KR20130135418A - Photosensitive resin composition and photosensitive material comprising the same - Google Patents
Photosensitive resin composition and photosensitive material comprising the same Download PDFInfo
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- KR20130135418A KR20130135418A KR1020120058934A KR20120058934A KR20130135418A KR 20130135418 A KR20130135418 A KR 20130135418A KR 1020120058934 A KR1020120058934 A KR 1020120058934A KR 20120058934 A KR20120058934 A KR 20120058934A KR 20130135418 A KR20130135418 A KR 20130135418A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
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Abstract
본 명세서는 감광성 수지 조성물 및 이를 포함하는 유기 발광 소자에 관한 것이다. 본 명세서에 따른 고분자를 포함하는 감광성 수지 조성물은 다양한 감광재로 적용할 수 있다.The present specification relates to a photosensitive resin composition and an organic light emitting device including the same. The photosensitive resin composition including the polymer according to the present specification may be applied to various photosensitive materials.
Description
본 명세서는 감광성 수지 조성물 및 이를 포함하는 감광재에 관한 것이다.The present specification relates to a photosensitive resin composition and a photosensitive material including the same.
액정 표시장치(Liquid Crystal Display), 플라즈마 디스플레이 패널(Plasma Display Panel) 등의 디스플레이 장치에 사용되는 컬러필터의 미세패턴은 네거티브형 포토레지스트(Negative Photoresist)를 이용한 포토리소그래피(Photolithography)에 의해 통상적으로 코팅-건조-노광-현상- 소성의 공정을 거쳐 형성된다. Fine patterns of color filters used in display devices such as liquid crystal displays and plasma display panels are typically coated by photolithography using negative photoresist. It is formed through the process of dry-exposure-developing-firing.
상기 공정 중에서, 상기 컬러필터의 미세패턴의 품질 특성을 확인하기 위해 각 공정들 사이에 패턴 검사기를 이용하여 패턴의 직선성 불량, 패턴 탈락 불량, 이물 불량, 돌기 불량 및 각종의 얼룩에 의한 불량 등을 검출하게 된다. In the process, to check the quality characteristics of the fine pattern of the color filter using a pattern checker between each process of the linearity of the pattern, poor pattern dropping, foreign matters, poor projections and various stains, etc. Will be detected.
본 명세서는 빛에 의해 경화되는 감광성 수지 조성물 및 이를 포함하는 감광재를 제공하고자 한다.The present specification is to provide a photosensitive resin composition and a photosensitive material comprising the same to be cured by light.
본 명세서는 바인더 수지, 하기 화학식 1 내지 4 중 어느 하나로 표시되는 화합물 중 어느 하나 이상인 중합성 화합물, 광개시제, 밀착촉진제 및 용매를 포함하는 것을 특징으로 하는 감광성 수지 조성물을 제공한다. The present specification provides a photosensitive resin composition comprising a binder resin, a polymerizable compound, a photoinitiator, an adhesion promoter, and a solvent, which are at least one of the compounds represented by any one of Formulas 1 to 4 below.
[화학식 1][Formula 1]
[화학식 2](2)
[화학식 3](3)
[화학식 4][Formula 4]
상기 화학식 1 및 4에서,In Chemical Formulas 1 and 4,
R1 내지 R10는 각각 독립적으로 하기 화학식 5 또는 하기 화학식 8으로 표시되고, R11 내지 R13는 하기 화학식 8로 표시되며, R14 내지 R17은 하기 화학식 6로 표시되고,R1 to R10 are each independently represented by the following formula (5) or (8), R11 to R13 is represented by the formula (8), R14 to R17 is represented by the formula (6),
[화학식 5][Chemical Formula 5]
[화학식 6][Chemical Formula 6]
상기 화학식 5 내지 6에서, R18 및 R19는 각각 독립적으로 수소 또는 C1~C10의 알킬기이며, R20은 하기 화학식 7로 표시되고,In Formulas 5 to 6, R18 and R19 are each independently hydrogen or an alkyl group of C 1 ~ C 10 , R20 is represented by the following formula (7),
[화학식 7][Formula 7]
상기 화학식 7에서, R21은 수소 또는 C1~C10의 알킬기이며, R22는 (CH2)bOH 또는 하기 화학식 8로 표시되고,In Formula 7, R21 is hydrogen or an alkyl group of C 1 ~ C 10 , R22 is represented by (CH 2 ) b OH or the following formula (8),
[화학식 8][Formula 8]
상기 화학식 8에서, R23은 (CH2)nO 또는 CO(CH2)lO 이며, R24는 수소 또는 C1~C10의 알킬기이고, n 및 l은 각각 독립적으로 2 내지 10인 정수이고, m은 1 내지 2의 정수이며, o 및 p는 1 내지 3의 정수이고, a 및 b는 1 내지 10의 정수이다.In Formula 8, R 23 is (CH 2 ) n O or CO (CH 2 ) l O, R 24 is hydrogen or an alkyl group of C 1 ~ C 10 , n and l are each independently an integer of 2 to 10, m is an integer of 1-2, o and p are integers of 1-3, and a and b are integers of 1-10.
또한, 본 명세서는 상기 감광성 수지 조성물로 제조된 감광재를 제공한다. In addition, the present specification provides a photosensitive material prepared from the photosensitive resin composition.
또한, 본 명세서는 상기 감광재를 포함하는 컬러필터를 제공한다.In addition, the present specification provides a color filter including the photosensitive material.
또한, 본 명세서는 상기 컬러필터를 포함하는 액정 표시 장치를 제공한다. In addition, the present specification provides a liquid crystal display device including the color filter.
본 명세서의 실시상태에 따른 감광성 수지 조성물은 패턴 형성을 위한 포토리소그래피 공정 중 패턴 검사 시 불량률을 줄일 수 있는 장점이 있다. The photosensitive resin composition according to an exemplary embodiment of the present specification has an advantage of reducing a defective rate during pattern inspection during a photolithography process for forming a pattern.
본 명세서의 실시상태에 따른 감광성 수지 조성물은 패턴 형성을 위한 포토리소그래피 공정 중 물얼룩의 생성이 줄어드는 장점이 있다. The photosensitive resin composition according to the exemplary embodiment of the present specification has an advantage of reducing the generation of water stains during the photolithography process for pattern formation.
도 1은 본 명세서의 실시예 1 및 비교예 1의 감광재의 현미경 사진이다.1 is a micrograph of the photosensitive material of Example 1 and Comparative Example 1 of the present specification.
이하 본 명세서를 보다 상세히 설명한다.Hereinafter, the present specification will be described in more detail.
본 명세서에 따른 감광성 수지 조성물은 바인더 수지, 중합성 화합물, 광개시제 밀착촉진제 및 용매를 포함하는 것을 특징으로 한다.The photosensitive resin composition according to the present specification is characterized by including a binder resin, a polymerizable compound, a photoinitiator adhesion promoter, and a solvent.
본 발명의 바인더 수지는 에틸렌성 불포화기와 산기를 함유한 바인더 수지로서, 다음의 3단계의 반응을 통하여 합성할 수 있다. 상기 3단계의 반응 중에서, 1단계는 기본 아크릴 바인더 수지를 합성하는 단계이며, 2단계는 기본 아크릴 바인더 수지에 불포화기를 도입하는 단계이고, 3단계는 상기 불포화기가 도입된 아크릴 바인더 수지에 산기를 부여하는 단계이다. The binder resin of the present invention is a binder resin containing an ethylenically unsaturated group and an acid group, and can be synthesized through the following three steps of reactions. In the reaction of the three steps, step 1 is a step of synthesizing the basic acrylic binder resin, step 2 is the step of introducing an unsaturated group into the base acrylic binder resin, step 3 is to give an acid group to the acrylic binder resin into which the unsaturated group is introduced It's a step.
상기 1단계에서는 에폭시기를 함유한 모노머 및 이와 공중합 가능한 모노머를 반복단위로 포함하여 합성한다. In the first step, a monomer containing an epoxy group and a monomer copolymerizable therewith are included as repeating units.
상기 에폭시기 및 에틸렌성 불포화 결합을 함유한 모노머로는 알릴 글리시딜에테르, 글리시딜 (메타)아크릴레이트, 3,4-에폭시시클로헥실메틸 (메타)아크릴레이트, 글리시딜 5-노보넨-2-메틸-2-카복실레이트(엔도, 엑소 혼합물), 1,2-에폭시-5-헥센 및 1,2-에폭시-9-데센으로 이루어지는 군으로부터 선택되는 1 종 이상의 화합물을 사용할 수 있으나, 이에만 한정되는 것은 아니다.Examples of the monomer containing an epoxy group and an ethylenic unsaturated bond include allyl glycidyl ether, glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, glycidyl 5-norbornene- At least one compound selected from the group consisting of 2-methyl-2-carboxylate (endo, exo mixture), 1,2-epoxy-5-hexene and 1,2-epoxy-9- But is not limited thereto.
상기 1단계의 에폭시를 함유한 모노머와 공중합 가능한 모노머로는 불포화 카르복시산 에스테르류, 방향족 비닐 단량체류, 불포화 에테르류, N-비닐 3차 아민류, 및 불포화 이미드류로 이루어진 군으로부터 선택되는 1종 이상일 수 있으나, 이에만 한정되는 것은 아니다. The monomer copolymerizable with the epoxy-containing monomer of step 1 may be at least one selected from the group consisting of unsaturated carboxylic acid esters, aromatic vinyl monomers, unsaturated ethers, N-vinyl tertiary amines, and unsaturated imides. However, the present invention is not limited thereto.
상기 불포화 카르복시산 에스테르류의 구체적인 예로는, 벤질(메타)아크릴레이트, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 부틸(메타)아크릴레이트, 디메틸아미노에틸(메타)아크릴레이트, 이소부틸(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 에틸헥실(메타)아크릴레이트, 2-페녹시에틸(메타)아크릴레이트, 테트라히드로퍼프릴(메타)아크릴레이트, 히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-히드록시-3-클로로프로필(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 아실옥틸옥시-2-히드록시프로필(메타)아크릴레이트, 글리세롤(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 3-메톡시부틸(메타)아크릴레이트, 에톡시디에틸렌글리콜 (메타)아크릴레이트, 메톡시트리에틸렌글리콜(메타)아크릴레이트, 메톡시트리프로필렌글리콜(메타)아크릴레이트, 폴리(에틸렌 글리콜) 메틸에테르(메타)아크릴레이트, 페녹시디에틸렌글리콜(메타)아크릴레이트, p-노닐페녹시폴리에틸렌글리콜(메타)아크릴레이트, p-노닐페녹시폴리프로필렌글리콜(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, 테트라플루오로프로필(메타)아크릴레이트, 1,1,1,3,3,3-헥사플루오로이소프로필 (메타)아크릴레이트, 옥타플루오로펜틸(메타)아크릴레이트, 헵타데카플루오로데실(메타)아크릴레이트, 트리브로모페닐(메타)아크릴레이트, 메틸 α-히드록시메틸 아크릴레이트, 에틸 α-히드록시메틸 아크릴레이트, 프로필 α-히드록시메틸 아크릴레이트 및 부틸 α-히드록시메틸 아크릴레이트로 이루어진 그룹으로부터 선택될 수 있으나, 이들에만 한정되는 것은 아니다.Specific examples of the unsaturated carboxylic acid esters include benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, and isobutyl ( Meta) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, ethylhexyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetra Hydroperpril (meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-chloropropyl (meth) acrylate, 4-hydroxybutyl ( Meth) acrylate, acyloctyloxy-2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxy CD-ethyleneglycol (Meth) acrylate, methoxy triethylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate, poly (ethylene glycol) methyl ether (meth) acrylate, phenoxydiethylene glycol (meth) acrylate , p-nonylphenoxypolyethylene glycol (meth) acrylate, p-nonylphenoxypolypropylene glycol (meth) acrylate, glycidyl (meth) acrylate, tetrafluoropropyl (meth) acrylate, 1,1 , 1,3,3,3-hexafluoroisopropyl (meth) acrylate, octafluoropentyl (meth) acrylate, heptadecafluorodecyl (meth) acrylate, tribromophenyl (meth) acrylate , Methyl α-hydroxymethyl acrylate, ethyl α-hydroxymethyl acrylate, propyl α-hydroxymethyl acrylate and butyl α-hydroxymethyl acrylate It is, but is not limited thereto.
상기 방향족 비닐 단량체류의 구체적인 예로는, 스티렌, α-메틸스티렌, (o,m,p)-비닐 톨루엔, (o,m,p)-메톡시 스티렌, 및 (o,m,p)-클로로 스티렌으로 이루어진 그룹으로부터 선택될 수 있으나, 이들에만 한정되는 것은 아니다.Specific examples of the aromatic vinyl monomers include styrene, α-methylstyrene, (o, m, p) -vinyl toluene, (o, m, p) -methoxy styrene, and (o, m, p) -chloro It may be selected from the group consisting of styrene, but is not limited thereto.
상기 불포화 에테르류의 구체적인 예로는, 비닐 메틸 에테르, 비닐 에틸 에테르, 및 알릴 글리시딜 에테르로 이루어진 그룹으로부터 선택될 수 있으나, 이들에만 한정되는 것은 아니다.Specific examples of the unsaturated ethers may be selected from the group consisting of vinyl methyl ether, vinyl ethyl ether, and allyl glycidyl ether, but are not limited thereto.
상기 불포화 이미드류의 구체적인 예로는, N-페닐 말레이미드, N-(4-클로로페닐) 말레이미드, N-(4-히드록시페닐) 말레이미드, 및 N-시클로헥실 말레이미드로 이루어진 그룹으로부터 선택될 수 있으나, 이들에만 한정되는 것은 아니다.Specific examples of the unsaturated imides are selected from the group consisting of N-phenyl maleimide, N- (4-chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide, and N-cyclohexyl maleimide It may be, but is not limited to these.
상기 2단계에서는 상기 1단계의 기본 아크릴 바인더 수지에 불포화기를 도입하는 단계로서 상기 1단계의 기본 아크릴 바인더 수지 내에 함유되어 있는 에폭시기와 산기를 함유한 모노머의 산기를 반응시켜 얻을 수 있다. In the second step, as the step of introducing an unsaturated group to the basic acrylic binder resin of the first step may be obtained by reacting the acid group of the epoxy group contained in the basic acrylic binder resin of the first step and the monomer containing an acid group.
상기 산기를 함유한 모노머는 (메트)아크릴산, 크로톤산, 이타콘산, 말레인산, 푸마르산, 모노메틸 말레인산, 이소프렌 술폰산, 스티렌 술폰산, 5-노보넨-2-카복실산 등으로 이루어진 군으로부터 선택되는 1종 이상의 것을 이용할 수 있으나, 이에만 한정되는 것은 아니다.The monomer containing an acid group is at least one selected from the group consisting of (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, isoprene sulfonic acid, styrene sulfonic acid, 5-norbornene-2-carboxylic acid, and the like. May be used, but is not limited thereto.
상기 3단계는 상기 2단계의 불포화기가 함유된 바인더 수지에 산기를 부여하는 반응으로 상기 2단계의 에폭시기와 산기 함유 모노머의 산기와의 반응을 통해 생성되는 히드록시기를 산 무수물과 반응시켜 얻을 수 잇다. The third step is to give an acid group to the binder resin containing the unsaturated group of the second step may be obtained by reacting the hydroxy group generated by the reaction of the epoxy group of the second step with the acid group of the acid group-containing monomer with an acid anhydride.
상기 산 무수물로는 무수 말레인산, 무수 메틸 말레인산, 테트라하이드로 프탈산 무수물 등이 있으나, 이들에만 한정되는 것은 아니다.Examples of the acid anhydride include maleic anhydride, methyl maleic anhydride, tetrahydro phthalic anhydride, and the like, but are not limited thereto.
상기 바인더 수지의 함량은 상기 감광성 수지 조성물의 총 중량을 기준으로 1 ~ 50 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The content of the binder resin may be 1 to 50% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서에 따른 중합성 화합물은 에틸옥사이드 구조를 갖는 아크릴계 모노머를 포함한다. The polymerizable compound according to the present specification includes an acrylic monomer having an ethyl oxide structure.
상기 에틸옥사이드 구조를 갖는 아크릴계 모노머는 하기 화학식 1 내지 4 중 어느 하나로 표시되는 화합물 중 어느 하나 이상인 화합물을 포함한다. The acrylic monomer having the ethyl oxide structure includes a compound of any one or more of the compounds represented by any one of the following Chemical Formulas 1 to 4.
[화학식 1][Formula 1]
[화학식 2](2)
[화학식 3](3)
[화학식 4][Formula 4]
상기 화학식 1 및 4에서, R1 내지 R10는 각각 독립적으로 하기 화학식 5 또는 하기 화학식 8으로 표시되고, R11 내지 R13는 하기 화학식 8로 표시되며, R14 내지 R17은 하기 화학식 6로 표시된다. In Formulas 1 and 4, R1 to R10 are each independently represented by the following Formula 5 or Formula 8, R11 to R13 are represented by the following Formula 8, and R14 to R17 are represented by the following Formula 6.
[화학식 5][Chemical Formula 5]
[화학식 6][Chemical Formula 6]
상기 화학식 5 내지 6에서, R18 및 R19는 각각 독립적으로 수소 또는 C1~C10의 알킬기이며, R20은 하기 화학식 7로 표시된다. In Formulas 5 to 6, R18 and R19 are each independently hydrogen or an alkyl group of C 1 ~ C 10 , R20 is represented by the following formula (7).
[화학식 7][Formula 7]
상기 화학식 7에서, R21은 수소 또는 C1~C10의 알킬기이며, R22는 (CH2)bOH 또는 하기 화학식 8로 표시된다. In Chemical Formula 7, R21 is hydrogen or an alkyl group of C 1 to C 10 , and R22 is represented by (CH 2 ) b OH or the following Chemical Formula 8.
[화학식 8][Formula 8]
상기 화학식 8에서, R23은 (CH2)nO 또는 CO(CH2)lO 이며, R24는 수소 또는 C1~C10의 알킬기이고, n 및 l은 각각 독립적으로 2 내지 10인 정수이고, m은 1 내지 2의 정수이며, o 및 p는 1 내지 3의 정수이고, a 및 b는 1 내지 10의 정수이다.In Formula 8, R 23 is (CH 2 ) n O or CO (CH 2 ) l O, R 24 is hydrogen or an alkyl group of C 1 ~ C 10 , n and l are each independently an integer of 2 to 10, m is an integer of 1-2, o and p are integers of 1-3, and a and b are integers of 1-10.
상기 C1~C10 알킬기는 직쇄 또는 분지쇄일 수 있고, 구체적인 예로는 메틸기, 에틸기, 프로필기, 이소프로필기, 부틸기, t-부틸기 등이 있으나, 이에만 한정되는 것은 아니다.C 1 ~ C 10 The alkyl group may be linear or branched, and specific examples thereof include methyl group, ethyl group, propyl group, isopropyl group, butyl group, t-butyl group, and the like, but are not limited thereto.
상기 화학식 3은 하기 화학식 9로 표시될 수 있으나, 이에만 한정되는 것은 아니다.Formula 3 may be represented by the following Formula 9, but is not limited thereto.
[화학식 9][Chemical Formula 9]
상기 화학식 4는 하기 화학식 10로 표시될 수 있으나, 이에만 한정되는 것은 아니다.Formula 4 may be represented by the following Formula 10, but is not limited thereto.
[화학식 10][Formula 10]
상기 에틸옥사이드 구조를 갖는 아크릴계 모노머는 DPEA-12, RP1040, DM2015 등이 있으며, 이에 한정되는 것은 아니다.Acrylic monomers having an ethyl oxide structure include DPEA-12, RP1040, DM2015, but is not limited thereto.
본 명세서에서, 중합성 화합물은 불포화 이중결합을 포함하는 화합물이며, 개시제에 의해 개시되어 중합될 수 있는 화합물이며, 특히 감광성 수지 조성물에서 가교제로서 역할을 한다. In the present specification, the polymerizable compound is a compound containing an unsaturated double bond, a compound which can be polymerized by being initiated by an initiator, and particularly serves as a crosslinking agent in the photosensitive resin composition.
상기 중합성 화합물은 당 기술분야에서 일반적으로 사용하는 중합성 화합물을 더 포함할 수 있다. The polymerizable compound may further include a polymerizable compound generally used in the art.
예를 들면, 트리메틸올프로판 디(메트)아크릴레이트, 트리메틸올프로판 트리(메트)아크릴레이트, 펜타에리스리톨 테트라(메트)아크릴레이트, 디펜타에리스리톨 펜타(메트)아크릴레이트 및 디펜타에리스리톨 헥사(메트)아크릴레이트로 이루어진 군에서 선택되는 다가 알코올과 α, β-불포화 카르복실산을 에스테르화하여 얻어지는 화합물; 트리메틸올프로판 트리글리시딜에테르아크릴산 부가물, 비스페놀 A 디글리시딜에테르아크릴산 부가물 등의 글리시딜기를 함유하는 화합물에 (메트)아크릴산을 부가하여 얻어지는 화합물; β-히드록시에틸(메트)아크릴레이트의 프탈산디에스테르, β-히드록시에틸(메트)아크릴레이트의 톨루엔 디이소시아네이트 부가물 등의 수산기 또는 에틸렌성 불포화 결합을 가지는 화합물과 다가 카르복실산과의 에스테르 화합물, 또는 폴리이소시아네이트와의 부가물; 및 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, 부틸(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트 등의 (메트)아크릴산 알킬에스테르로 이루어지는 군으로부터 선택되는 1종 이상을 사용할 수 있으나, 이들에만 한정되지 않는다.For example, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) Compounds obtained by esterifying a polyhydric alcohol selected from the group consisting of acrylates with α, β-unsaturated carboxylic acids; A compound obtained by adding (meth) acrylic acid to a compound containing a glycidyl group such as trimethylolpropane triglycidyl ether acrylic acid adduct and bisphenol A diglycidyl ether acrylic acid adduct; ester compounds of a compound having a hydroxyl group or an ethylenically unsaturated bond such as a phthalic acid diester of? -hydroxyethyl (meth) acrylate and a toluene diisocyanate adduct of? -hydroxyethyl (meth) acrylate with a polyvalent carboxylic acid , Or adducts with polyisocyanates; And (meth) acrylic acid alkyl esters such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate. But it is not limited to these.
상기 중합성 화합물의 함량은 상기 감광성 수지 조성물의 총 중량을 기준으로 1 ~ 50 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The content of the polymerizable compound may be 1 to 50% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서에 따른 감광성 수지 조성물에 있어서, 상기 광개시제는 아세토페논계 화합물; 비이미다졸계 화합물; 트리아진계 화합물; 및 옥심계 화합물 중 선택된 어느 하나 이상일 수 있다.In the photosensitive resin composition according to the present specification, the photoinitiator is an acetophenone-based compound; Biimidazole type compounds; Triazine compounds; And oxime compounds.
상기 아세토페논계 화합물로는 2-히드록시-2-메틸-1-페닐프로판-1-온, 1-(4-이소프로필페닐)-2-히드록시-2-메틸프로판-1-온, 4-(2-히드록시에톡시)-페닐-(2-히드록시-2-프로필)케톤, 1-히드록시시클로헥실페닐케톤, 벤조인메틸 에테르, 벤조인에틸 에테르, 벤조인이소부틸 에테르, 벤조인부틸 에테르, 2,2-디메톡시-2-페닐아세토페논, 2-메틸-(4-메틸티오)페닐-2-몰폴리노-1-프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-몰폴리노페닐)-부탄-1-온, 또는 2-메틸-1-[4-(메틸티오)페닐]-2-몰폴리노프로판-1-온 등이 있으나. 이에만 한정되는 것은 아니다.Examples of the acetophenone compounds include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 4 -(2-hydroxyethoxy) -phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenylketone, benzoinmethyl ether, benzoinethyl ether, benzoin isobutyl ether, benzo Inbutyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- (4-methylthio) phenyl-2-morpholino-1-propan-1-one, 2-benzyl-2-dimethyl Amino-1- (4-morpholinophenyl) -butan-1-one, or 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one. It is not limited only to this.
상기 비이미다졸계 화합물로는 2,2'-비스(2-클로로페닐)-4,4',5,5'-테트라페닐 비이미다졸, 2,2'-비스(o-클로로페닐)-4,4',5,5'-테트라키스(3,4,5-트리메톡시페닐)-1,2'-비이미다졸, 2,2'-비스(2,3-디클로로페닐)-4,4',5,5'-테트라페닐 비이미다졸, 또는 2,2'-비스(o-클로로페닐)-4,4,5,5'-테트라페닐-1,2'-비이미다졸 등이 있으나. 이에만 한정되는 것은 아니다.Examples of the biimidazole compound include 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole and 2,2'-bis (o-chlorophenyl)- 4,4 ', 5,5'-tetrakis (3,4,5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl) -4 , 4 ', 5,5'-tetraphenyl biimidazole, or 2,2'-bis (o-chlorophenyl) -4,4,5,5'-tetraphenyl-1,2'-biimidazole, etc. There is. It is not limited only to this.
상기 트리아진계 화합물로는 3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오닉산, 1,1,1,3,3,3-헥사플로로이소프로필-3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오네이트, 에틸-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 2-에폭시에틸-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 시클로헥실-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 벤질-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 3-{클로로-4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오닉산, 3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피온아미드, 2,4-비스(트리클로로메틸)-6-p-메톡시스티릴-s-트리아진, 2,4-비스(트리클로로메틸)-6-(1-p-디메틸아미노페닐)-1,3,-부타디에닐-s-트리아진, 또는 2-트리클로로메틸-4-아미노-6-p-메톡시스티릴-s-트리아진 등이 있으나. 이에만 한정되는 것은 아니다.Examples of the triazine compound include 3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionic acid, 1,1,1,3,3,3 -Hexafluoroisopropyl-3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionate, ethyl-2- {4- [2, 4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, 2-epoxyethyl-2- {4- [2,4-bis (trichloromethyl) -s-triazine- 6-yl] phenylthio} acetate, cyclohexyl-2- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, benzyl-2- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, 3- {chloro-4- [2,4-bis (trichloromethyl) -s-triazine- 6-yl] phenylthio} propionic acid, 3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionamide, 2,4-bis (trichloro Rhomethyl) -6-p-methoxystyryl-s-triazine, 2,4-bis (trichloromethyl) -6- (1-p- Dimethylaminophenyl) -1,3, -butadienyl-s-triazine, or 2-trichloromethyl-4-amino-6-p-methoxystyryl-s-triazine. It is not limited only to this.
상기 옥심계 화합물로는 일본 시바사의 CGI-242, CGI-124 등이 있으나, 이에만 한정되는 것은 아니다.The oxime compounds include, but are not limited to, CGI-242, CGI-124, etc. of Shiva, Japan.
상기 광개시제의 함량은 감광성 수지 조성물 총 중량을 기준으로 0.1 ~ 20 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The content of the photoinitiator may be 0.1 to 20% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서에 따른 감광성 수지 조성물에 있어서, 상기 밀착촉진제는 기판과의 접착력을 증가시켜주는 화합물이라면 특별히 제한되지 않는다. In the photosensitive resin composition according to the present specification, the adhesion promoter is not particularly limited as long as it is a compound that increases adhesion to the substrate.
예를 들면, 상기 밀착촉진제는 상기 밀착촉진제는 메타아크릴로일옥시 프로필트리메톡시 실란, 메타아크릴로일옥시 프로필디메톡시 실란, 메타아크릴로일옥시 프로필트리에톡시 실란 및 메타아크릴로일옥시 프로필디메톡시실란 중 어느 하나 이상인 메타 아크릴로일계 실란; 및 옥틸트리메톡시 실란, 도데실트리메톡시 실란 및 옥타데실트리메톡시 실란 중 어느 하나 이상인 알킬 트리메톡시 실란을 포함할 수 있다. For example, the adhesion promoter may include methacryloyloxy propyltrimethoxy silane, methacryloyloxy propyldimethoxy silane, methacryloyloxy propyltriethoxy silane and methacryloyloxy propyl. Methacryloyl silane which is at least one of dimethoxysilane; And alkyl trimethoxy silane which is at least one of octyltrimethoxy silane, dodecyltrimethoxy silane, and octadecyltrimethoxy silane.
상기 밀착촉진제 총 중량을 기준으로, 상기 메타 아크릴로일계 실란의 함량은 65 ~ 95 중량%이며, 상기 알킬 트리메톡시 실란의 함량은 5 ~ 35 중량%일 수 있다. Based on the total weight of the adhesion promoter, the content of the methacryloyl-based silane may be 65 to 95% by weight, and the content of the alkyl trimethoxy silane may be 5 to 35% by weight.
상기 알킬 트리메톡시 실란의 함량은 메타 아크릴로일계 실란의 함량의 5 ~ 50 중량%일 수 있다. The content of the alkyl trimethoxy silane may be 5 to 50% by weight of the content of the methacryloyl-based silane.
상기 밀착촉진제의 함량은 감광성 수지 조성물 총 중량을 기준으로 0.01 ~ 1 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The content of the adhesion promoter may be 0.01 to 1% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서에 따른 감광성 수지 조성물에 있어서, 상기 용매는 아세톤, 메틸 에틸 케톤, 메틸 이소부틸 케톤, 메틸셀로솔브, 에틸셀로솔브, 테트라히드로퓨란, 1,4-디옥산, 에틸렌글리콜 디메틸 에테르, 에틸렌글리콜 디에틸 에테르, 프로필렌글리콜 디메틸 에테르, 프로필렌글리콜 디에틸 에테르, 디에틸렌글리콜 디메틸에테르, 디에틸렌글리콜 디에틸에테르, 디에틸렌글리콜 메틸 에틸 에테르, 클로로포름, 염화메틸렌, 1,2-디클로로에탄, 1,1,1-트리클로로에탄, 1,1,2-트리클로로에탄, 1,1,2-트리클로로에텐, 헥산, 헵탄, 옥탄, 시클로헥산, 벤젠, 톨루엔, 크실렌, 메탄올, 에탄올, 이소프로판올, 프로판올, 부탄올, t-부탄올, 2-에톡시 프로판올, 2-메톡시 프로판올, 3-메톡시 부탄올, 시클로헥사논, 시클로펜타논, 프로필렌글리콜 메틸 에테르 아세테이트, 프로펠렌글리콜 에틸 에테르 아세테이트, 3-메톡시부틸 아세테이트, 에틸 3-에톡시프로피오네이트, 에틸 셀로솔브아세테이트, 메틸 셀로솔브아세테이트, 부틸 아세테이트, 프로필렌글리콜 모노메틸에테르 및 디프로필렌글리콜 모노메틸에테르로 이루어지는 군으로부터 선택되는 1종 이상일 수 있으나, 이에만 한정되는 것은 아니다.In the photosensitive resin composition according to the present specification, the solvent is acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, tetrahydrofuran, 1,4-dioxane, ethylene glycol dimethyl ether, Ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, chloroform, methylene chloride, 1,2-dichloroethane, 1 , 1,1-trichloroethane, 1,1,2-trichloroethane, 1,1,2-trichloroethane, hexane, heptane, octane, cyclohexane, benzene, toluene, xylene, methanol, ethanol, isopropanol , Propanol, butanol, t-butanol, 2-ethoxy propanol, 2-methoxy propanol, 3-methoxy butanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, propylene From the group consisting of glycol ethyl ether acetate, 3-methoxybutyl acetate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate, propylene glycol monomethyl ether and dipropylene glycol monomethyl ether It may be one or more selected, but is not limited thereto.
상기 용매의 함량은 감광성 수지 조성물 총 중량을 기준으로 30 ~ 90 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The content of the solvent may be 30 to 90% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서에 따른 감광성 수지 조성물은 착색제를 추가로 포함할 수 있다. The photosensitive resin composition according to the present specification may further include a colorant.
상기 착색제로는 1종 이상의 안료, 염료 또는 이들의 혼합물을 사용할 수 있다. As the colorant, one or more pigments, dyes, or mixtures thereof may be used.
구체적으로 예시하면, 흑색의 착색제로는 흑색 안료를 포함하는 착색 분산액을 이용할 수 있다. 사용 가능한 카본블랙으로는 동해카본(주)의 시스토 5HIISAF-HS, 시스토 KH, 시스토 3HHAF-HS, 시스토 NH, 시스토 3M, 시스토 300HAF-LS, 시스토 116HMMAF-HS, 시스토 116MAF, 시스토 FMFEF-HS, 시스토 SOFEF, 시스토 VGPF, 시스토 SVHSRF-HS, 및 시스토 SSRF; 미쯔비시화학(주)의 다이어그램 블랙 ?, 다이어그램 블랙 N339, 다이어그램 블랙 SH, 다이어그램 블랙 H, 다이어그램 LH, 다이어그램 HA, 다이어그램 SF, 다이어그램 N550M, 다이어그램 M, 다이어그램 E, 다이어그램 G, 다이어그램 R, 다이어그램 N760M, 다이어그램 LR, #2700, #2600, #2400, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, #CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, 및 OIL31B; 대구사(주)의 PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, 및 LAMP BLACK-101; 콜롬비아 카본(주)의RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, 및 RAVEN-1170 등을 사용할 수 있으나, 이에만 한정되는 것은 아니다.Specifically, as the black colorant, a colored dispersion containing a black pigment may be used. The carbon black which can be used includes Sisto 5HIISAF-HS, Sisto KH, Sisto 3HHAF-HS, Sisto NH, Sisto 3M, Sisto 300HAF-LS, Sisto 116HMMAF-HS, Sisto of East Sea Carbon 116MAF, cysto FMFEF-HS, cysto SOFEF, cysto VGPF, cysto SVHSRF-HS, and cysto SSRF; Mitsubishi Chemical Corporation Diagram Black?, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, # 25, # CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; PRINTEX-55, PRINTEX-55, PRINTEX-45, PRINTEX-35, PRINTEX-55, PRINTEX-85, PRINTEX-75, PRINTEX- SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, and LAMP BLACK-101; PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A; SPECIAL BLACK-550; RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN- 2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, RAVEN-1170, etc. may be used, but is not limited thereto.
상기 카본블랙과 혼합하여 사용가능한 착색 안료로는 카민 6B(C.I.12490), 프탈로시아닌 그린(C.I. 74260), 프탈로시아닌 블루(C.I. 74160), 미쓰비시 카본 블랙 MA100, 페릴렌 블랙(BASF K0084. K0086), 시아닌 블랙, 리놀옐로우(C.I.21090), 리놀 옐로우GRO(C.I. 21090), 벤지딘 옐로우4T-564D, 미쓰비시 카본 블랙 MA-40, 빅토리아 퓨어 블루(C.I.42595), C.I. PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT 15:1, 15:4, 15:6, 22, 60, 64, C.I. PIGMENT 83, 139 C.I. PIGMENT VIOLET 23 등이 있으며, 이 밖에 백색 안료, 형광 안료 등을 사용할 수도 있으나, 이에만 한정되는 것은 아니다.Color pigments that can be mixed with the carbon black include carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), Mitsubishi carbon black MA100, perylene black (BASF K0084. K0086), cyanine black , Linol Yellow (CI21090), Linol Yellow GRO (CI 21090), Benzidine Yellow 4T-564D, Mitsubishi Carbon Black MA-40, Victoria Pure Blue (CI42595), CI PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT 15: 1, 15: 4, 15: 6, 22, 60, 64, C.I. PIGMENT 83, 139 C.I. PIGMENT VIOLET 23, and the like, and white pigments, fluorescent pigments and the like may also be used, but are not limited thereto.
또한, 청색의 착색제로는 청색 안료 단독으로 사용하거나, 청색 안료와 바이올렛 안료를 혼용하여 사용할 수 있다.In addition, as a blue coloring agent, it can be used individually by a blue pigment, or can mix and use a blue pigment and a violet pigment.
상기 청색 안료로는 트리아릴카보늄계인 Pig.Blue#1(C.I.42595:2), Pig.Blue#2(C.I.44045:2), Pig.Blue#9(C.I.42025:1), Pig.Blue#10(C.I.44040:2), Pig.Blue#14(C.I.42600:1), Pig.Blue#18(C.I.42770:1), Pig.Blue#19(C.I.42750), Pig.Blue#56(C.I.42800), Pig.Blue#62(C.I.44084); Cu 프탈로시아닌계인 Pig.Blue#15(C.I.74160), Pig.Blue#15:1(C.I.74160); 메탈프리 프탈로시아닌계인 Pig.Blue#16(C.I.74100); 인단스론계인 Pig.Blue#60(C.I.69800), Pig.Blue#64(C.I.69825); 인디고계인 Pig.Blue#66(C.I.73000), Pig.Blue#63(C.I.73015:x) 등이 사용될 수 있으나, 이에만 한정되는 것은 아니다.Examples of the blue pigment include Pig.Blue # 1 (CI42595: 2), Pig.Blue # 2 (CI44045: 2), Pig.Blue # 9 (CI42025: 1) and Pig.Blue #, which are triarylcarbonium compounds. 10 (CI44040: 2), Pig.Blue # 14 (CI42600: 1), Pig.Blue # 18 (CI42770: 1), Pig.Blue # 19 (CI42750), Pig.Blue # 56 (CI42800 ), Pig.Blue # 62 (CI44084); Cu phthalocyanine-based Pig.Blue # 15 (C.I.74160), Pig.Blue # 15: 1 (C.I.74160); Pig.Blue # 16 (C.I.74100), which is a metal phthalocyanine type; Indanthrone system Pig.Blue # 60 (C.I.69800), Pig.Blue # 64 (C.I.69825); Indigo-based Pig.Blue # 66 (C.I.73000), Pig.Blue # 63 (C.I.73015: x) and the like may be used, but is not limited thereto.
상기 바이올렛 안료로는 트리아릴카보늄계인 Pig.Violet#1(C.I.45170:2), Pig.Violet#2(C.I.45175:1), Pig.Violet#3(C.I.42535:2), Pig.Violet#27(C.I.42535:3), Pig.Violet#39(C.I.42555:2); 안스라퀴논계인 Pig.Violet#5:1(C.I.58055:1); 나프톨계인 Pig.Violet#25(C.I.12321), Pig.Violet#50(C.I.12322); 퀴나크리돈계인 Pig.Violet#19(C.I.73900); 디옥사진계인 Pig.Violet#23(C.I.51319), Pig.Violet#37(C.I.51345); 페릴렌계인 Pig.Violet#29(C.I.71129); 벤즈이미다졸론계인 Pig.Violet#32(C.I.12517) 등이 사용될 수 있으나, 이에만 한정되는 것은 아니다.The violet pigments include Pig.Violet # 1 (CI45170: 2), Pig.Violet # 2 (CI45175: 1), Pig.Violet # 3 (CI42535: 2), Pig.Violet # 27 (CI42535: 3), Pig.Violet # 39 (CI42555: 2); Anthraquinone-based Pig.Violet # 5: 1 (C.I.58055: 1); Naphthol-based Pig.Violet # 25 (C.I.12321), Pig.Violet # 50 (C.I.12322); Pig.Violet # 19 (C.I.73900) which is a quinacridone family; Pig.Violet # 23 (C.I.51319) and Pig.Violet # 37 (C.I.51345), which are dioxazines; Perylene-based Pig.Violet # 29 (C.I.71129); Benzimidazolone-based Pig.Violet # 32 (C.I.12517) may be used, but is not limited thereto.
또한, 녹색의 착색제로는 녹색 안료 단독으로 사용하거나, 녹색 안료와 노란색 안료를 혼용하여 사용할 수 있다.In addition, as a green coloring agent, it can use individually by a green pigment, or can mix and use a green pigment and a yellow pigment.
상기 녹색 안료로는 트리아릴카보늄계인 Pig.Green#1(C.I.42040:1), Pig.Green#2(C.I.42040:1), Pig.Green#4(C.I.42000:2); Cu 프탈로시아닌계인 Pig.Green#7(C.I.74260), Pig.Green#36(C.I.74265); Zn 프탈로시아닌계인 Pig.Green#58, 메탈 복합체인 Pig.Green#8(C.I.10006), Pig.Green#10(C.I.12775) 등이 사용될 수 있으나, 이에만 한정되는 것은 아니다.Examples of the green pigment include Pig.Green # 1 (C.I.42040: 1), Pig.Green # 2 (C.I.42040: 1), and Pig.Green # 4 (C.I.42000: 2), which are triarylcarbonium compounds; Pig. Green # 7 (C.I.74260), Pig.Green # 36 (C.I.74265), which are Cu phthalocyanine series; Zn phthalocyanine-based Pig.Green # 58, metal complex Pig.Green # 8 (C.I.10006), Pig.Green # 10 (C.I.12775) and the like may be used, but are not limited thereto.
상기 황색 안료로는 모노아조계인 Pig.Yellow#1(C.I.11680), Pig.Yellow#2(C.I.11730), Pig.Yellow#3(C.I.11710), Pig.Yellow#5(C.I.11660), Pig.Yellow#6(C.I.11670), Pig.Yellow#10(C.I.12710), Pig.Yellow#49(C.I.11765), Pig.Yellow#65(C.I.11740), Pig.Yellow#73(C.I.11738), Pig.Yellow#74(C.I.11741), Pig.Yellow#75(C.I.11770), Pig.Yellow#97(C.I.11767), Pig.Yellow#98(C.I.11727), Pig.Yellow#111(C.I.11745), Pig.Yellow#116(C.I.11790), Pig.Yellow#167(C.I.11737); 모노아조계 금속 복합체인 Pig.Yellow#61(C.I.13880), Pig.Yellow#62:1(C.I.13940:1), Pig.Yellow#100(C.I.19140:1), Pig.Yellow#168(C.I.13960), Pig.Yellow#169(C.I.13955), Pig.Yellow#183(C.I.18792); 비스아세토아세트아릴라이드계인 Pig.Yellow#16(C.I.20040); 디아릴라이드계인 Pig.Yellow#12(C.I.21090), Pig.Yellow#13(C.I.21100), Pig.Yellow#14(C.I.21095), Pig.Yellow#17(C.I.21105), Pig.Yellow#55(C.I.21096), Pig.Yellow#63(C.I.21091), Pig.Yellow#81(C.I.21127), Pig.Yellow#83(C.I.21108), Pig.Yellow#87(C.I.21107:1), Pig.Yellow#113(C.I.21126), Pig.Yellow#114(C.I.21092), Pig.Yellow#124(C.I.21107), Pig.Yellow#126(C.I.21101), Pig.Yellow#127(21102), Pig.Yellow#152(C.I.21111), Pig.Yellow#170(C.I.21104), Pig.Yellow#171(C.I.21106), Pig.Yellow#172(C.I.21109), Pig.Yellow#174(C.I.21098); 플라반스론계인 Pig.Yellow#24(C.I.70600); 디아조계 축합물인 Pig.Yellow#93(C.I.20710), Pig.Yellow#94(C.I.20038), Pig.Yellow#95(C.I.20034), Pig.Yellow#128(C.I.20037), Pig.Yellow#166(C.I.20035); 안스라퀴논계인 Pig.Yellow#123(C.I.65049), Pig.Yellow#147(C.I.60645); 알다진계인 Pig.Yellow#101(C.I.48052); 나프탈렌 술폰산 금속 복합체인 Pig.Yellow#104(C.I.15985:1); 안스라피리미딘계인 Pig.Yellow#108(C.I.68420); 이소인돌리논계인 Pig.Yellow#109(C.I.56284), Pig.Yellow#110(C.I.56280), Pig.Yellow#139(C.I.56298), Pig.Yellow#185(C.I.56290); 벤즈이미다졸론계인 Pig.Yellow#123(C.I.11783), Pig.Yellow#154(C.I.13980), Pig.Yellow#175(C.I.11784), Pig.Yellow#180(C.I.21290), Pig.Yellow#181(C.I.11777); 퀴노프탈론계인 Pig.Yellow#138(C.I.56300); 금속복합체인 Pig.Yellow#117(C.I.48043), Pig.Yellow#129(C.I.48042), Pig.Yellow#150(C.I.12764), Pig.Yellow#153(C.I.48545), Pig.Yellow#177(C.I.48120), Pig.Yellow#179(C.I.48125) 등이 사용될 수 있으나, 이에만 한정되는 것은 아니다.Examples of the yellow pigment include Pig. Yellow # 1 (CI11680), Pig. Yellow # 2 (CI11730), Pig. Yellow # 3 (CI11710), Pig. Yellow # 5 (CI11660), and Pig. Yellow # 6 (CI11670), Pig. Yellow # 10 (CI12710), Pig. Yellow # 49 (CI11765), Pig. Yellow # 65 (CI11740), Pig. Yellow # 73 (CI11738), Pig. Yellow # 74 (CI11741), Pig. Yellow # 75 (CI11770), Pig. Yellow # 97 (CI11767), Pig. Yellow # 98 (CI11727), Pig. Yellow # 111 (CI11745), Pig. Yellow # 116 (CI11790), Pig. Yellow # 167 (CI11737); Pig.Yellow # 61 (CI13880), Pig.Yellow # 62: 1 (CI13940: 1), Pig.Yellow # 100 (CI19140: 1), Pig.Yellow # 168 (CI13960) ), Pig. Yellow # 169 (CI13955), Pig. Yellow # 183 (CI18792); Pig. Yellow # 16 (C.I. 20040), which is a bisacetoacetalilide system; Pigary Yellow # 12 (CI21090), Pig. Yellow # 13 (CI21100), Pig. Yellow # 14 (CI21095), Pig. Yellow # 17 (CI21105), Pig. Yellow # 55 CI21096), Pig.Yellow # 63 (CI21091), Pig.Yellow # 81 (CI21127), Pig.Yellow # 83 (CI21108), Pig.Yellow # 87 (CI21107: 1), Pig.Yellow # 113 (CI21126), Pig.Yellow # 114 (CI21092), Pig.Yellow # 124 (CI21107), Pig.Yellow # 126 (CI21101), Pig.Yellow # 127 (21102), Pig.Yellow # 152 (CI21111), Pig. Yellow # 170 (CI21104), Pig. Yellow # 171 (CI21106), Pig. Yellow # 172 (CI21109), Pig. Yellow # 174 (CI21098); Pig.Yellow # 24 (C.I.70600), which is a flavones system; Pig.Yellow # 93 (CI20710), Pig.Yellow # 94 (CI20038), Pig.Yellow # 95 (CI20034), Pig.Yellow # 128 (CI20037), Pig.Yellow # 166 (Diazo condensate) CI20035); Anthraquinone-based Pig. Yellow # 123 (C.I.65049), Pig.Yellow # 147 (C.I.60645); Pig.Yellow # 101 (C.I.48052), which is an alginate; Pig.Yellow # 104 (C.I.15985: 1), a naphthalene sulfonic acid metal complex; Pigra Yellow # 108 (C.I.68420), which is anthrapyrimidine; Pig.Yellow # 109 (C.I.56284), Pig.Yellow # 110 (C.I.56280), Pig.Yellow # 139 (C.I.56298), Pig.Yellow # 185 (C.I.56290), which are isoindolinones; Benzimidazolone series Pig.Yellow # 123 (CI11783), Pig.Yellow # 154 (CI13980), Pig.Yellow # 175 (CI11784), Pig.Yellow # 180 (CI21290), Pig.Yellow # 181 (CI11777); Pig. Yellow # 138 (C.I. 56300), which is a quinophthalone; Pig.Yellow # 117 (CI48043), Pig.Yellow # 129 (CI48042), Pig.Yellow # 150 (CI12764), Pig.Yellow # 153 (CI48545), Pig.Yellow # 177 (CI) 48120, Pig. Yellow # 179 (CI48125), etc. may be used, but is not limited thereto.
또한, 적색 안료로는 적색 안료 단독으로 사용하거나, 적색 안료와 상기 황색 안료를 혼용하여 사용할 수 있다. In addition, as a red pigment, it can be used individually by a red pigment, or can mix and use a red pigment and the said yellow pigment.
상기 적색 안료로는 나프톨계 적색 안료인 Pig.Red #1 (C.I.12070), Pig.Red #2 (C.I.12310), Pig.Red #3 (C.I.12120), Pig.Red #4(C.I.12085), Pig.Red #5 (C.I.12490), Pig.Red #6 (C.I.12090), Pig.Red #7(C.I.12420), Pig.Red #8 (C.I.12355), Pig.Red #9 (C.I.12460), Pig.Red #10 (C.I.12440), Pig.Red #11 (C.I.12430), Pig.Red #12(C.I.12385), Pig.Red #13(C.I.12395), Pig.Red #14(C.I.12380), Pig.Red #15(C.I.12465), Pig.Red #16(12500), Pig.Red #17(C.I.12390), Pig.Red #18(C.I.12350), Pig.Red #21(C.I.12300), Pig.Red #22(C.I.12315), Pig.Red #23(C.I.12355), Pig.Red #31(12360), Pig.Red #32(12320), Pig.Red #95(C.I.15897), Pig.Red #112(C.I.12370), Pig.Red #114(C.I.12351), Pig.Red #119(C.I.12469), Pig.Red #146(C.I.12485), Pig.Red #147(C.I.12433), Pig.Red #148(C.I.12369), Pig.Red #150(C.I.12290), Pig.Red #151(C.I.15890), Pig.Red #184(C.I.12487), Pig.Red #187(C.I.12486), Pig.Red #188(C.I.12467), Pig.Red #210(C.I.12474), Pig.Red #245(C.I.12317), Pig.Red #253(C.I.12375), Pig.Red #258(C.I.12318), Pig.Red #261(C.I.12468); 나프톨계와 금속 복합체인 Pig.Red #49(C.I.15630), Pig.Red #49:1(C.I.15630:1), Pig.Red #49:2(C.I.15630:2), Pig.Red #49:3(C.I.15630:3), Pig.Red #50:1(C.I.15500:1), Pig.Red #51:1(C.I.15580:1), Pig.Red #53(C.I.15585), Pig.Red #53:1(C.I.15585:1), Pig.Red #68(C.I.15525), Pig.Red #243(C.I.15910), Pig.Red #247(C.I.15915); 디스아조피라졸론계인 Pig.Red #37(C.I.21205), Pig.Red #38(C.I.21210), Pig.Red #41(C.I.21200); 디스아조계 축합물인 Pig.Red #144(C.I.20735), Pig.Red #166(C.I.20035), Pig.Red #220(C.I.20055), Pig.Red #221(C.I.20065), Pig.Red #242(C.I.20067); 2-히드록시-3-나프토익산계 금속 복합체인 Pig.Red #48:1(C.I.15865:1), Pig.Red #48:2(C.I.15865:2), Pig.Red #48:3(C.I.15865:3), Pig.Red #48:4(C.I.15865:4), Pig.Red #48:5(C.I.15865:5), Pig.Red #52:1(C.I.15860:1), Pig.Red #52:2(C.I.15860:2), Pig.Red #57:1(C.I.15850:1), Pig.Red #58:2(C.I.15825:2), Pig.Red #58:4(C.I.15825:4), Pig.Red #63:1(C.I.15880:1), Pig.Red #63:2(C.I.15880:2), Pig.Red #64(C.I.15800), Pig.Red #64:1(C.I.15800:1), Pig.Red #200(C.I.15867); 나프탈렌술폰산 금속 복합체인 Pig.Red #60:1(C.I.16105:1), Pig.Red #66(C.I.18000:1), Pig.Red #67(C.I.18025:1); 트리아릴카보늄계인 Pig.Red #81:1(C.I.45160:1), Pig.Red #81:3(C.I.45160:3), Pig.Red #169(C.I.45160:2); 안트라퀴논계인 Pig.Red #89(C.I.60745), Pig.Red #177(65300); 시오인디고계인 Pig.Red #88(C.I.73312), Pig.Red #181(C.I.73360); 퀴나크리돈계인 Pig.Red #122(C.I.73915), Pig.Red #207(C.I.73900), Pig.Red #209(C.I.73905); 페릴렌계인 Pig.Red #123(C.I.71145), Pig.Red #149(C.I.71137), Pig.Red #178(C.I.71155), Pig.Red #179(C.I.71130), Pig.Red #190(C.I.71140), Pig.Red #194(C.I.71100), Pig.Red #224(C.I.71127); 밴즈이미다졸론계인 Pig.Red #171(C.I.12512), Pig.Red #175(C.I.12513), Pig.Red #176(C.I.12515), Pig.Red #185(C.I.12516), Pig.Red #208(C.I.12514); 피란스론계인 Pig.Red #216(C.I.59710); 디케토피롤로피롤계인 Pig.Red #254(C.I.56110); 및 이소인돌린계인 Pig.Red #260(C.I.56295) 등으로 이루어진 그룹으로부터 선택될 수 있다.As the red pigment, Pig.Red # 1 (CI12070), Pig.Red # 2 (CI12310), Pig.Red # 3 (CI12120), Pig.Red # 4 (CI12085), which are naphthol-based red pigments, Pig.Red # 5 (CI12490), Pig.Red # 6 (CI12090), Pig.Red # 7 (CI12420), Pig.Red # 8 (CI12355), Pig.Red # 9 (CI12460), Pig.Red # 10 (CI12440), Pig.Red # 11 (CI12430), Pig.Red # 12 (CI12385), Pig.Red # 13 (CI12395), Pig.Red # 14 (CI12380), Pig.Red # 15 (CI12465), Pig.Red # 16 (12500), Pig.Red # 17 (CI12390), Pig.Red # 18 (CI12350), Pig.Red # 21 (CI12300), Pig .Red # 22 (CI12315), Pig.Red # 23 (CI12355), Pig.Red # 31 (12360), Pig.Red # 32 (12320), Pig.Red # 95 (CI15897), Pig.Red # 112 (CI12370), Pig.Red # 114 (CI12351), Pig.Red # 119 (CI12469), Pig.Red # 146 (CI12485), Pig.Red # 147 (CI12433), Pig.Red # 148 (CI12369), Pig.Red # 150 (CI12290), Pig.Red # 151 (CI15890), Pig.Red # 184 (CI12487), Pig.Red # 187 (CI12486), Pig.Red # 188 (CI12467), Pig.Red # 210 (CI12474), Pig.Red # 245 (CI12317), Pig.Red # 253 (CI12375), Pig.Red # 258 (CI12318), Pig .Red # 261 (C.I.12468); Pig.Red # 49 (CI15630), Pig.Red # 49: 1 (CI15630: 1), Pig.Red # 49: 2 (CI15630: 2), Pig.Red # 49: naphthol-based and metal complexes 3 (CI15630: 3), Pig.Red # 50: 1 (CI15500: 1), Pig.Red # 51: 1 (CI15580: 1), Pig.Red # 53 (CI15585), Pig.Red # 53: 1 (CI15585: 1), Pig.Red # 68 (CI15525), Pig.Red # 243 (CI15910), Pig.Red # 247 (CI15915); Disazopyrazolone Pig.Red # 37 (C.I.21205), Pig.Red # 38 (C.I.21210), Pig.Red # 41 (C.I.21200); Disazo-based condensates Pig.Red # 144 (CI20735), Pig.Red # 166 (CI20035), Pig.Red # 220 (CI20055), Pig.Red # 221 (CI20065), Pig.Red # 242 (CI20067); Pig.Red # 48: 1 (CI15865: 1), Pig.Red # 48: 2 (CI15865: 2), Pig.Red # 48: 3 (CI, 2-hydroxy-3-naphthoic acid-based metal complexes 15865: 3), Pig.Red # 48: 4 (CI15865: 4), Pig.Red # 48: 5 (CI15865: 5), Pig.Red # 52: 1 (CI15860: 1), Pig.Red # 52: 2 (CI15860: 2), Pig.Red # 57: 1 (CI15850: 1), Pig.Red # 58: 2 (CI15825: 2), Pig.Red # 58: 4 (CI15825: 4), Pig.Red # 63: 1 (CI15880: 1), Pig.Red # 63: 2 (CI15880: 2), Pig.Red # 64 (CI15800), Pig.Red # 64: 1 (CI 15800: 1), Pig. Red # 200 (CI15867); Pig.Red # 60: 1 (C.I.16105: 1), Pig.Red # 66 (C.I.18000: 1), Pig.Red # 67 (C.I.18025: 1), naphthalenesulfonic acid metal complexes; Triarylcarbonium-based Pig.Red # 81: 1 (C.I.45160: 1), Pig.Red # 81: 3 (C.I.45160: 3), Pig.Red # 169 (C.I.45160: 2); Pig.Red # 89 (C.I. 60745), Pig.Red # 177 (65300), which are anthraquinones; Pig.Red # 88 (C.I.73312), Pig.Red # 181 (C.I.73360), which are ciiodigo-based; The quinacridone family Pig.Red # 122 (C.I.73915), Pig.Red # 207 (C.I.73900), Pig.Red # 209 (C.I.73905); Perylene-based Pig.Red # 123 (CI71145), Pig.Red # 149 (CI71137), Pig.Red # 178 (CI71155), Pig.Red # 179 (CI71130), Pig.Red # 190 (CI 71140), Pig. Red # 194 (CI71100), Pig. Red # 224 (CI71127); Van. Imidazolone-based Pig.Red # 171 (CI12512), Pig.Red # 175 (CI12513), Pig.Red # 176 (CI12515), Pig.Red # 185 (CI12516), Pig.Red # 208 (CI12514); Pyranthrone Pig.Red # 216 (C.I.59710); Pig.Red # 254 (C.I.56110), a diketopyrrolopyrrole system; And Pig.Red # 260 (C.I.56295), which is isoindolin-based, and the like.
상기 착색제의 함량은 감광성 수지 조성물 총중량을 기준으로 5 ~ 60 중량% 일 수 있다.The content of the colorant may be 5 to 60% by weight based on the total weight of the photosensitive resin composition.
본 명세서에 따른 감광성 수지 조성물은 광가교증감제, 경화촉진제, 분산제, 산화방지제, 자외선흡수제, 열중합방지제, 계면활성제 및 레벨링제로 이루어지는 군으로부터 선택된 1종 이상의 첨가제를 추가로 포함할 수 있다.The photosensitive resin composition according to the present disclosure may further include at least one additive selected from the group consisting of photocrosslinking sensitizers, curing accelerators, dispersants, antioxidants, ultraviolet absorbers, thermal polymerization inhibitors, surfactants and leveling agents.
상기 광가교증감제로는, 예컨대 벤조페논, 4,4-비스(디메틸아미노)벤조페논, 4,4비스(디에틸아미노)벤조페논, 2,4,5-트리메틸아미노벤조페논, 메틸-o-벤조일벤조에이트, 3,3-디메틸-4-메톡시벤조페논 또는 3,3,4,4-테트라(t-부틸퍼옥시카보닐)벤조페논 등의 벤조페논계 화합물; 9-플로레논, 2-크로로-9-프로레논, 2-메틸-9-플로레논 등의 플로레논계 화합물; 티옥산톤, 2,4-디에틸 티옥산톤, 2-클로로 티옥산톤, 1-클로로-4-프로필옥시 티옥산톤, 이소프로필티옥산톤 또는 디이소프로필티옥산톤 등의 티옥산톤계 화합물; 크산톤 또는 2-메틸크산톤 등의 크산톤계 화합물; 안트라퀴논, 2-메틸 안트라퀴논, 2-에틸 안트라퀴논, t-부틸안트라퀴논 또는 2,6-디클로로-9,10-안트라퀴논 등의 안트라퀴논계 화합물; 9-페닐아크리딘, 1,7-비스(9-아크리디닐)헵탄, 1,5-비스(9-아크리디닐펜탄) 또는 1,3-비스(9-아크리디닐)프로판 등의 아크리딘계 화합물; 벤질, 1,7,7-트리메틸-비시클로[2,2,1]헵탄-2,3-디온, 9,10-펜안트렌퀴논 등의 디카보닐 화합물; 2,4,6-트리메틸벤조일 디페닐포스핀 옥사이드 또는 비스(2,6디메톡시벤조일)-2,4,4-트리메틸페틸 포스핀 옥사이드 등의 포스핀 옥사이드계 화합물; 메틸-4-(디메틸아미노)벤조에이트, 에틸-4-(디메틸아미노)벤조에이트 또는 2-n-부톡시에틸-4-(디메틸아미노)벤조에이트 등의 벤조페논계 화합물; 2,5-비스(4-디에틸아미노벤잘)시클로펜타논, 2,6-비스(4-에틸아미노벤잘)시클로헥사논 또는 2,6-비스(4-디에틸아미노벤잘)-4-메틸-시클로펜타논 등의 아미노 시너지스트; 3,3-카본닐비닐-7-(디에틸아미노)쿠마린, 3-(2-벤조티아졸일)-7-(디에틸아미노)쿠마린, 3-벤조일-7-(디에틸아미노)쿠마린, 3-벤조일-7-메톡시-쿠마린 또는 10,10-카르보닐비스[1,1,7,7-테트라메틸-2,3,6,7-테트라히드로-1H,5H,11H-C1]-벤조피라노[6,7,8-ij]-퀴놀리진-11-온 등의 쿠마린계 화합물; 4-디에틸아미노 칼콘, 4-아지드벤잘아세토페논 등의 칼콘 화합물; 2-벤조일메틸렌, 또는 3-메틸-b-나프토티아졸린 등을 사용할 수 있다. Examples of the photocrosslinking sensitizer include benzophenone, 4,4-bis (dimethylamino) benzophenone, 4,4bis (diethylamino) benzophenone, 2,4,5-trimethylaminobenzophenone, and methyl-o-. Benzophenone compounds such as benzoylbenzoate, 3,3-dimethyl-4-methoxybenzophenone or 3,3,4,4-tetra (t-butylperoxycarbonyl) benzophenone; Fluorene-based compounds such as 9-fluorenone, 2-chloro-9-proprenone and 2-methyl-9-fluorenone; Thioxanthones such as thioxanthone, 2,4-diethyl thioxanthone, 2-chloro thioxanthone, 1-chloro-4-propyloxy thioxanthone, isopropyl thioxanthone or diisopropyl thioxanthone compound; Xanthone compounds such as xanthone or 2-methylxanthone; Anthraquinone compounds such as anthraquinone, 2-methyl anthraquinone, 2-ethyl anthraquinone, t-butylanthraquinone or 2,6-dichloro-9,10-anthraquinone; 9-phenylacridine, 1,7-bis (9-acridinyl) heptane, 1,5-bis (9-acridinylpentane) or 1,3-bis (9-acridinyl) propane Acridine-based compounds; Dicarbonyl compounds such as benzyl, 1,7,7-trimethyl-bicyclo [2,2,1] heptane-2,3-dione, and 9,10-phenanthrenequinone; Phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide or bis (2,6dimethoxybenzoyl) -2,4,4-trimethylphenyl phosphine oxide; Benzophenone compounds such as methyl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate or 2-n-butoxyethyl-4- (dimethylamino) benzoate; 2,5-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-ethylaminobenzal) cyclohexanone or 2,6-bis (4-diethylaminobenzal) -4-methyl Amino synergists such as cyclopentanone; 3,3-carbonylvinyl-7- (diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethylamino) coumarin, 3-benzoyl-7- (diethylamino) coumarin, 3 -Benzoyl-7-methoxy-coumarin or 10,10-carbonylbis [1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H, 5H, 11H-C1] -benzo Coumarin-based compounds such as pyrano [6,7,8-ij] -quinolizine-11-one; Chalcone compounds such as 4-diethylaminokalone and 4-azidobenzalacetophenone; 2-benzoylmethylene, or 3-methyl-b-naphthothiazoline.
상기 경화촉진제로는, 예컨대 2-머캡토벤조이미다졸, 2-머캡토벤조티아졸, 2-머캡토벤조옥사졸, 2,5-디머캡토-1,3,4-티아디아졸, 2-머캡토-4,6-디메틸아미노피리딘, 펜타에리스리톨 테트라키스(3-머캡토프로피오네이트), 펜타에리스리톨 트리스(3-머캡토프로피오네이트), 펜타에리스리톨 테트라키스(2-머캡토아세테이트), 펜타에리스리톨 트리스(2-머캡토아세테이트), 트리메틸올프로판 트리스(2-머캡토아세테이트), 트리메틸올프로판 트리스(3-머캡토프로피오네이트), 트리메틸올에탄 트리스(2-머캡토아세테이트), 및 트리메틸올에탄 트리스(3-머캡토프로피오네이트)로 이루어진 군으로부터 선택된 1 종 이상을 포함할 수 있으나, 이들로만 한정되는 것은 아니며 당 기술분야에 일반적으로 알려져 있는 것들을 포함할 수 있다.Examples of the curing accelerator include 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2,5-dimercapto-1,3,4-thiadiazole, 2- Mercapto-4,6-dimethylaminopyridine, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), pentaerythritol tetrakis (2-mercaptoacetate), Pentaerythritol tris (2-mercaptoacetate), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), trimethylolethane tris (2-mercaptoacetate), and Trimethylolethane tris (3-mercaptopropionate) may include one or more selected from the group consisting of, but is not limited to these, and may include those generally known in the art.
상기 분산제는 미리 안료를 표면 처리하는 형태로 안료에 내부 첨가시키는 방법, 또는 안료에 외부 첨가시키는 방법으로 사용할 수 있다. 상기 분산제로는 고분자형, 비이온성, 음이온성, 또는 양이온성 분산제를 사용할 수 있으며, 그 예로는 폴리알킬렌글리콜 및 이의 에스테르, 폴리옥시알킬렌 다가 알콜, 에스테르알킬렌 옥사이드 부가물, 알코올알킬렌옥사이드 부가물, 설폰산 에스테르, 설폰산염, 카르복실산에스테르, 카르복실산염, 알킬아미드알킬렌옥사이드 부가물, 및 알킬아민으로 이루어진 그룹으로부터 선택된 1종 이상이 있으나, 이에 한정되는 것은 아니다.The dispersant may be used as a method of internally adding to the pigment in the form of surface treatment of the pigment in advance or externally adding to the pigment. The dispersant may be a polymeric, nonionic, anionic, or cationic dispersant, and examples thereof include polyalkylene glycols and esters thereof, polyoxyalkylene polyhydric alcohols, ester alkylene oxide adducts, and alcohol alkylenes. At least one selected from the group consisting of oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, alkylamide alkylene oxide adducts, and alkylamines, but is not limited thereto.
상기 산화방지제는 2,2-티오비스(4-메틸-6-t-부틸페놀), 또는 2,6-g,t-부틸페놀 등을 사용할 수 있고, 상기 자외선 흡수제는 2-(3-t-부틸-5-메틸-2-히드록시페닐)-5-클로로-벤조트리아졸, 또는 알콕시 벤조페논 등을 사용할 수 있다.The antioxidant may be 2,2-thiobis (4-methyl-6-t-butylphenol), or 2,6-g, t-butylphenol, -Butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole, or alkoxybenzophenone.
상기 자외선 흡수제는 2-(3-t-부틸-5-메틸-2-히드록시페닐)-5-클로로-벤조트리아졸, 또는 알콕시 벤조페논 등을 사용할 수 있으나, 이에 한정되는 것은 아니다.The ultraviolet absorber may use 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole or alkoxy benzophenone, but is not limited thereto.
상기 열중합방지제는 히드로퀴논, p-메톡시페놀, 디-t-부틸-p-크레졸, 피로가롤, t-부틸카테콜, 벤조퀴논, 4,4-티오비스(3-메틸-6-t-부틸페놀), 2,2-메틸렌비스(4-메틸-6-t-부틸페놀), 또는 2-머캅토이미다졸 등을 사용할 수 있으나, 이에 한정되는 것은 아니다.The thermal polymerization inhibitor is hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogarol, t-butylcatechol, benzoquinone, 4,4-thiobis (3-methyl-6-t -Butylphenol), 2,2-methylenebis (4-methyl-6-t-butylphenol), 2-mercaptoimidazole and the like can be used, but is not limited thereto.
상기 계면활성제는 실리콘계 계면활성제 또는 불소계 계면활성제이며, 구체적으로 실리콘계 계면활성제는 BYK-Chemie 사의 BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380, BYK-390 등을 사용할 수 있으며, 불소계 계면활성제로는 DIC(DaiNippon Ink & Chemicals) 사의 F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF-1442 등을 사용할 수 있으나, 이에만 한정되는 것은 아니다.Specifically, the silicone surfactant is BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307 , BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-370, BYK-370, BYK-380, and BYK-390 may be used as the fluorine-based surfactant, and DIC F-444, F-444, F-441, F-450, F-493, F-494, F-443, F-444, F-445 and F-446 of Dai Nippon Ink & , F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F- TF-1116SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1025SF, TF- , TF-1131, TF1132, TF1027SF, TF-1441, TF-1442, and the like.
상기 분산제, 산화방지제, 자외선흡수제, 열중합방지제, 및 레벨링제는 당 기술분야에 일반적으로 알려져 있는 것들을 포함할 수 있다.The dispersant, antioxidant, ultraviolet absorbent, thermal polymerization inhibitor, and leveling agent may include those generally known in the art.
상기 첨가제의 함량은 각각 독립적으로 감광성 수지 조성물 총 중량을 기준으로 0.01 ~ 5 중량%일 수 있으나, 이에만 한정되는 것은 아니다.The amount of the additive may be independently 0.01 to 5% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.
본 명세서의 일 실시상태에 따른 감광성 수지 조성물은 에틸렌옥사이드와 같이 물을 흡수하는 관능기를 가지는 중합성 화합물을 포함함으로써, 미세 패턴을 생성하는 공정 중에 노출되는 물이 미세 패턴에 흡수되어 물에 의해 생기는 얼룩 등이 줄어드는 장점이 있다. The photosensitive resin composition according to the exemplary embodiment of the present specification includes a polymerizable compound having a functional group that absorbs water such as ethylene oxide, whereby water exposed during the process of generating a fine pattern is absorbed by the fine pattern and is generated by water. There is an advantage that stains are reduced.
미세 패턴을 생성하는 공정 중에 물에 의한 얼룩 등이 생성되면, 패턴 검사기에 의해서 불량으로 인식하게 되어 불량률이 상대적으로 높아지게 된다. 이에 따라, 관련 제품을 생성하는 수율 또한 낮아지게 된다. If water stains or the like are generated during the process of generating the fine pattern, the pattern inspector recognizes the defect as a defect and the defect rate is relatively high. As a result, the yield of producing the related products is also lowered.
본 명세서에 따른 감광성 수지 조성물을 이용하여 제조된 감광재를 제공한다. There is provided a photosensitive material produced using the photosensitive resin composition according to the present specification.
더 자세히는, 본 명세서의 감광성 수지 조성물을 기재 위에 적절한 방법으로 도포하여 박막 또는 패턴형태의 감광재를 형성한다.In more detail, the photosensitive resin composition of this specification is apply | coated on a base material by an appropriate method, and the photosensitive material of a thin film or a pattern form is formed.
상기 도포 방법으로는 특별히 제한되지는 않지만 스프레이 법, 롤 코팅법, 스핀 코팅법 등을 사용할 수 있으며, 일반적으로 스핀 코팅법을 널리 사용한다. 또한, 도포막을 형성한 후 경우에 따라서 감압 하에 잔류 용매를 일부 제거할 수 있다.Although it does not restrict | limit especially as said coating method, A spray method, a roll coating method, a spin coating method, etc. can be used, and spin coating method is generally used widely. In addition, after forming a coating film, some residual solvent can be removed in some cases under reduced pressure.
본 명세서에 따른 감광성 수지 조성물을 경화시키기 위한 광원으로는, 예컨대 파장이 250 내지 450㎚의 광을 발산하는 수은 증기 아크(arc), 탄소 아크, Xe 아크 등이 있으나 반드시 이에 국한되지는 않는다.As a light source for curing the photosensitive resin composition according to the present specification, for example, mercury vapor arc (arc), carbon arc, Xe arc, etc., which emit light having a wavelength of 250 to 450 nm, but is not limited thereto.
본 명세서에 따른 감광성 수지 조성물은 TFT LCD 컬러필터 제조용 안료분산형 감광재, TFT LCD 또는 유기 발광 다이오드의 블랙 매트릭스 형성용 감광재, 오버코트층 형성용 감광재, 컬럼 스페이서 감광재에 사용되는 것이 바람직하나, 광경화형 도료, 광경화성 잉크, 광경화성 접착제, 인쇄판, 인쇄배선반용 감광재, 기타 투명 감광재, PDP 제조 등에도 사용할 수 있으며, 그 용도에 제한을 특별히 두지는 않는다.The photosensitive resin composition according to the present disclosure is preferably used for pigment dispersion type photosensitive material for manufacturing TFT LCD color filter, photosensitive material for forming black matrix of TFT LCD or organic light emitting diode, photosensitive material for forming overcoat layer, column spacer photosensitive material, It can also be used in photocurable paints, photocurable inks, photocurable adhesives, printing plates, photosensitive materials for printed wiring boards, other transparent photosensitive materials, PDP production, and the like, and the use thereof is not particularly limited.
본 명세서는 상기 감광재를 포함하는 컬러필터를 제공한다.The present specification provides a color filter including the photosensitive material.
현재 디스플레이 시장에서 가장 큰 비중을 차지하고 있는 액정 표시 장치 및 LED BLU를 이용한 액정 표시 장치 등은 고품질의 컬러 특성을 구현하기 위해 컬러필터를 사용하고 있다. 컬러필터의 패턴은 포토리소그래피 공정을 이용하여 형성되는데, 통상적으로 포토리소그래피 공정은 유리 기판에 코팅, 진공건조, 전열처리, 노광, 현상 및 후열처리의 공정으로 구성된다. Currently, the liquid crystal display device and the liquid crystal display device using the LED BLU, which occupy the largest portion in the display market, use color filters to realize high quality color characteristics. The pattern of the color filter is formed using a photolithography process, which typically consists of a process of coating, vacuum drying, electrothermal treatment, exposure, development and post-heat treatment to a glass substrate.
포토리소그래피 공정은 전열처리 공정을 생략하여 유리 기판에 코팅, 진공건조, 노광, 현상 및 후열처리의 공정으로 구성될 수 있다. The photolithography process may be configured by coating, vacuum drying, exposing, developing, and post-heating the glass substrate by omitting the electrothermal treatment process.
한편, 포토리소그래피 공정에서는 패턴의 품질 특성을 확인하기 위해, 현상 및 세정 공정 후 후열처리를 진행하기 전에 패턴 검사기를 이용하여 패턴의 직진성 불량, 패턴 탈락 불량, 이물질 불량, 돌기 불량 및 각종의 얼룩에 의한 불량 등을 검출하게 된다. On the other hand, in the photolithography process, in order to check the quality characteristics of the pattern, before the post-heat treatment after the development and cleaning process, the pattern inspector is used for pattern straightness defects, pattern dropout defects, foreign matter defects, protrusion defects, and various stains. Due to the detection of defects.
본 명세서에 따른 감광성 수지 조성물은 포토리소그래피 공정에서 전열처리 공정을 생략하는 경우, 후열처리를 진행하기 전에 패턴 검사를 실시할 때, 물얼룩에 의한 불량 검출이 없거나, 적은 장점이 있다. In the photosensitive resin composition according to the present disclosure, when the electrothermal treatment step is omitted in the photolithography process, when the pattern inspection is performed before the post-heat treatment is performed, there is no defect detection due to water staining or there is little advantage.
이는 상기 감광성 수지 조성물 중 중합성 화합물로서 에틸옥사이드의 구조를 갖는 아크릴게 모노머를 포함하고 있기 때문에, 현상 공정 및 세정 공정 중에 사용되는 물이 감광성 수지 조성물에 의해 형성된 패턴에 흡수되어 물얼룩의 발생을 감소시킬 수 있다. Since the acryl crab monomer having a structure of ethyl oxide is included as the polymerizable compound in the photosensitive resin composition, water used during the developing process and the cleaning process is absorbed by the pattern formed by the photosensitive resin composition to prevent water staining. Can be reduced.
상기 감광재는 컬러필터 중 적색, 녹색, 청색의 3색 컬러패턴, 오버코트, 블랙 매트릭스, 컬럼스페이서 및 인쇄배선반 중 어느 하나 이상에 포함될 수 있다. The photosensitive material may be included in any one or more of three color patterns of red, green, and blue color, overcoat, black matrix, column spacer, and printed wiring board.
본 명세서는 상기 컬러필터를 포함하는 액정 표시 장치를 제공한다.The present specification provides a liquid crystal display including the color filter.
이하, 본 명세서의 이해를 돕기 위하여 본 명세서에 따른 일 실시예를 제시한다. 그러나, 하기의 실시예는 본 명세서를 예시하기 위한 것이며, 이에 의하여 본 명세서의 범위가 한정되는 것은 아니다.Hereinafter, an embodiment according to the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are intended to illustrate the present specification, whereby the scope of the present specification is not limited.
<실시예><Examples>
<합성예><Synthesis Example>
바인더 수지의 합성Synthesis of Binder Resin
(1) 1단계: 기본 아크릴 바인더 수지 중합 단계(1) step 1: basic acrylic binder resin polymerization step
벤질 메타아크릴레이트, N-페닐 말레이미드 및 스티렌의 몰비가 1:2:2가 되도록 각각의 모노머인 벤질 메타아크릴레이트 10.3 g, N-페닐 말레이미드 23.8 g, 스티렌 14.0 g을 혼합하고, 여기에 글리시딜 메타크릴레이트 71.9 g, 사슬 이동제인 1-도데칸티올 4 g, 용매인 프로필렌글리콜 모노메틸에테르 아세테이트 480 g을 기계적 교반기로 질소 분위기 하에서 30분간 혼합하였다. 질소 분위기 하에서 반응기의 온도를 60 ℃로 높이고 혼합물의 온도가 60 ℃가 되었을 때 열중합 개시제인 V-65를 5 g 넣고 15 시간 동안 교반하였다. (Mw 6,000, Av 0)10.3 g of each monomer, benzyl methacrylate, 23.8 g of N-phenyl maleimide, and 14.0 g of styrene are mixed so that the molar ratio of benzyl methacrylate, N-phenyl maleimide and styrene is 1: 2: 2, 71.9 g of glycidyl methacrylate, 4 g of 1-dodecanethiol as a chain transfer agent, and 480 g of propylene glycol monomethyl ether acetate as a solvent were mixed with a mechanical stirrer under a nitrogen atmosphere for 30 minutes. When the temperature of the reactor was increased to 60 ° C. under a nitrogen atmosphere and the mixture temperature reached 60 ° C., 5 g of a thermal polymerization initiator V-65 was added thereto and stirred for 15 hours. (Mw 6,000, Av 0)
(2) 2단계: 불포화기 도입(2) Step 2: Introduction of unsaturated group
상기 1단계 고분자를 중합한 반응기의 온도를 80 ℃로 높이고, 테트라에틸암모늄 브로마이드 0.5 g과 열중합 금지제인 4-메톡시 페놀 0.1 g을 넣고 공기 분위기 하에서 3 시간 동안 교반한 후, 메타아크릴산 26.1 g을 넣고 100℃로 반응기 온도를 높이고 24시간 동안 교반하였다. (Mw 8,000, Av 5)The reactor was polymerized to a temperature of 80 ° C., 0.5 g of tetraethylammonium bromide and 0.1 g of 4-methoxy phenol, a thermal polymerization inhibitor, were stirred under an air atmosphere for 3 hours, followed by 26.1 g of methacrylic acid. Put the reactor temperature to 100 ℃ and stirred for 24 hours. (Mw 8,000, Av 5)
(3) 3단계: 산기 부여(3) Stage 3: Give birth
상기 2단계에서 만들어진 고분자 용액의 온도를 70℃로 낮추고, 30.8 g의 테트라하이드로 프탈산 무수물을 넣고 80℃에서 24시간 추가로 교반하여 원하는 바인더 수지를 합성하였다. (Mw 10,100, Av 75)The temperature of the polymer solution prepared in step 2 was lowered to 70 ° C., and 30.8 g of tetrahydro phthalic anhydride was added thereto, followed by further stirring at 80 ° C. for 24 hours to synthesize a desired binder resin. (Mw 10,100, Av 75)
<실시예 1>≪ Example 1 >
안료로서 5.04 중량부인 피그먼트 Green 58, 0.15 중량부인 피그먼트 yellow 150, 상기 합성예에서 제조된 바인더 수지 0.30 중량부, 중합성 화합물로 DPEA-12 0.55 중량부, 광개시제로 I-369 0.12 중량부, 밀착촉진제로 3-메타아크릴옥시프로필트리메톡시실란 0.023 중량부, 계면활성제로 F-475 (DaiNippon Ink & Chemicals) 0.060 중량부, 용매로 프로필렌글리콜 모노메틸에테르 아세테이트 3.80 중량부를 혼합하였으며, 상기 혼합물을 5시간 동안 교반하여 감광성 수지 조성물을 제조하였다.Pigment Green 58, which is 5.04 parts by weight, Pigment yellow 150, which is 0.15 parts by weight, 0.30 part by weight of the binder resin prepared in the synthesis example, 0.55 part by weight of DPEA-12 as the polymerizable compound, 0.12 part by weight of I-369 as the photoinitiator, 0.023 part by weight of 3-methacryloxypropyltrimethoxysilane as an adhesion promoter, 0.060 part by weight of F-475 (DaiNippon Ink & Chemicals) as a surfactant, and 3.80 parts by weight of propylene glycol monomethyl ether acetate as a solvent were mixed. Stirring for 5 hours to prepare a photosensitive resin composition.
<실시예 2><Example 2>
상기 실시예 1에서 중합성 화합물로 DPEA-12 대신 RP1040을 사용한 것 이외에는 실시예 1과 동일하게 하여 감광성 수지 조성물을 제조하였다.A photosensitive resin composition was prepared in the same manner as in Example 1, except that RP1040 was used instead of DPEA-12 as the polymerizable compound in Example 1.
<비교예 1>≪ Comparative Example 1 &
상기 실시예 1에서 중합성 화합물로 DPEA-12 대신 디펜타에스리톨 헥사(메트)아크릴레이트(DPHA)를 사용한 것 이외에는 실시예 1과 동일하게 하여 감광성 수지 조성물을 제조하였다.A photosensitive resin composition was prepared in the same manner as in Example 1 except that dipentaerythritol hexa (meth) acrylate (DPHA) was used instead of DPEA-12 as the polymerizable compound in Example 1.
<실험예 1><Experimental Example 1>
물 얼룩의 평가 방법Evaluation method of water stain
상기 실시예 및 비교예의 감광성 수지 조성물을 유리 위에 스핀코팅하여 상온에서 30분간 방치하고, 40mJ/cm2로 포토마스크를 사용하여 노광을 실시한 뒤 Na2CO3 현상액에서 26 ℃ 온도로 현상한 후 26 ℃ 증류수를 사용하여 현상기에서 스핀 린싱(spin linsing)을 40초간 실시한다. 이후 스핀 코터기에서 1000rpm으로 20초간 블로잉(blowing)을 실시한다. 상기의 감광성 수지 조성물이 도포된 기판을 광학 현미경으로 관찰하여 패턴의 전체적인 톤과 물얼룩의 정도 및 개수를 육안으로 관찰하였다. The photosensitive resin compositions of Examples and Comparative Examples were spin-coated on glass, left at room temperature for 30 minutes, exposed to light using a photomask at 40 mJ / cm 2, and then developed at 26 ° C. in a Na 2 CO 3 developer, followed by 26 Spin linsing is carried out in a developer using distilled water for 40 seconds. Thereafter, blowing is performed for 20 seconds at 1000 rpm in a spin coater. The board | substrate with which the said photosensitive resin composition was apply | coated was observed with the optical microscope, and the general tone of the pattern and the grade and number of water stains were visually observed.
상기 표 1의 결과에서 확인할 수 있는 바와 같이, 본 발명은 에틸렌옥사이드 구조를 가진 중합성 화합물의 함량에 따라 물얼룩 개수(실시예 1 및 실시예 2)가 비교예 1과 비교하여 크게 감소하는 효과를 관찰하였으며, 전체적인 패턴의 톤도 밝아지고 균일하여 물얼룩이 개선되는 것을 관찰하였다.
As can be seen from the results of Table 1, the present invention has the effect of greatly reducing the number of water stains (Example 1 and Example 2) compared to Comparative Example 1 according to the content of the polymerizable compound having an ethylene oxide structure It was observed that the tone of the overall pattern was also brightened and uniform so that the water stain was improved.
Claims (13)
[화학식 1]
[화학식 2]
[화학식 3]
[화학식 4]
상기 화학식 1 및 4에서,
R1 내지 R10는 각각 독립적으로 하기 화학식 5 또는 하기 화학식 8으로 표시되고,
R11 내지 R13는 하기 화학식 8로 표시되며,
R14 내지 R17은 하기 화학식 6로 표시되고,
[화학식 5]
[화학식 6]
상기 화학식 5 내지 6에서,
R18 및 R19는 각각 독립적으로 수소 또는 C1~C10의 알킬기이며,
R20은 하기 화학식 7로 표시되고,
[화학식 7]
상기 화학식 7에서,
R21은 수소 또는 C1~C10의 알킬기이며,
R22는 (CH2)bOH 또는 하기 화학식 8로 표시되고,
[화학식 8]
상기 화학식 8에서,
R23은 (CH2)nO 또는 CO(CH2)lO 이며,
R24는 수소 또는 C1~C10의 알킬기이고,
n 및 l은 각각 독립적으로 2 내지 10인 정수이고,
m은 1 내지 2의 정수이며,
o 및 p는 1 내지 3의 정수이고,
a 및 b는 1 내지 10의 정수이다. A photosensitive resin composition comprising a binder resin, a polymerizable compound, a photoinitiator, an adhesion promoter, and a solvent, any one or more of compounds represented by any one of the following Chemical Formulas 1 to 4:
[Chemical Formula 1]
(2)
(3)
[Chemical Formula 4]
In Chemical Formulas 1 and 4,
R1 to R10 are each independently represented by the following formula (5) or (8),
R11 to R13 are represented by the following formula (8),
R14 to R17 are represented by the following formula (6),
[Chemical Formula 5]
[Chemical Formula 6]
In Chemical Formulas 5 to 6,
R18 and R19 are each independently hydrogen or an alkyl group of C 1 to C 10 ,
R20 is represented by the following formula (7),
(7)
In Formula 7,
R21 is hydrogen or an alkyl group of C 1 to C 10 ,
R22 is represented by (CH 2 ) b OH or the following formula (8),
[Chemical Formula 8]
In Formula 8,
R 23 is (CH 2 ) n O or CO (CH 2 ) l O,
R24 is hydrogen or an alkyl group of C 1 to C 10 ,
n and l are each independently an integer of 2 to 10,
m is an integer of 1 to 2,
o and p are integers from 1 to 3,
a and b are integers from 1 to 10.
[화학식 9]
The photosensitive resin composition of claim 1, wherein Formula 3 is represented by Formula 9 below:
[Chemical Formula 9]
[화학식 10]
The photosensitive resin composition of claim 1, wherein Formula 4 is represented by Formula 10:
[Formula 10]
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KR20180094352A (en) * | 2017-02-15 | 2018-08-23 | 동우 화인켐 주식회사 | Colored photosensitive resin composition, color filter, solid state image sensor and photographing apparatus comprising the same |
CN112074551A (en) * | 2019-03-27 | 2020-12-11 | 株式会社Lg化学 | Alkali-soluble, photocurable and thermally curable copolymer and photosensitive resin composition, photosensitive resin film and color filter using the same |
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KR20180094352A (en) * | 2017-02-15 | 2018-08-23 | 동우 화인켐 주식회사 | Colored photosensitive resin composition, color filter, solid state image sensor and photographing apparatus comprising the same |
CN112074551A (en) * | 2019-03-27 | 2020-12-11 | 株式会社Lg化学 | Alkali-soluble, photocurable and thermally curable copolymer and photosensitive resin composition, photosensitive resin film and color filter using the same |
US12006386B2 (en) | 2019-03-27 | 2024-06-11 | Lg Chem, Ltd. | Alkali soluble, photo-curable and thermo-curable copolymer, and photosensitive resin composition, photosensitive resin film and color filter using the same |
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