KR20150077649A - ceramic slurry composition with low viscosity for 3D printing and manufacturing method of ceramic slurry composition - Google Patents
ceramic slurry composition with low viscosity for 3D printing and manufacturing method of ceramic slurry composition Download PDFInfo
- Publication number
- KR20150077649A KR20150077649A KR1020130166360A KR20130166360A KR20150077649A KR 20150077649 A KR20150077649 A KR 20150077649A KR 1020130166360 A KR1020130166360 A KR 1020130166360A KR 20130166360 A KR20130166360 A KR 20130166360A KR 20150077649 A KR20150077649 A KR 20150077649A
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic slurry
- slurry composition
- parts
- weight
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 75
- 239000002002 slurry Substances 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 238000010146 3D printing Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 13
- 238000000016 photochemical curing Methods 0.000 claims abstract description 13
- 239000010954 inorganic particle Substances 0.000 claims abstract description 11
- 239000002270 dispersing agent Substances 0.000 claims abstract description 8
- 239000007822 coupling agent Substances 0.000 claims abstract description 7
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims description 13
- 239000004925 Acrylic resin Substances 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 239000002518 antifoaming agent Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 229910052878 cordierite Inorganic materials 0.000 claims description 3
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 239000002241 glass-ceramic Substances 0.000 claims description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052863 mullite Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims 1
- 238000007873 sieving Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DIEWDBGDONROEC-UHFFFAOYSA-N N=C=O.C1(=CC=CC=C1)C(=O)C(O)C1=CC=CC=C1 Chemical class N=C=O.C1(=CC=CC=C1)C(=O)C(O)C1=CC=CC=C1 DIEWDBGDONROEC-UHFFFAOYSA-N 0.000 description 1
- 229910034327 TiC Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63424—Polyacrylates; Polymethacrylates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
Abstract
본 발명은 광경화형 세라믹 슬러리를 이용하여 복잡한 형상의 3차원 세라믹 조형물을 제작하기 위한 것으로서, 3D 프린팅용 세라믹 슬러리 조성물에 있어서, 무기입자 30~80중량부, 광경화성 수지 10~30중량부, 광개시제 및 광증감제 3~10중량부, 반응성 희석제 5~20중량부, 커플링제 0.05~3중량부 및 분산제 0.05~3중량부를 포함하여 이루어진 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물 및 이를 DLP 방식을 이용한 3D 프린팅에 의해 조형물을 제조하는 것을 그 기술적 요지로 한다. 또한, 본 발명은 고농도 세라믹 슬러리의 저점도화를 실현하고, 고품질의 조형물을 성형하기 위한 세라믹 슬러리 조성물의 최적 비를 얻어 복잡한 형상의 3차원 세라믹 조형물을 제작할 수 있는 이점이 있다.A ceramic slurry composition for 3D printing comprising 30 to 80 parts by weight of an inorganic particle, 10 to 30 parts by weight of a photo-curing resin, a photoinitiator And 3 to 10 parts by weight of a photosensitizer, 5 to 20 parts by weight of a reactive diluent, 0.05 to 3 parts by weight of a coupling agent, and 0.05 to 3 parts by weight of a dispersing agent. The low viscosity ceramic slurry composition for DLP And a method of manufacturing a sculpture by 3D printing using the method. Further, the present invention has an advantage that a low viscosity of a high-concentration ceramic slurry can be realized and an optimal ratio of a ceramic slurry composition for forming a high-quality molding can be obtained and a three-dimensional ceramic molding of a complex shape can be produced.
Description
본 발명은 광경화형 세라믹 슬러리를 이용하여 복잡한 형상의 3차원 세라믹 조형물을 제작하기 위한 것으로서, 고농도 세라믹 슬러리의 저점도화를 위해 세라믹 슬러리 조성물의 최적 비를 구현하고, 반응성 희석제를 추가하여 세라믹 슬러리 조성물의 점도를 낮추기 위한 3D 프린팅용 저점도 세라믹 슬러리 조성물 및 그 슬러리 조성물을 이용한 조형물의 제조방법에 관한 것이다.The present invention relates to a method for producing a three-dimensional ceramic sculpture of complex shape by using a photocurable ceramic slurry, which realizes an optimum ratio of the ceramic slurry composition for lowering the viscosity of the high-concentration ceramic slurry, Viscosity ceramic slurry composition for 3D printing for lowering the viscosity and a method for manufacturing a molding using the slurry composition.
전자, 정보통신 기술의 발달로 소형화, 고집적화된 전자부품 및 정밀 기계부품의 개발이 요구되고 있다.Development of miniaturized, highly integrated electronic parts and precision mechanical parts is required due to development of electronic and information communication technologies.
종래에는 상기의 전자부품 및 기계부품의 제작시, 필요한 부분까지 플라스틱을 사출 성형하여 제작하여 왔다.Conventionally, plastic parts have been manufactured by injection molding to the necessary parts at the time of manufacturing the above electronic parts and mechanical parts.
그러나, 사출 성형 방법은 금형 제작에 비용 및 시간이 많이 소요되며, 부품 간 편차가 심하고, 패턴 구현 시 복잡한 형태의 패턴 제작에는 한계가 있고, 금형의 경우 소모품으로 수명에도 한계가 있다.However, the injection molding method requires a lot of cost and time to manufacture the mold, there is a large deviation between the parts, there is a limit to the production of the complicated shape pattern when the pattern is realized, and the life time of the mold is also limited.
특히, 사출 부품의 경우에는 두께가 1mm 이상이어야 해서 슬림한 형태의 부품의 제작에는 어려움이 있어, 생산자와 소비자들의 다양한 요구를 충족시키지 못하고 있는 실정이다.Particularly, in the case of injection parts, the thickness must be 1 mm or more, which makes it difficult to manufacture slim parts, and thus it fails to meet various demands of the producers and consumers.
최근에는 이러한 다양한 요구에 맞춰 3D 프린팅 기술에 대한 관심이 급증하고 있으며, 특히 본 발명에서는 광경화성 컴포지트 기반의 3D 프린팅 기술에 대해서 관심이 있으며, 그 중 액체 기반의 재료를 사용하는 DLP(Digital Light Processing) 방식의 3D 프린팅 기술에 대해서 살펴보고자 한다. In recent years, there has been a growing interest in 3D printing technology in response to these various demands. Particularly, in the present invention, there is an interest in 3D printing technology based on a photocurable composite, and DLP (Digital Light Processing ) Type of 3D printing technology.
DLP 방식에 의한 3D 프린팅 기술은 이미지 프로세싱 칩을 프로젝터에 장착하여 광경화성 수지에 마스크 이미지를 투영하여 경화시킴으로써 조형물을 제작하는 방식으로, 스팟(spot) 사이즈가 작은 마이크로 스팟형 디지털 빔을 이용하므로 고해상도 구현이 가능하여 작은 부품을 매우 정교하고 고품질로 생산할 수 있는 장점이 있다. 특히, 마이크로 전자부품 및 정밀 기계 부품의 제작에 활용성이 높은 특징이 있다.The DLP-based 3D printing technology uses a micro spot-type digital beam with a small spot size to mount a image processing chip on a projector and project a mask image onto a photocurable resin to cure it. It is possible to produce small parts with high precision. Particularly, it is highly applicable to the production of micro electronic parts and precision machine parts.
이러한 DLP 방식은 한 층이 경화가 되면 플랫폼이 상승하면서 새로운 슬러리가 다음 층을 형성하기 위해 조형물과 바닥판(bottom plate) 사이로 침투하게 되는데, 이때 슬러리의 농도가 맞지 않으면 여러가지 문제점이 야기되게 된다.In the DLP method, when a layer is cured, the platform rises and a new slurry penetrates between the molding and the bottom plate to form the next layer. If the concentration of the slurry is not proper, various problems are caused.
고농도의 점도가 높은 세라믹 슬러리의 경우 침투가 용이하지 않아 조형물 경화시 빈 공간이 생길 수 있으며, 이에 의해 조형물의 소결시 과도하게 수축되거나 크랙이 생길 염려가 있다. 즉, 고농도 슬러리의 경우 점도가 높아 정밀제어가 가능한 DLP 방식의 3D 프린팅으로 성형이 어려우며, 고품질의 정밀 부품의 제작이 제대로 이루어지지 않게 된다.In the case of a ceramic slurry having a high viscosity and a high viscosity, penetration is not easy and voids may be formed during curing of the molding, which may result in excessive shrinkage or cracking during sintering of the molding. That is, in the case of a high concentration slurry, it is difficult to form a DLP type 3D printing capable of precise control because of high viscosity, and high-quality precision parts can not be produced properly.
종래 기술인 US5496682는 "광중합을 이용한 3차원 소결 무기체 구조" 기술의 경우 광경화성 조성물의 경우 세라믹 또는 금속성 입자에 광경화성 모노머, 해교제 등이 사용되고 있다.Prior art US5496682 discloses a three-dimensional sintered inorganic structure using photopolymerization. In the case of photocurable compositions, photocurable monomers and peptizing agents are used for ceramics or metallic particles.
상기 종래 기술의 경우에도 세라믹 슬러리의 점도를 낮추기 위한 조성물이 포함되어 있지 않으며, 이에 의해 슬러리 내에 기포가 형성되어 조형물의 소결시 수축하게 되며, 제품의 불량을 야기하게 된다.Even in the case of the above-mentioned prior arts, a composition for lowering the viscosity of the ceramic slurry is not included, thereby forming bubbles in the slurry, resulting in shrinkage of the molding during sintering, resulting in defective products.
본 발명은 고농도 세라믹 슬러리의 저점도화를 위해 세라믹 슬러리 조성물의 최적 비를 구현하고, 반응성 희석제를 추가하여 세라믹 슬러리 조성물의 점도를 낮추기 위한 3D 프린팅용 저점도 세라믹 슬러리 조성물 및 그 슬러리 조성물을 이용한 조형물의 제조방법의 제공을 그 목적으로 한다.The present invention relates to a low viscosity ceramic slurry composition for 3D printing for lowering the viscosity of a ceramic slurry composition by realizing an optimum ratio of a ceramic slurry composition for lowering the viscosity of a high concentration ceramic slurry and adding a reactive diluent thereto and a slurry composition And a manufacturing method thereof.
상기 목적 달성을 위해 본 발명은, 3D 프린팅용 세라믹 슬러리 조성물에 있어서, 무기입자 30~80중량부, 광경화성 수지 10~30중량부, 광개시제 및 광증감제 3~10중량부, 반응성 희석제 5~20중량부, 커플링제 0.05~3중량부 및 분산제 0.05~3중량부를 포함하여 이루어진 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물을 기술적 요지로 한다.The present invention provides a ceramic slurry composition for 3D printing comprising 30 to 80 parts by weight of inorganic particles, 10 to 30 parts by weight of a photocurable resin, 3 to 10 parts by weight of a photoinitiator and a photosensitizer, 0.05 to 3 parts by weight of a coupling agent and 0.05 to 3 parts by weight of a dispersing agent. The present invention also provides a low-viscosity ceramic slurry composition for 3D printing.
또한, 상기 무기입자는, 세라믹계 분말로 싸이즈는 0.1~3㎛인 것을 특징으로 하며, 상기 세라믹계 분말은, (a)산화물계로 알루미나, 지르코니아, 실리카, 코디에라이트, 뮬라이트, 마그네시아, 타이타니아 중 어느 하나이거나, (b)탄화물계로 SiC 또는 TiC이거나, (c)질화물계로 Si3N4, AlN, TiN 및 BN 중 어느 하나이거나, (d)복합산화물계로 바륨타이타네이트, PZT(lead zirconium titanate) 또는 산화물 페라이트이거나, (e)금속 산화물과 질화물의 화합물인 옥시나이트라이드계이거나, (f)유리계 분말로 글라스 세라믹 분말 또는 유리 프릿(frit)이거나, 또는 이들의 혼합물 중 어느 하나를 사용하는 것이 바람직하다.The ceramic powder is characterized in that the ceramic powder has a size of 0.1 to 3 占 퐉. The ceramic powder may be selected from the group consisting of (a) oxides such as alumina, zirconia, silica, cordierite, mullite, magnesia, (B) SiC or TiC as a carbide system; (c) a nitride system selected from Si 3 N 4 , AlN, TiN and BN; (d) complex oxide system such as barium titanate, lead zirconium titanate ) Or an oxide ferrite, or (e) an oxynitride system which is a compound of a metal oxide and a nitride, (f) a glass-ceramic powder or glass frit, or a mixture thereof .
또한, 상기 광경화성 수지는, 광경화가 가능한 유기 관능기를 적어도 1관능기 이상 함유하는 에폭시계 아크릴 수지, 에테르계 아크릴 수지, 에스테르계 아크릴 수지 및 우레탄계 아크릴 수지 중에 어느 하나를 사용하는 것이 바람직하다.It is preferable that the photo-curing resin is any one of an epoxy-based acrylic resin, an ether-based acrylic resin, an ester-based acrylic resin and a urethane-based acrylic resin containing at least one functional group capable of photo-curing.
또한, 상기 반응성 희석제는, 점도 5cps~50cps의 액상 모노아크릴레이트 또는 모노메타아크릴레이트를 사용하는 것이 바람직하다.The reactive diluent is preferably a liquid monoacrylate or monomethacrylate having a viscosity of 5 cps to 50 cps.
또한, 상기 세라믹 슬러리 조성물에는, 레벨링제 0.05~3중량부가 더 포함되며, 소포제 0.05~3중량부 더 포함되는 것이 바람직하다.The ceramic slurry composition may further contain 0.05 to 3 parts by weight of a leveling agent and 0.05 to 3 parts by weight of a defoaming agent.
한편, 상기의 세라믹 슬러리 조성물은, DLP 방식의 3D 프린터에 투입되어 소정 형상의 조형물로 제조되고, 소결 공정을 거쳐 조형물의 완성이 이루어지게 되는 것이다.On the other hand, the ceramic slurry composition is put into a 3D printer of the DLP type, and is manufactured into a predetermined shaped product, and the finished product is completed through a sintering process.
본 발명은 고농도 세라믹 슬러리의 저점도화를 실현하고, 고품질의 조형물을 성형하기 위한 세라믹 슬러리 조성물의 최적 비를 얻어 복잡한 형상의 3차원 세라믹 조형물을 제작할 수 있는 효과가 있다.The present invention has an effect of realizing a low viscosity of a high-concentration ceramic slurry and obtaining an optimum ratio of a ceramic slurry composition for forming a high-quality molding, thereby producing a three-dimensional ceramic molding of a complex shape.
특히, 반응성 희석제를 추가하여 고농도 세라믹 슬러리를 저점도화하여, 마이크로 빔을 이용하는 DLP 방식을 이용한 3D 프린팅에 최적화된 광경화성 조성물을 제공하여, 고정밀, 고품질의 부품을 생산해낼 수 있는 효과가 있다.Particularly, a reactive diluent is added to lower the viscosity of the high-concentration ceramic slurry to provide a photo-curing composition optimized for 3D printing using a DLP method using a micro beam, thereby producing high-precision and high-quality parts.
본 발명은 광경화형 세라믹 슬러리를 이용하여 복잡한 형상의 3차원 세라믹 조형물을 제작하기 위한 것으로서, 고농도 세라믹 슬러리의 저점도화를 위해 세라믹 슬러리 조성물의 최적 비를 구현하고, 반응성 희석제를 추가하여 세라믹 슬러리 조성물의 점도를 낮추기 위한 것이다.The present invention relates to a method for producing a three-dimensional ceramic sculpture of complex shape by using a photocurable ceramic slurry, which realizes an optimum ratio of the ceramic slurry composition for lowering the viscosity of the high-concentration ceramic slurry, This is to lower the viscosity.
이에 의해 본 발명은 세라믹 슬러리 조성물의 점도를 낮춰 조형물 경화시 세라믹 슬러리 조성물의 빠른 침투가 가능하여 조형물의 빈 공간을 없애고, 소결공정에 의한 조형물의 수축율을 최소화하여 고품질의 정밀한 조형물을 제조할 수 있는 것이다.Accordingly, the present invention can reduce the viscosity of the ceramic slurry composition and allow rapid penetration of the ceramic slurry composition during the curing of the molding material, thereby eliminating the void space of the molding material and minimizing the shrinkage rate of the molding material by the sintering process to produce a high- will be.
또한, 본 발명은 정밀한 형상 제어가 가능한 DLP 방식의 3D 프린팅 기술에 최적화된 세라믹 슬러리 조성물을 확보하여 복잡한 형상의 세라믹 조형물을 용이하게 성형할 수 있는 것이다.
The present invention also provides a ceramic slurry composition optimized for a DLP type 3D printing technology capable of precise shape control, thereby easily molding a ceramic molding of a complex shape.
이하에서는 본 발명에 대해 상세히 설명하고자 한다.Hereinafter, the present invention will be described in detail.
본 발명은 3D 프린팅용 세라믹 슬러리 조성물에 있어서, 무기입자 30~80중량부, 광경화성 수지 10~30중량부, 광개시제 및 광증감제 3~10중량부, 반응성 희석제 5~20중량부, 커플링제 0.05~3중량부 및 분산제 0.05~3중량부를 포함하여 이루어진 것을 특징으로 한다.The present invention relates to a ceramic slurry composition for 3D printing comprising 30 to 80 parts by weight of inorganic particles, 10 to 30 parts by weight of a photo-curing resin, 3 to 10 parts by weight of a photoinitiator and 5 to 20 parts by weight of a reactive diluent, 0.05 to 3 parts by weight and 0.05 to 3 parts by weight of a dispersing agent.
본 발명에 따른 세라믹 슬러리 조성물은 무용제형으로 무기입자, 광경화성 수지, 광개시제 및 광증감제, 반응성 희석제, 커플링제 및 분산제로 이루어진다.The ceramic slurry composition according to the present invention is composed of an inorganic particle, a photo-curing resin, a photoinitiator, a photosensitizer, a reactive diluent, a coupling agent, and a dispersant as a solventless formulation.
먼저, 상기 무기입자는 세라믹계 분말로, 세라믹 슬러리 내에서의 침강방지를 위해 싸이즈는 0.1~3㎛ 이내를 유지하도록 하며, 그 함량비는 30~80중량부로, 이보다 적은 경우에는 무기입자의 기능을 제대로 수행하지 못하며, 그 보다 많은 경우에는 경화가 제대로 이루어지지 않고, 소결시 파손될 염려가 있다.First, the inorganic particles are ceramic-based powders. The size of the inorganic particles is set to be within a range of 0.1 to 3 占 퐉 in order to prevent sedimentation in the ceramic slurry. The content ratio thereof is 30 to 80 parts by weight, And in many cases, hardening is not properly performed, and there is a fear that the sintering will be broken.
또한, 상기 세라믹계 분말은, 모든 세라믹계 분말을 사용할 수 있으며, 상기 세라믹계 분말은, (a)산화물계로 알루미나, 지르코니아, 실리카, 코디에라이트, 뮬라이트, 마그네시아, 타이타니아 중 어느 하나이거나, (b)탄화물계로 SiC 또는 TiC이거나, (c)질화물계로 Si3N4, AlN, TiN 및 BN 중 어느 하나이거나, (d)복합산화물계로 바륨타이타네이트, PZT(lead zirconium titanate) 또는 산화물 페라이트이거나, (e)금속 산화물과 질화물의 화합물인 옥시나이트라이드계이거나, (f)유리계 분말로 글라스 세라믹 분말 또는 유리 프릿(frit)이거나, 또는 이들의 혼합물 중 어느 하나를 사용할 수 있다.The ceramic powder may be any one selected from the group consisting of (a) oxide, alumina, zirconia, silica, cordierite, mullite, magnesia and titania, SiC or TiC as the carbide system; (c) Si 3 N 4 , AlN, TiN and BN as the nitride system; (d) barium titanate, lead zirconium titanate (PZT) (e) an oxynitride compound which is a compound of a metal oxide and a nitride, or (f) a glass-ceramic powder or glass frit as the glass-based powder, or a mixture thereof.
그리고, 상기 광경화성 수지는 액상 형태로 제공되며, 광경화가 가능한 유기 관능기를 적어도 1관능기 이상 함유하는 에폭시계 아크릴 수지, 에테르계 아크릴 수지, 에스테르계 아크릴 수지 및 우레탄계 아크릴 수지 중 어느 하나를 사용한다.The photocurable resin is provided in a liquid form, and any one of epoxy-based acrylic resin, ether-based acrylic resin, ester-based acrylic resin and urethane-based acrylic resin containing at least one functional group capable of photo-curing is used.
구체적으로는 액상의 아크릴 모노머, 메타아크릴 모노머 등이 사용하며, 조형물의 강도 유지를 위하여 다관능 아크릴레이트를 사용하는 것이 바람직하다.Specifically, a liquid acrylic monomer, a methacrylic monomer, or the like is used, and a polyfunctional acrylate is preferably used to maintain the strength of the molding.
상기 광경화성 수지는 10~30중량부로 사용되며, 이 보다 적은 경우에는 광경화가 제대로 이루어지지 않으며, 점도가 높아져 세라믹 슬러리의 신속한 투입이 이루어지지 않게 된다. 더 많이 첨가하면 수지의 양이 너무 많아 소결 후 수축율이 너무 커져 조형물에 균열이 생기거나 형태 유지가 어렵게 된다.The photo-curing resin is used in an amount of 10 to 30 parts by weight. If it is less than 10 parts by weight, photo-curing is not properly carried out, the viscosity is increased, and the ceramic slurry can not be rapidly injected. If the amount of resin added is too large, the shrinkage ratio after sintering becomes too large, which may cause cracks in the molding or make it difficult to maintain the shape.
그리고, 상기 광개시제 및 광증감제는 자외선을 흡수하여 라디칼 혹은 양이온을 생성시켜 광중합을 개시하는 역할을 하는 것이면 모두 사용할 수 있으며, 예를 들어 벤조인이서 계열을 사용할 수 있다.The photoinitiator and photosensitizer may be any organic photoinitiator that absorbs ultraviolet light to generate radicals or cations to initiate photopolymerization. For example, a benzoin isocyanate series may be used.
상기 광개시제 및 광증감제는 3~10중량부로 사용되는 것이 바람직하며, 이 범위 내에서 적절한 에너지의 자외선을 가했을 시 광중합 반응이 가장 활발하였다.The photopolymerization initiator and the photosensitizer are preferably used in an amount of 3 to 10 parts by weight, and the photopolymerization reaction is most active when ultraviolet rays of appropriate energy are applied within this range.
그리고, 상기 반응성 희석제는 세라믹 슬러리 조성물의 점도와 반응성을 조절하기 위한 것으로서, 말단에 아크릴레이트기 또는 에폭시기를 포함하는 물질로 액상의 모노아크릴레이트 모노머, 모노메타아크릴레이트 모노머 등을 사용한다.The reactive diluent is used to control the viscosity and reactivity of the ceramic slurry composition, and a liquid monoacrylate monomer, monomethacrylate monomer, or the like is used as a material containing an acrylate group or an epoxy group at the terminal.
상기 반응성 희석제는 점도 5cps~50cps의 광경화가 가능하면서도 광경화성 수지의 성분인 다관능 아크릴레이트보다 점도가 낮아 고농도 슬러리 제작에 사용된다.The reactive diluent is capable of light curing at a viscosity of 5 cps to 50 cps and is lower in viscosity than a polyfunctional acrylate, which is a component of a photocurable resin, and is used for producing a high-concentration slurry.
상기 반응성 희석제는 5~20중량부를 사용하며, 이 보다 낮은 경우에는 세라믹 슬러리 조성물의 점도에 거의 영향을 미치지 않으며, 이 보다 높은 경우에는 세라믹 슬러리 조성물의 점도가 너무 낮아져 광경화가 제대로 이루어지지 않게 된다.The reactive diluent is used in an amount of 5 to 20 parts by weight, and if it is lower than the above range, the viscosity of the ceramic slurry composition is hardly affected. If it is higher than the above range, the viscosity of the ceramic slurry composition becomes too low.
그리고, 세라믹 슬러리 조성물에는 커플링제 0.05~3중량부, 분산제 0.05~3중량부가 혼합되어, 무기입자에 유기 작용기를 생성하여 액상의 광경화성 수지에 무기입자가 잘 분산되도록 한다. 각 커플링제와 분산제의 양은 무기입자가 가장 잘 분산될 수 있는 양이다.0.05 to 3 parts by weight of a coupling agent and 0.05 to 3 parts by weight of a dispersing agent are mixed in the ceramic slurry composition to generate an organic functional group in the inorganic particles to allow the inorganic particles to be well dispersed in the liquid photocurable resin. The amount of each coupling agent and dispersant is an amount by which the inorganic particles can be best dispersed.
또한, 상기 세라믹 슬러리 조성물에는 레벨링제 0.05~3중량부가 더 포함되며, 소포제 0.05~3중량부가 더 포함된다.The ceramic slurry composition further contains 0.05 to 3 parts by weight of a leveling agent and 0.05 to 3 parts by weight of a defoaming agent.
상기 레벨링제는 세라믹 슬러리의 슬립성을 향상시켜 광경화시 세라믹 슬러리의 신속한 투입이 가능하도록 하며, 소포제는 세라믹 슬러리 내의 기포 제거로 성형성을 향상시키고, 제품의 불량률을 최소화할 수 있다.The leveling agent improves the slipperiness of the ceramic slurry so that the ceramic slurry can be rapidly injected during the photo-curing. The defoaming agent improves the formability by removing bubbles in the ceramic slurry and can minimize the defective rate of the product.
본 발명에 따른 상기의 최적화된 성분비를 갖는 세라믹 슬러리 조성물은 점도가 500cps~3000cps, 바람직하게는 1000cps 이하로 형성되며, DLP 방식의 3D 프린터에 투입되어 소정 형상의 조형물로 제조되고, 소결 공정을 거쳐 조형물을 완성하게 된다.The ceramic slurry composition having the optimized composition ratio according to the present invention has a viscosity of 500 cps to 3000 cps, preferably 1000 cps or less. The ceramic slurry composition is put into a DLP type 3D printer to be manufactured into a predetermined shape product, And the sculpture is completed.
여기에서 소결 공정은 500℃~2000℃ 사이의 온도에서 이루어지며, 소결 공정이 완료되면 광경화성 수지를 비롯한 유기물 성분은 모두 없어지고, 무기물 성분 만이 소결 공정에 의해 결합되어 단단하게 성형되게 된다.
Here, the sintering process is performed at a temperature between 500 ° C and 2000 ° C. When the sintering process is completed, all the organic components including the photo-curing resin disappear, and only the inorganic component is combined by the sintering process to be hardened.
한편, 본 발명의 일실시예로, 무기입자로 입자 싸이즈가 1㎛인 알루미나 분말 60중량부, 광경화성 수지로 트리메틸올프로판 트리아크릴레이트(trimethylolpropane triacrylate, SR351) 20중량부, 광개시제로 Irgacure 907 5중량부, 광증감제로 Darocur ITX 2중량부, 반응성 희석제 Glycidyl methacrylate, SR379, 10중량부, 커플링제 KBM-503, 1중량부, 분산제 BYK-111, 0.5중량부, 레벨링제 BYK-UV3530, 1중량부, 소포제 BYK-353, 0.5중량부로 혼합하였다. 본 발명의 일실시예 의한 세라믹 슬러리 조성물의 점도는 1000cps 이하였다.
In an embodiment of the present invention, 60 parts by weight of alumina powder having a particle size of 1 mu m as inorganic particles, 20 parts by weight of trimethylolpropane triacrylate (SR351) as a photocurable resin, Irgacure 907 5 1 part by weight of a reactive diluent Glycidyl methacrylate, SR379, 10 parts by weight of a coupling agent KBM-503, 0.5 parts by weight of a dispersing agent BYK-111, 0.5 parts by weight of a leveling agent BYK-UV3530, 1 part by weight , And 0.5 part by weight of antifoaming agent BYK-353. The viscosity of the ceramic slurry composition according to one embodiment of the present invention was 1000 cps or less.
이와 같이 본 발명은 광경화형 세라믹 슬러리를 이용하여 복잡한 형상의 3차원 세라믹 조형물을 제작하기 위한 것으로서, 고농도 세라믹 슬러리의 저점도화를 실현하고, 고품질의 조형물을 성형하기 위한 세라믹 슬러리 조성물의 최적 비를 구현하고자 하는 것이다.As described above, the present invention is to produce a three-dimensional ceramic sculpture of complex shape using a photocurable ceramic slurry, realizes low viscosity of a high-concentration ceramic slurry, and realizes an optimum ratio of a ceramic slurry composition for molding a high quality sculpture I would like to.
특히, 반응성 희석제를 추가하여 고농도 세라믹 슬러리를 저점도화하여, 마이크로 빔을 이용하는 DLP 방식을 이용한 3D 프린팅에 최적화된 광경화성 조성물을 제공하여, 고정밀, 고품질의 부품을 생산해낼 수 있게 된다.In particular, by adding a reactive diluent, the high-concentration ceramic slurry can be made to have a low viscosity, and a photo-curable composition optimized for 3D printing using a DLP method using a micro beam can be provided, so that high-precision and high-quality parts can be produced.
Claims (9)
무기입자 30~80중량부, 광경화성 수지 10~30중량부, 광개시제 및 광증감제 3~10중량부, 반응성 희석제 5~20중량부, 커플링제 0.05~3중량부 및 분산제 0.05~3중량부를 포함하여 이루어진 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.In a ceramic slurry composition for 3D printing,
30 to 80 parts by weight of inorganic particles, 10 to 30 parts by weight of a photo-curing resin, 3 to 10 parts by weight of a photoinitiator and a photosensitizer, 5 to 20 parts by weight of a reactive diluent, 0.05 to 3 parts by weight of a coupling agent and 0.05 to 3 parts by weight of a dispersant Wherein the low-viscosity ceramic slurry composition for 3D printing is a low-viscosity ceramic slurry composition for 3D printing.
세라믹계 분말로 싸이즈는 0.1~3㎛인 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.The method according to claim 1,
The ceramic slurry composition for 3D printing according to claim 1, wherein the ceramic-based powder has a size of 0.1 to 3 占 퐉.
(a)산화물계로 알루미나, 지르코니아, 실리카, 코디에라이트, 뮬라이트, 마그네시아, 타이타니아 중 어느 하나이거나,
(b)탄화물계로 SiC 또는 TiC이거나,
(c)질화물계로 Si3N4, AlN, TiN 및 BN 중 어느 하나이거나,
(d)복합산화물계로 바륨타이타네이트, PZT(lead zirconium titanate) 또는 산화물 페라이트이거나,
(e)금속 산화물과 질화물의 화합물인 옥시나이트라이드계이거나,
(f)유리계 분말로 글라스 세라믹 분말 또는 유리 프릿(frit)이거나,
또는 이들의 혼합물 중 어느 하나인 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.The ceramic powder according to claim 2, wherein the ceramic-
(a) an oxide system selected from the group consisting of alumina, zirconia, silica, cordierite, mullite, magnesia, and titania,
(b) SiC or TiC as the carbide,
(c) a nitride based one of Si 3 N 4 , AlN, TiN, and BN,
(d) complex oxides such as barium titanate, lead zirconium titanate (PZT) or oxide ferrite,
(e) an oxynitride compound which is a compound of a metal oxide and a nitride,
(f) glass-based powder, glass-ceramic powder or glass frit,
Or a mixture thereof. ≪ RTI ID = 0.0 > 11. < / RTI >
광경화가 가능한 유기 관능기를 적어도 1관능기 이상 함유하는 에폭시계 아크릴 수지, 에테르계 아크릴 수지, 에스테르계 아크릴 수지 및 우레탄계 아크릴 수지 중에 어느 하나를 사용하는 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.The photocurable resin composition according to claim 1,
A low viscosity ceramic slurry composition for 3D printing, characterized in that any one of epoxy-based acrylic resin, ether-based acrylic resin, ester-based acrylic resin and urethane-based acrylic resin containing at least one functional group capable of photo-curing is used.
점도 5cps~50cps의 액상 모노아크릴레이트 또는 모노메타아크릴레이트를 사용하는 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.2. The method of claim 1, wherein the reactive diluent comprises:
Characterized in that a liquid monoacrylate or monomethacrylate having a viscosity of 5 cps to 50 cps is used as the low viscosity ceramic slurry composition for 3D printing.
레벨링제 0.05~3중량부가 더 포함되는 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.The ceramic slurry composition according to claim 1,
0.05 to 3 parts by weight of a leveling agent is added to the low-viscosity ceramic slurry composition for 3D printing.
소포제 0.05~3중량부 더 포함되는 것을 특징으로 하는 3D 프린틴용 저점도 세라믹 슬러리 조성물.The ceramic slurry composition according to claim 1,
0.05 to 3 parts by weight of an antifoaming agent is further included in the low viscosity ceramic slurry composition for 3D printing.
500cps~3000cps인 것을 특징으로 하는 3D 프린팅용 저점도 세라믹 슬러리 조성물.The ceramic slurry composition according to claim 1,
Wherein the low-viscosity ceramic slurry composition is in the range of 500 cps to 3000 cps.
DLP 방식의 3D 프린터에 투입되어 소정 형상의 조형물로 제조되고,
소결 공정을 거쳐 조형물을 완성하는 것을 특징으로 하는 슬러리 조성물을 이용한 조형물의 제조방법.A ceramic slurry composition according to any one of claims 1 to 8,
Is put into a DLP type 3D printer and is manufactured into a molding of a predetermined shape,
Wherein the sieving process is completed through a sintering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130166360A KR101551255B1 (en) | 2013-12-30 | 2013-12-30 | ceramic slurry composition with low viscosity for 3D printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130166360A KR101551255B1 (en) | 2013-12-30 | 2013-12-30 | ceramic slurry composition with low viscosity for 3D printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150077649A true KR20150077649A (en) | 2015-07-08 |
| KR101551255B1 KR101551255B1 (en) | 2015-09-09 |
Family
ID=53790359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130166360A Active KR101551255B1 (en) | 2013-12-30 | 2013-12-30 | ceramic slurry composition with low viscosity for 3D printing |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101551255B1 (en) |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965665A (en) * | 2016-05-10 | 2016-09-28 | 江苏道勤新材料科技有限公司 | Soft ceramic 3D printing material |
| KR101859642B1 (en) * | 2016-04-26 | 2018-05-18 | 고려대학교 산학협력단 | System for manufacturing three-dimensional porous scaffolds using photocurable slurry and method for manufacturing photocurable slurry |
| KR20180116776A (en) * | 2017-04-17 | 2018-10-26 | 고려대학교 산학협력단 | 3D plotting technique using photo-curable ceramic slurry |
| KR20190000579A (en) | 2017-06-23 | 2019-01-03 | 주식회사 팡세 | Composition for 3D printing and 3D printer using the same |
| KR20190000577A (en) | 2017-06-23 | 2019-01-03 | 주식회사 팡세 | Composition for 3D printing and 3D printing method using the same |
| KR20190034913A (en) * | 2017-09-25 | 2019-04-03 | 주식회사 엠오피(M.O.P Co., Ltd.) | Ceramic/metal slurry composition for digital light processing type 3D printer using surface modified pigment |
| CN109665819A (en) * | 2018-12-10 | 2019-04-23 | 北京工业大学 | A kind of preparation method of the porous minimal surface structure aluminium oxide ceramics based on 3D printing |
| KR20190044753A (en) * | 2017-10-23 | 2019-05-02 | 한국도자기주식회사 | Ceramic ware composition for binder jetting 3D printing and manufacturing method of ceramic ware using the composition |
| KR101969335B1 (en) * | 2018-01-29 | 2019-08-13 | 주식회사 엠오피(M.O.P Co., Ltd.) | Method for manufacturing structure for mobile device by using 3d printing |
| WO2019231179A1 (en) * | 2018-05-31 | 2019-12-05 | 주식회사 바이오알파 | Composition for fdm 3d printers |
| KR102138490B1 (en) * | 2020-01-31 | 2020-07-29 | (주)시지바이오 | Composition for FDM 3D printer based on alumina |
| KR20210012731A (en) * | 2019-07-26 | 2021-02-03 | 한국산업기술대학교산학협력단 | Piezoelectric composition for 3d printing, method for preparing piezoelectric energy harvester using 3d printing and piezoelectric energy harvester thereby |
| KR20210047428A (en) * | 2019-10-21 | 2021-04-30 | 고려대학교 산학협력단 | Slurry composite containing zirconia with high transmittance and strength, Preparation method thereof, and Ceramic structure using the same |
| KR20210085581A (en) * | 2019-12-30 | 2021-07-08 | 한국세라믹기술원 | Manufacturing method for shaping of ceramics by 3D printing and container for slurry |
| CN113173792A (en) * | 2021-04-09 | 2021-07-27 | 上海簇睿低碳能源技术有限公司 | Resin suitable for 3D printing of ceramic and preparation method thereof |
| WO2022034978A1 (en) * | 2020-08-14 | 2022-02-17 | 에이온 주식회사 | 3d printing ceramic slurry composition having high flexural strength |
| KR20220021833A (en) * | 2020-08-14 | 2022-02-22 | 에이온 주식회사 | Ceramic slurry compostion for 3D print with high flexural strength |
| US11674030B2 (en) | 2017-11-29 | 2023-06-13 | Corning Incorporated | Highly loaded inorganic filled aqueous resin systems |
| CN116809921A (en) * | 2023-07-11 | 2023-09-29 | 嘉兴饶稷科技有限公司 | Pure copper photocuring 3D printing high-photosensitive active slurry and preparation method thereof |
| CN117069498A (en) * | 2023-08-17 | 2023-11-17 | 上海应用技术大学 | Silicon carbide ceramic slurry for 3D printing, preparation method, application and silicon carbide ceramic |
| CN117088695A (en) * | 2023-08-30 | 2023-11-21 | 嘉兴饶稷科技有限公司 | A 3D printing method for ceramic slurry with surface oxidation modified silicon carbide powder |
| CN117447198A (en) * | 2023-10-16 | 2024-01-26 | 佛山(华南)新材料研究院 | 3D printed barium titanate ceramic and preparation method thereof |
| US11912860B2 (en) | 2018-03-29 | 2024-02-27 | Corning Incorporated | Highly loaded inorganic filled organic resin systems |
| CN117776676A (en) * | 2024-02-26 | 2024-03-29 | 上海南极星高科技股份有限公司 | Method for preparing magnesia porous ceramic by photo-curing 3D printing process |
| KR20240079225A (en) * | 2022-11-28 | 2024-06-05 | 국립창원대학교 산학협력단 | Dual-curable ceramic slurry composition for 3d printing and manufacturing method dual-curable ceramic structure using the same |
| KR20240105927A (en) * | 2022-12-29 | 2024-07-08 | 한국세라믹기술원 | SiC STRUCTURES AND METHOD FOR MANUFACTURING THE SAME |
| KR20240166775A (en) * | 2023-05-18 | 2024-11-26 | (주)레드자이언트 | UV curable ceramic ink composition |
| KR20250029416A (en) * | 2023-08-23 | 2025-03-05 | 동아대학교 산학협력단 | Manufacturing method of slurry for 3d printer containing natural polyol |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106495670B (en) * | 2016-10-13 | 2018-06-15 | 深圳市撒比斯科技有限公司 | For the adhesive, preparation method and application of photocuring ceramics 3D printing |
| KR101831819B1 (en) * | 2017-01-10 | 2018-02-23 | 경상대학교산학협력단 | The composition for 3D printing using epoxy resin, manufacturing method thereof, and manufacturing method of epoxy fiber |
| KR102216179B1 (en) | 2019-04-22 | 2021-02-16 | 한국화학연구원 | 3D printing Ink Composition for Preparing Catalyst Structure and Method for Preparing Catalyst Structure Using Same |
| KR102457877B1 (en) * | 2020-11-04 | 2022-10-24 | 한국세라믹기술원 | Photocurable ceramic complex ink composition and manufacturing method of printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390565A (en) | 1982-08-26 | 1983-06-28 | Lord Corporation | Photocurable compositions for use as ceramic ink vehicles |
| JP2003522821A (en) | 2000-02-08 | 2003-07-29 | バンティコ アクチエンゲゼルシャフト | Liquid radiation-curable compositions especially for stereolithography |
| EP1646493B1 (en) * | 2003-07-23 | 2011-11-16 | DSM IP Assets B.V. | Viscosity reducible radiation curable resin composition |
-
2013
- 2013-12-30 KR KR1020130166360A patent/KR101551255B1/en active Active
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101859642B1 (en) * | 2016-04-26 | 2018-05-18 | 고려대학교 산학협력단 | System for manufacturing three-dimensional porous scaffolds using photocurable slurry and method for manufacturing photocurable slurry |
| CN105965665A (en) * | 2016-05-10 | 2016-09-28 | 江苏道勤新材料科技有限公司 | Soft ceramic 3D printing material |
| KR20180116776A (en) * | 2017-04-17 | 2018-10-26 | 고려대학교 산학협력단 | 3D plotting technique using photo-curable ceramic slurry |
| KR20190000579A (en) | 2017-06-23 | 2019-01-03 | 주식회사 팡세 | Composition for 3D printing and 3D printer using the same |
| KR20190000577A (en) | 2017-06-23 | 2019-01-03 | 주식회사 팡세 | Composition for 3D printing and 3D printing method using the same |
| KR20190034913A (en) * | 2017-09-25 | 2019-04-03 | 주식회사 엠오피(M.O.P Co., Ltd.) | Ceramic/metal slurry composition for digital light processing type 3D printer using surface modified pigment |
| KR20190044753A (en) * | 2017-10-23 | 2019-05-02 | 한국도자기주식회사 | Ceramic ware composition for binder jetting 3D printing and manufacturing method of ceramic ware using the composition |
| US11674030B2 (en) | 2017-11-29 | 2023-06-13 | Corning Incorporated | Highly loaded inorganic filled aqueous resin systems |
| KR101969335B1 (en) * | 2018-01-29 | 2019-08-13 | 주식회사 엠오피(M.O.P Co., Ltd.) | Method for manufacturing structure for mobile device by using 3d printing |
| US11912860B2 (en) | 2018-03-29 | 2024-02-27 | Corning Incorporated | Highly loaded inorganic filled organic resin systems |
| WO2019231179A1 (en) * | 2018-05-31 | 2019-12-05 | 주식회사 바이오알파 | Composition for fdm 3d printers |
| CN109665819A (en) * | 2018-12-10 | 2019-04-23 | 北京工业大学 | A kind of preparation method of the porous minimal surface structure aluminium oxide ceramics based on 3D printing |
| KR20210012731A (en) * | 2019-07-26 | 2021-02-03 | 한국산업기술대학교산학협력단 | Piezoelectric composition for 3d printing, method for preparing piezoelectric energy harvester using 3d printing and piezoelectric energy harvester thereby |
| KR20210047428A (en) * | 2019-10-21 | 2021-04-30 | 고려대학교 산학협력단 | Slurry composite containing zirconia with high transmittance and strength, Preparation method thereof, and Ceramic structure using the same |
| KR20210085581A (en) * | 2019-12-30 | 2021-07-08 | 한국세라믹기술원 | Manufacturing method for shaping of ceramics by 3D printing and container for slurry |
| KR102138490B1 (en) * | 2020-01-31 | 2020-07-29 | (주)시지바이오 | Composition for FDM 3D printer based on alumina |
| WO2022034978A1 (en) * | 2020-08-14 | 2022-02-17 | 에이온 주식회사 | 3d printing ceramic slurry composition having high flexural strength |
| KR20220021833A (en) * | 2020-08-14 | 2022-02-22 | 에이온 주식회사 | Ceramic slurry compostion for 3D print with high flexural strength |
| CN113173792A (en) * | 2021-04-09 | 2021-07-27 | 上海簇睿低碳能源技术有限公司 | Resin suitable for 3D printing of ceramic and preparation method thereof |
| KR20240079225A (en) * | 2022-11-28 | 2024-06-05 | 국립창원대학교 산학협력단 | Dual-curable ceramic slurry composition for 3d printing and manufacturing method dual-curable ceramic structure using the same |
| WO2024117367A1 (en) * | 2022-11-28 | 2024-06-06 | 창원대학교 산학협력단 | Dual curable ceramic slurry composition for 3d printing and method for manufacturing dual curable ceramic structure using same |
| KR20240105927A (en) * | 2022-12-29 | 2024-07-08 | 한국세라믹기술원 | SiC STRUCTURES AND METHOD FOR MANUFACTURING THE SAME |
| KR20240166775A (en) * | 2023-05-18 | 2024-11-26 | (주)레드자이언트 | UV curable ceramic ink composition |
| CN116809921A (en) * | 2023-07-11 | 2023-09-29 | 嘉兴饶稷科技有限公司 | Pure copper photocuring 3D printing high-photosensitive active slurry and preparation method thereof |
| CN117069498A (en) * | 2023-08-17 | 2023-11-17 | 上海应用技术大学 | Silicon carbide ceramic slurry for 3D printing, preparation method, application and silicon carbide ceramic |
| KR20250029416A (en) * | 2023-08-23 | 2025-03-05 | 동아대학교 산학협력단 | Manufacturing method of slurry for 3d printer containing natural polyol |
| CN117088695A (en) * | 2023-08-30 | 2023-11-21 | 嘉兴饶稷科技有限公司 | A 3D printing method for ceramic slurry with surface oxidation modified silicon carbide powder |
| CN117447198A (en) * | 2023-10-16 | 2024-01-26 | 佛山(华南)新材料研究院 | 3D printed barium titanate ceramic and preparation method thereof |
| CN117776676A (en) * | 2024-02-26 | 2024-03-29 | 上海南极星高科技股份有限公司 | Method for preparing magnesia porous ceramic by photo-curing 3D printing process |
| CN117776676B (en) * | 2024-02-26 | 2024-06-04 | 上海南极星高科技股份有限公司 | Method for preparing magnesia porous ceramic by photo-curing 3D printing process |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101551255B1 (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101551255B1 (en) | ceramic slurry composition with low viscosity for 3D printing | |
| Schwentenwein et al. | Lithography-based ceramic manufacturing: A novel technique for additive manufacturing of high-performance ceramics | |
| EP3572874B1 (en) | Methods for making a metal, sand or ceramic object by additive manufacture and formulations for use in said methods | |
| CN106747360A (en) | A kind of preparation method of 3D printing photocuring ceramic size | |
| KR101969335B1 (en) | Method for manufacturing structure for mobile device by using 3d printing | |
| CN116813315A (en) | Ceramic slurry for additive manufacturing techniques | |
| CN107098715A (en) | A kind of ceramic part 3D printing method based on dual UV curable paint bonding agent | |
| KR102080321B1 (en) | Fabrication method of ceramic core based on 3d printing | |
| CN113501719A (en) | High-solid-content photosensitive silicon carbide ceramic slurry for 3D printing and preparation method thereof | |
| CN117303870B (en) | Zero-sintering shrinkage aluminum-based ceramic core material manufactured by photocuring additive | |
| KR102590474B1 (en) | Artificial marble | |
| CN117362016A (en) | Silicon oxide ceramic core and preparation method thereof | |
| JP6891394B2 (en) | Manufacturing method of three-dimensional model | |
| CN108249895A (en) | A kind of ceramic material and its 3D printing method of rapid curing forming | |
| CN114080375B (en) | Paste for ceramic three-dimensional modeling and method for producing three-dimensional modeling object | |
| JP7368787B2 (en) | Ceramics 3D modeling paste and method for producing three-dimensional objects | |
| JPH0891940A (en) | Optical molding method for ceramic | |
| CN117776734B (en) | An aluminum nitride ceramic part and its molding method | |
| JP6686909B2 (en) | Resin composition for three-dimensional modeling | |
| CN118930281A (en) | Silicon nitride ceramic based on DLP-3D printing and preparation method thereof | |
| JP5103346B2 (en) | Method for producing ceramic molded body and method for producing ceramic member | |
| CN108191410A (en) | A kind of 3D printing is molded cation photocuring type aluminium oxide ceramics paste compound | |
| KR102745851B1 (en) | Photocationically curable ceramic slurry composition for 3D printing and method for preparing thereof | |
| JPH06329460A (en) | Method for optical forming of ceramic | |
| CN112174652A (en) | Photocuring silicon dioxide ceramic slurry and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20131230 |
|
| PA0201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20141205 Patent event code: PE09021S01D |
|
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20150825 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20150902 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20150902 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20180627 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180627 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20190806 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190806 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200720 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210810 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20220705 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230621 Start annual number: 9 End annual number: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240624 Start annual number: 10 End annual number: 10 |