KR20110037056A - Waste Printed Circuit Board Treatment Method - Google Patents
Waste Printed Circuit Board Treatment Method Download PDFInfo
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- KR20110037056A KR20110037056A KR20090094307A KR20090094307A KR20110037056A KR 20110037056 A KR20110037056 A KR 20110037056A KR 20090094307 A KR20090094307 A KR 20090094307A KR 20090094307 A KR20090094307 A KR 20090094307A KR 20110037056 A KR20110037056 A KR 20110037056A
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- KR
- South Korea
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- printed circuit
- circuit board
- substrate
- waste
- magnetic
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000002699 waste material Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 31
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 16
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000696 magnetic material Substances 0.000 claims abstract description 14
- 238000007885 magnetic separation Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007769 metal material Substances 0.000 claims abstract description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 238000010298 pulverizing process Methods 0.000 claims abstract description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 abstract description 9
- 238000000227 grinding Methods 0.000 abstract description 4
- 238000003672 processing method Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 238000000197 pyrolysis Methods 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000004821 distillation Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C23/00—Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
- B02C23/08—Separating or sorting of material, associated with crushing or disintegrating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/06—Jet mills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
- B02C19/186—Use of cold or heat for disintegrating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C1/00—Magnetic separation
- B03C1/02—Magnetic separation acting directly on the substance being separated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
본 발명은 폐인쇄회로기판의 처리방법에 관한 것으로, 더욱 상세하게는 인쇄회로기판의 회로배선을 고정·절연하는 수지에 브롬계난연제가 첨가된 인쇄회로기판에서 수지와 브롬을 제거할 수 있는 폐인쇄회로기판의 처리방법에 관한 것이다.The present invention relates to a method of treating a printed circuit board, and more particularly, to a waste which can remove resin and bromine from a printed circuit board in which a bromine-based flame retardant is added to a resin that fixes and insulates the circuit wiring of the printed circuit board. It relates to a processing method of a printed circuit board.
이를 위하여 본 발명은 브롬계난연제 BFR이 첨가된 폐인쇄회로기판을 파쇄, 분쇄 및 자기분리방법으로 폐인쇄회로기판의 함유물을 자성체 물질과 비자성체 물질로 분리하는 폐인쇄회로기판의 처리방법에 있어서, 폐인쇄회로기판을 파쇄한 후 상기 기판을 상기 기판이 연소하지 않으며 상기 기판의 금속재료가 산화되지 않는 분위기하에서 상기 기판을 건류하여 상기 기판의 수지성분내의 탄소(C), 수소(H), 질소(N), 산소(O), 브롬(Br)을 환원시켜 상기 기판으로부터 제거한 후 이후 공정인 자기분리공정에서 상기 기판의 자성체 물질과 비자성체 물질의 분리를 용이하게 분리하는 것에 특징이 있다.To this end, the present invention provides a method for treating a waste printed circuit board that separates the contents of the waste printed circuit board into magnetic and non-magnetic materials by crushing, pulverizing and magnetic separation of the waste printed circuit board to which the brominated flame retardant BFR is added. After the shredding of a closed printed circuit board, the substrate is carbonized in a resin composition of the substrate in the atmosphere in which the substrate is not combusted and the metal material of the substrate is not oxidized. , Nitrogen (N), oxygen (O) and bromine (Br) are reduced and removed from the substrate, and then the magnetic separation process of the substrate is characterized in that the separation of the magnetic material and the nonmagnetic material easily. .
폐인쇄회로기판, 브롬계난연제, 수지. 칩, 휴대폰, 피시, 파쇄, 분쇄, 건류, 자기분리, 환원, 자성체물질, 비자성체물질 Waste Printed Circuit Board, Bromine Flame Retardant, Resin. Chip, Mobile Phone, Fish, Shredding, Grinding, Drying, Magnetic Separation, Reduction, Magnetic Materials, Nonmagnetic Materials
Description
본 발명은 폐인쇄회로기판의 처리방법에 관한 것으로, 더욱 상세하게는 인쇄회로기판의 회로배선을 고정·절연하는 수지에 브롬계난연제가 첨가된 인쇄회로기판에서 수지와 브롬을 제거할 수 있는 폐인쇄회로기판의 처리방법에 관한 것이다.The present invention relates to a method of treating a printed circuit board, and more particularly, to a waste which can remove resin and bromine from a printed circuit board in which a bromine-based flame retardant is added to a resin that fixes and insulates the circuit wiring of the printed circuit board. It relates to a processing method of a printed circuit board.
기술혁신이 빠르게 진행되는 요즈음 민생용 기기나 산업용 기기등의 전기·전자기기(EEE)에서는 여러 가지의 기능이 전자회로에 의해서 제어되고 있으며 하드웨어의 부분인 회로기판은 급격하게 증가하고 있다. 그리고 전기·전자기기(EEE)가 수명이 다 되어 버려지는 전기·전자기기 폐기물(WEEE, waste electrical and electronic equipment)은 전세계적으로 매년 수천만톤 이상이 되며, 전기·전자기기 폐기물(WEEE)는 하드웨어 회로배선인 인쇄회로기판을 포함하고 있다. 예를 들면 피씨(PC)인 경우에 인쇄회로기판는 피씨(PC,personal computer)의 8％의 함량을 차지하며, 휴대폰(Mobile Phone)인 경우에 인쇄회로기판는 휴대폰의 50％ 이상의 함량을 차지하고 있다. 전기·전자기기 폐기물(WEEE)인 폐인쇄회로기판(Waste PCB)는 유독재료인 납(Pb), 브롬(Br), 벤젠, 카드뮴(Cd)을 함유하며, 동시에 금(Au), 팔라 듐(Pd), 은(Ag), 동(Cu)같이 고부가가치인 귀금속재료를 함유하고 있다. 그리고 전자기기의 소형화, 다기능화에 대응해 부품의 소형화, 예를 들면 인쇄회로기판의 고밀도화, 고기능화가 요구되여 인쇄회로기판는 기존의 단층 이외에 양면, 3층, 4층 등의 멀티층으로 설계제작된다. 인쇄회로기판(PCB)의 조성을 보면, 단층 인쇄회로기판은 동(Cu)을 5∼6％정도 함유하며, 양면 인쇄회로기판은 동(Cu)을 10∼12％정도 함유하며, 다층 인쇄회로기판은 동(Cu)을 20∼30％정도 함유하며, 리드프레임은 철(Fe), 니켈(Ni), 크롬(Cr)으로 구성되며, 인쇄회로기판을 솔더링하는 공정에서는 동(Cu), 주석(Sn), 납(Pb)등을 사용하며, 접점공정에서는 은(Ag), 금(Au), 팔라듐(Pd), 등이 사용된다. 인쇄회로기판은 기판재와 기판에 장착된 전자부품으로 구성된다. 기판재에는 배선재료로 동(Cu), 철(Fe)이 사용되며, 장착된 전자부품에는 칩(chip)과 기타부품등을 사용한다. 칩 특히 집적회로(ic, integrated circuits)는 다른 부품보다 금(Au), 은(Ag)같은 귀금속을 함유하고 있다. 인쇄회로기판은 1Kg 당 수백 mg의 금(Au)을 함유하고 있으며, 이는 금광에서 채굴되는 금광석에 함유된 금의 양이 평균 10 mg/Kg 에 비하여 상당히 높다.In today's fast-paced technological innovations, electrical and electronic devices (EEE), such as consumer devices and industrial devices, are controlled by electronic circuits, and circuit boards, part of hardware, are increasing rapidly. In addition, waste electrical and electronic equipment (WEEE), which is nearing the end of its life, becomes more than tens of millions of tons annually worldwide, and waste of electrical and electronic equipment (WEEE) is hardware. It includes a printed circuit board which is a circuit wiring. For example, in the case of PC, the printed circuit board accounts for 8% of the personal computer (PC), and in the case of a mobile phone, the printed circuit board comprises more than 50% of the mobile phone. Waste PCBs (WEEE) contain toxic materials such as lead (Pb), bromine (Br), benzene, and cadmium (Cd), while gold (Au) and palladium ( Pd), silver (Ag), copper (Cu) and contains high value-added precious metal materials. In addition to miniaturizing and multifunctional electronic devices, miniaturization of components, for example, high density and high functionality of printed circuit boards, is required. . In terms of the composition of a printed circuit board (PCB), a single-layer printed circuit board contains about 5 to 6% of copper (Cu), and a double-sided printed circuit board contains about 10 to 12% of copper (Cu) and a multilayer printed circuit board. It contains about 20 to 30% of silver copper (Cu), and the lead frame is composed of iron (Fe), nickel (Ni), and chromium (Cr). In the process of soldering a printed circuit board, copper (Cu) and tin ( Sn), lead (Pb), and the like, and silver (Ag), gold (Au), palladium (Pd), and the like are used in the contact process. The printed circuit board is composed of a substrate material and electronic components mounted on the substrate. Copper and iron are used for the wiring material, and chips and other parts are used for the mounted electronic parts. Chips, especially integrated circuits, contain precious metals like gold (Au) and silver (Ag) more than other components. Printed circuit boards contain hundreds of milligrams of gold (Au) per kilogram, which is considerably higher than the average of 10 mg / kg of gold in the gold ore mined from the gold mine.
우리나라에서 한 해 버려지는 휴대폰은 1300만대가 넘으며, 버려진 휴대폰의 주요부품인 인쇄회로기판은 그대로 폐기하거나, 또는 소각로에서 파쇄된 인쇄회로기판을 소각하여 금속을 회수하는 방법등이 시도되고 있다.More than 13 million mobile phones are discarded in Korea each year, and the printed circuit boards, which are the main parts of abandoned mobile phones, are discarded as they are, or incinerated shredded printed circuit boards are incinerated to recover metals.
수지(resin)에 브롬계난연제인 BFR(brominated flame retardants)가 첨가된 인쇄회로기판는 연소가 어렵고, 연소시에는 유해가스가 발생하는 등의 문제로 재활용하는데 어려움이 있다.Printed circuit boards to which brominated flame retardants (BFRs), which are brominated flame retardants, are added to resins, are difficult to combust and are difficult to recycle due to problems such as generation of harmful gases during combustion.
그리고 수지(resin)에 브롬계난연제인 BFR(brominated flame retardants)가 첨가된 인쇄회로기판을 파쇄공정 및 분쇄공정을 거쳐 자기분리(magnetic separation)방법으로 자성체 물질과 비자성체 물질로 분류할 때 인쇄회로기판의 수지와 브롬은 자기분리방법을 할 수 없게 한다는 등의 어려움이 있다.In addition, when a printed circuit board containing brominated flame retardants (BFR) added to a resin is classified into a magnetic material and a nonmagnetic material by a magnetic separation method through a crushing process and a crushing process, a printed circuit board is used. The resin and bromine of the substrate have a difficulty in that a magnetic separation method cannot be performed.
도 1은 종래의 폐인쇄회로기판의 처리방법의 플로우 차트(flow chart)이다.1 is a flow chart of a conventional method for processing a closed printed circuit board.
도1에서 도시한 바와 같이, 폐인쇄회로기판의 처리방법은 폐인쇄회로기판을 파쇄하는 공정(스텝 S1)과 파쇄된 폐인쇄회로기판을 반송 컨베이어로 이동하여 소각로인 킬른(klin)에 투입하여 폐인쇄회로기판을 소각로내에 체류시켜 소각처리하는 공정(스텝 S2)과 소각로에서 소각처리된 소각처리물을 배출하는 공정(스텝 S3)으로 구성되어 있다.As shown in FIG. 1, the method for treating a waste printed circuit board includes a process of crushing the waste printed circuit board (step S1) and moving the crushed waste printed circuit board to a conveying conveyor to put it into a kiln, which is an incinerator. And a step of holding the waste printed circuit board in the incinerator for incineration (step S2) and for discharging the incinerated material from the incinerator (step S3).
상술한 공정은 브롬계(취소계)난연제인 BFR(brominated flame retardants)가 첨가된 인쇄회로기판은 연소가 어렵고, 연소시에는 유해가스가 발생하는 등의 문제가 있다.In the above-described process, a printed circuit board to which brominated flame retardants (BFR) are added is difficult to burn, and harmful gases are generated during combustion.
그러나 폐인쇄회로기판의 종래 처리방법은 브롬계난연제인 BFR이 첨가된 인쇄회로기판을 킬른 소각로에서 소각할 때 연소가 어렵고 유해가스가 발생하는 등의 문제점으로 인쇄회로기판을 전량 폐기하여 인쇄회로기판이 함유한 귀금속 등의 금속재료를 재활용(reuse)하지 못하는 등의 문제점이 있다는 것이다.However, the conventional method of treating a closed printed circuit board is a problem that it is difficult to burn and harmful gas is generated when the printed circuit board containing BFR, which is brominated flame retardant, is burned in a kiln incinerator, so that the printed circuit board is discarded entirely. There is a problem such as the inability to recycle the metal material such as precious metals contained therein.
그리고 폐인쇄회로기판의 종래 처리방법은 브롬계난연제 BFR이 첨가된 인쇄 회로기판을 파쇄공정 및 분쇄공정을 거쳐 자기분리(magnetic separation)방법으로 자성체물질 과 비자성체 물질로 분류(분리)할 때 인쇄회로기판의 수지(resin)와 브롬(Br)으로 인하여 자기분리방법을 할 수 없게 하는 등의 문제점이 있다는 것이다.In the conventional method of treating a printed circuit board, the printed circuit board to which the brominated flame retardant BFR is added is classified into a magnetic material and a nonmagnetic material by a magnetic separation method through a crushing process and a crushing process. The resin and bromine (Br) of the circuit board has a problem such that the magnetic separation method is not possible.
본 발명은 이러한 과제를 해결할 수 있도록 건류(dry distillation)공정으로 브롬계난연제 BFR가 첨가된 인쇄회로기판에서 수지(resin)와 브롬(Br)을 제거하여 후속공정인 분쇄공정 이후 자기분리(magnetic separation)공정을 효과적으로 실시할 수 있는 폐인쇄회로기판의 처리방법을 제공하는 데 그 목적이 있다.In order to solve this problem, the present invention removes resin and bromine from a printed circuit board to which bromine-based flame retardant BFR is added in a dry distillation process, followed by magnetic separation after a crushing process. The purpose of the present invention is to provide a method for treating a closed printed circuit board which can effectively perform the process.
또, 발명은 브롬계난연제 BFR가 첨가된 폐인쇄회로기판으로부터 귀금속등의 금속재료를 효율적으로 분리하는 폐인쇄회로기판의 금속재료 분리 방법을 제공하는 데 그 목적이 있다.Another object of the present invention is to provide a method for separating metal materials of a waste printed circuit board which efficiently separates metal materials such as precious metals from the waste printed circuit board to which the brominated flame retardant BFR is added.
상기 목적을 달성하기 위하여 본 발명은 브롬계난연제 BFR이 첨가된 폐인쇄회로기판을 파쇄, 분쇄 및 자기분리방법으로 폐인쇄회로기판의 함유물을 자성체 물질과 비자성체 물질로 분리하는 폐인쇄회로기판의 처리방법에 있어서, 폐인쇄회로기판을 파쇄한 후 상기 기판을 상기 기판이 연소하지 않으며 상기 기판의 금속재료가 산화되지 않는 분위기하에서 상기 기판을 건류하여 상기 기판의 수지성분내의 탄소(C), 수소(H), 질소(N), 산소(O), 브롬(Br)을 환원시켜 상기 기판으로부터 제거한 후 이후 공정인 자기분리공정에서 상기 기판의 자성체 물질과 비자성체 물질의 분리를 용이하게 분리하는 것을 특징으로 하는 폐인쇄회로기판의 처리방법이 제공된다..In order to achieve the above object, the present invention provides a waste printed circuit board for separating the contents of the waste printed circuit board into a magnetic material and a non-magnetic material by crushing, pulverizing and magnetic separation of the waste printed circuit board to which the brominated flame retardant BFR is added. In the processing method of the present invention, after the waste printed circuit board is broken, the substrate is carbonized in the resin component of the substrate by carbonizing the substrate in an atmosphere in which the substrate does not burn and the metal material of the substrate is not oxidized. Hydrogen (H), nitrogen (N), oxygen (O) and bromine (Br) are reduced and removed from the substrate, and then the magnetic separation and nonmagnetic materials of the substrate are easily separated in the subsequent magnetic separation process. Provided is a method of treating a closed printed circuit board.
본 발명의 건류공정으로 기판내 수지성분인 탄소(C), 수소(H), 질소(N), 산소(O), 브롬(Br)을 환원시켜, 이후 공정인 자기분류공정에서 기판의 자성체 물질과 비자성체 물질을 분별 회수 할 수 있다. 그리고 건류공정시 발생한 가스를 회수하여 유해가스의 대기방출을 억제하여 지구 환경보호에 도움이 된다.In the distillation process of the present invention, carbon (C), hydrogen (H), nitrogen (N), oxygen (O), and bromine (Br), which are resin components in the substrate, are reduced, and the magnetic material of the substrate in the subsequent self-classification process. And non-magnetic material can be recovered. In addition, the gas generated in the dry distillation process is recovered to prevent the emission of harmful gases to the environment to help protect the environment.
본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.The present invention will now be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 폐인쇄회로기판의 처리방법의 공정 플로우 차트(process flow chart)이다.2 is a process flow chart of a method of treating a closed printed circuit board of the present invention.
파쇄(cutting)공정에서는 워터제트 절단기를 사용하여 폐인쇄회로기판를 20×20mm 사이즈로 절단한다. 워터제트 절단기의 고압분사수에 의해 필요한 크기로 절단할 수 있다.In the cutting process, the waste printed circuit board is cut into a 20 × 20 mm size using a water jet cutting machine. It can be cut into the required size by the high pressure jet of the water jet cutting machine.
건류(dry distillation)공정에서는 필요 크기로 절단된 폐인쇄회로기판, 여기서는 20×20mm 사이즈로 절단된 기판을 건류로((dry distillation furnace)에 투입하여 여러 종류의 다양한 건류 분위기하에서 실시한다. 건류를 위한 가열방법으로는 전기로식, 적외선가열식, 원적외선가열식, 유도가열식, 열풍식 등의 가열방식을 사용할 수 있다. 폐인쇄회로기판의 수지성분이 연소하지 않거나 기판의 금속재료의 산화를 억제하기 위해서는 건류분위기를 진공상태나 불활성가스 분위기하에서 실시하는 것이 바람직하다. 불활성가스란, 헬륨, 아르곤, 질소 등의 가스를 이용할 수 있다. 폐인쇄회로기판에 난연제, 예를 들면 브롬계난연제 BFR이 첨가된 폐인쇄 회로기판인 경우에는 공기 분위기중에서도 기판 성분은 연소하기 어려우며, 공기 분위기로 가열하여 건류를 할 수 있으나 기판의 금속재료의 산화정도가 문제점으로 건류공정은 불활성가스 분위기하에서 실시하는 것이 바람직하다.In the dry distillation process, a closed printed circuit board cut to a required size, here a substrate cut to a size of 20 × 20 mm, is put into a dry distillation furnace and subjected to various types of dry distillation atmosphere. The heating method can be electric furnace, infrared heating, far-infrared heating, induction heating, hot air, etc. Heating method is used in order to prevent the resin component of the closed printed circuit board from burning or to suppress oxidation of the metal material of the substrate. It is preferable to carry out the atmosphere in a vacuum or inert gas atmosphere, and inert gas may be a gas such as helium, argon, nitrogen, etc. A waste in which a flame retardant such as brominated flame retardant BFR is added to a waste printed circuit board. In the case of a printed circuit board, the board components are difficult to burn even in the air atmosphere, and the carbon dioxide can be dried by heating in the air atmosphere. However, since the degree of oxidation of the metal material of the substrate is a problem, the distillation process is preferably performed under an inert gas atmosphere.
본 발명의 건류공정은 불활성 아르곤가스 분위기로 폐인쇄회로기판의 기판 부분의 온도가 350℃이상 600℃이하에서 1 ∼ 2시간 정도의 처리시간동안 가열하는 공정이다. 이 가열공정에 의해서 폐인쇄회로기판의 수지성분내의 탄소(C), 수소(H), 질소(N), 산소(O), 브롬(Br)을 환원시킨다. 건류공정시 발생한 가스는 에탄올, 실리카 겔, 10％ 수산화나트륨수용액으로 회수하여 유해가스의 대기방출을 억제한다. 그리고 건류공정 전후의 절단된 폐인쇄회로기판의 무게를 보면 건류공정후 수지성분내의 탄소(C), 수소(H), 질소(N), 산소(O), 브롬(Br)이 제거되어 무게가 감소되었음을 무게측정을 통하여 알 수 있다. 그리고 건류공정으로 폐인쇄회로기판을 취화(brittle)시킨다.The dry distillation process of the present invention is a process of heating the substrate portion of the closed printed circuit board in the inert argon gas atmosphere for a processing time of about 1 to 2 hours at 350 ° C or higher and 600 ° C or lower. By this heating process, carbon (C), hydrogen (H), nitrogen (N), oxygen (O) and bromine (Br) in the resin component of the closed printed circuit board are reduced. The gas generated during the distillation process is recovered with ethanol, silica gel and 10% aqueous sodium hydroxide solution to suppress the release of harmful gases into the air. The weight of the closed printed circuit board before and after the distillation process shows that the carbon (C), hydrogen (H), nitrogen (N), oxygen (O) and bromine (Br) in the resin components are removed after the distillation process. It can be seen from the weighing that it has been reduced. In addition, the waste printed circuit board is brittle by a dry distillation process.
건류공정이 끝나면 분쇄공정으로 이동하기 전에 냉각공정을 실시한다. 냉각공정이란 건류공정으로 가열된 폐인쇄회로기판을 냉각하는 공정이다. 건류공정으로 고온상태에 있는 폐인쇄회로기판을 그대로 대기중에 노출할 경우 폐인쇄회로기판 부분이 연소하거나 금속재료가 산화함으로 기판부분의 연소나 금속재료의 산화를 방지하기 위해서 폐인쇄회로기판을 불활성가스 분위기하에서 냉각하는 것이다.After the drying process, the cooling process is carried out before moving to the grinding process. The cooling process is a process of cooling the waste printed circuit board heated by the dry distillation process. If the waste printed circuit board is exposed to the atmosphere at high temperature by the dry distillation process, the waste printed circuit board is burned or the metal material is oxidized. Therefore, the waste printed circuit board is inactivated to prevent combustion of the board part or oxidation of the metal material. It cools in a gas atmosphere.
분쇄공정에서는 냉각공정으로 냉각된 폐인쇄회로기판을 분쇄장치를 사용하여 분쇄한다. 분쇄장치로는 장치구성이 비교적 단순한 볼 밀(ball mill)방식의 분쇄기가 바람직하다.In the grinding process, the waste printed circuit board cooled by the cooling process is ground using a grinding apparatus. As a mill, a ball mill type mill is preferable, which is relatively simple in configuration.
분리공정에서는 먼저 체(sieve)를 사용하여 250um미만 , 250um이상 의 분쇄입자크기로 나눈다. 그리고 250um이상 의 분쇄입자크기는 자기분리방법을 사용하여 자성체 물질과 비자성체 물질로 분리한다. 자성체 물질에는 철(Fe), 니켈(Ni)이 대부분을 차지하며, 한편 비자성체 물질에는 동(Cu)이 대부분을 차지하고 있다. 한편 주석(Sn), 납(Pb), 은(Ag), 금(Au), 팔라듐(Pd)은 자성체 물질과 비자성체 물질 모두에서 분리·회수된다.In the separation process, a sieve is first used to divide the powder into particles having a particle size of less than 250 μm and more than 250 μm. And the particle size of more than 250um is separated into magnetic material and nonmagnetic material by using magnetic separation method. Iron (Fe) and nickel (Ni) occupy most of the magnetic material, while copper (Cu) occupies most of the nonmagnetic material. Meanwhile, tin (Sn), lead (Pb), silver (Ag), gold (Au), and palladium (Pd) are separated and recovered from both magnetic and nonmagnetic materials.
도 1은 종래의 폐인쇄회로기판의 처리방법의 플로우 차트(flow chart)이다.1 is a flow chart of a conventional method for processing a closed printed circuit board.
도 2는 본 발명의 폐인쇄회로기판의 처리방법의 처리장치를 보여주는 그림이다.2 is a view showing a processing apparatus of the processing method of the closed printed circuit board of the present invention.
Claims (3)
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| CN106079001A (en) * | 2016-06-20 | 2016-11-09 | 浙江旺林生物科技有限公司 | A kind of nano bamboo powdered carbon production technology |
| US12186786B2 (en) | 2019-02-28 | 2025-01-07 | Mitsubishi Materials Corporation | Method for treating waste electronic substrate |
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| CN106079001A (en) * | 2016-06-20 | 2016-11-09 | 浙江旺林生物科技有限公司 | A kind of nano bamboo powdered carbon production technology |
| US12186786B2 (en) | 2019-02-28 | 2025-01-07 | Mitsubishi Materials Corporation | Method for treating waste electronic substrate |
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