KR20090067964A - Adhesive tape and manufacturing method thereof - Google Patents

Abstract

An adhesive tape and a manufacturing method thereof are provided to apply an electrical conductivity to various electronic device based on the light-shield pattern of mask. An adhesive tape comprises an adhesive polymer resin; and conductive filler of plate which is distributed in the adhesive polymer resin. The conductive filler of plate is electrically arranged to the horizontal direction (xy direction) and thickness direction (Z direction) in the adhesive polymer resin. The thickness of adhesive tape is 10 ~ 200 mum. The surface resistance is more than 0.1 Ф/m^2 and the vertical resistance is more than 0.001 Ф. The thickness of conductive filler of the plate is 100 nm ~ 25 mum.

Description

Adhesive tape and its manufacturing method {ADHESIVE TAPE AND METHOD FOR PREPARING THE SAME}

The present invention relates to a pressure-sensitive adhesive tape for shielding electromagnetic waves useful in various electronic products and a method of manufacturing the same.

Electromagnetic waves generated on the circuits of various electronic devices may in some cases disrupt the function of surrounding electronic devices or components, degrade the performance of the devices, cause ambient noise and disturbances, damage electronic images, It can shorten the life.

Various materials have been developed until recently to block electromagnetic waves causing this problem. The materials include various metal plates, metal plated fabrics, conductive paints, conductive tapes, conductive polymers, and the like.

In particular, conductive tapes are mainly used for electronic devices that are downsized. The conductive tape is prepared by adding a fine conductive filler such as carbon black, graphite, silver, copper, nickel, aluminum, etc. to the tacky polymer resin to impart conductivity to the resin. In order for these conductive fillers to impart conductivity to the pressure-sensitive adhesive, the conductive filler particles must form a continuous conductive path in the tacky polymer resin. Thus, in general, a relatively excess amount of conductive filler is added to the tacky polymer resin. However, when an excessive amount of conductive filler is added, melt viscoelasticity of the adhesive resin is reduced, causing the filler particles to agglomerate with each other to increase the viscosity of the polymer resin. As a result, the specific gravity of the product is increased and the physical properties are lowered, there is a problem that the shock and vibration absorption is lowered. Moreover, it was difficult to control the electrical conductivity of the conductive tape manufactured by the conventional manufacturing method.

Accordingly, the present inventors have tried to produce a conductive adhesive tape that can block electromagnetic waves without causing the above-mentioned problems. In addition, efforts have been made to produce adhesive tapes suitable for application to electronic devices that are increasingly miniaturized and slimmed.

As a result, the present inventors found that when a plate-like conductive filler is used for the adhesive polymer resin, an adhesive tape having a very thin thickness can be manufactured while maintaining the adhesive properties and the electrical conductivity.

In addition, when the mask of the light shielding pattern is attached to both sides of the adhesive tape and then irradiated with light, the movement of the conductive filler can be controlled according to the light shielding pattern of the mask, thereby manufacturing a conductive adhesive tape having the required electrical conductivity. I knew it was. The present invention is based on this.

The present invention is an adhesive polymer resin; And a plate-shaped conductive filler distributed in the tacky polymer resin, wherein the plate-shaped conductive filler is electrically in the horizontal direction (xy direction) and `` 'direction (z direction) of the adhesive tape in the tacky polymer resin. The adhesive tape which is characterized by being arranged continuously is provided.

In addition, the present invention comprises the steps of: (i) mixing a monomer for forming an adhesive polymer resin and a plate-like conductive filler; (Ii) sheeting the mixture in the form of a tape; (Iii) disposing a mask on one or both sides of the sheet; And (iii) irradiating light on both surfaces of the sheet to photopolymerize the monomer, wherein the mask is provided with a light shielding pattern, and light is formed on the surface of the sheet. Provided is a method for producing an adhesive tape, which is characterized by being irradiated in part or in whole.

Adhesive tape according to the present invention can be applied to a variety of electronic devices that require a variety of electrical conductivity because the arrangement of the plate-like conductive filler can be changed according to the light shielding pattern of the mask to change the electrical conductivity.

Hereinafter, the present invention will be described in detail.

The adhesive tape according to the present invention has a structure in which a plate-like conductive filler material is distributed in an adhesive polymer resin, wherein the plate-shaped conductive filler material is horizontally and / or in a thickness direction on the surface, inside, or both of the adhesive tape. It is characterized by being arranged. Depending on the ordered arrangement of this plate-like conductive filler material, the adhesive tape of the present invention exhibits various electrical conductivity.

The plate-shaped conductive fillers used in the present invention may be arranged substantially flat in the tacky polymer resin. In addition, the filler particles may move differently due to a difference in polymerization initiation between portions of the polymer resin according to the presence of the light shielding pattern in the photopolymerization step.

For example, the adhesive tape in the form of a sheet according to an embodiment of the present invention comprises the steps of adding a plate-like conductive filler to a polymer material in a syrup state (hereinafter referred to as "polymer syrup") that is not fully cured; Preparing the mixture in the form of a sheet; Disposing a peelable release film on both sides of the sheet; And photopolymerizing the polymer syrup by irradiating light on both sides of the sheet. At this time, the plate-shaped conductive filler material is arranged in a flat (for example, oriented in a plane) in the horizontal direction (xy direction), it is possible to manufacture an adhesive tape having a thickness of about 10 ~ 200 ㎛. Here, preparing the polymer syrup in a sheet form and disposing the polymer syrup between a release film may be performed at the same time.

In particular, in the process of manufacturing the polymer syrup in the form of a sheet, it is possible to arrange a release film having a light shielding pattern formed on both sides of the sheet. When such a light shielding pattern is present, light irradiation is selectively performed according to the light shielding pattern of the release film to selectively initiate photopolymerization on the surface of the syrup. Accordingly, the plate-shaped conductive filler is arranged to move to a portion that has not yet been polymerized. By using this principle, the arrangement of the plate-shaped conductive filler material can be controlled.

Specifically, when the light is irradiated through the mask on which the light shielding pattern is formed, the light cannot pass through the light shielding pattern where the light shielding pattern is formed or the amount of passage is significantly reduced, so that polymerization is not initiated or light polymerization is initiated in this portion. The speed is very slow. On the other hand, in the polymer syrup portion of the portion where the light shielding pattern does not exist, photopolymerization is actively started, and polymerization proceeds downward of the polymer syrup gradually by radicals generated due to the initiation of the photopolymerization.

As such, the plate-shaped conductive filler material existing at the portion at which polymerization of the polymer syrup starts is moved to another portion not yet polymerized. When photopolymerization proceeds from both sides of the polymer syrup, the polymerization is initiated from the surface of the polymer syrup, and the conductive filler on the surface of the polymer syrup is moved to the inner middle portion of the polymer syrup which has not yet undergone polymerization. On the other hand, since the photopolymerization is not started in the portion of the polymer syrup existing under the light shielding pattern, the filler in the portion does not move to another portion. By using the movement characteristics of the plate-shaped conductive filler can be produced a variety of adhesive tape according to the present invention.

2 shows an example of the present invention. The polymer syrup 1 is disposed between the masks 3 without the light shielding pattern and is irradiated with the light 4. In this case, an adhesive tape in which the plate-shaped conductive filler 2 is arranged in the horizontal direction in the inner middle portion of the polymer syrup may be formed.

3 shows another example of the present invention, wherein the polymer syrup 1 is disposed between the masks 3 having the light shielding pattern and is irradiated with the light 4. In this case, an adhesive tape may be formed in which the plate-shaped conductive filler 2 is arranged in the inner middle portion of the polymer syrup in the portion where the light shielding pattern does not exist. On the other hand, in the portion of the polymer syrup in the portion where the light shielding pattern is present, the plate-shaped conductive filler 2 is present in the entire thickness direction due to the photopolymerization initiated by the weak or light on the surface of the polymer syrup without any noticeable movement. do. By this combination, the plate-shaped conductive filler 2 forms a network structure electrically connected from one side to the other side.

In addition, when a mask in which a light shielding pattern is formed on only one surface of the polymer syrup is used, an adhesive tape in which the plate-shaped conductive filler is arranged in the horizontal direction and the thickness direction from one surface of the polymer syrup to the inner middle portion may be formed.

According to the present invention, a pressure-sensitive adhesive tape in which plate-shaped conductive fillers are arranged differently may be used for various purposes. For example, in the case of the adhesive tape in which the plate-shaped conductive filler is arranged like a continuous network from one side of the adhesive tape to the opposite side (as shown in Fig. 1 (a)), both sides for all directions (xyz direction) grounding It can be used as a tape. Further, in the case of the adhesive tape in which the plate-shaped conductive filler is continuously arranged in the thickness direction and the horizontal direction from one surface of the adhesive tape to the inner middle portion (shown in FIG. 1 (b)), the horizontal direction (xy direction) It can be used as a double-sided tape for grounding and double-sided tape for vertical or thickness direction (z-direction) insulation. Further, in the case of the adhesive tape in which the plate-shaped conductive filler is continuously arranged in the horizontal direction in the inner middle portion of the adhesive tape (as shown in Fig. 1 (c)), it may be used as an insulating double-sided tape.

In the adhesive tape according to the present invention described above, unlike the conventional adhesive tape in which the conductive filler is irregularly dispersed, the arrangement of the plate-shaped conductive filler can be controlled. Thus, the adhesive tape of the present invention can be made to be suitable for applications requiring various electrical conductivity. In particular, in the case of the present invention, since a plate-like conductive filler material is used, a relatively thin adhesive tape, for example, an adhesive tape having a thickness of about 100 μm or less can be produced. Thus, the adhesive tape of the present invention typically has a surface resistance of about 0.1 kPa / m 2 or more, or a vertical resistance of about 0.001 kPa or more.

In the pressure-sensitive adhesive tape according to the present invention, the plate-shaped conductive filler is introduced to make the pressure-sensitive adhesive tape thinner while imparting electrical conductivity. As the plate-shaped conductive filler, any material can be used as long as the shape is plate-shaped while providing electrical conductivity.

Examples of the plate-like conductive filler in the present invention include a plate-like metal including a plate-like noble metal and a plate-like non-noble metal; Plate-like noble metals and base metals plated with noble metals or base metals; Plate-shaped nonmetal plated with a noble metal or a nonmetal; Plate-shaped conductive nonmetals; And mixtures of two or more of these.

Specifically, the plate-shaped conductive filler material may be noble metals such as gold, silver, platinum and the like and non-metals such as nickel, copper, tin, aluminum, and the like; Precious metals and base metals plated with precious metals such as silver plated copper, nickel, aluminum, tin, and gold; Precious metals and base metals plated with base metals such as nickel plated copper, silver and the like; Nonmetals plated with precious metals or nonmetals such as silver or nickel plated -graphite, -glass, -ceramic, -plastic, -elastomer, -mica and the like; Conductive nonmetals such as carbon black, carbon fiber, and the like; And mixtures of two or more thereof.

The size of the plate-shaped conductive filler varies depending on the type of material used. Although the size of the plate-shaped conductive filler is not particularly limited, in one example of the present invention, when the plate-shaped conductive filler is square or square, the thickness is generally about 100 nm to 25 μm, or the length of one side is About 0.25 to 25 μm.

In the adhesive tape produced according to the present invention, the content of the plate-like conductive filler material may be about 20 to 60% by weight based on the total weight of the adhesive tape. According to one embodiment of the present invention, the content of the adhesive polymer resin in the adhesive tape may be about 40 to 80% by weight, the content of the plate-like conductive filler may be about 20 to 60% by weight.

In the present invention, an acrylic polymer resin may be used as the adhesive polymer resin. According to one embodiment of the present invention, an acrylic polymer resin which may be prepared by polymerization of a photopolymerizable monomer may be used.

Useful photopolymerizable monomers for the production of such acrylic polymer resins include alkyl acrylate ester monomers having an alkyl group having 1 to 14 carbon atoms. Non-limiting examples of the alkyl acrylate ester monomers include butyl (meth) acrylate, hexyl (meth) acrylate, n- octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) ) Acrylate, isononyl (meth) acrylate, and the like. In addition, this isococyl acrylate, isononyl acrylate, 2-ethylhexyl acrylate, 2-decyl acrylate, dodecyl acrylate ), n-butyl acrylate (n-butyl acrylate), hexyl acrylate (hexylacrylate) and the like.

The alkyl acrylate ester monomers may be used alone to form an acrylic adhesive resin, but may be copolymerized with other polar copolymerizable monomers to form an acrylic adhesive polymer resin. That is, the acrylic adhesive polymer resin may be prepared from copolymerization of an alkyl acrylate ester monomer having a C1-C14 alkyl group with a polar copolymerizable monomer. At this time, the ratio of the alkyl acrylate ester monomer and the polar copolymerizable monomer is not particularly limited, but considering the physical properties of the final adhesive polymer resin, the weight ratio of 99-50: 1-50 is preferred.

Non-limiting examples of the polar copolymerizable monomer, acrylic acid (itaryic acid), itaconic acid (itaconic acid), hydroxyalkyl acrylate (hydroxyalkyl acrylate), cyanoalkyl acrylate (cyanoalkyl acrylate), acrylamide ( acrylamide, substituted acrylamide, N-vinyl pyrrolidone, N-vinyl caprolactam, acrylonitrile, vinyl chloride And diallyl phthalate. Such a polar copolymerizable monomer may serve to impart adhesiveness and cohesiveness to the polymer resin and improve adhesion.

In the adhesive tape manufactured according to the present invention, the content of the adhesive polymer resin may generally be about 40 to 80 wt% based on the total weight of the adhesive tape.

In addition, in order to have the physical properties required by the product to which the adhesive tape is applied, the adhesive tape according to the present invention may further include one or more other fillers. As long as such other fillers do not impair the properties and usability of the adhesive tape, any other fillers may be used without particular limitation on their kind. Non-limiting examples of the other fillers include thermally conductive fillers, flame retardant fillers, antistatic agents, foaming agents and the like.

The other filler may generally be used in an amount of about 100 parts by weight or less, for example, about 10 to 100 parts by weight based on 100 parts by weight of the adhesive polymer resin.

In addition, the adhesive tape of the present invention may further include an additive, for example, a polymerization initiator, a crosslinking agent, a photoinitiator, a pigment, an antioxidant, an ultraviolet stabilizer, a dispersant, an antifoaming agent, a plasticizer, a tackifier resin, and the like. Such additives may be added in the manufacture of the adhesive tape.

Hereinafter, the present invention will be described in detail with respect to the production method of the adhesive tape.

In the adhesive tape of the present invention, a step of mixing a monomer for forming an adhesive polymer resin or a polymer syrup prepolymerized with the monomer and a plate-like conductive filler for imparting electrical conductivity, adding other fillers or additives as necessary, And it may be prepared by the step of polymerizing the mixture.

That is, the adhesive tape of the present invention comprises the steps of mixing the adhesive polymer resin-forming monomer and the plate-like conductive filler; Sheeting the mixture; Disposing a mask on the surface of the sheet; And photopolymerizing a monomer for forming an adhesive polymer resin by irradiating light on both sides of the sheet. In this case, a mask having a light shielding pattern may be used, and light may be irradiated to a part or all of the surface according to the light shielding pattern of the mask. In this case, the plate-shaped conductive filler present in the portion of the sheet in which polymerization is initiated is arranged to move to another portion in which polymerization is not performed.

According to an example of the present invention, after preparing the polymer syrup by prepolymerizing the monomer for forming the adhesive polymer resin, a plate-like conductive filler and other necessary additives may be added thereto. By using such a method, the plate-like conductive filler can be uniformly dispersed, and also the initiation of selective photopolymerization can be facilitated. That is, in the step of mixing the adhesive polymer resin-forming monomer and the plate-like conductive filler, preparing a polymer syrup by partially polymerizing the monomer composition; And adding a plate-like conductive filler to the polymer syrup. According to an example of the present invention, the polymer syrup may have a viscosity of about 500 to 20,000 cPs.

According to a specific example of the manufacturing method, under the condition that oxygen is blocked, first, by using a polymerization initiator, a monomer for forming a tacky polymer resin, for example, a monomer for forming an acrylic polymer resin, may have a viscosity of about 500 to 20,000 cPs. Prepare syrup. To this, a plate-shaped conductive filler, a crosslinking agent, a photoinitiator and other necessary additives are added and the mixture is sheeted. In this case, the polymer syrup sheet may be disposed between two release film layers using a light-transmissive release film or the like. By disposing the polymer syrup between the release film, it is possible to maintain a condition that is substantially blocked oxygen. In addition, when the light shielding pattern is formed on one or both surfaces of the release film, the release film may serve as a mask in which the light blocking pattern is formed. Thereafter, under the condition that oxygen is substantially blocked, light, preferably ultraviolet rays, is irradiated through a release film or other mask on which the light shielding pattern is formed, so that the polymer syrup may be polymerized and crosslinked. In this case, light is irradiated to a part or all of the surface according to the light shielding pattern to selectively initiate photopolymerization. As a result, the plate-like conductive filler present in the portion of the syrup in which the polymerization is initiated moves to another portion in which the polymerization is not started. As a result, the plate-shaped conductive filler is arranged three-dimensionally, whereby an adhesive tape having a desired electrical conductivity can be produced.

When the surface of the sheet is irradiated with light, an unnecessary oxidation reaction does not occur in the adhesive polymer resin so that the oxygen content in the sheet is low, and thus the adhesive force of the adhesive tape may be excellent. That is, as described above, when the polymer syrup is disposed between the release films and sheeted, the oxygen may be blocked. In general, it is preferable to start photopolymerization by irradiating light in a chamber substantially blocked from oxygen, for example, a chamber having a concentration of oxygen of about 1000 ppm or less. By doing so, it is possible to block oxygen more effectively, thereby preventing the oxidation reaction. In some cases, the oxygen concentration is more preferably about 500 ppm or less.

In the photopolymerization step, a mask having a light shielding pattern may be used to irradiate light only to a selective portion of the sheet, and a mask having no light shielding pattern formed to irradiate light to all of the sheets, That is, a transparent mask can be used. The mask on which the light shielding pattern is formed includes a region through which light can pass and a region through which light does not pass or a very small amount of light passes. Accordingly, light may be irradiated or light may be irradiated to the sheet portion corresponding to the portion where the light shielding pattern exists, and the plate-shaped conductive filler present in the portion may be left on the surface without substantial movement. On the other hand, light passes through the sheet portion corresponding to the portion where the light shielding pattern does not exist to initiate photopolymerization, and the plate-shaped conductive filler present in the portion may move to the portion where the photopolymerization has not started. Thereby, the plate-shaped conductive filler can form a network structure in the sheet. In addition, in order to arrange the plate-shaped conductive filler in the inner intermediate layer of the sheet, light may be irradiated to the entire surface of the sheet by using a mask in which no light shielding pattern is formed.

Non-limiting examples of the mask include a light-transmissive release film having a predetermined light shielding pattern such as a mesh structure, a lattice structure, and a light-transmissive release film without a light shielding pattern. Here, the light-transmissive release film may be a transparent plastic film having a surface release treatment or a low surface energy, and the like. For example, a polyethylene film, a polypropylene film, or a polyethylene terephthalate (PET) film, which is a kind of plastic, may be used.

Any material that can block about 10 to 100% of light incident on the light blocking pattern portion may be used to form the light blocking pattern. Preferably, a material capable of blocking at least about 50% of light incident on the light blocking pattern may be used. According to an example of the present invention, the light shielding pattern may be designed to block at least about 70% of incident light. If necessary, the light shielding pattern may be designed to completely block incident light (100%).

There is no restriction | limiting in the method of forming a light shielding pattern on the surface of the said light-transmissive release film. Any method may be used as long as it is possible to reduce the amount of light passing through or to block the light-shielding pattern forming material having a property of blocking light from passing through on the surface of the light transmissive release film. As an example of this, the printing method can be applied. The printing method includes conventionally known printing methods, for example, a screen printing method, a printing method using thermal transfer paper, a gravure printing method, and the like. In order to form the light shielding pattern, black ink having excellent light absorbency may be used. In order to form the light shielding pattern, black ink having excellent light absorbency may be used. The shape of the light shielding pattern formed on the release film is not particularly limited and may be selected so that the conductive filler material may form a predetermined specific network structure.

The thickness of the release film is not particularly limited, but according to an example of the present invention, the thickness of the release film may be about 5 μm to 2 mm. In general, it is not easy to apply the polymer syrup to a release film having a thickness of less than about 5 μm and to form a light shielding pattern. In addition, when the release film is too thick (for example, exceeding about 2 mm), it is not easy to perform photopolymerization of the polymer syrup.

Moreover, the thickness of the adhesive tape manufactured by this invention is not specifically limited, It is preferable that the said adhesive tape is about 10-200 micrometers in thickness. According to other examples of the present invention, in consideration of photopolymerization, thickness and mobility of the plate-shaped conductive filler, the thickness of the adhesive tape is preferably about 20 to 150 μm, more preferably about 30 to 100 μm. desirable.

The intensity of light for photopolymerization of the polymer syrup may be about the intensity of light that is typically applied to the photopolymerization. According to an example of this invention, the light intensity of about an ultraviolet-ray is suitable.

In the present invention, one or more crosslinking agents may be used for crosslinking the adhesive polymer resin. According to the amount of the crosslinking agent, properties of the adhesive polymer resin, in particular, the adhesive properties can be adjusted. The crosslinking agent may be used by about 0.05 to 2 parts by weight based on 100 parts by weight of the adhesive polymer resin. Specific examples of crosslinking agents that can be used include 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, 1,2-ethylene glycol diacrylate, 1,12-dode There are polyfunctional acrylates such as candiol acrylate, but are not limited thereto.

In addition, one or more photoinitiators may be used in the manufacturing process of the adhesive tape of the present invention. According to the amount of the photoinitiator, the degree of polymerization of the polymer resin may be controlled. The photoinitiator may be used by about 0.01 to 2 parts by weight based on 100 parts by weight of the tacky polymer resin. Specific examples of photoinitiators that can be used include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, and α, α-methoxy-α-hydroxyaceto Phenone, 2-benzoyl-2 (dimethyl amino) -1- [4- (4-morphonyl) phenyl] -1-butanone, 2,2-dimethoxy 2-phenyl acetophenone, and the like, but are limited thereto. It is not.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. However, the following examples are for illustrating the present invention, and the scope of the present invention is not limited thereto.

In the following, "parts" means "parts by weight" based on 100 parts by weight of the tacky polymer resin formed by polymerization of monomers.

<Example 1>

Into a 1-liter glass reactor, 90 parts of 2-ethylhexyl acrylate as an acrylic monomer and 10 parts of acrylic acid as polar monomers are added, and 0.1 parts of Irgacure 651 (α, α-methoxy-α-hydroxyacetophenone) as a photoinitiator are added thereto. 0.1 part of crosslinker 1,6-hexanediol diacrylate (HDDA) was added. The monomers were partially polymerized by photoinitiation to produce a syrup having a viscosity of 3000 cPs. To the obtained syrup, 40 parts of plate-like silver was added as a plate-like conductive filler, and the mixture was stirred to prepare a mixture in the form of a homogeneous polymer syrup.

On the other hand, a light shielding mask having a light shielding pattern was formed by patterning a lattice having a width of 350 µm and a thickness of 1.0 mm with a black ink on a release film made of a transparent polyethylene terephthalate (PET) film having a thickness of 75 µm.

As shown in FIG. 6, the patterned release film was disposed on both sides of the polymer syrup by using a roll coating machine while extruding the polymer syrup from the glass reactor, and the polymer syrup was disposed to have a thickness of about 50 μm. . In this case, the release film may be disposed on both surfaces of the polymer syrup to prevent the polymer syrup from contacting air, particularly oxygen.

An adhesive tape was prepared by curing the polymer syrup by irradiating 4.5 ㎽ / cm 3 of ultraviolet light on both sides for about 520 seconds using a metal halide ultraviolet lamp toward the release film on which the light shielding pattern was formed.

<Example 2>

An adhesive tape was prepared in the same manner as in Example 1 except that a patterned release film was disposed on the top and a transparent release film other than the patterned release film was disposed on the bottom.

<Example 3>

An adhesive tape was prepared in the same manner as in Example 1 except for disposing a transparent release film instead of a patterned release film on both sides.

Experimental Example 1-Resistance Measurement

Using the Kiethely 580 micro-ohmmeter by the surface probe method of Mil-G-83528B, the vertical resistance and surface resistance of the adhesive tapes prepared in Examples 1 to 3 were measured and the average values are shown in Table 1 below. .

Vertical resistance (Ω) Surface resistance (Ω / ㎡) Top Bottom Example 1 0.004 10.5 11.4 Example 2 - 10 - Example 3 - - -

As can be seen from Table 1, it can be seen that the adhesive tapes prepared in Examples 1 to 3 had various resistances, that is, electrical conductivity, depending on the light shielding pattern of the mask.

Experimental Example 2-Adhesion Test

According to ASTM D 1000, the adhesive tapes prepared in Examples 1 to 3 were laminated with aluminum, and then the adhesive force in the 180 ° direction to the steel on the upper and lower surfaces of each adhesive tape using a universal test machine (UTM). Was measured. The results are shown in Table 2 below.

Top view (kgf / in.) Bottom (kgf / in.) Example 1 1.2 1.2 Example 2 1.41 1.15 Example 3 1.32 1.42

Figure 1 (a) is for the pressure-sensitive adhesive tape produced in Example 1 of the present invention, it shows a state that the plate-like conductive filler is arranged in a network shape as a whole.

Figure 1 (b) is for the pressure-sensitive adhesive tape prepared in Example 2 of the present invention, it shows a plate-like conductive filler is arranged in a horizontal direction and a thickness direction from one side of the polymer syrup to the inner middle.

Figure 1 (c) is for the pressure-sensitive adhesive tape prepared in Example 3 of the present invention, showing a plate-like conductive filler is arranged in a horizontal direction on the inner intermediate layer of the polymer syrup.

2 and 3 schematically show that the arrangement of the filler is changed in accordance with the pattern of the mask in the light irradiation step of the manufacturing step of the adhesive tape according to the present invention.

4 (a) is a scanning electron microscope (SEM) photograph showing the surface of the adhesive tape prepared according to Example 1 of the present invention.

4 (b) and 4 (c) are scanning electron microscope (SEM) photographs showing a cross section of the adhesive tape prepared according to Example 1 of the present invention.

5 (a) and 5 (b) are scanning electron microscope (SEM) photographs showing the appearance of each surface of the adhesive tape prepared according to Example 2 of the present invention, respectively.

Figure 6 schematically shows a process for producing an adhesive tape according to the present invention.

Claims (20)

Adhesive polymer resins; And a flake type conductive filler distributed in the adhesive polymer resin, The plate-shaped conductive filler is an adhesive tape, characterized in that electrically arranged in a horizontal direction (xy direction) and a thickness direction (z direction) in the adhesive polymer resin. The adhesive tape according to claim 1, wherein the adhesive tape has a thickness of 10 to 200 m. The adhesive tape according to claim 1, wherein the surface resistance is 0.1 kPa / m 2 or more. The adhesive tape according to claim 1, wherein the vertical resistance is 0.001 kPa or more. The pressure-sensitive adhesive tape of claim 1, wherein the plate-shaped conductive filler has a thickness of 100 nm to 25 μm. The adhesive tape according to claim 1, wherein the plate-shaped conductive filler is contained in an amount of 20 to 60 wt% based on the total weight of the adhesive tape. The method of claim 1, wherein the plate-like conductive filler is a plate-like metal comprising a noble metal (non-noble metal) and (non-noble metal); Plate-shaped noble metals and base metals plated with noble metals; Plate-shaped precious metals and base metals plated with base metals; Plate-shaped non-metal plated with precious or non-metal; Plate-shaped conductive nonmetals; And an adhesive tape selected from the group consisting of a mixture thereof. 8. The method of claim 7, wherein the precious metal comprises gold, silver and platinum; The base metal includes nickel, copper, tin and aluminum; The plate-shaped noble metal or base metal plated with the noble metal includes silver plated -copper, -nickel, -aluminum, -tin and -gold; The plate-shaped precious metal or base metal plated with the base metal includes nickel plated copper and silver; The plate-shaped nonmetal plated with the noble metal or the non-metal includes silver or nickel plated -graphite, -glass, -ceramic, -plastic, -elastomer, and -mica; The plate-shaped conductive non-metal is an adhesive tape characterized in that it comprises carbon black and carbon fiber. The adhesive tape according to claim 1, wherein the adhesive polymer resin is contained in an amount of 40 to 80% by weight based on the total weight of the adhesive tape. The adhesive tape according to claim 1, wherein the adhesive polymer resin comprises an acrylic polymer resin. The adhesive tape according to claim 10, wherein the acrylic polymer resin is a polymer obtained by copolymerizing an alkyl acrylate ester monomer having a C1-C14 alkyl group with a polar copolymerizable monomer. The adhesive tape according to claim 11, wherein the ratio of the alkyl acrylate ester monomer and the polar copolymerizable monomer is 99 to 50: 1 to 50. (Iii) mixing the adhesive polymer resin-forming monomer and the plate-like conductive filler; (Ii) sheeting the mixture in the form of a tape; (Iii) disposing a mask on one or both sides of the sheet; And (Iii) photopolymerizing the monomer by irradiating light on both sides of the sheet; As a manufacturing method of an adhesive tape comprising: The mask is provided with a light shielding pattern, and the method of manufacturing an adhesive tape, characterized in that the light is irradiated to a part or all of the surface of the sheet in accordance with the light shielding pattern. The method of claim 13, wherein in the photopolymerization step, the plate-shaped conductive filler in the mixture is arranged in a horizontal direction (xy direction) and a thickness direction (z direction) according to the pattern shape of the light shielding pattern. . The method of claim 13, wherein the mask has a selective light blocking pattern formed on one or both surfaces of the light-transmissive release film. The method of claim 13, wherein the light shielding pattern formed on the mask has a net structure or a lattice structure. The method of claim 15, wherein the light transmissive release film is a polyethylene film, a polypropylene film, or a polyethylene terephthalate (PET) film. The method of claim 13, wherein the mixing of the adhesive polymer resin monomer and the plate-shaped conductive filler comprises forming a polymer syrup by partially polymerizing the monomer for the adhesive polymer resin; And adding a plate-like conductive filler to the partially polymerized polymer syrup to uniformly mix the adhesive tape. The method of claim 18, wherein the polymer syrup has a viscosity of 500 to 20,000 cPs. The method of manufacturing an adhesive tape according to claim 13, wherein the concentration of oxygen is 1000 ppm or less when the light is irradiated.

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