KR20150143307A - 연삭 장치 - Google Patents
연삭 장치 Download PDFInfo
- Publication number
- KR20150143307A KR20150143307A KR1020150073849A KR20150073849A KR20150143307A KR 20150143307 A KR20150143307 A KR 20150143307A KR 1020150073849 A KR1020150073849 A KR 1020150073849A KR 20150073849 A KR20150073849 A KR 20150073849A KR 20150143307 A KR20150143307 A KR 20150143307A
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- KR
- South Korea
- Prior art keywords
- grinding
- workpiece
- holding
- measuring
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
연삭 장치는 피가공물(W)을 유지하는 유지면을 갖는 유지 수단과, 유지 수단에 유지된 피가공물(W)의 이면(裏面)(WR)을 연삭하는 연삭 수단과, 연삭 수단에 의해 연삭된 피가공물(W)의 이면(WR)의 높이를 측정하는 높이 측정기(40)를 구비한다. 높이 측정기(40)는 피가공물(W)의 이면(WR)에 접촉시키는 접촉점이 동일 높이 위치에 배치된 2개의 계측침(43)을 구비한다. 2개의 계측침(43)은 유지 수단의 회전축(A)를 중심으로 한 원주(C) 상을 따라 병렬로 또한 인접한 피가공물(W)끼리의 둘레 방향의 간격(W2)보다도 큰 간격(W1)만큼 이격되어 배치된다.
Description
도 2는 실시형태에 따른 연삭 장치의 유지 수단과 높이 측정기 등의 사시도.
도 3은 실시형태에 따른 연삭 장치의 높이 측정기와 복수의 피가공물의 사시도.
도 4는 실시형태에 따른 연삭 장치의 높이 측정기 등과 복수의 피가공물의 평면도.
도 5는 실시형태에 따른 연삭 장치의 높이 측정기와 복수의 피가공물의 측면도.
10 : 유지 수단
10a : 유지면
20 : 연삭 수단
40 : 높이 측정기
43 : 계측침
48a : 접촉점
A : 회전축
C : 원주
W : 피가공물
WR : 이면(상면)
W1 : 간격
W2 : 간격
Claims (1)
- 피가공물을 유지하는 유지면을 갖는 유지 수단과, 상기 유지 수단에 유지된 피가공물의 상면을 연삭하는 연삭 수단과, 상기 연삭 수단에 의해 연삭된 피가공물의 상기 상면의 높이를 측정하는 높이 측정기를 구비한 연삭 장치로서,
상기 유지 수단은, 복수의 피가공물을 유지하고 피가공물의 사이즈보다도 큰 사이즈로 형성된 유지면을 가지며, 상기 유지면에 직교하고 상기 유지면의 중심을 통과하는 회전축을 중심으로 하여 회전 가능하고, 상기 유지면 상에 있어서 상기 회전축을 중심으로 한 원주 상에서 상기 복수의 피가공물을 둘레 방향으로 유지하고,
상기 높이 측정기는, 피가공물의 상면에 접촉시키는 접촉점이 동일 높이 위치에 배치된 2개의 계측침을 구비하고, 상기 2개의 계측침은 상기 유지 수단의 회전축을 중심으로 한 상기 원주 상을 따라 병렬로 또한 인접한 피가공물끼리의 둘레 방향의 간격보다도 큰 간격만큼 이격되어 배치되고,
복수의 피가공물의 연삭시에 있어서는, 한쪽의 상기 계측침이 상기 복수의 피가공물 사이에 위치할 때에는 다른 한쪽의 상기 계측침은 복수의 피가공물 중 어느 하나의 상면에 접촉하여 피가공물의 높이 위치를 항상 계측하는 것을 특징으로 하는 연삭 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014122691A JP6295146B2 (ja) | 2014-06-13 | 2014-06-13 | 研削装置 |
JPJP-P-2014-122691 | 2014-06-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150143307A true KR20150143307A (ko) | 2015-12-23 |
KR102151282B1 KR102151282B1 (ko) | 2020-09-02 |
Family
ID=55082502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150073849A Active KR102151282B1 (ko) | 2014-06-13 | 2015-05-27 | 연삭 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6295146B2 (ko) |
KR (1) | KR102151282B1 (ko) |
CN (1) | CN105290969B (ko) |
TW (1) | TWI651162B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102452208B1 (ko) * | 2021-05-06 | 2022-10-11 | 주식회사 엔티에스 | 두께 게이지 측정 구조체 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7651151B2 (ja) * | 2019-12-25 | 2025-03-26 | スピードファム株式会社 | ワークホール検出装置及びワークホール検出方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000006018A (ja) | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
JP2010247311A (ja) * | 2009-04-20 | 2010-11-04 | Disco Abrasive Syst Ltd | 被加工物の研削方法 |
JP2012101293A (ja) | 2010-11-08 | 2012-05-31 | Disco Corp | 加工方法 |
US20140073223A1 (en) * | 2012-09-07 | 2014-03-13 | Axus Technology, Llc | Method and apparatus for wafer backgrinding and edge trimming on one machine |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0740240A (ja) * | 1993-07-29 | 1995-02-10 | Tdk Corp | セラミック板研削方法及び装置 |
JP4462997B2 (ja) * | 2003-09-26 | 2010-05-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP5025200B2 (ja) * | 2006-09-19 | 2012-09-12 | 株式会社ディスコ | 研削加工時の厚さ測定方法 |
JP5122854B2 (ja) * | 2007-04-13 | 2013-01-16 | 株式会社ディスコ | デバイスの研削方法 |
JP5836757B2 (ja) * | 2011-11-02 | 2015-12-24 | 株式会社ディスコ | 板状物の研削方法 |
CN203390714U (zh) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | 一种晶片研磨装置 |
-
2014
- 2014-06-13 JP JP2014122691A patent/JP6295146B2/ja active Active
-
2015
- 2015-04-28 TW TW104113542A patent/TWI651162B/zh active
- 2015-05-27 KR KR1020150073849A patent/KR102151282B1/ko active Active
- 2015-06-09 CN CN201510313499.6A patent/CN105290969B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000006018A (ja) | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
JP2010247311A (ja) * | 2009-04-20 | 2010-11-04 | Disco Abrasive Syst Ltd | 被加工物の研削方法 |
JP2012101293A (ja) | 2010-11-08 | 2012-05-31 | Disco Corp | 加工方法 |
US20140073223A1 (en) * | 2012-09-07 | 2014-03-13 | Axus Technology, Llc | Method and apparatus for wafer backgrinding and edge trimming on one machine |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102452208B1 (ko) * | 2021-05-06 | 2022-10-11 | 주식회사 엔티에스 | 두께 게이지 측정 구조체 |
Also Published As
Publication number | Publication date |
---|---|
KR102151282B1 (ko) | 2020-09-02 |
CN105290969B (zh) | 2019-03-15 |
JP2016002606A (ja) | 2016-01-12 |
CN105290969A (zh) | 2016-02-03 |
JP6295146B2 (ja) | 2018-03-14 |
TW201600239A (zh) | 2016-01-01 |
TWI651162B (zh) | 2019-02-21 |
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