KR20150056556A - Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES - Google Patents
Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES Download PDFInfo
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- KR20150056556A KR20150056556A KR1020157007581A KR20157007581A KR20150056556A KR 20150056556 A KR20150056556 A KR 20150056556A KR 1020157007581 A KR1020157007581 A KR 1020157007581A KR 20157007581 A KR20157007581 A KR 20157007581A KR 20150056556 A KR20150056556 A KR 20150056556A
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- 229910045601 alloy Inorganic materials 0.000 title claims description 17
- 239000000956 alloy Substances 0.000 title claims description 17
- 229910017816 Cu—Co Inorganic materials 0.000 title description 2
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 6
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 238000004881 precipitation hardening Methods 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 abstract description 13
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000000523 sample Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 229910002668 Pd-Cu Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000575 Ir alloy Inorganic materials 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052789 astatine Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 Ag 20∼50질량%, Pd 20∼50질량%, Cu 10∼40질량%, Co 0.5∼30질량%로 이루어지고, 접촉저항이 낮고 내산화성이 우수하며, 경도가 단단하고, 가공성이 우수하며, Sn합금땜납에 대해 젖음성이 낮고, 또한 내Sn합금땜납 침식성을 가지는 것을 특징으로 하는 전기·전자기기 용도의 금속재료를 제공하는 것이다.The present invention relates to a copper alloy sheet comprising 20 to 50% by weight of Ag, 20 to 50% by weight of Pd, 10 to 40% by weight of Cu and 0.5 to 30% by weight of Co and has low contact resistance, excellent oxidation resistance, And has a low wettability with respect to a Sn alloy solder and also has an Sn alloy solder erosion resistance.
Description
본 발명은 전기·전자기기 용도의 금속재료에 관한 것이다.The present invention relates to a metal material for use in electric and electronic devices.
전기·전자기기 용도에 사용되는 금속재료는, 낮은 접촉저항이나 내산화성이 우수하다는 등의 제특성이 요구되기 때문에, 고가의 Pt합금, Au합금, Pd합금, Ag합금 등의 귀금속 합금을 널리 이용하고 있다. 그러나, 사용용도(반도체 집적회로 등의 검사용 프로브 등)에 따라서는, 낮은 접촉저항이나 내산화성 외에, 경도(내마모성) 등도 필요해진다. 그래서, 소성가공을 실시한 상태에서 높은 경도를 나타내는 Pt합금, Ir합금 등이나, 석출경화되는 Au합금, Pd합금 등이 자주 사용되고 있다(예를 들어, 특허문헌 1, 특허문헌 2).The metal materials used for electric and electronic devices are required to have properties such as low contact resistance and excellent oxidation resistance. Therefore, the noble metal alloys such as expensive Pt alloys, Au alloys, Pd alloys and Ag alloys are widely used . However, depending on the intended use (such as a probe for inspection of a semiconductor integrated circuit or the like), in addition to low contact resistance and oxidation resistance, hardness (abrasion resistance) is also required. Therefore, Pt alloys, Ir alloys, etc., which exhibit high hardness in the state of being subjected to plastic working, and Au alloys and Pd alloys that precipitate and cure are frequently used (e.g., Patent Document 1, Patent Document 2).
프로브의 검사대상이 Sn합금땜납 범프 등인 경우, 프로브의 재질이 Sn합금땜납에 포함되는 Sn에 대해 내침식성이 낮고, 또한, 젖음성이 좋으면, 몇 만 회나 되는 반복 동작시험시에, 프로브에 Sn합금땜납이 부착하기 쉬워지고, 그 결과, 저항값에 변화를 가져오기 때문에, 정확한 시험을 실시할 수 없게 되는 경우가 있다.When the probe is an Sn alloy solder bump or the like and the probe is made of a Sn alloy alloy having a low erosion resistance against Sn included in the solder alloy and a good wettability, The solder tends to adhere, and as a result, the resistance value is changed, so that the accurate test may not be performed.
그래서, 프로브에 Sn합금땜납이 부착하는 것에 대한 대책으로서, 어느 일정 횟수의 시험을 실시한 후에, 프로브의 선단을 세정하고 있다. 그러나, 프로브에 Sn합금땜납이 잘 부착되지 않게 할 수 있다면, 세정 횟수를 삭감시킬 수 있는데다가, 보다 정확한 시험이 가능해져, 검사 수율도 향상하게 된다.Therefore, as a countermeasure against adhesion of the Sn alloy solder to the probe, the tip of the probe is cleaned after a certain number of tests. However, if the Sn alloy solder can be prevented from adhering to the probe well, the number of times of cleaning can be reduced, more accurate testing becomes possible, and inspection yield can be improved.
이러한 요망에 대해 Ag도금, Pd도금을 실시하는 등의 연구·개발이 이루어져 있다. 그러나, 몇 만 회나 되는 반복 동작시험이나 세정을 하는 것에 의해, 도금 마모 등이 우려된다. 또한, 최근 검사대상이 미소화됨에 따라, 프로브 자체도 미소화가 진행되고 있어, 도금을 실시하는 것이 곤란한 경우도 생각할 수 있다(예를 들어, 특허문헌 3).Research and development such as Ag plating and Pd plating have been carried out for such a demand. However, by repeated operation test or cleaning several tens of thousands times, plating wear and the like may be caused. In addition, as the object to be inspected in recent years has become microscopic, the probe itself has been made much smaller, and it is conceivable that plating is difficult (for example, Patent Document 3).
본 발명은 Ag 20∼50질량%, Pd 20∼50질량%, Cu 10∼40질량%로 이루어지는 Ag-Pd-Cu합금에, 특정 원소인 Co 0.5∼30질량%를 첨가하는 것에 의해, Sn합금땜납에 포함되는 Sn을 주대상으로 하여 젖음성이 낮고, 또한 내침식성을 가지는 것을 특징으로 하는 전기·전자기기 용도의 Ag-Pd-Cu-Co합금을 제공하는 것이다. 또한, 본 발명에서의 Sn합금땜납은, Sn-Cu계, Sn-Ag계, Sn-Ag-Cu계, Sn-Zn-Bi계, Sn-Ag-In계, Sn-Zn-Al계 등으로 대표되는 Pb프리 땜납을 가리킨다.The present invention relates to a Sn-Pd-Cu alloy containing 0.5 to 30 mass% of Co as a specific element in an Ag-Pd-Cu alloy comprising 20 to 50 mass% of Ag, 20 to 50 mass% of Pd and 10 to 40 mass% The present invention provides an Ag-Pd-Cu-Co alloy for electric / electronic appliances characterized in that the main target of Sn included in solder is low wettability and also has corrosion resistance. The Sn alloy solder in the present invention may be at least one selected from the group consisting of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Zn-Bi, Sn-Ag- Refers to representative Pb-free solder.
본 발명에 있어서, Co의 첨가량을 0.5∼30질량%로 하는 이유는, Sn합금땜납에 대한 젖음성이 낮고, 또한 내침식성을 향상시키기 위해서이며, 0.5질량% 미만에서는 Sn합금땜납에 대한 내침식성이나 젖음성 저하의 효과는 나타나지 않고, 30질량%를 넘으면 현저하게 가공성이 저하되고, 게다가, 소정의 경도를 얻을 수 없기 때문이다.In the present invention, the reason why the amount of Co added is 0.5 to 30 mass% is that the wettability to the Sn alloy solder is low and the corrosion resistance is improved. When the amount is less than 0.5 mass%, the corrosion resistance to the Sn alloy solder The effect of lowering the wettability is not exhibited. If it exceeds 30 mass%, the workability is remarkably deteriorated, and furthermore, the predetermined hardness can not be obtained.
또한, 본 발명의 Ag-Pd-Cu합금에 Co를 첨가한 합금에, 추가로, 용도에 따라 특성을 개선하는 첨가원소로서, Au 0.1∼10질량% 및/또는 Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb, Ta의 군에서 선택된 적어도 1종 이상의 첨가원소를 0.1∼3.0질량% 첨가하는 것을 특징으로 한다. Au를 0.1∼10질량% 첨가하는 이유는, 내산화성 및 경도를 향상시키기 위해서이며, 0.1질량% 미만에서는 그 효과가 없고, 10질량%를 넘으면 가공성이 나빠지기 때문이다. Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb, Ta로 이루어지는 군에서 선택된 적어도 1종 이상의 첨가원소를 0.1∼3.0질량% 첨가하는 이유는, 경도를 향상시키기 위해서이다. Ni는, Ag-Pd-Cu합금의 석출 후의 절곡특성을 향상시키는 첨가원소로서도 작용한다. Re, Rh 및 Ru는, 결정립을 미세화시키는 첨가원소로서도 작용한다.In addition, the alloy containing Co in the Ag-Pd-Cu alloy of the present invention may further contain 0.1 to 10 mass% of Au and / or Ni, Pt, Re, Rh, At least one additional element selected from the group consisting of Ru, Si, Sn, Zn, B, In, Nb and Ta is added in an amount of 0.1 to 3.0 mass%. The reason for adding 0.1 to 10 mass% of Au is to improve the oxidation resistance and hardness. When the content is less than 0.1 mass%, the effect is not effective. When the content exceeds 10 mass%, the workability is deteriorated. The reason why 0.1 to 3.0 mass% of at least one additional element selected from the group consisting of Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb and Ta is added, to be. Ni also acts as an additive element for improving the bending property after precipitation of the Ag-Pd-Cu alloy. Re, Rh, and Ru also function as an additive element for refining the crystal grains.
본 발명에 의해, 접촉저항이 낮고 내산화성이 우수하며, 경도가 단단하며, 가공성이 우수하고, Sn합금땜납에 대해 젖음성이 낮고, 또한 내Sn합금땜납 침식성을 가지는 것을 특징으로 하는 전기·전자기기 용도의 금속재료를 제공하는 것이 가능해진다.According to the present invention, it is possible to provide an electric / electronic device which is low in contact resistance, excellent in oxidation resistance, hard in hardness, excellent in workability, low in wettability to Sn alloy solder, It becomes possible to provide a metal material for use.
이하에 본 발명의 실시예를 설명한다. 진공용해에 의해 각 Ag-Pd-Cu합금에 Co 또는, 용도에 따라 특성을 개선하는 첨가원소를 첨가한 합금의 잉곳(두께 10mm×폭 10mm×길이 100mm)을 제작했다.Hereinafter, embodiments of the present invention will be described. An ingot (10 mm in thickness x 10 mm in width x 100 mm in length) of an alloy containing Co or an additive element improving characteristics according to the application was added to each Ag-Pd-Cu alloy by vacuum melting.
공동(湯引) 등의 용해결함부를 제거한 후, 압연가공과 용체화 처리(800℃×1hr, H2와 N2의 혼합 분위기 중)를 판두께 0.3mm까지 반복하여, 최종단면감소율이 약 75%가 되도록 압연가공한 것을 시험편(두께 0.3mm×폭 20mm×길이 20mm)으로 하고, 석출경화의 조건은 H2와 N2의 혼합 분위기 중에서 300∼500℃×1hr로 실시했다. 또한, 시험편의 경도측정은, 표면경도를 비커스경도시험기로, HV 0.2로 측정했다.Co (湯引) such as defective melting portions and then removing, by repeating (of 800 ℃ × 1hr, H 2 and a mixed atmosphere of N 2) rolling and solution treatment to a thickness 0.3mm, the final cross-section reduction rate of about 75 (0.3 mm in thickness × 20 mm in width × 20 mm in length), and conditions for precipitation hardening were 300 to 500 ° C. for 1 hour in a mixed atmosphere of H 2 and N 2 . The hardness of the test piece was measured by HV 0.2 using a Vickers hardness tester.
Sn합금땜납에 대한 낮은 젖음성 및 내Sn합금땜납 침식성의 조사는, 시험편 위에 두께 0.8mm×폭 1.0mm×길이 10mm의 Sn합금땜납을 설치하고, 275℃에서 1min 가열유지한 후, 용융한 Sn합금땜납을 냉각하고 나서, 시험편의 외관을 관찰하는 것에 의해, Sn합금땜납에 대한 낮은 젖음성을 평가했다. 낮은 젖음성의 평가기준은, 용융된 Sn합금땜납 폭이 폭 3.0mm 미만인 것을 평가 A로 하고, 폭 3.0mm∼4.9mm인 것을 평가 B로 하고, 폭 5.0mm 이상을 평가 C로 했다. 또한, 시험편 및 Sn합금땜납의 단면조직 관찰에 의해 내Sn합금땜납 침식성을 평가했다. 내Sn합금땜납 침식성의 평가기준은, 시험편에 대한 Sn의 침식 깊이가 30㎛ 미만을 평가 A, 30∼59㎛를 평가 B, 60㎛ 이상을 평가 C로 했다.Sn alloy solder and Sn alloy solder erosion resistance were measured by placing a Sn alloy solder having a thickness of 0.8 mm, a width of 1.0 mm, and a length of 10 mm on the test piece, heating and maintaining at 275 캜 for 1 minute, After cooling the solder, the appearance of the test piece was observed to evaluate the low wettability of the Sn alloy solder. The evaluation criteria for the low wettability were evaluated as Evaluation A in which the melting Sn alloy solder width was less than 3.0 mm in width, Evaluation B in which the width was 3.0 mm to 4.9 mm, and Evaluation C was 5.0 mm in width or more. In addition, the Sn-based alloy solder erosion resistance was evaluated by observing the cross-sectional structure of the test piece and the Sn alloy solder. The evaluation criteria of the Sn alloy solder erosion resistance in the Sn alloy solder were as follows: Evaluation A for the Sn erosion depth of less than 30 占 퐉 for the test piece; Evaluation B for 30 to 59 占 퐉;
본 실시예의 용해방법은 진공용해를 이용했지만, 진공용해 이외의 여러 가지 금속용해방법, 예를 들어, 연속주조법, 가스용해 등의 여러 가지 금속용해법도 적용 가능하다. 또한, 향후 확립될 새로운 용해방법으로도 용해 가능할 것으로 추측된다.Although the melting method of this embodiment uses vacuum melting, various metal melting methods other than vacuum melting, for example, various casting methods such as continuous casting and gas melting, are also applicable. It is also assumed that it will be possible to dissolve into a new dissolution method to be established in the future.
본 실시예는 시험편으로서 판재를 제조하고 있기 때문에, 소성가공방법의 하나인 압연가공을 실시하고 있으나, 요구되는 형상에 맞춰, 압연가공 이외의 여러 가지 소성가공방법을 실시하는 것이 가능하다. 예를 들어, 요구되는 형상이 선상인 경우, 신선가공(인발가공), 혹은 스웨이징가공 등의 소성가공이 바람직하며, 프로브의 제조에 이용되는 프로브용 금속재료 등에 바람직하게 이용할 수 있다. 또한, 향후 확립될 새로운 소성가공방법으로도 가공 가능할 것으로 추측된다.In this embodiment, since the plate material is manufactured as a test piece, rolling processing, which is one of the plastic working methods, is performed. However, it is possible to carry out various plastic working methods other than the rolling process in accordance with the required shape. For example, when the required shape is linear, plastic working such as drawing (drawing) or swaging is preferable and can be preferably used for a metal material for a probe used for manufacturing a probe. It is also assumed that the new plastic working method to be established in the future will be able to be processed.
본 실시예에서 사용한 Sn합금땜납은, 센쥬긴조쿠고교주식회사제 에코솔더(등록상표)(Sn-Ag-Cu계)이지만, 그 외의 Pb프리땜납(Sn합금땜납)에서도, 젖음성이 낮고, 내Sn합금땜납 침식성의 향상을 확인할 수 있었다.Although the Sn alloy solder used in this embodiment is Eco Solder (registered trademark) (Sn-Ag-Cu system) manufactured by Senjingijok Kogyo Co., Ltd., other Pb-free solder (Sn alloy solder) An improvement in the erosion resistance of the alloy solder was confirmed.
표 1, 표 2에 실시예의 조성일람, 낮은 젖음성, 내Sn합금땜납 침식성, 가공 후 및 석출경화 후의 경도를 나타낸다.Table 1 and Table 2 show the composition of the examples, the low wettability, the Sn alloy solder erosion resistance, and the hardness after processing and after precipitation hardening.
표 2의 결과로부터, Ag-Pd-Cu에 Co를 첨가하지 않은 비교예 1 및 비교예 2에서는, 낮은 젖음성 및 내Sn합금땜납 침식성은 모두 평가 B이지만, 비교예 1 및 비교예 2에 Co를 10질량% 첨가한 실시예 1 및 실시예 2에서는, 낮은 젖음성 및 내Sn합금땜납 침식성 모두 향상을 확인할 수 있어, 평가 A였다.From the results shown in Table 2, both of the low wettability and the Sn alloy solder erosion resistance in Comparative Example 1 and Comparative Example 2 in which Co was not added to Ag-Pd-Cu were evaluated as B, but in Comparative Example 1 and Comparative Example 2, Co In Examples 1 and 2 in which 10 mass% was added, it was confirmed that improvement in both the wettability and the Sn alloy solder erosion resistance was evaluated, and it was evaluated as A.
마찬가지로, 비교예 3∼6에 관해서도, 낮은 젖음성 및 내Sn합금땜납 침식성 중 어디에도 평가 A인 것은 없었다. 실시예 3∼32의 Ag-Pd-Cu합금에 Co를 첨가하고, 또한 Au, Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb, Ta의 군에서 선택되는 적어도 1종을 첨가한 합금에서는, 낮은 젖음성 및 내Sn합금땜납 침식성이, 적어도 한쪽에서는 평가 A가 되고, 또한 평가 C는 확인되지 않아, Sn합금땜납에 대해 젖음성이 낮으며, 내Sn합금땜납 침식성의 향상을 확인할 수 있었다.Likewise, in Comparative Examples 3 to 6, there was no evaluation A in either of the low wettability and the Sn Sn alloy solder erosion resistance. And at least one element selected from the group consisting of Au, Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb and Ta was added to the Ag-Pd- In the alloy containing one kind of alloy, the low wettability and the Sn Sn alloy solder erosion property are evaluated at least at one side, and the evaluation C is not confirmed, and the wettability to the Sn alloy solder is low and the Sn Sn alloy solder erosion resistance Improvement.
[표 1][Table 1]
[표 2][Table 2]
Claims (5)
추가로, Au를 0.1∼10질량% 포함하는 것을 특징으로 하는 금속재료.The method according to claim 1,
Further, the metal material contains 0.1 to 10 mass% of Au.
추가로, Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb, Ta로 이루어지는 군에서 선택된 적어도 1종 이상의 첨가원소를 0.1∼3.0질량% 함유하는 것을 특징으로 하는 금속재료.3. The method according to claim 1 or 2,
Characterized by further comprising 0.1 to 3.0 mass% of at least one additional element selected from the group consisting of Ni, Pt, Re, Rh, Ru, Si, Sn, Zn, B, In, Nb and Ta. material.
소성가공 후의 석출경화시 경도를 200∼450 HV로 하는 것을 특징으로 하는 금속재료.3. The method according to claim 1 or 2,
And a hardness at the time of precipitation hardening after the plastic working is 200 to 450 HV.
소성가공 후의 석출경화시 경도를 200∼450 HV로 하는 것을 특징으로 하는 금속재료.The method of claim 3,
And a hardness at the time of precipitation hardening after the plastic working is 200 to 450 HV.
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| KR101957618B1 (en) * | 2014-11-07 | 2019-03-12 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Copper alloy target |
| WO2016159315A1 (en) * | 2015-03-31 | 2016-10-06 | 日本発條株式会社 | Alloy material, contact probe, and connection terminal |
| JP6728057B2 (en) * | 2015-03-31 | 2020-07-22 | 日本発條株式会社 | Alloy materials, contact probes and connection terminals |
| JP6713006B2 (en) * | 2016-01-25 | 2020-06-24 | 田中貴金属工業株式会社 | Sliding contact material and manufacturing method thereof |
| US10385424B2 (en) * | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
| JP6647075B2 (en) * | 2016-02-19 | 2020-02-14 | 日本発條株式会社 | Alloy materials, contact probes and connection terminals |
| CN111511939B (en) * | 2017-12-27 | 2021-09-14 | 株式会社德力本店 | Precipitation hardening type Ag-Pd-Cu-In-B alloy |
| JP7014003B2 (en) * | 2018-03-28 | 2022-02-01 | 住友金属鉱山株式会社 | Copper alloy target for solder joint electrode and film formation of solder joint electrode |
| CN117015625A (en) * | 2021-03-26 | 2023-11-07 | 石福金属兴业株式会社 | Alloy material for probe |
| TW202248651A (en) * | 2021-03-26 | 2022-12-16 | 日商友華股份有限公司 | Probe |
| WO2022202681A1 (en) * | 2021-03-26 | 2022-09-29 | 石福金属興業株式会社 | Alloy material for probe pins |
| JP7072126B1 (en) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Material for probe pins made of Ag-Pd-Cu alloy |
| CN117026055B (en) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | Palladium alloy for semiconductor chip test probe and preparation method thereof |
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| JPS59107049A (en) * | 1982-12-09 | 1984-06-21 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
| US5290371A (en) * | 1992-10-28 | 1994-03-01 | The J. M. Ney Company | Dental alloy and restoration made therewith |
| US5484569A (en) * | 1994-08-12 | 1996-01-16 | The J. M. Ney Company | Silver palladium alloy |
| US5833774A (en) * | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
| JP4057129B2 (en) * | 1998-02-25 | 2008-03-05 | 株式会社徳力本店 | Magnetic alloy for dental casting |
| JP4738557B2 (en) * | 1999-04-08 | 2011-08-03 | 株式会社徳力本店 | Magnetic alloy for dental casting |
| JP4176133B1 (en) * | 2007-06-06 | 2008-11-05 | 田中貴金属工業株式会社 | Probe pin |
| KR101512681B1 (en) * | 2008-03-24 | 2015-04-16 | 가부시끼 가이샤 구보다 | Pipe provided with corrosion prevention layer on the outside surface, process for production of the same, and process for production of alloy wires to be used for corrosion prevention of outside surface of the pipe |
| JP5657881B2 (en) * | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | Probe pin material |
| WO2011149290A2 (en) * | 2010-05-27 | 2011-12-01 | Park Hyung-Seok | Metal alloy for fusion of dental ceramics, and dental prosthesis |
| WO2012077378A1 (en) * | 2010-12-09 | 2012-06-14 | 株式会社徳力本店 | Material for electrical/electronic use |
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