.

Figure 3 shows an example of a schematic II 'cross-section of the coil part of Figure 2.

Referring to the drawings, a coil component 100 according to an example includes a body portion 10, a coil portion 20 disposed in the body portion 10, and an electrode portion 30 disposed on the body portion 10 . The body portion 10 includes a magnetic material. The coil portion 20 includes support members 21 and first and second patterns 22 and 23 in the form of plane coils formed on one surface and the other surface of the support member 21, 1 and the second pattern 22, 23, respectively. The electrode unit 30 includes a first external electrode 31 connected to the lead terminal of the first pattern 22 and a second external electrode 32 connected to the lead terminal of the second pattern 23. [

The body portion 10 forms an outer appearance of the coil component 100 and includes first and second faces facing in a first direction, third and fourth faces facing in a second direction, 5, and 6, but is not limited thereto. The body portion 10 includes a magnetic material. The magnetic material is not particularly limited as long as it has magnetic properties, and examples thereof include pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy Fe-Ni-Co alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Co alloy powder, Fe-Ni-Co alloy powder, Fe- Based ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Fe-based ferrite, Fe-based ferrite, Ba ferrite, Ba-Ni ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Zn ferrite, Ba-Zn ferrite, Hexagonal ferrite such as Ba-Ni-Co ferrite, and garnet type ferrite such as Y ferrite.

The magnetic material may be one comprising a metal magnetic powder and a resin mixture. The metal magnetic material powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component. Examples of the metal magnetic powder include iron (Fe) Chromium (Cr) -silicon (Si), and the like. The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., alone or in combination. The metal magnetic body powder may be a metal magnetic body powder having an average particle diameter (D ₁ , D ₂ ) of 2 or more. In this case, by using a bimodal metal magnetic powder of different sizes, the magnetic resin composite can be filled and the filling rate can be increased.

The coil part 20 functions to perform various functions in the electronic device through the characteristics expressed from the coil of the coil part 100. For example, the coil component 100 may be a power inductor. In this case, the coil portion 20 may store electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply. The coil portion 20 is formed by the first and second patterns 22 and 23 formed on one surface and the other surface of the support member 21 and the support member 21 and the first and second patterns 22 and 23, 1 and the second pattern 22, 23, respectively.

The support member 21 is formed to be thinner and easier to form the coil portion 20 and is not particularly limited as long as it can support the coil patterns 22 and 23. For example, a copper clad laminate (CCL), a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal soft magnetic substrate, an insulating substrate made of an insulating resin, or the like. As the insulating resin, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- Film, FR-4, bismaleimide triazine (BT) resin, and PID (Photo Imagable Dielectric) resin. From the standpoint of stiffness maintenance, an insulating substrate including glass fiber and epoxy resin can be used, but the present invention is not limited thereto.

The ratio t / T of the thickness of the support member to the thickness of the body portion 10 is 0.09 or less when the thickness of the body portion 10 is T and the thickness of the support member 21 is t, 0.04 to 0.09. The higher the relative thickness ratio of the support member 21 is, the smaller the area occupied by the magnetic material constituting the body portion 10, and the coil characteristics such as inductance are lowered. The thickness of the support member 21 is preferably set to be in accordance with the thickness of the body portion 10. At this time, the thickness of the support member 21 is preferably less than 60 탆, and may be, for example, 40 탆 or more and less than 60 탆. As the thickness of the support member 21 becomes thinner, the thickness of the vias 24 passing through the support member 21 becomes thinner as a result of which the current path is shortened and saturation inductance can be improved, The DC resistance Rdc can be reduced.

This can be specifically confirmed by the following [Table 1]. In Table 1, L denotes inductance, Rdc denotes DC resistance, and Isat denotes saturation inductance. * Means a comparative example. The thickness of the support member 21 was set to less than 60 탆 under the condition that the thickness ratio t / T of the sample 2 was 0.09 or less. As a result, inductance and saturation inductance were increased and DC resistance was decreased . These are the results measured at high frequencies above 1 MHz.

division Sample 1 * Sample 2 Characteristics L [uH] 0.919 0.969 105.51% Rdc [mOhm] 160.310 160.120 99.88% Isat, norminal [A] 1.700 1.800 105.88% T 650 650 100.00% t 60 40 66.67% t / T 0.092 0.062 66.67%

This can be specifically confirmed by referring to FIG. 4 shows the transition of inductance and direct current superposition according to via thickness. As shown in the figure, when the thickness of the support member 21 is 60 m, that is, when the thickness of the via 24 passing through the support member 21 is 60 m, the thickness of the support member 21 It can be seen that the inductance and the superposition of direct current are more excellent when the thickness of the via 24 passing through the through hole 40 is 40 mu m.

The first and second patterns 22 and 23 each have a plane coil shape. The first and second patterns 22 and 23 in the form of the plane coil may be a plating pattern formed by an isotropic plating method, but not limited thereto, and may be a plating pattern formed by an anisotropic plating method. In the case of the flat coil shape, since the number of turns can be at least 2 or more, it is advantageous to realize a thin and high inductance. The first and second patterns 22 and 23 may be composed of a seed layer and a plating layer. The seed layer may comprise a first layer comprising at least one of titanium (Ti), titanium-tungsten (Ti-W), molybdenum (Mo), chrome (Cr), nickel (Ni), and nickel (Ni) Layer and a second layer containing the same material as the plating layer, for example, copper (Cu). The plating layer may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) But it is not limited thereto. The first and second patterns 22 and 23 may be covered with a known insulating film and protected.

The vias 24 extend through the support member 21 and thus have a thickness corresponding to the support member 21. The vias 24 electrically connect the first and second patterns 22, 23. Therefore, the current path is continued, and as a result, one coil that rotates in the same direction is formed. The via 24 may also be composed of a seed layer and a plating layer, and specific examples are as described above. That is, the via 24 may be formed simultaneously with the first and second patterns 22 and 23. The shape of the horizontal cross section of the via 24 is not particularly limited, and may be, for example, a circle, an ellipse, a polygon, or the like. The vertical cross-sectional shape of the via 24 is also not particularly limited, and may be, for example, a tapered shape, an inverted tapered shape, an hourglass shape, a columnar shape, or the like.

The electrode unit 30 serves to electrically connect the coil component 100 to the electronic device when the coil component 100 is mounted on the electronic device. The electrode unit 30 includes a first external electrode 31 and an external second electrode 32 which are disposed on the body unit 10 so as to be spaced apart from each other. The electrode portion 30 may include a pre-plating layer (not shown) to improve the electrical reliability between the coil portion 20 and the electrode portion 30, if necessary.

The first external electrode 31 covers the first surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The second outer electrode 32 covers the second surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The first external electrode 31 is connected to the lead-out terminal of the first pattern 22 drawn out to the first surface of the body portion 10. The second external electrode 32 is connected to the lead-out terminal of the second pattern 23 drawn out to the second surface of the body portion 10.

The first and second external electrodes 31 and 32 may include, for example, a conductive resin layer and a conductive layer formed on the conductive resin layer. The conductive resin layer may be formed by paste printing or the like and may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The conductor layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, a nickel layer and a tin As shown in FIG.

Manufacturing method of coil parts

Hereinafter, the method of manufacturing the coil component of the present disclosure will be described, but the overlapping contents of the above description will be omitted.

5 is a schematic process diagram showing an example of manufacturing a coil component.

Referring to the drawings, first, a support member 21 is prepared. A plurality of metal layers (not shown) may be disposed on both sides of the support member 21, which may be used as a seed layer when forming a coil or the like. The support member 21 may be of a large size for forming a plurality of coil parts 20. A via hole 24H for forming the via 24 is formed in the support member 21 in advance. The via hole 24H may be a mechanical drill, a laser drill, or the like.

Next, a seed layer 22c is formed on the support member 21. Then, At this time, the seed layer 22c is also formed on the wall surface of the via hole 24H. The seed layer 22c is formed by performing a front plating on the supporting member 21 by a known method, attaching a dry film, forming an opening pattern having a flat coil shape by exposure and development, Filling, and peeling off the dry film. Electroplating copper plating or electroless copper plating can be used for the plating method. For example, a chemical vapor deposition (CVD), a physical vapor deposition (PVD), a sputtering, a subtractive, an additive, a semi-additive process, a modified semi- Process) can be used.

Next, a plating layer 22d is formed on the seed layer 22c. As a result, first and second patterns 21 and 22 having a plane coil shape are formed. That is, although only one surface of the support member 21 is shown in the drawing, the other surface is formed in the same manner. As described above, electroplating, electroless copper plating, or the like can be used for plating.

Next, the insulating film 22d is coated. The surfaces of the first and second patterns 21 and 22 are protected by the insulating film 22d. That is, although only one side of the support member 21 is shown in the drawing, the other side is coated in the same manner. As the coating of the insulating film 22d, for example, CVD (chemical vapor deposition) or the like can be used.

Next, through holes (15) penetrating the center portions of the first and second patterns (21, 22) of the support member (21) are formed. The through hole 15 is filled with a magnetic material to form a magnetic core. In this case, characteristics such as inductance can be improved.

Next, a plurality of body portions 10 are formed by laminating a magnetic substance sheet composed of a magnetic material, for example, a metal magnetic body powder and a resin mixture, on the upper and lower portions of the plurality of coil portions 20, The individual body part 10 is obtained and then the electrode part 30 is formed on the body part 10 to manufacture the individual coil part 100. [

In the present disclosure, the term " electrically connected " means a concept including both a physical connection and a non-connection. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

Furthermore, the expression " an example used in the present disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

Also, the terms used in the present disclosure are used to illustrate only one example, and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1: Power inductor
2: High frequency inductor
3: Normal bead
4: High frequency beads
5: Common mode filter
100: Coil parts
10: Body part
20: coil part
30:
21: Support member
21, 23: First and second patterns
24: Via

Claims (10)

1. A coil component in which a coil portion is disposed in a body portion including a magnetic material,
The coil portion includes a support member,
A first pattern of a plane coil shape formed on one surface of the support member,
A second pattern in the form of a plane coil formed on the other surface of the support member,
A via penetrating the support member and connecting the first and second patterns,
/ RTI >
(T / T) of the support member to the thickness of the body portion is 0.09 or less when the thickness of the body portion is T and the thickness of the support member is t,
Coil parts.
The method according to claim 1,
Wherein the thickness t of the support member is less than 60 [
Coil parts.
The method according to claim 1,
The coil component is a thin film power inductor,
Coil parts.
The method of claim 3,
Wherein the coil component has an inductance value of 0.950uH or more at a high frequency of 1MHz or more,
Coil parts.
The method of claim 3,
Wherein the coil component has a direct current resistance (Rdc) value of 160.150 mOhm or less,
Coil parts.
The method of claim 3,
Wherein the coil component has a saturation inductance (Isat) value of 1.750 A or greater,
Coil parts.
The method according to claim 1,
Wherein the magnetic material includes a metal magnetic powder and a resin mixture,
Wherein the metal magnetic body powder is a mixture of two or more metal magnetic body powders having different average particle sizes,
Coil parts.
The method according to claim 1,
An electrode section is disposed on the body section,
The electrode unit may include a first external electrode connected to the lead terminal of the first pattern,
And a second external electrode connected to the lead-out terminal of the second pattern.
Coil parts.
Preparing a support member;
Forming a coil portion by forming first and second patterns each having a plane coil shape on one surface and the other surface of the support member; And
Forming a body part by embedding the coil part with a magnetic material; / RTI >
(T / T) of the support member to the thickness of the body portion is 0.09 or less when the thickness of the body portion is T and the thickness of the support member is t,
A method of manufacturing a coil component.
10. The method of claim 9,
Wherein the thickness t of the support member is less than 60 [
A method of manufacturing a coil component.

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