KR20100001809A - Flexible circuit board and camera module using thereof - Google Patents

Abstract

The flexible circuit board according to the present invention includes a signal layer formed with an electrode pattern for electrically connecting the modules; A ground layer stacked on the signal layer and configured to ground electromagnetic waves of the signal layer; A coating layer provided on surfaces of the signal layer and the ground layer and having an opening formed to expose a part of the ground layer to the outside; And a conductive member attached to the coating layer and electrically connected to the ground layer through the opening to enlarge the ground area.

In addition, the camera module according to the present invention includes a first imaging module for capturing an image of an object; A second imaging module for photographing an object; A first module connector accommodated to electrically connect the first imaging module, a second module connector accommodated to electrically connect the second imaging module, and an electrode pattern between the first module connector and the second module connector A substrate part including a connection part formed thereon; And a conductive member attached to the substrate and electrically connected to a ground layer formed inside the flexible circuit board to enlarge a ground area.

Description

Flexible circuit board and camera module using same {FLEXIBLE CIRCUIT BOARD AND CAMERA MODULE USING THEREOF}

The present invention relates to a flexible circuit board and a camera module using the same, and more particularly, to a flexible circuit board mounted on an electronic device and the like and a camera module equipped with the flexible circuit board using the same.

In general, the printed circuit board is a printed circuit pattern formed on the upper surface of the substrate, the active circuit (resistance, inductor, capacitor) and passive elements (transistor, diode), etc. necessary for the circuit implementation is mounted on the printed circuit pattern.

In recent years, with the miniaturization and high density of devices, printed circuit boards and devices possessing the same have also been miniaturized, thinned, and integrated.

Most electronic devices on the market are equipped with antennas for externally detecting video signals, voice signals or text signals.

The antenna has a structure that protrudes to the outside, but recently, the antenna is manufactured to have a structure mounted inside the electronic device, so that it is easy to carry and has a beautiful design.

However, when the antenna is mounted inside the electronic device, the antenna may be formed adjacent to the printed circuit board and the signal sensitivity may be reduced by the electromagnetic waves generated from the printed circuit board. Required.

The present invention relates to a flexible circuit board including a conductive member electrically connected to a ground layer to expand a ground area, and a camera module having the same.

The flexible circuit board according to the present invention includes a signal layer formed with an electrode pattern for electrically connecting the modules; A ground layer stacked on the signal layer and configured to ground electromagnetic waves of the signal layer; A coating layer provided on surfaces of the signal layer and the ground layer and having an opening formed to expose a part of the ground layer to the outside; And a conductive member attached to the coating layer, attached to the coating layer, and electrically connected to the ground layer through the opening to enlarge the ground area.

In addition, the conductive member is characterized by using a conductive tape.

In addition, the conductive member is characterized in that the coating using a material of silver.

In addition, the camera module according to the present invention includes a first imaging module for capturing an image of an object; A second imaging module for photographing an object; A first module connector accommodated to electrically connect the first imaging module, a second module connector accommodated to electrically connect the second imaging module, and an electrode pattern between the first module connector and the second module connector A substrate part including a connection part formed thereon; And a conductive member attached to the substrate and electrically connected to a ground layer formed inside the substrate to expand the ground area.

In addition, the substrate is formed on the surface, it characterized in that it comprises a coating layer having an opening provided in order to connect the ground layer and the conductive member.

In addition, the substrate unit may include a main connector electrically connected to the main circuit board.

The main connector may include a connector opening formed on one surface of the main connector, and the conductive member may be attached to one surface of the main connector.

In addition, the conductive member is characterized by using a conductive tape.

The flexible circuit board and the camera module using the same according to the present invention have an effect of reducing the interference of the reception sensitivity of the antenna by electromagnetic waves by attaching the conductive member to the conductive layer to increase the ground area.

An embodiment of a flexible circuit board and a camera module using the same according to the present invention will be described in more detail with reference to the accompanying drawings.

1 is a cross-sectional view for describing a flexible circuit board according to a first embodiment of the present invention.

As shown in FIG. 1, the flexible circuit board includes a signal layer 110, a ground layer 120, a coating layer 130, and a conductive member 140.

Electrode patterns are formed in the signal layer 110 such that the first imaging module, the second imaging module, and the main circuits are electrically connected to each other.

The signal layer 110 is formed of one layer, but may be a structure in which a plurality of layers are stacked.

The ground layer 120 is stacked on the signal layer 110 and functions to ground electromagnetic waves that are unnecessarily generated in the signal layer 110.

2 is a view for explaining the ground layer of the flexible circuit board according to the first embodiment of the present invention.

As shown in FIG. 2, the ground layer 120 is formed of a conductive member and is formed in the connection portion 130 except for the mounting portions of the first module connector 150 and the second module connector 160.

Accordingly, the flexible circuit board is equipped with a first imaging module and a second imaging module, and a ground layer (or a ground layer) is formed at a portion where the electrode pattern passes through the first module connector 150, the second module connector 160, and the main connector 170. 120 may be formed. However, various structures of the ground layer are possible, depending on the intention of the designer.

The coating layer 130 is formed on the surfaces of the signal layer 110 and the ground layer 120 to protect the signal layer 110 and the ground layer 120.

An opening 132 may be formed on one surface of the coating layer 130, and the ground layer 120 and the conductive member 140 may be electrically connected through the opening 132.

The opening 132 may be provided by a method of peeling off the coating, and it is also preferable to use various methods such as being formed in the form of a hole in the coating layer 130.

The conductive member 140 is formed on the coating layer 130 and positioned adjacent to the ground layer 120. The conductive member 140 is preferably designed on the flexible circuit board so as to be closest to the antenna installed in the electronic device.

The conductive member 140 is preferably attached to the coating layer 130 using an EMI film. However, it is also possible to use the conductive member 140 in various ways such as silver coating in addition to the EMI film. Here, the conductive member 140 is electrically connected to the ground layer 120 to absorb electromagnetic waves generated from the ground layer 120.

Conventionally, when the antenna is mounted inside the personal portable terminal, there is a problem in that the signal sensitivity is reduced by electromagnetic waves generated by a circuit board adjacent to the camera module and electrically connected to the camera module.

However, in the present invention, the flexible circuit board and the camera module using the same form a ground layer 120 on the signal layer 110 to ground unnecessary electromagnetic waves emitted from the signal layer 110, and ground on the ground layer 120. Since the conductive member 140 that enlarges the area is attached, there is an effect of reducing the interference of the reception sensitivity of the antenna by electromagnetic waves.

3 is a view for explaining a top surface of the camera module using a flexible circuit board according to a second embodiment of the present invention, Figure 4 is a view for explaining the bottom surface of the camera module of FIG.

3 and 4, the camera module using the flexible circuit board in the second embodiment according to the present invention is the first imaging module 210, the second imaging module 220, the first module connector 212 ), A second module connector 212, a connection portion 230, a substrate portion, and a conductive member 240.

In the present invention, the camera module is mounted to the personal portable terminal. Personal portable terminal means a portable terminal such as a mobile phone, PDA, etc., but can also be applied to various electronic devices.

The first imaging module 210 may be a camera module that photographs an image of an object. However, it is also possible to mount various types of modules in addition to the camera module.

The second imaging module 220 is preferably an imaging module that enables a video call. Therefore, a personal handheld terminal capable of capturing an image with the first imaging module 210 and making a video call using the second imaging module 220 can be manufactured.

However, the second imaging module 220 may be mounted on both sides of the personal mobile terminal by mounting a second camera instead of an imaging module. The second imaging module 220 may be a module having another function or manufactured without the second imaging module 220. It is also possible.

The first module connector 212 has a first imaging module 210 mounted therein and may be electrically connected to the first imaging module 210. At this time, the first module connector 212 and the first imaging module 210 is preferably bonded to each other using a conductive adhesive, it is also possible to use other bonding methods.

The second module connector 212 has a second imaging module 220 mounted therein and is electrically connected to the second imaging module 220.

The connection unit 230 connects the first module connector 212 and the second module connector 222, and a signal pattern is formed. In addition, the first module connector 212 and the main connector 250 serves to connect.

The main connector 250 is mounted on the main circuit and electrically connected to the main connector 250 to control the first imaging module 210 and the second imaging module 220 in the main circuit.

The substrate portion preferably includes a signal layer, a ground layer and a coating layer. Electrode patterns are formed on the signal layer to be electrically connected to the first imaging module 210, the second imaging module 220, and the main circuit board. In addition, the ground layer is stacked on the signal layer, and functions to ground electromagnetic waves generated in the signal layer. The coating layer is formed on the surfaces of the signal layer and the ground layer to serve to protect the signal layer and the ground layer. The signal layer, ground layer and coating layer in this embodiment are substantially the same as in the first embodiment of the present invention.

The conductive member 240 is attached to the substrate, and is electrically connected to the ground layer formed inside the substrate to function to enlarge the ground area. The conductive member 240 is substantially the same as the conductive member 240 described in the first embodiment of the present invention, and description thereof may be omitted.

5 is a perspective view illustrating a main connector 250 according to a second embodiment of the present invention.

As shown in FIG. 5, the connector opening 252 is formed on one surface of the main connector 250, and the conductive member 240 is attached thereto. The conductive member 240 preferably uses a conductive tape 254, and is attached to one surface of the main connector 250 to enlarge the ground area.

However, in addition to the conductive tape 254, a plate may be attached to a stainless material, and a conductive paste such as silver paste may be applied.

1 is a cross-sectional view for describing a flexible circuit board according to a first embodiment of the present invention.

2 is a view for explaining the ground layer of the flexible circuit board according to the first embodiment of the present invention.

3 is a view for explaining a lower surface of the camera module using the flexible circuit board according to the second embodiment of the present invention.

4 is a diagram for describing an upper surface of the camera module of FIG. 3.

5 is a perspective view illustrating a main connector 250 according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

110 .... signal layer 120 .... ground layer

130 ... coating layer 140 ... conductive member

Claims (8)

A signal layer having an electrode pattern electrically connecting the modules; A ground layer stacked on the signal layer and configured to ground electromagnetic waves of the signal layer; A coating layer provided on surfaces of the signal layer and the ground layer and having an opening formed to expose a part of the ground layer to the outside; And A conductive member attached to the coating layer and electrically connected to the ground layer through the opening to expand the ground area; Flexible circuit board comprising a. The method of claim 1, The said conductive member used the conductive tape, The flexible circuit board characterized by the above-mentioned. The method of claim 1, The conductive member is coated with a material of silver, wherein the flexible circuit board. A first imaging module for photographing an object; A second imaging module for photographing an object; A first module connector accommodated to electrically connect the first imaging module, a second module connector accommodated to electrically connect the second imaging module, and an electrode pattern between the first module connector and the second module connector A substrate part including a connection part formed thereon; And A conductive member attached to the substrate and electrically connected to a ground layer formed inside the substrate to expand a ground area; Camera module comprising a. The method of claim 4, wherein And a coating layer formed on a surface of the substrate and having an opening part for connecting the ground layer and the conductive member. The method of claim 4, wherein The board module comprises a main connector electrically connected to the main circuit board. The method of claim 6, The main connector includes a connector opening formed on one surface, and the conductive member is attached to one surface of the main connector. The method of claim 7, wherein The conductive member is a camera module, characterized in that using a conductive tape.

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