KR20160139049A - 숫돌 및 그것을 이용한 연삭·연마 장치 - Google Patents
숫돌 및 그것을 이용한 연삭·연마 장치 Download PDFInfo
- Publication number
- KR20160139049A KR20160139049A KR1020167032878A KR20167032878A KR20160139049A KR 20160139049 A KR20160139049 A KR 20160139049A KR 1020167032878 A KR1020167032878 A KR 1020167032878A KR 20167032878 A KR20167032878 A KR 20167032878A KR 20160139049 A KR20160139049 A KR 20160139049A
- Authority
- KR
- South Korea
- Prior art keywords
- grindstone
- grinding
- polishing
- workpiece
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
도 2는, 본 발명에 이용하는 숫돌 기둥의 구조를 나타낸 모식도이다.
도 3은, 본 발명의 숫돌의 실시형태를 예시하는 사시도이다.
도 4는, 본 발명의 연삭·연마 장치의 실시형태를 예시하는 도면이다.
도 5는, 본 발명의 효과를 나타낸 도면이다.
3: 지립 4: 결합재
5: 기공 10: 숫돌
11: 가공면 12: 기단면
15: 연삭·연마층 16: 숫돌기부
17, 18: 유체유로 19: 급배구
20: 숫돌 홀더 22: 숫돌 회전 샤프트
25: 진공 펌프 29: 가압 펌프
31: 진공척 L: 숫돌 기둥의 축
D: 숫돌 기둥의 직경 S: 숫돌 기둥의 간격
W: 피가공물
Claims (1)
- 피가공물을 연삭·연마하는 숫돌로서,
상기 피가공물을 연삭·연마하는 지립 및 결합재로 이루어지고, 연삭·연마하는 면의 깊이 방향으로 축(L)을 가지고 평행하게 배치된 다수의 기둥으로 이루어지는 숫돌 기둥과, 당해 숫돌 기둥과 일체로 형성되는 숫돌 매트릭스를 가지고, 상기 숫돌 기둥과 숫돌 매트릭스는 모두 지립과 결합재로 이루어지며,
상기 숫돌 기둥 및 숫돌 매트릭스는 기공률 20∼60체적%의 다공체이고, 당해 기공을 통해 진공 펌프 등의 진공 장치를 이용하여 상기 기공을 통해 피가공물을 흡인하여, 숫돌 기둥과의 거리를 가깝게 하여 접촉시킴으로써 연삭 효율을 향상 시키고, 또한, 피가공물과 숫돌의 사이에 냉각액, 기체, 화학 연마제를 가지는 슬러리 또는 이들의 혼합물을 주입하여 숫돌과 피연삭물의 거리를 제어하여, 적절한 래핑 및 연마를 가능하게 하여, 연삭 공정, 래핑 공정, 연마 공정을 동일한 숫돌로 행하는 것을 특징으로 하는 숫돌.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2012-232441 | 2012-10-20 | ||
JP2012232441A JP5373171B1 (ja) | 2012-10-20 | 2012-10-20 | 砥石およびそれを用いた研削・研磨装置 |
PCT/JP2013/076164 WO2014061423A1 (ja) | 2012-10-20 | 2013-09-27 | 砥石およびそれを用いた研削・研磨装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157007093A Division KR20150045494A (ko) | 2012-10-20 | 2013-09-27 | 숫돌 및 그것을 이용한 연삭·연마 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160139049A true KR20160139049A (ko) | 2016-12-06 |
Family
ID=49954930
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157007093A Ceased KR20150045494A (ko) | 2012-10-20 | 2013-09-27 | 숫돌 및 그것을 이용한 연삭·연마 장치 |
KR1020167032878A Ceased KR20160139049A (ko) | 2012-10-20 | 2013-09-27 | 숫돌 및 그것을 이용한 연삭·연마 장치 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157007093A Ceased KR20150045494A (ko) | 2012-10-20 | 2013-09-27 | 숫돌 및 그것을 이용한 연삭·연마 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10414020B2 (ko) |
JP (1) | JP5373171B1 (ko) |
KR (2) | KR20150045494A (ko) |
CN (1) | CN104736300B (ko) |
TW (1) | TWI513548B (ko) |
WO (1) | WO2014061423A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6564624B2 (ja) * | 2015-06-10 | 2019-08-21 | 株式会社ディスコ | 研削砥石 |
JP6302889B2 (ja) * | 2015-06-29 | 2018-03-28 | 株式会社ナノテム | 砥石 |
JP6687231B2 (ja) | 2015-07-15 | 2020-04-22 | 三井研削砥石株式会社 | 研磨工具及びその製造方法並びに研磨物の製造方法 |
TWI577505B (zh) * | 2015-10-22 | 2017-04-11 | China Grinding Wheel Corp | A wheel with internal supply of fluid structure |
KR101681497B1 (ko) | 2015-11-20 | 2016-12-01 | (주)승진기계 | 연마용 숫돌 |
CN109890563A (zh) * | 2016-10-19 | 2019-06-14 | 纳腾股份有限公司 | 磨石 |
TWI705874B (zh) * | 2016-10-28 | 2020-10-01 | 日商納騰股份有限公司 | 磨石 |
CN113329846B (zh) * | 2019-02-01 | 2024-01-02 | 株式会社则武 | 高硬质脆性材料用金属结合剂磨石 |
CN112091806A (zh) * | 2020-07-31 | 2020-12-18 | 浙江工业大学 | 一种氧化锆陶瓷半球化学辅助力流变抛光方法 |
CN111975622A (zh) * | 2020-07-31 | 2020-11-24 | 浙江工业大学 | 一种陶瓷半球化学辅助力流变抛光加工装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63150163A (ja) | 1986-12-12 | 1988-06-22 | Genichi Sato | 研削砥石 |
JPS6440279A (en) | 1987-08-04 | 1989-02-10 | Toshiba Corp | Abrasive fixed type polishing tool member |
JP2000198073A (ja) | 1999-01-05 | 2000-07-18 | Disco Abrasive Syst Ltd | 研磨砥石 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3426486A (en) * | 1964-11-16 | 1969-02-11 | Landis Tool Co | Abrasive disc |
JPS5432895U (ko) * | 1977-08-10 | 1979-03-03 | ||
JPS5851074A (ja) * | 1981-09-17 | 1983-03-25 | Komatsu Ltd | 超砥粒研削砥石の製造方法 |
JPS59156669A (ja) * | 1983-02-21 | 1984-09-05 | Sumitomo Electric Ind Ltd | ソ−ブレ−ド用セグメント |
JPS6056468U (ja) * | 1983-09-26 | 1985-04-19 | クレノ−トン株式会社 | 両頭平面研削盤用といし |
JPH01193174A (ja) * | 1988-01-27 | 1989-08-03 | Toshiba Corp | 研摩砥石 |
JP3167097B2 (ja) * | 1995-08-28 | 2001-05-14 | アイオン株式会社 | 両面砥石ラッピング装置 |
US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
CN1060424C (zh) * | 1997-08-26 | 2001-01-10 | 汪宁 | 用于化学-机械抛光的抛光盘及其制造方法 |
US5942015A (en) * | 1997-09-16 | 1999-08-24 | 3M Innovative Properties Company | Abrasive slurries and abrasive articles comprising multiple abrasive particle grades |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
JP2001138244A (ja) * | 1999-08-17 | 2001-05-22 | Mitsubishi Materials Corp | レジンボンド砥石 |
JP2001088017A (ja) * | 1999-09-22 | 2001-04-03 | Mitsui Kensaku Toishi Kk | ペレット状研削砥石担持工具及びそれを用いた研削装置 |
US6454644B1 (en) * | 2000-07-31 | 2002-09-24 | Ebara Corporation | Polisher and method for manufacturing same and polishing tool |
JP4490036B2 (ja) * | 2000-10-24 | 2010-06-23 | 鴻海精密工業股▲ふん▼有限公司 | 研磨工具およびその製造用組成物 |
JP4167009B2 (ja) * | 2002-05-28 | 2008-10-15 | 株式会社ディスコ | 砥石 |
US7494519B2 (en) * | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
JP4292179B2 (ja) * | 2005-10-27 | 2009-07-08 | 株式会社ナノテム | 砥石 |
US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
JP4948920B2 (ja) * | 2006-06-28 | 2012-06-06 | 京セラ株式会社 | 真空チャック及びこれを用いた真空吸着装置 |
-
2012
- 2012-10-20 JP JP2012232441A patent/JP5373171B1/ja not_active Expired - Fee Related
-
2013
- 2013-09-27 CN CN201380054808.1A patent/CN104736300B/zh not_active Expired - Fee Related
- 2013-09-27 KR KR1020157007093A patent/KR20150045494A/ko not_active Ceased
- 2013-09-27 US US14/433,956 patent/US10414020B2/en not_active Expired - Fee Related
- 2013-09-27 WO PCT/JP2013/076164 patent/WO2014061423A1/ja active Application Filing
- 2013-09-27 KR KR1020167032878A patent/KR20160139049A/ko not_active Ceased
- 2013-10-18 TW TW102137676A patent/TWI513548B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63150163A (ja) | 1986-12-12 | 1988-06-22 | Genichi Sato | 研削砥石 |
JPS6440279A (en) | 1987-08-04 | 1989-02-10 | Toshiba Corp | Abrasive fixed type polishing tool member |
JP2000198073A (ja) | 1999-01-05 | 2000-07-18 | Disco Abrasive Syst Ltd | 研磨砥石 |
Also Published As
Publication number | Publication date |
---|---|
TWI513548B (zh) | 2015-12-21 |
US20150258656A1 (en) | 2015-09-17 |
CN104736300A (zh) | 2015-06-24 |
JP2014083611A (ja) | 2014-05-12 |
US10414020B2 (en) | 2019-09-17 |
TW201424938A (zh) | 2014-07-01 |
KR20150045494A (ko) | 2015-04-28 |
CN104736300B (zh) | 2018-06-29 |
WO2014061423A1 (ja) | 2014-04-24 |
JP5373171B1 (ja) | 2013-12-18 |
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