KR20120096738A - Mounter and pcb management system using thereby - Google Patents

Abstract

Mounters are provided. Mounter according to an embodiment of the present invention, the marker nozzle to mark the recognition mark on the surface of the component, the pickup nozzle for picking up the chip and moving the chip on the surface of the component to automatically replace the pickup nozzle according to the process Head.

Description

Mounter and printed circuit board management system using it {Mounter and PCB management system using thereby}

The present invention relates to a mounter and a printed circuit board management system using the same, and more particularly, to a mounter using a marker nozzle and a pickup nozzle and a printed circuit board management system using the same.

Surface Mount Technology (SMT) prints solder paste on a printed circuit board (PCB), and mounts various surface mount device (SMD) mounter equipment thereon. After mounting using the same, it may refer to a technique of joining the PCB and the lead of the surface mount component through a reflow process.

The problem to be solved by the present invention is to provide a mounter that can simplify the process and improve the production efficiency.

Another problem to be solved by the present invention is to provide a printed circuit board management system that can simplify the process and improve the production efficiency.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

The mounter according to an embodiment of the present invention for solving the above problems, a marker nozzle for marking a recognition mark on the surface of the component, a pickup nozzle for picking up the chip and moving the chip on the surface of the component and the marker A head for automatically replacing the pickup nozzle according to the process.

The printed circuit board management system according to an embodiment of the present invention for solving the other problem, and loads the printed circuit board, and the unique number of the printed circuit board on the printed circuit board with a marker nozzle mounted to the mounter Marking, replacing the marker nozzle with a pick-up nozzle, picking up a chip with the pick-up nozzle, placing the chip on the printed circuit board, and placing information of the chip mounted on the printed circuit board with the unique number. Transmits an image, fixes the chip on the printed circuit board through a reflow process, recognizes the unique number on the printed circuit board, receives the placement information of the chip, and is fixed on the printed circuit board. Identifying the chip and unloading the printed circuit board.

Other specific details of the invention are included in the detailed description and drawings.

1 is a diagram illustrating an example of an SMT line system including a mounter according to embodiments of the present invention.
2 is a block diagram of a mounter according to an embodiment of the present invention.
FIG. 3 is a diagram illustrating an example of the mounter of FIG. 2.
4A is a plan view illustrating an example of a marker nozzle mounted to the head of FIG. 3.
4B is a cross-sectional view of the marker nozzle of FIG. 4A.
FIG. 5 is a partial cross-sectional view for describing a state in which the marker nozzle of FIG. 3 is waiting on the nozzle standby plate.
FIG. 6 is a perspective view illustrating the nozzle waiting plate of FIG. 3. FIG.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, a mounter and a printed circuit board management system using the same according to embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 6. 1 is a diagram illustrating an example of an SMT line system including a mounter according to embodiments of the present invention. 2 is a block diagram of a mounter according to an embodiment of the present invention. FIG. 3 is a diagram illustrating an example of the mounter of FIG. 2. 4A is a plan view illustrating an example of a marker nozzle mounted to the head of FIG. 3. 4B is a cross-sectional view of the marker nozzle of FIG. 4A. FIG. 5 is a partial cross-sectional view for describing a state in which the marker nozzle of FIG. 3 is waiting on the nozzle standby plate. FIG. 6 is a perspective view illustrating the nozzle waiting plate of FIG. 3. FIG.

First, as shown in FIG. 1, a general SMT line system may include a loader 100, a printer 200, a mounter 300, a reflow oven 400, an unloader 500, and the like.

The loader 100 is a device for automatically supplying a PCB. For example, the loader 100 may supply a substrate using a medium called a magazine.

The screen printer 200 may apply solder paste to the surface of the PCB injected through the loader 100. At this time, the solder paste may be disposed corresponding to the position where the surface mounting component, for example, the chip is to be mounted.

The chip mounter 300 may arrange and fix various surface mount components including a chip on a land portion of a PCB to which solder paste is applied. Although not shown in the drawings, it may be composed of a plurality of mounters according to the type of various surface mount components mounted on the PCB.

Although not shown in the drawings, the mounter 300 may include a chip feeder, a head, a nozzle, and the like. First, the chip is sucked by the suction nozzle of the head from the chip supply unit, and the suction state and the center position of the chip can be accurately identified and mounted on the PCB. In this case, in order to accurately check the adsorption state and the center position of the chip, a camera may be installed. When the verification is completed through the camera, the chip may be rotated at an accurate angle to correct the mounting position.

The reflow oven 400 may heat and dissolve the lower solder paste and then perform a cooling process to fix the chips mounted on the PCB by the mounter 300 on the PCB.

The unloader 500 may serve to load and receive a PCB in which the above work is completed.

2 and 3, the mounter 300 according to the embodiment of the present invention includes a conveyor 310, a chip supply part 320, a moving part 330, a head 340, a control part 360, And nozzle waiting plate 370.

The conveyor 310 may be driven to provide a component, for example, a PCB, on which a chip is mounted, and to position the component at a predetermined point in the mounter.

The chip supply unit 320 may supply a chip to be mounted on the PCB. In some other embodiments, the chip supply 320 may be a surface mount component supply for supplying another surface mount component.

The moving part 330 may move the head 340 to the PCB, the chip supply part 320, and the nozzle standby plate 370. The moving unit 330 may move the head 340 in the X-axis and Y-axis directions, and the movement may be controlled by the controller 360.

In this case, a nozzle may be fixed to the end of the head 340, and a marker nozzle 350 or a pickup nozzle (not shown) may be fixed. More specifically, the marker nozzle 350 marks a recognition mark on the PCB, and the pickup nozzle moves the chip on the PCB. At this time, the pick-up nozzle may suck the chip until it picks up the chip and moves it onto the PCB surface. The head 340 automatically replaces the marker nozzle 350 and the pickup nozzle according to the process.

The marker nozzle 350 may mark a recognition mark on the PCB surface. For example, the marker nozzle 350 may provide a recognition mark marking material, for example, ink, to display a recognition mark that can be recognized. For example, a unique number may be displayed on a PCB or placement information of a chip mounted on the PCB may be displayed. As described above, when a plurality of PCBs are supplied using a magazine, confusion may occur between the plurality of PCBs. In order to prevent such confusion, a unique number of the PCB may be displayed using the marker nozzle 350 on the surface of each PCB. Here, although the ink is presented as one exemplary material as the recognition mark marking material, it is not limited thereto, and various materials may be applied.

Accordingly, even if several PCBs are simultaneously transferred in a magazine unit, each PCB can be distinguished by a unique number. The display method may be, for example, a combination using a dot or a line, but is not limited thereto and may include various distinguishable marks.

In addition, by using the marker nozzle 350 installed in the mounter 300, the placement information of the chip mounted on the PCB may be displayed. Here, the placement information of the chip mounted on the PCB may mean information such as the number of chips mounted on the PCB, the location of the chip mounted, and the type of the chip mounted. Like displaying the unique number of the PCB, the method of displaying the placement information of the chip may be, for example, a combination using a dot or a line, but is not limited thereto and may include various distinguishable marks.

As described above, the head 340 of the mounter 300 may be fixed to the marker nozzle 350 or the pickup nozzle, the marker nozzle 350 and the pickup nozzle is automatically replaced according to the process. For example, in a process of moving a chip on the chip supply unit 320 onto the PCB, a pickup nozzle may be fixed to the head 340. The pick-up nozzle fixed to the head 340 may pick up the chip provided on the chip supply unit 320 and suck the chip until it moves on the PCB.

At this time, the moving unit 330 moves the head 340 in the X-axis and Y-axis direction, the movement can be controlled by the controller 360. Although not shown in the drawings, a monitoring device that can be confirmed by the user image can be further installed whether the chip fixed by the pick-up nozzle is moved safely.

The nozzle waiting plate 370 may be a space for waiting for the marker nozzle 350 and the pickup nozzle while the marker nozzle 350 and the pickup nozzle are not used. As described above, the marker nozzle 350 and the pick-up nozzle are automatically replaced according to the corresponding process, and accordingly, the head 340 is moved to the nozzle standby plate 370 by the moving unit 330 so that the marker nozzle ( 350 may be replaced with the pickup nozzle.

In some other embodiments, the nozzle holding plate 370 may move within a range. In this case, the movement of the head 340 and the movement of the nozzle standby plate 370 by the moving unit 330 may be adjusted by the controller 360.

The controller 360 may control operations of the conveyor 310, the moving unit 330, the chip supply unit 320, the pickup head 340, and the nozzle waiting plate 370. More specifically, the controller 360 controls the conveyor 310 to move the PCB to the center region of the mounter 300, that is, the region for component mounting, and to control the chip supply unit 320 to stop at the set position. In addition, the moving unit 330 may be moved in a planar direction (eg, X-axis and Y-axis) to absorb the semiconductor chip and move to the mounting position on the PCB.

In addition, the controller 360 controls the head 340 to move up and down (eg, Z-axis) so that the head 340 provides the adsorption fixation and the recognition mark marking material of the chip, and controls the nozzle standby plate 370 to move. can do.

4A and 4B, the marker nozzle 350 may include body parts 352, 354, and 356, and a marking pen 358 formed at one end of the body parts 352, 354, and 356. have. More specifically, the body parts 352, 354, and 356 may include a mounting part 352 fixedly mounted to the head 340, a connection part 354 connecting the mounting part 352 and the inclined part 356, and a nozzle standby plate. In contact with 370, the marking pen 358 may include an inclined portion 356 which prevents the marking pen 358 from being exposed to the outside air.

As shown in the figure, a groove is formed in the mounting portion 352 can be fixed and easily fixed to the head 340. The marking pen 358 may be formed in the body parts 352, 354, and 356 so that a part of the marking pen 358 may be exposed through the inclined part 356. The marking pen 358 may contain a recognition mark marking material, for example, ink, and the marking pen 358 may be provided with the recognition mark marking material while contacting the PCB to display the recognition mark on the PCB.

As shown in FIG. 5, the marker nozzle 350 is waiting at the nozzle waiting plate 370 to stably provide a recognition mark marking material, for example ink, on the PCB. A portion of the marking pen 358 can be stored in a dipped state in the storage. More specifically, the nozzle waiting plate 370 may include a waiting hole 374a for the marker nozzle for waiting the marker nozzle 350, and a recognition mark marking material, for example, may be formed inside the waiting hole 374a for the marker nozzle. For example, storage 376 containing ink may be disposed.

As shown in FIG. 6, the nozzle waiting plate 370 may include a plurality of nozzle waiting holes 374a, 374b, 374c, and 374d. More specifically, the nozzle waiting plate 370 may be divided into a plurality of areas A, B, C, and D, and a plurality of nozzle waiting holes 374a, 374b, 374c, and 374d may be formed in each area. have. In this case, the plurality of regions A, B, C, and D may include nozzle waiting holes 374a, 374b, 374c, and 374d having different sizes.

In other words, the plurality of nozzle waiting holes 374a formed in the region A and the plurality of nozzle waiting holes 374b formed in the region B may have different sizes. Different types of nozzles, for example, marker nozzles and pickup nozzles, may be disposed in the regions A, B, C, and D, respectively. Alternatively, marker nozzles of different sizes may be disposed with respect to the same kind of marker nozzles. In addition, nozzle waiting holes 374c having the same size as in region C may be formed in two or more rows C1 and C2. Since the nozzle waiting plate 370 shown in FIG. 5 is just one example, the shape of the nozzle waiting plate 370 and the size of the nozzle waiting holes 374a, 374b, 374c, and 374d may be variously modified. Of course, it can be applied.

In addition, the inlet of the nozzle waiting holes 374a, 374b, 374c, and 374d of the nozzle waiting plate 370 may be formed as an inclined surface, as shown in FIG. 5. The inclined surface may be engaged with the inclined portion 356 of the marker nozzle 350 to prevent external air from flowing into the nozzle waiting holes 374a, 374b, 374c, and 374d. Accordingly, it is possible to prevent the ink in the marking pen 376 from evaporating.

1 to 6 and the foregoing description, a printed circuit board management system according to an embodiment of the present invention loads a printed circuit board and is placed on the printed circuit board with a marker nozzle 340 mounted to the mounter 300. The unique number of the printed circuit board is indicated on the board, the marker nozzle 330 is replaced with the pickup nozzle, the chip is picked up by the pickup nozzle, and the chip is placed on the printed circuit board. The placement information of the chip mounted on the printed circuit board together with the unique number may be transmitted, and the chip may be fixed on the printed circuit board through a reflow process. Subsequently, a process of recognizing a unique number on a printed circuit board, receiving chip placement information, identifying a chip fixed on the printed circuit board, and unloading the printed circuit board may be performed. Here, replacing the marker nozzle with the pickup nozzle can use an automatic nozzle replacement system. At this time, the marker nozzle and the pickup nozzle may be waiting on the nozzle waiting plate.

Furthermore, transmitting the placement information of the mounted chip means replacing the pickup nozzle with the marker nozzle and displaying the placement information of the mounted chip on the printed circuit board using the recognition mark marking material provided by the marker nozzle. can do. In addition, receiving the placement information of the mounted chip may mean recognizing the placement information of the chip indicated by the marking material on the printed circuit board.

According to the mounter and the printed circuit board management system using the same according to the embodiment of the present invention, the marking process may be performed without expensive equipment by automatically replacing the marker nozzle and the pickup nozzle using the head mounted on the mounter. In addition, since the marking process is performed using a marker nozzle in the mounter, unlike a handwritten marking by a worker, since the operator does not directly access a printed circuit board, such as opening a door of the equipment, the operation is easy. Safety has also been improved. Furthermore, the marking process may be automated to reduce the positional shift of the printed circuit board, and the work time may be much shorter.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: loader 200: printing press
300: mounter 310: conveyor
320: component supply unit 330: moving unit
340: head 350: marker nozzle
352: mounting portion 354: connecting portion
356: inclined portion 358: marking pen
360: control unit 370: nozzle waiting plate
400: reflow oven 500: unloader
600:

Claims (10)

A marker nozzle for marking a recognition mark on the surface of the part;
A pick-up nozzle that picks up chips and moves the chips on the surface of the part;
And a head for automatically replacing the marker nozzle and the pickup nozzle according to a process. The method according to claim 1,
And a nozzle waiting plate for waiting for the marker nozzle and the pickup nozzle while the marker nozzle and the pickup nozzle are not in use. The method of claim 2, wherein the nozzle waiting plate,
Including a waiting hole for the marker nozzle for waiting for the marker nozzle,
The mounter is disposed inside the waiting hole for the marker nozzle is stored storage for the identification mark marking material. The method of claim 3,
And the recognition mark marking material is ink. The method of claim 3, wherein the marker nozzle,
And a marking pen formed at one end of the body portion to provide ink on the surface of the part,
A portion of the marking pen dipped into the ink of the storage. The method of claim 1, wherein the marker nozzle,
A mount for providing a recognition mark marking material on the surface of the component to display a unique number on the surface of the component or to display placement information of a chip mounted on the component. The method according to claim 1,
The component is a printed circuit board. Load the printed circuit board,
Marking the unique number of the printed circuit board on the printed circuit board with a marker nozzle mounted to the mounter,
Replace the marker nozzle with a pickup nozzle,
Picking up the chip with the pickup nozzle to place the chip on the printed circuit board,
Transmits the placement information of the chip mounted on the printed circuit board with the unique number,
Fixing the chip on the printed circuit board through a reflow process,
Recognize the unique number on the printed circuit board,
Receiving the placement information of the chip and confirming the chip fixed on the printed circuit board,
A printed circuit board management system comprising unloading the printed circuit board. The method of claim 8,
Replacing the marker nozzle with the pickup nozzle uses an automatic nozzle replacement system,
And replacing with the marker nozzle and the pickup nozzle waiting on a nozzle waiting plate. The method of claim 8,
Transmitting the placement information of the mounted chip,
Replacing the pick-up nozzle with the marker nozzle and displaying the placement information of the mounted chip on the printed circuit board using ink provided by the marker nozzle,
Receiving the placement information of the mounted chip,
A printed circuit board management system comprising recognizing placement information of the chip displayed on the printed circuit board.

Images