KR20170078209A - Handler for testing semiconductor - Google Patents

Abstract

The present invention relates to a handler for testing semiconductor devices supporting testing of semiconductor devices.
The handler for semiconductor device testing according to the present invention comprises: a contact inducer coupled with a socket plate of a tester to guide a semiconductor element into electrical contact with a test socket provided in the socket plate; And a device supplier for supplying the semiconductor device with the contact induction device; Wherein the contact induction unit comprises: a coupling plate coupled with the socket plate; An insert having a mounting groove on which the semiconductor device supplied by the device feeder is seated, the mounting being provided on the coupling plate so as to correspond one-to-one with the test socket; And an elastic member elastically supporting the insert upward so that the insert can be lowered relative to the test socket when the element feeder presses down the semiconductor element seated on the insert; .
According to the present invention, the reliability of the electrical connection between the semiconductor element and the test socket is improved.

Description

HANDLER FOR TESTING SEMICONDUCTOR

The present invention relates to a handler for testing semiconductor devices used in testing semiconductor devices.

A handler for semiconductor device testing (hereinafter referred to as a "handler") is a device for classifying semiconductor devices according to a test result after electrically connecting semiconductor devices manufactured through a predetermined manufacturing process to a tester.

The technique related to the handler is disclosed in various patent documents such as Korean Patent Laid-Open No. 10-2002-0053406 (hereinafter referred to as "Prior Art 1") and Japanese Patent Laid-Open No. 2011-247908 (hereinafter referred to as "Prior Art 2" .

According to the disclosed patent document, the gripping head (referred to as "index head" in the prior art 1 and "pressing device" in the prior art 2) descends while holding the semiconductor element, (Hereinafter referred to as a " test socket " in the prior art 2) in a semiconductor device (hereinafter referred to as a " tester "). To this end, the gripping head is configured to allow horizontal and vertical movement. Here, the horizontal movement of the gripping head is made between the upper point of the shuttle (referred to as the 'slide table' in the prior art 2) carrying the semiconductor element and the upper point of the socket plate. And the vertical movement of the gripping head is performed when the semiconductor element is gripped or released from the shuttle and when the semiconductor element is electrically connected to or disconnected from the test socket. Of course, the position or other related structure between the shuttle and the grip head can have various shapes.

The operation of electrically connecting the semiconductor element to the test socket by the descent of the gripping head must proceed with a precise positioning between the semiconductor element held by the gripping head and the test socket.

However, due to the control tolerance for horizontal movement and various other design factors, it is very difficult to precisely position the semiconductor device held by the gripping head and the test socket. In order to solve this problem, a positioning pin (referred to as a 'guide pin' in the related art 2) is formed in the socket plate as referred to in the prior art 2, and a positioning hole Quot; hole "). Therefore, since the positioning pin of the socket plate is first inserted into the positioning hole of the gripping head when the gripping head is lowered, the semiconductor device is electrically connected to the test socket in a state in which precise positioning between the gripping head and the test socket is performed. .

On the other hand, the number of terminals of the semiconductor device is increased due to development of integration technology and the like. Semiconductor device manufacturers attempt to reduce the size of terminals and the spacing between terminals in order to accommodate a large number of terminals within a limited area. As a result, products with a terminal gap of 0.5mm ~ 0.40mm and 0.35mm ~ 0.30mm have been developed and are expected to decrease further in the future. Of course, as the distance between the terminals decreases, the size of the terminals must of course also be reduced. For example, in the case of the BGA type, when the distance between the terminals is 0.50 mm, the diameter of the terminal is 0.33 mm, but when the distance between the terminals is 0.35 mm, the diameter of the terminal becomes as small as 0.23 mm. In recent years, the gap between the terminals is reduced to 0.30 mm while the diameter of the terminals is also reduced to 0.20 mm or less. In this case, if the semiconductor element is grasped by the gripping head in an out-of-position or twisted state even to a small extent, a failure will occur in the electrical connection between the semiconductor element and the test socket. There is a risk that the terminals may be damaged or short-circuited.

Thereby necessitating a further elaborate electrical connection between the semiconductor device and the test socket.

However, in view of the above-mentioned tendency that the diameter of the terminal or the interval between the terminals is reduced, it is very difficult to obtain a precise positioning between the semiconductor device and the test socket using only the positioning pin and the positioning hole. It can be difficult.

First, as the positioning pin is repeatedly inserted and detached in the positioning hole, the wall forming the positioning hole may be worn. In this case, the positioning pins and positioning holes will lose their function. To overcome this, it is necessary to carry out troublesome work such as replacement of parts, which leads to a loss of human resources and a decrease in the operation rate of equipment.

Second, the gripping of the semiconductor element by the gripping head may be defective. That is, the gripping state of the semiconductor element is particularly important because it must have a configuration in which the semiconductor element is electrically connected to the test socket by descending while holding the semiconductor element. However, the movement control tolerance of the shuttle or the grip head or the mounting tolerance of the semiconductor element disturbs the fine grip of the semiconductor element held by the gripping head. Therefore, the semiconductor element D can not be accurately grasped by the picker P of the grasping head, or can be grasped in a finely rotated state, as is exaggerated in FIGS. 1 (a) and 1 (b). However, attempts to reduce the design tolerances as much as possible are subject to mechanical limitations.

Therefore, the applicant of the present invention has proposed a technique in which a liftable pocket plate is provided as in Korean Patent Laid-Open Publication No. 10-2014-0121909 (hereinafter referred to as "Prior Art").

According to the prior art, since the positional correction is performed while the semiconductor element is seated on the pocket plate, the semiconductor element can be electrically connected to the test socket appropriately even if the holding head grasps the semiconductor element to a certain extent.

However, the spacing between the terminals is getting smaller and smaller, and various mechanical tolerances still exist. It is also necessary to consider that each of the discrete semiconductor elements seated on the pocket plate by thermal expansion or contraction of the pocket plate has different positional deviations. For this reason, it is expected that more precise and individual position control will be required for each semiconductor element in the near future.

The object of the present invention is as follows.

First, a technique for precisely calibrating the position of a semiconductor device over at least two stages regardless of the device feeder is provided.

Second, there is provided a technique for allowing a plurality of semiconductor elements supplied by an element feeder to be individually controlled in position.

In order to accomplish the above object, a handler for testing a semiconductor device according to the present invention comprises: a contact inducer coupled to a socket plate of a tester to induce a semiconductor element to be electrically and precisely contacted to a test socket provided on the socket plate; And a device supplier for supplying the semiconductor device with the contact induction device; Wherein the contact induction unit comprises: a coupling plate coupled with the socket plate; An insert having a seating groove that is horizontally movably installed on the coupling plate so as to correspond to the test socket in a one-to-one correspondence relationship and on which a semiconductor device supplied by the device feeder is seated; And an elastic member elastically supporting the insert upward so that the insert can be lowered relative to the test socket when the element feeder presses down the semiconductor element seated on the insert; .

Wherein the insert has a first calibration hole and a second calibration hole for calibrating a position with respect to the test socket and a first calibration pin provided in the test socket is inserted into the first calibration hole to adjust the position of the insert to 1 And a second calibrated pin provided in the test socket is inserted into the second calibrated hole when the semiconductor element seated on the insert by the element feeder is pressed downwardly so that the position of the insert is quadratically Calibration.

The semiconductor element to be supplied to the insert by the element feeder is firstly calibrated by the mounting groove and secondarily calibrated by the second calibrating hole and the second calibrating pin.

And the diameter of the second calibrated hole is smaller than the diameter of the first calibrated hole.

The first calibrating pin is inserted into the first calibrating hole and the center of the second calibrating pin is calibrated to a position where it can be inserted into the second calibrating hole.

The height of the second calibrating pin is lower than the height of the first calibrating pin and at least the upper end of the first calibrating pin is inserted into the first calibrating hole while the insert is raised, 2 The calibration hole is missing.

Wherein the coupling plate comprises: a coupling frame coupled to the socket plate; And a detachable frame detachably coupled to the coupling frame, the detachable frame having the insert fluidly installed therein; .

The present invention has the following effects.

First, since the position of the semiconductor element can be precisely corrected over at least two stages regardless of the element feeder, the reliability of the electrical connection between the semiconductor element and the test socket is improved.

Third, since a plurality of semiconductor elements supplied by the element feeder are individually controlled in position, even if a plurality of semiconductor elements have different positional patterns due to mechanical tolerance, thermal expansion, contraction, or the like, Connection can be made precisely.

1 is a reference diagram for explaining a problem of the prior art.
2 is a schematic plan structural view of a handler according to the present invention.
Fig. 3 is an exploded perspective view partially cut away from the main part of the handler of Fig. 2; Fig.
Fig. 4 is an exploded perspective view of the contact inducer applied to the handler of Fig. 2; Fig.
5 is an incisional perspective view of the insert applied to the contactor of FIG. 4;
Figure 6 is a bottom perspective view of the insert applied to the contactor of Figure 4;
Figure 7 is a schematic side view of the element feeder applied to the handler of Figure 2;
8 is a schematic plan view of a socket plate provided in the tester.
FIG. 9 is a cross-sectional view of the state where the coupling plate and the socket plate applied to the handler of FIG. 2 are fixed to each other.
10 is a reference view for explaining the positional relationship between the first calibration pin and the first calibration hole, the second calibration pin and the second calibration hole in the state of FIG. 9;
Fig. 11 is a cross-sectional view according to another example in which the coupling plate and the socket plate, which can be applied to the handler of Fig. 2, are mutually fixed.

Hereinafter, preferred embodiments according to the present invention will be described, but for the sake of simplicity of explanation, descriptions that are known or duplicated are omitted or compressed as much as possible.

<Equipment description>

FIG. 2 is a schematic plan view of a handler 200 (hereinafter abbreviated as a 'handler') for testing a semiconductor device according to the present invention. FIG. Fig.

2 and 3, the handler 200 according to the present invention includes a shuttle 210, a loading portion 220, an unloading portion 230, a contact inducer 240, and a device feeder 250, .

The shuttle 210 has a pocket table 211 reciprocating on a straight line connecting the loading position LP, the grip position DP and the unloading position UP in the left and right direction.

The pocket table 211 has 16 loading pockets 211a and 16 unloading pockets 211b capable of loading semiconductor elements. Here, the loading pocket 211a reciprocates between the loading position LP and the gripping position DP by reciprocating movement of the pocket table 211, and the unloading pocket 211b is moved in the reciprocating motion of the pocket table 211 Reciprocates between the gripping position DP and the unloading position UP. The loading portion 220 loads the semiconductor elements to be tested with the loading pockets 211a of the shuttle 210).

The unloading portion 230 unloads the tested semiconductor device from the unloading pockets 211b of the shuttle 210.

For reference, the loading / unloading technique of the semiconductor device formed by the loading part 220 / the unloading part 230 is already known and disclosed in various forms, so that a detailed description thereof will be omitted.

The contact induction machine 240 is coupled with the socket plate SP of the tester so that the semiconductor element can be brought into electrical contact with the test socket TS provided in the socket plate SP. To this end, the contact inducer 240 includes a coupling plate 241, sixteen inserts 242 and a plurality of elastic members 243, as shown in FIG.

The coupling plate 241 is coupled with the socket plate SP and includes a coupling frame 241a and a detachable frame 241b.

The coupling frame 241a is provided in a rectangular frame shape and fixedly and tightly coupled to the socket plate SP.

The detachable frame 241b is detachably coupled to the coupling frame 241a, and the above sixteen inserts 242 are installed in a two-to-eight matrix form so as to be able to flow in a vertical direction or a horizontal direction. Therefore, when it is necessary to replace the insert 242, the operator only needs to detach the detachable frame 241b from the engaging frame 241a to perform the replacement operation. Of course, depending on the implementation, the coupling plate 241a may be integrally provided without being separated from the coupling frame and the detachable frame.

The sixteen inserts 242 all have the same structure. Each of the inserts 242 is provided so as to be horizontally and vertically movable to and from the detachable frame 241b so as to correspond one-to-one with the test socket TS, and accommodates semiconductor devices supplied by the device feeder 250. [ 5 is an incisional perspective view of the insert 242. FIG. 5, the insert 242 has a seating groove RS for receiving semiconductor elements. The gap between the inner wall surfaces IF forming the seating grooves RS becomes narrower toward the lower side. Therefore, when the element feeder 250 drops the semiconductor element into the seating groove RS, the semiconductor element is seated while its attitude and position are corrected by the inclination of the inner wall surfaces IF. Of course, the semiconductor element mounted on the seating groove RS is supported by the thin support film 242a, and the terminals of the semiconductor element are exposed downward through the exposure hole EH of the support film 242a. 6, which is a bottom perspective view of the insert 242, the insert 242 is provided with two first correcting holes PH ₁ , four second correcting holes PH ₂ , FS) are formed.

The first calibration hole PH ₁ and the second calibration hole PH ₂ are provided for precisely setting the position between the semiconductor element and the test socket TS.

The position of the insert 242 is firstly calibrated while the first calibration pin PP ₁ (see FIG. 8) provided in the test socket TS is inserted into the first calibration hole PH ₁ . The semiconductor element supplied by the element feeder 250 is also seated in the seating groove RS of the insert 242 so that the first correction hole PH ₁ and the first correction pin PP ₁ are used to fix the insert 242 The position can be settled to the calibrated position as much as the calibrated position.

The position of the insert 242 is secondarily corrected by inserting the second correcting pin PP ₂ (see FIG. 8) provided in the test socket TS into the second correcting hole PH ₂ . This was the second diameter of the calibration hole (PH ₁₎ is smaller than the diameter of the first calibrated hole (PH _1), is provided for the fine positioning of the semiconductor element.

The functions of the first calibration hole PH ₁ and the second calibration hole PH ₁ will be described later in more detail.

The upper end of the elastic member 243 is inserted into the fixing groove FS, and the elastic member 243 is fixed while the upper end of the elastic member 243 is inserted into the fixing groove FS.

The resilient members 243 are positioned between the insert 242 and the test socket TS so that the insert 242 can be lowered relative to the test socket TS when the device feeder 250 presses down the semiconductor element seated in the insert 242 And elastically supports the insert 242 upward to maintain the spacing between test sockets (TS). These elastic members 243 may be provided as coil springs, and the lower end thereof is supported by the test socket TS.

The element feeder 250 grasps the sixteen semiconductor elements from the loading pockets 211a at the gripping position DP and feeds the sixteen semiconductor elements to the coupling plate 241. The sixteen semiconductor elements, And is supplied to the unloading pockets 211b in the gripping position DP. To this end, as in the schematic side view of FIG. 7, the element feeder 250 includes a gripping head 251, a horizontal shifter 252 and a vertical shifter 253.

The gripping head 251 can grip and release the 16 semiconductor elements and each has 16 pickers P capable of grasping or releasing the holding of one semiconductor element by vacuum pressure.

The horizontal shifter 252 moves the gripping head 251 in the forward and backward directions and can be provided with a cylinder. This horizontal shifter 252 allows the gripping head 251 to be positioned above the socket plate SP or above the gripping position DP.

The vertical movement device 253 moves the gripping head 251 in the vertical direction and can be provided with a motor. This vertical movement device 253 allows the gripping head 251 to properly grasp and hold the semiconductor element from the gripping position DP and the engaging plate 241 and further to hold it in the socket plate 241 It becomes possible to press the semiconductor element toward the test socket (TS) side.

For reference, the socket plate SP has 16 test sockets (TS) as shown in the explanatory plan view of Fig. The sixteen semiconductor elements which are seated in the inserts 242 of the contact induction machine 240 are electrically connected to the tester while being pressed toward the sixteen test sockets TS by the descent of the gripping head 251. [ Further, the test sockets TS each have two first calibration pins PP ₁ and four second calibration pins PP ₂ . The first calibration pin PP ₁ is inserted into the first calibration hole PH ₁ to primarily correct the position of the insert 242 and the second calibration pin PP ₂ is fixed to the semiconductor The position of the insert 242 and the semiconductor element is precisely and secondarily corrected while being inserted into the second calibration hole PH ₂ when the element and the insert 242 move down while being pressed. For this purpose, the first calibration pin PP ₁ and the second calibration pin PP ₂ are provided in the shape of a gently curved conical shape at the top, and the first calibration hole PH ₁ and the second calibration hole PH ₂ , The diameter h of the second calibration pin PP ₂ is smaller than the diameter H of the first calibration pin PP ₁ so as to correspond to the diameter of the second calibration pin PP ₁ . Of course, the first calibration pin PP ₁ and the second calibration pin PP ₂ may be separated from the electrical connection portion SA of the test socket TS to separate them from the socket.

<Explanation of Functions of Major Parts>

When the coupling plate 241 is tightly fixed to the socket plate SP, the first calibration pin PP ₁ is inserted into the first calibration hole PH _{1 as} shown in FIG. At this time, the positions of the inserts 242 are firstly corrected in the process of inserting the first correcting pin PP ₁ into the first correcting hole PH ₁ . Of course, since the inserts 242 flow separately, the inserts 242 are individually positionally calibrated to the corresponding test socket TS. 8, the second correcting pin PP ₂ is removed from the second correcting hole PH ₂ , but the first correcting pin PP ₁ and the insert due to the action of the first correcting hole PH ₁ , 242 subsequent second calibration pin (PP being the center (O) of at least a second calibrated pin (PP _2), as shown in the bottom view of Figure 10 by the position correction is located in a second calibrated holes (PP ₂₎ of ₂ can be inserted into the second calibration hole PH ₂ . 9, the height of the second calibration pin PP ₂ is preferably lower than the height of the first calibration pin PP ₁ .

When the element feeder 250 drops the semiconductor element in a state in which the gripping head 251 located above the engaging plate 241 is lowered to a certain height, the semiconductor element is inserted into the seating groove RS of the insert 242 The position and the posture are firstly corrected.

The gripping head 251 presses the semiconductor element and the insert 242 downward in the descending process so that the second calibration pin PP ₂ Is inserted into the second calibration hole PH ₂ . As a result, the semiconductor element is electrically connected to the test socket TS with the insert 242 and the position of the semiconductor element secondarily and precisely calibrated. Of course, also at this time, the insert 242 and the semiconductor elements are individually position controlled.

Even if the coupling plate 241 is tightly fixed to the socket plate SP, only the upper end portion of the first calibration pin PP ₁ is inserted into the first calibration hole PH ₁ as shown in FIG. 11 . According to this example, the semiconductor element is firstly positioned and postured while being seated in the seating groove RS of the insert 242, and the semiconductor element seated on the insert 242 is pressed downward, The position is secondarily corrected by the first correcting pin PP ₁ and the first correcting hole PH ₁ and then the position is finely positioned by the second correcting pin PP ₂ and the second correcting hole PH ₂ Lt; / RTI &gt; That is, according to the present invention, various examples can be presented for precisely calibrating the position of a semiconductor device through two or more steps using an individually movable insert 242.

On the other hand, although 16 semiconductor elements are tested at one time in this embodiment, the present invention can be preferably applied if at least one semiconductor element is tested at a time. Of course, the number of pickers, the number of inserts, and the number of test sockets will be the same as the number of semiconductor devices tested at once.

In addition, although the present embodiment has described only one shuttle as an example, the present invention can be preferably applied even when a plurality of shuttles and a plurality of gripping heads are constituted as in the 10-2012-0110424 application filed by the applicant .

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the present invention is to be construed as being limited only by the following claims and their equivalents.

200: Handler for semiconductor device test
240: contact induction machine
241: engaging plate
241a: Coupling frame 241b: Removable frame
242: insert
RS: seat groove
PH ₁ : first calibration hole PH ₂ : second calibration hole
243: elastic member
250: element feeder
SP: Socket plate
TS: Test socket
PP ₁ : first calibration pin PP ₂ : second calibration pin

Claims (7)

A contact inducing member coupled with the socket plate of the tester to guide the semiconductor device into electrical contact with the test socket provided in the socket plate; And
An element feeder for supplying the semiconductor element with the contact induction unit; Lt; / RTI &gt;
The contact induction device includes:
A coupling plate coupled with the socket plate;
An insert having a seating groove that is horizontally movably installed on the coupling plate so as to correspond to the test socket in a one-to-one correspondence relationship and on which a semiconductor device supplied by the device feeder is seated; And
An elastic member for elastically supporting the insert upward so that the insert can be lowered relative to the test socket when the element feeder presses down the semiconductor element seated on the insert; Containing
Handler for testing semiconductor devices. The method according to claim 1,
Wherein the insert has a first calibration hole and a second calibration hole for calibrating a position with respect to the test socket,
A first calibration pin provided in the test socket is inserted into the first calibration hole to primarily correct the position of the insert,
A second calibration pin provided in the test socket is inserted into the second calibration hole when the semiconductor device mounted on the insert is pressed downward by the device feeder, and the position of the insert is secondarily calibrated
Handler for testing semiconductor devices. 3. The method of claim 2,
Wherein the semiconductor element to be supplied to the insert by the element feeder is firstly positionally corrected by the mounting groove and is secondarily calibrated by the second calibrating hole and the second calibrating pin
Handler for testing semiconductor devices. 3. The method of claim 2,
Wherein the diameter of the second hole is smaller than the diameter of the first hole
Handler for testing semiconductor devices. 5. The method of claim 4,
The first calibrating pin is inserted into the first calibrating hole and the center of the second calibrating pin is calibrated to a position where it can be inserted into the second calibrating hole
Handler for testing semiconductor devices. 3. The method of claim 2,
The height of the second caliper pin is lower than the height of the first caliper pin,
Wherein the first calibration pin is inserted into the first calibration hole at least at an upper end thereof in a state in which the insert is raised,
Handler for testing semiconductor devices. The method according to claim 1,
The coupling plate
A coupling frame coupled to the socket plate; And
A detachable frame detachably coupled to the coupling frame, the detachable frame having the insert fluidly installed therein; Containing
Handler for testing semiconductor devices.

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