KR20120074108A - 휴대용 디스플레이 제품의 lcd 보호용 브라켓 - Google Patents
휴대용 디스플레이 제품의 lcd 보호용 브라켓 Download PDFInfo
- Publication number
- KR20120074108A KR20120074108A KR1020100136067A KR20100136067A KR20120074108A KR 20120074108 A KR20120074108 A KR 20120074108A KR 1020100136067 A KR1020100136067 A KR 1020100136067A KR 20100136067 A KR20100136067 A KR 20100136067A KR 20120074108 A KR20120074108 A KR 20120074108A
- Authority
- KR
- South Korea
- Prior art keywords
- bracket
- polyamide
- portable display
- carbon
- carbon fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 58
- 239000004917 carbon fiber Substances 0.000 claims abstract description 58
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 37
- 239000004760 aramid Substances 0.000 claims abstract description 29
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 29
- 230000001681 protective effect Effects 0.000 claims abstract description 21
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 19
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 19
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 29
- 239000000945 filler Substances 0.000 claims description 25
- 229910002804 graphite Inorganic materials 0.000 claims description 15
- 239000010439 graphite Substances 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000008188 pellet Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 10
- 239000002041 carbon nanotube Substances 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 6
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 6
- 150000004984 aromatic diamines Chemical class 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000005470 impregnation Methods 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000004611 light stabiliser Substances 0.000 claims description 3
- 238000005453 pelletization Methods 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000003017 thermal stabilizer Substances 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 238000000465 moulding Methods 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- -1 aliphatic diamine Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229920000007 Nylon MXD6 Polymers 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical class CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- 239000004957 Zytel Substances 0.000 description 1
- 229920006102 Zytel® Polymers 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920006119 nylon 10T Polymers 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
실시예 | ||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | |
(a11) | 35 | 30 | 20 | - | - | - | 35 | 35 |
(a12) | - | - | - | 35 | 30 | 20 | - | - |
(a2) | 5 | 10 | 20 | 5 | 10 | 20 | 5 | 5 |
(B) | 60 | 60 | 60 | 60 | 60 | 60 | - | - |
(B') | - | - | - | - | - | - | 60 | 60 |
(C)CNT | - | - | - | - | - | 0.5 | 0.5 | 0.5 |
(D)금속코팅흑연 | - | - | - | - | 5 | - | - | 5 |
(E)금속분 | - | - | - | 5 | - | - | 5 | - |
Spiral mm | 61 | 59 | 56 | 42 | 45 | 48 | 43 | 44 |
FM(GPa) | 39 | 39.5 | 41 | 49 | 49.8 | 45 | 47 | 48 |
FS(MPa) | 430 | 465 | 495 | 500 | 503 | 502 | 510 | 515 |
IZOD(KJ/m2) | 74 | 73 | 71 | 79 | 79 | 73 | 79 | 79 |
체적저항 | 0.2 | 0.2 | 0.2 | 0.08 | 0.09 | 0.1 | 0.07 | 0.06 |
흡습율% | 3.9 | 3.6 | 3.1 | 2.8 | 2.9 | 2.7 | 2.1 | 2.0 |
EMI 차폐 | 75 | 78 | 80 | 82 | 81 | 83 | 85 | 86 |
비교예 | |||||
1 | 2 | 3 | 4 | 5 | |
(a11) | 40 | - | 40 | - | 10 |
(a12) | - | 40 | - | 40 | - |
(a2) | - | - | 10 | 10 | 5 |
(B) | 60 | 60 | 50 | 50 | 85 |
Spiral mm | 65 | 40 | 68 | 54 | 30 |
FM(GPa) | 38 | 39 | 33 | 33 | 40 |
FS(MPa) | 420 | 430 | 380 | 390 | 430 |
IZOD | 75 | 74 | 80 | 79 | 75 |
체적저항 | 0.2 | 0.2 | 1.2 | 1.3 | 0.2 |
흡습율% | 4.1 | 3.6 | 4.7 | 4.1 | 4.1 |
EMI 차폐 | 75 | 78 | 56 | 57 | 76 |
Claims (17)
- (A) 폴리아미드 수지 및 (B) 카본섬유를 포함하여 이루어지며, 상기 (A) 폴리아미드 수지와 (B) 카본섬유의 중량비는 (A):(B)=20~40 중량%: 60~80 중량%이고, 상기 (A) 폴리아미드 수지는 (a1)탄소수 4~6의 지방족기를 주쇄로 함유하는 지방족 폴리아미드 및 (a2)방향족 폴리아미드를 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 (A) 폴리아미드 수지는 (a1)지방족 폴리아미드 50 내지 95 중량%; 및 (a2) 방향족 폴리아미드 5 내지 50 중량%를 포함하여 이루어지는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 (a1)지방족 폴리아미드는 PA 6, PA 66, PA 46 또는 이들의 2 이상의 혼합물인 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 (a2)방향족 폴리아미드는 전방향족 폴리아미드, 반방향족 폴리아미드 또는 이들의 혼합물인 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 (a2)방향족 폴리아미드는 방향족 디아민과 지방족 디카르복실산의 중합체인 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 (B) 카본섬유는 길이가 0.01 내지 20 mm 인 카본섬유를 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 브라켓은 탄소나노튜브를 (A)+(B) 100 중량부에 대하여 0 초과 20 중량부 이하의 범위로 더 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 브라켓은 난연제, 가소제, 커플링제, 열안정제, 광안정제, 탄소필러, 무기필러, 이형제, 분산제, 적하방지제 및 내후안정제로 이루어진 군으로부터 선택된 하나 이상의 첨가제를 더 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제9항에 있어서, 상기 탄소필러는 흑연, 탄소나노튜브, 카본 블랙, 이들의 금속 코팅물 또는 이들의 2종 이상 혼합물을 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제9항에 있어서, 상기 무기필러는 금속필러를 포함하는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- 제1항에 있어서, 상기 브라켓은 300℃에서 1mm규격에 의한 스파이럴 플로우(spiral flow) 길이가 42 내지 75 mm 이고, ASTM D790에 의한 굴곡모듈러스가 38~50 GPa 이고, ASTM D256에 의한 3.2mm 두께에서 아이조드 충격강도가 71 내지 90 KJ/m2이고, 100x100mm 규격에 의한 체적저항이 0.01 내지 0.5 Ω?cm 이며, 1 GHz, 2mm 두께에서 EMI D257 규격에 의한 차폐효과가 70 내지 120 dB 인 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓.
- (a1)탄소수 4~6의 지방족기를 주쇄로 함유하는 지방족 폴리아미드 및 (a2)방향족 폴리아미드를 포함하여 이루어지는 폴리아미드 수지(A)를 압출기에 투입하고;
상기 압출기에 (B) 카본섬유를 투입하여 상기 (A) 폴리아미드 수지에 (B) 카본섬유를 (A):(B)=20~40 중량%: 60~80 중량%의 중량비로 함침하고;
상기 함침된 혼합물을 압출하여 펠렛화하고; 그리고
상기 펠렛을 성형하는;
단계를 포함하여 이루어지는 것을 특징으로 하는 휴대용 디스플레이 제품의 LCD 보호용 브라켓의 제조방법.
- 제13항에 있어서, 상기 함침은 폴리아미드 수지(A)의 용융물에 카본섬유(B)를 통과시켜 함침하는 것을 특징으로 하는 방법.
- 제13항에 있어서, 상기 펠렛은 5.5 내지 25 mm 를 갖는 것을 특징으로 하는 방법.
- 제13항에 있어서, 상기 (B) 카본섬유는 길이가 0.01 내지 20 mm 인 것을 특징으로 하는 방법.
- 제13항에 있어서, 상기 함침된 혼합물을 압출한 후 커팅하여 펠렛화하는 것을 특징으로 하는 방법.
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PCT/KR2010/009596 WO2012091204A1 (ko) | 2010-12-27 | 2010-12-30 | 휴대용 디스플레이 제품의 lcd 보호용 브라켓 |
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KR101946793B1 (ko) * | 2017-11-10 | 2019-02-12 | 주식회사 서연이화 | 전자파 차폐용 복합체 |
KR20200103266A (ko) * | 2019-02-25 | 2020-09-02 | 한화컴파운드 주식회사 | 접착성이 개선된 폴리아미드 복합체 및 이를 포함한 적층체 |
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DE69636105T2 (de) * | 1995-12-29 | 2007-05-03 | Rhodia Engineering Plastics S.R.L. | Polyamid und Verfahren zu dessen Herstellung |
JPH10120798A (ja) * | 1996-10-18 | 1998-05-12 | Kobe Steel Ltd | 電子機器用導電性ケーシング |
US6048922A (en) * | 1997-08-20 | 2000-04-11 | Eastman Chemical Company | Process for preparing high strength fiber reinforced composites |
JP2004168849A (ja) * | 2002-11-19 | 2004-06-17 | Fujitsu Ltd | 電子機器筐体 |
DE502005001078D1 (de) * | 2005-11-18 | 2007-08-30 | Ems Chemie Ag | Verstärkte Polyamidformmassen |
EP1971642B1 (en) * | 2005-11-23 | 2010-03-31 | E.I. Du Pont De Nemours And Company | Carbon fiber reinforced polyamide resin composition |
US8853324B2 (en) * | 2006-11-22 | 2014-10-07 | E I Du Pont De Nemours And Company | Mobile telephone housing comprising polyamide resin composition |
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KR101946793B1 (ko) * | 2017-11-10 | 2019-02-12 | 주식회사 서연이화 | 전자파 차폐용 복합체 |
KR20200103266A (ko) * | 2019-02-25 | 2020-09-02 | 한화컴파운드 주식회사 | 접착성이 개선된 폴리아미드 복합체 및 이를 포함한 적층체 |
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