KR20150032644A - Method for manufacturing groove for grinding of resin-bond grindstone, resin-bond grindstone, and apparatus and method for processing plate-like body - Google Patents

Abstract

The present invention relates to a method of manufacturing a polishing groove of a resin bonded stone capable of making a polishing groove for polishing an end portion of a plate-like body into a groove shape matching the shape of a rim of a plateau, A plate machining apparatus using a grindstone, a resin bonded stone, and a method for machining a plate are provided. The outer peripheral surface 43 of the resin bond stone 26 is pressed against the chamfered surface by grinding the rim portion 12A of the glass plate 12 by the metal bond stone 18 to form a chamfered surface, (44) is formed on the outer peripheral surface (43) According to this manufacturing method, the annular groove 44 having the same outline shape as the chamfered surface of the glass plate 12 can be manufactured on the outer peripheral surface 43 of the resin bonded stone 26. In addition, while manufacturing the annular groove 44, the chamfered surface can be polished by the manufactured annular groove 44. [ Therefore, the chamfering efficiency of the glass plate 12 is improved.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for manufacturing a resin-bonded-abrasive grindstone, a resin-bonded grindstone, a processing device for a plate-shaped body, and a method for processing a plate- PLATE-LIKE BODY}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a polishing groove for a resin bonded stone, a resin bonded stone, a processing apparatus for a plate, and a method for processing a plate.

A glass plate for an FPD (Flat Panel Display) used in a plate chain, a liquid crystal display, a plasma display, or the like is formed into a plate in a molten glass, and then cut into a glass plate of a predetermined rectangular size by a cutting device. Thereafter, the glass plate is ground and chamfered by the chamfer grinding wheel of the chamfering apparatus (plate-shaped body processing apparatus) disclosed in Patent Document 1 or the like.

Further, the chamfering device described in Patent Document 2 includes a chamfer grinding wheel, a cooling liquid (grinding liquid) injection nozzle, and the like. The chamfered grinding wheel is rotated about an axis parallel to the axis orthogonal to the main surface of the glass plate and the rotational direction thereof is set to a direction opposite to the conveying direction of the glass plate in the grinding portion of the glass plate. An arc-shaped grinding groove is formed on the outer circumferential surface of the grinding wheel for chamfering, and the edge of the glass plate is ground in a circular arc shape by the grinding groove.

In addition, as disclosed in Patent Document 3, there is known a plate-shaped chamfering device provided with a metal-bonded grinding wheel for grinding (coarse machining) and a resin-bonded grinding wheel for polishing (precision machining). According to this chamfering apparatus, the edge of the plate-shaped body is ground by the metal bond grindstone to form a chamfered surface at the edge portion, and then the chamfered surface is polished by the resin bond stone.

On the outer circumferential surface of the resin bonded bone wheel of Patent Document 3, a polishing groove is formed in which the chamfered surfaces of the plate bodies are contacted.

Japanese Patent Application Laid-Open No. 2002-160147 Japanese Patent Application Laid-Open No. 2009-172749 Japanese Patent Laid-Open No. 2001-71244

In recent years, there has been an increasing need to perform finishing by increasing the quality requirement for chamfering the rim of the plate. When the finishing is performed by a resin bonded stone disclosed in Patent Document 3, it is necessary to prepare a groove shape matching the shape of the rim of the plate. Further, in order to perform finishing with high quality, it is necessary to accurately align the grooves of the finishing stone at the edge of the plate. This adjustment required skill and was also time-consuming.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method of manufacturing a polishing groove for a resin bonded bond stone, which can manufacture a polishing groove for polishing an end portion of a plate- And a method for processing a plate-shaped body using the resin-bonded stone and a method for processing the plate-shaped body.

In order to achieve the above-described object, the present invention provides a method of manufacturing a resin bond stone, comprising the steps of: arranging and arranging a plate-shaped body having a flat outer circumferential surface and a harder plate than a bond of the resin- Wherein the annular polishing groove is formed by relatively pressing the outer circumferential surface of the plate-like body and the edge of the plate-like body, and transferring the shape of the rim portion of the plate-like body to the outer circumferential surface of the resin- Of the present invention.

According to the present invention, a resin-bonded stone having a flat outer peripheral surface and a plate-like body harder than the bond (binder) of the resin-bonded stone are arranged and arranged. Then, the outer periphery of the resin bond stone and the rim of the plate-like body are relatively pressed while rotating the resin-bond stone at the central axis of the resin-bond stone. Thus, the outer circumferential surface of the resin bond stone is ground by the rim of the plate-like body, so that an annular polishing groove can be produced in which the contour of the rim of the plate-like body is transferred to the outer circumferential surface of the resin bond stone. Further, according to the present invention, it is not necessary to adjust the existing groove of the resin bonded stone to the position of the rim of the plate like the conventional resin bonded grindstone. That is, in one embodiment of the present invention, the edges of the plate can be polished simultaneously with the production of the polishing grooves.

In a preferred embodiment of the present invention, the rim of the plate-like body is ground in a predetermined shape by a metal-bonded grindstone while the rim of the plate- Is relatively pressed to manufacture the abrasive grooves on the outer circumferential surface of the resin bonded stone.

According to one embodiment of the present invention, the rim of the plate-shaped body is ground by the metal-bonded grindstone, and a chamfered surface is formed in the rim. Then, the chamfered surface and the flat outer peripheral surface of the resin bond stone are relatively pressed. Thus, a polishing groove having the same shape as the contour of the chamfered surface can be formed on the outer peripheral surface of the resin bonded stone.

In one embodiment of the present invention, it is preferable that the outer circumferential surface of the resin bonded stone be pressed against the edge portion of the edge portion of the plate body, excluding the corner portion, to manufacture the polishing groove.

When the corner portion of the rim of the plate and the outer peripheral surface of the resin bond stone are relatively pressed, an external force due to the rotation of the resin bond stone acts on the corner portion, so that stress is concentrated on the corner portion.

On the other hand, according to one embodiment of the present invention, since the edge of the rim of the plate-like member and the outer peripheral surface of the resin bonded-bond stone are relatively pressed, the stress is dispersed, whereby breakage of the plate-shaped body can be prevented.

In one embodiment of the present invention, the bond of the resin bonded stone is phenol, epoxy, polyimide, polyurethane, silicone, butyl rubber, or natural rubber, and the abrasive grains of the resin bond stone include diamond, cubic boron nitride ), Alumina (Al ₂ O ₃ ), silicon carbide (SiC), pumice, or garnet, and the plate is preferably a glass plate.

According to one embodiment of the present invention, a polishing groove is formed on the outer circumferential surface of the resin bond stone by the rim of the hard glass plate than the bond of the resin bond stone. Further, the edge portion of the glass plate can be polished by the produced polishing groove. That is, the production of the grooves for polishing and the polishing of the rims by the manufactured grooves can be carried out in the same step. Also, the glass plate is harder than the bond of the resin bond stone.

In order to achieve the above object, the present invention provides a resin bonded stone wheel manufactured by the method for manufacturing a resin-bonded abrasive groove of the present invention.

In order to achieve the above-described object, the present invention provides a method of polishing a resin-bonded stone, comprising the steps of: holding a platen, holding the platy material; grinding the edge of the platy material held by the platen; A rotating means for rotating the center of the plate-like body about the central axis of the plate-shaped body, a grinding groove of the resin-bonded grindstone and a rim of the plate- And a spraying means for spraying a cooling liquid to a contact point between the abrasive groove of the resin bond stone and the rim of the plate-like body.

Further, an embodiment of the present invention provides a method of processing a plate member, wherein the edge of the plate member is processed by using the above-described processing apparatus according to an embodiment of the present invention.

According to the present invention, the resin bond stone is rotated by the rotating means. Then, the abrasive grooves of the resin bonded grindstone and the rim of the plate-like object held on the surface plate are brought into contact with each other by the moving means to move the resin bond-bonded grindstone or the plate-like object along the rim of the plate- Then, the cooling liquid is injected by the injection means to the contact point between the abrasion groove of the resin bond stone and the rim of the plate-like body. Thus, the edge of the plate can be smoothly polished by the polishing groove of the resin bonded bond stone.

In an embodiment of the present invention, there is provided a metal bond grinder for grinding and chamfering a rim of the plate held by the base, wherein the resin bonded grinding wheel is formed by grinding the chamfered rim of the plate- It is preferable to mirror-surface-process.

According to one embodiment of the present invention, the edge portion of the plate-shaped body is chamfered by the metal bond grindstone to form a chamfered surface at the rim portion. Then, the chamfering surface is polished by the resin bond stone to mirror-surface processing.

According to the present invention, the polishing groove for polishing the end portion of the plate-shaped body can be formed into a groove shape that matches the shape of the edge portion of the plate-shaped body.

1 is a plan view of a chamfer device to which a plate processing device of the present invention is applied.
Fig. 2 is a perspective view showing the arrangement position of the grindstone, the glass plate, and the nozzle.
3A is an explanatory diagram in which the grinding grooves of the metal bond grindstone are arranged opposite to the rim of the glass plate.
FIG. 3B is an explanatory diagram in which the edge of the glass plate is ground by the metal bond grindstone. FIG.
3C is an enlarged view of a rim of a glass plate on which a chamfered surface is formed by grinding.
4 is a side view of the metal bond stone.
5 is an overall perspective view of a resin bonded stone.
6A is an explanatory diagram showing a manufacturing method for manufacturing a polishing groove on a resin bond stone.
6B is an explanatory view showing a manufacturing method of manufacturing a polishing groove on a resin bond stone.
7 is an explanatory view of pressing a resin bond stone to a corner portion of the rim of the glass plate.
8 is an explanatory view of pressing a resin bond stone to the edge of the rim of the glass plate.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of a method for manufacturing a polishing groove for a resin bonded stone according to the present invention, a resin bonded stone, a processing apparatus for a plate member, and a method for processing a plate member will be described in detail with reference to the accompanying drawings.

1 is a plan view of a chamfering apparatus 10 of an embodiment to which a plate processing apparatus of the present invention is applied. The chamfering device 10 has a configuration in which the edges 12A to 12D of a glass plate (plate) 12 for a liquid crystal display having a thickness of 0.7 mm or less are ground and chamfered, and a chamfered chamfered surface is polished, Processing equipment.

Further, the plate member applicable to the working apparatus of the present invention is not limited to the glass plate for liquid crystal display. For example, it may be a glass plate for FPD such as a glass plate for a plasma display, a glass plate for an LED display, or a general glass plate for a solar cell, an illumination, a building material, or a mirror. A plate made of metal or resin can also be applied. The thickness of the plate member is not limited to 0.7 mm or less, and may be thicker than 0.7 mm.

The chamfering device 10 includes a base 14 for holding and holding a rectangular glass plate 12, a moving device (moving means) 16 for reciprocating the base 14 in the direction of the arrow AB, A pair of disk-shaped or cylindrical metal-bonded grinding wheels 18 and 20 for grinding the metal-bonded grinding wheels 12A to 12D to form chamfered surfaces on the rim, motors 22 and 24 for rotating the metal-bonded grinding wheels 18 and 20 at high speed (Rotation means) 30 and 32 for rotating the resin bond-bonded grinding wheels 26 and 28 at a high speed, a metal bond (not shown) for rotating the resin bond- 34 and 36 for spraying the coolant onto the machined portion (contact point) by the grinding wheels 18 and 20 and the machined portion (contact point) by the resin bonded grinding wheels 26 and 28 (Injecting means) 38, 40, and the like. A method of manufacturing the polishing grooves of the resin bonded grinding wheels 26 and 28 will be described later. The shapes of the metal bonded grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 are not limited to the disc or cylinder but may be cylindrical.

The chamfering device 10 of the embodiment is a chamfering device in which a glass plate 12 is adhered to an adsorption surface of an upper surface of a surface plate 14 in a state in which a rim portion of a glass plate 12 having two opposed main surfaces is exposed from an upper surface of the surface plate 14. [ And the base 14 is moved by the moving device 16 in the direction of arrow A. During this movement, the opposing edge portions 12A and 12B of the glass plate 12 are ground by the metal bonded grinding wheels 18 and 20 rotating in the direction opposite to the moving direction of the glass plate 12, . Then, the chamfered surfaces are polished by the resin bonded grinding wheels 26, 28 rotating in the direction opposite to the moving direction of the glass plate 12. [ Thus, the edge portions 12A and 12B of the glass plate 12 are chamfered, and then mirror-finished.

The cooling fluid is injected from the nozzle 34 to the machining portion where the metal bond stone 18 and the rim portion 12A of the glass plate 12 are in contact with each other and the metal bond stone 20 and the glass plate 12 The cooling liquid is sprayed from the nozzle 36 to the machining portion which is in contact with the rim portion 12B. The cooling liquid is sprayed from the nozzle 38 to the machining portion where the resin bond stone 26 and the rim portion 12A of the glass plate 12 are in contact with each other and the resin bond stone 28 and the glass plate 12 The cooling liquid is ejected from the nozzle 40 to the machining portion to which the rim portion 12B of the nozzle 40 contacts.

Thus, since the machined portion is cooled by the cooling liquid, the occurrence of burning, cracking, and the like occurring in the rim portions 12A, 12B of the glass plate 12 is reduced. Chipping occurring at the interface between each of the two main surfaces of the glass plate 12 and the end surfaces of the rim portions 12A and 12B is also reduced. As the cooling liquid, pure water, grinding oil, and mixtures thereof can be exemplified.

In the chamfering device 10, the metal bond grindstone 18 and the resin bond stone 26 are integrally joined to each other so as to be chamfered and mirror-finished simultaneously on the pair of opposing edge portions 12A, 12B of the glass plate 12, And the metal bond stone 20 and the resin bond stone 28 are arranged so as to face the rim portion 12B. The resin bonded grinding wheels 26 and 28 are disposed on the downstream side of the glass plate 12 in the carrying direction with respect to the metal bonded grinding wheels 18 and 20.

1, the metal-bonded grinding wheel 18 is rotated in the clockwise direction by the motor 22, and the metal-bonded grinding stone 20 is rotated in the counterclockwise direction by the motor 24. Further, the resin bond stone 26 is rotated in the clockwise direction by the motor 30, and the resin bond stone 28 is rotated in the counterclockwise direction by the motor 32. The number of revolutions of the grinding wheels 18, 20, 26, 28 is preferably set to 3000 rpm or more.

1 shows the chamfering device 12 for machining the rim portions 12A and 12B by the fixed metal bond grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 while moving the glass plate 12 in the direction of the arrow A But the present invention is not limited thereto. It may be a chamfering device that fixes the glass plate 12 and moves the metal bond grindstone 18 and 20 and the resin bonded grindstone 26 and 28 along the rim portions 12A and 12B of the glass plate 12. [ The chamfering device may also move the metal bonded grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 and the glass plate 12 in a direction approaching each other along the rim portions 12A and 12B of the glass plate 12 . The other opposing rim portions 12C and 12D of the glass plate 12 are connected to the metal bonding grids 18 and 20 and the metal bonding grids 26 and 28 disposed at the rear ends of the resin bonded grinding wheels 26 and 28, It may be machined by grinding wheel and resin bonded grinding wheel. Alternatively, the glass plate 12 is moved in the B direction by the platen 14 and returned to its original position. Subsequently, the glass plate 12 is rotated by the platen 14 along the vertical line in the main surface direction of the glass plate 12 The glass plate 12 is moved in the A direction by the base 14 and the metal bond grinding wheels 18 and 20 whose intervals are changed in accordance with the lengths of the rim portions 12A and 12B of the glass plate 12 And the resin-bonded grinding wheels 26 and 28 may be used to process the rim portions 12C and 12D.

2 is a perspective view showing the positions of the metal bond grindstone 18, the resin bond stone 26 and the nozzles 34, 38 with respect to the glass plate 12. As shown in Fig. The metal bonded grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 are arranged to face the end face 12E of the glass plate 12. Here, the end face 12E is a face in the direction orthogonal to the main face 12F of the glass plate 12, and is a face before machining. The edges 12A to 12D are referred to as edge portions 12A to 12D and the edges of the edge portions 12E to 12D of the metal bond grinding wheels 18 and 20 are referred to as edge portions 12A to 12D. And the resin bonded grinding wheels 26 and 28. The rotation axes of the metal bonded grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 may be inclined at a predetermined angle with respect to the water line formed on the main surface 12F of the glass plate 12 as described in Patent Document 1 .

The metal bonded grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28 are simultaneously rotated and moved by the movement of the glass plate 12 by the moving device 16 shown in Fig. The parts 12A and 12B are simultaneously machined by the metal bond grinding wheels 18 and 20 and the resin bonded grinding wheels 26 and 28. [

Figs. 3A and 3B are enlarged cross-sectional views of main portions of the outer circumferential surface of the metal-bonded grinding wheel 18. Fig. Since the metal-bonded grinding wheels 18 and 20 shown in Fig. 1 have the same configuration, the metal-bonded grinding stone 18 will be described here, and the description of the metal-bonded grinding stone 20 will be omitted.

On the outer circumferential surface of the metal-bonded grinding wheel 18, an annular groove 42, which is a grinding groove, is formed in a horizontal direction (orthogonal to the rotation axis indicated by one-dot chain line in Fig. 4). As shown in the side view of the metal bonded grinding wheel 18 in Fig. 4, the annular grooves 42 are provided in parallel in the vertical direction.

The sectional shape of the annular groove 42 in the thickness direction of the metal bond stone 18 is not limited to the U shape shown in Figs. 3A and 3B, and may be a V shape or a concave shape. The number of the annular grooves 42 may be one. However, in order to omit the exchange operation of the metal bond grindstone 18, a plurality of the annular grooves 42 may be provided at predetermined intervals in the thickness direction of the metal- . A plurality of annular grooves 42 are provided in the metal bond grindstone 18 so that when the annular groove 42 in use is at the end of its life, (The thickness direction of the metal-bonded grinding stone 18) in the pitch unit of the glass plate 12 in the pitch unit of the glass plate 12 12A). The shape of the annular groove 42 may be a shape having a single radius of curvature. The shape of the annular groove 42 may be a part for grinding the end face 12E as shown in Fig. 3A and a rim portion 12A of the glass plate 12 shown in Fig. The end surface 12G of the main surface 12F and the end surface 12G of the main surface 12F may have a different radius of curvature.

3A, the annular groove 42 of the metal-bonded stone 18 in the horizontal direction is opposed to the end face 12E of the glass plate 12. From this state, the metal-bonded stone 18 And is sent in the horizontal direction toward the end face 12E. When the annular groove 42 of the metal bond stone 18 contacts the end face 12E, the metal bond stone 18 is fed toward the rim portion 12A by the amount of grinding as shown in Fig. 3B. 3C, the rim portion 12A is ground by the annular groove 42, and a chamfered surface is formed in the rim portion 12A. 3B, the metal bond grindstone 18 is attached to the rim portion 12A so that the central portion of the end face 12E in the thickness direction of the glass plate 12 comes into contact with the deepest portion of the annular groove 42, Lt; / RTI >

Next, a first manufacturing method of the annular groove 44 shown in Fig. 2, which is a polishing groove for the resin bonded grinding wheels 26 and 28, will be described. Since the resin bonded stone 26 and the resin bonded stone 28 are the same, the resin bonded stone 26 will be described here, and the resin bonded stone 28 will not be described. Further, the description related to the resin bonded stone 28 is omitted.

5 is an overall perspective view showing a resin bonded-bonded stone 26 in a state in which the annular groove 44 is not formed. The resin bonded bond wheel 26 is formed in a disc shape, a cylindrical shape, or a cylindrical shape, and the outer peripheral surface 43, which is a polishing surface, is a flat grinding wheel. 6A and 6B are explanatory diagrams showing a procedure for manufacturing the annular groove 44 in the resin bonded stone 26 of FIG. 6A and 6B, a glass plate 12 for manufacturing the annular groove 44 is shown. Naturally, the glass plate 12 is harder than the bond of the resin bond stone 26.

In manufacturing the annular groove 44, the chamfered surface of the rim portion 12A of the glass sheet 12 ground by the metal-bonded grinding stone 18 of the chamfering device 10 is set to be a flat outer peripheral surface of the resin- (43).

1 using the base 14, the moving device 16, the motors 30 and 32 and the nozzles 38 and 40, the edge 12A of the glass plate 12 Bonded to the outer peripheral surface 43 of the resin bond-bonded grinding wheel 26, 28 by pressing the flat outer peripheral surface 43 of the resin bonded-bond stone 26 against the chamfered surface while grinding the metal- The annular groove 44 is formed.

The annular groove 44 having the same contour as the chamfered surface of the glass plate 12 can be manufactured on the outer peripheral surface 43 of the resin bonded stone 26. [ In addition, while manufacturing the annular groove 44, the chamfered surface can be polished by the manufactured annular groove 44. [ Therefore, the chamfering efficiency of the glass plate 12 is improved.

The resin bonded stone 26 on which the annular groove 44 is formed by the above-described manufacturing method is continuously used in the chamfering device 10. When the service life of the first annular groove 44 is completed, the resin bond stone 26 is raised by a predetermined amount and the second new annular groove 44 is formed on the flat outer peripheral surface 43 in the above- do. The annular groove 44 is formed by the rim portion 12A of the glass plate 12 held by the rim 14 so that the height of the annular groove 44 with respect to the height of the rim portion 12A The adjustment becomes unnecessary.

That is, in the resin-bonded-type grindstone of Patent Document 3 in which the annular groove 44 is formed in advance, the height adjustment is necessary every time the old annular groove is changed to the new annular groove. However, . Thus, according to the above manufacturing method, the chamfering efficiency can be improved.

The chamfering device 10 shown in Fig. 1 is provided with the metal bond grinding wheels 18 and 20, but only the chamfering devices without the metal bonded grinding wheels 18 and 20, i.e., the resin bonded grinding wheels 26 and 28 The present invention can also be applied to a chamfering device for polishing the rim portions 12A and 12B of the glass plate 12 by means of the chamfering device.

2, the outer peripheral surface 43 of the resin bond stone 26 is pressed against the edge S of the rim 12A of the glass plate 12 excluding the corner C, .

Figs. 7 and 8 show the pressing position of the resin bond stone 26 with respect to the rim portion 12A of the glass plate 12. Fig.

7, when the corner C of the rim portion 12A of the glass plate 12 and the outer peripheral surface of the resin bonded grinding wheels 26 and 28 are relatively pressed, an external force due to the rotation of the resin bonded grinding wheels 26 and 28 The stress acts on the corner C to concentrate the stress on the corner C, and the corner C may be broken.

On the other hand, as shown in Fig. 8, when the edge portion S of the rim portion 12A of the glass plate 12 and the outer peripheral surface of the resin bonded-bond stone 26 are relatively pressed, the stress is dispersed, so that breakage of the glass plate 12 can be prevented have.

The resin bond stone 26 is a grinding wheel that holds abrasive grains of a thermosetting resin. Examples of the bond include phenol, epoxy, polyimide, polyurethane, silicone, butyl rubber, and natural rubber. Examples of the abrasive grains include diamond, cubic boron nitride (CBN), alumina (Al ₂ O ₃ ), silicon carbide (SiC), pumice, garnet and the like. The abrasive grain size of the resin bonded bond stone 26 is preferably 200 to 1500 (JIS R6001: 1998), for example, when the abrasive grains are diamond.

The present application is based on Japanese Patent Application No. 2013-193933 filed on September 19, 2013, the contents of which are incorporated herein by reference.

10: Chamfer device
12: Glass plate
12A to 12D: the rim of the glass plate
12E, 12E ': End face of the glass plate
12F: Main surface of glass plate
12G: Interface of glass plate
14: Plate
16: Mobile device
18, 20: Metal bond stone
22, 24: motor
26, 28: Resin bond stone
30, 32: motor
34, 36, 38, 40: Nozzles
42, 44: annular groove

Claims (8)

A resin bonded bond stone having a flat outer circumferential surface and a plate body which is harder than the bond of the resin bond stone are arranged and arranged,
The outer peripheral surface of the resin bond stone and the rim portion of the plate-like body are relatively pressed while rotating the resin-bonded grindstone around the central axis, and the shape of the rim portion of the plate- A method for manufacturing a polishing groove for a resin bonded stone, characterized by manufacturing an annular polishing groove. The method according to claim 1,
The edge portion of the plate-like body is ground in a predetermined shape by a metal bond stone to relatively press the edge portion of the plate-like object ground in the predetermined shape and the outer peripheral surface of the resin bond stone, Wherein the polishing groove is formed on the outer circumferential surface of the polishing pad. 3. The method according to claim 1 or 2,
Wherein the polishing groove is formed by pressing the outer peripheral surface of the resin bond stone to the edge portion excluding the corner portion of the edge portion of the plate-like body to manufacture the polishing groove. 4. The method according to any one of claims 1 to 3,
Wherein the bond of the resin bonded stone is phenol, epoxy, polyimide, polyurethane, silicone, butyl rubber, or natural rubber,
The abrasive grains of the resin bonded stone are diamond, cubic boron nitride (CBN), alumina (Al ₂ O ₃ ), silicon carbide (SiC), pumice,
Wherein the plate member is a glass plate. A resin bonded stone wheel produced by a method for manufacturing a resin groove for a resin bonded stone according to any one of claims 1 to 4. A platen for holding a platelet,
The resin bonded grinding wheel according to claim 5, which polishes a rim of the plate-like body held by the base,
A rotating means for rotating the resin bond stone about the center axis of the resin bonded stone;
A moving means for bringing the abrasive grooves of the resin bonded grindstone into contact with the rim of the plate material to move the resin bonded grinding wheel or the plate material along the rim of the plate material;
And a spraying means for spraying a cooling liquid onto a contact point between the abrasion groove of the resin bonded stone and the rim of the plate-
And a processing unit for processing the plate. The method according to claim 6,
And a metal bonded grinding wheel for grinding and chamfering a rim of the plate held by the base,
Wherein the resin bonded grinding wheel polishes the chamfered edge portion of the plate-like object to perform mirror-surface processing. A method of processing a plate member, characterized in that the edge portion of the plate member is machined by using the plate member processing apparatus according to Claim 6 or 7.

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