KR20100123303A - Replication mold forming method using imprint process - Google Patents

Abstract

The present invention comprises the steps of forming an embossed and intaglio pattern on the master substrate; Forming a liquid material on the master substrate; Bonding the back plane onto the liquid material; And partially pressing the backplane and solidifying the liquid material.

Description

Manufacturing method of imprint replication mold {REPLICATION MOLD FORMING METHOD USING IMPRINT PROCESS}

The present invention relates to a method for manufacturing an imprint replica mold.

In the imprint method, the manufacturing process of the mold is to shade using a master substrate and a back plane to form a replica mold. In this method, a pattern is formed on the master substrate, and an ultraviolet (UV) curable resin (resin), which is a material of the mold, is formed, and then the mold back plane is bonded to support the mold. Then, after bonding, ultraviolet rays are irradiated in a vacuum or inert gas atmosphere to cure the liquid ultraviolet curable resin, and then the master substrate and the mold are separated to form a replica mold for imprint.

Since the imprint method is a technique of replicating the replica as it is, the pattern formed on the master substrate is reflected in the replica. Therefore, when the material of the replica mold shrinks or expands in the manufacturing process, the total pitch of the replica mold changes. As such, when the overall dimensions of the replication mold are changed, a defect occurs in the final product in which the replication mold is used, and thus, a method for coping with such a problem is required.

The present invention for solving the above problems of the background art, when manufacturing a replica mold by an imprint method, provides a method of manufacturing an imprint method replica mold capable of offset correction of the replica mold to control the overall dimensions of the replica mold It is.

Embodiments of the present invention as a means for solving the above problems, forming a pattern of embossed and intaglio on the master substrate; Forming a liquid material on the master substrate; Bonding the back plane onto the liquid material; And partially pressing the backplane and solidifying the liquid material.

In another aspect, an embodiment of the present invention, forming a pattern of embossed and intaglio on the master substrate; Forming a curable liquid material on the master substrate; Bonding the back plane onto the liquid material; And partially pressurizing the backplane under asymmetrical pressure conditions and solidifying the liquid material.

When solidifying the liquid material, the pressure condition applied to the backplane may proceed while the liquid material is transferred.

When partially pressing the backplane, pressing may be performed by pressing a pressurizing substrate which is placed on the surface of the backplane and has a pressurizing portion protruding from one surface of the pressing substrate facing the surface of the backplane.

The pressurizing substrate has a symmetrical pressure condition in a region corresponding to the first outer surface and the second outer surface defined on the surface of the backplane through the pressing portion including the first pressing portion and the second pressing portion respectively protruding at the same height. Can be passed.

The pressurizing substrate may transmit pressure conditions to a region corresponding to the center surface defined on the surface of the backplane through the protruding pressurization portion.

When partially pressing the backplane, it can be pressed by rolling a cylindrical roller placed on the surface of the backplane.

The cylindrical roller applies an asymmetric pressure condition to an area corresponding to a first outer surface and a second outer surface defined on the surface of the backplane and an area corresponding to a central surface located between the first outer surface and the second outer surface. I can deliver it.

The cylindrical roller can transmit pressure only to the first outer surface and the second outer surface.

The cylindrical roller can transmit pressure only to the central surface.

The present invention has the effect of providing a method for manufacturing an imprint method replica mold capable of offset correction of the replication mold to control the overall dimensions of the replication mold when manufacturing the replica mold by the imprint method. For this reason, the present invention can increase the completeness and precision in manufacturing the replication mold, it is possible to improve the yield and quality of the object to which the replication mold is transferred.

Hereinafter, with reference to the accompanying drawings, the specific content for the practice of the present invention will be described.

First Embodiment

1 to 11 are views for explaining a manufacturing method according to a first embodiment of the present invention.

As shown in FIG. 1 and FIG. 2, an embossed and intaglio pattern PT is formed on the master substrate 150.

On the master substrate 150, a material MM, for example, a metal or a polymer, to form a pattern is formed. In addition, a photoresist PR may be formed on the material MM to form the pattern PT. Then, a part of the photosensitive layer PR is removed to form the material MM in a desired shape through a photolithography process. When dry or wet etching is performed according to the material MM formed on the master substrate 150, a pattern PT of an embossed and intaglio is formed on the master substrate 150. Thereafter, the photosensitive layer PR remaining on the master substrate 150 is removed. Although not shown, a material such as a release layer may be coated on the surface of the pattern PT.

Next, as shown in FIG. 3, the step of forming the curable liquid material 160 on the master substrate 150 is performed.

The liquid material 160 may be formed on the master substrate 150 using any one of dispensing, spin coating, and inkjet. The liquid material 160 may be selected as an ultraviolet curable material such as resin, but may also be selected as a thermosetting material. When the liquid material 160 is selected as an ultraviolet curable material, a method of solidifying it may be selected from an ultraviolet irradiation method. When the liquid material 160 is selected as a thermosetting material, a method of solidifying it may be selected by a heat irradiation method. have. In the embodiment, the liquid material 160 is selected as an ultraviolet curable material as an example.

Next, as shown in FIG. 4, the step of attaching the back plane 170 to the master substrate 150 on which the liquid material 160 is formed is performed.

The back plane 170 is bonded to the master substrate 150 on which the liquid material 160 is formed. The backplane 170 may be selected as a substrate having a flat surface facing the master substrate 150, but is not limited thereto. Here, when the liquid material 160 is selected as an ultraviolet curable material, the back plane 170 is selected as an ultraviolet light transmitting material.

Next, as shown in FIGS. 5 to 7, the step of partially pressing the outer surfaces EP1 and EP2 of the backplane 170 is performed.

The reason for partially pressing the outer surfaces EP1 and EP2 of the backplane 170 is to perform offset correction to control the total pitch of the replica mold. In an embodiment, the outer surface of the backplane 170 such that condensation stress of the liquid material 160 is generated in the direction of the center of the backplane 170 by the pressure transmitted to the outer surfaces EP1, EP2 of the backplane 170. Pressurize. The method for pressing the outer surfaces EP1 and EP2 of the backplane 170 may be selected from the following two methods.

The first method uses the pressure substrate 180 as shown in FIG. In the first method, the pressure substrate 180 has a backplane such that symmetrical pressure conditions are transmitted to an area corresponding to the first outer surface EP1 and the second outer surface EP2 defined on the surface of the backplane 170. On one surface of the pressing substrate 180 facing the surface of 170 has a pressing portion (185a, 185b) including a first pressing portion 185a and a second pressing portion 185b protruding at the same height. The press substrate 180 shown is aligned on the back plane 170 to press the defined area on the surface of the back plane 170 through the press portions 185a and 185b when pressurized by a press or the like. The second method uses a cylindrical roller 190 as shown in FIGS. 6 and 7. In the second method, the cylindrical roller 190 is pressurized to transmit symmetrical pressure conditions to the regions corresponding to the first outer surface EP1 and the second outer surface EP2 defined on the surface of the backplane 170. The surface of the backplane 170 is rolled while varying the strength of the force. The illustrated cylindrical roller 190 rolls on the surface of the back plane 170 and rests on the surface of the back plane 170 to press the defined area.

Using the two methods described above, a symmetrical pressure condition is transmitted to an area corresponding to the first outer surface EP1 and the second outer surface EP2 defined on the surface of the backplane 170 and the backplane 170 The pressure is not transmitted to the area corresponding to the central surface (CP). Alternatively, using the two methods described above, an asymmetrical pressure condition is transmitted to an area corresponding to the first outer surface EP1 and the second outer surface EP2 defined on the surface of the backplane 170 and the backplane ( Pressure is not transmitted to the region corresponding to the central surface CP of 170. Alternatively, by using the two methods described above, a symmetrical or asymmetrical pressure condition is transmitted to an area corresponding to the first outer surface EP1 and the second outer surface EP2 defined on the surface of the backplane 170 and the back A pressure lower than the pressure transmitted to the regions corresponding to the first outer surface EP1 and the second outer surface EP2 is transmitted to the region corresponding to the center surface CP of the plane 170. Summarizing the above description into a relational expression is as shown in Equation 1 below.

EP1 (= EP2, ≠ EP2)> CP (= 0, ≠ 0)

According to the above methods, the pressure applied to the area corresponding to the first outer surface EP1 and the second outer surface EP2 and the area corresponding to the central surface CP is different from the surface of the back plane 170. The pressure condition is transmitted.

Next, as shown in FIG. 8, the step of solidifying the liquid material 160 is performed. Here, the embodiment divided the pressing step and the solidification step for convenience of description, but this may be performed in the same step.

Ultraviolet (UV) radiation is applied to the backplane 170 to solidify the liquid material 160. Ultraviolet (UV) irradiation may be performed while the pressure condition applied to the backplane 170 is transferred to the liquid material 160. The apparatus for irradiating ultraviolet rays (UV) may use an ultraviolet lamp, but is not limited thereto. The ultraviolet lamp irradiating ultraviolet (UV) light on the backplane 170 may be provided with a control device to adjust the intensity and time of the ultraviolet light (UV) to be irradiated. When ultraviolet light (UV) is irradiated on the back plane 170, the liquid material 160 formed between the master substrate 150 and the back plane 170 is cured. In an embodiment, the mark M is formed together with the pattern PT on the master substrate 150. The mark M formed on the master substrate 150 is then used to sense an offset change to control the overall dimensions of the finished replica mold. The mark M formed on the master substrate 150 is transferred to the replica mold.

As shown in FIG. 9, when the surface of the backplane 170 is partially pressurized according to an embodiment, symmetry is performed on an area corresponding to the first outer surface EP1 and the second outer surface EP2 of the backplane 170. A non-pressure section (or low pressure section) in which a pressure condition (or a high pressure section) (section A, section C) through which pressure conditions are transmitted is formed and corresponding to the center surface CP of the backplane 170 is not transmitted. Pressure section) (section B) is formed. Accordingly, the liquid material 160 is cured by irradiated ultraviolet light (UV) while stress condensed toward the center of the backplane 170 is generated.

10 and 11, when the backplane 170 is separated from the master substrate 150 after the process according to the embodiment, the condensed stress is directed toward the outer side of the backplane 170. The pulley (Release) will increase the overall dimensions of the replication mold (MD). Hereinafter, an experimental example using the process according to the embodiment will be described.

Experimental Example

(1) Pressure condition: Pressurized using a cylindrical roller 190 (substrate size: 370 mm * 470 mm) (2) Process progress condition: The first outer surface (EP1) and the second outer surface of the backplane 170 Set the length of the pressure section (Section A, C) where the symmetrical pressure conditions are transmitted to the area corresponding to (EP2) to 100 mm. Set the strength of the pressure applied to the pressure section (Section A, C) to 11.5kgf. Non-pressure section (section B) is not pressurized. (3) Measurement of the overall dimensions of the replica mold: (a) In the long axis direction, the replica mold (MD) is increased by an average of 7.28 μm relative to the master substrate. (b) In the uniaxial direction, the replica mold (MD) fluctuates within 1 μm relative to the master substrate (ie, almost no significant difference).

Referring to the above experimental example, the overall size of the replication mold MD is formed by using the first mark M1 formed on the master substrate 150 and the second mark M2 transferred to the replication mold MD. It can be understood that the evaluation can be performed by calculating the offset CV which is a change value of. Therefore, the embodiment can control the overall dimensions of the replication mold MD by varying the pressure conditions when the backplane 170 is pressed.

Thereafter, the completed replication mold MD may be transferred onto the target substrate. The target substrate may be used to transfer the replication mold MD, such as a liquid crystal display device and an organic light emitting display device. Examples thereof include a display device and other semiconductors, but are not limited thereto.

Second Embodiment

12 to 18 are views for explaining a manufacturing method according to a second embodiment of the present invention.

Prior to the description of the second embodiment, forming the embossed and intaglio pattern PT on the master substrate 250 to attaching the backplane 270 to the master substrate 250 on which the liquid material 260 is formed. Steps are described in detail in the first embodiment (refer to the description of FIGS. 1 to 4), and will be omitted to avoid duplication of description.

Next, as shown in FIGS. 12 to 14, the step of partially pressing the center surface CP of the backplane 270 is performed.

The reason for partially pressing the center surface CP of the backplane 270 is to perform offset correction to control the total pitch of the replica mold. In an embodiment the center surface CP of the backplane 270 such that condensation stress of the liquid material 260 occurs in the outward direction of the backplane 270 by the pressure delivered to the center surface CP of the backplane 270. Press). The pressing method of the center surface CP of the backplane 270 may be selected from one of the following two methods.

The first method uses a pressure substrate 280 as shown in FIG. In the first method, the pressurizing substrate 280 faces the surface of the backplane 270 so that the pressure condition is transmitted to an area corresponding to the center surface CP defined on the surface of the backplane 270. 280 has a pressing portion 285 protruding from one side thereof. The pressurized substrate 280 shown is placed on the surface of the backplane 270 to press the defined area on the surface of the backplane 270 through the pressurizing portion 285 when pressurized by a press or the like. The second method uses a cylindrical roller 290 as shown in FIGS. 13 and 14. In the second method, the cylindrical roller 290 varies the strength of the force that is pressurized so that pressure is transmitted to an area corresponding to the center surface CP defined on the surface of the backplane 270 and of the backplane 270. Roll the surface. The illustrated cylindrical roller 290 rolls on the surface of the backplane 270 and rests on the surface of the backplane 270 to press the defined area.

Using the two methods described above, a pressure is applied to an area corresponding to the center surface CP defined on the surface of the backplane 270 and an area corresponding to the outer surfaces EP1 and EP2 of the backplane 270. No pressure is delivered. Alternatively, by using the two methods described above, high pressure is transmitted to a region corresponding to the center surface CP defined on the surface of the backplane 270 and corresponds to the outer surfaces EP1 and EP2 of the backplane 270. The low pressure of the symmetrical or asymmetrical conditions is transmitted to the region. Summarizing the above description into a relational expression is as shown in Equation 2 below.

CP (≠ 0)> EP1 (= EP2, ≠ EP2)

According to the above methods, the surface of the backplane 270 has an asymmetrical difference in pressure applied to the region corresponding to the first outer surface EP1 and the second outer surface EP2 and the region corresponding to the central surface CP. The pressure condition is transmitted.

Next, as shown in FIG. 15, the step of solidifying the liquid material 260 is performed. Here, the embodiment divided the pressing step and the solidification step for convenience of description, but this may be performed in the same step.

Ultraviolet (UV) radiation is applied to the backplane 270 to solidify the liquid material 260. Ultraviolet (UV) irradiation may proceed with the pressure conditions applied to the backplane 270 transferred to the liquid material 260. The apparatus for irradiating ultraviolet rays (UV) may use an ultraviolet lamp, but is not limited thereto. Ultraviolet lamps irradiating ultraviolet (UV) light on the backplane 270 may be provided with a control device to adjust the intensity and time of the ultraviolet (UV) light to be irradiated. When ultraviolet light (UV) is irradiated on the backplane 270, the liquid material 260 formed between the master substrate 250 and the backplane 270 is cured. In an embodiment, the mark M is formed on the master substrate 250 together with the pattern PT. The mark M formed on the master substrate 250 is then used to sense an offset change to control the overall dimensions of the finished replica mold. The mark M formed on the master substrate 250 is transferred to the replica mold.

As shown in FIG. 16, when the surface of the backplane 270 is partially pressurized according to an embodiment, a pressure section (or a high pressure section) in which pressure conditions are transmitted to an area corresponding to the center surface CP of the backplane 270. A non-pressure section (or low pressure section) in which a pressure condition is not transmitted to a region where a section B is formed and corresponding to the first outer surface EP1 and the second outer surface EP2 of the backplane 270 ( Section A and section C) are formed. Accordingly, the liquid material 260 is hardened by the irradiated ultraviolet light (UV) while generating a stress condensed in the outer direction of the backplane 270.

As shown in FIGS. 17 and 18, when the backplane 270 is separated from the master substrate 250 after the process according to the embodiment, the condensed stress is directed toward the center of the backplane 270. The pulley (Release) is reduced the overall dimensions of the replication mold (MD). Hereinafter, an experimental example using the process according to the embodiment will be described.

Experimental Example

(1) Pressure condition: Pressurized using the cylindrical roller 290 (substrate size: 370 mm * 470 mm) (2) Process progress condition: Pressure condition in the area corresponding to the center surface (CP) of the backplane 270 Set the length of this pressure section (section B) to 200 mm. Set the strength of the pressure applied to the pressure section (section B) to 11.5 kgf. Non-pressure section (section A, section C) is not pressurized. (3) Measurement of the overall dimensions of the replica mold: (a) In the long axis direction, the replica mold (MD) is reduced by 7.28 µm on average compared to the master substrate. (b) In the uniaxial direction, the replica mold (MD) fluctuates within 1 μm relative to the master substrate (ie, almost no significant difference).

Referring to the above experimental example, the overall dimensions of the replication mold MD are formed by using the first mark M1 formed on the master substrate 250 and the second mark M2 transferred to the replication mold MD. It can be understood that the evaluation can be performed by calculating the offset CV which is a change value of. Therefore, the embodiment can control the overall dimensions of the replication mold MD by varying the pressure conditions when the backplane 270 is pressed.

Subsequently, the completed replication mold MD may be transferred onto the target substrate. The target substrate may be a liquid crystal display device, an organic light emitting display device, and a place for transferring the replication mold MD. Examples thereof include the same display device and other semiconductors, but are not limited thereto.

As described above, an embodiment of the present invention provides a method for manufacturing an imprint method replica mold capable of offset correction of the replica mold when the replica mold is manufactured by an imprint method so as to control the overall dimensions of the replica mold. In addition, the embodiment of the present invention can be applied to the substrate printing as well as the production method of the replica mold. In addition, by using the embodiment of the present invention it is possible to reduce the required cost according to the selection of the master substrate. In addition, by using an embodiment of the present invention it is possible to further secure a margin for the overall dimensional control to increase the completeness of the replica mold when manufacturing the master substrate.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 to 11 are views for explaining a manufacturing method according to a first embodiment of the present invention.

12 to 18 are views for explaining a manufacturing method according to a second embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

150, 250: master substrate 160, 260: liquid material

170, 270: backplane 180, 280: pressurized substrate

190, 290: Cylindrical Roller PT: Pattern

MD: Replica Mold M: Mark

Claims (10)

Forming an embossed and intaglio pattern on the master substrate; Forming a liquid material on the master substrate; Bonding a back plane onto the liquid material; And Partially pressurizing said backplane and solidifying said liquid material. Forming an embossed and intaglio pattern on the master substrate; Forming a curable liquid material on the master substrate; Bonding a back plane onto the liquid material; And Partially pressurizing the backplane under asymmetric pressure conditions and solidifying the liquid material. The method according to claim 1 or 2, When solidifying the liquid material, And a pressure condition applied to the backplane is transferred to the liquid material. The method of claim 1, When partially pressurizing the backplane, And pressurizing the pressing substrate having a pressing portion protruding on one surface of the pressing substrate facing the surface of the backplane and pressing the pressing substrate on the surface of the backplane. The method of claim 4, wherein The pressurized substrate, A symmetrical pressure condition is transmitted to a region corresponding to the first outer surface and the second outer surface defined on the surface of the backplane through the pressing portion including the first pressing portion and the second pressing portion, respectively protruding at the same height. Method for producing an imprint replication mold, characterized in that. The method of claim 4, wherein The pressurized substrate, And a pressure condition is transmitted to a region corresponding to a central surface defined on the backplane through the protruding pressing portion. The method of claim 2, When partially pressurizing the backplane, And pressing by rolling a cylindrical roller placed on the surface of the backplane. The method of claim 7, wherein The cylindrical roller, The asymmetrical pressure condition is applied to an area corresponding to a first outer surface and a second outer surface defined on the surface of the backplane and to an area corresponding to a central surface located between the first outer surface and the second outer surface. Method of manufacturing an imprint replication mold, characterized in that the transfer. The method of claim 8, The cylindrical roller, The method for manufacturing an imprint replica molding, characterized in that the pressure is transmitted only to the first outer surface and the second outer surface. The method of claim 8, The cylindrical roller, The method of manufacturing an imprint replica molding, characterized in that the pressure is transmitted only to the central surface.

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