KR20130003796U - Apparatus for drying semiconductor devices - Google Patents

Abstract

An apparatus for drying semiconductor devices is disclosed. The apparatus includes a support plate for supporting a plurality of semiconductor elements, a drying plate formed on the support plate and having a plurality of suction holes for sucking and removing water on the semiconductor elements and the support plate; And a driving part connected to the drying plate and moving the drying plate in a vertical direction to position the drying plate adjacent to an upper surface of the semiconductor elements supported on the support plate. Since the moisture may be sufficiently removed using the dry plate, a more accurate inspection image of the semiconductor devices positioned on the support plate may be obtained.

Description

Apparatus for drying semiconductor devices

Embodiments of the present invention relate to an apparatus for drying semiconductor devices. More particularly, the present invention relates to an apparatus for drying semiconductor elements cleaned after cutting in a cutting and sorting process of semiconductor elements.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be bonded to a plurality of semiconductor devices through a dicing process and a die- Lt; / RTI > semiconductor strips.

The semiconductor strips fabricated as described above may be individualized through a sawing and sorting process and classified according to good or defective product judgment. The cutting and sorting process loads the semiconductor strip onto a chuck table and then individualizes the plurality of semiconductor elements using a cutting blade, and the individual semiconductor elements are collectively picked up by a pick-up device and cleaned and dried .

After the cleaning process of the semiconductor devices is completed, the semiconductor devices may be placed on a support plate of a table assembly known as a buffer table and dried on the support plate. The semiconductor devices cleaned and dried as described above may be loaded from the buffer table to the pallet table for inspection and transport.

Meanwhile, when transferred from the buffer table to the pallet table, the semiconductor devices may be transferred to the pallet table in an inverted state by the inversion mechanism. In addition, an inspection process for classifying the semiconductor devices may be performed. For example, the front and rear surfaces of the semiconductor devices positioned in the buffer table and the pallet table may be inspected. The inspection process may be performed by acquiring an inspection image of the semiconductor devices and analyzing the inspection image by using a vision device.

Subsequently, the semiconductor elements stacked on the pallet table may be transferred to a good or bad tray according to a result determined in the inspection process, that is, a good or bad item.

However, when performing the inspection process through the vision camera in the buffer table, that is, the table assembly, foreign substances such as moisture supplied in the cleaning process may remain on the table assembly, thereby making it difficult to acquire the inspection image. have. Specifically, the illumination light may be reflected by moisture on the table assembly, thereby making it difficult to obtain an accurate inspection image, and as a result, the reliability of the inspection process may be greatly reduced.

Embodiments of the present invention have an object to provide a device capable of sufficiently drying the semiconductor device in order to improve the reliability of the inspection process for the semiconductor device to solve the above problems.

According to embodiments of the present invention, a semiconductor device drying apparatus includes a support plate for supporting a plurality of semiconductor devices, and disposed on the support plate to suck and remove moisture on the semiconductor devices and the support plate. A drying plate having a plurality of suction holes, and a driving part connected to the drying plate and moving the drying plate in a vertical direction to position the drying plate adjacent to upper surfaces of semiconductor elements supported on the support plate. can do.

According to embodiments of the present invention, a lower surface of the drying plate may be provided with a plurality of spacers in close contact with the upper surface of the semiconductor elements by the drive unit, the suction holes may be disposed between the spacers have.

According to embodiments of the present invention, the support plate may be provided with a plurality of vacuum holes for adsorbing the semiconductor elements.

According to embodiments of the present invention, the support plate may be provided with a plurality of through holes, and the plurality of support pads are inserted into the through holes to protrude from the upper surface of the support plate, respectively, to support the semiconductor elements. The upper surface portions of the support plate adjacent to the through holes may be provided with a plurality of second suction holes for sucking and removing the moisture from the upper surface of the support plate.

According to embodiments of the present invention, the second suction holes are a plurality of main suction holes extending in a horizontal direction in the support plate and an upper surface branched from the main suction holes and adjacent to the through holes. It may include branch suction holes extending to the parts.

According to embodiments of the present invention, each support pad may have a smaller area than the semiconductor device, and the second suction holes may be located below an edge portion of the semiconductor device supported by the support pad.

According to embodiments of the present invention, a base having a flat upper surface may be provided, and the support plate may be disposed on the base.

According to embodiments of the present invention, a heater for drying the semiconductor elements may be built in the base.

According to embodiments of the present invention, each support pad may be provided with a vacuum hole for adsorbing the semiconductor device.

According to the embodiments of the present invention, foreign matters such as moisture remaining on the support plate on which the semiconductor devices are placed can be sufficiently sucked and removed through the suction holes formed in the drying plate and the support plate. Accurate inspection images can be obtained.

As a result, the reliability of the inspection process for the semiconductor devices located on the support plate can be greatly improved, and the classification errors of the semiconductor devices due to inaccurate inspection results that can occur in the prior art can be greatly reduced. have.

1 and 2 are schematic configuration diagrams illustrating an apparatus for drying semiconductor devices according to an embodiment of the present invention.
3 and 4 are schematic configuration diagrams illustrating an apparatus for drying semiconductor devices according to another embodiment of the present invention.
FIG. 5 is an enlarged cross-sectional view illustrating the support pad and the second suction holes illustrated in FIG. 3.
FIG. 6 is a schematic plan view for explaining the support plate of FIG. 3.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the present invention to those skilled in the art, rather than to allow the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used below is for the purpose of describing particular embodiments only and is not intended to limit the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by one of ordinary skill in the art to which this invention belongs, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed as having a meaning consistent with their meaning in the context of the description of the relevant art and the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not intended to be limited to the particular shapes of the areas described as illustrations, but include deviations in the shapes, and the areas described in the figures are entirely schematic and their shapes. Are not intended to describe the precise shape of the region nor are they intended to limit the scope of the present invention.

1 and 2 are schematic configuration diagrams illustrating an apparatus for drying semiconductor devices according to an embodiment of the present invention.

1 and 2, an apparatus 100 for drying semiconductor devices according to an exemplary embodiment of the present invention is a strip in which a plurality of semiconductor devices 10 are mounted to manufacture semiconductor devices 10. The semiconductor devices 10 may be cut to separate the semiconductor devices 10, and the semiconductor devices 10 may be inspected and classified.

Specifically, the semiconductor devices 10 individualized in the cutting process may be picked up by a pickup device and then transferred from the cutting module to the cleaning module, and the semiconductor devices 10 cleaned by the cleaning module may be picked up. By the device can be transported onto the support plate 110 of the drying device 100. However, foreign matter such as moisture provided in the cleaning process may remain on the support plate 110 on which the semiconductor devices 10 are placed. In this case, the semiconductor devices 10 on the support plate 110 may be inspected. In order to obtain a test image for the semiconductor device 10 may cause a problem.

In particular, the moisture may inaccurate the inspection image acquired by the vision camera (not shown), thereby causing an inspection error in the process of analyzing the inspection image.

The semiconductor device drying apparatus 100 according to the exemplary embodiment of the present invention may be configured to easily remove the moisture remaining on the support plate 110 and the semiconductor devices 10.

A drying plate 120 having a plurality of suction holes 122 for sucking and removing moisture on the semiconductor elements 10 and the support plate 110 may be disposed on the support plate 110. The drying plate 120 may be connected to the driving unit 130 to be movable in the vertical direction. In particular, the driving unit 130 moves the drying plate 120 in a vertical direction such that the drying plate 120 is positioned adjacent to the upper surfaces of the semiconductor devices 10 supported on the support plate 110. You can.

For example, a pneumatic or hydraulic cylinder may be used as the driving unit 130. However, the driving unit 130 may include a linear motion mechanism using a motor, a ball screw, and the like, and may be variously changed as necessary. Therefore, the scope of the present invention will not be limited by the configuration of the drive unit 130.

According to the exemplary embodiment of the present invention, as shown in FIGS. 1 and 2, the lower surface of the drying plate 120 is in close contact with the upper surfaces of the semiconductor devices 10 by the driving unit 130. Spacers 124 may be provided. The spacers 124 may be provided to prevent the lower surface of the drying plate 120 from directly contacting the upper surfaces of the semiconductor devices 10.

In particular, the spacers 124 may have a cross-sectional area gradually decreased downward as shown in FIGS. 1 and 2. For example, the spacers 124 may have a cone shape, a polygonal pyramid shape, or a prism shape. In addition, the spacers 124 may be made of an elastic material, for example, rubber, to prevent damage to the semiconductor devices 10.

According to an embodiment of the present invention, the suction holes 122 may be disposed between the spacers 124. In addition, the drying plate 120 may be provided with a suction chamber 126 that is connected to the suction holes 122, the suction chamber 126 is a suction device 140, for example, a fan ( fan) or pump. As a result, the moisture remaining on the support plate 110 and the semiconductor elements 10 may be sufficiently sucked through the suction holes 122 and the suction chamber 126 to be removed.

Meanwhile, a base 150 having a flat upper surface may be disposed below the support plate 110. Although not shown, the support plate 110 may be coupled to the base 150 using fastening members such as bolts.

The support plate 110 may be provided with a plurality of vacuum holes 112 for adsorbing the semiconductor devices 10, and communicates with the vacuum holes 112 on an upper surface of the base 150. Recesses may be provided. Accordingly, a vacuum chamber 152 defined by the support plate 110 and the recess may be provided between the support plate 110 and the base 150, and the vacuum chamber 152 may be vacuumed. May be coupled to system 160. That is, the vacuum chamber 152 may function as a vacuum manifold for uniformly providing a vacuum to the plurality of vacuum holes 112.

In addition, a heater 170 for drying the semiconductor devices 10 may be embedded in the base 150. In particular, moisture remaining on the support plate 110 and the semiconductor elements 10 may be vaporized by the heater 170, and the vaporized moisture is sufficiently removed through the suction holes 122. Can be. Therefore, the reliability of the inspection process for the semiconductor devices 10 positioned on the support plate 110 may be greatly improved. As an example, an electric resistance heating wire or the like may be used as the heater 170.

3 and 4 are schematic configuration diagrams illustrating an apparatus for drying semiconductor devices according to another embodiment of the present invention. FIG. 5 is an enlarged cross-sectional view for explaining the support pad and the second suction holes shown in FIG. 3, and FIG. 6 is a schematic plan view for explaining the support plate in FIG. 3.

3 to 6, the illustrated semiconductor device drying apparatus 200 includes a support plate 210 for supporting a plurality of semiconductor devices 10, the semiconductor devices 10, and the support plate ( A drying plate 230 having a plurality of first suction holes 232 for sucking and removing moisture remaining on the 210, and a driving unit 240 for moving the drying plate 230 in a vertical direction. It may include. A plurality of spacers 234 may be provided on a lower surface of the drying plate 230, and a suction chamber 236 connected to the first suction device 250 may be provided therein.

The drying plate 230, the spacers 234, and the driving unit 240 are the same as or similar to those described above with reference to FIGS. 1 and 2, and thus, further description thereof will be omitted.

A plurality of through holes 212 may be provided in the support plate 210, and a plurality of support pads 220 for supporting the semiconductor elements 10 may be provided in the through holes 212, respectively. Can be inserted.

The support pads 220 protrude from the upper surface of the support plate 210, that is, between the semiconductor devices 10 placed on the support pads 220 and the upper surface of the support plate 210. The through holes 212 may be inserted to form a predetermined gap. In this case, an area occupied by each of the support pads 220 may be smaller than that of the semiconductor device 10. Since the spacing between the semiconductor devices 10 is only about several tens of micrometers corresponding to the thickness of the cutting blades used in the cutting process, the support pads 220 are made larger than the semiconductor devices 10. This is because it is not possible to form the through holes 212 in the support plate 210.

In addition, protruding the support pads 220 from the upper surface of the support plate 210 by a predetermined height may include the semiconductor devices 10 and the support plate 210 disposed on the support pads 220. This is to prevent direct contact between the upper surfaces of the semiconductor devices 10 and the upper surface of the plate 210 so as to more easily remove moisture.

The support plate 210 may have a plurality of second suction holes 214 and 216 for sucking and removing moisture from upper surface portions adjacent to the through holes 212. In particular, the second suction holes 214 and 216 are adjacent to the support plates 210 adjacent to the through holes 212 to remove moisture remaining between the semiconductor elements 10 and the support plate 210. It may be formed in the upper surface portions of the). That is, the suction holes 214 and 216 may be disposed below edge portions of the semiconductor devices 10 supported by the support pads 220.

According to another embodiment of the present invention, a plurality of main suction holes 214 and the main suction holes extending in the horizontal direction in the support plate 210 as shown in the second suction holes (214, 216) Branch suction holes 216 may be formed to branch from the holes 214 and extend to upper surface portions adjacent to the through holes 212. As shown in FIG. 6, the main suction holes 214 may be formed to be orthogonal to each other in the form of a checkerboard in the support plate 210, and the branch suction holes 216 may be adjacent main suctions. It may be connected to the holes 214.

On the other hand, as shown in Figure 5, the upper portion of the through-holes 212, that is, the corner portions where the upper surface of the support plate 210 and the inner surface of the through-holes 212 may be chamfered. The branch suction holes 216 may extend obliquely downward from the chamfered surfaces 219. This is to improve the processability of the branch suction holes 216 and to facilitate the connection with the main suction holes 214 passing between the adjacent through holes 212.

As described above, the branch suction holes 216 are disposed below the edges of the semiconductor elements 10 supported by the support pads 220, and the upper portions of the through holes 212 are chamfered. Therefore, the gap between the upper surface of the support plate 210 and the semiconductor devices 10 may be increased. Therefore, moisture remaining between the upper surface of the support plate 210 and the semiconductor elements 10 may be more easily sucked and removed.

According to another embodiment of the present invention, a base 260 having a flat upper surface may be disposed below the support plate 210, and the support plate 210 is coupled to an upper surface of the base 260. Can be.

The lower surface of the support plate 210 may be provided with a suction groove 218 having a ring shape surrounding the periphery of the through holes 212, as shown in Figure 6, the base 260 At least one lower suction hole 262 connected to the suction groove 218 may be provided. In this case, the lower suction hole 262 may be connected to a second suction device 252, for example, a fan or a pump, for sucking and removing foreign matter including the moisture. As a result, the moisture remaining on the upper surface of the support plate 210 is divided into the branch suction holes 216 formed around the through holes 212 and the main suction holes formed in the support plate 210. 214 and the lower suction hole 262 of the base 260 may be sufficiently removed.

Referring back to FIG. 5, vacuum holes 222 may be formed in the support pads 220 to adsorb the semiconductor devices 10, and the vacuum holes 222 may be formed in the base 260. ) May be connected to the vacuum system 270. In particular, a recess 224 connected to the vacuum hole 222 may be provided on the upper surfaces of the support pads 220. Accordingly, the semiconductor devices 10 and the support pads 220 may be provided. Vacuum chambers defined by the semiconductor devices 10 and the recesses 224 may be provided therebetween. The vacuum chambers may improve the adsorption force on the semiconductor devices 10 by increasing the area in which the vacuum pressure provided through the vacuum holes 222 acts on the semiconductor devices 10.

Meanwhile, as illustrated in FIG. 3, a recess 264 communicating with the vacuum holes 222 may be provided on the upper surface of the base 260. Accordingly, a vacuum chamber defined by the support plate 210 and the recess 264 may be provided between the support plate 210 and the base 264, and the vacuum chamber may include the vacuum system ( 270).

In addition, a heater 280 for drying the semiconductor devices 10 may be built in the base 260. Accordingly, moisture remaining on the support plate 210 and the semiconductor devices 10 may be vaporized by the heater 280, and the first suction holes 232 and the second suction holes may also be vaporized. Since it can be sufficiently removed through (214, 216), the reliability of the inspection process for the semiconductor devices 10 positioned on the support plate 210 can be greatly improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as set forth in the following claims And changes may be made without departing from the spirit and scope of the invention.

10: semiconductor element 100: semiconductor element drying apparatus
110: Support plate 112: Vacuum hole
120: drying plate 122: suction hole
124: spacer 126: suction chamber
130: drive unit 140: suction device
150: base 160: vacuum system
170: heater

Claims (9)

A support plate for supporting a plurality of semiconductor elements;
A drying plate disposed on an upper portion of the support plate and having a plurality of suction holes for sucking and removing moisture on the semiconductor elements and the support plate; And
And a drive unit connected to the drying plate and moving the drying plate in a vertical direction to position the drying plate adjacent to an upper surface of the semiconductor elements supported on the support plate. The semiconductor device of claim 1, wherein a plurality of spacers are provided on the lower surface of the drying plate to be in close contact with the upper surfaces of the semiconductor devices by the driving unit, and the suction holes are disposed between the spacers. Device for drying the field. The apparatus of claim 1, wherein the support plate is provided with a plurality of vacuum holes for adsorbing the semiconductor devices. According to claim 1, The support plate is provided with a plurality of through holes,
The through holes are provided with a plurality of support pads which are inserted to protrude from the upper surface of the support plate to support the semiconductor elements.
The upper surface portions of the support plate adjacent to the through holes are provided with a plurality of second suction holes for sucking and removing the moisture from the upper surface of the support plate. Device for. The method of claim 4, wherein the second suction holes are a plurality of main suction holes extending in the horizontal direction inside the support plate and to the upper surface portions adjacent to the through holes branched from the main suction holes. And extending branch suction holes. The semiconductor device of claim 4, wherein each of the support pads has an area smaller than that of the semiconductor device, and the second suction holes are positioned below an edge of the semiconductor device supported by the support pad. Device for 5. The apparatus of claim 4, further comprising a base having a flat top surface, wherein the support plate is disposed on the base. 8. The apparatus of claim 7, wherein a heater is built in the base to dry the semiconductor elements. The apparatus of claim 4, wherein each support pad is provided with a vacuum hole for adsorbing the semiconductor device.

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