KR20100071110A - Non-flammable cleaner composition - Google Patents
Non-flammable cleaner composition Download PDFInfo
- Publication number
- KR20100071110A KR20100071110A KR1020107011405A KR20107011405A KR20100071110A KR 20100071110 A KR20100071110 A KR 20100071110A KR 1020107011405 A KR1020107011405 A KR 1020107011405A KR 20107011405 A KR20107011405 A KR 20107011405A KR 20100071110 A KR20100071110 A KR 20100071110A
- Authority
- KR
- South Korea
- Prior art keywords
- bromide
- hydrocarbon
- cleaning
- cleaning composition
- solvent
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 238000004140 cleaning Methods 0.000 claims abstract description 45
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 43
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 30
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 26
- 239000002904 solvent Substances 0.000 claims abstract description 26
- -1 alkyne hydrocarbon Chemical class 0.000 claims abstract description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 15
- JPOXNPPZZKNXOV-UHFFFAOYSA-N bromochloromethane Chemical compound ClCBr JPOXNPPZZKNXOV-UHFFFAOYSA-N 0.000 claims abstract description 8
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- HLVFKOKELQSXIQ-UHFFFAOYSA-N 1-bromo-2-methylpropane Chemical compound CC(C)CBr HLVFKOKELQSXIQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 claims abstract description 4
- UPSXAPQYNGXVBF-UHFFFAOYSA-N 2-bromobutane Chemical compound CCC(C)Br UPSXAPQYNGXVBF-UHFFFAOYSA-N 0.000 claims abstract description 4
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001336 alkenes Chemical class 0.000 claims description 7
- 150000001345 alkine derivatives Chemical class 0.000 claims description 7
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 150000001649 bromium compounds Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 abstract description 18
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract description 17
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract description 17
- 238000009413 insulation Methods 0.000 abstract description 15
- 239000003381 stabilizer Substances 0.000 abstract description 15
- 239000012459 cleaning agent Substances 0.000 abstract description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052801 chlorine Inorganic materials 0.000 abstract description 3
- 239000000460 chlorine Substances 0.000 abstract description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000005406 washing Methods 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000003449 preventive effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 4
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 125000004971 nitroalkyl group Chemical group 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000003599 detergent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 208000000785 Invasive Pulmonary Aspergillosis Diseases 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- JSZOAYXJRCEYSX-UHFFFAOYSA-N 1-nitropropane Chemical compound CCC[N+]([O-])=O JSZOAYXJRCEYSX-UHFFFAOYSA-N 0.000 description 1
- 208000002177 Cataract Diseases 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 208000000453 Skin Neoplasms Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 201000000849 skin cancer Diseases 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/028—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing halogenated hydrocarbons
- C23G5/02854—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing halogenated hydrocarbons characterised by the stabilising or corrosion inhibiting additives
- C23G5/02858—Hydrocarbons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/244—Hydrocarbons unsaturated
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
본 발명은 프레온이나 염소계 용제의 대체 용제로서 사용되고 있는 브롬계 용제는, 프레온이나 염소계 용제와 비교하여 분해하기 쉬운 것이 특징이다. 종래의 브롬계 세정 조성물은 방청제나 니트로에탄 등의 안정제를 이용하여 분해를 방지하였지만, 이들 세정제를 프린트 기판의 세정제에 이용하면, 절연 저항의 저하를 초래하여, 누설 불량 등이 발생하는 경우가 있다. 브롬계 용제의 안정제로서, n-프로필브로마이드, 메틸렌브로마이드, 브로모클로로메탄, n-부틸브로마이드, 이소부틸브로마이드, sec-부틸브로마이드, ter-부틸브로마이드로부터 선택되는 브롬화물과 탄소수 4 내지 10의 알켄계 탄화수소 또는 알킨계 탄화수소를 혼합한 것을 포함하는 비인화성 세정 조성물을 이용한다.The bromine solvent used as an alternative to the freon and chlorine solvents is more easily decomposed than the freon and chlorine solvents. Conventional bromine-based cleaning compositions prevent decomposition by using stabilizers such as rust inhibitors and nitroethane. However, when these cleaning agents are used as cleaning agents for printed boards, the insulation resistance may be lowered and leakage defects may occur. . As a stabilizer of a bromine solvent, bromide selected from n-propyl bromide, methylene bromide, bromochloromethane, n-butyl bromide, isobutyl bromide, sec-butyl bromide, ter-butyl bromide and an alken having 4 to 10 carbon atoms A non-flammable cleaning composition containing a mixture of a ken hydrocarbon or an alkyne hydrocarbon is used.
Description
본 발명은 비인화성의 세정 조성물, 특히 인쇄 기판이나 전자 부품 등의 플럭스 세정이나 전자 부품이나 기구 부품의 탈지에 이용하는 비인화성 세정 조성물에 관한 것이다.The present invention relates to a non-flammable cleaning composition, in particular to a non-flammable cleaning composition used for flux cleaning of printed boards, electronic components, and the like, and degreasing of electronic and mechanical components.
신뢰성을 중시하는 전자 기기에 이용하는 인쇄 기판이나 전자 부품은, 납땜 후에 플럭스 잔사가 부착되어 있으면, 장기간 경과하는 사이에 상기 플럭스 잔사가 흡습하거나, 플럭스 잔사에 티끌이나 먼지 등이 부착되어, 도체간의 절연성을 열화시킬 뿐만 아니라, 부식 생성물을 발생시키는 등의 악영향을 일으키게 된다. 이 때문에, 이들 인쇄 기판이나 전자 부품은 납땜 후에 세정을 행하고 있었다.For printed circuit boards and electronic components used in electronic devices that focus on reliability, if flux residues are attached after soldering, the flux residues may be absorbed for a long period of time, or dust or dust may adhere to the flux residues to insulate the insulation between the conductors. In addition to deterioration, it also causes adverse effects such as generating corrosion products. For this reason, these printed circuit boards and electronic components were wash | cleaned after soldering.
또한 정밀 기계에 사용되는 부품은, 그것을 제작하는 도중 절삭 가공시에 부착되는 절삭유나 소성 가공시에 부착되는 윤활제 등이 남아 있으면, 부품을 정밀 기계로 조립한 후에, 녹이 발생하거나, 접동성이 원활해지지 않는 등의 불량의 원인이 된다. 이 때문에, 정밀 기계용 부품도 가공 후에 세정을 행하고 있었다.In the case of parts used in precision machines, if cutting oil adhered during cutting and lubricants adhered during plastic processing remain during manufacturing, the parts are rusted or slid smoothly after assembling the parts. It may cause defects such as not being lost. For this reason, the parts for precision machines were also wash | cleaned after processing.
종래, 이들 전자 부품이나 기계 부품의 세정에는 플럭스나 오일을 잘 용해하는 프레온이나 1,1,1-트리클로로에탄 등의 세정제가 이용되고 있었다. 그러나 프레온이나 1,1,1-트리클로로에탄 등의 세정제는 지구를 둘러싸고 있는 오존층을 파괴시켜, 지구에 자외선을 다량으로 도달시켜 인류에게 피부암이나 백내장을 유발시키거나, 지하수를 오염시키는 원인이 되기 때문에, 1988년 몬트리올 의정서에서 그 사용이 규제되어 왔다. 또한, 프레온이나 1,1,1-트리클로로에탄보다 분해되기 쉽고, 오존 파괴 계수가 낮은 메틸렌클로라이드 등의 염소계의 용제가 이용되어 왔지만, 이들 휘발성 유기 용제는 분해되어 CO2를 발생시켜, 지구 온난화의 원인이 된다고 하여 사용할 수 없게 되어 있다. 이와 같이 프레온이나 1,1,1-트리클로로에탄 등을 사용할 수 없게 되어 왔기 때문에, 최근에는 이들 대신에 대체 프레온이나 대체 에탄 등의 새로운 세정제가 다수 제안되어 왔다.Conventionally, cleaning agents, such as freon and 1,1,1- trichloroethane, which melt | dissolve flux and an oil well were used for the washing | cleaning of these electronic components and mechanical components. However, detergents such as freon and 1,1,1-trichloroethane destroy the ozone layer surrounding the earth, reaching the earth with a large amount of ultraviolet rays, causing human skin cancer, cataracts, and polluting groundwater. Therefore, its use has been regulated in the 1988 Montreal Protocol. In addition, chlorine-based solvents such as methylene chloride, which are more easily decomposed than freon and 1,1,1-trichloroethane, and have a low ozone depletion coefficient, have been used. However, these volatile organic solvents decompose to generate CO 2 , resulting in global warming. It becomes impossible to use because it causes. Since Freon, 1, 1, 1-trichloroethane, etc. cannot be used in this way, in recent years, many new cleaners, such as a substitute freon and a substitute ethane, have been proposed instead.
규제되어 있지 않은 세정제로서, 물과 섞어 사용하는 테르펜 화합물 등의 준수계 세정제도 있지만, 인쇄 기판의 건조에는 IPA 등의 유기 용제를 사용할 필요가 있고, 준수계 세정제의 건조에 이용하는 IPA는 프레온 12나 메틸렌클로라이드 등에 비하여 건조성이 느리고, 세정 후에 얼룩이 발생하기 쉽기 때문에 외관적으로 문제가 있다.Although non-regulated detergents are also compatible detergents such as terpene compounds used in admixture with water, organic solvents such as IPA need to be used for drying printed boards, and IPAs used for drying the compliance cleaners are Freon 12 and Compared with methylene chloride and the like, the drying property is slower, and staining tends to occur after washing, which causes a problem in appearance.
본 출원인은 탄소수 4 이하, 비점 100 ℃ 이하, 인화점 11 ℃ 이상의 할로겐계 용제 85 내지 99.9 질량%와 유까 산교 가부시끼가이샤(출원시에는 닛본 유시 가부시끼가이샤)의 메탈렉스 등의 방청제가 혼합되어 있는, 자동 납땜 장치에 이용하는 유지기(retainer) 세정제를 개시하고 있다(일본 특허 공개 (평)6-128591호 공보).The present applicant has mixed 85 to 99.9% by mass of a halogen solvent having 4 or less carbon atoms, a boiling point of 100 ° C. or less, a flash point of 11 ° C. or more, and a rust preventive agent such as metalx of Yuka Sangyo Kabushiki Kaisha (Nipbon Yushi Kabushikiisha, at the time of application). And a retainer cleaner for use in an automatic soldering apparatus (Japanese Patent Laid-Open No. 6-128591).
또한, 탄소수 4 이하, 비점 100 ℃ 이하의 할로겐계 용제와 0.1 내지 15 질량%의 유까 산교 가부시끼가이샤의 메탈렉스 등의 방청제, 추가로 알코올계, 탄화수소계, 에테르계 등의 비점 350 ℃ 이하에서 인화성이 있는 유기 용제를 첨가한 플럭스의 세정 효과를 높인 3원계의 세정제를 개시하고 있다(일본 특허 공개 (평)7-292393호 공보).Furthermore, a halogenated solvent having a carbon number of 4 or less and a boiling point of 100 ° C. or less and a rust preventive agent such as metalx of 0.1 to 15% by mass of Yugaku Sangyo Co., Ltd., and further having a boiling point of 350 ° C. or lower such as alcohol, hydrocarbon, or ether A ternary cleaning agent is disclosed, in which a cleaning effect of a flux to which a flammable organic solvent is added is disclosed (Japanese Patent Laid-Open No. 7-292393).
또한 본 출원인은 아니지만, CnH2n +1Br, CnH2m -1Br(n은 4 이상, m은 2 이상)로 표시되는 브롬화탄화수소를 함유하는 세정 조성물에 니트로알칸, 에테르, 에폭시드, 아민류를 포함하는 안정제를 첨가한 세정 조성물이 개시되어 있다(일본 특허 공개 (평)7-150196호 공보).Also, although not applicant, nitroalkanes, ethers, epoxides are used in cleaning compositions containing brominated hydrocarbons represented by C n H 2n +1 Br, C n H 2m -1 Br (n is at least 4, m is at least 2). And the cleaning composition which added the stabilizer containing amines are disclosed (Unexamined-Japanese-Patent No. 7-150196).
특허문헌 1에서는, 할로겐계 용제가 알루미늄이나 마그네슘과 반응하여 금속을 부식시키는 문제점을 해결하기 위해서 방청제를 공존시키고 있지만, 방청제로서 사용하고 있는 유까 산교 가부시끼가이샤 제조의 메탈렉스는, 본래 철강 등의 기계 부품용 방청제를 위해, 특허문헌 1과 같이 자동 납땜 장치의 스테인리스제의 유지기의 세정에서는 문제가 발생하지 않지만, 인쇄 기판의 세정에 사용하면 세정 후의 절연 저항값이 저하되어 누설 불량이 발생된다. 특허문헌 2는, 할로겐계 용제가 로진 등의 수지 성분의 용해성은 높지만 활성제 성분 등의 이온성 성분의 세정성이 낮기 때문에, 이소프로필알코올 등의 유기 용제를 특허문헌 1에 첨가한 발명이지만, 메탈렉스 등의 방청제를 사용하면 세정 후 인쇄 기판의 절연 저항이 낮아진다는 문제점은 해결되고 있지 않다. 이 문제점은 출원 시점에서는 판명되지 않았지만, 나중에 판명되었기 때문에 특허문헌 2의 발명은 심사 청구를 행하지 않고, 출원 취하를 하였다.In Patent Literature 1, although a rust preventive agent coexists in order to solve the problem which a halogen-type solvent reacts with aluminum or magnesium and corrodes a metal, the metal Rex Co., Ltd. product made by Yugaku Sangyo Kabushiki Kaisha used as a rust preventive agent is originally made of steel, etc. For the anticorrosive for mechanical parts, as in Patent Literature 1, no problem occurs in the cleaning of the stainless steel retainer of the automatic soldering apparatus, but when used for cleaning the printed board, the insulation resistance value after cleaning decreases and leakage failure occurs. . Patent Literature 2 is an invention in which an organic solvent such as isopropyl alcohol is added to Patent Literature 1 because the halogen-based solvent has high solubility in resin components such as rosin, but low washability of ionic components such as an activator component. The use of a rust preventive agent such as Rex does not solve the problem that the insulation resistance of the printed circuit board is lowered after cleaning. This problem was not found at the time of filing, but since it was found later, the invention of Patent Literature 2 was withdrawn without filing a request for examination.
할로겐계 용제가 알루미늄이나 마그네슘을 침범하여 부식시키는 문제를 해결하기 위해서, 니트로알칸, 에테르, 에폭시드, 아민류로부터 선택시키는 안정제를 첨가한 것이 특허문헌 3의 세정 조성물이지만, 필두에서 들고 있는 니트로메탄, 니트로에탄, 니트로프로판 등의 니트로알칸의 안정제를 사용하는 방법으로는, 세정제가 산성이 되기 쉽고, 특허문헌 3에서도 세정 후 인쇄 기판의 절연 저항이 낮아지기 쉽다. 또한, 니트로알칸의 안정제는 안정성이 부족하고, 분해를 일으키기 쉬우며, 니트로 화합물이 분해를 일으키면 알루미늄이나 마그네슘의 부식 방지 효과도 감소된다.In order to solve the problem in which the halogen-based solvent invades aluminum and magnesium, a stabilizer selected from nitroalkanes, ethers, epoxides, and amines is added, but the cleaning composition of Patent Document 3 is used. As a method of using nitroalkane stabilizers such as nitroethane and nitropropane, the cleaning agent tends to be acidic, and Patent Document 3 also tends to lower the insulation resistance of the printed board after cleaning. In addition, stabilizers of nitroalkanes lack stability and are prone to degradation, and the corrosion protection of aluminum or magnesium is also reduced when the nitro compound causes degradation.
본 발명이 해결하고자 하는 문제점은, 종래의 할로겐계 세정제가 안정성에 문제가 있고, 인쇄 기판의 세정에 이용하면 절연 저항의 저하가 일어나기 쉬운 것이어서, 본 발명은 이들의 문제점을 해결한 브롬계의 세정제를 제공하는 것이다.The problem to be solved by the present invention is that a conventional halogen-based cleaner has a problem in stability, and when used for cleaning a printed board, a lowering of insulation resistance is likely to occur, and the present invention is a bromine-based cleaner which solves these problems. To provide.
본 발명자들은 이중 결합을 갖는 알켄계 탄화수소 및 3중 결합을 갖는 알킨계 탄화수소는, 브롬계 용제가 분해되었을 때에 발생하는 브롬을 이중 결합 및 3중 결합에 도입함으로써, 안정제로서의 기능을 갖는 것을 발견하여 본 발명을 완성시켰다.The inventors have found that alkene hydrocarbons having a double bond and alkyne hydrocarbons having a triple bond have a function as a stabilizer by introducing bromine generated when the bromine solvent is decomposed into the double bond and the triple bond. The present invention has been completed.
본 발명은 n-프로필브로마이드, 메틸렌브로마이드, 브로모클로로메탄, n-부틸브로마이드, 이소부틸브로마이드, sec-부틸브로마이드, ter-부틸브로마이드로부터 선택되는 브롬화물과 탄소수 4 내지 10의 알켄계 탄화수소 및/또는 알킨계 탄화수소를 혼합한 것을 포함하는 비인화성 세정 조성물이다.The present invention is a bromide selected from n-propyl bromide, methylene bromide, bromochloromethane, n-butyl bromide, isobutyl bromide, sec-butyl bromide, ter-butyl bromide and an alkene hydrocarbon having 4 to 10 carbon atoms, and / Or a non-flammable cleaning composition comprising a mixture of alkyne-based hydrocarbons.
세정 조성물에 사용되는 브롬계 용제는, 탄화수소의 H를 Br으로 대체한 브롬화탄화수소가 인쇄 기판의 세정에 적합하다. 이러한 브롬화탄화수소는, 일반적으로는 안정적이지만, 강한 극성을 갖고 있기 때문에 세정제가 흡습하여 수분을 함유하게 되면 전리하여, 알칼리 금속, 알칼리 토금속, 알루미늄 등과 반응을 일으키게 되고, 이들이 포함되어 있는 합금을 부식시켜 버린다. 인쇄 기판의 경우 반도체나 전해 컨덴서에는 알루미늄이 사용되고 있기 때문에, 브롬계의 세정 조성물과 반응하여 이들이 부식된다. 본 발명에서는, 브롬화탄화수소에 혼입시킨 알켄계 탄화수소 및 알킨계 탄화수소가 안정제로서 기능하고, 전리하여 분해된 브롬화탄화수소의 브롬이 알켄계 탄화수소의 이중 결합, 알킨계 탄화수소의 3중 결합에 부가 반응을 일으켜 브롬이 도입되어, 알루미늄 등 부식의 원인이 되는 유리된 브롬을 발생시키지 않는다. 또한 브롬화탄화수소는 불연재로서의 효과를 갖기 때문에, 본 발명의 세정 조성물은 비인화성이라는 특징도 가지고 있다.The bromine-based solvent used in the cleaning composition is suitable for washing the printed substrate with brominated hydrocarbons in which H of the hydrocarbon is replaced with Br. Such brominated hydrocarbons are generally stable, but have strong polarity, so that when the cleaning agent absorbs moisture and contains moisture, it is ionized and reacts with alkali metals, alkaline earth metals, aluminum, etc., and the alloys containing them are corroded. Throw it away. In the case of a printed board, since aluminum is used for a semiconductor and an electrolytic capacitor, it reacts with a bromine type cleaning composition and it corrodes. In the present invention, alkene-based hydrocarbons and alkyne-based hydrocarbons incorporated into brominated hydrocarbons function as stabilizers, and bromination of brominated hydrocarbons that are ionized and decomposed causes addition reactions to double bonds of alkene-based hydrocarbons and triple bonds of alkyne-based hydrocarbons. Bromine is introduced and does not generate free bromine that causes corrosion such as aluminum. In addition, since the brominated hydrocarbon has an effect as a nonflammable material, the cleaning composition of the present invention also has a feature of being nonflammable.
본 발명의 비인화성 세정 조성물은, 인쇄 기판의 세정에 이용하여도 세정 후 절연 저항값을 저하시키지 않고, 알루미늄이나 마그네슘 등의 합금을 부식시키지 않는 신뢰성이 높은 세정 조성물이며, 비인화성이기 때문에 소방법에 있어서의 위험물로서의 취급도 받지 않는 우수한 것이다.The non-flammable cleaning composition of the present invention is a highly reliable cleaning composition which does not lower the insulation resistance after cleaning and does not corrode alloys such as aluminum and magnesium even when used for cleaning printed boards. It is an excellent thing that does not accept the handling as dangerous goods in the same way.
본 발명에 사용하는 브롬화탄화수소는 탄소수가 4 이하인 비교적 저분자량의 브롬화탄화수소가 바람직하다. 분자량이 커지면 카우리-부탄올(Kauri-Butanol) 지수는 커지고, 플럭스 성분 중 로진 등의 수지 성분의 세정성은 양호하지만, 플럭스 성분 중 활성제 등의 이온성 물질의 세정성은 악화된다. 이 때문에 극성이 강한 브롬화탄화수소가 플럭스 세정에는 적합하다. 본 발명의 인쇄 기판의 플럭스를 제거하기 위해서 적합한 탄소수가 4 이하인 브롬화탄화수소로는 n-프로필브로마이드, 메틸렌브로마이드, 브로모클로로메탄, n-부틸브로마이드, 이소부틸브로마이드, sec-부틸브로마이드, ter-부틸브로마이드를 들 수 있다. 보다 바람직하게는 n-프로필브로마이드가 최적이다.The brominated hydrocarbon used in the present invention is preferably a relatively low molecular weight brominated hydrocarbon having 4 or less carbon atoms. When the molecular weight increases, the Kauri-Butanol index increases, and the cleaning property of resin components such as rosin in the flux component is good, but the cleaning property of ionic substances such as active agents in the flux component is deteriorated. For this reason, strong brominated hydrocarbons are suitable for flux cleaning. Suitable brominated hydrocarbons having 4 or less carbon atoms to remove the flux of the printed board of the present invention are n-propyl bromide, methylene bromide, bromochloromethane, n-butyl bromide, isobutyl bromide, sec-butyl bromide, ter-butyl Bromide. More preferably n-propyl bromide is optimal.
본 발명의 브롬계 용제에 첨가하는 알켄계 탄화수소 및 알킨계 탄화수소의 안정제는 탄소수가 4 내지 10인 것이 바람직하다. 탄소수가 4 미만인 탄소수가 낮은 탄화수소 안정제는 기체이고 반응성은 높지만, 브롬과 반응하면 강한 산성을 나타내는 브롬화탄화수소를 형성한다. 이들 브롬화탄화수소는 수분 등의 영향으로 용이하게 이온으로 분리되기 쉬워 인쇄 기판을 세정한 후의 절연 저항값은 악화된다. 또한 기체이기 때문에 취급하기 어렵다. 이 때문에, 본 발명의 브롬계 용제에 첨가하는 알켄계 탄화수소 및 알킨계 탄화수소의 안정제는 탄소수가 4 이상인 것이 필요하다. The stabilizer of the alkene hydrocarbon and the alkyne hydrocarbon added to the bromine solvent of the present invention preferably has 4 to 10 carbon atoms. Hydrocarbon stabilizers with less than 4 carbon atoms are gaseous and highly reactive, but when reacted with bromine, they form brominated hydrocarbons that exhibit strong acidity. These brominated hydrocarbons are easily separated into ions under the influence of moisture and the like, and the insulation resistance value after cleaning the printed board is deteriorated. It is also difficult to handle because it is a gas. For this reason, the stabilizer of an alkene-based hydrocarbon and an alkyne-based hydrocarbon added to the bromine-based solvent of the present invention needs to have 4 or more carbon atoms.
또한, 알켄계 탄화수소 및 알킨계 탄화수소의 안정제의 탄소수가 10을 초과하면 브롬과의 반응이 낮아져 안정제로서의 효과가 약해지기 때문에, 브롬이 분해되기 쉬워 플라스틱이나 고무 등의 부식성이 강해진다. 또한, 탄소수가 10을 초과하면 비점이 높고, 고체인 것도 있어서 취급하기가 어렵다. 이 때문에, 본 발명의 브롬계 용제에 첨가하는 알켄계 탄화수소 및 알킨계 탄화수소의 안정제는 탄소수가 10 이하인 것이 필요하다. In addition, when the carbon number of the stabilizer of the alkene-based hydrocarbon and the alkyn-based hydrocarbon exceeds 10, the reaction with bromine is lowered, and the effect as a stabilizer is weakened. Therefore, bromine is easily decomposed, and the corrosiveness of plastics and rubber is strong. Moreover, when carbon number exceeds 10, a boiling point is high and it is a solid thing, and it is difficult to handle. For this reason, the stabilizer of an alkene-based hydrocarbon and an alkyne-based hydrocarbon added to the bromine-based solvent of the present invention needs to have 10 or less carbon atoms.
본 발명에 적합한 브롬계 용제에 첨가하는 알켄계 탄화수소 및 알킨계 탄화수소의 안정제는 탄소수 6 내지 7의 것이 보다 바람직하고, 가장 바람직한 것은 1-헥센, 1-헵텐, 1-헥신, 1-헵텐을 사용했을 때이다.As the stabilizer of the alkene-based and alkyne-based hydrocarbons added to the bromine-based solvent suitable for the present invention, those having 6 to 7 carbon atoms are more preferable, and most preferably 1-hexene, 1-heptene, 1-hexine, 1-heptene are used. It is time to.
본 발명의 세정 조성물에, 추가로 저분자의 알코올이나 케톤 등의 극성 용제를 첨가하면, 플럭스 성분 중 활성제 등의 이온성 물질의 세정성이 향상된다. 이 경우는, 세정 조성물에 대하여 30부 이하의 첨가가 바람직하다. 30부보다 많이 첨가하면, 세정성이 저하될 뿐 아니라, 인화성이 일어나기 때문에 화기에 대한 주의도 필요해진다. 보다 바람직하게는 10부의 첨가이다.The addition of polar solvents such as low molecular alcohols and ketones to the cleaning composition of the present invention further improves the cleaning properties of ionic substances such as active agents in the flux component. In this case, 30 parts or less of addition is preferable with respect to a cleaning composition. If more than 30 parts is added, not only the detergency is deteriorated, but also flammability occurs, which requires attention to fire. More preferably, it is 10 parts addition.
<실시예><Examples>
표 1에 기재된 배합량으로 제조하고, 충분히 혼합하여 세정성 조성물을 제작하였다. 3개월간 정치한 후 각 배합의 세정제를 이용하여, 인쇄 기판의 세정 후의 절연 저항 시험, 내용제성 시험을 행하였다. 절연 저항 시험, 내용제성 시험의 결과를 하기 표 1에 나타낸다.It manufactured by the compounding quantity of Table 1, fully mixed, and produced the cleaning composition. After standing still for 3 months, the insulation resistance test and the solvent resistance test after washing of the printed circuit board were performed using the cleaning agent of each formulation. The results of the insulation resistance test and the solvent resistance test are shown in Table 1 below.
1. 절연 저항 시험1. Insulation resistance test
JISZ 3197 8.5.3의 방법에 따라서, 절연 저항 시험을 행하였다.The insulation resistance test was done in accordance with the method of JISZ 3197 8.5.3.
1) JIS 2형의 빗형 기판 전체면에 센쥬 긴조꾸 고교 제조의 포스트 플럭스 ES-1061SP-2를 침지 도포한다.1) Senju Ginzo Kogyo Co., Ltd. post flux ES-1061SP-2 is immersed and applied to the whole surface of the comb-shaped board | substrate of JIS type 2.
2) Sn-3Ag-0.5Cu 조성의 땜납 합금을 넣은 땜납 배스를 260 ℃로 가열해둔다. 플럭스의 용제가 건조된 후, 시험 기판을 5 초간 땜납 배스에 침지하여 납땜을 행한다. 시험 기판은 방냉해둔다.2) A solder bath containing a solder alloy of Sn-3Ag-0.5Cu composition is heated to 260 ° C. After the flux solvent is dried, the test substrate is immersed in a solder bath for 5 seconds to perform soldering. The test substrate is left to cool.
3) 실시예 및 비교예의 세정 조성물은 밀폐된 세정기에 투입하여 40 ℃의 설정으로 가온한다. 납땜 후의 시험 기판을 각 조성의 세정기에 투입하여 2 분간 세정한다. 3) The cleaning compositions of Examples and Comparative Examples are put into a closed washing machine and heated to a setting of 40 ° C. The test board after soldering is put into the washing machine of each composition, and it wash | cleans for 2 minutes.
4) 시험 기판을 건조한 후, 90 ℃, 95 % RH로 설정한 항온 항습조에 투입하고, 1000 시간 후 절연 저항을 측정한다.4) After drying a test board | substrate, it puts into the constant temperature and humidity bath set to 90 degreeC and 95% RH, and measures insulation resistance after 1000 hours.
JISZ 3197 8.5.3의 시험 방법에 있어서, 절연 저항값이 1×108 Ω 이상인 것은 신뢰성에 문제가 없다고 판단할 수 있다.In the test method of JISZ 3197 8.5.3, it can be judged that there is no problem in reliability that an insulation resistance value is 1 * 10 <8> ohms or more.
2. 내용제성 시험2. Solvent resistance test
JIS C0052의 방법에 따라서, 내용제성 시험을 행하였다.The solvent resistance test was done in accordance with the method of JIS C0052.
1) 알루미늄 전해 컨덴서의 리드를 절단하여 40 ℃의 온도로 설정된 세정기에 5 분간 투입한다. 1) The lead of the aluminum electrolytic capacitor is cut and put into the washing machine set at the temperature of 40 degreeC for 5 minutes.
2) 세정기로부터 취출하여 건조한 후, 알루미늄 전해 컨덴서의 외관을 관찰하고, 변화가 없는 것을 ○, 부식 등의 변화가 있는 것을 ×로 하였다.2) After taking out from a washing machine and drying, the external appearance of the aluminum electrolytic capacitor was observed, and the thing with no change, (circle), and the thing with changes, such as corrosion were made into x.
본 발명의 세정 조성물은 세정 후의 절연 저항값도 1×1011 Ω 이상으로 높은 값을 나타내고, 또한 전자 부품의 내용제성 시험도 문제가 없기 때문에, 신뢰성이 높은 세정 조성물인 것을 알 수 있다.Since the cleaning composition of this invention shows the high value of the insulation resistance after washing also 1x10 <11> or more, and also the solvent resistance test of an electronic component, it turns out that it is a highly reliable cleaning composition.
<산업상의 이용 가능성>Industrial availability
본 발명의 비인화성 세정 조성물은 인쇄 기판의 세정에 사용할 수 있을 뿐 아니라, 땜납이나 알루미늄 등을 부식시키지 않기 때문에 땜납볼, 와셔, 펠릿 등의 솔더 프리폼의 세정이나 기구 부품 등의 금속 부품의 세정에도 사용 가능하다.The non-flammable cleaning composition of the present invention can be used not only for cleaning printed circuit boards but also for cleaning solder parts such as solder balls, washers and pellets, and for cleaning metal parts such as mechanical parts, because it does not corrode solder or aluminum. Can be used
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CN106757093A (en) * | 2016-12-07 | 2017-05-31 | 苏州长风航空电子有限公司 | A kind of metal greasy dirt cleaning agent |
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JPH06292393A (en) * | 1993-04-01 | 1994-10-18 | Toshiba Corp | Selector for standby machine for controlling number of motor |
JPH06306391A (en) * | 1993-04-21 | 1994-11-01 | Daikin Ind Ltd | Composition having chlorine-free halohydrocarbon |
US5690862A (en) * | 1995-11-01 | 1997-11-25 | Albemarle Corporation | No flash point solvent system containing normal propyl bromide |
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US6951835B1 (en) * | 1999-03-22 | 2005-10-04 | E.I. Du Pont De Nemours And Company | Azeotrope-like compositions of 1,1,1,3,3-pentafluorobutane |
JP3263065B1 (en) * | 2001-02-14 | 2002-03-04 | 株式会社カネコ化学 | Cleaning solvent composition |
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