KR20130090041A - Apparatus for transferring chip and method for transferring chip using the same - Google Patents

Abstract

A chip transfer device is disclosed, wherein the chip transfer device comprises: a first linear motor having a first mover; A second linear motor disposed adjacent to the movement path of the first mover; A drive switching unit mounted to the first mover so as to be slidable; And a link mechanism hinged to each of the drive switching unit and the second mover provided in the second linear motor.

Description

Chip transfer apparatus and chip transfer method using the same {APPARATUS FOR TRANSFERRING CHIP AND METHOD FOR TRANSFERRING CHIP USING THE SAME}

The present invention relates to an apparatus for transferring a chip, such as an LED chip or a semiconductor chip, and a chip transfer method using the same.

The chip transfer device refers to a device for transferring a chip such as an LED chip or a semiconductor chip at high speed. For example, it is installed in a die bonder that continuously attaches the LED chip to the die of the lead frame, and picks up (clamps) the LED chip through the bond head module, so that the left and right directions (Y-axis direction) and the vertical direction ( Z-axis direction) and the like may correspond to such a chip transfer device.

Looking at a conventional chip transfer device for the transfer of the LED chip, first there is a chip transfer device of the rotary arm (arm) method. This is a way to transfer the chip by swinging the arm (swing). However, this method has a problem in that the larger the wafer size, the longer the required arm length becomes, which makes it difficult to control the high speed and the vibration of the tip becomes severe when the arm changes direction.

In addition, other conventional chip transfer apparatuses for transferring LED chips include a ball screw and a cam system. The left and right directions (Y-axis direction) is driven through the ball screw, and the up-down direction (Z-axis direction) is driven through the cam or ball screw to transfer the chip. However, in the case of the ball screw, there is a problem in that a lot of noise and vibration occurs due to its characteristics, and the accuracy is reduced due to thermal expansion during operation at high speed, there was a difficulty in high speed control.

In particular, when the ball screw method is applied to both the drive shafts in the left and right direction and the up and down direction, a structure is formed in which the other drive shafts are stacked on one drive shaft. There is a problem that the axis located in the inevitably be provided on a limited scale, the high speed driving and control of the chip transfer device is difficult. In addition, even when driving in the vertical direction through the cam, there is a limitation that the driving in the vertical direction can only be made in a predetermined operation due to the characteristics of the cam.

On the other hand, even in the case of a chip transfer device using a linear motor in order to implement the left and right direction and the vertical direction drive together, the other drive shaft is stacked on one drive shaft (stack) structure, so as in the above-described ball screw method There is a problem that the load of the axis located in the large and the axis located in the upper portion is provided with a limited scale, the high speed driving and control of the chip transfer device becomes difficult.

Recently, development of a linear motor capable of two-way driving has been made. However, such a two-dimensional linear motor has a problem of poor scalability when a long distance drive with a longer stroke is required. Because it is configured to control with linear motor of, there was a limit that a larger capacity motor is required to increase speed and precision during high speed driving and control.

The present application is to solve the above-mentioned problems of the prior art, it is possible to transfer the chip at a high speed by not loading each other between the drive shaft, but does not require a high capacity motor compared to the conventional, the structure is simple and manufacturability and expandability An object of the present invention is to provide a chip transfer device and a chip transfer method using the same.

As a technical means for achieving the above technical problem, the chip transfer device according to the first aspect of the present application, the chip transfer device, comprising: a first linear motor having a first mover; A second linear motor disposed adjacent to the movement path of the first mover; A drive switching unit mounted to the first mover so as to be slidable; And a link mechanism hinged to each of the drive switching unit and the second mover provided in the second linear motor.

According to one embodiment of the present application, the chip conveying apparatus according to the first aspect of the present application further comprises a rail portion provided with a rail parallel to the movement path of the first mover, the first mover to be slidably movable on the rail It includes a slide unit is fastened, the drive switching unit may be mounted to the slide unit to be slidable.

On the other hand, as a technical means for achieving the above technical problem, the chip transfer method according to the second aspect of the present application is a chip transfer method using a chip transfer apparatus according to the first aspect of the present application, wherein the second mover Preparing to pick up the chip with the bond head module spaced apart from the chip by being located behind the first mover; A step in which the bond head module picks up the chip by sliding the drive switching unit toward the chip by the link mechanism while the second mover moves forward; And completing the pickup of the chip by sliding the second mover in a direction opposite to the sliding movement direction in the step of the pickup by the link mechanism while the second mover moves forward. And transferring the picked-up chip while the first and second movers move forward.

According to the above-described problem solving means of the present application, since the structure of the other driving device or additional devices are driven separately without cumulative load on each linear motor is implemented so as not to load each other between the axes, the two-axis drive is made Drivenability can be greatly improved, resulting in more stable and precise high speed drive and control.

In addition, according to the above-described problem solving means of the present application, since the two linear motors are not complicatedly coupled to each other and are simply connected to each other through a link mechanism in a state of being disposed adjacent to each other, expansion can be easily performed. Creation can be secured and manufacturing costs can be reduced.

In addition, according to the above-described problem solving means of the present application, the drive switching unit is provided in a manner that is mounted on the slide unit fastened to the rail portion rather than stacked on the first mover, Since the load due to the mounting is not directly applied to the first mover, the driveability of the first linear motor can be greatly improved.

1 is a schematic front view of a chip transfer apparatus according to an embodiment of the present disclosure.
FIG. 2 is a schematic cross-sectional view taken along the line II-II of FIG. 1.
3 is a conceptual diagram illustrating the driving of a chip transfer device according to an exemplary embodiment of the present disclosure.
4 to 6 is a conceptual diagram showing a chip transfer method step by step using a chip transfer device according to an embodiment of the present application.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it includes not only a case directly connected but also a case where it is physically or electrically connected with another part in between.

Throughout this specification, when a member is located "on" another member, this includes not only when one member is in contact with another member but also when another member exists between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

Throughout this specification, the term "combination thereof" included in the expression of the machine form means one or more combinations or combinations selected from the group consisting of the constituents described in the expression of the machine form, And the like.

In addition, the description of constitution and technical matters which are obvious to a person having ordinary skill in the art to which the present invention belongs will be simplified or omitted.

The chip conveying apparatus (hereinafter referred to as 'the present chip conveying apparatus') according to an exemplary embodiment of the present application is a chip conveying apparatus which connects two linear motors to each other through a link to change the direction of driving so that two-axis driving is established.

More specifically, the present chip conveying apparatus connects the movers of two linear motors through a link mechanism, and moves the movements of the two movers in the driving direction of the unit mounted on one of the two movers through the relative position difference generated between the two movers. It is a chip transfer device that realizes two-way driving that can be controlled precisely and at high speed by switching in a direction different from the path.

Here, a linear motor is a device for converting thrust generated between a magnet and a magnetic field of a winding in which current flows into linear motion, and does not require an additional device for converting rotational motion into linear motion. Low and precise control is possible. That is, by applying the linear motor to the present chip transfer device, high speed, non-contact, direct drive, quietness, simplicity of structure, ease of maintenance and the like can be secured.

In general, in a linear motor, the mover may be provided with a coil assembly and the stator may be provided with a magnet assembly. The current flows through the coil assembly and the magnet assembly forms a magnetic field. When the current and the magnetic field cross each other, a force of Lorentz occurs, so that linear driving of the mover provided in the linear motor may be performed. Since technical matters related to the linear motor will be apparent to those skilled in the art, more detailed description thereof will be omitted.

The chip conveying apparatus includes a first linear motor 1.

1 and 2, the first linear motor 1 has a first mover 11. In addition, the first linear motor 1 may include a first stator 12 that forms a movement path of the first mover 11. As described above, the first mover 11 may be slidably moved along a movement path formed in the first stator 12 according to a linear driving force generated in association with the first stator 12.

In this case, the linear driving force does not necessarily mean a linear driving force, but may mean a thrust in one direction, and the driving force for movement in a curved path may also be included therein. Thus, the moving path of the movers 11, 21 may be a path in which one or more of a straight path and a curved path are combined. However, when a curved section is included in the moving path of the movers 11 and 21, when the movers 11 and 21 cross the curved section, a large radius of curvature such that high speed control or precision does not occur It is desirable to ensure that it can be secured.

1 and 2, the chip transfer device may include a rail unit 5 on which a rail 51 is formed in parallel with a moving path of the first mover 11.

1 and 2, the first mover 11 may include a slide unit 111 that is slidably fastened to the guide path, for example, the rail 51. That is, since the slide unit 111 is included in the first mover 11 and moves in cooperation with the first mover 11, the rail 51 to which the slide unit 111 is slidably movable is fastened. Again, the normal driving may be performed only when the first mover 11 is formed to be parallel to the movement path of the first mover 11.

In this way, the slide unit 111 is fastened to the rail 51 in a state in which the slide unit 111 is interlocked with the first mover 11, and the drive change unit 3 is mounted on the slide unit 111 to be described later. Since the load due to the mounting of (3) is mainly applied to the rail 51 rather than directly to the first mover 11, the driveability of the first linear motor 1 can be greatly improved, thereby making it more stable and accurate. High speed drive and control can be achieved.

For reference, the rail 51 may be a configuration of a concept including all of the path members of various forms in which the slide unit 111 may be fastened to be slidably movable. For example, the rail 51 may mean a configuration formed in a protruding shape, but may also mean a configuration formed in a recessed groove shape. In addition, the slide unit 111 may be provided with a fastening portion which is slidably engaged with the rail 51 of the protruding or recessed groove shape.

In addition, the driving switching unit 3 may be mounted to the slide unit 111 provided in the first mover 11 so as to be slidable. In this way, the drive switching unit 3 is slidably mounted to the first mover 11, thereby inducing the organicity of the first linear motor 1, the second linear motor 2, and the link mechanism 4. By using the connection relationship, a new drive in a direction different from the driving directions of the first linear motor 1 and the second linear motor 2 can be made. This will be described later in more detail with reference to the driving of the chip transfer device.

In addition, the chip transfer device includes a second linear motor 2.

1 and 2, the second linear motor 2 has a second mover 21. In addition, the second linear motor 2 may include a second stator 22 forming a movement path of the second mover 21. Like the first linear motor 2, the second mover 21 may be slidably moved along the movement path formed in the second stator 22 according to the linear driving force generated in association with the second stator 22. . In this case, the linear driving force does not necessarily mean only the linear driving force as described above.

1 and 2, this second linear motor 2 is disposed adjacent to the movement path of the first mover 11. In exemplary embodiments, the movement path of the first mover 11 and the movement path of the second mover 21 may be formed in parallel with each other. However, if necessary, the movement path of the first mover 11 and the movement path of the second mover 21 may not be parallel to each other. For example, depending on the location where the chip conveying device is disposed, both moving paths may be configured to move closer or closer to each other in order to smoothly drive the chip pick-up (clamping). .

Also in a similar context, the first linear motor 1 and the second linear motor 2 may be provided so that the movement paths of the first mover 11 and the second mover 21 are formed in a curved path as necessary. Can be. For example, the first linear motor 1 and the second linear motor 2 may be provided in the form of a curved linear motor, thereby securing more various application motions in driving the chip transfer device. Can be.

And the chip transfer device includes a drive switching unit (3).

1 and 2, the drive switching unit 3 is mounted to the first mover 11 so as to be slidable. More specifically, as shown in FIG. 1 and FIG. 2, the drive switching unit 3 may be slidably mounted to the slide unit 111 provided in the first mover 11 as described above. For example, a rail 111a may be provided on one surface of the slide unit 111, and the driving switching unit 3 may be mounted in such a manner as to be slidably engaged with the rail 111a.

However, in the main purpose of the present application, the first mover 11 through organic interlocking operation of the drive switching unit 3, the first linear motor 1, the second linear motor 2, and the link mechanism 4. There is a desire to secure a driving motion in a direction different from the driving of the moving path of the. Accordingly, the drive switching unit 3 is preferably mounted to the first mover 11 so as to be slidable in a direction different from the movement path of the first mover 11.

For example, referring to FIGS. 1 and 2, the direction different from the moving path of the first mover 11 may mean a direction orthogonal to the moving path of the first mover 11.

In this way, the sliding movement of the drive switching unit 3 with respect to the direction orthogonal to the movement path of the first mover 11 is made, so that two, such as the left-right direction (Y-axis direction) and the up-down direction (Z-axis direction) The driving of the present chip conveying device can be made in the axial direction. However, since the driving of the chip transfer device is not necessarily implemented with respect to two clearly orthogonal axes as described above, the angle formed by the two axes may vary depending on necessity or circumstances.

In addition, the chip transfer device includes a link mechanism 4.

1 and 2, the link mechanism 4 is hingedly connected to the second mover 21 provided in the drive switching unit 3 and the second linear motor 2, respectively. That is, referring to FIG. 3, this connection relation of the link mechanism 4 is combined with the first linear motor 1 and the second linear motor 2, whereby the first mover 11 and the second mover 21. By changing the angle (tilt) of the link mechanism (4) according to the distance difference between the) it is possible to switch the driving direction can be implemented two-axis drive.

The link mechanism 4 is provided with a length such that the drive switching unit 3 can be slidably moved relative to the first mover 11 according to the positional relationship between the first mover 11 and the second mover 21. Can be.

For example, referring to FIG. 3, as the first mover 11 and the second mover 21 have a distant positional relationship (see FIG. 3A), the link mechanism 4 is hinged. Since the drive change unit 3 is pulled toward the second mover 21, the drive change unit 3 is positioned on the second mover 21 side (second mover 21) on the first mover 11. ), But is not the direction that exactly faces, generally sliding to the second mover (21) side.

On the contrary, as the first mover 11 and the second mover 21 have a positional relationship closer to each other (see FIG. 3B), the link mechanism 4 is hinged to the second mover. Since the drive switching unit 3 is pushed out of the 21, the drive switching unit 3 is placed on the opposite side of the second mover 21 on the first mover 11 (for the second mover 21). Not exactly in the opposite direction, but generally on the opposite side of the second mover 21).

And in order for the drive switching unit 3 to ensure a longer sliding movement section on the first mover 11, the link mechanism 4 needs to be provided longer. That is, the length of the link mechanism 4 may be set according to the necessity of securing the sliding movement section with respect to the first mover 11 of the drive switching unit 3. In other words, various application motions may be possible depending on the shape, length, function, and the like of the link mechanism 4. For reference, the length of the link mechanism 4 may mean a length between a portion hinged to the drive switching unit 3 and a portion hinged to the second mover 21.

In addition, the link mechanism 4 may include a plurality of link members connected to each other. Although the link mechanism 4 is provided with one link member in one embodiment of the present application shown in the drawings, the link mechanism 4 is different from the one embodiment of the present application through a connection combination of a plurality of link members. Motion can be implemented.

The chip transfer device may include a bond head module 6 mounted on the drive switching unit 3 and picking up chips.

For example, the bond head module 6 may be a die or bond die equipment for an LED or a semiconductor, and then, after picking up a chip such as an LED chip or a semiconductor chip, a wafer or a lead frame may be used. It may be a module used to place a portion on which a epoxy is dotting or stamping on a die such as a frame. At this time, the chip pick-up (clamping) of the bond head module 6 may be made through adsorption. Since the technical matters related to the bond head module 6 will be apparent to those skilled in the art, detailed description thereof will be omitted.

Accordingly, the chip transfer device may be applied to a die bonding process of picking up (clamping) a chip through the bond head module 6 and then transferring and placing the chip.

In addition, the chip transfer apparatus may include a control unit for controlling the driving of each component, and may include a wiring unit and a power supply unit to provide electrical connections required for the respective components.

Hereinafter, the driving of the present chip transfer apparatus will be mainly described with reference to FIG. 3.

As shown in FIG. 3B, the control is performed such that the first mover 11 and the second mover 21 come closer to each other so that the drive switching unit 3 moves away from the second mover 21 side. It is slidably moved on the slide unit 111 of the first mover 11. Through this drive motion, the bond head module 6 mounted on the drive switching unit 3 sucks the chip.

Next, the control is performed such that the second mover 21 moves away from the first mover 11 as shown in FIG. 3 (a) while the bond head module 6 picks up (clamps) the chip. The drive switching unit 3 is slidably moved on the slide unit 111 of the first mover 11 in a direction closer to the second mover 21 side. Through this drive motion, the bond head module 6 mounted on the drive switching unit 3 picks up (clamps) and lifts up the chip.

Next, the first mover 11 and the second mover 21 are transferred onto a lead frame doped with epoxy along the respective travel paths. At this time, when the relative positional relationship between the first mover 11 and the second mover 21 is kept constant, since the sliding movement of the drive switching unit 3 does not occur, through the bond head module 6 The height at which the chip is raised can be kept constant.

However, the relative positional relationship between the first mover 11 and the second mover 21 does not necessarily have to be kept constant during transfer after picking up (clamping) the chip, and the chip may finally be placed (mounted). In consideration of the position, it is preferable to control the first mover 11 and the second mover 21 as efficiently as possible. For example, for efficient pick up (clamping), transfer, and placement (mounting) of the chip, the transfer paths of the first mover 11 and the second mover 21 may be at least one of a straight path and a curved path. It can be formed through a combination, and the link mechanism 4 can also be provided through a connection combination of a plurality of link members as necessary.

After the chip is transferred onto the lead frame doped with epoxy in this way, the control is made such that the first mover 11 and the second mover 21 come closer together as shown in FIG. , The drive switching unit 3 is slidably moved on the slide unit 111 of the first mover 11 in a direction away from the second mover 21 side. This drive motion causes the bond head module 6 mounted on the drive switching unit 3 to place (mount) the chip being picked up (clamped) on the epoxy.

As described above, two-axis driving for die bonding of the chip may be performed through the present chip transfer device.

According to the present chip transfer device, the drive switching unit 3 is not stacked on the first mover 11 but on the slide unit 111 that is slidably fastened to the rail portion 5. By being provided in such a manner that the load due to the mounting of the drive switching unit 3 is not directly applied to the first mover 11, the driveability of the first linear motor 1 can be greatly improved.

That is, according to the present chip conveying apparatus, other driving devices or additional devices are driven on the first linear motor 1 or the second linear motor 2 without being stacked, and are individually driven to load each other during the driving. Since the structure is not implemented, the driveability can be greatly improved while the two-axis driving is made, and more stable and precise high speed driving and control can be achieved.

In addition, since the two linear motors 1 and 2 are not intricately coupled to each other and simply interlock with each other via the link mechanism 4 in a state in which they are arranged adjacent to each other, the driving directions of the movable elements 11 and 21 are Expansion in the left-right direction (Y-axis direction) can be easily made. In other words, the stroke of the present chip transfer device can be increased in proportion to the length of the linear motors 1, 2.

In addition, the driving direction of the drive switching unit 3 (eg, the up and down direction (Z-axis direction)) is adjusted by adjusting the interval at which the two linear motors 1 and 2 are spaced apart from each other, and adjusting the length of the link mechanism 4. Extensions can also be made easily.

In addition, as described above, since the organic interlocking relationship is formed only by the uncomplicated concise configuration, it is easy to manufacture, and since the conventional linear motor can be used as it is or expanded, manufacturing cost can be reduced and economical efficiency can be secured. Can be.

In addition, the type of the chip to which the present chip conveying device is applied is not limited, but the present chip conveying device has the advantage of more stable and precise high-speed driving and control as described above. In the transfer of the chip can be exhibited a significantly different effect compared to the conventional chip transfer device.

Meanwhile, hereinafter, the chip transfer method using the chip transfer device according to the exemplary embodiment of the present application (hereinafter referred to as 'the present chip transfer method') will be described. However, since the chip transfer method is a chip transfer method using a chip transfer device according to an embodiment of the present invention, the same reference numerals are used for the same or similar components as described above, and a duplicate description will be briefly or omitted. Let's do it.

4 is a conceptual diagram illustrating a step of picking up a chip in the present chip transfer method. FIG. 5 is a conceptual diagram illustrating a first embodiment of a process of transferring and placing a picked-up chip in the present chip transfer method. 6 is a conceptual diagram illustrating a second embodiment of a process of transferring and placing a picked-up chip in the present chip transfer method.

For reference, the process of picking up the chip shown in FIG. 4 may be commonly implemented in the first and second embodiments, but the process of transferring and placing the chip shown in FIG. 5 may be implemented in the first embodiment. In this case, the process of transferring and placing the chips shown in FIG. 6 may be implemented in the second embodiment. In addition, although the chip is not specifically illustrated in FIGS. 4 to 6, it may be understood that the chip is disposed at a horizontal dotted line portion that is in contact with the bond head module 6.

First, a process of picking up chips commonly implemented in the first and second embodiments will be described with reference to FIGS. 4, 5 (a), and 6 (a).

According to the present chip transfer method, the second mover 21 is positioned behind the first mover 11 so that the bond head module 6 is prepared to pick up the chip with the chip spaced apart from the chip. Include.

Here, the fact that the second mover 21 is located behind the first mover 11 means that the pick-up of the chip is made in the movement paths of the first mover 11 and the second mover, respectively. When defined as the rear and defined as the front side where the placement of the chip is made, it means that the second mover 21 is located relatively rearward on the movement path than the first mover 11.

By way of example, referring to FIG. 4A, the second mover 21 is located behind the first mover 11. By being located at the relatively left side, the link mechanism 4 may mean a state in which the drive switching unit 3 is lifted by pulling the drive switching unit 3 upward.

In the present chip transfer method, the bond head module 6 picks up the chip by sliding the drive switching unit 3 toward the chip by the link mechanism 4 while the second mover 21 moves forward. Steps.

For example, referring to FIGS. 4A and 4B, the second mover 21 is moved to the right side (see FIG. 4B) rather than the state of FIG. 4A. The mechanism 4 pushes the drive switching unit 3 downward along the rail 111a, so that the bond head module 6 mounted on the drive switching unit 3 picks up the chip.

In the present chip transfer method, the second mover 21 is moved forward, so that the drive switching unit 3 slides in the opposite direction to the sliding movement direction in the step of picking up the chip by the link mechanism 4. And picking up the chip is completed.

For example, referring to (b) and (c) of FIG. 4, the second mover 21 is moved to the right side more than the state of FIG. 4B (see FIG. 4C). The mechanism 4 pulls the drive switching unit 3 upward along the rail 111a, thereby completing chip pick-up of the bond head module 6 mounted on the drive switching unit 3.

In addition, the chip transfer method may include transferring the picked-up chip while the first mover 11 and the second mover 21 move forward.

For example, the chip may be transferred from the state of FIG. 4C to the state of FIG. 5A, or from the state of FIG. 4C to the state of FIG. 6A. The transfer can take place.

4 to 6, in the chip transfer method, the first linear motor 1 has a chip in which the moving path of the first mover 11 is smaller than the moving path of the second mover 21. It may be arranged adjacent to the second linear motor 2 so as to be close to the picked up position.

Next, a process of placing a chip that can be implemented in the first embodiment will be described with reference to FIG. 5.

The chip transfer method according to the first exemplary embodiment of the present application may include preparing a placing of the picked-up chip by the second mover 21 stopping moving forward.

For example, referring to FIGS. 5A and 5B, the second mover 21 is no longer moved to the right at the position shown in FIG. 5A and remains stopped. That is, the step of preparing the chip to be placed in accordance with the movement of the second mover 21 to the right side of the first mover 11 as described above may no longer be moved.

In addition, in the chip transfer method according to the first embodiment of the present application, as the first mover 11 is moved forward, the bond head is slidably moved toward the set position by the link mechanism 4 by the link mechanism 4. The module 6 may comprise placing the chip in a set position.

For example, referring to FIGS. 5A and 5B, the first mover 11 is in the state of FIG. 5A while the second mover 21 is stopped at a predetermined position. The bond head module mounted on the drive switching unit 3 is moved to the right side (see FIG. 5 (b)), and thus the link mechanism 4 slides the drive switching unit 3 downward. 6) can place the picked-up chip.

For reference, the set position may mean a position where the chip is to be placed (mounted), for example, a position where the LED chip is to be mounted on the lead frame.

And the chip transfer method according to the first embodiment of the present application by sliding the drive switching unit 3 by the link mechanism 4 to move away from the placed chip while the second mover 21 is moved to the rear again It may include the step of completing the placement of the chip.

For example, referring to FIGS. 5B and 5C, when the bond head module 6 places the chip as shown in FIG. 5B, the second mover 21 is again used. 5 is moved to the left (Fig. 5 (c)), whereby the link mechanism 4 slides the drive switching unit 3 upward, thereby completing the placement of the chip.

Next, a process of placing a chip that can be implemented in the second embodiment will be described with reference to FIG. 6.

Chip transfer method according to the second embodiment of the present application may include the step of preparing the placement of the pick-up chip picked up by the first mover (11) and the second mover (21) moving forward.

For example, referring to FIGS. 6A and 6B, the first mover 11 is no longer moved to the right at the position shown in FIG. 6A and remains stopped. That is, the step in which the chip is placed in accordance with the movement of the first mover 11 to the left side of the second mover 21 as described above may be referred to as a step.

In addition, in the chip transfer method according to the second embodiment of the present application, as the second mover 21 is moved backward, the link head 4 is slidably moved toward the set position by the drive mechanism 3 by the link mechanism 4. The module 6 may comprise placing the chip in a set position.

For example, referring to FIGS. 6A and 6B in contrast to FIGS. 5A and 5B, in the first embodiment, the chip is placed with the second mover 21 stopped. While (a) of FIG. 5 is prepared and the first mover 11 is moved to the right (FIG. 5b), the chip is placed, while in the second embodiment, the first operation is performed. In the state where the ruler 11 is stopped, the chip is prepared for placement (Fig. 6 (a)), and in this state, the second mover 21 is returned to the left side (Fig. 6 (b)). Racing will take place.

And the chip transfer method according to the second embodiment of the present application is the sliding movement in the step of the drive switching unit 3 is placed in the chip by the link mechanism 4 while the second mover 21 is moved to the rear The sliding of the opposite direction of the direction may include the step of completing the placement of the chip.

For example, referring to FIGS. 6B and 6C, when the bond head module 6 places the chip as shown in FIG. It is moved to the left side (Fig. 6 (c)), whereby the link mechanism 4 slides the drive switching unit 3 upward, thereby completing the placement of the chip.

Next, after the chip is completed, both the first and second embodiments are in the same state as shown in FIGS. 5C and 6C, and thus, again in FIG. 4A. As the first mover 11 and the second mover 21 are moved in the state shown, the transfer process of the chip may be repeatedly performed.

Referring to the drawings, the repetitive transfer of the chip according to the first embodiment of the present application may be made by repeating the processes shown in Figures 4 and 5, the chip repetitive transfer according to the second embodiment of the present application The process shown in 4 and 6 may be repeated.

However, in order for the chip transfer to be repeated, the chip at a position different from the position where the chip was previously transferred should be transferred. As the chip is repeated, the first mover 11 and the second mover are moved. The position of the ruler 21 may vary somewhat continuously. Alternatively, in some cases, instead of changing the positions of the first mover 11 and the second mover 21, the stage containing the chip to be transferred may be moved, and the chip may be repeatedly transferred. Alternatively, the repetitive transfer algorithm of the chip may be set in a direction in which the position change of the first mover 11 and the second mover 21 and the position change of the stage containing the chip to be transferred are combined together. .

It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1. First linear motor 11. First mover
111. Slide unit 111a. rail
12. First stator
2. 2nd linear motor 21. 2nd mover
22. Second stator
3. Drive switching unit 4. Link mechanism
5. Rails 51. Rails
6. Bondhead Module

Claims (13)

In the chip transfer device,
A first linear motor having a first mover;
A second linear motor disposed adjacent to the movement path of the first mover;
A drive switching unit mounted to the first mover so as to be slidable; And
And a link mechanism hinged to each of the drive switching unit and a second mover provided in the second linear motor. The method of claim 1,
Further comprising a rail portion provided with a rail parallel to the movement path of the first mover,
The first mover includes a slide unit which is slidably fastened to the rail,
And the drive switching unit is mounted to the slide unit to be slidably movable. The method of claim 1,
And the drive switching unit is mounted to the first mover so as to be slidable in a direction different from the movement path of the first mover. The method of claim 3,
And a direction different from the movement path of the first mover is a direction orthogonal to the movement path of the first mover. The method of claim 1,
And the link mechanism is provided with a length such that the drive switching unit can be slidably moved relative to the first mover in accordance with the positional relationship between the first mover and the second mover. The method of claim 1,
And the movement paths of the first and second movers are formed parallel to each other. The method of claim 1,
And the movement paths of the first and second movers are curved paths. The method of claim 1,
And a bond head module mounted on the drive switching unit and picking up chips. 9. The method of claim 8,
And the chip is an LED chip. A chip transfer method using the chip transfer device according to claim 8,
Preparing to pick up the chip with the bond head module spaced apart from the chip as the second mover is located behind the first mover;
A step in which the bond head module picks up the chip by sliding the drive switching unit toward the chip by the link mechanism while the second mover moves forward; And
Completing the pickup of the chip by sliding the second mover in a direction opposite to the sliding movement direction in the step of picking up the drive switching unit by the link mechanism while the second mover moves forward; And
And transferring the picked-up chip while the first and second movers move forward. The method of claim 10,
The second mover stops moving forward to prepare for placing the picked up chip;
Placing the chip in the set position by the bond head module by sliding the first mover toward the set position by the link mechanism while the first mover is moved forward; And
And the placement of the chip is completed by sliding the drive shifting unit away from the placed chip by the link mechanism while the first mover is moved rearward again. The method of claim 10,
The first and second movers stop moving forward to prepare for placing the picked up chip;
Placing the chip in the set position by the bond head module as the second mover moves rearward and slides toward the set position by the link mechanism by the link mechanism; And
And further comprising the step of completing the placement of the chip by sliding the second mover in the opposite direction to the sliding movement direction in the step of placing the drive switching unit by the link mechanism while the second mover moves further backward. Chip transfer method. The method of claim 10,
And the first linear motor is disposed adjacent to the second linear motor such that the movement path of the first mover is closer to the position where the chip is picked up than the movement path of the second mover.

Images