KR20130022494A - Light emitting module and backlight unit having the same - Google Patents

Abstract

The light emitting module according to the embodiment includes a plurality of light emitting diodes; And a module substrate including a substrate portion on which the plurality of light emitting diodes are disposed, and a heat dissipation portion bent from the substrate portion, wherein the module substrate comprises: a metal layer having a first width; An insulating layer having a second width smaller than a first width on the metal layer; And a wiring layer on the insulating layer, wherein the heat dissipation part of the module substrate is formed of the metal layer.

Description

LIGHT EMITTING MODULE AND BACKLIGHT UNIT HAVING THE SAME}

The embodiment relates to a light emitting module and a backlight unit having the same.

As information processing technology develops, display devices such as LCD, PDP and AMOLED are widely used. Among such display devices, an LCD requires a backlight unit capable of generating light in order to display an image.

The light emitting module mounts a plurality of light emitting diodes on a substrate and supplies external power through a connector to control driving of the plurality of light emitting diodes.

The embodiment provides a new light emitting module and a backlight unit having the same.

The embodiment provides a light emitting module and a backlight unit having the same by removing an insulating layer from a boundary between a substrate portion and a heat radiating portion of a module substrate, thereby reducing cracks caused by a bending process and improving heat radiation efficiency.

The embodiment provides a light emitting module having a heat radiating portion of a module substrate formed of a metal layer from a substrate portion on which a light emitting diode is mounted, and a backlight unit having the same.

The embodiment provides a backlight unit in which the heat dissipation part of the module substrate is coupled to the bottom part of the bottom cover and the substrate part inside the first side part.

The light emitting module according to the embodiment includes a plurality of light emitting diodes; And a module substrate including a substrate portion on which the plurality of light emitting diodes are disposed, and a heat dissipation portion bent from the substrate portion, wherein the module substrate comprises: a metal layer having a first width; An insulating layer having a second width smaller than a first width on the metal layer; And a wiring layer on the insulating layer, wherein the heat dissipation part of the module substrate is formed of the metal layer.

In an embodiment, a backlight unit may include: a bottom cover including a bottom portion and a first side portion bent from the bottom portion; A light guide plate on the bottom cover; And a substrate portion disposed inside the first side surface portion of the bottom cover, and a heat dissipation portion bent from the substrate portion and disposed on a bottom portion of the bottom cover. And a light emitting module disposed on a substrate portion of the module substrate and including a plurality of light emitting diodes corresponding to at least one side of the light guide plate, wherein the module substrate comprises: a metal layer having a first width; An insulating layer having a second width smaller than a first width on the metal layer; And a wiring layer on the insulating layer.

The embodiment can prevent a crack between the substrate portion and the heat dissipation portion of the module substrate having the light emitting diode, thereby improving the reliability of the light emitting module.

The embodiment can improve the heat dissipation efficiency by removing the insulating layer from the heat dissipation portion of the module substrate.

According to the embodiment, the thickness of the backlight unit may be reduced by reducing the thickness of the heat dissipation unit of the light emitting module or by forming the heat dissipation unit with a metal layer.

The embodiment can improve the reliability of a light emitting module having a light emitting diode and a lighting system having the same.

1 is an exploded perspective view of a display device according to an exemplary embodiment.
FIG. 2 is a side cross-sectional view of the backlight unit of FIG. 1.
3 and 4 are views illustrating a manufacturing process of the light emitting module of FIG. 2.
5 is a cross-sectional view illustrating an example of a light emitting diode of the light emitting module of FIG. 1.

In the description of the embodiment, each substrate, frame, sheet, layer, or pattern is formed "on" or "under" of each substrate, frame, sheet, layer, or pattern. In the case of what is described as being intended, "on" and "under" include both "directly" or "indirectly" formed. . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1, the display device 100 includes a display panel 10 on which an image is displayed, and a backlight unit 20 that provides light to the display panel 10.

The backlight unit 20 may include a light guide plate 70 that provides a surface light source to the display panel 10, a reflective member 45 that reflects leakage light, and a light source in an edge region of the light guide plate 70. A light emitting module 30 and a bottom cover 40 forming a lower exterior of the display device 100 are included.

Although not illustrated, the display device 100 includes a panel supporter for supporting the display panel 10 from a lower side, and a top that forms a rim of the display device 100 and surrounds the circumference of the display panel 10. It may include a cover.

Although not shown in detail, the display panel 10 includes, for example, a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates. Include. A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed at an intersection of the gate line and the data line. Color filters may be formed on the upper substrate. The structure of the display panel 10 is not limited thereto, and the display panel 10 may have various structures. In another example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 10 may be formed in various shapes according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying a scan signal to a gate line and a data driving printed circuit board (PCB) for supplying a data signal to a data line are provided at edges of the display panel 10. ) May be provided.

A polarizing film (not shown) may be disposed on at least one of the top and bottom of the display panel 10. An optical sheet 60 may be disposed below the display panel 10, and the optical sheet 60 may be included in the backlight unit 20, and may include at least one prism sheet or / and a diffusion sheet. have. The optical sheet 60 may be removed but is not limited thereto.

The diffusion sheet evenly spreads the incident light, and the diffused light may be focused onto the display panel by the prism sheet. Here, the prism sheet may be selectively configured using a horizontal or / and vertical prism sheet, one or more roughness reinforcing sheets, and the like. Type or number of the optical sheet 60 may be added or deleted within the technical scope of the embodiment, but is not limited thereto.

The light emitting module 30 may be disposed inside the first side portion 42 of the side surface of the bottom cover 40. The light emitting module 30 may be disposed on different side portions of the bottom cover 40, for example, both sides or all sides thereof, but is not limited thereto.

The light emitting module 30 includes a module substrate 32 and a plurality of light emitting diodes 34 arranged on one surface of the module substrate 32.

The module substrate 32 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 32 may include a printed circuit board having a metal layer therein.

The plurality of light emitting diodes 34 are arranged along the light incident direction X of the light guide plate 70 at a predetermined pitch, and at least one of the light emitting diodes 34 includes at least one of at least one color such as white, red, green, and blue. One will emit light. The embodiment may use a light emitting diode that emits light of at least one color or a combination of light emitting diodes that emit a plurality of colors.

The light emitting diode 34 may include an LED chip using a group III-V compound semiconductor and a molding member for protecting the LED chip. At least one kind of phosphor may be added to the molding member, but is not limited thereto. The LED chip may emit light in a visible light band or emit light in an ultraviolet band.

The light emitting diodes 34 may be arranged in at least one column, or may be arranged at regular intervals or at irregular intervals.

The module substrate 32 includes a substrate portion 32A and a heat dissipation portion 32B, and the light emitting diode 34 is mounted on the substrate portion 32A, and the heat dissipation portion 32B includes the substrate portion ( It may be bent from 32A and disposed at an angle substantially perpendicular to the substrate portion 32A (eg, 85 ° to 95 °). The heat dissipation part 32B may be an area bent from the substrate part 32A among the areas where the light emitting diodes 34 are not mounted. Although the heat dissipation part 32B is illustrated as being bent in one direction of the substrate part 32A, the heat dissipation part 32B may be bent to face each other in both directions of the substrate part 32A, but is not limited thereto.

The width of the heat dissipation part 32B may be wider than the width of the substrate part 32A, and may be formed to be 0.8 mm or more, for example. The width of the heat dissipation unit 32B may be adjusted in consideration of the heat dissipation efficiency. The substrate portion 32A may be formed to a thickness thicker than the thickness of the heat dissipation portion 32B.

The substrate portion 32A of the module substrate 32 may be attached to the first side portion 42 of the bottom cover 40 by an adhesive member 50. The substrate portion 32A of the module substrate 32 may use a fastening member instead of an adhesive member.

A connector may be installed in the substrate portion 32A of the module substrate 32. The connector may be disposed on at least one of an upper surface and a lower surface of the module substrate 32, but is not limited thereto.

The plurality of light emitting diodes 34 are correspondingly disposed on at least one side surface of the light guide plate 70, that is, the light generated from the plurality of light emitting diodes 34 is incident. The light guide plate 70 may be formed in a polygonal shape including an upper surface at which a surface light source is generated, a lower surface opposite to the upper surface, and at least four side surfaces. The light guide plate 70 is made of a transparent material, and may include, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) resin. Can be. The light guide plate 70 may be formed by an extrusion molding method, but is not limited thereto.

A reflective pattern (not shown) may be formed on the top or / and bottom of the light guide plate 70. The reflection pattern is formed of a predetermined pattern, for example, a reflection pattern and / or a prism pattern, thereby reflecting or / and diffusely reflecting light, so that the light may be uniformly irradiated through the entire surface of the light guide plate 70. The lower surface of the light guide plate 70 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 70, but is not limited thereto.

The reflective member 45 may be provided under the light guide plate 70. The reflective member 45 reflects the light traveling toward the lower portion of the light guide plate 70 in the display panel direction. Since the backlight unit 20 re-injects the light leaked to the lower portion of the light guide plate 70 into the light guide plate 70 by the reflective member 45, the light efficiency is lowered, the light properties are lowered, and dark portions are generated. Etc. problems can be prevented. The reflective member 45 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 45 may be a reflective layer formed on an upper surface of the bottom cover 40, but is not limited thereto.

The bottom cover 40 includes an accommodating portion 41 having an open upper portion, and the accommodating portion 41 includes a light emitting module 30, an optical sheet 60, a light guide plate 70, and a reflecting member 45. Can be stored. The bottom cover 40 is a metal having high heat dissipation efficiency, such as aluminum (Al), magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), niobium (Nb) and the It may optionally be formed among these optional alloys.

The reflective member 45, the light guide plate 70, and the optical sheet 60 may be sequentially stacked on the accommodating portion 41 of the bottom cover 40, and the light emitting module 30 may include the bottom cover 40. The first side portion 42 of the light guide plate 70 is disposed to correspond to one side of the light guide plate 70.

A recess 41B is formed in the bottom portion 41A of the bottom cover 40, and the recess 41B is a portion to which the heat radiating portion 32B of the module substrate 32 is coupled. The recess 41B may be formed to have a depth of about the thickness of the heat dissipation part 32B and a width of about the width of the heat dissipation part 32B, but is not limited thereto.

The embodiment has described an example in which the recess portion 41B is disposed in a portion bent from the first side portion 42 of the bottom portion 41A of the bottom cover 40, but the recess portion 41B may not be formed. have.

Referring to FIG. 2, the module substrate 32 may include a metal layer 131, an insulating layer 132 on the metal layer 131, a wiring layer 133 on the insulating layer 132, and a wiring layer 133. A protective layer 134 is included.

The metal layer 131 includes at least one of Al, Cu, and Fe, and is formed on the entire lower surface of the module substrate 32 to be used as a heat dissipation plate. For example, the metal layer 131 may use a plate having a Cu material for bending and heat dissipation efficiency. The metal layer 131 may be formed to a thickness of 45㎛ ~ 75㎛, for example, may be formed to a thickness of 50㎛ ± 5㎛. The metal layer 131 may be formed to a thickness thinner than the thickness of the insulating layer 132. The width of the metal layer 131 may be formed to be the same width as the width of the module substrate (32). The lower surface area of the metal layer 131 may be formed to have the same area as the lower surface area of the module substrate 32.

An insulating layer 132 is formed on the metal layer 131, and the insulating layer 132 may include prepregregulated materials, and may include an epoxy resin, a phenol resin, an unsaturated polyester resin, or the like. . The insulating layer 132 may be formed to a thickness of 80 ~ 100㎛, may be formed thicker than the metal layer 131, it may be formed smaller than the width (or area) of the metal layer 131.

The wiring layer 133 includes a circuit pattern, and includes at least one of Cu, Au, Al, and Ag, and for example, Cu may be used. The wiring layer 133 may be formed to a thickness of 25 ~ 70㎛, may be formed thinner than the thickness of the insulating layer 132, but is not limited thereto.

A protective layer 134 is formed on the wiring layer 133, and the protective layer 134 includes solder resist, and the solder resistor protects an area other than a pad on the upper surface of the module substrate 32. The protective layer 134 may be formed to a thickness of 15 ~ 30㎛. Via holes may be formed in the module substrate 32, but embodiments are not limited thereto.

In addition, a plurality of wiring layers may be disposed in the module substrate 32, and an insulating layer may be further disposed between the plurality of wiring layers.

The light emitting diodes 34 are mounted on the wiring layer 133 of the module substrate 32, and the light emitting diodes 34 are arranged in a series, parallel, or parallel mixed structure by a circuit pattern of the wiring layer 133. Can be.

The module substrate 32 includes a substrate portion 32A and a heat dissipation portion 32B, and the substrate portion 32A has a lamination structure of a metal layer / insulating layer / wiring layer / protective layer 131/132/133/134. The heat dissipation part 32B is formed of a metal layer 131. Here, the metal layer 131 includes a first heat dissipation part 131A and a second heat dissipation part 131B, and the first heat dissipation part 131A becomes a base layer of the substrate part 32A. The second heat dissipation unit 131B becomes the heat dissipation unit 32B. The second heat dissipation part 131B may have a wider width than the first heat dissipation part 131A. The first heat dissipation part 131A and the second heat dissipation part 131B may have the same thickness, but the embodiment is not limited thereto.

The gap D1 between the upper surface of the second heat dissipation part 131B and the insulating layer 132 may be formed to be 0.8 mm to 1 mm, and the insulating layer 132 may be formed by the gap D1. By spaced apart from the bent portion between the first heat dissipation portion 131A and the second heat dissipation portion 132B, it is possible to improve the problem that dust generation and heat dissipation effect by the insulating layer are reduced. This reduces the area occupied by the insulating layer 132 among the regions on the metal layer 131 and is disposed below the region of the wiring layer 133, so that the insulating layer 132 covers the metal layer 131 and the heat dissipation effect is reduced. Can be prevented. In addition, when the insulating layer 132 is disposed in the bent portion, it is possible to prevent cracking in the portion or affecting the circuit pattern.

In addition, the gap between the wiring layer 133 and the bent portion may be further reduced by separating the insulating layer 132 from the heat dissipating portion 32B and the substrate portion 32A. Reducing the gap may reduce the thickness of the light emitting module and the thickness of the backlight unit having the same.

The height D2 of the light emitting module is a distance between a lower surface of the heat dissipation part 32B and an upper surface of the module substrate 32, and may be formed to be 9 mm to 13 mm.

An adhesive member 50 disposed between the first side surface portion 42 of the bottom cover and the substrate portion 32A of the module substrate 32 is disposed so that the substrate portion 32A of the module substrate 32 is moved. The second side portion 42 of the bottom cover is bonded. The heat radiating portion 32B of the module substrate 32 may be adhered to the recess 41B formed at the bottom portion 41A of the bottom cover by the adhesive member 51. Since the heat radiating portion 32B of the module substrate 32 is thin, the recess 41B may not be formed in the bottom portion 41A of the bottom cover.

According to the embodiment, when heat is generated from the light emitting diode 34, some heat is conducted through the first heat dissipation part 131A of the module substrate 32 to pass the path F0 through the first side part 42 of the bottom cover. The heat dissipation is performed, and a part of the remaining heat is conducted to the second heat dissipation part 131B of the module substrate 32 to dissipate heat paths F1 and F2 through the bottom part 41A of the bottom cover.

3 and 4, an insulating layer 132 is formed on the first region A1 on the metal layer 131 of the module substrate 32, and a wiring layer 133 is formed on the insulating layer 132. The protective layer 134 is formed on the wiring layer 133. For example, the metal layer 131 may use a plate having a Cu material for bending and heat dissipation efficiency. The metal layer 131 may be formed to a thickness of 45㎛ ~ 75㎛, for example, may be formed to a thickness of 50㎛ ± 5㎛. The thickness T2 of the module substrate 32 may be formed to a thickness of 200 μm or more, but is not limited thereto.

The second region A2 between the first region A1 and the third region A3 of the metal layer 131 is a buffer region, and spaces the first region A1 from the bending line L1. . The distance between the bending line L1 and the first region A1 is 0.8 mm or more, for example, 0.8 mm to 1 mm, so as to minimize the impact transmitted to the laminated structure such as the insulating layer 132 during bending. I can let you.

When the metal layer 131 is bent by bending along the bending line L1 of FIG. 3, the first heat dissipating portion 131A and the second heat dissipating portion 131B are arranged at a predetermined angle as shown in FIG. 4. The first heat dissipation part 131A may be bent at an almost right angle from the second heat dissipation part 131B, but is not limited thereto.

Since the insulating layer 132 is not formed around the bending line L1, the thickness of the heat dissipating portion 32B of the module substrate 32 may be reduced, and the crack generated during bending may be reduced. In addition, the heat radiation efficiency can be improved.

In addition, by arranging the thickness of the metal layer 131 thin, it is possible to improve the heat dissipation efficiency and to double the thickness of the backlight unit (Bezel).

5 is a side cross-sectional view showing a light emitting device according to the embodiment.

Referring to FIG. 5, the light emitting device 34 may include a body 210 having a first cavity 260, a first lead frame 221 having a second cavity 225, and a third having a third cavity 235. A two-lead frame 231, light emitting chips 271 and 72, and wires 201.

The body 210 may include at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board (PCB). Can be formed. Preferably, the body 210 may be made of a plastic resin material such as polyphthalamide (PPA).

The top shape of the body 210 may have various shapes such as triangle, square, polygon, and round shape according to the use and design of the light emitting device 34. The first lead frame 221 and the second lead frame 231 may be disposed on the bottom of the body 210 to be mounted on the substrate in a direct type, and disposed on the side of the body 210 in an edge type. It may be mounted on a substrate, but is not limited thereto.

The body 210 has an open top and has a first cavity 260 consisting of side and bottom. The first cavity 260 may include a cup structure or a recess structure recessed from an upper surface of the body 210, but is not limited thereto. The side surface of the first cavity 260 may be perpendicular or inclined with respect to the floor.

The shape of the first cavity 260 viewed from above may be circular, elliptical, or polygonal (eg, rectangular). An edge of the first cavity 260 may be curved or flat.

The first lead frame 221 is disposed in the first area of the first cavity 260, a portion of which is disposed at the bottom of the first cavity 260, and a bottom of the first cavity 260 at the center thereof. The concave second cavity 225 is disposed to have a lower depth. The second cavity 225 includes a concave shape, for example, a cup structure or a recess shape, in a direction from the upper surface of the first lead frame 221 to the lower surface of the body 210. Side surfaces of the second cavity 225 may be inclined or vertically bent from the bottom of the second cavity 225. Two opposite sides of the side surface of the second cavity 225 may be inclined at the same angle or inclined at different angles.

The second lead frame 231 is disposed in a second area spaced apart from the first area of the first cavity 260, and a part of the second lead frame 231 is disposed at a bottom of the first cavity 260, and the second area is formed at the center thereof. A concave third cavity 235 is formed to have a depth lower than the bottom of one cavity 260. The third cavity 235 includes a concave shape, for example, a cup structure or a recess shape, in the direction of the lower surface of the body 210 from an upper surface of the second lead frame 231. Side surfaces of the third cavity 235 may be inclined or vertically bent from the bottom of the third cavity 235. Two opposite sides of the side surface of the third cavity 235 may be inclined at the same angle or inclined at different angles.

The lower surface of the first lead frame 221 and the lower surface of the second lead frame 231 may be exposed to the lower surface of the body 210 or disposed on the same plane as the lower surface of the body 210.

The first lead part 223 of the first lead frame 221 may be disposed on the bottom surface of the body 210 and protrude to the first side surface 213 of the body 210. The second lead part 233 of the second lead frame 231 may be disposed on the bottom surface of the body 210 and protrude to the second side surface 214 opposite to the first side surface of the body 210.

The first lead frame 221 and the second lead frame 231 are made of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum. It may include at least one of aluminum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), and may be formed of a single metal layer or a multilayer metal layer. The first and second lead frames 221 and 231 may have the same thickness, but the thickness of the first and second lead frames 221 and 231 is not limited thereto.

The bottom shape of the second cavity 225 and the third cavity 235 may be a circle or ellipse having a rectangle, a regular rectangle or a curved surface.

In the body 210, other metal frames other than the first and second lead frames 221 and 231 are further disposed to be used as heat dissipation frames or intermediate connection terminals.

A first light emitting chip 271 is disposed in the second cavity 225 of the first lead frame 221, and a second light emitting chip () is disposed in the third cavity 235 of the second lead frame 231. 272 may be disposed. The light emitting chips 271 and 272 may selectively emit light in a range of visible light to ultraviolet light, and may be selected from red LED chips, blue LED chips, green LED chips, and yellow green LED chips. The light emitting chips 271 and 72 include compound semiconductor light emitting devices of Group III to Group V elements.

A molding member 290 is disposed in at least one of the first cavity 260, the second cavity 225, and the third cavity 235 of the body 210, and the molding member 290 is formed of silicon or It includes a light-transmissive resin layer such as epoxy, and may be formed in a single layer or multiple layers. The molding member 290 or the light emitting chips 271 and 272 may include phosphors for changing the wavelength of light emitted, and the phosphors excite a part of the light emitted from the light emitting chips 271 and 272 to different wavelengths. It will emit light. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but the present invention is not limited thereto. The surface of the molding member 290 may be formed in a flat shape, concave shape, convex shape and the like, but is not limited thereto.

A lens may be further formed on an upper portion of the body 210, and the lens may include a concave or / and convex lens structure, and adjust light distribution of light emitted from the light emitting element 34. Can be.

The first light emitting chip 272 may be connected to the first lead frame 221 and the second lead frame 231 disposed on the bottom of the first cavity 260, and the connection method may include a wire 201. Or a die bonding or flip bonding scheme may be used. The second light emitting chip 272 may be electrically connected to the first lead frame 221 and the second lead frame 231 disposed on the bottom of the first cavity 260, and the connection method is wire 201. ) Or die bonding or flip bonding.

A protection device may be disposed in the first cavity 260, and the protection device may be implemented by a thyristor, a zener diode, or a transient voltage suppression (TVS), and the zener diode may be configured to electrostatically discharge the light emitting chip. to protect against discharge.

The light emitting module according to the embodiment may be applied not only to a backlight unit such as a portable terminal, a computer, but also to a lighting device such as a lighting lamp, a traffic light, a vehicle headlight, an electric sign, a street lamp, and the like, but is not limited thereto. In addition, the light guide plate may not be disposed in the direct type light emitting module, but is not limited thereto. In addition, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but is not limited thereto.

It is not intended to be limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, it will be apparent to those skilled in the art that various forms of substitution, modification, and alteration are possible without departing from the technical spirit of the present invention described in the claims, and the appended claims. Will belong to the technical spirit described in.

Reference Signs List 100: display device, 10: display panel, 20: backlight unit, 60: optical sheet, 70: light guide plate, 45: reflective member, 30: light emitting module, 32: module substrate, 34: light emitting diode, 131: metal layer, 132: Insulating layer, 133: wiring layer, 134: protective layer, 32A: substrate portion, 32B: heat dissipation portion

Claims (14)

A plurality of light emitting diodes; And
A module substrate including a substrate portion on which the plurality of light emitting diodes are disposed and a heat dissipation portion bent from the substrate portion,
The module substrate may include a metal layer having a first width; An insulating layer having a second width smaller than a first width on the metal layer; And a wiring layer on the insulating layer,
The light emitting module of the module substrate is formed of the metal layer. The semiconductor device of claim 1, wherein the metal layer comprises: a first heat dissipation unit disposed in the substrate unit; And a second heat dissipation unit disposed in the heat dissipation unit,
The second heat dissipation unit is a light emitting module spaced apart from the insulating layer and the wiring layer. The light emitting module of claim 3, wherein a distance between the bent portion and the insulating layer between the heat dissipation portion and the substrate portion of the module substrate is 0.8 mm to 1 mm. The light emitting module according to any one of claims 1 to 3, wherein the metal layer has a thickness thinner than that of the insulating layer. The light emitting module of claim 4, wherein the metal layer is formed of Cu material. The light emitting module of claim 4, wherein the metal layer has a thickness of 50 μm ± 5 μm. The light emitting module of claim 1, wherein the substrate of the module substrate is bent at a right angle from the heat radiating portion. A bottom cover including a bottom portion and a first side portion bent from the bottom portion;
A light guide plate on the bottom cover; And
A module substrate including a substrate portion disposed inside the first side surface portion of the bottom cover, and a heat dissipation portion bent from the substrate portion and disposed on a bottom portion of the bottom cover; And a light emitting module disposed on the substrate portion of the module substrate and including a plurality of light emitting diodes corresponding to at least one side of the light guide plate.
The module substrate may include a metal layer having a first width; An insulating layer having a second width smaller than a first width on the metal layer; And a wiring layer on the insulating layer. The backlight unit of claim 8, further comprising a recess in which a heat dissipation portion of the module substrate is inserted into a bottom portion of the bottom cover. The backlight unit of claim 8, wherein the heat dissipation part of the module substrate comprises the metal layer. The semiconductor device of claim 10, wherein the metal layer comprises: a first heat dissipation unit on which the insulation layer is disposed; And a second heat dissipation part spaced apart from the insulating layer. The backlight unit of claim 8, wherein an interval between the bent portion and the insulating layer between the heat dissipating portion and the substrate portion of the module substrate is 0.8 mm to 1 mm. The backlight unit of claim 8, wherein the metal layer has a thickness thinner than that of the insulating layer and is formed of a Cu material. The backlight unit of claim 8, further comprising an adhesive member between the metal layer of the module substrate and the side portion and the bottom portion of the bottom cover.

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