KR20130027492A - Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material - Google Patents
Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material Download PDFInfo
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- KR20130027492A KR20130027492A KR1020127028203A KR20127028203A KR20130027492A KR 20130027492 A KR20130027492 A KR 20130027492A KR 1020127028203 A KR1020127028203 A KR 1020127028203A KR 20127028203 A KR20127028203 A KR 20127028203A KR 20130027492 A KR20130027492 A KR 20130027492A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 160
- 238000007747 plating Methods 0.000 title claims abstract description 93
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 80
- 239000000463 material Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 13
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000013078 crystal Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 description 9
- 239000010951 brass Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000005498 polishing Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910009038 Sn—P Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 239000006174 pH buffer Substances 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 229940081974 saccharin Drugs 0.000 description 2
- 235000019204 saccharin Nutrition 0.000 description 2
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 1
- -1 butyne diol Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- KDKYADYSIPSCCQ-UHFFFAOYSA-N ethyl acetylene Natural products CCC#C KDKYADYSIPSCCQ-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/16—Acetylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Mechanical Engineering (AREA)
Abstract
양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공한다. 광택 니켈 도금재는, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재와, 금속 기재의 그 표면에 형성된 니켈 도금층을 구비한다.Provided are a polished nickel plated material having a good appearance, an electronic component using the polished nickel plated material, and a method for producing the polished nickel plated material. A glossy nickel plating material is provided with the metal base material whose thickness of the processed altered layer of a surface is 0.2 micrometer or more, and the nickel plating layer formed in the surface of the metal base material.
Description
본 발명은, 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법에 관한 것이다.TECHNICAL FIELD This invention relates to the electronic component using a glossy nickel plating material, a glossy nickel plating material, and the manufacturing method of a glossy nickel plating material.
단자, 커넥터 등의 전자 부품 또는 금속 장식품 등에는, 금속 기재에 광택 니켈 도금을 실시한 재료가 사용되고 있다. 광택 니켈 도금을 제조할 때의 문제로서는, 도금 외관이 도금 소재의 표면 특성에 영향을 받는 점을 들 수 있다. 예를 들어, 황동 (Cu-30％Zn) 스트립에 광택 니켈 도금을 실시하는 경우, 황동 소재가 템퍼링재이면, 도금 후의 외관에 양호한 광택이 보이지 않고, 흐린 외관 또는 광택과 흐림이 혼재하는 외관이 되는 경우가 있다. 또, 인청동 (Cu-8％Sn-P) 스트립에 광택 니켈 도금을 실시하는 경우에도 동일한 문제점이 확인되었다.BACKGROUND ART Metallic substrates with glossy nickel plating are used for electronic components such as terminals, connectors, and metal ornaments. The problem at the time of manufacturing a bright nickel plating is that a plating appearance is influenced by the surface characteristic of a plating material. For example, when the brass (Cu-30% Zn) strip is subjected to bright nickel plating, if the brass material is a tempered material, a good gloss is not seen in the appearance after the plating, and the appearance that the cloudy appearance or the gloss and cloudiness are mixed It may become. Moreover, the same problem was confirmed also when giving a bright nickel plating to a phosphor bronze (Cu-8% Sn-P) strip.
이와 같은 문제를 해결하기 위해, 예를 들어, 특허문헌 1 에는, 도금성이 우수한 구리 합금의 제조 방법이 개시되어 있다. 그리고, 이것에 따르면, 구리 합금 표면의 가공 변질층을 얇게 함으로써, 특히 은 도금 또는 구리 도금을 양호하게 형성할 수 있다고 기재되어 있다.In order to solve such a problem, the patent document 1 discloses the manufacturing method of the copper alloy excellent in plating property, for example. And according to this, it is described that especially silver plating or copper plating can be formed favorably by thinning the process-deterioration layer of the copper alloy surface.
그러나, 상기 서술한 구리 합금은, 은 도금 또는 구리 도금에는 양호하게 적용할 수 있지만, 광택 니켈 도금에 있어서, 양호한 광택을 얻기는 매우 어려워 아직 개선의 여지가 있다. 그래서, 본 발명은, 양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공하는 것을 과제로 한다.However, although the above-mentioned copper alloy can be favorably applied to silver plating or copper plating, it is very difficult to obtain good gloss in luster nickel plating, and there is still room for improvement. Then, an object of this invention is to provide the manufacturing method of the glossy nickel plating material which has a favorable external appearance, the electronic component using a glossy nickel plating material, and a glossy nickel plating material.
본 발명자들은, 예의 검토한 결과, 도금 처리를 실시하는 금속 기재의 표면에 가공 변질층을 형성함으로써, 외관이 양호한 광택 니켈 도금이 얻어진다는 특허문헌 1 과는 상반되는 사실을 알아냈다.MEANS TO SOLVE THE PROBLEM As a result of earnestly examining, the present inventors discovered the fact that it is contrary to patent document 1 that a gloss nickel plating with favorable external appearance is obtained by forming a process-deterioration layer in the surface of the metal base material to which plating process is performed.
이상의 지견을 기초로 하여 완성된 본 발명은 일 측면에 있어서, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재와, 그 금속 기재의 그 표면에 형성된 니켈 도금층을 구비한 광택 니켈 도금재이다.The present invention completed based on the above findings, in one aspect, is a glossy nickel plated material provided with a metal substrate having a thickness of the processed altered layer on the surface of 0.2 µm or more, and a nickel plating layer formed on the surface of the metal substrate.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 가공 변질층의 두께가 0.25 ～ 3.0 ㎛ 이다.In another embodiment of the glossy nickel plating material which concerns on this invention, the thickness of a process altered layer is 0.25-3.0 micrometers.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 가공 변질층의 두께가 0.3 ～ 2.0 ㎛ 이다.In another embodiment of the glossy nickel plating material which concerns on this invention, the thickness of a process altered layer is 0.3-2.0 micrometers.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.3 ㎛ 이하이다.In another embodiment of the glossy nickel plating material according to the present invention, the crystal grain size of nickel constituting the nickel plating layer is 0.3 µm or less.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ～ 0.3 ㎛ 이다.In still another embodiment of the glossy nickel plating material according to the present invention, the crystal grain diameter of nickel constituting the nickel plating layer is 0.01 to 0.3 µm.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 금속 기재가 스테인리스, 구리 또는 구리 합금으로 형성되어 있다.In still another embodiment of the glossy nickel plated material according to the present invention, the metal substrate is formed of stainless steel, copper, or a copper alloy.
본 발명은 다른 일 측면에 있어서, 본 발명에 관련된 광택 니켈 도금재를 사용한 전자 부품이다.In another aspect, the present invention is an electronic component using the glossy nickel plating material according to the present invention.
본 발명은 또 다른 일 측면에 있어서, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재를 준비하고, 그 표면에 니켈 도금층을 형성하는 광택 니켈 도금재의 제조 방법이다.In yet another aspect, the present invention is a method for producing a glossy nickel plated material, wherein a metal substrate having a thickness of the processed altered layer on the surface thereof is 0.2 μm or more, and a nickel plated layer is formed on the surface thereof.
본 발명에 관련된 광택 니켈 도금재의 제조 방법의 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ～ 0.3 ㎛ 이하이다.In one Embodiment of the manufacturing method of the glossy nickel plating material which concerns on this invention, the crystal grain diameter of nickel which comprises a nickel plating layer is 0.01-0.3 micrometer or less.
본 발명에 따르면, 양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공할 수 있다.According to the present invention, it is possible to provide a glossy nickel plated material having a good appearance, an electronic component using a glossy nickel plated material, and a method for producing a glossy nickel plated material.
도 1 은 실시예 3 에 관련된 황동 기재, 가공 변질층 및 니켈 도금층의 확대 단면도이다.BRIEF DESCRIPTION OF THE DRAWINGS It is an expanded sectional view of the brass base material, the processing altered layer, and the nickel plating layer which concerns on Example 3. FIG.
(금속 기재)(Metal base)
본 발명에 사용할 수 있는 금속 기재의 형태에 특별히 제한은 없지만, 예를 들어, 스테인리스강, 구리 또는 구리 합금을 들 수 있다. 이 중에서, 스테인리스강으로는, 마텐자이트계, 페라이트계, 오스테나이트계 등을 사용할 수 있다. 또, 구리 또는 구리 합금은, 커넥터나 단자 등의 전자 부품에 사용되는 모재로서 공지인 임의의 구리 또는 구리 합금으로 해도 되지만, 전기ㆍ전자기기의 접속 단자 등에 사용되는 것을 고려하면, 전기 전도율이 높은 것 (예를 들어, IACS (International Anneild Copper Standard：국제 표준 연동의 도전율을 100 으로 했을 때의 값) 이 15 ～ 80 ％ 정도) 를 사용하는 것이 바람직하고, 예를 들어 Cu-Sn-P 계 (예를 들어 인청동), Cu-Zn 계 (예를 들어 황동, 단동), Cu-Ni-Zn 계 (예를 들어 양은), Cu-Ni-Si 계 (코르손 합금), Cu-Fe-P 계 합금 등을 들 수 있다. 또, 금속 기재의 형상에는 특별히 제한은 없고, 판, 스트립 및 프레스품 등의 형태여도 된다.Although there is no restriction | limiting in particular in the form of the metal base material which can be used for this invention, For example, stainless steel, copper, or a copper alloy is mentioned. Among these, martensite, ferrite, austenitic, or the like can be used as the stainless steel. Moreover, although copper or a copper alloy may be arbitrary arbitrary copper or copper alloy as a base material used for electronic components, such as a connector and a terminal, considering that it is used for the connection terminal of an electrical and electronic device, a high electrical conductivity It is preferable to use the thing (for example, IACS (value when the conductivity of the international Annealed Copper Standard is 100) about 15 to 80%), for example, Cu-Sn-P system ( Phosphor Bronze), Cu-Zn-based (e.g. brass, Dandong), Cu-Ni-Zn-based (e.g. silver), Cu-Ni-Si-based (Corson alloy), Cu-Fe-P-based Alloys; Moreover, there is no restriction | limiting in particular in the shape of a metal base material, Forms, such as a board, a strip, and a press product, may be sufficient.
니켈 도금을 실시하는 금속 기재의 표면에는, 가공 변질층이 0.2 ㎛ 이상의 두께로 존재한다. 가공 변질층의 두께가 0.2 ㎛ 미만이면, 당해 표면에 형성되는 니켈 도금 조직이 모두, 혹은 부분적으로 조대한 것이 되어, 양호한 외관의 도금이 얻어지지 않는다. 가공 변질층이란, 압연 가공이나 버프 연마 등에 의해 금속 표면에 발생되는 결정립의 미세한 층이다. 가공 변질층의 두께는, 바람직하게는 0.25 ～ 3.0 ㎛ 이며, 더 바람직하게는 0.3 ～ 2.0 ㎛ 이다.On the surface of the metal base material to which nickel plating is carried out, a processing altered layer exists in thickness of 0.2 micrometer or more. When the thickness of the processed altered layer is less than 0.2 µm, all or part of the nickel plating structure formed on the surface becomes coarse, and plating of a good appearance is not obtained. The processing altered layer is a fine layer of crystal grains generated on the metal surface by rolling, buffing, or the like. The thickness of the processed altered layer is preferably 0.25 to 3.0 µm, more preferably 0.3 to 2.0 µm.
한편, 광택 니켈 도금재를 제조하는 경우에는, 광택제를 함유하는 도금을 사용하여 금속 기재에 도금 피막을 형성하지만, 상기 서술한 바와 같이 금속 기재 표면 상태에 따라, 니켈 도금이 광택 외관으로 되지 않는 경우가 있다. 니켈 도금은 하지의 금속 결정의 영향을 받기 쉽다는 특성을 갖기 때문이다. 예를 들어, 금속 기재의 결정립이 조대이면, 도금의 결정립도 커져, 결과적으로 도금 표면의 요철이 커진다. 그래서, 흐린 외관이 된다. 한편, 금속 기재의 결정립이 미세하면, 도금 조직도 미세해져, 도금 표면은 평활해진다. 그래서, 도금은 광택 외관으로 된다.On the other hand, when manufacturing a gloss nickel plating material, when a plating film is formed in a metal base material using the plating containing a gloss agent, but nickel plating does not become a gloss appearance according to the metal base surface state as mentioned above. There is. This is because nickel plating has a property of being easily affected by the underlying metal crystals. For example, when the crystal grain of a metal base material is coarse, the crystal grain of plating also becomes large and consequently, the unevenness | corrugation of a plating surface becomes large. Thus, the appearance is cloudy. On the other hand, when the crystal grain of a metal base material is fine, a plating structure will also become fine and a plating surface will be smooth. Thus, the plating has a glossy appearance.
(광택 니켈 도금재)(Glossy Nickel Plating Material)
본 발명에 관련된 광택 니켈 도금재는, 상기 서술한 금속 기재의 가공된 표면에, 니켈 도금층이 형성되어 있다. 니켈 도금층은, 금속 기재의 표면의 금속의 결정 입경에 대응되는 크기의 결정 입경 (0.3 ㎛ 이하) 을 갖는 니켈로 구성되어 있다. 니켈 도금층은, 이와 같이 결정 입경이 미세하기 때문에, 양호한 광택을 가지고 있다. 또, 니켈 도금층을 구성하는 니켈의 결정 입경은, 바람직하게는 0.01 ～ 0.3 ㎛ 이다.As for the glossy nickel plating material which concerns on this invention, the nickel plating layer is formed in the processed surface of the metal base material mentioned above. The nickel plating layer is comprised from nickel which has the crystal grain size (0.3 micrometer or less) of the magnitude | size corresponding to the crystal grain diameter of the metal of the surface of a metal base material. The nickel plating layer has good gloss because the crystal grain size is fine in this way. Moreover, the crystal grain diameter of nickel which comprises a nickel plating layer becomes like this. Preferably it is 0.01-0.3 micrometer.
니켈 도금층은 니켈로 구성되는데, 이 중에는 극히 미량인 유기 광택제 성분도 포함된다. 이것은 광택제 성분이 도금 공정에서 피막에 미량 포함되기 때문이다.The nickel plated layer is composed of nickel, including an extremely small amount of an organic brightener component. This is because the brightener component is contained in the coating in a small amount in the plating step.
또, 본 발명에 관련된 단자, 커넥터 등의 전자 부품은, 상기 서술한 광택 니켈 도금재를 재료로 하여 구성되어 있다.Moreover, the electronic components, such as a terminal and a connector which concern on this invention, are comprised using the glossy nickel plating material mentioned above as a material.
(광택 니켈 도금재의 제조 방법)(Manufacturing Method of Glossy Nickel Plating Material)
먼저, 스테인리스강, 구리 또는 구리 합금 등으로 형성된 금속 기재를 준비한다. 다음으로, 예를 들어, 압연, 스킨 패스 압연, 버프 연마, 브러쉬 연마에 의해 금속 기재의 표면에 가공 변질층을 형성한다. 가공 변질층의 두께가 0.2 ㎛ 이상이 되도록 가공 조건, 예를 들어 압연 가공도, 버프 연마시의 압력이나 시간을 조정한다. 가공 변질층의 관찰은, FIB (Focused Ion Beam) 에 의한 단면 관찰로 실시하여, 가공의 성공 여부를 확인한다.First, a metal substrate formed of stainless steel, copper or a copper alloy is prepared. Next, a processed altered layer is formed on the surface of a metal base material by rolling, skin pass rolling, buff polishing, and brush polishing, for example. The processing conditions, for example, the rolling work degree, the pressure and the time during buff polishing are adjusted so that the thickness of the processed deterioration layer is 0.2 µm or more. Observation of the processed deformed layer is performed by cross-sectional observation with a focused ion beam (FIB) to confirm the success or failure of the processing.
다음으로, 광택 도금욕을 준비한다. 광택 도금욕에 사용하는 광택 도금액은, 수용성 니켈염, pH 완충제, 광택제를 함유한다.Next, the gloss plating bath is prepared. The gloss plating liquid used for a gloss plating bath contains a water-soluble nickel salt, a pH buffer, and a gloss agent.
여기서, 수용성 니켈염으로는, 예를 들어 황산 니켈, 염화 니켈 등을 들 수 있고, 이들은 합계 250 ～ 350 g/ℓ 첨가된다.Here, as water-soluble nickel salt, nickel sulfate, nickel chloride, etc. are mentioned, for example, 250-350 g / L in total are added.
pH 완충제로는, 예를 들어, 붕산, 시트르산 등을 들 수 있고, 이들은 35 ～ 45 g/ℓ 첨가된다.Examples of the pH buffers include boric acid and citric acid, and 35 to 45 g / L are added thereto.
광택제로는, 예를 들어, 사카린, 1-4부틴디올을 들 수 있고, 이들은 0.1 ～ 2 g/ℓ 첨가된다.Examples of the brightening agent include saccharin and 1-4 butyne diol, and these are added in an amount of 0.1 to 2 g / L.
광택 도금액은 수용액으로, pH 3 ～ 5 로 조정하는 것이 바람직하고, pH 3.8 ～ 4.2 로 조정하는 것이 더 바람직하다.It is preferable to adjust pH 3--5 with an aqueous solution, and, as for a gloss plating liquid, it is more preferable to adjust pH-3.8-4.2.
또, 광택 도금액은, 욕온도 40 ～ 60 ℃ 에서 사용하는 것이 바람직하고, 45 ～ 50 ℃ 에서 사용하는 것이 더 바람직하다.Moreover, it is preferable to use a gloss plating liquid at bath temperature 40-60 degreeC, and it is more preferable to use at 45-50 degreeC.
광택 도금액의 pH 및 욕온도가 상기 범위 밖인 경우, 도금 속도가 느리거나, 외관 불량을 일으키기 쉬운 등의 문제가 있다.When the pH and bath temperature of the gloss plating solution are outside the above ranges, there is a problem such as a slow plating rate or a poor appearance.
계속해서, 상기 서술한 표면이 가공된 금속 기재를 광택 도금욕 내에 소정 시간 침지시켜, 원하는 광택을 갖는 광택 니켈 도금 기재를 얻는다. 이 때, 금속 기재 표면에는 결정 입경이 1 ㎛ 이하, 바람직하게는 0.01 ～ 0.2 ㎛ 정도의 가공 변질층이 형성되어 있으므로, 그 표면에 형성되는 도금층의 금속의 결정 입경도 그에 대응하여 미세해진다. 그래서, 형성된 도금층의 표면은 평활해져, 양호한 광택을 얻을 수 있다.Subsequently, the above-mentioned surface-processed metal substrate is immersed in a gloss plating bath for a predetermined time to obtain a gloss nickel plated substrate having a desired gloss. At this time, since the processing altered layer of 1 micrometer or less, preferably 0.01-0.2 micrometer, is formed in the surface of a metal base material, the crystal grain size of the metal of the plating layer formed in the surface becomes correspondingly fine. Therefore, the surface of the formed plating layer becomes smooth, and favorable gloss can be obtained.
실시예Example
이하, 본 발명의 실시예를 나타내지만, 이것들은 본 발명을 더 잘 이해하기 위해서 제공하는 것으로, 본 발명이 한정되는 것을 의도하는 것은 아니다.Hereinafter, although the Example of this invention is shown, these are provided in order to understand this invention better, and it does not intend that this invention is limited.
(예 1：실시예 1 ～ 10)(Example 1: Examples 1 to 10)
금속 기재로서 두께 0.65 ㎜ 의 황동판을 준비하였다. 황동판의 표면에는, 버프 연마에 의해 표 1 에 나타낸 두께의 가공 변질층을 형성하였다. 이 변질층의 두께는, FIB 를 사용하여 관찰한 것이다.A brass plate having a thickness of 0.65 mm was prepared as a metal substrate. On the surface of a brass plate, the processing altered layer of the thickness shown in Table 1 was formed by buff polishing. The thickness of this altered layer is observed using FIB.
또, 금속 기재의 가공 변질층을 구성하는 금속의 결정 입경을 FIB 에 의해 관찰하였다.Moreover, the crystal grain diameter of the metal which comprises the process altered layer of a metal base material was observed by FIB.
계속해서, 이하의 조성을 갖는 광택 도금액을 함유하는 광택 도금욕을 준비하였다.Then, the gloss plating bath containing the gloss plating liquid which has the following compositions was prepared.
ㆍNiSO4ㆍ6H2O 250g/ℓㆍ NiSO 4 ㆍ 6H 2 O 250g / ℓ
ㆍNiCl2ㆍ6H2O 50g/ℓㆍ NiCl 2 ㆍ 6H 2 O 50g / ℓ
ㆍ붕산 40 사카린 2 g/ℓㆍ boric acid 40 saccharin 2 g / l
ㆍ1,4-부틴디올 0.2 g/ℓ1,4-butynediol 0.2 g / l
다음으로, 표면을 가공한 황동판을 탈지, 산세한 후, 도금욕에 침지시켜 전류 밀도 5 A/dm2 로 도금층을 형성하였다. 광택 도금욕은, pH 4.0 에서 45 ℃ 로 하였다.Next, after degreasing and pickling the brass plate which processed the surface, it immersed in the plating bath, and formed the plating layer with the current density of 5 A / dm <2> . The gloss plating bath was 45 degreeC at pH 4.0.
도 1 에, 실시예 3 에 관련된 황동 기재, 가공 변질층 및 니켈 도금층의 확대 단면도를 나타낸다.In FIG. 1, the expanded sectional drawing of the brass base material, a process altered layer, and a nickel plating layer which concerns on Example 3 is shown.
(예 2：비교예 1 ～ 5)(Example 2: Comparative Examples 1 to 5)
비교예 1 ～ 5 로서 먼저 실시예와 동일한 동박을 준비하였다. 다음으로, 실시예와 동일한 도금욕을 준비하고, 이것에 그 황동판 표면을 가공하지 않고, 또는 가볍게 브러쉬 연마하는 등의 경미한 가공을 실시하여 도금하였다. 도금 전류 및 욕온도도 실시예와 동일하게 설정하였다.As Comparative Examples 1-5, the same copper foil as the Example was prepared first. Next, the plating bath similar to an Example was prepared, and this process was plated by mild processing, such as brush-grinding, without processing the surface of the brass plate, or lightly brush-polishing. Plating current and bath temperature were also set similarly to the Example.
(평가)(evaluation)
니켈 도금층을 구성하는 니켈의 결정 입경을 FIB 에 의한 단면 이미지에 의해 관찰하였다.The crystal grain diameter of nickel which comprises the nickel plating layer was observed by the cross-sectional image by FIB.
니켈 도금층의 광택에 대해 외관 관찰을 실시하였다. 외관 평가는, 광택도계 (일본 전색 공업 제조 반사농도계 ND-1) 를 사용하며 실시하여, 측정값이 1.8 초과일 때를 ○ 으로 하고, 1.6 ～ 1.8 일 때를 △ 로 하고, 1.6 미만일 때를 × 로 평가하였다.Appearance observation was performed about the gloss of a nickel plating layer. Appearance evaluation was carried out using a glossmeter (reflection densitometer ND-1 manufactured by Nippon Denshi Kogyo Industries Co., Ltd.), when the measured value was greater than 1.8, and when the value was 1.6 to 1.8, △ and × Evaluated as.
예 1 및 2 의 결과를 표 1 에 나타낸다.The results of Examples 1 and 2 are shown in Table 1.
Claims (9)
상기 가공 변질층의 두께가 0.25 ～ 3.0 ㎛ 인 광택 니켈 도금재.The method of claim 1,
Glossy nickel plating material whose thickness of the said processing altered layer is 0.25-3.0 micrometers.
상기 가공 변질층의 두께가 0.3 ～ 2.0 ㎛ 인 광택 니켈 도금재.The method of claim 2,
Glossy nickel plating material whose thickness of the said processing altered layer is 0.3-2.0 micrometers.
상기 니켈 도금층을 구성하는 니켈의 결정 입경이 0.3 ㎛ 이하인 광택 니켈 도금재.The method according to any one of claims 1 to 3,
Glossy nickel plating material whose crystal grain diameter of the nickel which comprises the said nickel plating layer is 0.3 micrometer or less.
상기 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ～ 0.3 ㎛ 인 광택 니켈 도금재.The method of claim 4, wherein
Glossy nickel plating material whose crystal grain diameter of the nickel which comprises the said nickel plating layer is 0.01-0.3 micrometer.
금속 기재가 스테인리스, 구리 또는 구리 합금으로 형성되어 있는 광택 니켈 도금재.6. The method according to any one of claims 1 to 5,
Glossy nickel plating material in which a metal base is formed from stainless steel, copper, or a copper alloy.
상기 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ～ 0.3 ㎛ 이하인 광택 니켈 도금재의 제조 방법.The method of claim 8,
The manufacturing method of the glossy nickel plating material whose crystal grain diameter of the nickel which comprises the said nickel plating layer is 0.01-0.3 micrometer or less.
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| PCT/JP2011/054954 WO2011122235A1 (en) | 2010-03-31 | 2011-03-03 | Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material |
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| JP6190104B2 (en) * | 2012-11-01 | 2017-08-30 | Ｄｏｗａメタルテック株式会社 | Nickel plating material and method for producing the same |
| JP6141708B2 (en) * | 2013-07-09 | 2017-06-07 | 三菱伸銅株式会社 | Plated copper alloy plate with excellent gloss |
| JP6805547B2 (en) * | 2015-09-18 | 2020-12-23 | アイシン精機株式会社 | Press fit terminal |
| CN105543921A (en) * | 2015-12-28 | 2016-05-04 | 上海运安制版有限公司 | Nickel plating non-grinding process for production of printing roller |
| JP6888201B2 (en) * | 2017-02-13 | 2021-06-16 | 日鉄ステンレス株式会社 | Separator for solid oxide fuel cell with excellent heat resistance and fuel cell using this |
| JP7190280B2 (en) * | 2018-08-10 | 2022-12-15 | 株式会社Lixil | plumbing fixtures |
| CN116334700A (en) * | 2023-02-03 | 2023-06-27 | 立讯精密工业（滁州）有限公司 | Technological method for regulating and controlling glossiness of electroplated nickel layer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892968A (en) * | 1981-11-30 | 1983-06-02 | Hitachi Ltd | automatic probe head |
| JPS59133397A (en) * | 1983-01-20 | 1984-07-31 | Kasei Naoetsu:Kk | Formation of specular surface on extruded aluminum section by plating |
| JPS62107094A (en) * | 1985-11-06 | 1987-05-18 | Nippon Mining Co Ltd | Manufacture of nickel plated material |
| JPS62116794A (en) * | 1985-11-15 | 1987-05-28 | Nippon Mining Co Ltd | Production of nickel plated material |
| JPH06136596A (en) * | 1992-10-22 | 1994-05-17 | Hirai Seimitsu:Kk | Production of nickel plated material |
| JP2000219996A (en) * | 1999-02-01 | 2000-08-08 | Kobe Steel Ltd | Production of copper or copper alloy sheet for electronic parts |
| JP2009149931A (en) * | 2007-12-19 | 2009-07-09 | Honda Motor Co Ltd | Aluminum base part and manufacturing method thereof |
-
2010
- 2010-03-31 JP JP2010083223A patent/JP5869749B2/en active Active
-
2011
- 2011-03-03 WO PCT/JP2011/054954 patent/WO2011122235A1/en active Application Filing
- 2011-03-03 KR KR1020127028203A patent/KR20130027492A/en not_active Ceased
- 2011-03-03 KR KR1020147027348A patent/KR20140121899A/en not_active Ceased
- 2011-03-03 KR KR1020157026833A patent/KR20150115962A/en not_active Ceased
- 2011-03-03 CN CN201180016871.7A patent/CN102812165B/en active Active
- 2011-03-17 TW TW100109081A patent/TWI431170B/en active
Also Published As
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|---|---|
| CN102812165B (en) | 2016-01-20 |
| WO2011122235A1 (en) | 2011-10-06 |
| CN102812165A (en) | 2012-12-05 |
| TWI431170B (en) | 2014-03-21 |
| KR20150115962A (en) | 2015-10-14 |
| JP2011214066A (en) | 2011-10-27 |
| JP5869749B2 (en) | 2016-02-24 |
| KR20140121899A (en) | 2014-10-16 |
| TW201139757A (en) | 2011-11-16 |
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