KR20160091493A - Fingerprint sensor module and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a fingerprint sensor module and a method of manufacturing the same.
A fingerprint sensor module according to the present invention includes: a fingerprint sensor package having a sensing electrode formed on an upper portion of a base substrate and a fingerprint sensor chip mounted on a lower surface of the base substrate; A substrate on which the fingerprint sensor package is mounted and a dome switch on the bottom; And a flexible substrate integrally extended on one side of the substrate.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a fingerprint sensor module,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a fingerprint sensor module and a method of manufacturing the same, and more particularly, to a fingerprint sensor module and a method of manufacturing the same.

In recent years, personal information security has become a priority, and fingerprint sensors are being employed to enhance security performance in portable electronic devices such as smart phones and tablet PCs that individuals possess and use.

In addition, fingerprint sensors are used in storage devices such as smart cards in which personal information and payment information are stored, in addition to portable electronic devices.

In particular, a fingerprint sensor applied to a portable electronic device is a sensor that detects a fingerprint of a finger, and registers a user of the portable electronic device through a fingerprint sensor and authenticates a registered user. Accordingly, data stored in the portable electronic device And other than the registered users, authentication can be prevented from occurring, thereby preventing a security incident in advance.

Such a fingerprint sensor can be classified into an optical sensor, an electric sensor, an ultrasonic sensor, a thermal sensation sensor, and the like according to the principle of detecting a fingerprint pattern of a finger. The fingerprint pattern data of the finger is acquired using each driving principle, .

On the other hand, the fingerprint sensor is sealed in a resin material such as EMC or the like and is formed in the form of a module and assembled to the main board. In this case, when the fingerprint sensor module is assembled to the main board, the fingerprint sensor module is electrically connected to the main board through the connector connected to the board on which the fingerprint sensor is mounted, thereby increasing the number of assembly operations.

In addition, the conventional fingerprint sensor module is disadvantageous in that the productivity is deteriorated as the fingerprint sensor is individually packaged on the rigid-flexible substrate (RF-PCB) connected to the main board.

Korean Patent Publication No. 2004-0086160

The present invention has been made to solve the above-mentioned problems and disadvantages of the conventional fingerprint sensor module, and it is an object of the present invention to provide a fingerprint sensor package which is mounted on a substrate by a surface mounting method, A fingerprint sensor module in which a substrate to be mounted is formed integrally with a main board through a flexible substrate and a method of manufacturing the fingerprint sensor module are provided.

The above object of the present invention is achieved by a fingerprint sensor package in which a fingerprint sensor package having a sensing electrode formed on an upper portion of a base substrate and a fingerprint sensor chip mounted on a lower surface of the base substrate is formed, And a fingerprint sensor module coupled to the fingerprint sensor module by surface mounting.

The flexible board is integrally extended on one side of the board, and the other side of the flexible board is connected to the main board to provide flexibility. The fingerprint sensor module may be bent on the main board so that the dome switch provided on the fingerprint sensor module may contact the upper surface of the main board.

In the fingerprint sensor package, a molding part having a connection part is formed on a lower surface of the base substrate, a connection part is connected to the connection part, and a protection layer is covered on the upper surface of the base substrate.

Another object of the present invention is to provide a method of manufacturing a semiconductor device, Forming a sensing electrode on the base substrate and mounting a fingerprint sensor chip on a bottom surface of the base substrate; Forming a molding on a lower surface of the base substrate; Forming a connection portion in the shape of a groove in the molding portion and inserting a solder ball into the connection portion; Forming a protective layer on an upper surface of the base substrate; Forming a fingerprint sensor package by cutting the base substrate on which the protective layer and the molding part are formed; And mounting the fingerprint sensor package on the upper surface of the substrate by a surface mounting method.

INDUSTRIAL APPLICABILITY As described above, the fingerprint sensor module and the method of manufacturing the same according to the present invention can simplify the manufacturing process of the fingerprint sensor module and improve the manufacturing productivity, since the fingerprint sensor package is individually mounted on the substrate.

In addition, since the fingerprint sensor package of the present invention is separately mounted on the substrate, only the fingerprint sensor package can be separated from the substrate and replaced when defective assembly or defect occurs in the fingerprint sensor package.

In the present invention, since the substrate of the fingerprint sensor module and the main board are not connected to each other through the connector and the flexible substrate is integrally formed and electrically connected, the I / O can be increased, and noise .

1 is a sectional view of a fingerprint sensor module according to the present invention;
2 is an assembled sectional view of a fingerprint sensor module according to the present invention.
3 is a cross-sectional view illustrating various embodiments of the fingerprint sensor module according to the present invention,
3A is a structure coupled through a metal post,
3B is a structure in which a re-wiring layer is formed in a molding part and is coupled through a solder ball,
Figure 3c is a cross-sectional view of the structure bonded through bumps using copper plating.
4 is a front sectional view showing a main board bonding structure of the fingerprint sensor module according to the present invention.
FIG. 5 is a side cross-sectional view illustrating the main board bonding structure of the fingerprint sensor module according to the present invention. FIG.
6 to 12 are cross-sectional process diagrams illustrating a method of manufacturing a fingerprint sensor module according to the present invention,
6 is a cross-sectional view of the fingerprint sensor chip in a state in which the fingerprint sensor chip is flip-
7 is a cross-sectional view of the base substrate with the molding part formed thereon.
8 is a cross-sectional view of a state in which a solder ball is mounted by exposing an electrode of a base material.
9 is a cross-sectional view of the base substrate with a protective layer formed thereon.
10 is a cross-sectional view of a fingerprint sensor package in which a base substrate is individually cut.
11 and 12 are cross-sectional views before and after a fingerprint sensor package is mounted on a substrate.

The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as excluding the presence or addition of the mentioned forms, numbers, steps, operations, elements, elements and / It is not.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements have the same numerical numbers as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. The terms first, second, etc. in this specification are used to distinguish one element from another element, and the element is not limited by the terms.

The matters relating to the functional effects of the fingerprint sensor module and the method of manufacturing the same according to the present invention, including the technical structure of the above object, will be clearly understood by the detailed description with reference to the following drawings, in which a preferred embodiment of the present invention is shown.

1 is a cross-sectional view of a fingerprint sensor module according to the present invention, and FIG. 2 is an assembled cross-sectional view of a fingerprint sensor module according to the present invention.

The fingerprint sensor module 100 of the present embodiment includes a fingerprint sensor package 110 on which a fingerprint sensor chip 113 is mounted and a substrate 120 to which the fingerprint sensor package 110 is coupled.

The fingerprint sensor package 110 includes a base substrate 111 having a sensing electrode 112 at an upper portion thereof, a fingerprint sensor chip 113 mounted on the base substrate 111, and a mold surrounding the fingerprint sensor chip 113 (114). ≪ / RTI > The fingerprint sensor package 110 may further include a protective layer 115 that is covered on the sensing electrode 112 of the base substrate 111 and a bracket 117 that surrounds the side surface of the base substrate and the molding portion .

The substrate 120 on which the fingerprint sensor package 110 is mounted may be a printed circuit board (PCB). The substrate 120 is provided with an electrical connection means 122 on a pad 121 formed on an upper surface thereof and a dome switch 123 mounted on a lower surface thereof.

The fingerprint sensor package 110 is mounted on the substrate 120 via an electrical connection means 122 in a surface mount (SMT) manner. The fingerprint sensor package 110 is fabricated in a wafer level state, 120), it is possible to simplify the manufacturing process of the fingerprint sensor module. In addition, since the fingerprint sensor package can be mass-produced at the wafer level, manufacturing productivity can be improved.

A sensing electrode 112 is provided on a base substrate 111 of the fingerprint sensor package 110 and a sensing electrode 112 is disposed on an upper portion of the base substrate 111. [ Or may be formed to be buried on the upper side in the base substrate 111. [ Here, the sensing electrode 112 senses the medium of a finger or the like by radiating a sensing signal to the upper portion. The sensing signal is an electrical signal including RF, which causes a difference in electrical characteristics between the peak and the valley of the fingerprint provided on the finger, and the difference in capacitance due to the height difference can be generated.

At this time, the sensing electrode 112 is protected by the protective layer 115 covering the entire upper surface of the base substrate 111. Further, the surface of the protective layer 115 may be formed with a colored or transparent coating layer (not shown) separately. This is to prevent the protection layer 115 from being exposed to the outside when the fingerprint sensor module 100 is mounted on the portable electronic device, thereby preventing corrosion due to the external environment.

A fingerprint sensor chip 113 is mounted on the bottom of the base substrate 111. The fingerprint sensor chip 113 is coupled to the base substrate 111 by a flip chip method and can be configured with an ASIC (Application Specific IC). The fingerprint sensor chip 113 is covered and protected by a molding part 114 using an epoxy molding compound (EMC). The molding part 114 is formed on the lower surface of the base substrate 111, except for the electrical connection part 114a, . At this time, the electrical connecting portion 114a of the molding portion 114 may be recessed in the form of a groove, and the connecting means 118 such as a solder ball may be coupled to the electrical connecting portion 114a.

The fingerprint sensor chip 113 processes registration and authentication by sensing signals sensed by the sensing electrode 112. The sensing electrode 112 and the vias 116 formed on the base substrate 111 (Not shown) including a plurality of circuits (not shown).

The fingerprint sensor package 110 configured in this way can be individually mounted on the substrate 120 by a surface mounting device (SMD) or an operator. Accordingly, only the fingerprint sensor package 110 can be removed from the substrate 120 when the fingerprint sensor module 100 is defective.

The fingerprint sensor package 110 may be mounted on the substrate 120 with the brackets 117 coupled to the side surfaces of the base substrate 111 and the molding part 114 to be fixed as a whole. The bracket 117 can prevent the molding portion 114 and the base substrate 111 from separating when the fingerprint sensor package 110 is mounted on the substrate 120 and the soldering operation is performed through the reflow apparatus.

The dome switch 123 is mounted on the lower surface of the substrate 120, and the flexible substrate 130 is connected to one side of the substrate 120. The substrate 120 is electrically connected to the main board mounted on the portable electronic device through the flexible substrate 130 and is electrically connected to the dome switch 123 ) To the main board. Here, the main board connection structure of the board 120 and the main board connection structure of the dome switch 123 will be described in detail with reference to the drawings shown in FIGS. 6 and 12 below.

The dome switch 123 mounted on the substrate 120 may have a predetermined elasticity and presses a pad of a main board or the like to generate a physical signal. The dome switch 123 may allow the fingerprint sensor module 100 to function as a home key in the portable electronic device when pressing the exposed portion of the fingerprint sensor package 110 to the outside.

The fingerprint sensor module configured as described above can be manufactured to have various types of coupling structures as shown in FIG. FIG. 3 is a cross-sectional view illustrating various embodiments of the fingerprint sensor module according to the present invention, wherein FIG. 3 (a) shows a structure coupled through a metal post, FIG. 3 (b) shows a structure in which a re- 3C is a cross-sectional view of the structure coupled through bumps using copper plating.

Referring to FIG. 3A, a metal post 125 is formed on a substrate 120 to which a fingerprint sensor package 110 is coupled. The metal posts 125 are preferably formed of a copper (Cu) material and are formed at positions corresponding to the positions where the connection portions 114a of the fingerprint sensor package 110 are formed. The metal posts 125 are inserted into the connection portions 114a of the molding portion 114 and are connected to the connection portions 114a when the reflow is performed while the fingerprint sensor package 110 is mounted on the substrate 120. [ The connecting means 118 is connected to the connecting means 118. [ Since the metal posts 125 protruding from the substrate 120 using the metal posts 125 and the fingerprint sensor package 110 are inserted into the connection portions 114a of the molding portion 114, The binding force between the fingerprint sensor package 120 and the fingerprint sensor package 110 can be enhanced.

3B, the rewiring layer 114b is formed on the molding part 114 of the fingerprint sensor package 110 mounted on the substrate 120 and the solder ball 118 So that the substrate 120 and the fingerprint sensor package 110 are bonded together. At this time, the re-distribution layer 114b may be formed by Cu plating after laser processing so that the electrode is exposed to the molding portion 114. A solder ball or the like is bonded to the re-distribution layer 114b exposed to the outside of the molding portion 114 So that the fingerprint sensor package 110 can be mounted on the substrate 120.

3C, a groove is formed in the molding part 114 using a laser or the like to expose the electrode, and the groove of the molding part 114 is subjected to a plating process, The solder ball 118 may be attached to the exposed portion of the bump 114c so that the bonding of the substrate 120 and the fingerprint sensor package 110 can be performed.

As described above, the fingerprint sensor module can be electrically connected to the main board through the flexible substrate integrally formed on the substrate, as described above.

FIG. 4 is a front sectional view showing a main board bonding structure of a fingerprint sensor module according to the present invention, and FIG. 5 is a side sectional view illustrating a main board bonding structure of a fingerprint sensor module according to the present invention.

1, the fingerprint sensor module 100 according to the present invention is assembled with a fingerprint sensor package 110 fixed on a board 120 surrounded by a bracket 117, and the fingerprint sensor module 100 is mounted on a main board 200). The fingerprint pattern of the finger placed on the protective layer 115 of the fingerprint sensor module 100 is sensed through the sensing electrode 112 of the base substrate 111. The sensed fingerprint sensing signal is transmitted to the fingerprint sensor chip 113, And transferred to the main board 200 to register and authenticate the portable electronic device.

The fingerprint sensor module 100 has a flexible substrate 130 integrally extended to one side of the substrate 110 and the other side of the flexible substrate 130 is connected to the main board 200. A substrate 120 constituting the fingerprint sensor module 100, a main board 200 to which the fingerprint sensor module 100 is connected, and a flexible board (not shown) electrically connecting the fingerprint sensor module 100 and the main board 200 130 is fabricated as an integrated type of RFPCB, that is, a rigid-flexible substrate, and the substrate 120 constituting the fingerprint sensor module 100 functions as a sub-substrate. The fingerprint sensor module 100 connected to the main board 200 can be manufactured by combining the fingerprint sensor package 110 on the substrate 120 connected to the main board 200 through the flexible substrate 130 have.

Accordingly, since the fingerprint sensor module 100 according to the present embodiment is electrically connected to the main board 200 without a separate connector, the number of parts to be manufactured can be reduced, thereby reducing the production cost. In addition, the I / O can be increased as the flexible substrate is integrally formed and electrically connected without connecting the substrate 120 of the fingerprint sensor module 100 and the main board 200 through the connectors, The noise can be reduced in the signal transmission.

Meanwhile, the main board 200 is mounted on a case of a portable electronic device, various devices 210 for operating the portable electronic device are mounted, and a USB port 220 for connection with an external device is coupled. The flexible board 130 connected to the main board 200 can be bent such that the board 120 on which the fingerprint sensor package 110 is mounted is positioned on one side of the main board 200 due to flexibility, The flexible substrate 130 is curved so that the fingerprint sensor module 100 is positioned on the upper surface side of the flexible substrate 130.

The fingerprint sensor module 100 connected to the flexible substrate 130 is disposed on the main board 200 and the dome switch 123 mounted on the bottom surface of the substrate 120 of the fingerprint sensor module 100 is connected to the main board 200. [ And contacts the switch pad 230 formed on the upper surface of the board 200. The dome switch 130 can be operated by pressing the switch pad 230 on the main board 200 by the pressure of the fingerprint sensor module 100 so that the fingerprint sensor module 100 can function as a home key or other function key .

A manufacturing method of the fingerprint sensor module configured as above will be described in more detail with reference to FIGS. 6 to 12 below.

6 to 12 are cross-sectional views illustrating a method of manufacturing a fingerprint sensor module according to the present invention. FIG. 6 is a cross-sectional view of a fingerprint sensor chip bonded to a base substrate by flip- 8 is a cross-sectional view of a state in which a solder ball is mounted by exposing an electrode of a base material, FIG. 9 is a cross-sectional view of a state in which a protective layer is formed on the base material, and FIG. 10 is a cross- 11 is a cross-sectional view of a cut fingerprint sensor package, and Figs. 11 and 12 are cross-sectional views before and after a fingerprint sensor package is mounted on a substrate.

The fingerprint sensor module of the present embodiment first prepares a wafer base 111 of a wafer level as shown in FIG. 6, and forms a sensing electrode 112 on the base substrate 111. The fingerprint sensor chip 113 is flip-chip bonded to the lower surface of the base substrate 111. The sensing electrode 112 of the base substrate 111 can be connected to the circuit in the base substrate via the via 116 and the fingerprint sensor chip 113 and the sensing electrode 112 can be electrically connected through the circuit. 6, the two base substrates 111 are connected to each other. However, this is for exemplarily showing that the base substrate is manufactured in a wafer level state. In actual production, two or more base substrates 111 May be connected in series.

Next, as shown in Fig. 7, the molding part 114 is formed on the lower surface of the base substrate 111. [ The molding part 114 may be formed to have a thickness enough to completely cover the fingerprint sensor chip 113 coupled to the lower surface of the base substrate 111 by EMC. The molding part 114 may protect the fingerprint sensor chip 113 coupled to the lower surface of the base substrate 111 from the external environment.

Next, as shown in FIG. 8, a connecting portion 114a is formed in the molding part 114 in the form of a groove on the bottom surface of the base substrate 111, and the solder ball 118 is inserted into the connecting part 114a. The connection portion 114a formed in the molding portion 114 can be processed mainly through a laser and the pad 119 formed on the base substrate 111 can be exposed through the connection portion 114 in the form of an electrode. The solder ball 118 inserted into the connection portion 114 is connected to the pad 119 and is employed as an electrical connection means.

Thereafter, as shown in FIG. 9, a protective layer 115 is formed on the upper surface of the base substrate 111. The protective layer 115 protects the surface of the base substrate 111 and the sensing electrode 112 from the external environment when the upper side of the fingerprint sensor module is exposed to the outside of the portable electronic device. In addition, a coating layer (not shown) may be additionally formed on the upper surface of the protective layer 115. The coating layer may be formed in the same color or transparent as the color of the portable electronic device as the protective layer 115 is exposed to the outside.

10, the base substrate 111, on which the protective layer 115 and the molding part 114 are formed, is cut along the dicing line and is constituted by the fingerprint sensor package 110. As shown in FIG. 11, the bracket 117 is coupled to the side surface of the fingerprint sensor package 110, and the base substrate 111 and the molding part 114 are fixed to the upper surface of the substrate 120, And is mounted by a mounting method (SMT). Thereafter, the fingerprint sensor package 110 is reflowed to the substrate 120, and the fabrication of the fingerprint sensor module 100 is completed as shown in FIG.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes, substitutions and alterations can be made therein without departing from the spirit and scope of the invention. However, it should be understood that such substitutions, changes, and the like fall within the scope of the following claims.

100. Fingerprint sensor module
110. Fingerprint Sensor Package
111. Base substrate
112. Sensing electrode
113. Fingerprint Sensor Chip
114. Molding part
115. Protective layer
116. Via
117. Bracket
118. Solderball
120. Substrate
121. The pad
122. Solderball
123. Dome Switch
130. A flexible substrate
200. Motherboard

Claims (13)

A fingerprint sensor package having a sensing electrode formed on an upper portion of a base substrate and a fingerprint sensor chip mounted on a lower surface of the base substrate;
A substrate on which the fingerprint sensor package is mounted and a dome switch on the bottom; And
A flexible substrate integrally extended on one side of the substrate;
And a fingerprint sensor module.
The method according to claim 1,
Wherein the fingerprint sensor package has a molding part formed with a connection part on the lower surface of the base substrate, and the connection part is coupled to the connection part.
3. The method of claim 2,
The fingerprint sensor module according to claim 1, wherein the fingerprint sensor package has a protective layer on an upper surface of the base substrate, and a coating layer is further formed on the protective layer.
3. The method of claim 2,
Wherein the flexible substrate is connected to the substrate on one side thereof and is connected to the main board to be flexible, and the dome switch provided on the fingerprint sensor module is curved so that the fingerprint sensor module is positioned on the main board, And the fingerprint sensor module is in contact with the upper surface of the main board.
5. The method of claim 4,
Wherein the main board, the substrate, and the flexible substrate are integrally connected to each other, and the fingerprint sensor package is mounted on the substrate by surface mounting.
3. The method of claim 2,
Wherein the fingerprint sensor package further comprises a bracket surrounding the base substrate and a side surface of the molding part.
The method according to claim 6,
Wherein the substrate and the fingerprint sensor package are surface-mounted by a solder ball, a metal post, a re-wiring layer, or a connecting means of at least one of bumps.
5. The method of claim 4,
Wherein the dome switch functions as a home key or other function key by being pressed against the switch pad of the main board.
Preparing a base substrate of a wafer level;
Forming a sensing electrode on the base substrate and mounting a fingerprint sensor chip on a bottom surface of the base substrate;
Forming a molding on a lower surface of the base substrate;
Forming a connection portion in the shape of a groove in the molding portion and inserting a solder ball into the connection portion;
Forming a protective layer on an upper surface of the base substrate;
Forming a fingerprint sensor package by cutting the base substrate on which the protective layer and the molding part are formed; And
And mounting the fingerprint sensor package on a top surface of the substrate by a surface mounting method.
10. The method of claim 9,
In the step of forming the protective layer,
And forming a transparent or colored coating layer on the top surface of the protective layer.
11. The method of claim 10,
In mounting the fingerprint sensor package on the upper surface of the substrate,
A fingerprint sensor module for mounting the fingerprint sensor package on the substrate after positioning the substrate on an upper portion of the main board when the flexible substrate is curved and connected to the main board through a flexible substrate, ≪ / RTI >
10. The method of claim 9,
After the step of cutting the base substrate to form the fingerprint sensor package,
And attaching a bracket to a side surface of the fingerprint sensor package.
10. The method of claim 9,
In mounting the fingerprint sensor package on the upper surface of the substrate,
Wherein the substrate and the fingerprint sensor package are surface-mounted by a solder ball, a metal post, a rewiring layer, or a connecting means of at least one of bumps.

Images