KR20140040152A - 절연 제제 - Google Patents
절연 제제 Download PDFInfo
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- KR20140040152A KR20140040152A KR1020137032763A KR20137032763A KR20140040152A KR 20140040152 A KR20140040152 A KR 20140040152A KR 1020137032763 A KR1020137032763 A KR 1020137032763A KR 20137032763 A KR20137032763 A KR 20137032763A KR 20140040152 A KR20140040152 A KR 20140040152A
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- South Korea
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- epoxy resin
- curing
- epoxy
- anhydride
- formulation composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/04—Treating the surfaces, e.g. applying coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
Claims (26)
- 전기 장치용 절연체로서 유용하며, (a) 1종 이상의 액체 에폭시 수지; (b) 1종 이상의 액체 환형 무수물 경화제; (c) 1종 이상의 열 전도 및 전기 절연 고체 충전제 (여기서, 충전제는 에폭시-실란 처리된 충전제이고, 충전제의 크기는 약 1㎛ 내지 약 100㎛임); 및 (d) 아민 수소를 갖지 않는 1종 이상의 아민 경화 촉매를 포함하며, 경화시에 유리 전이 온도, 인장 강도, 유전체 강도, 열 전도도 및 체적 저항률을 포함한 특성의 균형을 경화된 생성물에 제공하는, 경화성 에폭시 수지 제제 조성물.
- 제1항에 있어서, 경화시 약 140℃ 이상의 유리 전이 온도, 약 80MPa 이상의 인장 강도, 약 10kV/mm 이상의 유전체 강도, 약 0.8W/m-K 이상의 열 전도도, 및 약 1x1012ohm-cm 이상의 체적 저항률을 포함한 특성의 균형을 경화된 생성물에 제공하는 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 에폭시 수지가 비스페놀 A의 디글리시딜 에테르, 비스페놀 F 디글리시딜 에테르, 에폭시 노볼락 또는 이들의 혼합물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 에폭시 수지가 에폭시 노볼락을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 에폭시 수지의 농도 범위가 약 7중량% 내지 약 30중량%인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 무수물 경화제가 나딕 메틸 무수물, 메틸 테트라히드로프탈산 무수물 및 이들의 혼합물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 무수물 경화제가 나딕 메틸 무수물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 무수물 경화제가 메틸 테트라히드로프탈산 무수물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 무수물 경화제가 나딕 메틸 무수물과 메틸 테트라히드로프탈산 무수물의 혼합물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 무수물 경화제의 농도 범위가 약 7중량% 내지 약 35중량%인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 충전제가 에폭시-실란 처리된 석영을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 충전제의 농도 범위가 약 40중량% 내지 약 90중량%인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 경화 촉매가 1-치환된 이미다졸 촉매를 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 1종 이상의 경화 촉매의 농도 범위가 약 0.005중량% 내지 약 2중량%인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 반응성 희석제, 유연화제, 가공 보조제, 강인화제 또는 이들의 혼합물을 포함하는 에폭시 수지 제제 조성물.
- 제15항에 있어서, 반응성 희석제가 1,4-부탄디올 디글리시딜에테르; 1,6-헥산디올 디글리시딜에테르; 트리메틸올프로판 트리글리시딜에테르; 프로폭실화 글리세린의 트리글리시딜 에테르; 에폭시드화 피마자유; 에폭시드화 아마인유; 오르토-크레실 글리시딜 에테르; 알킬 글리시딜 에테르; 네오펜틸 글리콜 디글리시딜에테르 또는 이들의 혼합물을 포함하는 것인 에폭시 수지 제제 조성물.
- 제1항에 있어서, 경화시 약 140℃ 내지 약 225℃의 유리 전이 온도를 경화된 생성물에 제공하는 에폭시 수지 제제 조성물.
- 제1항에 있어서, 경화시 약 80MPa 내지 약 250MPa의 인장 강도를 경화된 생성물에 제공하는 에폭시 수지 제제 조성물.
- 제1항에 있어서, 경화시 약 10kV/mm 내지 약 45kV/mm의 절연 파괴 강도를 경화된 생성물에 제공하는 에폭시 수지 제제 조성물.
- 제1항에 있어서, 경화시 약 1x1012ohm-cm 내지 약 1x1019ohm-cm의 체적 저항률을 경화된 생성물에 제공하는 에폭시 수지 제제 조성물.
- (a) 1종 이상의 액체 에폭시 수지; (b) 1종 이상의 액체 환형 무수물 경화제; (c) 1종 이상의 열 전도 및 전기 절연 에폭시-실란 처리된 충전제; 및 (d) 아민 수소를 갖지 않는 1종 이상의 아민 경화 촉매를 혼합하는 것을 포함하며, 경화시에 유리 전이 온도, 인장 강도, 유전체 강도 및 체적 저항률을 포함한 특성의 균형을 경화된 생성물에 제공하는, 전기 장치용 절연체로서의 경화성 에폭시 수지 제제 조성물의 제조 방법.
- (i) 제1항에 따른 조성물을 제공하는 단계;
(ii) 제1항에 따른 조성물을 기판에 적용하는 단계; 및
(iii) 기판 및 조성물을 경화시켜 절연 재료를 형성하는 단계
를 포함하고, 생성된 절연 재료가 약 120℃ 이상의 연속적 조작 온도에서 요구되는 전기적, 기계적 및 열적 특성을 포함한 요구 특성의 균형을 갖는
전기 장치용 에폭시 절연 재료의 제조 방법. - 제22항에 따른 방법에 의해 제조되는 생성물.
- 제23항에 있어서, 약 120℃ 이상의 조작 온도에서 요구되는 전기적, 기계적 및 열적 특성을 포함한 특성의 균형을 갖는 절연 재료, 포팅 재료 또는 캐스팅 재료를 포함하는 생성물.
- 제24항에 있어서, 전기 장치를 포함하는 생성물.
- 제25항에 있어서, 전기 장치가 전력 변압기를 포함하는 것인 생성물.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161485843P | 2011-05-13 | 2011-05-13 | |
US61/485,843 | 2011-05-13 | ||
PCT/US2012/033424 WO2012158292A1 (en) | 2011-05-13 | 2012-04-13 | Insulation formulations |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140040152A true KR20140040152A (ko) | 2014-04-02 |
KR102001688B1 KR102001688B1 (ko) | 2019-07-18 |
Family
ID=45976562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137032763A Active KR102001688B1 (ko) | 2011-05-13 | 2012-04-13 | 절연 제제 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9196412B2 (ko) |
EP (1) | EP2707412B1 (ko) |
JP (1) | JP6030126B2 (ko) |
KR (1) | KR102001688B1 (ko) |
CN (1) | CN103649160B (ko) |
BR (1) | BR112013029221B1 (ko) |
CA (1) | CA2835658C (ko) |
MX (1) | MX345330B (ko) |
TW (1) | TWI540149B (ko) |
WO (1) | WO2012158292A1 (ko) |
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KR20220029572A (ko) * | 2020-08-31 | 2022-03-08 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 수지를 제조하는 방법 및 절연 구조를 제조하는 방법 |
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CN117285698A (zh) * | 2015-03-26 | 2023-12-26 | 亨斯迈先进材料特许(瑞士)有限公司 | 用于制备室外制品的热固性环氧树脂组合物以及由此获得的制品 |
DK3317318T3 (da) * | 2015-07-02 | 2019-07-22 | Huntsman Adv Mat Licensing Switzerland Gmbh | Varmehærdende epoxyharpikssammensætning til fremstilling af udendørsartikler og de deraf opnåede artikler |
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WO2012158292A1 (en) | 2012-11-22 |
TWI540149B (zh) | 2016-07-01 |
BR112013029221B1 (pt) | 2021-03-09 |
CA2835658A1 (en) | 2012-11-22 |
US9196412B2 (en) | 2015-11-24 |
JP6030126B2 (ja) | 2016-11-24 |
TW201311756A (zh) | 2013-03-16 |
CN103649160A (zh) | 2014-03-19 |
BR112013029221A2 (pt) | 2017-03-14 |
MX2013013273A (es) | 2014-07-09 |
EP2707412A1 (en) | 2014-03-19 |
JP2014518921A (ja) | 2014-08-07 |
US20140125439A1 (en) | 2014-05-08 |
CN103649160B (zh) | 2016-01-13 |
KR102001688B1 (ko) | 2019-07-18 |
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MX345330B (es) | 2017-01-25 |
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