KR20120111366A - Method of fabricating solar cell module by using al thin film - Google Patents

Abstract

It provides a solar cell module manufacturing method using a thin aluminum thin film. The solar cell module manufacturing method includes forming a back electrode on a substrate; Scribing and dividing the back electrode; Forming a metal thin film containing at least one of a Group I element, a Group III element, and a Group VI element on the back electrode; Forming a light absorption precursor layer containing at least a Group I element and a Group III element on the metal thin film; Forming a light absorbing layer by heat treating the metal thin film and the light absorbing precursor layer by injecting a Group VI element material; Forming a buffer layer on the light absorption layer; P2 scribing and dividing from the light absorption layer to the buffer layer; Forming an n-type window layer on the buffer layer; And a P3 scribing and dividing process from the light absorbing layer to the n-type window layer. Therefore, by introducing a step of adding a metal thin film between the back electrode and the light absorption precursor layer thin film in the solar cell module manufacturing process, the back electrode due to the P2 scribing process which is a disadvantage of the conventional CIS-based thin film solar cell module manufacturing process and The floating phenomenon between the CIS-based absorbing layer film and the short circuit problem caused by this can be solved.

Description

Method of manufacturing solar cell module using thin aluminum thin film {Method of fabricating solar cell module by using Al thin film.}

The present invention relates to a method for manufacturing a solar cell module, and more particularly to a method for manufacturing a CIS-based thin film solar cell module using a thin aluminum thin film.

Solar cells (Solar Cells or Photovoltaic Cells) are the key elements in photovoltaic power generation that convert sunlight directly into electricity. Solar cells can be classified into inorganic solar cells such as silicon and compound semiconductors made of inorganic materials, and organic solar cells containing organic materials, depending on the constituent materials thereof. Among them, it has a I-III-VI ₂ Group Chalcopyrite compound semiconductor is a direct transition type energy band gap which is represented by CuInSe ₂ (CIS), a light absorption coefficient 1x10 ⁵ cm ^- the increase in semiconductor ^1, a thickness of 1 It is possible to manufacture high efficiency solar cell with a thin film of ~ 2 μm and also has excellent electro-optic stability in the long term. Therefore, it is emerging as a low-cost, high-efficiency solar cell material that can significantly improve the economics of photovoltaic power generation by replacing expensive crystalline silicon solar cells currently used.

When the CIS solar cell is modularized, a scribing process is performed. When the P2 scribing process occurs, the CIS thin film is lifted due to the weak adsorption force between the back electrode and the CIS light absorbing layer thin film. A short circuit occurs between the transparent electrode and the back electrode deposited thereon. As a result, a problem of lowering the efficiency of the thin film solar cell module occurs.

Therefore, there is a need to improve the adsorption force between the back electrode and the CIS light absorbing layer film in order to prevent the lifting phenomenon between the back electrode and the CIS absorbing layer film by the P2 scribing process.

The technical problem to be solved by the present invention is to provide a method of manufacturing a solar cell module to improve the adhesion between the back electrode and the CIS-based light absorption layer film.

Technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above technical problem, an aspect of the present invention comprises the steps of forming a back electrode on the substrate; Scribing and dividing the back electrode; Forming a metal thin film containing at least one of a Group I element, a Group III element, and a Group VI element on the back electrode; Forming a light absorption precursor layer containing at least a Group I element and a Group III element on the metal thin film; Forming a light absorbing layer by heat treating the metal thin film and the light absorbing precursor layer by injecting a Group VI element material; Forming a buffer layer on the light absorption layer; P2 scribing and dividing from the back electrode to the buffer layer; Forming an n-type window layer on the buffer layer; And dividing the light absorbing layer into the n-type window layer by scribing P3.

The element contained in the metal thin film may be selected from Cu, Al, and Se.

The metal thin film may have a thickness of 1 to 50 nm.

The deposition amount of the metal thin film may be 0.1 to 2 at% of the total composition of the group III elements of the light absorption layer.

The heat treatment may be selenization heat treatment or selenization and sulfide heat treatment.

The temperature of the heat treatment may be 350 to 550 ℃.

The light absorption layer may be Cu (In _x Ga _{1- x} ) (Se _y S _{1 -y} ) ₂ (where 0 <X ≦ 1 and 0 <Y ≦ 1).

As described above, according to the present invention, a process of adding a metal thin film between the back electrode and the light absorption precursor layer thin film to the CIS thin film solar cell module manufacturing process is a disadvantage of the conventional CIS thin film solar cell module manufacturing process. The excitation between the back electrode and the CIS light absorbing layer film due to the P2 scribing process and the short circuit caused by this can be eliminated.

However, the effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of a laminated structure of a thin film solar cell module according to an embodiment of the present invention.
2A to 2J are cross-sectional views of a laminate structure of modules according to process steps of a method of manufacturing a thin film solar cell according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. If a layer is said to be "on" another layer or substrate it may be formed directly on the other layer or substrate or a third layer may be interposed therebetween.

Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Like numbers refer to like elements throughout. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In addition, the term "group I element" used in the present invention means that both the Group 1 element and the Group 11 element on the periodic table.

The term "group III element" used in the present invention means to include both group III elements and group 13 elements on the periodic table.

The term "Group VI element" used in the present invention means to include both Group 6 elements and Group 16 elements on the periodic table.

Example

1 is a cross-sectional view of a laminated structure of a thin film solar cell module according to an embodiment of the present invention. 2A to 2J are cross-sectional views of a laminated structure of modules showing a method of manufacturing a CIS solar cell according to an embodiment of the present invention according to process steps.

Referring to FIG. 2A, a substrate 110 is provided. The substrate may be an insulating material such as a glass substrate, a ceramic substrate, a polymer, or the like. According to the flexibility of the substrate 110, a flexible solar cell can be manufactured, thereby increasing the utilization of the solar cell.

Referring to FIG. 2B, after cleaning the substrate 110, a back electrode 120 is formed on the substrate 110. The back electrode 120 may use any metal used as an electrode. Preferably, any one of Mo, Ni, and Au can be used. It is more preferable to use Mo especially. The Mo back electrode can maintain high electrical conductivity, ohmic contact to CIGS, and high temperature stability under Se atmosphere.

The method of forming the back electrode 120 on the substrate 110 is mainly performed by electron beam deposition, resistance heating deposition, or sputtering.

Referring to FIG. 2C, the back electrode 120 is divided by P1 scribing 210. Laser or mechanical scribers may be used when P1 scribing 210. For example, molybdenum (Mo) is deposited on the back electrode 120 and scribed using a 1064 nm DPSS or a fiber laser. In the solar cell patterning, as the width of the removed portion is narrower, the active area is increased, thereby improving cell efficiency.

Referring to FIG. 2D, a metal thin film 131 containing at least one of a group I element, a group III element, and a group VI element is deposited on the back electrode 120.

For example, the element contained in the metal thin film 131 may be selected from Cu, Al, and Se. Preferably Al may be selected. However, the present invention is not limited thereto and may be selected from group I elements, group III elements, and group VI elements.

The metal thin film is preferably 1 to 50 nm thick. If the thickness of the metal thin film is less than 1 nm, there is a fear that the adhesion between the back electrode and the light absorbing layer may not be improved. In addition, when the thickness of the metal thin film exceeds 50 nm, a problem of lowering the light absorption efficiency of the light absorption layer occurs.

The deposition amount of the metal thin film is preferably 0.1 to 2 at% of the total composition of the group III elements of the light absorption layer. If it is less than 0.1 at%, there is a concern that the adhesion between the back electrode and the light absorbing layer may not be improved, and if it exceeds 2 at%, a problem of lowering the light absorption efficiency of the light absorbing layer occurs.

Referring to FIG. 2E, a light absorption precursor layer 132 containing at least a group I element and a group III element is formed on the metal thin film 131. In order to function as a light absorbing layer, the group I element, the group III element and the group VI element should be contained. The group VI element may be added in the next heat treatment step, so the light absorption precursor is at least the group I element and the group III. The element must be contained.

The light absorption precursor layer 132 is a co-evaporation method, a sputtering method, an electrodeposition method or an organic metal using the group I element (or a compound thereof) and the group III element (or a compound thereof). It can be formed using chemical vapor deposition (MOCVD).

Referring to FIG. 2F, the metal thin film 131 and the light absorption precursor layer 132 are injected with a group VI element material and heat-treated to form the light absorption layer 130. In addition, the crystallinity of the light absorption layer may be improved by the heat treatment.

The heat treatment may include selenization heat treatment or selenization and sulfide heat treatment. The temperature of the heat treatment is preferably 350 to 550 ℃. If the temperature of the heat treatment is less than 350 ℃ may not crystallize the light absorbing precursor layer, if the temperature of the heat treatment exceeds 550 ℃ unnecessarily high temperature to crystallize the light absorbing layer is not preferable in terms of manufacturing cost. .

The light absorption layer may include Cu (In _x Ga _{1 -x} ) (Se _y S _{1 -y} ) ₂ (where 0 <X ≦ 1 and 0 <Y ≦ 1). For example, in the case of forming a thin Al thin film on the Mo back surface electrode, depositing a Cu-In-Ga precursor thereon, and performing selenization and sulfidation heat treatment, the light absorption layer is Cu (In _x Ga _{1 -x} ) (Se _y S). _{1 -y} ) ₂ (where 0 <X≤1 and 0 <Y≤1).

Referring to FIG. 2G, a buffer layer 140 is formed on the light absorption layer 130.

In the compound solar cell according to the present invention, a lattice constant and an energy band gap between two materials are formed by forming a pn junction between the thin film of the light absorption layer 130, which is a p-type semiconductor, and a window layer 200, which is an n-type semiconductor, to be described later. Since the difference is large, in order to form a good junction, a buffer layer 140 having a band gap in between the two materials is required.

ZnS, CdS, ZnSe, InS, InOOH, and ZnOOH may be used as the buffer layer 140. In addition, the buffer layer may have a dual structure including any one of ZnS, CdS, ZnSe, InS, InOOH, and ZnOOH and intrinsic zinc oxide layers. The intrinsic zinc oxide layer can prevent damage to the buffer layer generated when the window layer is formed on the buffer layer by sputtering or the like.

The buffer layer 140 may be formed by a chemical bath deposition (CBD) method or an RF spattering method.

Referring to FIG. 2H, the light absorption layer 130 is divided into P2 scribing 220 to the buffer layer 140. In the P2 scribing 220 process, a laser or a mechanical scriber may be used.

Due to the conventional P2 scribing process, the phenomenon of lifting and short circuit between the back electrode and the thin film of the light absorption layer has occurred. However, the present invention, as described above, by forming a metal thin film such as Al on the back electrode 120 first, and then forming a light absorbing precursor layer to improve the adhesion between the back electrode and the light absorbing layer through the heat treatment, The problem of lifting and short circuit between the electrode and the thin film of the light absorption layer was solved.

Referring to FIG. 2I, an n-type window layer 150 is formed on the buffer layer 140.

As the n-type semiconductor, the window layer 150 forming the pn junction with the CIS-based light absorbing layer 130 functions as a transparent electrode on the front of the solar cell, so the light transmittance must be high and the electrical conductivity must be good.

Thus, the window layer 150 may be a ZnO layer. Since the window layer 150 is formed of a zinc oxide (ZnO) material, transmittance of incident sunlight may be guaranteed by 80% or more. If necessary, a double structure in which an indium tin oxide (ITO) thin film having excellent electro-optic properties is deposited on a ZnO thin film may be used.

For example, ZnO window layers can be deposited using ZnO targets by RF sputtering, reactive sputtering with Zn metal, and metal organic chemical vapor deposition (MOCVD). Can be formed.

Referring to FIG. 2J, the light absorbing layer 130 may be divided by the P3 scribing 230 to the n-type window layer 150.

Laser or mechanical scriber may be used in the P3 scribing 230 process.

In the above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications and changes by those skilled in the art within the spirit and scope of the present invention. You can change it.

110: substrate 120 back electrode
130: light absorption layer 131: metal thin film
132: light absorption precursor layer 140: buffer layer
150: window layer 210: P1 scribing
220: P2 scribing 230: P3 scribing

Claims (7)

Forming a back electrode on the substrate;
Scribing and dividing the back electrode;
Forming a metal thin film containing at least one of a Group I element, a Group III element, and a Group VI element on the back electrode;
Forming a light absorption precursor layer containing at least a Group I element and a Group III element on the metal thin film;
Forming a light absorbing layer by heat treating the metal thin film and the light absorbing precursor layer by injecting a Group VI element material;
Forming a buffer layer on the light absorption layer;
P2 scribing and dividing from the light absorption layer to the buffer layer;
Forming an n-type window layer on the buffer layer; And
P3 scribing and dividing from the light absorption layer to the n-type window layer. The method of claim 1,
The element contained in the metal thin film is a method of manufacturing a solar cell module is selected from Cu, Al and Se. The method of claim 1,
The metal thin film is a method of manufacturing a solar cell module, characterized in that the thickness of 1 to 50 nm. The method of claim 1,
The deposition amount of the metal thin film is a method of manufacturing a solar cell module, characterized in that 0.1 to 2 at% of the total composition of the group III element of the light absorption layer. The method of claim 1,
The heat treatment is a method of manufacturing a solar cell module comprising a selenization heat treatment or selenization and sulfide heat treatment. The method of claim 1,
The temperature of the heat treatment is a manufacturing method of a solar cell module, characterized in that 350 to 550 ℃. The method of claim 1,
The light absorbing layer is Cu (In _x Ga _{1 -x} ) (Se _y S _{1 -y} ) ₂ (However, 0 <X ≤ 1, 0 <Y ≤ 1) A manufacturing method of a solar cell module.

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