KR20120019729A - Ic card constructed by using spot welding and method the same - Google Patents

Abstract

The present invention relates to an IC card and a manufacturing method thereof. An IC card manufacturing method using spot welding according to the present invention includes the steps of: (a) preparing a laminated card including an upper layer, an inlay layer and a lower layer; (b) preparing the COB; (c) a first milling step of removing a partial region of the upper layer of the laminated card to form a COB seating groove exposing both ends of the copper coil attached to the inlay layer; (d) extracting both ends of the copper coil; (e) a second milling step of forming chip receiving grooves by removing corresponding portions of the inlay layer where both ends of the copper wire coil are exposed to a depth set so that COB can be mounted; (f) connecting both end portions of the copper wire coils by spot welding with the first contact portion and the second contact portion of the COB, respectively; And (g) mounting the COB in the COB seating groove.
The IC card manufactured by spot welding according to the present invention can physically and stably fix the copper coil and COB of the IC card. As a result, the physical properties required by ISO 7816-1 and ISO 10373-1 Mechanical bending stress requirements and mechanical warping stress requirements can be satisfied.

Description

IC card constructed by using spot welding and Method the same}

The present invention relates to an IC card, and more particularly, to an IC card manufactured by connecting an integrated circuit (hereinafter referred to as an 'IC') to an antenna inside the card by using spot welding.

An IC card is a card with at least one integrated circuit, also known as a smart card.

IC cards can be classified into contact cards and contactless cards. The contact card has a major surface with a read / write interface exposed to the external environment. Thus, in use, the read / write interface portion of the contact card is in direct physical contact with the read / write head of the computer terminal or processor, so that the data is written to the IC in the card or stored in the IC. Will be read.

On the other hand, the non-contact card has a coil of copper wire acting as an antenna, which coil is connected to the IC in the card. The copper coil serves as an antenna for transmitting or receiving radio frequency signals in the card, and the IC in the card connected to the copper coil is connected to an external system (eg, a computer system) by radio frequency (RF).

If a contactless IC card is frequently used, the connection portion of the IC and the antenna embedded in the card may be easily damaged during the use of the card, and in certain circumstances, the use of the contactless card may waste more time. For example, in the case of expressway toll payment, since all vehicles passing through the toll gate must stop for payment in order to use a contactless card, it wastes a lot of time.

Recently, a dual interface IC card incorporating the functions of a contact card and a contactless card has been produced, and such a dual interface IC card is also called a combination card. The dual-interface IC card described above, like a contact card, allows the main surface of the IC to be exposed even when the integrated circuit (IC) is embedded so that the read / write head of an external system is in physical contact with the IC to read data from the IC or You can write data in it. On the other hand, the dual interface IC card, like a contactless card, allows the IC to be electrically connected to a copper wire coil embedded in the card so that the IC can be connected to an external system by radio frequency transmission, thereby reading data from the IC. Or write data into the IC. Dual interface IC cards with this feature have the advantage that they can be used in more diverse environments.

In manufacturing the above-described dual interface IC card, conventionally, an integrated circuit is fixed to a copper wire coil by using a conductive adhesive. However, the method of using a conductive adhesive is not sufficiently strong in the physical connection between the copper coil and the integrated circuit, resulting in mechanical bending stress and mechanical warping stress, which are physical properties required by ISO 7861-1 and ISO 10373-1. There is a problem that cannot meet the characteristics.

Therefore, in order to solve the above problems, a method of directly connecting and fixing an integrated circuit to a copper wire coil using a soldering method has been used. This soldering method can meet the physical properties required by ISO 7816-1 and ISO 10373-1, but all the work is done by hand, so the productivity is not very low, and the harmful gases emitted during soldering are harmful to human body and environment. It has a problem of polluting.

SUMMARY OF THE INVENTION An object of the present invention for solving the above-mentioned problems is to stably connect a copper wire coil embedded in a card and a chip on board (COB) equipped with an integrated circuit by using spot welding, whereby the COB is stably disposed on the card. It is to provide an IC card.

Features of the present invention for achieving the above-described technical problem, the copper wire coil is disposed embedded, attached to the front surface, both ends of the copper wire coil inlay layer disposed in a predetermined area; An upper layer having a COB seating groove formed in a region corresponding to a region in which both ends of the copper wire coil are disposed and disposed in front of the inlay layer; An underlayer disposed on a rear surface of the inlay layer; And a semiconductor chip including a first contact portion and a second contact portion, wherein the COB is mounted in a COB seating groove of the upper layer. The both ends of the copper wire coil have a first contact portion and a second contact portion of the COB. It is preferable that the parts are spot welded and electrically connected to each other.

In the IC card manufactured by spot welding according to the above-mentioned feature, the COB is preferably characterized by further comprising a hot-melt tape attached to the front edge.

In the IC card manufactured using the spot welding according to the above features, the inlay layer further comprises a chip receiving groove connected to the COB seating groove of the upper layer, the center of the chip receiving groove is the center of the COB seating groove It is preferred to be characterized by coinciding with the center.

Another aspect of the present invention for achieving the above technical problem is a method of manufacturing an IC card, comprising the steps of: (a) preparing a laminated card comprising an upper layer, an inlay layer and a lower layer; (b) preparing the COB; (c) a first milling step of removing a partial region of the upper layer of the laminated card to form a COB seating groove exposing both ends of the copper coil attached to the inlay layer; (d) extracting both ends of the copper coil; (e) a second milling step of forming chip receiving grooves by removing corresponding portions of the inlay layer where both ends of the copper wire coil are exposed to a depth set so that COB can be mounted; (f) connecting both end portions of the copper wire coils by spot welding with the first contact portion and the second contact portion of the COB, respectively; And (g) mounting the COB in the COB seating groove.

An IC card manufacturing method using spot welding according to the above-mentioned features, further comprising the step of cutting the copper wire coil extracted in the step (d) to a predetermined length before the step (f). It is preferable.

In the IC card manufacturing method using the spot welding according to the above features, the step (b) is a step of attaching a hot-melt tape (Hot-melt Tape) on the back of the Combi Reel Chip (Combi Reel Chip); And preparing the COB by punching the combi reel chip into a single semiconductor chip unit.

In the method of manufacturing an IC card using spot welding according to the above-mentioned feature, it is preferable that the method further comprises the step of bending the copper wire coil connected to the COB into the inside of the COB seating groove before the step (g). .

In the IC card manufacturing method using the spot welding according to the above features, the step (g) is the step of first fixing the COB to the COB seating groove by applying heat and pressure to the upper edge of the COB; And secondly fixing the COB to the COB seating groove by applying stronger heat and pressure than when the first surface is fixed to the upper edge of the COB.

The IC card manufactured by spot welding according to the present invention can physically and stably fix the copper coil and COB of the IC card. As a result, the physical properties required by ISO 7816-1 and ISO 10373-1 Mechanical bending stress requirements and mechanical warping stress requirements can be satisfied.

In addition, the IC card manufacturing method using the spot welding according to the present invention by using a spot welding method that does not emit harmful substances, it is possible to completely solve the problem of environmental pollution caused by the technique using the conventional soldering method.

1 is a diagram showing the structure of an IC card manufactured using spot welding according to a preferred embodiment of the present invention.
2 is a plan view showing a core sheet for producing a plurality of cards and a partially enlarged view showing one card area.
3 and 4 are exploded perspective views and a plan view of a laminated card panel composed of a core sheet and an outer sheet.
5 is a plan view exemplarily showing one card punched from the laminated card panel of FIG. 4.
6 is a plan view exemplarily illustrating a process of preparing a COB and one COB punched from a combi reel chip.
7 is a cross-sectional view and a plan view for explaining a process of making a groove for fixing a COB equipped with an integrated circuit on a card.
8 is a view for explaining the preparation process for raising the copper wire coil of the card, in order to fix the COB to the card.
9 is a view for explaining a method of bending a copper wire coil connected to the COB.
10 is a view for explaining a process of mounting the COB in the COB seating groove.

Hereinafter, a structure of an IC card manufactured using spot welding according to a preferred embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

Figure 1 (a) is a plan view showing the structure of the IC card manufactured using spot welding according to a preferred embodiment of the present invention, (b) is a perspective view. Referring to FIG. 1, an IC card 100 manufactured using spot welding according to a preferred embodiment of the present invention includes an inlay layer 110, an upper layer 120, a lower layer 130, and a COB 150. .

The inlay layer 110 has a copper wire 160 attached to the front surface, so that both ends of the copper wire coil are disposed in a predetermined region.

The upper layer 120 has a COB seating groove 140 formed in an area corresponding to an area where both end portions of the copper wire coil are disposed, and is disposed on the front surface of the inlay layer 110. On the other hand, the inlay layer 110 further includes a chip receiving groove connected to the COB seating groove 140 of the upper layer, the center of the chip receiving groove coincides with the center of the COB seating groove. In addition, the depth of the chip receiving groove is set in consideration of the thickness of the semiconductor chip accommodated.

The lower layer 130 is disposed on the rear surface of the inlay layer 110.

The COB 150 includes a semiconductor chip including a first contact portion 156 and a second contact portion 158, and is mounted in the COB seating groove 140 of the upper layer 120. The COB 150 further includes a hot-melt tape at the front edge. The COB 150 having the above-described configuration attaches a hot-melt tape to a rear surface of a combi reel chip, and then combines the combi reel chip in units of a single semiconductor chip. It is manufactured by punching. Meanwhile, the first and second contact portions 156 and 158 of the COB are spot welded to both ends of the copper coil and electrically connected thereto.

The IC card manufactured by spot welding according to the preferred embodiment of the present invention having the above-described configuration can physically stably fix the copper wire coil and the COB of the IC card. Hereinafter, the manufacturing method of the IC card which has the structure mentioned above is demonstrated concretely.

According to a preferred embodiment of the present invention, a method of manufacturing an IC card using spot welding may include: (a) preparing a laminated card including an upper layer, an inlay layer, and a lower layer; (b) preparing the COB; (c) a first milling step of removing a partial region of the upper layer of the laminated card to form a COB seating groove exposing both ends of the copper coil attached to the inlay layer; (d) extracting both ends of the copper coil; (e) a second milling step of forming chip receiving grooves by removing corresponding portions of the inlay layer where both ends of the copper wire coil are exposed to a depth set so that COB can be mounted; (f) connecting both ends of the cut copper wire coils by spot welding with the first and second contact portions of the COB, respectively; And (g) mounting the COB in the COB seating groove.

Hereinafter, a step of preparing a laminated card including an upper layer, an inlay layer, and a lower layer will be described with reference to FIGS. 2 to 5.

2 (a) is a plan view showing a core sheet 200 for manufacturing a plurality of laminated cards 400, (b) is a corresponding area (A) of the core sheet 200 to form one card in the future ) Is an enlarged plan view shown separately. As shown in FIG. 2, a copper wire coil 160 serving as an antenna is mounted on the core sheet 200, and the copper wire coil 160 rounds a corresponding card area several times (about 3 to 4 times). Both end portions 162 and 164 of the copper wire coil are arranged in a predetermined area.

Next, as shown in FIG. 3, the upper layer 120 and the lower layer 130, each consisting of outer sheets of various purposes, are stacked on the upper and lower surfaces of the core sheet 200 in which copper wire coils are mounted in an area corresponding to each card. Let's do it. Here, the core sheet 200 refers to a state before the plurality of inlay layers are aligned and cut in card units. In FIG. 3, the upper layer 120 and the lower layer 130 including only one outer sheet are illustrated, but the upper layer 120 and the lower layer 130 may be formed by stacking more outer sheets. The outer sheets that may be stacked on the upper and lower portions of the core sheet 200 are determined according to the use of the card to be produced, and a filling sheet, a protective sheet, a graphic printing sheet, an outer transparent sheet, and the like may be used. As such, the type and purpose of the outer sheets constituting the upper layer 120 and the lower layer 130 are not only well known in the art, but also irrelevant to the scope of the present patent, and thus the description thereof will be omitted. do.

Next, by the above-described process, the core sheet, the upper layer and the lower layer are fixed by applying pressure and high temperature, thereby forming the laminated card panel 300 as shown in FIG. The laminated card panel 300 is punched to form each laminated card 400 as shown in FIG. 5.

Next, a process of completing an IC card by arranging a chip on board (COB) equipped with an integrated circuit on the stack card 400 will be described.

Hereinafter, a process of preparing COB will be described with reference to FIG. 6.

FIG. 6A is a diagram illustrating a process of attaching a thermal adhesive tape to a rear surface of a combi reel chip, and FIG. 6B schematically illustrates each COB formed by punching the combi reel chip. Referring to FIG. 6A, a heat adhesive tape is attached to a rear surface of a combi reel chip composed of a plurality of chips using heat and pressure. Referring to FIG. 6 (b), the combination chip is punched and separated by a single semiconductor chip unit, and the COB 150 is prepared by punching to include the thermal adhesive tape.

In the COB 150, a semiconductor chip 154 is disposed at a central portion thereof, and a first contact portion 156 and a second contact portion 158 are formed in an area adjacent to the semiconductor chip 154. A thermal adhesive tape is attached to the edge not including the first and second contact portions 156 and 158. The first contact portion 156 and the second contact portion 158 of the COB 150 are spot welded to both ends of the copper wire coil of the laminated card, respectively, by the following steps.

Hereinafter, referring to FIG. 7, a process of making a groove so that the copper wire coil is exposed on the surface of the laminated card 400 will be described.

FIG. 7A illustrates a laminated card 400 formed by the above-described process, and FIG. 7B is a cross-sectional view taken along the B-B 'direction of FIG. As shown in FIG. 7B, the upper layer 120 and the lower layer 130 are sequentially stacked around the inlay layer 110, and the amount of the copper wire coil is formed on the surface of the inlay layer 110. Distal ends 162 and 164 are disposed.

FIG. 7C is a plan view showing a state in which both end portions of the copper wire coil are exposed on the laminated card surface, and FIG. 7D is a cross-sectional view taken along the C-C 'direction of (c). As shown in FIG. 7C, both end portions of the copper wire coil attached to the inlay layer 110 are removed by removing a portion of the upper layer 120 stacked on the inlay layer 110 of the lamination card 400. A COB seating groove exposing (162, 164) is formed.

Next, both exposed ends 162 and 164 of the copper wire coil are pulled out of the laminated card by using a tool capable of fine work such as tweezers.

Next, as shown in (e) and (f) of Figure 7, the chip receiving groove by removing the corresponding portion of the inlay layer 110, the both ends of the copper wire coil is exposed to a depth set so that the COB can be mounted To form. The COB seating groove is connected to the chip receiving groove of the inlay layer, the center of the chip receiving groove is formed in a structure having a double step in accordance with the center of the COB seating groove.

Hereinafter, a process of electrically connecting the COB and the copper wire coil by spot welding will be described with reference to FIG. 8.

FIG. 8A is a view illustrating a copper wire coil cut to a suitable length before spot welding, and FIG. 8B is a view showing a COB and a copper wire coil connected by spot welding.

As shown in FIG. 8A, the copper coil 160 is erected at least about 60 ° from the surface of the card 400, and the laminated card ( The end portion of the copper wire coil 400 is cut to an appropriate length.

Next, as shown in (b) of FIG. 8, spot welding is performed on the end portions of the copper wire coils at the first contact portion and the second contact portion, respectively. The spot welding is a welding method of heat fusion using the principle of resistance welding. In detail, the objects to be welded are superimposed, and then the ends of the overlapped objects are pressed with a properly formed electrode, and when a current is applied thereto, heat is generated because the electrical resistance of the contact surface is large. The resistance of the contact surface is soon extinguished, but the heat generated causes the temperature of the material to rise, thereby increasing the resistance of the object itself to increase the temperature. Spot welding is the welding under a strong pressure.

In the IC card manufacturing method using spot welding according to a preferred embodiment of the present invention, by placing the sock end of the copper wire coil and the contact portion of the COB between the electrodes and applying a current by using a welding rod, the resistance heat generated at this time By using the heat dissipation of the end of the copper coil and the contact portion of the COB.

Next, the copper wire coil connected to the COB is bent into the COB seating groove. 9 is a view for explaining a method of bending a copper wire coil connected to the COB. 9, the copper wire coil having a length longer than the contact interval between the card and the COB is bent so that the copper wire coil is not exposed to the outside when the COB is mounted on the card.

Hereinafter, a process of mounting the COB to the COB seating groove will be described with reference to FIG. 10.

10 is a diagram illustrating a process of fixing the COB to the COB seating groove.

As shown in FIG. 10, the COB is mounted in the COB seating groove. This proceeds sequentially with the step of first fixing the COB to the COB seating groove and the second step of fixing the COB to the COB seating groove.

First, the COB is disposed in a COB seating groove, and then heat and pressure are applied to the edge of the top surface of the COB to fix the COB to the laminated card. Since the upper surface of the COB is attached with a heat adhesive tape, it can be fixed to the COB seating groove through the heat and pressure. Next, the COB is completely fixed to the lamination card by applying heat and pressure stronger than the heat and pressure at the time of first fixing to the edge of the upper surface of the COB.

The IC card manufactured by spot welding according to the preferred embodiment of the present invention can physically and stably fix the copper wire coil and the COB of the IC card. As a result, it is required by ISO 7816-1 and ISO 10373-1. Mechanical bending stress requirements and mechanical warping stress requirements are satisfied. In addition, the IC card manufacturing method using the spot welding according to a preferred embodiment of the present invention by using a spot welding method that does not emit harmful substances, to completely solve the problem of environmental pollution caused by the conventional soldering technique It becomes possible.

Although the present invention has been described above with reference to preferred embodiments thereof, this is merely an example and is not intended to limit the present invention, and those skilled in the art do not depart from the essential characteristics of the present invention. It will be appreciated that various modifications and applications which are not illustrated above in the scope are possible. And differences relating to such modifications and applications should be construed as being included in the scope of the invention as defined in the appended claims.

The IC card manufactured using the spot welding according to the present invention and its manufacturing method can be widely used in all fields of manufacturing the IC card.

100: card
110: inlay layer
120: upper layer
130: lower layer
140: COB seating groove
150: COB
152: heat adhesive tape
154: integrated circuit
156, 158: contact part
160: copper wire coil
162, 164: both ends of the copper coil
200: core sheet
300: laminated card panel
400: laminated card
600: Combi Reel Chip

Claims (8)

An inlay layer having a copper wire coil embedded therein and attached to a front surface, wherein both ends of the copper coil are disposed in a predetermined region;
An upper layer having a COB seating groove formed in a region corresponding to a region in which both ends of the copper wire coil are disposed and disposed in front of the inlay layer;
An underlayer disposed on a rear surface of the inlay layer; And
A COB having a semiconductor chip including a first contact portion and a second contact portion, the COB being mounted in a COB seating groove of the upper layer;
Equipped with
Both end portions of the copper wire coils are spot welded and electrically connected to the first contact portion and the second contact portion of the COB, respectively. The method of claim 1, wherein the COB is
An IC card manufactured using spot welding, further comprising a hot-melt tape attached to an edge of the front surface. The method of claim 1,
The inlay layer is further provided with a chip receiving groove connected to the COB seating groove of the upper layer,
An IC card manufactured by spot welding, wherein the center of the chip receiving groove coincides with the center of the COB seating groove. In the method of manufacturing the IC card,
(a) preparing a laminated card comprising a top layer, an inlay layer and a bottom layer;
(b) preparing the COB;
(c) a first milling step of removing a partial region of the upper layer of the laminated card to form a COB seating groove exposing both ends of the copper coil attached to the inlay layer;
(d) extracting both ends of the copper coil;
(e) a second milling step of forming chip receiving grooves by removing corresponding portions of the inlay layer where both ends of the copper wire coil are exposed to a depth set so that COB can be mounted;
(f) connecting both end portions of the copper wire coils by spot welding with the first contact portion and the second contact portion of the COB, respectively; And
(g) mounting the COB in the COB seating groove;
IC card manufacturing method using a spot welding, comprising a. The method of claim 4, wherein
Before the step (f), the IC card manufacturing method using a spot welding, characterized in that further comprising the step of cutting the copper wire coil extracted in the step (d) to a predetermined length. The method of claim 4, wherein step (b)
Attaching a hot-melt tape to a rear surface of a Combi Reel Chip; And
And preparing a COB by punching the combi reel chip into a single semiconductor chip unit. The method of claim 4, wherein
Before the step (g), the method of manufacturing an IC card using spot welding, further comprising the step of bending the copper coil connected to the COB into the COB seating groove. The method of claim 4, wherein step (g)
First fixing the COB to the COB seating groove by applying heat and pressure to an upper edge of the COB; And
Manufacturing the IC card using spot welding, comprising: fixing the COB to the COB seating groove by applying heat and pressure stronger than heat and pressure when the first fixing to the upper surface edge of the COB is performed. Way.

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