KR20130046311A - The radiant heat circuit board unified blanket and the backlight unit having the same - Google Patents

Abstract

According to an aspect of the present invention, there is provided a heat dissipation circuit board mounted to a chassis that provides a light guiding passage of a backlight unit, the heat dissipation circuit board including a first region in which a light emitting device is mounted, and a second region bent from the first region. The device includes a device groove for embedding the light emitting device. Therefore, by forming the heat dissipation circuit board to which the light emitting element is attached in an L shape, the chassis and the heat dissipation circuit board can be combined without a blanket. In addition, the light emitting device is inserted into the heat dissipation circuit board to reduce the overall thickness of the light emitting module, thereby reducing the bezel.

Description

The radiant heat circuit board unified blanket and the backlight unit having the same}

The present invention relates to a light unit including a blanket integrated radiating circuit board.

Liquid crystal display (LCD) is a display device in which the liquid crystal is inclined according to the intensity of the electric field formed by the upper and lower electrodes, and displays an image by selectively transmitting the light emitted from the lower backlight according to the inclination degree. .

The liquid crystal display is a flat panel display that is widely used because of low power consumption and low power consumption.

The backlight of the liquid crystal display device is a light source for irradiating light to the rear of the liquid crystal panel, and a complex including a power supply circuit for driving the light source and an integral part to form a uniform plane light is called a backlight unit (BLU). do. In the backlight unit, a light source device such as a light emitting diode (LED) is mounted on a printed circuit board. The printed circuit board uses a metal material that can withstand the heat emitted by the light source element.

However, if the heat generated from the light source device is not released, the light source device may be destroyed or the life may be shortened.

1 illustrates a cross-sectional view of a heat dissipation circuit board 10 and a blanket 140 manufactured according to the related art in a chassis 50 which is a light guiding passage of a backlight unit.

Referring to FIG. 1, the heat dissipation circuit board 10 and the blanket 140 for fixing it to the chassis 50 are separately manufactured and bonded using the adhesive layer 20, and the chassis 50 is used as a light guiding passage. )).

In this case, the blanket 140 has a predetermined thickness, extends horizontally from the side wall of the chassis 50, is spaced apart from the side wall of the chassis 50 by a predetermined distance, and is bent at a first angle θ1, and the chassis ( 50 is bent again at the bottom surface 110a and the second angle θ2. When the first angle θ1 of the blanket 140 is 0 to 90 degrees, the bezel of the chassis 50 increases in the heat dissipation circuit board 10, and the first angle θ1 is 90 to 270 degrees. In this case, when the thickness of the backlight unit is increased and the first angle θ1 is 270 to 360, a problem of obstructing an optical path of the light emitting diode occurs.

In addition, when the second angle θ1 formed between the side surface 110b and the bottom surface of the blanket 140 is 90 to 270 degrees, when the thickness of the backlight unit is increased and the second angle θ1 is 270 to 360 degrees, The problem is that the bezel is larger.

In addition, an air layer is formed between the blanket 140 and the chassis 50 to be separated by an impact and the heat dissipation is reduced.

The embodiment provides a backlight unit including a blanket integrated heat dissipation circuit board having a new structure.

An embodiment includes a heat dissipation circuit board mounted to a chassis providing a light guiding passage of a backlight unit, the heat dissipation circuit board including a first region in which a light emitting element is mounted, and a second region bent from the first region, The device includes a device groove for embedding the light emitting device.

According to the present invention, by forming an L-shaped heat dissipation circuit board to which a light emitting element is attached, the chassis and the heat dissipation circuit board can be combined without a blanket. In addition, the light emitting device is inserted into the heat dissipation circuit board to reduce the overall thickness of the light emitting module, thereby reducing the bezel.

1 is a cross-sectional view of a conventional blanket integrated heat dissipation circuit board and chassis structure.
2 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a backlight unit including the same according to the present invention.
3 is a top view of the blanket integrated heat dissipation circuit board shown in FIG. 2.
4 is a cross-sectional view of the heat dissipation circuit board of FIG. 3.
5 is an enlarged view of FIG. 4.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

The present invention provides a blanket integrated heat dissipation circuit board, which can be directly coupled to the bottom chassis.

Hereinafter, a heat dissipation circuit board according to the present invention will be described with reference to FIGS. 2 to 5.

2 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a backlight unit including the same according to the present invention, FIG. 3 is a top view of the blanket integrated heat dissipation circuit board shown in FIG. 2, and FIG. 4 is heat radiation of FIG. 3. 5 is a cross-sectional view of the circuit board, and FIG. 5 is an enlarged view of FIG. 4.

The display device includes a backlight unit and a display panel that receives light from the backlight unit and displays an image. Therefore, the backlight unit will also be described below by describing the display device.

2 to 5, the bottom chassis 110, the light emitting modules 130 and 170 formed in the bottom chassis 110, the reflective sheet 182, and the light guide plate 180 are included.

The display device includes a light guide plate 180 formed on the light emitting modules 130 and 170, the reflective sheet 182, and the reflective sheet 182 to form a light emitting unit, and the optical sheet 181 and the optical sheet 181 on the light guide plate 180. The top chassis 260 is formed on the display panel 250 and the display panel 250.

The bottom chassis 110 vertically extends from the bottom surface 110a and the bottom surface 110a having a planar shape having a rectangular shape having two long sides and two short sides facing each other and perpendicular to each other. Side 110b.

The bottom chassis 110 is coupled to the support member 200 formed on the optical sheet 181 to form the light emitting modules 130 and 170, the reflective sheet 182, the light guide plate 180, and the optical sheet in the bottom chassis 110. 181 is stored.

The bottom chassis 110 may be formed of, for example, a metal material, and a plurality of convex portions (not shown) may be formed on the bottom surface to enhance rigidity.

The reflective sheet 182 is formed on the bottom surface of the bottom chassis 110.

On the other hand, the reflective sheet 182 is composed of a reflector, a reflective metal plate, and the like and reflects light leaked from the light guide plate 180 again.

The display device includes a light guide plate that diffuses and reflects light emitted from the light emitting modules 130 and 170 onto the light emitting modules 130 and 170 and the reflective sheets 182 and irradiates the display panel 250 with a surface light source. 180 is formed.

The light guide plate 180 is formed in a one-body shape corresponding to one screen defined by the display panel 250.

The integrated light guide plate 180 includes an upper surface and a lower surface, and the upper surface on which the surface light source is generated is flat.

The light guide plate 180 may be made of a PC material or a poly methy methacrylate (PMMA) material, and a reflective pattern may be formed at a lower portion thereof. The reflective pattern may be formed in a concentric or uneven pattern based on each corner, but is not limited thereto.

The light guide plate 180 may be manufactured by mixing phosphors, or a phosphor may be coated on an upper surface thereof, but is not limited thereto.

The light guide plate 180 may have a polygonal shape to correspond to one screen, and may have a rectangular shape, preferably a rectangular shape, according to the shape of the screen.

The light emitting modules 130 and 170 are disposed on one side of the light guide plate 180.

The light emitting modules 130 and 170 may be a bar type extending along one side of the light guide plate 180.

The light emitting modules 130 and 170 include a blanket integrated heat dissipation circuit board 130 and a light emitting element 170 inserted into the heat dissipation circuit board 130.

The blanket integrated heat dissipation circuit board 130 includes a support substrate 131 of an alloy including copper, aluminum, nickel, or the like having high heat conductivity and excellent heat dissipation.

An insulating layer 140 including an epoxy resin or a polyimide resin is formed on the support substrate 131, and a pattern 150 formed by patterning a copper foil layer on the insulating layer 140, specifically, Pads 150a and 150b or a circuit pattern 150c are formed.

In this case, the pads 150a and 150b are electrically connected to the electrode pad 150a and the plurality of electrode pads 150a of the light emitting device 170 mounted thereon to transmit external power. It may be a connector pad 150b, and the pads 150a and 150b may be exposed by the solder resist 160.

On the other hand, as shown in Figure 3, the heat dissipation circuit board is composed of two bent regions (130a, 130b), the two bent regions (130a, 130b) may have the same width, but is not limited thereto.

Pads 150a and 150b and a circuit pattern 150c are formed to mount the light emitting device 170 in one of the two bent regions 130a and 130b.

That is, the pads 150a and 150b and the circuit pattern 150c are formed in one bent region 130b, and the metals are formed in the bent region 150b where the pads 150a and 150b and the circuit pattern 150c are formed. The insulating layer 140 is formed on the support substrate 131.

In this case, a plurality of light emitting devices 170, for example, a device groove 135 to which a light emitting diode is mounted, is formed on the electrode pad 150a of the one bent region 130b.

As shown in FIG. 3, both the insulating layer 140 and the pattern 150 may be formed in only one of the two bent regions 130a and 130b, and the other bent region 130a may be a dummy region. In contrast, the insulating layer 140 is formed in both of the bent regions 130a and 130b, and the electrode of the light emitting device 170 extends to the bottom surface along the side surface of the device groove 135 in one bent region 130b. The pad 150a is formed, and a circuit pattern 150c for transmitting a signal to each light emitting device 170 may be formed in the other bent region 130a.

Meanwhile, in the bent regions 130a and 130b, a bent region 130a in which the light emitting device 170 is not mounted is in contact with the bottom surface 110a of the chassis 110, and a device groove for mounting the light emitting device 170 is provided. A bent region 130b in which 135 is defined is mounted in contact with the side surface 110b of the chassis 110.

As such, the device grooves 135 are formed, and the light emitting devices 170 are formed by filling the device grooves 135 to reduce the overall thickness of the light emitting modules 130 and 170. At this time, the depth of the device groove 135 may be lower than or equal to the thickness of the light emitting device 170, the light emitting surface of the light emitting device 170 is not formed lower than the device groove 135.

The chassis 110 and the heat dissipation circuit board may be fixed by applying an adhesive layer (not shown) between the bottom surface 110a of the chassis 110 and the heat dissipation circuit board.

The adhesive layer uses a thermal interface material (TIM) such as thermal grease or thermal compound having high thermal conductivity and excellent adhesion.

As such, while forming a bent heat radiating circuit board without a separate blanket, the heat radiating circuit board is formed in an L shape and attached to be in close contact with the side surfaces 110b of the chassis 110. ) Is not formed between the light emitting device 170 and the heat dissipation property by directly transferring heat to the chassis 110.

In addition, by forming a groove in the heat dissipation circuit board and mounting the light emitting device 170 in the groove, the thickness of the light emitting module may be reduced, thereby reducing the thickness of the bezel.

Meanwhile, the optical sheet 181 is disposed on the light guide plate 180.

The optical sheet 181 may not be formed, and only one diffusion sheet or only one prism sheet may be formed. The number and type of the optical sheets 181 may be variously selected depending on the desired luminance characteristics.

 The support member 200 is formed on the optical sheet 181.

The support member 200 is coupled to the bottom chassis 110 so that the reflective sheets 182, the light emitting modules 130 and 170, the light guide plate 180, and the optical sheet 181 may be tightly coupled to the bottom chassis 110. The upper display panel 250 is supported.

The support member 200 may be formed of a synthetic resin material or a metal material, for example.

The display panel 250 is disposed on the supporting member 200.

The display panel 250 displays image information by light emitted from the light guide plate 180. For example, the display panel 250 may be implemented as a liquid crystal display panel. The display panel 250 may include an upper substrate, a lower substrate, and a liquid crystal layer interposed between the two substrates, and may further include polarizing sheets adhered to the upper surface of the upper substrate and the lower surface of the lower substrate, respectively.

The top chassis 260 is formed on the display panel 250.

The top chassis 260 includes a front part disposed on the front of the display device and a side part bent in a vertical direction from the front part and disposed on the side of the display device, and the side part includes the support member 200 and a screw (not shown). It can be coupled via a coupling member such as.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

Thermal Circuit Board 130
Chassis 110
Light emitting element 170
LGP 180

Claims (11)

A heat dissipation circuit board mounted to a chassis that provides a light guiding passage of a backlight unit,
A first region in which the light emitting element is mounted, and
A second area bent from the first area,
The first region is a blanket integrated heat-dissipating circuit board including a device groove for embedding the light emitting device. The method of claim 1,
The heat dissipation circuit board
Support substrate,
An insulating layer formed on the support substrate,
A circuit pattern or pad formed on the insulating layer, and
Blanket integrated heat dissipation circuit board comprising a solder resist for exposing the pad. The method of claim 2,
The support substrate is a blanket integrated heat dissipation circuit board having a plurality of the device grooves for mounting the light emitting element. The method of claim 3,
The pad is a blanket integrated heat dissipation circuit board is formed along the side of the device groove to the bottom surface. The method of claim 3,
The blanket integrated heat dissipation circuit board having a depth of the device groove is equal to or less than the thickness of the light emitting device. A bottom chassis having a bottom surface and a side bent from the bottom surface,
A light guide plate disposed on a bottom surface of the bottom chassis, and
A light emitting module attached to side and bottom surfaces of the bottom chassis and providing light to side surfaces of the light guide plate;
The light-
A heat dissipation circuit board including a first area attached to a side of the bottom chassis and a second area bent from the first area and attached to a bottom surface of the bottom chassis, and
A plurality of light emitting elements disposed on the first region,
The first region may include a device groove filling the light emitting device. The method according to claim 6,
The heat dissipation circuit board
Support substrate,
An insulating layer formed on the support substrate,
A circuit pattern or pad formed on the insulating layer, and
And a solder resist exposing the pad. The method of claim 7, wherein
The support substrate has a plurality of the device grooves for mounting the light emitting device. 9. The method of claim 8,
The pad is formed along the side of the device groove to the bottom surface. 10. The method of claim 9,
And a depth of the groove of the device is less than or equal to the thickness of the light emitting device. The backlight unit of any one of claims 6 to 10, and
And a display panel configured to receive light from the backlight unit and display an image.

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