KR20160071579A - Organic layer deposition assembly, apparatus for organic layer deposition comprising the same, and method for manufacturing of organic light emitting display apparatus using the same - Google Patents

Abstract

An embodiment of the present invention discloses an organic layer deposition assembly for depositing a deposition material on a substrate. The organic layer deposition assembly includes: a deposition source which discharges the deposition material; a deposition nozzle unit which is placed on one side of the deposition source and comprises multiple deposition nozzles; and a patterning slit sheet which is placed opposite to the deposition nozzle unit and has multiple patterning slits. The substrate is formed so that the substrate is separated from the organic layer deposition assembly by a predetermined distance, and capable of relatively moving with respect to the organic layer deposition assembly. The deposition material discharged from the deposition source passes through the patterning slit sheet and is deposited on the substrate, forming a pattern on the substrate. The patterning slits have multiple openings through which the deposition material passes and ribs formed between the openings. The widths of the ribs are in a range of 0.6 to 0.7 mm.

Description

[0001] The present invention relates to an organic layer deposition assembly, an organic layer deposition apparatus including the organic layer deposition assembly, and a manufacturing method of the organic light emitting display apparatus using the organic layer deposition assembly.

Embodiments of the present invention relate to an apparatus and method, and more particularly, to an organic layer deposition assembly, an organic layer deposition apparatus including the organic layer deposition assembly, and a method of manufacturing an organic light emitting display using the same.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

The organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer can be formed by various methods, one of which is the independent deposition method. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of an organic layer to be formed is closely contacted to a substrate surface on which an organic layer or the like is to be formed, A material is deposited to form an organic layer of a predetermined pattern.

However, the method using such a fine metal mask has a limitation that it is not suitable for large-sized organic light emitting display device using a large mother-glass. This is because, when a large area mask is used, the mask is warped due to its own weight, and distortion of the pattern due to the warping phenomenon may occur. This is also arranged with the current tendency to require fixed tax on the pattern.

Further, there is a problem that it takes a considerable time to separate the substrate and the fine metal mask from each other, and then takes a long time to manufacture and lowers the production efficiency .

The above-described background technology is technical information that the inventor holds for the derivation of the present invention or acquired in the process of deriving the present invention, and can not necessarily be a known technology disclosed to the general public prior to the filing of the present invention.

Embodiments of the present invention provide an organic layer deposition assembly, an organic layer deposition apparatus including the organic layer deposition assembly, and a method of manufacturing an organic light emitting display device using the same.

One embodiment of the present invention is an organic layer deposition assembly for depositing a deposition material on a substrate, comprising: an evaporation source for emitting a deposition material; an evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles And a patterning slit sheet disposed to face the evaporation source nozzle portion and having a plurality of patterning slits formed therein, the substrate being formed to be spaced apart from the organic layer deposition assembly to be relatively movable with respect to the organic layer deposition assembly , The deposition material emitted from the evaporation source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate, the plurality of patterning slits extend in the longitudinal direction of the patterning slit, and a plurality of A plurality of openings arranged continuously to allow the deposition material to pass therethrough, Includes a plurality of ribs formed in a space spaced apart in the longitudinal direction of the slit pattern between the width of each rib discloses an organic layer deposition assemblies, characterized in that 0.65mm.

In the present embodiment, the patterning slit sheet may be formed to be smaller than the substrate in at least one of a first direction, which is a longitudinal direction of the patterning slit sheet, and a second direction, which is a width direction of the patterning slit sheet .

In this embodiment, a plurality of patterning slits are formed in the patterning slit sheet along a first direction which is the lengthwise direction of the patterning slit sheet, and a plurality of evaporation slits are formed in the evaporation source nozzle portion along a second direction in the width direction of the patterning slit sheet. And circular nozzles are formed.

In the present embodiment, the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet may be integrally formed by a coupling member.

In this embodiment, the connecting member guides the movement path of the evaporation material.

In this embodiment, the connecting member may be formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside.

According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, including: a moving unit configured to move a substrate with a fixed substrate, the moving unit moving the moving unit in a first direction; A loading section for fixing the substrate to the moving section, a chamber for holding the vacuum, and a substrate fixed to the moving section transferred from the loading section, wherein the organic layer And an unloading section for separating the substrate from which the deposition has been completed while passing through the deposition section from the moving section, wherein the moving section is capable of circulating between the first transfer section and the second transfer section And the substrate fixed to the moving part is formed to be spaced apart from the organic layer deposition assembly by a predetermined distance while being moved by the first transfer part A plurality of patterning slits extending in the longitudinal direction of the patterning slit and having a plurality of openings through which a plurality of deposition materials are passed in a longitudinal direction and a width direction of the patterning slit, And a plurality of ribs formed in a space spaced in the longitudinal direction, wherein the width of each of the ribs is 0.65 mm.

In this embodiment, the first transfer unit and the second transfer unit may be configured to pass through the vapor deposition unit when passing through the vapor deposition unit.

In the present embodiment, the first conveying portion and the second conveying portion may be arranged vertically side by side.

In this embodiment, the first transfer unit may be configured to sequentially move the moving unit to the loading unit, the deposition unit, and the unloading unit.

In this embodiment, the second transfer unit may sequentially move the moving unit to the unloading unit, the deposition unit, and the loading unit.

In the present embodiment, the patterning slit sheet may be formed to be smaller than the substrate in at least one of a first direction, which is a longitudinal direction of the patterning slit sheet, and a second direction, which is a width direction of the patterning slit sheet .

In this embodiment, a plurality of patterning slits are formed in the patterning slit sheet along a first direction which is the lengthwise direction of the patterning slit sheet, and a plurality of evaporation slits are formed in the evaporation source nozzle portion along a second direction in the width direction of the patterning slit sheet. And circular nozzles are formed.

In the present embodiment, the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet may be integrally formed by a coupling member.

In this embodiment, the connecting member guides the movement path of the evaporation material.

In this embodiment, the connecting member may be formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside.

According to another embodiment of the present invention, there is provided a method of manufacturing an organic light emitting display device using an organic layer deposition apparatus for forming an organic layer on a substrate, comprising the steps of fixing a substrate to a moving section in a loading section, Transferring the substrate from the organic layer deposition assembly to the organic layer deposition assembly while relatively moving the substrate relative to the organic layer deposition assembly with the organic layer deposition assembly disposed within the chamber and the substrate being spaced apart a predetermined distance, Depositing a deposited material on the substrate to form an organic layer; separating the deposited substrate from the moving part in the unloading part; and moving the separated moving part to the substrate using a second transfer part installed to penetrate the chamber Transporting the deposition material to the loading portion, wherein the organic layer deposition assembly comprises: And a patterning slit sheet disposed to face the evaporation source nozzle unit and having a plurality of patterning slits formed therein, wherein the patterning slit sheet is disposed on one side of the evaporation source and includes a plurality of evaporation source nozzles, The substrate is formed so as to be spaced apart from the organic layer deposition assembly so as to be relatively movable with respect to the organic layer deposition assembly, and the deposition material emitted from the deposition source passes through the patterning slit sheet to form a pattern on the substrate, A plurality of patterning slits extending in the longitudinal direction of the patterning slit and having a plurality of openings through which the deposition material is continuously arranged in a longitudinal direction and a width direction of the patterning slit and a plurality of openings through which the length of the patterning slit A plurality of ribs formed in a space spaced apart from each other, Width discloses a method of manufacturing an organic light emitting display device, characterized in that 0.65mm.

In this embodiment, a plurality of organic layer deposition assemblies are provided in the chamber, and the deposition can be continuously performed on the substrate by the respective organic layer deposition assemblies.

In this embodiment, the moving unit may be configured to circulate between the first conveying unit and the second conveying unit.

In the present embodiment, the first conveying portion and the second conveying portion may be arranged vertically side by side.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

The organic layer deposition assembly, the organic layer deposition apparatus including the organic layer deposition assembly, and the method of manufacturing the organic light emitting display device using the same according to embodiments of the present invention are more suitable for mass production of a large substrate and can improve the occurrence of stains on the substrate.

1 illustrates an organic layer deposition assembly in accordance with an embodiment of the present invention.
Figure 2 is an enlarged view of a patterning slit sheet of the organic layer deposition assembly of Figure 1;
3 is a perspective view schematically illustrating a deposition section including the organic layer deposition assembly of FIG.
4 is a schematic cross-sectional view of the deposition section of FIG.
5 is a plan view of a system configuration schematically showing an organic layer deposition apparatus including the deposition unit of FIG.
6 is a side view of a system configuration schematically showing the organic layer deposition apparatus of FIG.
FIG. 7 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms. In the following embodiments, the terms first, second, and the like are used for the purpose of distinguishing one element from another element, not the limitative meaning. Also, the singular expressions include plural expressions unless the context clearly dictates otherwise. Also, the terms include, including, etc. mean that there is a feature, or element, recited in the specification and does not preclude the possibility that one or more other features or components may be added.

Also, in the drawings, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings. Also, if an embodiment is otherwise feasible, the particular process sequence may be performed differently than the sequence described. For example, two processes that are described in succession may be performed substantially concurrently, and may be performed in the reverse order of the order described.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

FIG. 1 is a view showing an organic layer deposition assembly 100-1 according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a patterning slit sheet 130 of the organic layer deposition assembly 100-1 of FIG. 1 to be.

Referring to FIG. 1, an organic layer deposition assembly 100-1 according to an embodiment of the present invention includes an evaporation source 110, an evaporation source nozzle unit 120, and a patterning slit sheet 130.

The evaporation source 110 includes a crucible 111 filled with an evaporation material 115 and a deposition material 115 filled in the crucible 111 by heating the crucible 111 to the evaporation source nozzle portion And a heater 112 for evaporating the refrigerant to the evaporator 120 side.

An evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110 and a plurality of evaporation source nozzles 121 are formed on the evaporation source nozzle unit 120 along the Y axis direction.

A patterning slit sheet 130 and a frame 135 are further provided between the evaporation source 110 and the substrate 600. The patterning slit sheet 130 is provided with a plurality of patterning slits 131 And spacers 132 are formed.

The deposition source 110, the evaporation source nozzle unit 120, and the patterning slit sheet 130 are coupled by the connecting member 140.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 600. A plurality of evaporation source nozzles 121 are formed in the evaporation source nozzle unit 120 along the Y axis direction, that is, the scanning direction of the substrate 600.

Here, the plurality of evaporation source nozzles 121 may be equally spaced. The evaporated material 115 vaporized in the evaporation source 1100 passes through the evaporation source nozzle unit 120 and is directed toward the substrate 600 as a deposition target. As a result, a plurality of evaporation source nozzles 121 are formed along the scanning direction of the substrate 600 in one organic layer deposition assembly 100-1.

In this case, if a plurality of evaporation source nozzles 121 are provided in the X-axis direction, the distances between the evaporation source nozzles 121 and the patterning slits 131 are different from each other. At this time, A shadow is generated by the evaporation material emitted from the evaporation source nozzle 121 farther away.

Therefore, by forming the evaporation source nozzle 121 so that only one evaporation source nozzle 121 exists in the X-axis direction as in the present invention, generation of shadows can be greatly reduced. In addition, since a plurality of evaporation source nozzles 121 exist in the scanning direction, even if a flux difference between the individual evaporation source nozzles occurs, the difference is canceled, and the uniformity of deposition is maintained constant.

Next, the patterning slit sheet 130 disposed between the evaporation source 110 and the substrate 600 has patterning slits 131 and spacers 132 arranged side by side along the X-axis direction. 2, a portion of the patterning slit sheet 130 is enlarged. Each of the patterning slits 131 has a plurality of openings 133 (not shown) extending in the longitudinal direction of the patterning slits 131, And a plurality of ribs 134 formed in spaces spaced apart from each other in the longitudinal direction of the patterning slit 131 between the openings 133, that is, the Y-axis direction.

A plurality of openings 133 may be continuously arranged in the X-axis direction which is the width direction of the patterning slit 131 and a plurality of the openings 133 may be continuously arranged in the Y-axis direction of the patterning slit 131 have. Accordingly, a space separating the openings 133 is formed between the openings 133, which are continuously spaced apart from each other in the Y-axis direction, and this space is the rib 134.

The relationship between the width W of the rib 134 and the film uniformity of the deposition material deposited on the substrate 600 and the deposition accuracy (pixel per accuracy, PPA) will be described below, Will be described. Here, the deposition accuracy, that is, the PPA, is an index indicating whether or not the deposition material is accurately deposited as designed on the substrate 600, and is one criterion for determining the deposition accuracy.

The patterning slit sheet 130 engages with the frame 135 while being stretched in the Y-axis direction. This is to prevent the shadow region from being deposited on the substrate during the deposition process by arranging the patterning slit sheet 130 as flat as possible.

However, if the rigidity of the patterning slit sheet 130 is not sufficiently secured, deformation may occur in the shape of the patterning slit 131 of the patterning slit sheet 130 due to stretching in the Y-axis direction. When the patterning slit 131 is deformed in this manner, the deposition accuracy may be lowered.

Therefore, in order not to lower the deposition accuracy, it is necessary to minimize the deformation of the patterning slit 131 due to the tensile force in the Y-axis direction.

The rib 134 is formed to extend in the X axis direction between the plurality of openings 133 formed to extend in the Y axis direction in the patterning slit 131 and has a plurality of openings 133 ).

The greater the widths W of the ribs 134 and the greater the width W of the ribs 134 are, the more the tensile force in the Y-axis direction can be obtained. Accordingly, the deformation of the patterning slit 131 It can also be reduced. As a result, deposition accuracy can be improved by depositing the deposition material on the substrate 600 with the patterning slit sheet 130, which is coupled to the frame 135 in the tightly tensioned state.

However, if the number of the ribs 134 is increased or the width W of the ribs 134 is widened to an appropriate level or more, there arises a problem that the deposition material is unevenly deposited on the substrate 600. When the deposition material is deposited on the substrate 600 in a nonuniform manner, the panel of the organic light emitting display device may appear to be uneven when the organic light emitting display device is turned on after the deposition process.

In order to improve such a smear phenomenon, it is necessary to increase the amount of the deposition material passing through the opening 133 by minimizing the width of the rib 134 as opposed to the method of improving the deposition accuracy. Therefore, in order to simultaneously improve the PPA and the smear phenomenon, it is necessary to design the width of the rib 134 in an appropriate range.

Referring to Table 1 below, visibility of the organic light emitting display device can be confirmed when the width W of the rib 134 is 1.3 mm or 0.65 mm.

[Table 1]

The JND (just noticeable difference) in Table 1 is a numerical value indicating various types of stains that may occur in the organic light emitting display device. It is used to grasp the level of stains and mura in a display, etc., Or as a back-up data for finally correcting micro-bruises.

Here, A denotes a case where the width W of the rib 134 is 1.3 mm, B denotes a JND value at which the lighting level of the organic light emitting display device is determined as good, And the width W of the protrusion 134 is 0.65 mm.

Referring back to Table 1, when the width W of the rib 134 is 1.3 mm, the JND value of (B) is about 2.05, and the lighting level of the organic light emitting display device is determined to be defective. On the other hand, when the width W of the rib 134 is 0.65 mm (C), the JND value is approximately 0.75 and the lighting level of the organic light emitting display device is smaller than the JND value 0.93 (reference character B) It is judged as good goods. This means that when the width W of the rib 134 is 0.65 mm, the visibility of the spots on the display panel is good enough that the spots can not be recognized by a person.

FIG. 3 is a perspective view schematically illustrating a deposition unit 100 including the organic layer deposition assembly 100-1 of FIG. 1, and FIG. 4 is a schematic cross-sectional view of the deposition unit 100 of FIG.

3 and 4, a deposition unit 100 of an organic layer deposition apparatus 10 including an organic layer deposition assembly 100-1 according to an embodiment of the present invention includes at least one organic layer deposition assembly 100 -1), and a transfer unit 400.

Hereinafter, the configuration of the entire vapor deposition unit 100 will be described.

The chamber 101 is formed in a hollow box shape, and one or more organic layer deposition assemblies 100-1 and a transfer unit 400 are accommodated therein. In another aspect, a foot 102 is formed to be fixed to the ground, a lower housing 103 is formed on a foot 102, and a lower housing 103 is formed on an upper portion of the lower housing 103, (104) are formed. The chamber 101 is formed so as to house both the lower housing 103 and the upper housing 104 therein. At this time, the connection between the lower housing 103 and the chamber 101 may be sealed to completely block the inside of the chamber 101 from the outside. The lower housing 103 and the upper housing 104 are formed on the foot 102 fixed to the ground so that the lower housing 103 and the upper housing 102 can be separated from each other even if the chamber 101 repeats shrinkage / The lower housing 103 and the upper housing 104 can serve as a kind of reference frame in the deposition unit 100. [

The organic layer deposition assembly 100-1 and the first transfer part 410 of the transfer part 400 are formed in the upper housing 104 and the second transfer part 410 of the transfer part 400 is formed in the lower part of the lower housing 103. [ (420) is formed. The moving part 430 is continuously deposited while circulating between the first transfer part 410 and the second transfer part 420.

Hereinafter, the detailed structure of the organic layer deposition assembly 100-1 accommodated in the deposition unit 100 will be described.

Each organic layer deposition assembly 100-1 includes an evaporation source 110, an evaporation source nozzle unit 120, a patterning slit sheet 130, a connecting member 140, a first stage 150, a second stage 160 A camera 170, a sensor 180, and the like. Here, it is preferable that all the configurations of Figs. 3 and 4 are disposed in the chamber 101 in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

In detail, in order for the deposition material 115 emitted from the deposition source 110 to pass through the deposition source nozzle part 120 and the patterning slit sheet 130 to be deposited in a desired pattern on the substrate 600, ) Should maintain the same high vacuum condition as the FMM deposition method. Further, the temperature of the patterning slit sheet 130 should be sufficiently lower than the temperature of the evaporation source 110. This is because the problem of thermal expansion of the patterning slit sheet 130 due to temperature can be minimized only when the temperature of the patterning slit sheet 130 is sufficiently low.

In this chamber 101, a substrate 600 as a deposition target is disposed. The substrate 600 may be a substrate for a flat panel display, and a large-sized substrate having a size of 40 inches or more such as a mother glass capable of forming a plurality of flat panel displays may be used.

Here, in the embodiments of the present invention, the deposition proceeds as the substrate 600 moves relative to the organic layer deposition assembly 100-1.

Specifically, in the conventional FMM deposition method, the FMM size must be formed equal to the substrate size. Therefore, as the substrate size increases, the FMM must be made larger, which makes it difficult to fabricate the FMM, and it is not easy to align the FMM with a precise pattern by pulling the FMM.

In order to solve such problems, the organic layer deposition assembly 100-1 according to an embodiment of the present invention is configured such that deposition is performed while the organic layer deposition assembly 100-1 and the substrate 600 are relatively moved with respect to each other . In other words, the substrate 600 disposed to face the organic layer deposition assembly 100-1 performs the deposition continuously while moving along the Y-axis direction. That is, the deposition is performed by a scanning method while the substrate 600 moves in the direction of arrow A in FIG. Although the substrate 600 is illustrated as being deposited in the chamber (not shown) while moving in the Y-axis direction, the idea of the present invention is not limited thereto. The substrate 600 may be fixed, It is also possible that the assembly 100-1 itself is moved in the Y-axis direction to perform deposition.

Accordingly, the patterning slit sheet 130 can be made much smaller than the conventional FMM in the organic layer deposition assembly 100-1 of the present invention. That is, in the case of the organic layer deposition assembly 100-1 of the present invention, since the substrate 600 performs the deposition in a scanning manner continuously while moving along the Y-axis direction, the patterning slit sheet 130, The length of at least one of the X-axis direction and the Y-axis direction length may be formed to be much smaller than the length of the substrate 600. [

As described above, since the patterning slit sheet 130 can be made much smaller than the conventional FMM, the patterning slit sheet 130 of the present invention can be easily manufactured. That is, a small-sized patterning slit sheet 130 is advantageous over the FMM deposition method in all processes, such as etching of the patterning slit sheet 130, and subsequent precision tensioning and welding operations, movement and cleaning operations. Further, this becomes more advantageous as the display device becomes larger.

It is preferable that the organic layer deposition assembly 100-1 and the substrate 600 are spaced apart from each other in order to deposit the organic layer deposition assembly 100-1 and the substrate 600 relative to each other. This will be described later in detail.

On the other hand, on the side facing the substrate 600 in the chamber, an evaporation source 110 in which the evaporation material 115 is stored and heated is disposed. As the deposition material 115 stored in the deposition source 110 is vaporized, the deposition is performed on the substrate 600.

In detail, the evaporation source 110 includes a crucible 111 in which an evaporation material 115 is filled, a evaporation material 115 filled in the crucible 111 by heating the crucible 111, And a heater 112 for evaporating the evaporation source toward the evaporation source nozzle unit 120 side.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 600. Here, the organic layer deposition assembly 100-1 according to an embodiment of the present invention may be formed such that the evaporation source nozzles 121 are different from each other in depositing the common layer and the pattern layer.

That is, although not shown in the drawing, a plurality of evaporation source nozzles 121 may be formed in the evaporation source nozzle unit 120 for forming the pattern layer in the Y axis direction, that is, along the scanning direction of the substrate 600. Accordingly, by forming the evaporation source nozzle 121 so that there is only one evaporation source nozzle 121 in the X-axis direction, generation of a shadow can be greatly reduced. On the other hand, a plurality of evaporation source nozzles 121 may be formed along the X axis direction in the evaporation source nozzle unit 120 for forming the common layer. As a result, the uniformity of the thickness of the common layer can be improved.

A patterning slit sheet 130 is further provided between the evaporation source 110 and the substrate 600. The patterning slit sheet 130 further includes a frame 135 which is formed in the shape of a window frame. A plurality of patterning slits 131 are formed in the patterning slit sheet 130 along the X-axis direction. The evaporated material 115 vaporized in the evaporation source 110 is directed to the substrate 600 through the evaporation source nozzle unit 120 and the patterning slit sheet 130. At this time, the patterning slit sheet 130 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask. At this time, the total number of the patterning slits 131 may be larger than the total number of the evaporation source nozzles 121. A detailed description of the patterning slit sheet 130 has been described above, and therefore, a detailed description thereof will be omitted here.

The deposition source 110, the deposition source nozzle unit 120, and the patterning slit sheet 130 may be spaced apart from each other by a predetermined distance.

As described above, the organic layer deposition assembly 100-1 according to one embodiment of the present invention performs deposition while relatively moving relative to the substrate 600, and thus the organic layer deposition assembly 100-1 is mounted on the substrate The patterning slit sheet 130 is formed to be spaced apart from the substrate 600 by a certain distance.

In detail, in the conventional FMM deposition method, a mask is closely adhered to a substrate to prevent a shadow from being formed on the substrate, and a deposition process is performed. However, when the mask is brought into close contact with the substrate in this manner, there is a problem that a problem of defective due to contact between the substrate and the mask occurs. Further, since the mask can not be moved relative to the substrate, the mask must be formed to have the same size as the substrate. Therefore, as the size of the display device is increased, the size of the mask must be increased. Thus, there is a problem that it is not easy to form such a large mask.

In order to solve such a problem, in the organic layer deposition assembly 100-1 according to an embodiment of the present invention, the patterning slit sheet 130 is arranged so as to be spaced apart from the substrate 600, which is a deposition source, at a predetermined interval.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained.

Next, the specific arrangement of each component in the upper housing 104 is as follows.

First, the evaporation source 110 and the evaporation source nozzle unit 120 are disposed at the bottom of the upper housing 104. A seating part 104-1 is formed on both sides of the evaporation source 110 and the evaporation source nozzle part 120 and a first stage 150 and a second stage 160 And the above-described patterning slit sheet 130 are sequentially formed.

Here, the first stage 150 is formed to be movable in the X-axis direction and the Y-axis direction, and functions to align the patterning slit sheet 130 in the X-axis direction and the Y-axis direction. That is, the first stage 150 includes a plurality of actuators, and the first stage 150 is formed to move in the X-axis direction and the Y-axis direction with respect to the upper housing 104.

Meanwhile, the second stage 160 is formed to be movable in the Z-axis direction, and functions to align the patterning slit sheet 130 in the Z-axis direction. That is, the second stage 160 includes a plurality of actuators, and the second stage 160 is formed to move in the Z-axis direction with respect to the first stage 150.

On the other hand, a patterning slit sheet 130 is formed on the second stage 160. The patterning slit sheet 130 is formed on the first stage 150 and the second stage 160 so that the patterning slit sheet 130 is formed to be movable in the X axis direction, the Y axis direction, and the Z axis direction Thereby realizing an alignment, particularly a real-time align, between the substrate 600 and the patterning slit sheet 130.

Further, the upper housing 104, the first stage 150, and the second stage 160 may simultaneously guide the movement path of the evaporation material so that the evaporation material discharged through the evaporation source nozzle 121 is not dispersed . That is, the path of the evaporation material may be sealed by the upper housing 104, the first stage 150, and the second stage 160 to simultaneously guide the movement of the evaporation material in the X axis direction and the Y axis direction.

The connection member 140 may be further provided between the patterning slit sheet 130 and the evaporation source 110. In detail, an anode electrode or a cathode electrode pattern is formed at a rim portion of the substrate 600, and there is an area to be used as a terminal in the future for product inspection or product manufacture. If the organic material is deposited in this region, the anode electrode or the cathode electrode is difficult to function, and thus the rim portion of the substrate 600 should be a non-deposition region in which organic materials and the like should not be deposited. However, as described above, in the thin film deposition apparatus of the present invention, since the substrate 600 is moved relative to the thin film deposition apparatus and deposition is performed by a scanning method, the deposition of the organic material in the non- It was not easy.

In order to prevent organic substances from being deposited on the non-deposition region of the substrate 600, the thin film deposition apparatus according to an embodiment of the present invention may further include a separate connection member 140 at a rim portion of the substrate 600 . Although not shown in detail in the drawing, the connecting member 140 may be composed of two neighboring plates.

When the substrate 600 does not pass through the organic layer deposition assembly 100-1, the connection member 140 overlaps the evaporation source 110, so that the evaporation material 115 emitted from the evaporation source 110 is blocked by the patterning slit 110. [ So that the sheet 130 is not caught. In this state, when the substrate 600 starts to enter the organic layer deposition assembly 100-1, the front connecting member 140 covering the evaporation source 110 moves along with the movement of the substrate 600, The evaporation material 115 emitted from the evaporation source 110 passes through the patterning slit sheet 130 and is deposited on the substrate 600.

When the entire substrate 600 passes through the organic layer deposition assembly 100-1, the connecting member 140 on the rear side moves together with the movement of the substrate 600 to close the movement path of the deposition material again, 110 so that the evaporation material 115 emitted from the evaporation source 110 is not deposited on the patterning slit sheet 130.

The non-deposition region of the substrate 600 is covered with the connection member 140, so that organic matter can be prevented from being easily deposited on the non-deposition region of the substrate 600 without a separate structure.

Hereinafter, the transfer unit 400 for transferring the substrate 600 as a deposition target will be described in detail. 3 and 4, the transfer unit 400 includes a first transfer unit 410, a second transfer unit 420, and a moving unit 430.

The first transfer part 410 includes a moving part 430 including a carrier 431 and an electrostatic chuck 432 coupled to the carrier 431 so that an organic layer can be deposited on the substrate 600 by the organic layer deposition assembly 100-1. And a substrate 600 attached to the moving unit 430 in a line-by-line manner. The first conveying unit 410 includes a coil 411, a guide unit 412, a top magnetic levitation bearing (not shown), a side magnetic levitation bearing (not shown), and a gap sensor (not shown).

The second transfer part 420 is configured to return the moving part 430 separated from the unloading part 300 to the loading part 200 after the deposition of the substrate 600 is completed through the deposition part 100 . The second conveyance unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

The moving unit 430 includes a carrier 431 to be transported along the first transporting unit 410 and the second transporting unit 420 and an electrostatic chuck 432 coupled to one side of the carrier 431 and to which the substrate 600 is attached ).

Hereinafter, each component of the transfer unit 400 will be described in more detail.

First, the carrier 431 of the moving part 430 will be described in detail.

The carrier 431 includes a body portion 431a, a magnetic rail 431b, a CPS module (Contactless power supply Module) 431c, a power source portion 431d, and a guide groove 431e.

The body portion 431a forms the base of the carrier 431 and may be formed of a magnetic material such as iron. The carrier 431 can be maintained at a certain distance from the guide portion 412 by the repulsive force between the main body portion 431a of the carrier 431 and a magnetic levitation bearing (not shown) to be described later.

Guide grooves 431e may be formed on both sides of the body portion 431a and guide protrusions 412e of the guide portion 412 may be accommodated in the guide grooves 431e.

A magnetic rail 431b may be formed along the center line of the moving direction of the body portion 431a. The magnetic rail 431b of the main body 431a and the coil 411 to be described later are combined to constitute a linear motor and the carrier 431 can be transported in the direction A by the linear motor.

A CPS module 431c and a power source unit 431d may be formed on one side of the magnetic rail 431b in the main body 431a. The power supply unit 431d is a kind of rechargeable battery for providing power to the electrostatic chuck 432 for chucking and holding the substrate 600. The CPS module 431c is for charging the power supply unit 431d Wireless charging module.

In detail, a charging track 423 formed in the second transporting unit 420 to be described later is connected to an inverter (not shown) so that when the carrier 431 is transported in the second transporting unit 420 A magnetic field is formed between the charging track 423 and the CPS module 431c to supply power to the CPS module 431c. The power supplied to the CPS module 431c charges the power source unit 431d.

The electrostatic chuck 432 has an electrode to which power is applied in a body formed of a ceramic, and a substrate 600 is attached to the surface of the body by applying a high voltage to the electrode.

Next, the driving of the moving part 430 will be described in detail.

The magnetic rail 431b of the main body 431a and the coil 411 are coupled to each other to constitute a driving unit. Here, the driving unit may be a linear motor. The linear motor is a device with a very low degree of positioning because the friction coefficient is small and the position error is hardly generated as compared with the conventional sliding guidance system. As described above, the linear motor can be composed of the coil 411 and the magnetic rail 431b, and the magnetic rail 431b is arranged in a line on the carrier 431. The coil 411 is arranged on the magnetic rail 431b, A plurality of chambers may be disposed at one side of the chamber 101 at regular intervals. Since the magnetic rail 431b is disposed on the carrier 431 as a moving object instead of the coil 411, the carrier 431 can be driven without applying power to the carrier 431. Here, the coil 411 is formed in an atmosphere box and is installed in a standby state, and the magnetic rail 431b is attached to the carrier 431 so that the carrier 431 travels in the vacuum chamber 101 It will be possible.

Next, the first transfer unit 410 and the moving unit 430 will be described in detail.

Referring to FIG. 4, the first transfer part 410 moves the electrostatic chuck 432 fixing the substrate 600 and the carrier 431 for transferring the electrostatic chuck 432. The first transfer unit 410 includes a coil 411, a guide unit 412, a top magnetic levitation bearing (not shown), a side magnetic levitation bearing (not shown), and a gap sensor (not shown).

The coil 411 and the guide portion 412 are formed on the inner surface of the upper housing 104. The coil 411 is formed on the upper inner surface of the upper housing 104, And is formed on both inner side surfaces of the housing 104.

The guide portion 412 serves to guide the carrier 431 to be moved in one direction. At this time, the guide part 412 is formed to penetrate through the deposition part 100.

Side magnetic levitation bearings (not shown) are respectively disposed in the guide portions 412 so as to correspond to both sides of the carrier 431. The side magnetic levitation bearing (not shown) generates a gap between the carrier 431 and the guide portion 412 so that the guide portion 412 does not contact the guide portion 412 when the carrier 431 moves, As shown in FIG. That is, the repulsive force generated between the left side side magnetic levitation bearing (not shown) and the magnetic substance carrier 431 and the repulsive force generated between the right side side side magnetic levitation bearing (not shown) and the carrier 431 The gap between the carrier 431 and the guide portion 412 is generated while keeping the gap constant.

On the other hand, the upper magnetic levitation bearings (not shown) are respectively disposed in the guide portion 412 so as to be positioned on the upper side of the carrier 431. The upper magnetic levitation bearing (not shown) serves to move the carrier 431 along the guide portion 412 while maintaining a constant spacing therebetween, without contacting the guide portion 412. That is, the repulsive force and the gravity generated between the upper magnetic levitation bearing (not shown) and the carrier 431, which is a magnetic body, are parallel to each other while generating a gap between the carrier 431 and the guide portion 412, .

The guide portion 412 may further include a gap sensor (not shown). A gap sensor (not shown) can measure the distance between the carrier 431 and the guide portion 412. A gap sensor (not shown) may also be disposed on one side of the side magnetic levitation bearing (not shown). A gap sensor (not shown) disposed in the side magnetic levitation bearing (not shown) can measure the gap between the side surface of the carrier 431 and the side magnetic levitation bearing (not shown).

The magnetic force of the magnetic levitation bearing (not shown) is changed according to the value measured by the gap sensor (not shown), so that the interval between the carrier 431 and the guide portion 412 can be adjusted in real time. That is, the carrier 431 can be precisely moved by feedback control using a magnetic levitation bearing (not shown) and a gap sensor (not shown).

Next, the second transfer unit 420 and the moving unit 430 will be described in detail.

4, the second transfer unit 420 moves the electrostatic chuck 432 after the substrate is separated from the unloading unit 300 and the carrier 431 for transferring the electrostatic chuck 432 to the loading unit 200 again . Here, the second conveying unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

In detail, the coil 421, the roller guide 422 and the charging track 423 are formed on the inner surface of the lower housing 103, respectively, and the double coil 421 and the charging track 423 are formed on the inner surface of the lower housing 103 And the roller guides 422 are formed on the inner surfaces on both sides of the lower housing 103. Here, the coil 421 may be formed in an atmosphere box like the coil 411 of the first transfer unit 410.

Similarly to the first transfer part 410, the second transfer part 420 also includes a coil 421. The magnetic rail 431b of the main body 431a of the carrier 431 and the coil 421 are coupled with each other, And the driving unit may be a linear motor. By this linear motor, the carrier 431 can move along the direction opposite to the direction A in Fig.

Meanwhile, the roller guide 422 serves to guide the carrier 431 to move in one direction. At this time, the roller guide 422 is formed through the vapor deposition unit 100.

As a result, the position of the second carrier 420 is not required to be higher than that of the first carrier 410 because it is a step of transferring the empty carrier 431, not the step of depositing the organic material on the substrate. Therefore, the second conveying unit 420, which requires a relatively high positional accuracy, is applied to the first conveying unit 410, which is required to have a high positional accuracy, And to simplify the structure of the organic layer deposition apparatus. Of course, although not shown in the drawings, it is also possible to apply a magnetic levitation to the second conveying unit 420 as well as the first conveying unit 410.

The organic layer deposition assembly 100-1 of the organic layer deposition apparatus 1 according to an embodiment of the present invention may further include a camera 170 and a sensor 180 for aligning. In detail, the camera 170 can align a first mark (not shown) formed on the frame 135 of the patterning slit sheet 130 and a second mark (not shown) formed on the substrate 600 in real time. Here, the camera 170 is provided to ensure a smooth visual field in the vacuum chamber 101 under deposition. To this end, the camera 170 may be formed in the camera accommodating portion 171 and installed in a standby state.

In the present invention, since the substrate 600 and the patterning slit sheet 130 are spaced apart from each other by a certain distance, the distance between the substrate 600 and the patterning slit sheet 130 can be reduced by using one camera 170, And the distance to the first antenna 130 should be measured together. To this end, the organic layer deposition assembly 100-1 of the organic layer deposition apparatus 10 according to an embodiment of the present invention may include a sensor 180. [ Here, the sensor 180 may be a confocal sensor. The confocal sensor can scan a measurement object with a laser beam using a scanning mirror rotating at high speed and measure the distance to a measurement object using a fluorescent light or a reflected light beam emitted by the laser beam. The confocal sensor can measure the distance by sensing the interface between different media.

It is possible to measure the interval between the substrate 600 and the patterning slit sheet 130 in real time by providing the camera 170 and the sensor 180 so that the substrate 600 and the patterning slit sheet 130, It is possible to obtain an effect that the positional accuracy of the pattern is further improved.

FIG. 5 is a plan view of a system configuration schematically showing an organic layer deposition apparatus 10 including the deposition section of FIG. 4, and FIG. 6 is a cross-sectional view schematically showing the deposition section 100 of the organic layer deposition apparatus 10 of FIG. Fig.

5 and 6, the organic layer deposition apparatus 10 includes a deposition unit 100 including an organic layer deposition assembly 100-n (n is one or more natural numbers) according to an embodiment of the present invention, An unloading unit 300, and a transferring unit 400. [0031]

The loading unit 200 may include a first rack 212, an introducing chamber 214, a first inverting chamber 218, and a buffer chamber 219.

A plurality of substrates 600 before deposition is deposited on the first rack 212 and an introduction robot (not shown) provided in the introduction chamber 214 holds the substrate 600 from the first rack 212 After the substrate 600 is placed on the moving part 430 transferred from the second transfer part 420, the moving part 430 to which the substrate 600 is attached is transferred to the first inverting chamber 218.

A first inverting chamber 218 is provided adjacent to the introducing chamber 214 and a first inverting robot (not shown) located in the first inverting chamber 218 inverts the moving unit 430 to move the moving unit 430 Is mounted to the first transfer part 410 of the deposition unit 100.

5, the introduction robot 214 (not shown) of the introduction chamber 214 puts the substrate 600 on the upper surface of the moving part 430. In this state, the moving part 430 is moved to the inversion chamber 218 And the substrate 600 is positioned downward in the deposition unit 100 as the first inversion robot (not shown) of the inversion chamber 218 reverses the inversion chamber 218.

The configuration of the unloading unit 300 is configured in reverse to the configuration of the loading unit 200 described above. That is, the second inverting robot (not shown) reverses the substrate 600 and the moving unit 430 via the deposition unit 100 in the second inverting chamber 328 and transfers the substrate 600 and the moving unit 430 to the unloading chamber 324, The substrate 600 and the moving unit 430 are taken out from the unloading chamber 324 and then the substrate 600 is separated from the moving unit 430 and loaded on the second rack 322. The moving part 430 separated from the substrate 600 is returned to the loading part 200 through the second conveying part 420.

However, the present invention is not limited thereto. The substrate 600 may be fixed to the lower surface of the moving part 430 when the substrate 600 is first fixed to the moving part 430, 100). In this case, for example, a first inverting robot (not shown) of the first inverting chamber 218 and a second inverting robot (not shown) of the second inverting chamber 328 are unnecessary.

The deposition unit 100 has at least one vapor deposition chamber 101. 5 and 6, the deposition unit 100 includes a chamber 101 in which a plurality of organic layer deposition assemblies 100-1, 100-2, ..., 100-n. 5, the first organic layer deposition assembly 100-1, the second organic layer deposition assembly 100-2 to the eleventh organic layer deposition assembly 100-11 in the chamber 101, The deposition assemblies are installed, but the number is variable depending on the deposition material and deposition conditions. The chamber 101 is kept in vacuum during deposition.

The moving part 430 to which the substrate 600 is fixed is moved by the first transfer part 410 to at least the deposition part 100 and preferably to the loading part 200 and the deposition part 100, And the moving unit 430 separated from the substrate 600 in the unloading unit 300 is transferred to the loading unit 200 by the second transferring unit 420.

The first transfer part 410 is provided to penetrate the chamber 101 when passing through the deposition part 100 and the second transfer part 420 is provided with a moving part 430 in which the substrate 600 is separated Respectively.

In the organic layer deposition apparatus 10, the first transferring part 410 and the second transferring part 420 are formed in the upper and lower parts, and the moving part 430 after the vapor deposition process passes through the first transferring part 410 is transferred to the unloading part 300 is separated from the substrate 600 and then is transferred to the loading unit 200 through the second transfer unit 420 formed at the lower part of the substrate 600, thereby improving the efficiency of space utilization.

5 may further include an evaporation source replacement unit 190 on one side of each organic layer deposition assembly 100-n (n is a natural number of 1 or more). Although not illustrated in detail in the drawing, the evaporation source replacement portion 190 may be formed in a cassette type so as to be drawn out from each of the organic layer deposition assemblies 100-n (n is one or more natural numbers) Replacement of the deposition source (refer to 110 in Fig. 4) of the deposition assembly 100-n (n is a natural number of 1 or more) can be facilitated.

5 shows a set of a set for constituting an organic layer deposition apparatus composed of a loading unit 200, a deposition unit 100, an unloading unit 300 and a transfer unit 400, Respectively. That is, it can be understood that a total of two organic layer deposition apparatuses 10 are provided on the upper and lower sides of FIG. In this case, a patterning slit sheet replacement unit 500 may be further provided between the two organic layer deposition apparatuses 10.

That is, the patterning slit sheet replacement unit 500 is provided between the two organic layer deposition apparatuses 10, so that the two organic layer deposition apparatuses 10 use the patterning slit sheet replacement unit 500 jointly, The efficiency of space utilization can be improved as compared with the case where the organic layer deposition apparatus 10 includes the patterning slit sheet replacing unit 500.

7 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus 10 of FIG.

Referring to FIG. 7, the active matrix type organic light emitting display device is formed on a substrate 600. The substrate 600 may be formed of a transparent material such as a glass material, a plastic material, or a metal material. On the substrate 600, an insulating layer 51 such as a buffer layer is formed as a whole.

On the insulating layer 51, a TFT as shown in FIG. 7 and an organic light emitting diode (OLED) are formed.

On the upper surface of the insulating film 51, a semiconductor active layer 52 arranged in a predetermined pattern is formed. The semiconductor active layer 52 is buried with a gate insulating film 53. The active layer 52 may be formed of a p-type or n-type semiconductor.

A gate electrode 54 of the TFT is formed on the upper surface of the gate insulating film 53 at a position corresponding to the active layer 52. An interlayer insulating film 55 is formed so as to cover the gate electrode 54. After the interlayer insulating film 55 is formed, a contact hole is formed by etching the gate insulating film 53 and the interlayer insulating film 55 by an etching process such as dry etching so that a part of the active layer 52 is exposed.

Next, source / drain electrodes 56 and 57 are formed on the interlayer insulating film 55 and are formed in contact with the active layer 52 exposed through the contact hole. A protective layer 58 is formed to cover the source / drain electrodes 56 and 57 and a portion of the drain electrode 57 is exposed through an etching process. A separate insulating layer 59 may be further formed on the passivation layer 58 for planarization of the passivation layer 58.

The organic light emitting diode OLED emits red, green, and blue light according to the current flow to display predetermined image information. The organic light emitting diode OLED has a first electrode 61 formed on the protection layer 58 do. The first electrode 61 is electrically connected to the drain electrode 57 of the TFT.

The pixel defining layer 60 is formed to cover the first electrode 61. After a predetermined opening is formed in the pixel defining layer 60, an organic layer 62 including a light emitting layer is formed in a region defined by the opening. A second electrode 63 is formed on the organic layer 62.

The pixel defining layer 60 divides each pixel and is made of an organic material to planarize the surface of the substrate on which the first electrode 61 is formed, particularly, the surface of the insulating film 59.

The first electrode 61 and the second electrode 63 are insulated from each other and a voltage of different polarity is applied to the organic layer 62 including the light emitting layer to emit light.

When a low-molecular organic material is used, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), and a light emitting layer (EML) may be used as the organic layer 62 including the light emitting layer. An electron transport layer (ETL), and an electron injection layer (EIL) may be stacked in a single or a composite structure. The usable organic material may include copper phthalocyanine (CuPc) phthalocyanine, N, N'-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine ), Tris-8-hydroxyquinoline aluminum (Alq3), and the like.

Here, the organic layer 62 including the light emitting layer may be deposited by the organic layer deposition apparatus (refer to reference numeral 10 in FIG. 5) shown in FIG. That is, an evaporation source that emits evaporation material, an evaporation source nozzle unit which is disposed on one side of the evaporation source and in which a plurality of evaporation source nozzles are formed, and a patterning slit sheet which is disposed to face the evaporation source nozzle unit and in which a plurality of patterning slits are formed (See 10 in Fig. 5) and the substrate (see 600 in Fig. 3) are arranged to be spaced apart from each other by a predetermined distance relative to the other side While moving, a deposition material which is emitted from an organic layer deposition apparatus (see 10 in Fig. 5) is deposited on a substrate (see 600 in Fig. 3).

After the organic light emitting layer is formed, the second electrode 63 may be formed by the same deposition process.

The first electrode 61 functions as an anode and the second electrode 63 functions as a cathode. Of course, the first electrode 61 and the second electrode 63 ) May be reversed. The first electrode 61 may be patterned to correspond to a region of each pixel, and the second electrode 63 may be formed to cover all the pixels.

The first electrode 61 may be a transparent electrode or a reflective electrode. When the first electrode 61 is used as a transparent electrode, the first electrode 61 may be formed of ITO, IZO, ZnO, or In 2 O 3. A transparent electrode layer may be formed of ITO, IZO, ZnO, or In 2 O 3 on the reflective layer formed of Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, The first electrode 61 is formed by a sputtering method or the like, and then patterned by a photolithography method or the like.

When the second electrode 63 is used as a transparent electrode, the second electrode 63 is used as a cathode electrode. Therefore, a metal having a small work function, that is, IZO, ZnO, or In 2 O 3 (Al 2 O 3) is deposited thereon such that Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg and their compounds are oriented in the direction of the organic layer 62 including the light- An auxiliary electrode layer or a bus electrode line can be formed. Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are deposited on the entire surface when the electrode is used as a reflective electrode. At this time, vapor deposition can be performed in the same manner as in the case of the organic layer 62 including the above-described light emitting layer.

In addition, the present invention can be used for deposition of an organic layer or an inorganic film of an organic TFT, and the present invention is applicable to other various film forming processes.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: organic layer deposition device 214: introduction chamber
100: organic layer deposition assembly 218: first inversion chamber
101: Evaporation chamber 300: Unloading section
110: evaporation source 322: second rack
111: Crucible 324: Export chamber
112: heater 328: second inversion chamber
115: deposition material 400: transfer part
120: evaporation source nozzle part 410: first conveyance part
121: evaporation source nozzle 411, 421: coil
130: patterning slit sheet 412: guide part
131: patterning slit 420: second transferring part
132: Spacer 422: Roller guide
133: opening 423: charging track
134: ribs 430:
135: Frame 431: Carrier
140: connecting member 431a:
150: first stage 431b: magnetic rail
160: second stage 431c: CPS module
170: photographing member 431d:
180: sensor 432: electrostatic chuck
190: evaporation source replacement part 500: patterning slit sheet replacement part
200: loading part 600: substrate
212: first rack

Claims (20)

An organic layer deposition assembly for depositing a deposition material on a substrate,
An evaporation source for emitting the evaporation material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed therein;
And a patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits formed therein,
Wherein the substrate is formed to be spaced apart from the organic layer deposition assembly to be relatively movable with respect to the organic layer deposition assembly,
Wherein the deposition material emitted from the evaporation source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate,
Wherein the plurality of patterning slits are arranged in a matrix,
A plurality of openings extending in the longitudinal direction of the patterning slit and continuously arranged in the longitudinal direction and the width direction of the patterning slit to allow the deposition material to pass therethrough;
And a plurality of ribs formed in spaces spaced apart from each other in the longitudinal direction of the patterning slit between the openings,
And the width of each of the ribs is 0.65 mm. The method according to claim 1,
Wherein the patterning slit sheet is formed to be smaller than the substrate in at least one of a first direction which is a longitudinal direction of the patterning slit sheet and a second direction which is a width direction of the patterning slit sheet. . The method according to claim 1,
Wherein the patterning slit sheet is formed with the plurality of patterning slits along a first direction in a longitudinal direction of the patterning slit sheet,
Wherein the plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along a second direction which is a width direction of the patterning slit sheet. The method of claim 3,
Wherein the evaporation source, the evaporation source nozzle portion, and the patterning slit sheet are integrally formed by a coupling member. 5. The method of claim 4,
Wherein the connecting member guides the movement path of the evaporation material. 6. The method of claim 5,
Wherein the connecting member is formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside. A moving part formed to be movable with the fixed substrate fixed to the substrate; a first conveying part for moving the moving part in which the substrate is fixed in a first direction; and a second conveying part for moving the moving part, A conveying part including a second conveying part for moving the conveying part in a direction opposite to the first direction;
A loading unit for fixing the substrate to the moving unit;
A deposition unit including a chamber kept in a vacuum state and at least one organic layer deposition assembly for depositing an organic layer on the substrate fixed to the moving part transferred from the loading part; And
And an unloading unit for separating the substrate from the moving unit after the vapor deposition is completed while passing through the vapor deposition unit,
Wherein the moving unit is configured to be circuable between the first transfer unit and the second transfer unit,
Wherein the substrate fixed to the moving unit is spaced apart from the organic layer deposition assembly by a predetermined distance while being moved by the first transfer unit,
The organic layer deposition assembly includes:
An evaporation source for emitting the evaporation material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed therein;
And a patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits formed therein,
Wherein the substrate is formed to be spaced apart from the organic layer deposition assembly to be relatively movable with respect to the organic layer deposition assembly,
Wherein the deposition material emitted from the evaporation source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate,
Wherein the plurality of patterning slits are arranged in a matrix,
A plurality of openings extending in the longitudinal direction of the patterning slit and continuously arranged in the longitudinal direction and the width direction of the patterning slit to allow the deposition material to pass therethrough;
And a plurality of ribs formed in spaces spaced apart from each other in the longitudinal direction of the patterning slit between the openings,
And the width of each of the ribs is 0.65 mm. 8. The method of claim 7,
Wherein the first transfer part and the second transfer part are provided so as to pass through the deposition part when passing through the deposition part. 8. The method of claim 7,
Wherein the first transfer unit and the second transfer unit are arranged vertically in parallel. 8. The method of claim 7,
Wherein the first transfer unit sequentially moves the moving unit to the loading unit, the deposition unit, and the unloading unit. 8. The method of claim 7,
And the second transfer unit sequentially moves the moving unit to the unloading unit, the deposition unit, and the loading unit. 8. The method of claim 7,
Wherein the patterning slit sheet of the organic layer deposition assembly is formed to be smaller than the substrate in at least one of the first direction and the second direction. 8. The method of claim 7,
A plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along a first direction,
Wherein the patterning slit sheet is formed with a plurality of patterning slits along a second direction perpendicular to the first direction. 14. The method of claim 13,
Wherein the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet are integrally formed by a coupling member. 15. The method of claim 14,
Wherein the connection member guides the movement path of the evaporation material. 16. The method of claim 15,
Wherein the connection member is formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside. A method of manufacturing an organic light emitting display device using an organic layer deposition apparatus for forming an organic layer on a substrate,
Fixing the substrate to a moving part at a loading part;
Transferring the moving unit to which the substrate is fixed, into the chamber using a first transfer unit provided to penetrate the chamber;
The substrate is moved relative to the organic layer deposition assembly and the deposition material emitted from the organic layer deposition assembly is deposited on the substrate to form an organic layer, with the substrate being spaced a predetermined distance from the organic layer deposition assembly disposed in the chamber ;
Separating the substrate from which the deposition is completed in the unloading portion from the moving portion; And
And transferring the moving unit separated from the substrate to the loading unit using a second transfer unit installed to penetrate the chamber,
The organic layer deposition assembly includes:
An evaporation source for emitting the evaporation material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed therein;
And a patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits formed therein,
Wherein the substrate is formed to be spaced apart from the organic layer deposition assembly to be relatively movable with respect to the organic layer deposition assembly,
Wherein the deposition material emitted from the evaporation source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate,
Wherein the plurality of patterning slits are arranged in a matrix,
A plurality of openings extending in the longitudinal direction of the patterning slit and continuously arranged in the longitudinal direction and the width direction of the patterning slit to allow the deposition material to pass therethrough;
And a plurality of ribs formed in spaces spaced apart from each other in the longitudinal direction of the patterning slit between the openings,
Wherein the width of each of the ribs is 0.65 mm. 18. The method of claim 17,
Wherein a plurality of thin film deposition assemblies are provided in the chamber, and the thin film deposition assemblies are continuously deposited on the substrate. 18. The method of claim 17,
Wherein the moving part circulates between the first transfer part and the second transfer part. 18. The method of claim 17,
Wherein the first transferring part and the second transferring part are arranged vertically side by side.

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