KR20100052577A - 도금장치 - Google Patents
도금장치 Download PDFInfo
- Publication number
- KR20100052577A KR20100052577A KR1020107010317A KR20107010317A KR20100052577A KR 20100052577 A KR20100052577 A KR 20100052577A KR 1020107010317 A KR1020107010317 A KR 1020107010317A KR 20107010317 A KR20107010317 A KR 20107010317A KR 20100052577 A KR20100052577 A KR 20100052577A
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- substrate
- plating liquid
- anode
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000007747 plating Methods 0.000 title claims abstract description 417
- 239000007788 liquid Substances 0.000 claims abstract description 147
- 230000005684 electric field Effects 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims description 55
- 238000003756 stirring Methods 0.000 claims description 41
- 239000000243 solution Substances 0.000 claims description 31
- 238000009423 ventilation Methods 0.000 claims description 27
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 7
- 230000002265 prevention Effects 0.000 claims 1
- 238000007654 immersion Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 254
- 239000002184 metal Substances 0.000 description 54
- 229910052751 metal Inorganic materials 0.000 description 54
- 238000005406 washing Methods 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 16
- 238000011282 treatment Methods 0.000 description 13
- 239000011148 porous material Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 10
- 238000001994 activation Methods 0.000 description 8
- 230000004913 activation Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005273 aeration Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002210097 | 2002-07-18 | ||
| JPJP-P-2002-210097 | 2002-07-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047001692A Division KR101027489B1 (ko) | 2002-07-18 | 2003-07-18 | 도금장치 및 도금방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100052577A true KR20100052577A (ko) | 2010-05-19 |
Family
ID=30767712
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047001692A Expired - Fee Related KR101027489B1 (ko) | 2002-07-18 | 2003-07-18 | 도금장치 및 도금방법 |
| KR1020107010317A Ceased KR20100052577A (ko) | 2002-07-18 | 2003-07-18 | 도금장치 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047001692A Expired - Fee Related KR101027489B1 (ko) | 2002-07-18 | 2003-07-18 | 도금장치 및 도금방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20040262150A1 (zh) |
| EP (1) | EP1524338A4 (zh) |
| JP (1) | JP4434948B2 (zh) |
| KR (2) | KR101027489B1 (zh) |
| CN (2) | CN101387004B (zh) |
| WO (1) | WO2004009879A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102475318B1 (ko) * | 2021-10-28 | 2022-12-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003298904A1 (en) * | 2002-12-05 | 2004-06-30 | Surfect Technologies, Inc. | Coated and magnetic particles and applications thereof |
| TW200533791A (en) * | 2004-02-04 | 2005-10-16 | Surfect Technologies Inc | Plating apparatus and method |
| US20060081478A1 (en) * | 2004-10-19 | 2006-04-20 | Tsuyoshi Sahoda | Plating apparatus and plating method |
| JP4878866B2 (ja) * | 2006-02-22 | 2012-02-15 | イビデン株式会社 | めっき装置及びめっき方法 |
| KR20090049957A (ko) * | 2007-11-14 | 2009-05-19 | 삼성전기주식회사 | 도금장치 |
| US8012319B2 (en) * | 2007-11-21 | 2011-09-06 | Texas Instruments Incorporated | Multi-chambered metal electrodeposition system for semiconductor substrates |
| JP5184308B2 (ja) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| US8177944B2 (en) * | 2007-12-04 | 2012-05-15 | Ebara Corporation | Plating apparatus and plating method |
| JP2009299128A (ja) * | 2008-06-13 | 2009-12-24 | Panasonic Corp | 電気めっき装置 |
| TWI550139B (zh) | 2011-04-04 | 2016-09-21 | 諾菲勒斯系統公司 | 用於裁整均勻輪廓之電鍍裝置 |
| KR20120129125A (ko) * | 2011-05-19 | 2012-11-28 | 삼성전자주식회사 | 반도체 기판의 전기 도금 장치 및 방법 |
| JP5795965B2 (ja) * | 2011-05-30 | 2015-10-14 | 株式会社荏原製作所 | めっき装置 |
| JP5731917B2 (ja) * | 2011-06-30 | 2015-06-10 | 上村工業株式会社 | 表面処理装置およびめっき槽 |
| PL2868777T3 (pl) | 2012-07-02 | 2017-05-31 | Nippon Steel & Sumitomo Metal Corporation | Urządzenie do powlekania elektrolitycznego |
| JP2014088600A (ja) * | 2012-10-31 | 2014-05-15 | C Uyemura & Co Ltd | 表面処理装置 |
| US9909228B2 (en) | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
| JP5651737B2 (ja) * | 2013-06-03 | 2015-01-14 | 株式会社ムラタ | ニッケルめっきのためのめっき装置 |
| CN105917033B (zh) * | 2014-05-12 | 2018-01-19 | 株式会社山本镀金试验器 | 电镀装置及收容槽 |
| CN104005077B (zh) * | 2014-05-14 | 2016-11-09 | 上海交通大学 | 优化温度场分布的电镀装置及其电镀方法 |
| EP3016486B1 (en) * | 2014-10-29 | 2017-08-16 | ATOTECH Deutschland GmbH | Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module |
| US9978882B2 (en) * | 2014-11-13 | 2018-05-22 | Shindengen Electric Manufacturing Co., Ltd. | Method of manufacturing semiconductor device and glass film forming apparatus |
| JP6335777B2 (ja) * | 2014-12-26 | 2018-05-30 | 株式会社荏原製作所 | 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置 |
| WO2017120003A1 (en) * | 2016-01-06 | 2017-07-13 | Applied Materials, Inc. | Systems and methods for shielding features of a workpiece during electrochemical deposition |
| CN105648507A (zh) * | 2016-03-24 | 2016-06-08 | 河南理工大学 | 一种用于电沉积平面件的装置 |
| GB201701166D0 (en) * | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
| JP6847691B2 (ja) * | 2017-02-08 | 2021-03-24 | 株式会社荏原製作所 | めっき装置およびめっき装置とともに使用される基板ホルダ |
| GB2564893B (en) * | 2017-07-27 | 2020-12-16 | Semsysco Gmbh | Distribution system for chemical and/or electrolytic surface treatment |
| CN107447249A (zh) * | 2017-08-17 | 2017-12-08 | 苏州市金翔钛设备有限公司 | 一种电镀槽 |
| JP6986921B2 (ja) | 2017-10-12 | 2021-12-22 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP6329681B1 (ja) | 2017-10-31 | 2018-05-23 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP6790016B2 (ja) * | 2018-04-10 | 2020-11-25 | 上村工業株式会社 | 表面処理装置、表面処理方法及びパドル |
| JP6971915B2 (ja) | 2018-06-05 | 2021-11-24 | 株式会社荏原製作所 | めっき方法、めっき装置、及び限界電流密度を推定する方法 |
| JP7227875B2 (ja) * | 2019-08-22 | 2023-02-22 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
| JP7383441B2 (ja) * | 2019-10-07 | 2023-11-20 | 上村工業株式会社 | 表面処理装置、表面処理方法及びパドル |
| TWI721760B (zh) * | 2020-01-17 | 2021-03-11 | 海技股份有限公司 | 電鍍裝置及電鍍方法 |
| JP7354020B2 (ja) * | 2020-03-04 | 2023-10-02 | 株式会社荏原製作所 | めっき装置および抵抗体 |
| JP7356401B2 (ja) * | 2020-05-12 | 2023-10-04 | 株式会社荏原製作所 | プレート、めっき装置、及びプレートの製造方法 |
| WO2022102119A1 (ja) * | 2020-11-16 | 2022-05-19 | 株式会社荏原製作所 | プレート、めっき装置、及びプレートの製造方法 |
| CN112708922B (zh) * | 2020-12-31 | 2024-02-02 | 郑州琦升精密制造有限公司 | 一种电镀搅拌过滤装置 |
| US12163244B2 (en) | 2021-03-05 | 2024-12-10 | Ebara Corporation | Method of adjusting plating module |
| CN114729467A (zh) * | 2021-06-17 | 2022-07-08 | 株式会社荏原制作所 | 电阻体及镀覆装置 |
| KR20230122175A (ko) * | 2021-06-18 | 2023-08-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 및 도금 방법 |
| US11859302B2 (en) * | 2021-10-14 | 2024-01-02 | Unimicron Technology Corp. | Electroplating apparatus and electroplating method |
| KR102787919B1 (ko) | 2022-07-04 | 2025-03-26 | 김강민 | 도금층 표면 균일화 도금 방법 |
| CN117587487B (zh) * | 2024-01-18 | 2024-04-02 | 南京海创表面处理技术有限公司 | 一种高精度镁合金工件表面电镀设备及控制方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3824137A (en) * | 1973-04-18 | 1974-07-16 | In Line Technology Inc | Solution agitation process |
| US4304641A (en) * | 1980-11-24 | 1981-12-08 | International Business Machines Corporation | Rotary electroplating cell with controlled current distribution |
| US4469566A (en) * | 1983-08-29 | 1984-09-04 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
| JPS63176500A (ja) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | 電気めつき用遮蔽板 |
| US5514258A (en) * | 1994-08-18 | 1996-05-07 | Brinket; Oscar J. | Substrate plating device having laminar flow |
| US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
| US6179983B1 (en) * | 1997-11-13 | 2001-01-30 | Novellus Systems, Inc. | Method and apparatus for treating surface including virtual anode |
| US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
| US6261426B1 (en) * | 1999-01-22 | 2001-07-17 | International Business Machines Corporation | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching |
| JP2000313990A (ja) * | 1999-04-27 | 2000-11-14 | Dainippon Screen Mfg Co Ltd | 基板メッキ装置 |
| US6254742B1 (en) * | 1999-07-12 | 2001-07-03 | Semitool, Inc. | Diffuser with spiral opening pattern for an electroplating reactor vessel |
| US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| EP1229154A4 (en) * | 2000-03-17 | 2006-12-13 | Ebara Corp | METHOD AND DEVICE FOR ELECTROPLATING |
| JP2001329400A (ja) * | 2000-05-17 | 2001-11-27 | Hitachi Kyowa Engineering Co Ltd | めっき装置およびめっき方法 |
| JP2002054000A (ja) * | 2000-08-02 | 2002-02-19 | Nitto Denko Corp | 基板の電解めっき方法 |
| US6802946B2 (en) * | 2000-12-21 | 2004-10-12 | Nutool Inc. | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| CN1153851C (zh) * | 2001-02-28 | 2004-06-16 | 研能科技股份有限公司 | 控制电力线分布的装置及方法 |
| CN1153852C (zh) * | 2001-02-28 | 2004-06-16 | 研能科技股份有限公司 | 控制电力线分布的装置及方法 |
| CN2504282Y (zh) * | 2001-10-25 | 2002-08-07 | 王敬伦 | 平板电镀装置 |
| TWM240034U (en) * | 2002-02-19 | 2004-08-01 | Advanced Semiconductor Eng | Electric field adjustment device of electroplating tank |
-
2003
- 2003-07-18 CN CN2008101700231A patent/CN101387004B/zh not_active Expired - Lifetime
- 2003-07-18 WO PCT/JP2003/009144 patent/WO2004009879A1/ja active Application Filing
- 2003-07-18 US US10/485,350 patent/US20040262150A1/en not_active Abandoned
- 2003-07-18 CN CNB038018152A patent/CN100439571C/zh not_active Expired - Lifetime
- 2003-07-18 JP JP2004522759A patent/JP4434948B2/ja not_active Expired - Fee Related
- 2003-07-18 EP EP03765327A patent/EP1524338A4/en not_active Withdrawn
- 2003-07-18 KR KR1020047001692A patent/KR101027489B1/ko not_active Expired - Fee Related
- 2003-07-18 KR KR1020107010317A patent/KR20100052577A/ko not_active Ceased
-
2009
- 2009-05-07 US US12/453,347 patent/US20090218231A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102475318B1 (ko) * | 2021-10-28 | 2022-12-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050025114A (ko) | 2005-03-11 |
| CN101387004B (zh) | 2010-12-15 |
| JP4434948B2 (ja) | 2010-03-17 |
| CN100439571C (zh) | 2008-12-03 |
| CN101387004A (zh) | 2009-03-18 |
| WO2004009879A1 (ja) | 2004-01-29 |
| KR101027489B1 (ko) | 2011-04-06 |
| US20040262150A1 (en) | 2004-12-30 |
| EP1524338A4 (en) | 2008-02-27 |
| CN1610769A (zh) | 2005-04-27 |
| EP1524338A1 (en) | 2005-04-20 |
| US20090218231A1 (en) | 2009-09-03 |
| JPWO2004009879A1 (ja) | 2005-11-17 |
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