[go: up one dir, main page]

KR20100093983A - Fixing apparatus for lead frame - Google Patents

Fixing apparatus for lead frame Download PDF

Info

Publication number
KR20100093983A
KR20100093983A KR1020090013163A KR20090013163A KR20100093983A KR 20100093983 A KR20100093983 A KR 20100093983A KR 1020090013163 A KR1020090013163 A KR 1020090013163A KR 20090013163 A KR20090013163 A KR 20090013163A KR 20100093983 A KR20100093983 A KR 20100093983A
Authority
KR
South Korea
Prior art keywords
lead frame
lead
window
inner lead
windows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020090013163A
Other languages
Korean (ko)
Inventor
박주훈
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020090013163A priority Critical patent/KR20100093983A/en
Publication of KR20100093983A publication Critical patent/KR20100093983A/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: The clamping apparatus of lead frame is proceed the wire bonding through a plurality of windows. The work efficiency is improved and the productivity is improved. CONSTITUTION: A plurality of windows(26) has the constant interval for the wire bonding. The window clamp(30) comprises the flange(40) arranged in both ends of the window. The lead frame(50) comprises the first inner-lead(51) and the second inner-lead(52) wire-bonded on the window. In the second inner-lead, the light emitting diode chip(60) is attached. The open area(53) is formed between the first inner-lead and the second inner-lead.

Description

리드 프레임 고정장치{Fixing apparatus for lead frame}Fixing apparatus for lead frame

실시 예는 리드 프레임 고정장치에 관한 것이다.Embodiments relate to a lead frame fixture.

와이어 본딩(wire bonding) 공정은 반도체 패키지 제작을 위한 여러 공정 중의 하나로서, 반도체칩의 본딩패드(bonding pad)와 이에 대응되는 리드프레임의 인너리드(inner lead)를 금선(Au wire)과 같은 도전성 금속선으로 연결하는 공정이다. 이러한 와이어 본딩 공정이 진행되는 과정에서 리드 프레임의 유동을 억제하기 위하여 리드프레임 고정장치가 사용된다.The wire bonding process is one of several processes for manufacturing a semiconductor package. The wire bonding process is a conductive pad such as an Au wire that connects an inner lead of a bonding pad of a semiconductor chip and a corresponding lead frame. It is a process of connecting with a metal wire. The lead frame fixing device is used to suppress the flow of the lead frame during the wire bonding process.

실시 예는 복수개의 윈도우를 갖는 윈도우 클램프로 리드 프레임을 가압하고 발광 다이오드 칩에 대해 와이어 본딩을 실시할 수 있도록 한 리드 프레임 고정장치를 제공한다.The embodiment provides a lead frame fixing device for pressing a lead frame with a window clamp having a plurality of windows and enabling wire bonding to a light emitting diode chip.

실시 예에 따른 리드 프레임 고정장치는, 와이어 본딩을 위해 일정 간격을 갖는 복수개의 윈도우 및, 상기 윈도우의 양단에 배치된 플랜지를 포함하는 윈도우 클램프; 상기 윈도우 클램프 아래에 히터 블록; 상기 히터 블록 위에 놓여져 상기 윈도우 클램프에 의해 가압받고, 상기 윈도우 상에서 와이어 본딩되는 제1이너 리드 및 발광 다이오드 칩이 부착된 제2이너 리드를 갖는 리드 프레임을 포함한다.According to an exemplary embodiment, a lead frame fixing apparatus includes: a window clamp including a plurality of windows having a predetermined interval for wire bonding and flanges disposed at both ends of the window; A heater block under the window clamp; And a lead frame having a second inner lead attached to the heater block and pressed by the window clamp and wire-bonded on the window, and a second inner lead attached to a light emitting diode chip.

실시 예는 복수개의 윈도우를 통해 와이어 본딩을 수행함으로써, 생산성을 개선시켜 줄 수 있다.The embodiment may improve productivity by performing wire bonding through a plurality of windows.

실시 예는 와이어 본딩에 따른 작업 효율을 개선시켜 줄 수 있다.The embodiment can improve the work efficiency according to the wire bonding.

실시 예는 리드 프레임의 용적률을 개선시켜 줄 수 있다.The embodiment can improve the volume ratio of the lead frame.

이하, 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings as follows.

도 1은 실시 예에 따른 윈도우 클램프를 나타낸 사시도이다.1 is a perspective view showing a window clamp according to an embodiment.

도 1을 참조하면, 윈도우 클램프(30)는 판 형태로 형성되며, 복수개의 윈도 우(26)와 플랜지(40)를 포함한다. 상기 복수개의 윈도우(26)는 일정 크기의 구멍을 갖고 일정 간격으로 어레이된다. 상기 윈도우(26)는 예컨대, 반도체 칩 등이 어레이된 칩 탑재 영역에 일대일 대응되는 크기로 형성될 수 있다.Referring to FIG. 1, the window clamp 30 is formed in a plate shape and includes a plurality of windows 26 and a flange 40. The plurality of windows 26 are arranged at regular intervals with holes of a predetermined size. For example, the window 26 may be formed to have a size corresponding to one-to-one in a chip mounting region in which semiconductor chips and the like are arrayed.

여기서, 상기 각 윈도우(26)는 상기 칩 탑재 영역과 1:1로 대응되거나, 1:2, 1:3 등과 같이 1:N로 대응되는 크기로 형성될 수 있다. Here, each of the windows 26 may correspond to the chip mounting region in a one-to-one ratio, or may be formed in a size corresponding to one-to-one, such as 1: 2 and 1: 3.

상기 윈도우 클램프(30)의 윈도우(26)는 리드 프레임의 칩 탑재 영역의 행 단위 또는 열 단위로 대응되게 형성될 수 있다.The window 26 of the window clamp 30 may be formed to correspond to a row unit or a column unit of the chip mounting region of the lead frame.

상기 플랜지(40)는 윈도우 클램프(30)의 양단에 위로 단차지게 형성되며, 가압수단(미도시)에 의해 하 방향으로 가압력을 받는 부분이다. The flange 40 is formed to be stepped up at both ends of the window clamp 30, and is a portion to receive the pressing force in the downward direction by the pressing means (not shown).

도 2는 실시 예에 따른 윈도우 클램프와 리드 프레임의 분해 사시도이다.2 is an exploded perspective view of a window clamp and a lead frame according to an embodiment.

도 2를 참조하면, 상기 윈도우 클램프(30)는 제1 방향으로 배치되며, 리드 프레임(50) 위에 배치된다. Referring to FIG. 2, the window clamp 30 is disposed in the first direction and is disposed on the lead frame 50.

상기 리드 프레임(50)에는 발광 다이오드 칩(60)이 각 칩 탑재 영역마다 탑재되며, 복수개의 칩 탑재 영역(55)은 일정 크기(A1: 패키지 크기)로 가로 및 세로로 배열된다. 상기 칩 탑재 영역(55)에는 제1이너 리드(51)와 제2이너 리드(52)가 형성되고, 상기 제1이너 리드(51)와 제2이너 리드(52) 사이에 이들을 이격시켜 주는 오픈 영역(53)이 형성된다.A light emitting diode chip 60 is mounted in each of the chip mounting regions in the lead frame 50, and the plurality of chip mounting regions 55 are arranged horizontally and vertically in a predetermined size (A1: package size). A first inner lead 51 and a second inner lead 52 are formed in the chip mounting region 55, and are opened to space the gap between the first inner lead 51 and the second inner lead 52. Region 53 is formed.

상기 발광 다이오드 칩(60)은 제2이너 리드(52)에 부착된다. 이에 따라 상기 발광 다이오드 칩(60)은 상기 제1이너 리드(51)와 상기 제2이너 리드(52)에 와이어 본딩될 경우, 전기적으로 연결될 수 있다. 여기서, 상기 발광 다이오드 칩(60)은 제2이너 리드(52)에 전도성 접착제로 부착되고, 제1이너 리드(51)에는 와이어 본딩되어, 전기적으로 연결될 수 있다.The light emitting diode chip 60 is attached to the second inner lead 52. Accordingly, when the LED chip 60 is wire bonded to the first inner lead 51 and the second inner lead 52, the LED chip 60 may be electrically connected. The LED chip 60 may be attached to the second inner lead 52 with a conductive adhesive, and may be electrically connected to the first inner lead 51 by wire bonding.

여기서, 상기 각 윈도우(26)는 상기 칩 탑재 영역(55)과 1:1로 대응되거나, 1:2, 1:3 등과 같이 N:N로 형성될 수 있다. 또한 복수개의 윈도우(26)는 상기 리드 프레임(50)의 행 또는 열에 대응되는 개수로 형성될 수 있다. Here, each of the windows 26 may correspond to the chip mounting region 55 in a 1: 1 or N: N, such as 1: 2, 1: 3, and the like. In addition, the plurality of windows 26 may be formed in a number corresponding to the rows or columns of the lead frame 50.

도 3은 실시 예에 따른 리드 프레임 고정장치를 나타낸 측 단면도이며, 도 4는 도 3의 A 부분 확대도이다.3 is a side cross-sectional view illustrating a lead frame fixing apparatus according to an embodiment, and FIG. 4 is an enlarged view of portion A of FIG. 3.

도 3 및 도 4를 참조하면, 히터 블록(24) 위에는 상기 리드 프레임(50)이 놓여진다. 상기 리드 프레임(50) 위에는 윈도우 클램프(30)가 정렬되어 배치되며, 상기 윈도우 클램프(30)는 상기 윈도우 클램프(30)의 플랜지(40)에 가해지는 가압 수단(20)에 의해 상기 리드 프레임(50) 상에 밀착된다. 이때 상기 윈도우 클램프(30)의 하단은 상기 리드 프레임(50) 상면과 밀착되며, 상기 윈도우 클램프(30)의 각 윈도우(26)에는 발광 다이오드 칩(60)이 각각 정렬된다. 3 and 4, the lead frame 50 is placed on the heater block 24. The window clamps 30 are aligned and arranged on the lead frame 50, and the window clamps 30 are pressed by the pressing means 20 applied to the flange 40 of the window clamp 30. 50). In this case, the lower end of the window clamp 30 is in close contact with the upper surface of the lead frame 50, and the LED chip 60 is aligned with each window 26 of the window clamp 30.

여기서, 상기 윈도우 클램프(30)의 하단 전체는 상기 리드 프레임(50)의 상면과 면 접촉하게 된다. Here, the entire lower end of the window clamp 30 is in surface contact with the top surface of the lead frame 50.

상기 윈도우 클램프(30)는 상기 리드 프레임(50)의 칩 탑재 영역 둘레를 지지하게 되며, 상기 히터 블록(24)은 상기 리드 프레임(50)의 하 방향으로 움직임을 지지하고 상기 리드 프레임(50)을 가열하게 된다.The window clamp 30 supports the circumference of the chip mounting region of the lead frame 50, and the heater block 24 supports the movement in the downward direction of the lead frame 50 and the lead frame 50. Will heat.

상기 리드 프레임(50)의 제1이너 리드(51) 및 제2이너 리드(52)가 고정되면, 캐필러리(capillary)(70)를 사용하여 리드 프레임(50)의 제2인너리드(52)와 발광 다이오드 칩(60)을 전기적으로 연결하는 와이어(72) 본딩 작업을 수행하고, 제1이너리드(51)과 발광 다이오드 칩(60)을 전기적으로 연결하는 와이어 본딩을 수행하게 된다. 상기 와이어 본딩 작업은 상기 제2이너 리드 및/또는 제1이너 리드로 수행할 수 있으며, 이에 대해 한정하지는 않는다. 이에 따라 상기 발광 다이오드 칩(60)은 제1이너 리드(51)와 상기 제2이너 리드(52)에 와이어(72)로 연결되어, 전기적으로 연결 상태가 된다. When the first inner lead 51 and the second inner lead 52 of the lead frame 50 are fixed, the second inner lead 52 of the lead frame 50 is formed using a capillary 70. ) And the wire 72 to electrically connect the light emitting diode chip 60, and the wire bonding to electrically connect the first inner lead 51 and the light emitting diode chip 60. The wire bonding operation may be performed by the second inner lead and / or the first inner lead, but is not limited thereto. Accordingly, the light emitting diode chip 60 is connected to the first inner lead 51 and the second inner lead 52 by a wire 72, thereby being in an electrically connected state.

여기서, 상기 윈도우 클램프(30)는 1회에 N(N: 2이상)개의 발광 다이오드 칩(60)에 대해 와이어(72)로 본딩할 수 있게 되며, 이는 윈도우 클램프(30)의 이송 시간 간격을 늘려줄 수 있다. 또한 와이어 본딩에 대한 생산성 및 전체 공정 효율을 개선시켜 줄 수 있다.Here, the window clamp 30 can be bonded to the wire (72) for the N (N: 2 or more) LED chip 60 at a time, which is the transfer time interval of the window clamp 30 You can increase it. It can also improve productivity for wire bonding and overall process efficiency.

또한 N개의 윈도우(26)에 대응하여 리드 프레임(50) 상에 발광 다이오드 칩(60)의 일정 간격으로 어레이됨으로써, 리드 프레임(50)의 용적률을 개선시켜 줄 수 있다.In addition, the volume ratio of the lead frame 50 may be improved by being arranged at regular intervals of the LED chip 60 on the lead frame 50 corresponding to the N windows 26.

이상에서 본 발명에 대하여 실시예를 중심으로 설명하였으나 이는 단지 예시일 뿐 본 발명을 한정하는 것이 아니며, 본 발명이 속하는 분야의 통상의 지식을 가진 자라면 본 발명의 본질적인 특성을 벗어나지 않는 범위에서 이상에 예시되지 않은 여러 가지의 변형과 응용이 가능함을 알 수 있을 것이다. 예를 들어, 실시예에 구체적으로 나타난 각 구성 요소는 변형하여 실시할 수 있는 것이다. 그리고 이러한 변형과 응용에 관계된 차이점들은 첨부된 청구 범위에서 규정하는 본 발명의 범위에 포함되는 것으로 해석되어야 할 것이다.Although the present invention has been described above with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may have an abnormality within the scope not departing from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not illustrated. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

도 1은 실시 예에 따른 윈도우 클램프를 나타낸 사시도이다.1 is a perspective view showing a window clamp according to an embodiment.

도 2는 실시 예에 따른 윈도우 클램프와 리드 프레임의 분해 사시도이다.2 is an exploded perspective view of a window clamp and a lead frame according to an embodiment.

도 3은 실시 예에 따른 리드 프레임 고정장치를 나타낸 측 단면도이다.3 is a side cross-sectional view showing a lead frame fixing device according to an embodiment.

도 4는 도 3의 A 부분 확대도이다.4 is an enlarged view of a portion A of FIG. 3.

Claims (6)

와이어 본딩을 위해 일정 간격을 갖는 복수개의 윈도우 및, 상기 윈도우의 양단에 배치된 플랜지를 포함하는 윈도우 클램프; A window clamp comprising a plurality of windows at regular intervals for wire bonding, and flanges disposed at both ends of the windows; 상기 윈도우 클램프 아래에 히터 블록; A heater block under the window clamp; 상기 히터 블록 위에 놓여져 상기 윈도우 클램프에 의해 가압받고, 상기 윈도우 상에서 와이어 본딩되는 제1이너 리드 및 발광 다이오드 칩이 부착된 제2이너 리드를 갖는 리드 프레임을 포함하는 리드 프레임 고정장치.And a lead frame having a second inner lead attached to the heater block and pressed by the window clamp and wire-bonded on the window, and a second inner lead attached to a light emitting diode chip. 제1항에 있어서, 상기 리드 프레임에는 복수개의 칩 탑재 영역이 일정 간격을 갖고 매트릭스 형태로 어레이되며,The method of claim 1, wherein the lead frame has a plurality of chip mounting regions are arranged in a matrix form at regular intervals, 상기 칩 탑재 영역에는 발광 다이오드 칩과 전기적으로 연결된 제1이너 리드 및 제2이너리드; 상기 제1이너 리드 및 제2이너 리드 사이의 오픈 영역을 포함하는 리드 프레임 고정장치.The chip mounting region may include a first inner lead and a second inner lead electrically connected to a light emitting diode chip; And an open area between the first inner lead and the second inner lead. 제2항에 있어서, 상기 윈도우 중 적어도 하나는 적어도 하나의 칩 탑재 영역에 대응되게 형성되는 리드 프레임 고정장치.The lead frame fixing device of claim 2, wherein at least one of the windows corresponds to at least one chip mounting area. 제2항에 있어서, 상기 윈도우는 적어도 한 열 또는 행의 칩 탑재 영역에 대응되게 형성되는 리드 프레임 고정장치.The lead frame fixing device of claim 2, wherein the window is formed to correspond to at least one column or row of chip mounting regions. 제1항에 있어서, 상기 윈도우 클램프의 하단은 상기 리드 프레임의 상면과 면 접촉하여 지지하는 리드 프레임 고정장치. The lead frame fixing apparatus of claim 1, wherein a lower end of the window clamp is in surface contact with an upper surface of the lead frame. 제1항에 있어서, 상기 플랜지를 가압하는 가압수단을 포함하는 리드 프레임 고정장치.The lead frame fixing device according to claim 1, further comprising pressing means for pressing the flange.
KR1020090013163A 2009-02-17 2009-02-17 Fixing apparatus for lead frame Ceased KR20100093983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090013163A KR20100093983A (en) 2009-02-17 2009-02-17 Fixing apparatus for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090013163A KR20100093983A (en) 2009-02-17 2009-02-17 Fixing apparatus for lead frame

Publications (1)

Publication Number Publication Date
KR20100093983A true KR20100093983A (en) 2010-08-26

Family

ID=42758220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090013163A Ceased KR20100093983A (en) 2009-02-17 2009-02-17 Fixing apparatus for lead frame

Country Status (1)

Country Link
KR (1) KR20100093983A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104538343A (en) * 2014-12-17 2015-04-22 常州信息职业技术学院 Clamping device of automatic diode carding machine
WO2019091201A1 (en) * 2017-11-07 2019-05-16 深圳飞骧科技有限公司 Packaging bonding wire heating combination unit and packaging method thereof
KR102340011B1 (en) 2021-08-20 2021-12-16 이호성 Wire bonder clamp for high-density and ultra-thin LED substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104538343A (en) * 2014-12-17 2015-04-22 常州信息职业技术学院 Clamping device of automatic diode carding machine
WO2019091201A1 (en) * 2017-11-07 2019-05-16 深圳飞骧科技有限公司 Packaging bonding wire heating combination unit and packaging method thereof
KR102340011B1 (en) 2021-08-20 2021-12-16 이호성 Wire bonder clamp for high-density and ultra-thin LED substrates

Similar Documents

Publication Publication Date Title
US9640453B2 (en) Power semiconductor device
KR100271995B1 (en) An improved lead frame clamp for ultrasonic bonding
KR20100093983A (en) Fixing apparatus for lead frame
CN109216312B (en) Semiconductor assembly
CN101978491A (en) Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
JP2009505387A (en) Thermode device for multiple semiconductor components
US9997490B2 (en) Window clamp
KR101528887B1 (en) apparatus and method screening light emitting diode
US20080048006A1 (en) Wire bonder
KR20210030016A (en) Thermocompression bonding apparatus for semiconductor chips
US11056420B2 (en) Pressing-type semiconductor power device package
KR101408728B1 (en) A substrate fixing unit and a die bonding apparatus including the same
CN217316309U (en) Packaging bonding wire clamp
KR20090010318U (en) Wire Bonding Kit for Semiconductor Package Manufacturing
CN220253187U (en) Fixing jig for double-sided bonding wire long substrate PCB
US20140239473A1 (en) Wire bonding assembly and method
KR101220920B1 (en) Wire bonding apparatus and method
TWI413226B (en) Leadframe using hybrid metallic alloys for power semiconductor device packaging and manufactory method thereof
KR100204754B1 (en) Wire bonding apparatus for lead on chip having wide usefulness
US20160276185A1 (en) Method and apparatus for making integrated circuit packages
KR20150025522A (en) Improved collet
KR20030009628A (en) Heater block for wire bonding provided with porous material
KR200171481Y1 (en) Device heat protection apparatus for semiconductor device tester
JP5811718B2 (en) Semiconductor device and manufacturing method thereof
CN106104151A (en) Jack assemblies and the fixture for jack assemblies

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20090217

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20110217

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20111029

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20110217

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I