KR20150030235A - A plate heat exchanger with thermally drilled hole - Google Patents

Abstract

The present invention relates to a plate heat exchanger (1) including a plate package (P), which plate heat exchanger plates (1) are joined to each other and alternate with each other to form interplate spaces (3, 4) A, B) of at least two constitutions which form the laminate (2) of the heat exchanging plates (A, B). The interplate spaces (3, 4) are arranged to receive at least two different fluids. At least one through hole 20 is arranged to extend between the exterior of the plate package P and the compartment 5 inside the plate package and the compartment 5 is provided by any of the interplate spaces 3, At least one through hole (20) is formed by thermal drilling.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a plate heat exchanger having a thermally drilled hole,

The present invention relates generally to a plate heat exchanger having at least one through hole formed by thermal drilling. The present invention also relates to a method for arranging at least one through-hole in a plate-type heat exchanger.

Heat exchangers and in particular plate heat exchangers are examples of thin wall structures for providing an internal channel system for guiding one or more fluids between at least one inlet and at least one outlet.

Conventional plate heat exchangers are formed by a plurality of thin heat exchangers arranged to form a plate package. The plate package is formed by a plurality of first and second heat exchanger plates. The heat exchange substrate is formed such that a first interplate space is formed between each pair of adjacent first and second heat exchange substrates and a space between the second plates is formed between each pair of adjacent second and first heat exchange substrates And may be arranged side by side. The space between the first plate and the space between the second plates are separated from each other and are provided in an alternating order in the plate package. Substantially each heat exchange substrate has at least a first porthole and a second porthole, wherein the first porthole forms a first inlet channel into the space between the first plates, and the second porthole is formed from a space between the first plates Thereby forming a first outlet channel.

Permanent bonding may be accomplished by welding, brazing, bonding or adhesives. In this permanently coupled plate heat exchanger, the location of the inlet or outlet depends on the first and second portholes. In addition, any surface profile of the heat exchange substrate depends on the location of the inlet and outlet to optimize flow through the inter-panel space and thereby thermal efficiency. In general, there is a continuing challenge to reduce the size of the portholes to maximize the available heat transfer surface of the heat exchange substrate.

Thin-walled laminar structures formed by permanently bonded plate heat exchangers complicate the addition of additional inlets or outlets, sensors, etc., since their positioning is limited to the potholes and the inlet or outlet channels formed therein.

There are a number of problems associated with configuring a connection or interface within a permanently coupled plate heat exchanger. Taking just one of these problems as an example, it is almost impossible to create a hole in its side by preparing / pressing a pattern in a separate plate before joining the plates to form a plate package. By drilling holes or drilling holes in the plate package, the chips will indeed get into and contaminate the plate package. Due to the highly complicated cross section of the permanently bonded plate heat exchanger, it is almost impossible to remove any chips. There is also a risk of contamination of any device that will be arranged downstream thereof, such as a compressor. The thin articles in the sides produced by the flank of the individual plates are thus not thick enough to allow screw connection. The complex and irregular laminar structure of the permanently bonded plate heat exchanger may produce unreliable material for machining and the internal structure in the inlet or outlet port may collapse. Generally, it is even more difficult to create a surface to seal within a permanently bonded plate heat exchanger. Also, if permanent bonding is achieved by brazing, it is difficult to braze or weld the joints, such as welding bolts, without destroying the brazed structure. Additionally, it is very difficult to form large holes covering one or more interplanar spaces.

Following the examples of these problems, it is very difficult to mount connection portions such as any additional inlets or outlets, sensors, probes, fastening means, etc. in a plate heat exchanger, especially a permanently coupled plate heat exchanger. This is especially true for solid production.

It is an object of the present invention to provide a plate heat exchanger having at least one through hole that improves the above-described problems.

Another object is to provide a method that allows essentially arbitrary positioning of the through-holes in the plate heat exchanger.

In addition, the method should be applicable to solid preparation requiring high reliability and repeatability.

This object is achieved by a plate heat exchanger comprising a plate package comprising a plurality of heat exchangers of at least two configurations forming a laminate of heat exchange substrates joined together and alternating with each other to form an interplate space between the heat exchange substrates Wherein the interplate space is achieved by a plate heat exchanger arranged to receive at least two different fluids. The plate heat exchanger is arranged such that at least one through hole is arranged to extend between the outside of the plate package and the compartment inside the plate package and the compartment is at least partly formed by any of the interplate spaces, And is formed by drilling.

As a flow drilling, friction drilling or form drilling, also known thermal drilling is a non-cutting method that provides plastic reformation of the material. The hole is formed by rotating a pin-shaped tool having a circular cross section with a diameter corresponding essentially to the hole to be formed. During rotation, the tool creates holes by relying on friction from high rotational speeds. The generated heat causes the material to be malleable enough to form and perforate. As the tip of the tool penetrates the lower surface of the base material, the displaced material begins to flow in the tool transport direction. Some displaced material may form a collar around the top surface of the workpiece. The remainder of the material may form a sleeve bushing on the bottom surface. The formed sleeves are remarkably strong, and may be threaded, for example, in a separate process.

Thermal drilling has been surprisingly proven to be applicable to thin wall honeycomb-like structures such as plate heat exchangers. Thermal drilling is also a non-cutting method that does not leave any contaminating chips that may cause uncontrolled throttling or occlusion in the narrow passages inside the plate heat exchanger. Furthermore, there is no risk that a chip, which may constitute a problem that the device is arranged downstream of a plate heat exchanger such as a compressor, is not formed. The combination of a honeycomb-like structure and strict requirements without any chip formation has made the formation of holes in traditionally coupled plate heat exchangers very complicated and in fact has been avoided to some extent if practicable. This is especially true for solid preparation.

By using thermal drilling, a completely new possibility of accessing the interior of the plate package of the permanently coupled plate heat exchanger is provided. This involves the insertion of tools such as sensors, cameras, etc. to improve the monitoring and understanding of operating conditions within the plate heat exchanger. It thus also provides a whole new possibility of positioning the inlet or outlet for fluid supply or the tubing used accordingly. Indeed, thermal drilling allows essentially arbitrary positioning of the through-holes in the plate heat exchanger. Also, by thermal drilling, it becomes possible to form large holes that provide access to more than one inter-plate space.

The compartment may include a plurality of interplate spaces communicating with each other via a common channel, and at least one through hole is arranged in a wall portion forming a common channel. Thus, the wall portion may be the circumferential sealing surface of the common channel or its longitudinal end surface. The common channel may be, for example, an inlet or outlet channel that extends through or through the plate package.

The at least one through hole may be arranged to receive a component contained in a group consisting of a sensor such as a temperature sensor, a pressure sensor and an optical sensor, a plug such as a drain plug or a connection for inspection glass and tubing. It should be understood that these do not limit the examples of possible components that may be applied.

The longitudinal axis of the at least one through hole may be arranged to extend essentially parallel to the general plane of the longitudinal extension of the heat exchange substrate.

The at least one through-hole may be arranged in a wall forming a circumferential sidewall of the plate package, the sidewall extending essentially perpendicular to a general plane of the longitudinal surface extension of the heat exchange substrate.

At least one through-hole may have a diameter that provides access to more than one inter-plate space.

At least one through-hole may be arranged in the upper or lower end plate forming part of the plate package.

The heat exchange substrates in the plate package may be permanently bonded to each other through brazing, welding, adhesives or bonding.

The at least one through hole may include a longitudinally sealed surface forming a sleeve having a longitudinally extending portion coaxial with the longitudinal axis of the through hole, and the sleeve may have a free edge portion facing the interior of the compartment. The sleeve may be used for threaded engagement or for accommodating bushings, linings, connectors, and the like. The sleeve may also be used to provide a channel through the space between one or more plates to thereby provide improved access to the inner structure of the plate package, for example, to permit insertion of the sensor.

The mouse of at least one through hole directed away from the compartment may include a circumferential collar formed during thermal drilling. This circumferential collar may be used for connection of parts to be inserted into the through holes.

The at least one through hole may include a thread forming portion.

The plate heat exchanger may further comprise brackets arranged in or around the mouth of at least one through hole. Such a bracket may be used for mounting a component to be inserted into the through hole.

The laminate of the plate package is characterized in that a space between the first plates is formed between each pair of adjacent first heat exchange substrates and a second heat exchange plate and a space between the second plates is formed by a pair of adjacent second heat exchange substrates, And a plurality of first heat exchange substrates and a plurality of second heat exchange substrates which are coupled to each other in a manner formed between the substrates and arranged side by side. The space between the first plate and the space between the second plates may be separated from each other and provided in an alternating order in at least one plate package.

The common channel may comprise a plurality of through holes formed by thermal drilling and at least two of the through holes are arranged for the supply of the first fluid among at least two different fluids into the common channel.

The first of the at least two different fluids is supplied to the common channel via a manifold connected to at least two through holes.

This provides a number of advantages as described below. For a brazed plate heat exchanger, the diameter of the inlet port for the first fluid, which is the coolant, is designed to maintain the flow rate within a certain range to avoid pressure drops that are too high. This is very important when two phase applications are used to maintain efficiency and capability. In a conventional solution, the first fluid is supplied via one end of an inlet channel constituting a common channel constituted by a porthole in each respective heat exchange substrate. This means that the port cut-out design in each individual heat exchange substrate must be dimensioned based on the flow of the first fluid supplied thereto. In addition, the maximum number of heat exchange substrates must be considered because the flow is proportional thereto. It is well known that the port size has a strong influence on the pressure resistance of the plate heat exchanger. The bigger the worse. The design pressure of the plate heat exchanger is typically fixed by dividing the burst pressure by a factor typically in the range of 3 to 4.5. The coefficient values are mainly fixed according to the design pressure and also according to the requirements of the pressure vessel license body. The group that allows the lowest coefficient is a pressure cycling durability test. This is a challenge when designing the port area of a plate heat exchanger. For example, in a so-called CO ₂ transition critical gas cooler, the design pressure should be approximately 120 bar and the burst pressure should be 360 bar at best and 540 bar at worst.

By providing a plurality of thermally drilled through holes in the plate package after brazing and supplying the first fluid through these through holes, the port cutout in each heat exchange substrate is such that each of these holes only has a cross- It may be formed to be smaller. This makes the port area of the plate package stronger. Another advantage is that smaller portholes leave a larger area of the individual heat exchange substrate for heat transfer.

According to another aspect, the present invention is directed to a method of providing through-holes in a plate-type heat exchanger, the method comprising: providing a plate package, wherein the plate packages are coupled to each other and alternate with each other to provide interplate space between the heat- And a plurality of heat exchange substrates of at least two configurations forming a stack of heat exchange substrates to be formed, the interplate space being arranged to receive at least two different fluids; And at least one through hole extending between the compartments inside the plate package by thermal drilling, the compartment being at least partially formed by any of the interplate spaces.

Embodiments of the present invention will now be described by way of example with reference to the accompanying schematic drawings.
Figure 1 schematically shows a side view of a conventional plate heat exchanger.
Fig. 2 schematically shows a front view of the plate heat exchanger of Fig. 1. Fig.
Figure 3 shows a schematic, schematic cross-sectional view along the inlet or outlet channel of a plate package of a conventional plate heat exchanger.
Figures 4 and 5 show a highly schematic example of the first and second heat exchange substrates of a plate heat exchanger.
Fig. 6 shows a first embodiment of a highly schematic cross section of a plate package of a plate heat exchanger illustrating different positions of through-holes.
Figures 7A-7D schematically illustrate the formation of through-holes during thermal drilling and subsequent thermal tapping.
8 shows a schematic cross-sectional view of a through hole formed by thermal drilling.
Fig. 9 schematically shows a sectional top view of a plate package of a plate heat exchanger in a highly schematic manner.

Figs. 1 to 3 show a typical example of the plate-type heat exchanger 1. Fig. The plate heat exchanger 1 includes a plate package P formed by a plurality of compression-molded heat exchange substrates A and B which are provided side by side to thereby form a laminate 2. [ The heat exchange substrate included in the embodiment is hereinafter referred to as a first heat exchange substrate A (see FIGS. 3, 4 and 6) and a second heat exchange substrate B (see FIGS. 3, 5 and 6) Are different heat exchange substrates. The plate package (P) includes substantially the same number of first heat exchange substrates (A) and second heat exchange substrates (B).

3, the heat exchange substrates A and B are formed such that the first inter-plate space 3 is formed between each pair of adjacent first heat exchange substrates A and B, Plate space 4 is provided between the adjacent pairs of the second heat exchange substrates B and the first heat exchange substrate A in parallel. Thus, one of the two plate spaces forms a space 3 between each first plate, and the remaining plate spaces form respective second plate spaces 4, that is, the first and second plates The interstices (3,4) are provided in alternating order in the plate package (P). Furthermore, the spaces 3 and 4 between the first and second plates are substantially completely separated from each other.

Therefore, a plurality of compartments 5 are formed inside the plate package P. By way of example, the first compartment 51 is at least partially formed by any of the first inter-plate spaces 3, and the second compartment 52 is formed at least partially by any of the inter- Is partially formed.

The plate package (P) also includes an upper end plate (6) and a lower end plate (7) provided on each side of the plate package (P).

The plate heat exchanger 1 may be advantageously constructed to operate as an evaporator in a coolant circuit not shown. In such an evaporator application, the first interplate space 3 may form a passageway for a first fluid, such as a coolant, while the second interplate space 4 may comprise a second fluid configured to be cooled by the coolant Lt; / RTI >

In the embodiment shown in Figures 1 and 3, the heat exchange substrates A and B and the upper and lower end plates 6 and 7 are permanently connected to each other. This permanent connection may advantageously be accomplished through brazing, welding, adhesives or bonding.

As shown in FIGS. 2, 4 and 5, substantially each of the heat exchange substrates A and B has four portholes 8, that is, a first porthole 8, a second porthole 8, A porthole 8 and a fourth porthole 8. [ The first port hole 8 forms a first inlet channel 9 into the first interplate space 3 and the first inlet channel is substantially an entire plate package P, ) And also through the upper end plate (6). The second port hole 5 forms a first outlet channel 10 from the first interplate space 3 and this first outlet channel also has a substantially entire plate package P, B and the upper end plate 6. As shown in Fig. The third porthole 5 forms a second inlet channel 11 to the second interplate space 4 and the fourth porthole 5 forms a second outlet channel 2 from the second interplate space 4 12). These two channels 11 and 12 also extend substantially through the entire plate package P, i.e. all the plates A and B and the upper end plate 6.

In the disclosed embodiment, the first inlet channel 9, which is in communication with the first interplate space 3, may be seen as part of the first compartment 51. The first outlet channel 10, which communicates with the space 3 between the first plates, may also be seen as forming part of the first compartment 51. Similarly, in the disclosed embodiment, the second inlet channel 11 in communication with the second plate-to-plate space 4 may be seen as part of the second compartment 52. The second outlet channel 12, which is in communication with the space 4 between the second plates, may also be seen as forming part of the second compartment 52.

In a conventional plate heat exchanger of this type, the space between the first plates 3 is accessed via the first inlet channel 9 or the first outlet channel 10, that is, through the first compartment 51. Similarly, the space 4 between the second plates is accessed via the second inlet channel 11 or the second outlet channel 12, that is, through the second compartment 52.

In a conventional plate heat exchanger, any tools, sensors, etc. are inserted through one of these channels 9, 10, 11, 12, thereby allowing access along one longitudinal extension of one of these channels. However, this only permits access to the strictly restricted areas of the interior of the plate heat exchanger, and in particular does not allow access to the heat transfer surfaces of the individual heat exchange substrates A, B. Access to these areas is cumbersome and not possible during normal use of large-scale systems for practical reasons.

For a better understanding of the present invention, a schematic cross-sectional view of the inlet channels 9, 11 or outlet channels 10, 12 of a conventional plate heat exchanger 1, which illustrates one embodiment of the invention, Referring to FIG. Sectional view is not limited to the area in and around the inlet or outlet channels 9, 10, 11, 12, but the same principle is applicable to any outer wall portion of the plate package P of the plate heat exchanger 1 .

6 shows a state in which the first inter-plate space 3 is formed between each pair of adjacent first heat exchange substrates A and B and the second inter-plate spaces 4 are formed between each pair of A plurality of first and second heat exchange substrates A and B provided side by side in such a manner as to be formed between the adjacent second heat exchange substrate B and the first heat exchange substrate A. Thus, one of the two plate spaces forms a space 3 between each first plate, and the remaining plate spaces form respective second plate spaces 4, that is, the first and second plates The interstices (3,4) are provided in alternating order in the plate package (P). Furthermore, the spaces 3 and 4 between the first and second plates are substantially completely separated from each other.

The circumferential side wall 13 of the plate package P includes a plurality of outwardly extending flanges 14 each flange 14 having a pair of adjacent first heat exchange substrates A, (B). The circumferential sidewalls 13 extend essentially perpendicular to the normal plane 16 of the first and second heat exchange substrates A, B.

In the disclosed embodiment, the plurality of through holes 20 are arranged in the circumferential side wall 13 of the plate package P. [ The through hole 20 is formed by thermal drilling. Thermal drilling as a method will be described below. The longitudinal axis L of each through hole 20 is arranged to extend essentially parallel to the normal plane 16 of the first and second heat exchange substrates A,

In the disclosed embodiment, each first plate-to-plate space 3 has a through-hole 20 extending from the outside of the plate package P into the through channel which is the inlet channel 9, 11 or the outlet channel 10, . It should be understood that a hole pattern different from that shown may be used. It should also be appreciated that by thermal drilling, the through holes 20 may be arranged at any arbitrary position along the circumferential side wall 13 of the plate package P. [

The through holes 20 are arranged such that their longitudinal axes L are slightly displaced from the adjacent flanges 14 so that the through holes 20 are essentially parallel to the pair of heat exchange substrates A, B) of the first or second heat exchange substrate (A, B) together. It should be understood that other positions are possible.

It should be understood that the circumferential side wall 13 of the plate package P may be essentially smooth. This may be done, for example, by bending a plurality of outwardly extending flanges 14 or by cutting the flanges 14 to extend essentially parallel to the circumferential wall 13. It should also be understood that the cross section depends on the surface pattern 21 of the heat exchange substrates A and B constituting the plate package P.

6, the through holes 20 are arranged in the upper end plate 6 so that the distance from the outside of the plate package P to the inter-plate spaces 3, 4 closest to the upper end plate 6 Communication becomes possible. In the disclosed embodiment, the through-hole 20 extends into the first inter-plate space 3, i.e. the first compartment 51. Any arbitrary position is possible depending on the intended use of the through-hole 20. [ The same principle is applicable to the lower end plate 7.

Figure 6 also shows through holes 20, 23 arranged in the lower end plate 7. The through holes 20 and 23 extend into the second subsequent interplate spaces 3 and 4 through the interplate spaces 3 and 4 closest to the lower end plate 7. [ In the disclosed embodiment, the longitudinal axis L of the through holes 20, 23 extends through the joint 22 between the two joined heat exchange substrates A, B. It should be understood that other positions are possible.

Figure 6 also shows an embodiment of a through-hole 20, 23 having a diameter that provides access to more than one first or second plate space 3, 4. The through holes 20 and 23 are formed in a region extending across the plurality of heat exchange substrates A and B and thereby partition walls 24 between two or more interplate spaces 3, And this partition wall 24 is formed by the heat exchange substrates A and B as described above.

Referring now to Fig. 9, a cross-sectional plan view of a plate package P of a plate heat exchanger is schematically shown in a highly schematic manner.

The common channels (9, 10, 11, 12) for the supply and distribution of the first fluid include a plurality of through holes (20) formed by thermal drilling. The first fluid is supplied to the common channels (9, 10, 11, 12) via the manifold (50). The manifold 50 is connected to the outer wall 51 of the plate package P and communicates with the common channels 9, 10, 11 and 12 through the through holes 20. [

It should be understood that the first fluid may be dispensed into the common channels 9, 10, 11, 12 via nozzles or valves (not shown) arranged in the connection to the manifold.

The fluid may be supplied to the through hole 20 via the manifold 50 communicating with the plurality of through holes or via individual piping (not shown). The through-holes may be threaded to be secured to the necessary connections and sealed with gaskets, o-rings, and the like. Soft brazing may also be used.

It should be understood that the through holes 20 may be arranged in rows or in any other pattern. It should also be understood that the same principle is applicable not only to the inlet port of the first fluid but also to any other port of the plate package.

As a flow drilling, friction drilling or foam drilling, also known thermal drilling is a non-cutting method used to form the hole. The hole may be a through hole or a blind hole. The process is shown in Figs. 7A to 7C. Thermal drilling provides plastic reformation of the material. The hole 20 is formed by rotating a pin-shaped tool 30 having a circular cross section with a diameter corresponding essentially to the hole to be formed (see Fig. 7A). The tool 30 has a conical free end 31 which has a high rotational speed and which has a relatively high axial pressure to engage and form the hole 20 in the base material 32. The tool 30 may be made of carbide, such as, for example, Wolfram carbide. During rotation, the tool 30 creates holes by relying on the friction resulting from the high rotational speed (see FIG. 9B). The generated heat causes the base material 32 to be formed and sufficiently stiff to be perforated. As the tool 30 advances in the axial direction, material displacement occurs (see Fig. 7C). The initially displaced material flows upwardly toward the tool. As the tip of the free end 31 of the tool 30 penetrates the lower surface 33 of the base material 32, the displaced material begins to flow in the tool transport direction. As the material softens, the axial force decreases and the feed rate increases. Some displaced material may form a collar 34 around the top surface 35 of the base material 32. The remainder of the material forms the sleeve 36 in the lower surface 33. The collar 34 and the sleeve 36 will be coaxial with the final through hole 20 and have a longitudinal extension L that slightly exceeds the thickness of the base material 32. The work hardening degree depends on the material. As a result, the formed sleeve 36 is remarkably strong, and may be threaded, for example, in a separate process (see FIG. 7D). The threads may be formed inside or outside the sleeve 36. It should be understood that the threads 37 may not be limited to the collar 34, the base material 32 and the portion of the sleeve 36.

Standard drilling, NC and CNC machines are all suitable for thermal drilling. However, the process depends on the speed and force with which the special tool 30 engages the base material 32. [ It should be understood that parameters such as hole size, material and thickness affect suitable rotational speed, feed rate and axial force. For example, thin materials may bend or collapse under excessive pressure, thus requiring adequate support to prevent deformation. The pre-drilled hole may reduce the required axial force and leave a smooth finish in the lower edge of the sleeve. However, due to chip-forming, pre-drilling is generally not an option when applied to a heat exchanger. By thermal drilling, which is a non-cutting method, no chips are formed which can fall into a plate heat exchanger such as a permanently bonded plate package, or any device that will be arranged downstream of such a plate heat exchanger and which may contaminate it. Thermal drilling has been surprisingly proved to be excellent when forming large holes 23 having a diameter spanning a plurality of inter-plate spaces 3, 3, 4 and 4 as in the plate heat exchanger 1. [

Once the sleeve 36 is threaded, it may be done using thermal tapping, using the same principle as thermal drilling with essentially intrinsically lower temperatures, basically. Thermal tapping provides plastic reformation of the material. 7d) has a thread 38a which, when inserted into the hole 20 during rotation, causes the material in the sealing surface of the hole to pass through the threaded depression of the tool 38, into the crest 38a. Thus, the threads are cold formed and leave no clips. It should be understood that the thread shape, depth and strength are determined by the selected tool 38. It should also be understood that the threads may be formed by non-cutting conventional firing cold forming.

Referring now to FIG. 8, a schematic cross-sectional view of the through-hole 20 formed by thermal drilling is shown. Of the through hole 20 intended to be directed away from the inter-plate spaces 3, 4 as a result of thermal drilling, which is a method of forming the plastic material by displacing the material instead of cutting the material, (39) may include a circumferential collar (34) of displaced material. It is possible to mold the collar 34 by the tool 30 used during thermal drilling to control the shape of the collar 34. [ The through hole 20 also includes a longitudinally sealed surface on its lower side forming a sleeve 36 having a longitudinally extending portion coaxial with the longitudinal axis L of the through hole 20. The sleeve 36 has a free edge portion 40. Further, the sleeve 36 is the result of thermal drilling, which is a method of molding the firing material. The through hole 20 may be threaded. The thread may be formed from the outer edge of the collar 34 to the free edge portion 40 of the sleeve 36 along the entire inner sealing surface 41 of the through hole 20. It should be understood that the collar 34 may be used as a connection surface for any device or for a bracket or the like.

The through holes 20 may be used to receive or mount different types of sensors (not shown), such as temperature sensors, pressure sensors, and optical sensors. The through hole 20 may also be used to mount a plug or inspection glass (not shown) such as a drain plug. A conventional drain plug is a drain plug for compressor oil and a drain plug for system exhaust. The through-holes 20 may also be used as individual inlets or outlets (not shown) for the inverted cooling / heating duty.

The present invention has generally been described on the basis of a plate-type heat exchanger 1 having first and second plate spaces 3 and 4 and four portholes 8 that allow the flow of two fluids. It should be understood that the present invention is also applicable for plate heat exchangers having different configurations in terms of the number of interplate spaces, the number of portholes and the number of fluids to be handled. The present invention is also applicable to a plate heat exchanger in which one or a plurality of inlet or outlet channels formed as integrated through holes in the heat exchange substrate are omitted. It should also be understood that the present invention is applicable to any type of heat exchanger. It should also be appreciated that this may be applied to heat exchangers of tubes and shell-type or helical heat exchangers, for example.

Four portholes 8 are provided in the vicinity of the respective corners of the substantially rectangular heat exchange substrates A and B in the disclosed embodiment. It should be understood that other positions are possible, and that the present invention should not be limited to the positions shown and described.

The present invention is also applicable to a plate heat exchanger (not shown) comprising a heat exchange plate permanently bonded in a paired manner, wherein each pair forms a cassette. In this solution, the gaskets may be arranged between the respective cassettes. Also, in this embodiment, the heat exchange substrate forming each cassette may be permanently bonded by welding. The invention is also applicable to a plate heat exchanger (not shown) in which the plate packages are held together by a heat exchange substrate and a tie-bolt extending through the upper and lower end plates. In the latter case, gaskets are used between the heat exchange substrates.

It is to be understood that the invention is not limited to the disclosed embodiments, but may be varied and modified within the scope of the following claims, as set forth in part herein.

Claims (16)

(A, B) which comprises a plate package (P), the plate packages being coupled to each other and alternating with each other to form an interplate space (3, 4) between the heat exchange substrates (3, 4) are arranged to receive at least two different fluids, the plate-like spaces (3, 4) comprising at least two heat exchange substrates (A, B) (1)
At least one through hole 20 is arranged to extend between the outside of the plate package P and the compartment 5 inside the plate package P and the compartment 5 is arranged between the interplate spaces 3, And at least one through hole (20) is formed by thermal drilling. ≪ Desc / Clms Page number 13 > 2. A device according to claim 1, characterized in that the compartment (5) comprises a plurality of interplate spaces (3, 4) communicating with each other via a common channel (9, 10, 11, 12) and at least one through hole And arranged in the wall portion forming the common channels (9, 10, 11, 12). 3. The apparatus according to claim 1 or 2, wherein the at least one through hole (20) is contained in a group consisting of a sensor such as a temperature sensor, a pressure sensor and an optical sensor, a plug such as a drain plug or a connection for inspection glass and tubing The heat exchanger being arranged to receive the heat exchanged components. 4. A device according to any one of the preceding claims, wherein the longitudinal axis (L) of the at least one through hole (20) is essentially parallel to the normal plane (16) of the longitudinal surface extension of the heat exchange substrates The heat exchanger being arranged to extend into the heat exchanger. 5. A heat exchanger according to any one of claims 1 to 4, characterized in that at least one through hole (20) is arranged in a wall forming a circumferential side wall (13) of the plate package (P) B extending essentially perpendicularly to a general plane (16) of the longitudinal surface extension of the plate. 6. The plate-type heat exchanger according to any one of claims 1 to 5, wherein at least one through hole (20) has a diameter that provides access to more than one interplate space (3,4). 7. The plate-type heat exchanger according to any one of claims 1 to 6, wherein at least one through-hole is arranged in an upper or lower end plate (6, 7) forming part of the plate package (P). 8. The plate heat exchanger according to any one of claims 1 to 7, wherein the heat exchange substrates (A, B) in the plate package (P) are permanently bonded through brazing, welding, adhesive or bonding. 9. A device according to any one of the preceding claims, characterized in that at least one through hole (20) is formed in a longitudinal direction (L) forming a sleeve (36) having a longitudinal extension coaxial with the longitudinal axis (41), the sleeve having a free edge (40) facing the interior of the compartment (5). 10. A method according to any one of claims 1 to 9, wherein the mouse (39) of at least one through hole (20) directed away from the compartment (5) comprises a circumferential collar (34) formed during thermal drilling Plate Heat Exchanger. 11. The plate-type heat exchanger according to any one of claims 1 to 10, wherein the at least one through hole (20) includes a thread forming portion (37). 12. The plate type heat exchanger according to any one of claims 1 to 11, further comprising brackets arranged in or around the mouth of at least one through hole. The laminated body (2) of a plate package (P) according to claim 1, wherein the laminated body (2) of the plate package (P) is formed such that a first plate space (3) is formed between each pair of adjacent first heat exchange substrates And a plurality of first heat exchange substrates (hereinafter referred to as " first heat exchange substrates ") 5, which are coupled to each other and arranged side by side in such a manner that a space 4 between the second plates is formed between each pair of adjacent second heat exchange substrates B (A) and a plurality of second heat exchanging substrates (B), wherein the spaces between the first plate spaces (3) and the spaces between the second plates (4) are separated from each other, A plate heat exchanger provided side by side. 3. A device according to claim 2, characterized in that the common channels (9,10,11,12) comprise a plurality of through holes (20) formed by thermal drilling and at least two of the through holes (20) , 11, 12) for supplying a first fluid of at least two different fluids. 15. A method according to claim 14, wherein the first of the at least two different fluids is supplied to the common channels (9, 10, 11, 12) via a manifold (50) connected to at least two through- . A method for providing a through hole (20) in a plate-type heat exchanger (1)
(2) of heat exchange substrates comprising a plate package (P), said plate packages being coupled to each other and alternately forming interplate spaces (3, 4) between heat exchange substrates (A, B) Comprising a plate heat exchanger (1) comprising a plurality of heat exchange substrates (A, B) of at least two configurations, wherein the interplate spaces (3, 4) are arranged to receive at least two different fluids ,
At least one through hole (20) extending between the outside of the plate package (P) and the compartment (5) inside the plate package (P) is arranged by thermal drilling and the compartment (5) 4) at least partially.

Images