KR20120122907A - Splicing device - Google Patents

Abstract

The bonding apparatus disclosed in this specification conveys the mechanism comprised so that the strip | belt-shaped flexible base material containing the laminated transfer layer and the support layer may be conveyed, the mechanism comprised so that the sheet-shaped rigid base material may be conveyed, and the strip | belt-shaped flexible base material A coating mechanism configured to coat the pressure-sensitive adhesive on the transfer layer, a mechanism configured to cut the transfer layer coated with the adhesive into a sheet shape while conveying a band-shaped flexible substrate, a band-shaped flexible substrate and a sheet shape The bonding mechanism comprised so that the transfer layer cut | disconnected in the sheet form to the rigid base material may be bonded together via an adhesive, conveying the rigid base material of this.

Description

Junction Device {LAMINATION APPARATUS}

The present invention relates to a bonding apparatus for laminating a flexible substrate to a rigid substrate through an adhesive.

Recently, various electronic devices represented by display devices have been developed. Such an electronic device includes a circuit board on which circuit devices such as a thin film transistor (TFT) for driving are mounted in order to implement various functions such as a display function.

As a support base material of a circuit board, rigid base materials, such as a glass plate, are used widely. However, in order to realize a flexible electronic device, using flexible base materials, such as a plastic film, is examined. In this case, since it is necessary to form a circuit element such as TFT on the surface of the flexible substrate, it is necessary to fix the flexible substrate against deformation such as deflection and strain.

In order to support a flexible base material using a rigid base material, it is proposed to join a flexible base material to a rigid base material through an adhesive, for example as disclosed in patent documents 1-3. For example, Non-Patent Document 1 proposes and discloses a device for joining.

Japanese Patent Laid-Open No. 2006-237542 Japanese Patent Laid-Open Publication No. 2007-251080 Japanese Patent Laid-Open Publication No. 2009-246090

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Conventionally, since a flexible base material is bonded to a rigid base material using an adhesive, long time is required and work efficiency is not high enough. In addition, if the bonding takes too much time, the performance of the pressure-sensitive adhesive decreases due to moisture absorption and the like, so that the flexible substrate easily peels off from the rigid substrate after bonding.

Therefore, it is desirable to provide a bonding apparatus capable of efficiently bonding a flexible substrate to a rigid substrate in a short time through an adhesive.

According to one embodiment of the invention disclosed herein, a mechanism configured to convey a belt-like flexible substrate including a laminated transfer layer and a support layer, a mechanism configured to convey a sheet-shaped rigid substrate, and A coating mechanism configured to coat the adhesive on the transfer layer while conveying the band-shaped flexible substrate, a mechanism configured to cut the transfer layer coated with the adhesive into a sheet shape while conveying the band-shaped flexible substrate; There is provided a bonding apparatus including a bonding mechanism configured to bond a transfer layer cut into a sheet shape to a rigid substrate through an adhesive while conveying a band-shaped flexible substrate and a sheet-shaped rigid substrate.

According to the bonding apparatus according to one embodiment of the present invention, the transfer layer is coated into a sheet after the adhesive is coated on the transfer layer while conveying the band-shaped flexible substrate and the sheet-shaped rigid substrate including the support layer and the transfer layer. Cut. Thereafter, the cut transfer layer is bonded to the rigid substrate. Therefore, the flexible substrate can be efficiently bonded to the rigid substrate in a short time through the pressure-sensitive adhesive.

1 and 2 schematically show the configuration of a bonding apparatus according to an embodiment of the present invention disclosed herein.
3 is a cross-sectional view showing the configuration of a flexible base material.
4 (a) to 4 (e) are schematic cross-sectional views illustrating the operation of the bonding apparatus.

These and other features and advantages of the disclosed invention are apparent from the following detailed description and the accompanying drawings, in conjunction with the accompanying drawings, in which like elements are designated by like reference numerals.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention disclosed in this specification is described in detail with reference to drawings. The order of explanation is as follows.

1. Composition of the bonding device

2. Operation of the bonding device

<1. Configuration of Bonding Device>

First, the structure of the bonding apparatus which concerns on one Embodiment of this invention is demonstrated. 1 and 2 schematically show the configuration of the bonding apparatus, and FIG. 3 shows the cross-sectional structure of the flexible substrate 1 to be put into the bonding apparatus. In FIG. 1 and FIG. 2, in order to make clear the conveyance path | route of the flexible base material 1, the state in which the flexible base material 1 is conveyed is shown.

The bonding apparatus of this invention is used in order to bond the flexible base material 1 to the rigid base material 2 via an adhesive. Although the use of the flexible base material 1 bonded to the rigid base material 2 is not specifically limited, For example, the flexible base material 1 is applied to the support base material of the circuit board applied to the electronic device of various uses. . Such an electronic device may be a display device such as a liquid crystal display device, an organic electroluminescence (EL) device or an electronic paper display device, or may be a device for other uses other than the display use.

1 and 2, the bonding apparatus includes conveying mechanisms 10 and 20, a coating mechanism 30, a cutting mechanism 40, and a bonding mechanism 50. The coating mechanism 30, the cutting mechanism 40, and the bonding mechanism 50 are arranged along the conveyance path of the flexible base material 1. Moreover, the bonding apparatus may further include the drying mechanism 60, the buffer mechanism 70, the heating mechanism 80, and the washing | cleaning mechanisms 90 and 91, for example.

Referring to FIG. 3, the flexible substrate 1 includes a support layer or protective layer 1A and a transfer layer 1B stacked on each other and has a so-called band shape. Since the "strip shape" is sufficiently large in length compared with the width, the flexible base material 1 extends in the longitudinal direction, and refers to a form that can be wound in a so-called roll (shape. The supporting layer 1A is a transfer layer 1B. ) Is detachably supported, and the transfer layer 1B is peeled off from the support layer 1A and bonded to the rigid substrate 2. However, the flexible substrate 1 is supported by the support layer 1A and the transfer, if necessary. Some other layers may be included together with layer 1B.

The support layer 1A and the transfer layer 1B are not particularly limited as long as they have flexibility, but may be formed of, for example, a plastic film. The material of the plastic film is, for example, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyetherimide, polyether ether ketone, polyphenylene sulfide, polyarylate, polyimide, polyamide, Polycarbonate, cellulose triacetate, polyolefin, polystyrene, polyethylene, polypropylene, polymethylmethacrylate, polyvinyl chloride, polyvinylidene chloride, epoxy resin, phenolic resin, urea resin, Melamine resin, silicone resin or acrylic resin. However, the support layer 1A and the transfer layer 1B may be formed of the same material or may be formed of different materials.

The rigid base material 2 is what is called a sheet form. In this specification, "stiffness" means the property which can be stably supported so that the transfer layer 1B bonded to the rigid base material 2 may not deform | transform. In addition, in this specification, a "sheet shape" means that it is different from the strip | belt-shaped flexible base material 1 extended in a longitudinal direction, and that the rigid base material 2 is a some flat plate shape separated from each other. Although the rigid base material 2 will not be specifically limited if it has rigidity, For example, it is glass plates, such as a quartz plate or heat resistant glass. In addition, the rigid base material 2 may be a metal plate or a ceramic plate, for example. In addition, it should be noted that the constituent conditions of the rigid base material 2 are preferably determined in consideration of not only the rigidity mentioned above but also the temperature conditions, handleability, etc. of the post-process in which the rigid base material 2 is injected after bonding. These structural conditions of the rigid base material 2 are melting | fusing point = about 500 degreeC or more, linear expansion coefficient = 10 ppm or less, thickness = 0.4 mm or more, for example. "Post-process" is a process of forming circuit elements, such as TFT, on the transfer layer 1B.

The conveyance mechanism 10 is a mechanism which conveys the strip | belt-shaped flexible base material 1, and is a delivery roll 11, the cleaning roll 12, the feed rolls 13-18, and a winding roll. (take-up roll; 19). These rolls are rotatable about their respective axes at their centers, ie about an axis extending along the X axis shown in FIGS. 1 and 2. Arrows pasted for each roll in FIG. 1 and FIG. 2 indicate the rotational direction of the roll. The conveyance mechanism 10 conveys the flexible base material 1 so that the transfer layer 1B of the flexible base material 1 may become the outer surface of the flexible base material 1, for example.

In the unwinding roll 11, the flexible base material 1 before joining was wound in roll shape, and the winding roll 19 is the flexible base material 1 after joining being wound in roll shape. The unwinding speed and the winding speed of the flexible base material 1 can be adjusted for every roll. The feed rolls 13-18 guide the flexible base material 1 supplied from the release roll 11 to the winding roll 19 through the mechanism mentioned above. The cleaning roll 12 is arrange | positioned in front of the coating mechanism 30, for example, and wash | cleans the surface of the transfer layer 1B by which the adhesive is coated by the coating mechanism 30. As shown in FIG. However, ultrasonic cleaning or the like may be used instead of the cleaning roll 12. It should be noted that the feed roll 15 is, for example, a speed adjusting roll capable of adjusting the rotational speed in order to realize the function of the buffer mechanism 70 described later.

The conveyance mechanism 20 is a mechanism which conveys the sheet-shaped rigid base material 2 along the path | route different from the conveyance mechanism 10, The preparation chamber 21, the collection chamber 22, and the feed rolls 23 and 24 are shown. It includes a moving body 25 supported at opposite ends by the. These rolls are rotatable about their respective axes at their centers, ie about axes extending along the X axis. In addition, the arrow attached to each roll in FIG. 1 and FIG. 2 shows the rotation direction of a roll.

The preparation chamber 21 is a space which stocks the rigid base material 2 before joining, and the several rigid base material 2 is accommodated in the preparation room 21, for example. The plurality of rigid base materials 2 are continuously conveyed by the conveyance mechanism 20. In FIG. 2, a part of the rigid base material 2 is conveyed from the preparation chamber 21 to the recovery chamber 22. The recovery chamber 22 is located on the opposite side of the preparation chamber 21 via the joining mechanism 50 to accommodate the rigid substrate 2 after the joining. The feed rolls 23 and 24 are individually arrange | positioned inside the preparation chamber 21 and the collection chamber 22, respectively, for example. The movable body 25 can be wound around the feed rolls 23 and 24 so that the feed rolls 23 and 24 are rotation support shafts, and the movable bodies 25 are slidably moved in accordance with the rotation of the feed rolls 23 and 24. . The feed rolls 23 and 24 and the moving body 25 may be a belt conveyor etc., for example. In addition, it should be noted from the recovery chamber 22 that the rigid base material 2 after joining can be carried out to the exterior as needed.

The coating mechanism 30 is a mechanism which coats an adhesive on the transfer layer 1B, conveying the strip | belt-shaped flexible base material 1, The coating apparatus 31, the adhesive supply apparatus 32, and a film thickness test instrument (33). The coating mechanism 30 except the film thickness inspection instrument 33 is disposed between the unwinding roll 11 and the drying mechanism 60 along the conveyance path of the flexible base material 1, for example.

The coating apparatus 31 coats the adhesive, especially the adhesive solution supplied from the adhesive supply apparatus 32, on the surface of the transfer layer 1B. The coating method is not particularly limited, but may be, for example, die coating, gravure coating, knife coating, lip coating, slit coating, spray coating, or the like. The adhesive supply apparatus 32 supplies an adhesive to the coating apparatus 31 from the automatic stirring apparatus which mixes and stirs an organic solvent etc. with main resin and hardening | curing agent which are constituent materials of an adhesive, for example, and an automatic stirring apparatus. Pumps and the like. It is preferable that an automatic stirring device can adjust the supply amount of an adhesive. The film thickness measuring instrument 33 measures the film thickness of the pressure-sensitive adhesive coated by the coating apparatus 31, and is, for example, an infrared film thickness gauge. Although the position of the film thickness test | inspection gauge 33 is not specifically limited, For example, in order to measure the film thickness of the adhesive after drying, the drying mechanism 60 and the buffer mechanism along the conveyance path of the flexible base material 1 ( 70). It should be noted that the coating device 31 may be configured to be able to adjust the coating amount of the pressure-sensitive adhesive in accordance with the film thickness measured by the film thickness inspection instrument 33.

Although the kind of adhesive is not specifically limited, For example, an acrylic adhesive, a silicone adhesive, a siloxane-based adhesive, or a natural rubber adhesive can be used. In particular, it is preferable to use the adhesive which has sufficient heat resistance on the temperature conditions of the post process to which the transfer layer 1B joined to the rigid base material 2 is injected. More specifically, an adhesive having a thermal weight reduction at peak temperature of less than about 1% is preferable, and an adhesive having less than about 0.1% is more preferable. "Temperature condition of a post process" is formation temperature of circuit elements, such as TFT, for example.

The cutting mechanism 40 is a mechanism for cutting the transfer layer 1B coated with an adhesive into a sheet shape while conveying the band-shaped flexible substrate 1, and includes, for example, a cutter 41. The cutting mechanism 40 is disposed, for example, between the buffer mechanism 70 and the bonding mechanism 50 along the conveyance path of the flexible substrate 1.

The cutter 41 includes a single blade or a pull blade between the position P1 evacuated from the conveyance path of the flexible substrate 1 and the position P2 capable of cutting the transfer layer 1B. Can be moved from It should be noted, however, that the cutter 41 may be of a type capable of performing remote cutting such as a laser cutting device. In any case, the cutter 41 can cut only the transfer layer 1B without cutting the support layer 1A while conveying the flexible base material 1. It should be noted that the cutting position or range of the transfer layer 1B is arbitrarily determined as long as the transfer layer 1B can be cut into a sheet shape, and may be a whole width or a desired area narrower than the full width.

The bonding mechanism 50 bonds the transfer layer 1B cut | disconnected in sheet form to the rigid base material 2 via an adhesive, conveying a strip | belt-shaped flexible base material 1 and the sheet-shaped rigid base material 2. It is a mechanism to make, and includes the adhesive roll 51. The bonding mechanism 50 is arranged between the cutting mechanism 40 and the winding roll 19 along the conveyance path of the flexible base material 1, for example, and the arrangement position of the adhesive roll 51 is a rigid base material. It is a position which overlaps with a part of conveyance path of (2).

The drying mechanism 60 is a mechanism for heating and drying the pressure-sensitive adhesive coated on the transfer layer 1B, and includes a drying hood 61. The drying mechanism 60 is disposed between the coating mechanism 30 and the buffer mechanism 70, for example, along the conveyance path of the flexible substrate 1. While the heat treatment by the drying mechanism 60 removes volatile components, such as an organic solvent, it also plays the role which accelerates hardening reaction of main resin in an adhesive, etc. The drying hood 61 includes a plurality of heaters in the hood. Although dry conditions, such as heating temperature by the drying mechanism 60, are not specifically limited, For example, it is preferable to determine according to the kind of adhesive or hardening temperature.

The buffer mechanism 70 conveys the flexible base material 1 in order to solve the speed difference of the conveyance speed which arises due to the difference in time required for the process performed on the flexible base material 1 by a different mechanism. It is to increase or decrease the distance temporarily, and includes the moving roll 71, for example. The moving roll 71 is movable while supporting the strip | belt-shaped flexible base material 1 so that a conveyance of the strip | belt-shaped flexible base material 1 is possible between the position P4 and the position P4 which are far from the conveyance path | route of the strip-shaped flexible base material 1.

The buffer mechanism 70 may be disposed between two different mechanisms that generate a speed difference in the conveyance speed along the conveyance path of the flexible substrate 1, and the position of the buffer mechanism 70 is not particularly limited. . Here, for example, it is assumed that the time required for the coating treatment by the coating mechanism 30 is longer than the time required for the coating treatment by the bonding mechanism 50. Accordingly, the buffer mechanism 70 is disposed between the coating mechanism 30 and the bonding mechanism 50, and more specifically, between the drying mechanism 60 and the cutting mechanism 40.

The principle of solving the speed difference by the buffer mechanism 70 is as follows. Due to the difference in the treatment time described above, the bonding treatment by the bonding mechanism 50 is completed in a short time, but the coating treatment by the coating mechanism 30 requires a long time. Therefore, in such a state, the conveyance speed of the flexible base material 1 must be determined so that it may become the same as the conveyance speed suitable for the coating process which requires a lower speed. Therefore, at the time of joining, the moving roll 71 is moved from the position P3 to the position P4 so that the conveyance speed of the flexible base material 1 can be temporarily increased in the conveyance path | route back before the buffer mechanism 70. As a result, when the winding speed is faster than the unwinding speed, the amount of the flexible base material 1 supplied to the bonding mechanism 50 is temporarily increased, so that the flexible base material 1 of the flexible base material 1 in the conveying path after the buffer mechanism 70 can be increased. The conveying speed can be increased locally. At this time, since the rotation speed of the feed roll 15 which is a speed adjusting roll is kept constant regardless of the operation of the buffer mechanism 70, in the conveyance path | route before the buffer mechanism 70, of the flexible base material 1 The conveying speed is kept constant. It should be noted that after the joining process of the joining mechanism 50 is completed, the moving roll 71 is returned from the position P4 to the position P3 in the period until the next joining process is performed. The operation of the buffer mechanism 70 and the like is repeated each time the bonding.

In order to enable the speed difference to be resolved by the buffer mechanism 70, the moving distance of the moving roll 71, that is, the distance between the positions P3 and P4 is equal to or larger than the bonding length between the transfer layer 1B and the rigid base material 2. It is preferable that it is more preferable that the former distance is larger than the latter length.

When different from the above-described case, for example, when the bonding treatment by the bonding mechanism 50 requires a longer time than the coating treatment by the coating mechanism 30, at the time of bonding, the moving roll 71 is moved from the position P4. Note that it is good to move to position P3. This is because the conveyance speed of the flexible base material 1 can be temporarily increased in the conveyance path | route before the buffer mechanism 70 by the same principle. Of course, the buffer mechanism 70 does not necessarily need to be located between the coating mechanism 30 and the bonding mechanism 50 as described above, and is disposed between two mechanisms that generate a speed difference in the conveyance speed. do.

The heating mechanism 80 heats (agings) the transfer layer 1B and the rigid substrate 2 bonded to each other via an adhesive, and has a baking furnace or hot plate inside the processing chamber. a heating device such as a plate). The heating mechanism 80 is preferably disposed along the conveyance path of the rigid substrate 2 in order to shorten the time from the completion of bonding to the start of heating as much as possible. Thereby, the transfer layer 1B and the rigid base material 2 joined to each other are carried in to the heating mechanism 80 promptly inline. By the heat processing of the heating mechanism 80, volatile components, such as the organic solvent which remain in an adhesive, are removed and the adhesive force of an adhesive is stabilized.

The cleaning mechanism 90 cleans the surface of the rigid substrate 2 before bonding, that is, the surface to be bonded to the transfer layer 1B, and includes a cleaning apparatus inside the processing chamber. The washing | cleaning mechanism 90 is arrange | positioned between the preparation chamber 21 and the position corresponding to the bonding mechanism 50 along the conveyance path of the rigid base material 2. Although the washing | cleaning method is not specifically limited, For example, chemical washing | cleaning or abrasive washing | cleaning may be used, A rinse process, a drying process, etc. may be performed after washing | cleaning. Chemical cleaning is, for example, dipping cleaning or shower cleaning using an alkaline solution or the like, and polishing cleaning is, for example, tape polishing or dry ice blasting. Can be.

The cleaning mechanism 91 cleans the surface of the transfer layer 1B after bonding, that is, the surface of the transfer layer 1B in which circuit elements such as TFTs are formed in a later step, for example, the cleaning mechanism 90. ) Has the same configuration. The cleaning mechanism 91 is disposed between the position corresponding to the bonding mechanism 50 and the recovery chamber 22 along the conveyance path of the rigid base material 2.

<2. Operation of Bonding Device>

Now, the operation of the bonding apparatus will be described. 4 (a) to 4 (e) are for explaining the operation of the bonding apparatus, and the cross-sectional structure of the flexible substrate 1, the rigid substrate 2 and the components of the bonding apparatus associated with them are shown. Shown schematically. It should be noted that arrows Y1 and Y2 in FIGS. 3 to 4E show the moving directions of the flexible base material 1 and the rigid base material 2 put into the bonding apparatus, respectively.

In the bonding apparatus, as shown in FIG. 1 and FIG. 3, first, the conveyance mechanism 10 has a band shape so that the transfer layer 1B of the flexible substrate 1 becomes the outer surface of the flexible substrate 1. The flexible base material 1 is conveyed. In this case, the flexible base material 1 is supplied from the unwinding roll 11, and the flexible base material 1 is wound by the winding roll 19. As shown in FIG. In addition, the surface of the transfer layer 1B is cleaned by the cleaning roll 12. In the first half of the conveyance process of the flexible base material 1, as can be seen from FIG. 3, the transfer layer 1B is located above the support layer 1A.

On the other hand, the rigid base material 2 placed on the movable body 25 of the conveyance mechanism 20 is conveyed toward the collection | recovery chamber 22 from the preparation chamber 21 so that the surface joined with the transfer layer 1B may be an upper side. In this case, after the surface of the rigid base material 2 is cleaned by the washing | cleaning apparatus of the washing | cleaning mechanism 90, the rigid base material 2 is thrown into a joining position.

Subsequently, as can be seen in FIG. 4A, the coating apparatus 31 of the coating mechanism 30 adheres to the transfer layer 1B while the belt-like flexible substrate 1 is conveyed. After coating, the drying hood 61 of the drying mechanism 60 heats the adhesive 3 to dry. Although drying conditions are not specifically limited, For example, heating temperature = about 80 degreeC-200 degreeC, and heating time = about 10 minutes-1 hour.

Since the conveyance direction of the flexible base material 1 is reversed by the feed rolls 16 and 17 in the latter part of the conveyance path | route of the flexible base material 1, as can be seen from FIG. Layer 1B is located below support layer 1A. Thereby, the cutting machine 41 of the cutting mechanism 40 opposes the transfer layer 1B, and can cut | disconnect the transfer layer 1B.

Subsequently, as shown in FIG. 4C, the cutter 41 moves from the position P1 to the position P2 to cut only the transfer layer 1B of the flexible base material 1 at predetermined intervals. , 1 C of cutting parts are formed in the flexible base material 1. Thereby, the part prescribed | regulated by the adjacent cut part 1C among the transfer layers 1B is located in the state which can be separated from the support layer 1A. Here, for example, the transfer layer 1B is cut over the entire width.

Subsequently, as can be seen in FIG. 4D, the adhesive roll 51 of the bonding mechanism 50 presses the flexible base material 1 onto the rigid base material 2. Thereby, the part prescribed | regulated by the cutting part 1C among the transfer layers 1B is joined to the rigid base material 2 via the adhesive 3. As a result, the transfer layer 1B is transferred to the rigid substrate 2.

1 and 2, since the moving roll 71 of the buffer mechanism 70 moves from the position P3 to the position P4 at the time of joining, the flexible base material before and after the buffer mechanism 70 ( The speed difference of the conveyance speed of 1) is eliminated.

Thereafter, the flexible base material 1 after the bonding is conveyed toward the winding roll 19, but the rigid base material 2 after the bonding is different from the winding roll 19, that is, in the direction toward the recovery chamber 22. Is returned. As a result, as can be seen in FIG. 4E, the portion defined by the cutting portion 1C in the transfer layer 1B is separated from the support layer 1A.

Subsequently, the transfer layer 1B and the rigid base material 2 bonded to each other are conveyed to the recovery chamber 22 via the cleaning mechanism 91 and the heating mechanism 80 by the transfer mechanism 20. In this case, the surface of the transfer layer 1B is first cleaned by the cleaning device of the cleaning mechanism 91, and then the transfer layer 1B, the pressure-sensitive adhesive 3, and the rigid substrate (by the heating device of the heating mechanism 80). 2) is heated. In this case, heating conditions are not particularly limited, but, for example, heating temperature = about 120 ° C to 200 ° C and heating time = about 1 hour.

[Operation and Effects of Junction Devices]

In this bonding apparatus, the adhesive 3 is carried out to the transfer layer 1B, conveying the strip | belt-shaped flexible base material 1 and the sheet-shaped rigid base material 2 containing the support layer 1A and the transfer layer 1B. The coated transfer layer 1B is bonded to the rigid substrate 2 after the coating is carried out and cut into a sheet shape. In this case, by injecting the band-shaped flexible substrate 1 and the sheet-shaped rigid substrate 2 into one device, the bonding treatment of the flexible substrate 1 and the rigid substrate 2 molded into a sheet shape is performed. It is done continuously inline. Thereby, it is not necessary to prepare the sheet-like flexible base material 1 beforehand, and it is not necessary to use several apparatuses in order to perform a series of processes, such as a coating process, a cutting process, and a bonding process. In addition, since the series of processes do not have to be performed separately from each other, the time required for the series of processes is shortened, and all the processes are completed by only one device. Therefore, the processing efficiency is improved. Thereby, the flexible base material 1 can be efficiently bonded to the rigid base material 2 in a short time via the adhesive 3. In addition, the device can be miniaturized and the occupied area of the device can be reduced.

In particular, if the speed difference of the conveyance speed of the flexible substrate 1 is eliminated by the buffer mechanism 70, a plurality of processes having different processing times can be continuously performed inline while continuously conveying the flexible substrate 1. have.

Moreover, when the transfer layer 1B bonded to the rigid base material 2 is inlined to the heating mechanism 80 via the adhesive 3, absorption of atmospheric moisture etc. by the adhesive 3 is suppressed. Therefore, peeling of the transfer layer 1B due to the adhesive force fall of the adhesive 3 can be prevented.

In addition, when the cleaning mechanism 90 cleans the surface of the rigid base material 2 before joining, foreign matters can be prevented from being mixed in the interface of the joining. In addition, when the cleaning mechanism 91 cleans the surface of the transfer layer 1B after the bonding, foreign matters can be prevented from adhering to the surface of the transfer layer 1B on which circuit elements such as TFTs are formed in a later step. have.

While certain embodiments have been described for the preferred embodiments of the present invention, the disclosed invention is not limited to the embodiments described in the detailed description of the embodiments, but various modifications are possible. For example, the bonding apparatus of this invention is not limited to the circuit board mentioned above, but can be applied to arbitrary other uses, if the flexible base material joined to the rigid base material through the adhesive can be used.

This application includes the relevant subject matter disclosed in Japanese Priority Patent Application No. 2011-101410, filed with the Japan Patent Office on April 28, 2011, the entire contents of which are incorporated herein by reference.

1: flexible substrate
1A: support layer
1B: Transfer Layer
2: rigid substrate
3: adhesive

Claims (4)

As a lamination device,
A mechanism configured to convey a belt-like flexible substrate comprising a laminated transfer layer and a support layer,
A mechanism configured to convey the sheet-shaped rigid substrate,
A coating mechanism configured to coat the adhesive on the transfer layer while conveying the strip-shaped flexible substrate,
A mechanism configured to cut the transfer layer coated with the adhesive into a sheet shape while conveying the strip-shaped flexible substrate;
And a joining mechanism configured to bond the transfer layer cut into a sheet shape to the rigid substrate through the pressure-sensitive adhesive while conveying the band-shaped flexible substrate and the sheet-shaped rigid substrate. The method of claim 1,
A mechanism positioned between the coating mechanism and the bonding mechanism and configured to move while supporting the strip-shaped flexible substrate for conveyance between a position remote and close to the conveyance path of the strip-shaped flexible substrate. Including, the bonding device. The method of claim 1,
And a mechanism configured to heat the transfer layer bonded to the rigid substrate through the pressure sensitive adhesive. The method of claim 1,
And said flexible substrate is a plastic film, and said rigid substrate is a glass plate.

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