KR20090033817A - Adjusting device, laser processing device, adjusting method, and adjusting program - Google Patents

Abstract

The present invention relates to an adjusting apparatus, a laser processing apparatus, an adjusting method and an adjusting program, and an object thereof is to automatically and efficiently adjust the irradiation of spatially modulated light.

According to the present invention, when the controller 113 designates a calibration pattern to the DMD 106, the LED light from the LED light source 116 is spatially modulated by the DMD 106 and irradiated onto the workpiece 102. . The CCD camera 112 picks up the workpiece 102. The control part 113 accepts a picked-up image, and calculates the conversion parameter which converts the output pattern and correction pattern which generate | occur | produce on an image corresponding to a correction pattern. When the laser beam from the laser oscillator 103 is spatially modulated by the DMD 106 and irradiated to the workpiece 102 in accordance with the irradiation pattern designated by the operation unit 114 or the like, the control unit 113 based on the conversion parameter. The irradiation of the laser light is adjusted.

Description

ADJUSTING APPARATUS, LASER BEAM MACHINING APPARATUS, ADJUSTING METHOD, AND ADJUSTING PROGRAM}

TECHNICAL FIELD This invention relates to the technique of adjusting the irradiation of the space modulated by the spatial modulation element.

Conventionally, the laser processing apparatus which processes a to-be-processed object by irradiating a to-be-processed object with a laser beam is used. There are kinds of processing, such as drawing of a character and a picture, exposure, repair (repair) in the manufacturing process of a board | substrate. In addition, the substrate may include a flat panel display (FPD), a semiconductor wafer, or a multilayer printed circuit such as a liquid crystal display (LCD) or a plasma display panel (PDP). board).

Such a laser processing apparatus is equipped with a mechanism for irradiating a laser beam to a designated position, direction, and shape. Conventionally, slits etc. are used as this mechanism. Recently, as this mechanism, spatial modulation elements such as DMDs (Digital Micromirror Devices) in which micromirrors are arranged in an array are also used. Spatial modulators are also referred to as spatial light modulators (SLMs).

However, as a result, the position, direction, and shape to which the laser beam was actually radiated may differ from the designated position, direction, and shape. This is because a plurality of optical parts are present on the optical path from the laser light source to the workpiece, and are affected by non-uniformity of these optical parts, misalignment of the mounting position, misalignment of the mounting direction, and the like.

Therefore, it is necessary to calibrate and adjust the method of irradiation of a laser beam so that the designated position, direction, and shape may actually match the position, direction, and shape to which the laser beam is irradiated.

In addition, although the term "calibration" may be used by the meaning including "adjustment", it demonstrates below as "calibration" not including "adjustment". In addition, unless otherwise indicated, "adjustment" means the adjustment according to the result of a calibration.

Patent Literatures 1 to 3 describe conventional techniques for adjusting the irradiation of laser light.

The laser processing apparatus of patent document 1 calculates the coordinate position on the image of the processing pattern which is the object which irradiates a laser beam, and the coordinate position on the image of the point to which a laser beam is irradiated, and calculates the amount of position deviation of both sides. Then, the position deviation amount is converted into a correction amount for moving the stage, and the stage is moved to adjust the position of the processing pattern to match the irradiation position of the laser beam.

However, Patent Document 1 only describes adjustment of position shift in the X direction or the Y direction, and there is no description of scale conversion such as abnormal rotation, enlargement or reduction, or irregularity in shape.

In the sample observation system of patent document 2, the predetermined kind of abnormal rotation and nonuniformity are considered. This system is a structure in which a laser scanning device and an image acquisition device are attached to a microscope. In this system, the irradiation position of the laser beam irradiated by the laser scanning apparatus is measured from the image acquired by the image acquisition apparatus. And correction and adjustment are performed based on the information which showed the difference between the irradiation position obtained by this measurement, and the irradiation instruction position of the laser beam irradiation instruct | indicated with respect to the laser scanning apparatus.

In this system, four factors regarding the difference between the irradiation position and the irradiation instruction position are considered, and an adjustment method in accordance with these factors is taken. For example, the positional shift and abnormal rotation of the optical axis of the optical system of each of the image acquisition device and the laser scanning device are offset by the control of correcting the deflection operation of the deflection mirror for deflecting the laser light.

Patent document 3 discloses a teaching method for matching the focal position of a YAG laser light with a laser processing point of a workpiece in a YAG laser processing machine. In this method, correction in the Z direction, which is the optical axis direction of the YAG laser light, and correction in the X direction and the Y direction perpendicular to the Z direction are performed.

In the calibration of the Z direction, the slit light for measurement, which is irradiated on the workpiece in the direction inclined with respect to the Z axis, and appears as a line parallel to the X axis on the workpiece, is used. Correction data in the Z direction is obtained from the relationship between the movement in the Z direction of the laser processing head and the Y coordinate of the slit light in the image picked up the workpiece. Based on this data, correction in the Z direction for positioning the focus of the YAG laser light on the surface of the workpiece is performed.

Correction in the X-Y direction is performed after correction in the Z direction. Specifically, an image obtained by moving the laser processing head to the origin in the tool coordinate system (XYZ coordinate system), irradiating the laser light by one shot, and bead traces formed by the irradiation are captured. The coordinates of the bead trace at are obtained. Similarly, in the tool coordinate system, the laser processing head is also sequentially moved to the X axis defining point on the X axis and the Y axis defining point on the Y axis, so that irradiation, imaging, and acquisition of coordinates of the laser beam are performed. .

The transformation matrix from a tool coordinate system to a pixel coordinate system is calculated | required using the coordinate in these three tool coordinate systems and the coordinate in the pixel coordinate system which is an image coordinate system. This transformation matrix represents a combination of translational and rotational movements.

The inverse transformation of the transformation by this transformation matrix transforms the coordinates of the detection point represented by the pixel coordinate system into the tool coordinate system. The correction amount in the tool coordinate system is calculated, and the laser processing head moves in the X-Y direction by the correction amount.

[Patent Document 1] Japanese Patent Application Publication No. 6-277864

[Patent Document 2] Japanese Patent Application Publication No. 2004-109565

[Patent Document 3] Japanese Patent Application Publication No. 2000-263273

All the above-mentioned patent documents 1-patent document 3 describe the calibration and adjustment method in the case where the laser beam to irradiate is not spatially modulated. In addition, correction and adjustment of the irradiation of light through the spatial modulation element have often been performed manually by humans.

According to one aspect of the present invention, there is provided an adjusting apparatus for adjusting irradiation of light modulated by a spatial modulation element to an object in accordance with a designated input pattern. The adjusting device includes a taking-in part that receives an image of the object to which the light modulated by the spatial modulation element is irradiated, an output pattern corresponding to the input pattern on the image, and the input pattern. A calculation unit for calculating a conversion parameter to be converted, and an adjustment unit for adjusting irradiation of light to the object according to a designated irradiation pattern based on the conversion parameter calculated by the calculation unit when a calibration pattern is used as the input pattern. do.

According to another aspect of the present invention, a laser processing apparatus is provided. The laser processing apparatus includes an optical system for guiding a laser light emitted from a laser light source onto an object, a spatial modulation element provided on an optical path from the laser light source to the object, and spatially modulating incident light, and the adjusting device. And the laser beam is used as the light irradiated to the object in accordance with the irradiation pattern, and the irradiation of the laser light with respect to the object is adjusted by the adjustment device to process the object.

According to another aspect of the present invention, there is provided a method that a computer executes to realize the adjusting device, and a program for causing the computer to function as the adjusting device. The program is stored and provided in a computer-readable storage medium.

In any of the above aspects, the irradiation of light to the object is adjusted based on the calculated conversion parameter. Therefore, compared with the case where the difference between the specified irradiation pattern and the pattern of the actually irradiated light is not adjusted, it is reduced.

According to the present invention, since the irradiation of the spatially modulated light by the spatial modulation element is automatically adjusted in accordance with the conversion parameter, more accurate irradiation can be realized.

Further, according to the present invention, since the conversion parameter is calculated from one calibration pattern, the irradiation of light for obtaining the conversion parameter is sufficient once, and there is no need to repeat the irradiation and the mechanical movement of the structure as in the prior art. Therefore, according to this invention, a calibration can be performed efficiently and light irradiation can be adjusted.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described in detail, referring drawings. In the plurality of drawings showing different embodiments, the same reference numerals are given to components corresponding to each other, and description thereof will be omitted.

Hereinafter, the first embodiment will be described first, and then the second to eighth embodiments of the first embodiment will be described. All of the first to eighth embodiments are examples of applying the present invention to adjusting the irradiation of laser light in the laser processing apparatus. Next, as an example of applying the present invention to adjusting the irradiation of light by the projector, the ninth embodiment will be described, and finally, other modifications will be described.

1 is a schematic diagram showing the configuration of a laser processing apparatus in the first embodiment. Also in the second to eighth embodiments, a laser processing apparatus having the same configuration as that in FIG. 1 is used.

The laser processing apparatus 100 of FIG. 1 is an apparatus which processes the to-be-processed object 102 mounted on the stage 101 by the laser beam radiate | emitted from the laser oscillator 103. FIG. The laser processing apparatus 100 performs predetermined processing with respect to the to-be-processed object 102, such as fusion | melting, cutting | disconnection, printing of figures, characters, etc., exposure, or restoration (repair) of a circuit pattern. In the following description, for the sake of simplicity, the upper surface of the stage 101 is assumed to be perpendicular to the vertical direction.

The workpiece 102 may be an FPD substrate, a semiconductor wafer, a laminated printed circuit board, or the like or another general sample.

The laser light emitted from the laser oscillator 103 passes through the half mirror 104, is reflected by the mirror 105, and enters the DMD 106.

The DMD 106 is a spatial modulation element in which micromirrors are arranged in a two-dimensional array. The tilt angle of the micromirror can be switched to at least two types. The mirror state when the inclination angle is the first angle and the second angle is hereinafter referred to as "on state" and "off state", respectively.

The DMD 106 independently switches the inclination angles of the individual micromirrors, that is, the individual micromirror states, based on the instructions from the control unit 113 to be described later. The instruction to the DMD 106 indicates, for example, binary value data indicating whether or not laser light should be irradiated by data arranged in a two-dimensional array type, and is transmitted from the control unit 113.

When the incident light incident on the DMD 106 from the mirror 105 is reflected by the on-line micromirror, the laser oscillator 103, the half mirror 104, and the mirror 105 are arranged so that the direction of the reflected light is in the vertical direction. And DMD 106 are arranged. The projection having the half mirror 107, the imaging lens 108, the half mirror 109, and the objective lens 110 on the optical path reaching the surface of the workpiece 102 of the laser light reflected by the micro mirror in the on state. The optical system is arranged. The laser light reflected by the on-line micromirror is projected, ie irradiated, to the surface of the to-be-processed object 102 through a projection optical system. The projection optical system is configured so that the surface of the workpiece 102 and the DMD 106 are in the conjugate position.

The micromirrors in the off state are different from when the tilt angle is in the on state. Therefore, incident light incident on the DMD 106 from the mirror 105 is reflected in a direction different from the direction of reaching the half mirror 107 in the off-state micromirror and is not irradiated onto the workpiece 102. In FIG. 1, the optical path of the reflected light by the micromirror of an off state is shown with the broken arrow.

Therefore, by controlling the individual micromirrors in the on state or the off state, it is possible to control whether or not the laser light is irradiated to a position on the workpiece 102 corresponding to each micromirror. That is, by using the DMD 106, the laser beam can be irradiated onto the workpiece 102 at any position, direction, and shape.

The laser processing apparatus 100 includes an LED (Light Emitting Diode) light source 116. Light irradiated from the LED light source 116 (hereinafter referred to as "LED light") is reflected by the half mirror 104 and enters the mirror 105.

Here, the laser oscillator 103, the half mirror 104, and the LED light source 116 are arranged so that the optical axis of the laser beam transmitted through the half mirror 104 and the LED light reflected from the half mirror 104 coincide. . Therefore, the optical path of the LED light after being reflected by the half mirror 104 is the same as the optical path of the laser light, and the LED light is also irradiated onto the workpiece 102.

In this embodiment, a calibration is made to adjust the irradiation of the laser light through the DMD 106, and the LED light is used for the calibration.

In addition, the laser processing apparatus 100 includes an illumination light source 111 and a CCD (Charge Coupled Device) camera 112. When illumination light is required for imaging, illumination light from the illumination light source 111 is reflected by the half mirror 109 and irradiated to the surface of the workpiece 102 through the objective lens 110. Instead of the CCD camera 112, an imaging device such as a CMOS (Complementary Metal-Oxide Semiconductor) camera may be used.

The reflected light on the surface of the workpiece 102 of the laser light, the LED light, and the illumination light all includes an optical system having an objective lens 110, a half mirror 109, an imaging lens 108, and a half mirror 107. Incident on the photoelectric conversion element of the CCD camera 112 through. Accordingly, the CCD camera 112 picks up the surface of the workpiece 102.

In this embodiment, laser light, LED light and illumination light of a wavelength capable of imaging the reflected light with the CCD camera 112 are used. Therefore, when the CCD camera 112 photographs the workpiece 102 in the state in which the laser light or the LED light is irradiated using the DMD 106, the captured image includes the laser beam irradiated onto the workpiece 102 or the like. The pattern of LED light appears.

If the laser processing apparatus 100 does not contain any nonuniformity or misalignment at all, the pattern shown in the image coincides with the pattern, position, direction (angle), and shape specified in the DMD 106. However, in practice, the two patterns may not match. This discrepancy is the subject of correction.

The laser processing apparatus 100 further includes a control unit 113, an operation unit 114, and a monitor 115.

The control unit 113 controls the entire laser processing apparatus 100. The operation unit 114 is realized by an input device such as a keyboard or a pointing device. The instruction input from the operation unit 114 is sent to the control unit 113.

In addition, the monitor 115 displays an image, a character, or the like according to an instruction from the control unit 113. The monitor 115 may display, for example, an image of the workpiece 102 captured by the CCD camera 112 in almost real time. In the following description, the image captured by the CCD camera 112 and read by the control unit 113 may be referred to as a "live image".

Details of the control unit 113 will be described later with reference to FIG. 2, but will be briefly described as follows.

Inputs to the control unit 113 are instructions from the operation unit 114 and image data from the CCD camera 112. Controlled by the control unit 113 are the stage 101, the laser oscillator 103, the DMD 1006, the monitor 115, and the LED light source 116.

In addition, the controller 113 may be a general-purpose computer or a dedicated control device. The function of the control part 113 may be implemented by any one of hardware, software, firmware, or a combination thereof.

For example, a CPU (Central Processlng Unit), a nonvolatile memory such as R0M (Read 0nly Memory), a random access memory (RAM) used as a working area, and an external storage device such as a hard disk device. And the control unit 113 may be realized by a computer such as a personal computer (PC) provided with a connection interface with an external device and connected to each other by a bus.

In this case, the stage 101, the laser oscillator 103, the DMD 106, the monitor 115, and the LED light source 116 are connected to this computer by respective connection interfaces. The CPU realizes the function of the control unit 113 by loading and executing a program stored in a hard disk device or a portable storage medium that can be read by a computer in the RAM.

Next, the workpiece 102 is a substrate, and the laser processing apparatus 100 is a laser repair apparatus for irradiating a laser beam onto a defect on the substrate surface to repair the defect, using the specific example, the laser processing of the first embodiment. An outline of the operation of the apparatus 100 will be described.

As shown in FIG. 1, the laser processing apparatus 100 includes a microscope including an imaging lens 108 and an objective lens 110. Therefore, the CCD camera 112 can image the fine circuit pattern and the minute defect on the to-be-processed object 102 through a microscope. The captured live image is displayed on the monitor 115 in near real time.

A region where a defect exists on the surface of the workpiece 102 is referred to as a "defect region", and a region where the defect region is imaged among the images displayed on the monitor 115 will be referred to as a "defect display region". The laser repair apparatus recovers a board | substrate by irradiating a laser beam to a defect area. For example, dust and unnecessary resist are defects, but they are recoverable defects because they can be evaporated by irradiation with laser light. For example, such a defect is the object of recovery by the laser repair apparatus.

In order to prevent damage of the circuit pattern normally formed by irradiating a laser beam to the area | region without a defect, the area | region to which laser beam is irradiated must match with a defective area with good precision. Therefore, correction and adjustment are required.

For example, the operator selects, that is, designates the defect display area via the operation unit 114. The designated defect display area is a pattern representing the defect area. By assigning this pattern to the DMD 106, the control section 113 enables irradiation controlled to "irradiate laser light to the defect area and not irradiate the laser light to a region other than the defect area". In other words, by instructing the micromirror of the DMD 106 corresponding to the pixel included in the defect display region to instruct the on state and the other micromirror to instruct the off state, the laser beam is irradiated to the defect region so that a defect is generated. It recovers, and a laser beam is not irradiated to other area | regions.

If there is no nonuniformity or misalignment in the laser processing apparatus 100, the micromirror of the DMD 106 corresponding to the pixel contained in the defect display area | region has a laser in the position on the to-be-processed object 102 corresponding to this micromirror. It must be turned on to irradiate light. In addition, the micromirror corresponding to the pixel not included in the defective area should be turned off so as not to irradiate the laser light to a position on the workpiece 102 corresponding to the micromirror.

However, in practice, there may be a nonuniformity or a deviation in the laser processing apparatus 100. So calibration is done. And a laser beam is adjusted based on a calibration result, and is irradiated on the to-be-processed object 102 which is a board | substrate. As a result, the laser beam is irradiated in a pattern that matches the defect region on the substrate with good accuracy. That is, the laser processing apparatus 100 which is a laser repair apparatus can repair the defect of a board | substrate, without damaging a normal part by a laser beam.

Next, the control part 113 is demonstrated in detail.

2 is a functional block diagram showing the functions of the control unit 113 in the first embodiment.

The control unit 113 includes an intake unit 201 that receives an image from the CCD camera 112, a calculation unit 202 that performs calibration, an adjustment unit 203 that adjusts light irradiation based on the result of the calibration, A selection unit for selecting one of the spatial modulation control unit 204 for controlling the DMD 106, the stage control unit 205 for controlling the stage 101, and the laser oscillator 103 or the LED light source 116 as a light source ( 206. In the first embodiment, the adjusting device according to the present invention is implemented by the blowing unit 201, the calculating unit 202, and the adjusting unit 203.

The blowing unit 201 inputs an image obtained by photographing the workpiece 102 from the CCD camera 112. For example, when the control part 113 is implement | achieved by a PC, the taking-in part 201 may be implement | achieved by the image capture board attached to the PC.

Although the kind of the image which the taking-in part 201 accepts differs according to an embodiment, in any embodiment, the image which the taking-in part 201 necessarily accepts of the to-be-processed object 102 when irradiating according to a correction pattern is carried out. It is a burn.

The calibration pattern is a kind of input pattern instructed to the DMD 106. In the following description, the "input pattern" is a pattern indicating an instruction to the DMD 106, and an area (area) to which light is irradiated is referred to as an "on" or "off" instruction for each micromirror. It is a pattern represented by. Depending on the purpose for calibration or for processing by laser light, the pattern specifically designated as the input pattern is different.

According to a certain input pattern, the pattern corresponding to this input pattern arises on the image which image | photographed the to-be-processed workpiece 102 to which light was irradiated. Hereinafter, the pattern which generate | occur | produced on the image is called "output pattern."

The output pattern is a binary value of "light is irradiated" or "light is not irradiated", and is a pattern in which each point on the image appeared. Indications of "on" and "off" in the input pattern correspond to states of "light is irradiated" and "light is not irradiated" in the output pattern, respectively.

However, in general, the input pattern and the output pattern are different due to the nonuniformity, the deviation, and the like present in the laser processing apparatus 100. For example, the calibration pattern is a reference pattern used for calibration, but the output pattern is different from the reference pattern.

That is, based on the input pattern, the output pattern is shifted from the reference position, rotated from the reference angle, enlarged or reduced in shape, or deformed.

Thus, the calculation unit 202 calculates a conversion parameter for converting the input pattern into an output pattern. In each of the examples below, the calibration is to calculate the conversion parameters. Since the specific example of a conversion parameter differs by an Example, the detail is mentioned later.

The calculation unit 202 outputs the conversion parameter calculated when the calibration pattern is used as the input pattern to the adjustment unit 203. And the calculating part 202 may read out the predetermined calibration pattern stored in the memory | storage device which is not shown in figure, and may use it for calculation of a conversion parameter, and may generate a calibration pattern every time it corrects.

The adjustment unit 203 adjusts the irradiation of the laser light according to the irradiation pattern specified from the outside of the control unit 113 based on the conversion parameter. The object to be controlled for adjustment differs depending on the embodiment, but in the first embodiment, the adjustment unit 203 adjusts the irradiation pattern provided from the operation unit 114.

When the control part 113 is implemented by a PC, the calculating part 202 and the adjustment part 203 may be implemented by the CPU which loads a program into RAM and runs it. When the calibration pattern is stored in the storage device in advance, the storage device may be a RAM or a hard disk device included in the PC.

The spatial modulation control unit 204 receives an input pattern to be instructed to the DMD 106, and performs control to turn individual micromirrors of the DMD 106 into an on state or an off state according to the input pattern. As a result, the light irradiated from the laser oscillator 103 or the LED light source 116 is spatially modulated by the DMD 106 and irradiated onto the workpiece 102.

The spatial modulation control unit 204 receives a calibration pattern from the calculation unit 202 as an input pattern when irradiating LED light for calibration. In addition, in the irradiation of the laser beam for processing, the spatial modulation control unit 204 receives the input pattern adjusted by the adjustment unit 203 from the adjustment unit 203.

The stage control unit 205 controls the stage 101 in order to change the relative position between each component of FIG. 1 constituting the optical system and the stage 101. In another embodiment, the relative position may be changed by moving the optical system instead of the stage 101.

For example, when the laser processing apparatus 100 is a laser repair apparatus, the approximate position of the defect to be repaired is notified to the laser processing apparatus 100 from the defect inspection apparatus in advance. Then, the stage control unit 205 controls and moves the stage 101 so that the position on the notified workpiece 102 falls within the irradiation range of the laser beam and falls within the imaging range of the CCD camera 112.

Thereafter, the CCD camera 112 picks up the workpiece 102, and the taking-in unit 201 receives the picked-up image, and the monitor 115 displays this image. The pattern to be recovered by irradiating the laser beam, that is, the defect display area, is instructed by the operator from the operation unit 114 based on the image displayed on the monitor 115, for example. In addition, you may extract a defect display area by the well-known technique by comparison with the image obtained from the to-be-processed object.

The selection unit 206 selects one of the laser oscillator 103 and the LED light source 116 as a light source, turns on the light source on the selected side, and turns off the light source on the unselected side. Specifically, the selection unit 206 controls the laser oscillator 103 to be turned off when the calibration is performed and the LED light source 116 is turned on, and when the processing is performed, the laser oscillator 103 is turned on and the LED is turned on. Control to turn off the light source 116 is performed. In addition, the selection unit 206 may control to turn off both light sources.

When the control unit 113 is realized by a PC, both the spatial modulation control unit 204, the stage control unit 205, and the selection unit 206 are connected to a CPU that loads and executes a program into a RAM, an external device, and a PC. It can be realized by the interface.

Next, the calibration target will be described with reference to FIG. 3.

3 is a diagram illustrating the deformation of the irradiation pattern due to the misalignment and non-uniformity present in the laser processing apparatus 100, that is, the deformation from the input pattern to the output pattern.

For convenience of explanation, hereinafter, the horizontal axis of the image captured by the CCD camera 112 will be referred to as the x axis and the vertical axis of the image will be referred to as the y axis. Although the size of the image is arbitrary, in the present embodiment, 640 pixels in the x direction and 480 pixels in the y direction. This size is referred to as "640 x 480 pixels". The position of each pixel in an image is represented by the set (x, y) of x coordinate and y coordinate. The coordinates of the upper left vertex and the lower right vertex of the irradiation pattern 310 in FIG. 3 are (0, 0) and (639, 479), respectively.

The irradiation pattern 310 of FIG. 3 is a pattern showing which part of the image should be irradiated with the laser beam on the image picked up by the CCD camera 112. Therefore, the position in the irradiation pattern 310 can also be represented by the set (x, y) of the x coordinate and the y coordinate, and the size of the irradiation pattern 310 is equal to an image captured by the CCD camera 112. X 480 pixels.

Here, when irradiating a laser beam is shown in white and not irradiating in black, the irradiation pattern 310 can be represented as a monochrome binary value image, as shown in FIG. In the example of FIG. 3, the irradiation pattern 310 is formed of a white cross shape where a thick line parallel to the x-axis and a thick line parallel to the y-axis meet at a central portion of the image and a black background color. It shows that the laser beam should be irradiated to the part on the to-be-processed object 102 corresponding to this.

In this embodiment, the irradiation pattern 310 is instructed from the operation unit 114 as follows. First, under the illumination by illumination light from the illumination light source 111, the CCD camera 112 image | photographs the to-be-processed object 102 in the state which neither the laser nor LED light was irradiated. Then, the taking-in unit 201 of the control unit 113 receives the captured image and outputs it to the monitor 115.

After that, the operator looks at the image output to the monitor 115 and instructs the operating unit 114 the range in which the laser light should be irradiated. This instruction is given to the control unit 113 in the form of data of the irradiation pattern 310 having a size of 640x480 pixels through an interface connecting the operation unit 114 and the control unit 113.

In another embodiment, the data of the irradiation pattern 310 may be sent to the control unit 113 from another device. For example, when the laser processing apparatus 100 is a laser repair apparatus, such as an FPD board | substrate, the data of the irradiation pattern 310 may be sent to the control part 113 from a defect inspection apparatus. Alternatively, the laser repair apparatus may include an image recognition unit, and the image recognition unit may recognize the shape of the defect by the image recognition process, generate data of the irradiation pattern 310 representing the recognized shape, and output the data to the control unit 113. .

In either case, the data of the irradiation pattern 310 is given to the control unit 113. The control unit 113 then generates, from the irradiation pattern 310, DMD transmission data 320 for instructing the DMD 106 to turn on and off individual micromirrors. The DMD transmission data 320 is data representing an input pattern and is transmitted (that is, transmitted) to the DMD 106.

In the DMD 106, the micromirrors are arranged in a two-dimensional array type, and the position of the micromirrors can be represented by a combination (u, v) of u coordinates and v coordinates. In addition, below, in order to simplify description, in the coordinate (x, y) of the pixel in an image, and the coordinate (u, v) of a micromirror,

x = u, y = v

Assume that there is a relationship between Since the relationship is established only by properly arranging the micromirrors and appropriately setting the origin of the uv coordinate system, the generality of the following description is not lost.

Here, similarly to the drawing of the irradiation pattern 310, if the irradiation of the laser light is shown in white and the irradiation not in black, the DMD transmission data 320 can also be expressed as a black and white binary value image. In other words, the data for DMD transmission (320) as a black and white binary value image representing the points of positions (u, v) by white indicating that the micromirror is on or black indicating that the micromirror is off. ) Can be expressed.

In this embodiment, it is assumed that 800x600 micromirrors are arranged in the DMD 106. That is, the number of the micromirrors is larger than the number of pixels of the image picked up by the CCD camera 112. Therefore, the image which shows the DMD transmission data 320 becomes an image which enclosed the black margin around the image which shows the irradiation pattern 310. As shown in FIG. The reason for such a margin will be described later.

That is, the color (white or black) at the position (x, y) of the image representing the irradiation pattern 310 and the position at which u = x and v = y of the image representing the DMD transmission data 320. The colors in (u, v) are the same. And position (u, v)

u <0 or 640≤u or v <0 or 480≤v

When it is in the range of, the color at the positions u and v of the image representing the DMD data 320 is black.

In FIG. 3, the DMD transmission data 320 has a white rectangular border, but this border indicates a range of 640x480 pixels corresponding to the irradiation pattern 310 for the sake of explanation. It does not show turning on the micromirror on a white border line. In the present embodiment, the width of the margin above and below the white border line in the DMD data 320 is the same, and the width of the right margin and the left margin are also the same. However, the margin width may be appropriately determined according to the embodiment.

Based on the above-described relationship between the irradiation pattern 310 and the DMD transmission data 320, the control unit 113 generates the DMD transmission data 320 from the data of the irradiation pattern 310. As described above, in order to generate the DMD transmission data 320, the control unit 113 may simply add a black margin around the irradiation pattern 310.

The spatial modulation control unit 204 in the control unit 113 outputs the DMD transmission data 320 to the DMD 106 to give an on or off instruction to each of the 800 × 600 micromirrors.

Here, without the adjustment according to the correction, according to the DMD transmission data 320 itself, the micromirror of the DMD 106 is turned on or off, and the laser light is emitted from the laser oscillator 103. Assume

In this case, generally, the pattern of the laser beam irradiated on the to-be-processed object 102 differs from the desired irradiation pattern 310. This is because the optical system and / or the imaging system of the laser processing apparatus 100 may be misaligned or uneven.

For example, there may be a component in which the mirror or the lens is skewed, the mounting position of each component of the laser processing apparatus 100 is shifted, or the mounting angle is shifted and mounted from the original angle.

The live image 330 of FIG. 3 is an example of the image image | photographed by the CCD camera 112, when a pattern different from the desired irradiation pattern 310 is irradiated on the to-be-processed object 102 in this way. Therefore, the position on the live image 330 can also be represented by the xy coordinate system, and the size of the live image 330 is 640x480 pixels.

In the live image 330 of FIG. 3, a portion where the laser beam is actually irradiated is white, and a portion that is not irradiated is black. When the live image 330 is compared with the irradiation pattern 310, the white cross shape moves in the positive direction of the x-axis and is rotated about 15 ° in the counterclockwise direction. The deformation from the irradiation pattern 310 to the live image 330 may include not only such parallel movement (shift) and rotation, but also unevenness of shapes such as enlargement or reduction, that is, scale conversion or shear deformation. It may be.

Therefore, in order to prevent such deformation | transformation, it is necessary to perform a calibration and adjust irradiation of a laser beam based on the result of a calibration. In the present embodiment, the deformation of the above-described irradiation pattern caused by the deviation and nonuniformity present in the laser processing apparatus 100 is regarded as a result of a kind of transformation, and this transformation is mathematically modeled.

Next, a process of acquiring a parameter representing this mathematically modeled transformation by calibration and adjusting it based on the acquired parameter will be described.

In FIG. 3, the data for DMD transmission 320 is the same as the irradiation pattern 310 except for a margin. Therefore, the irradiation pattern 310 can be said to be an input pattern actually assigned to the DMD 106. And the live image 330 is an output pattern which arises in an image, when the laser beam transformed without adjusting anything is irradiated on the to-be-processed object 102 corresponding to this input pattern. Therefore, the deformation | transformation from the irradiation pattern 310 to the live image 330 can be considered that it is by conversion from the said input pattern to the said output pattern.

In the present embodiment, a mathematical model called an affine transformation represented by the transformation matrix T is adopted. That is, each element of the transformation matrix T is a transformation parameter to be calculated in the calibration.

As described above, since both the input pattern and the output pattern can be represented by the xy coordinate system and are always u = x and v = y, even if the uv coordinate system and the xy coordinate system are identified, there is no problem in calculating the conversion parameter. That is, the mathematical model in this embodiment is " the transformation matrix T in which the coordinates (x, y) in the irradiation pattern 310 which are the same as the coordinates (u, v) in the DMD transmission data 320 indicate the affine transformation. Is converted into the coordinates (x ', y') in the live image 330 ".

This mathematical model is represented by equation (1).

[Equation 1]

Here, the transformation matrix T is defined by the 3x3 matrix of expression (2).

[Equation 2]

Then, the transformation from the input pattern to the output pattern can be represented by the matrix operation of equation (3).

[Equation 3]

Here, elements d ₁ and d ₂ in the third column of the transformation matrix T represent the amount of parallel movement. In the transformation matrix T, when a part consisting of elements a ₁ , b ₁ , a ₂ , and b ₂ is regarded as a 2 × 2 matrix, the 2 × 2 matrix is a regular matrix from the definition of the affine transformation, and is rotated, enlarged, and reduced. And shear strains synthesized. This can also be understood from the following Expressions 4 to 12.

That is, any regular 2x2 matrix S can be resolved as in Equation 4.

[Equation 4]

In general, the matrix X representing rotation is represented by equation 5, the matrix Y representing enlargement or reduction is represented by equation 6, and the matrix Z representing shear deformation is represented by equation 7.

[Equation 5]

[Equation 6]

[Equation 7]

Here, when?,?, And? Are represented by Expressions 8, 9, and 10, respectively, and? Satisfies Expressions 11 and 12, the matrix S satisfies Expression 13.

[Equation 8]

[Equation 9]

[Equation 10]

[Equation 11]

[Equation 12]

[Equation 13]

S = XYZ

In other words, by calculating the transformation matrix T, it becomes possible to calibrate in consideration of translation, rotation, enlargement, reduction, and shear deformation. Therefore, a method of calculating the transformation matrix T will next be described.

In general, when three points a, b and c are mapped to points a ', b' and c 'by the affine transformation, the transformation matrix T representing this affine transformation is the coordinates of the points a, b and c and the point a. From the coordinates of ', b', c 'can be calculated as follows.

First, in the xy coordinate system

Set the coordinate of point a to (x _a , y _a ) ^T

Set the coordinates of point b to (x _b , y _b ) ^T

Set the coordinates of point c to (x _c , y _c ) ^T

Coordinates of point a '(x _a ', y _a ') ^T

Coordinates of point b '(x _b ', y _b ') ^T

Coordinates of point c '(x _c ', y _c ') ^T

It is represented by the column vector to be. Here, the above superscript letter "T" represents a transposition. Then, using the coordinates of points a, b, c and points a ', b', and c ', the matrix P represented by the following expression 14 and the matrix Q represented by the following expression 15 can be defined.

[Equation 14]

[Equation 15]

Here, from the equation 3, the relationship between the three points a, b, c and the three points a ', b', and c 'can be expressed as in Expression 16 below.

[Equation 16]

TP = Q

to be. If the positions of the three points a, b, and c are appropriately selected, the matrix P becomes a regular matrix and an inverse matrix P ⁻¹ exists. Therefore, equation 17 can be obtained by multiplying inverse matrix P ⁻¹ from the right side of both sides.

Formula 17

T = QP ^-1

Therefore, the calculating part 202 can calculate the conversion matrix T from Formula (17). That is, if three points a, b, and c are determined at appropriate positions such that the matrix P is a regular matrix, and the positions of the points a ', b', and c 'mapped by the transformation matrix T are known, T can be calculated. In this embodiment, the LED light according to the calibration pattern is irradiated to know the positions of the points a ', b', and c '.

4 is a diagram illustrating an example of a calibration pattern. Although an example of three calibration patterns is shown in FIG. 4, these are the patterns which express three points a, b, and c which are positioned so that matrix P turns into a regular matrix so that they can distinguish from each other.

The calibration pattern may be generated by the calculation unit 202 for each calibration amount, or may be generated in advance and stored in the storage device.

Since the calibration pattern is a kind of input pattern to the DMD 106, it can be represented as a white binary value image showing the on state and black showing the off state similarly to FIG. In addition, as described in FIG. 3, since the uv coordinate system is the same as the xy coordinate system in the present embodiment, FIG. 4 illustrates the x-axis and the y-axis.

Three circles (circles) different in diameter are arranged in the calibration pattern 340, and three points can be distinguished according to the difference in diameter. In other words, the center of the smallest diameter circle is point a, the center of the second smallest circle is point b, and the center of the largest circle is point c. Circles with different diameters are also different in area from each other, and can be easily distinguished from each other by image processing.

In the calibration pattern 341, three points are distinguished according to the shape difference. That is, the center of the rectangle is point a, the center of the rhombus is point b, and the center of the triangle is point c.

In the calibration pattern 342, three points are distinguished using the figure which consists of two line segments. In the calibration pattern 342, one end point of the line segment parallel to the y axis is point a, and the other end point is point b. In addition, the end point of the line segment parallel to the x-axis which is not in contact with the line segment ab is the point c. Here, if the point of contact between the line segment ab and the line segment parallel to the x-axis is point w, the positions of points a, b, and c are different so that the distance aw between point a and point w and the distance bw between point b and point w are different from each other. Can be determined.

Of course, calibration patterns other than those illustrated in FIG. 4 are also available. For example, the three vertices can be distinguished from each other on the basis of the length of the three sides, even if the pattern consists only of triangles in which the lengths of the three sides are different from each other. In addition, you may use the pattern which expressed the 4 or more points distinguishable from each other, and may use only 3 specific points among them for calibration. In short, when the transformation matrix T employs a mathematical model representing an affine transformation, the calibration pattern may be any shape pattern as long as it is possible to distinguish three points from each other.

By the way, when the CCD camera 112 image | photographs the to-be-processed object 102 to which light was irradiated according to the correction pattern, the image containing the output pattern transformed by the conversion matrix T can be obtained as mentioned above. In order to calculate the transformation matrix T, it is necessary to recognize the positions of the points a ', b', and c 'from this output pattern.

Here, since the cause of the deformation by the transformation matrix T is a deviation or non-uniformity lurking in the laser processing apparatus 100, the degree of deformation by the transformation matrix T is not extreme. Therefore, the point a in the output pattern is used by using a calibration pattern in which the "degree of distinguishing three points a, b, c" is made high so that the property of "three points can be distinguished" is maintained even if the calibration pattern is somewhat deformed. ', b', c 'can be distinguished from each other.

For example, in the example of the calibration pattern 340, if three diameters differ, three points a, b, and c can be distinguished. However, this distinguishable degree differs depending on the ratio of the diameters of the three circles.

If the values of the three diameters are approximated, the three circles may be mapped into three ellipses (or circles) that are almost indistinguishable by the transformation matrix T. However, if the values of the three diameters are significantly different from each other, the three circles are mapped into three ellipses (or circles) which are largely different in area from each other even in an output pattern deformed by the transformation matrix T. Therefore, three points a ', b', and c 'are distinguishable. That is, the center of each of the three ellipses (or circles) can be recognized as three points a ', b', and c '.

In other words, in the example of the calibration pattern 340, the more the diameters of the three circles differ from each other, the higher the degree of easy discrimination between the three points a, b, and c is. If the diameters of the three circles in the calibration pattern 340 are somewhat different, it is different depending on the embodiment whether the three points a ', b', and c 'are distinguishable in the output pattern. Therefore, you may perform a preliminary experiment and determine the diameter of three circles.

In the calibration pattern 341, triangles and squares can be easily distinguished from the output pattern. For example, if the length of the two sides of the rectangle is greatly different, or if the area of the rectangle and the rhombus is much different, the property of "three points can be distinguished" is maintained in the output pattern. Therefore, the center of each of the three figures in the output pattern can be recognized as three points a ', b', and C '.

Also for the calibration pattern 342, the two distances aw and bw differ from each other so that the property of "three points can be distinguished" is maintained in the output pattern, and the three points a ', b', and c 'are distinguished from each other. I can recognize it.

Next, with reference to FIG. 5, the process of calculating the conversion matrix T using such a correction pattern is demonstrated.

Fig. 5 is a flowchart showing the calculation step of the transformation matrix T as the conversion parameter in the first embodiment.

In step S101, the calculation unit 202 creates a calibration pattern as illustrated in FIG. 4, and outputs the correction pattern to the spatial modulation control unit 204, for example. Alternatively, the calculation unit 202 may read the calibration pattern stored in the storage device in advance in step S101.

The calibration pattern is assigned to the DMD 106 as an input pattern and can be represented as a binary value image. Therefore, in Fig. 5, step S101 is expressed as "DMD image creation."

Next, in step S102, the calculation unit 202 acquires coordinates of three points a, b, and c from the data of the calibration pattern.

For example, in the case of the calibration pattern 340 of FIG. 4, the calculation unit 202 recognizes three "white" circles from the calibration pattern by the image recognition process, and the center of the recognized three circles ( In other words, the coordinates of the center of gravity are calculated and acquired respectively. These three coordinates are the coordinates of points a, b and c.

And in step S103, the selection unit 206 selects the LED light source 116 as a light source. In addition, the spatial modulation control unit 204 controls the DMD 106 to switch between the on state and the off state of the micromirror in accordance with the calibration pattern. Accordingly, the LED light emitted from the LED light source 116 is spatially modulated in accordance with the calibration pattern, and is projected (ie irradiated) onto the surface of the workpiece 102 through the DMD 106.

Subsequently, in step S104, the CCD camera 112 picks up the workpiece 102, and the taking-in unit 201 receives (ie, captures) data of the captured image from the CCD camera 112. . In this image, an output pattern corresponding to the calibration pattern exists.

In following step S105, the calculating part 202 acquires the coordinates of three points a ', b', c 'from the output pattern of the image which the taking-in part 201 received as follows.

In this embodiment, the image received by the blowing unit 201 is a gray scale image. Of course, in another embodiment, although the CCD camera 112 which picks up a color image may be used, the calculation part 202 acquires the coordinates of three points a ', b', and c 'in such a case as well. do.

The calculator 202 first converts the image received by the take-up unit 201 into a monochrome binary value image. This binarization is performed based on, for example, a comparison of the luminance value and the threshold value of each pixel. In the converted black-and-white binary value image, the white area is the portion of the area irradiated with LED light, and the black area is the area not irradiated with the LED light. The calculation unit 202 performs the following processing using the converted monochrome binary value image.

For example, when the correction pattern 340 of FIG. 4 is used, the calculating part 202 recognizes the presence and position of the shape near a circle or an ellipse by image recognition processing. As a result, three shapes are recognized. In the example of the correction pattern 340, the area of three circles corresponds to the points a, b, and c in order of decreasing order, respectively. Therefore, the calculation unit 202 calculates the areas of the three recognized shapes and associates the shapes with the points a ', b', and c 'in order of decreasing area. In addition, the calculation unit 202 calculates the coordinates of the center of each of the three recognized shapes, and obtains these three coordinates as coordinates of three points a ', b', and c '.

Similarly, in the case where other calibration patterns are used, the calculation unit 202 acquires, in step S105, the coordinates of three points a ', b', and c 'from the monochrome binary value image representing the output pattern.

Subsequently, in step S106, the calculation unit 202 calculates the transformation matrix T according to the above-described equation (17). Here, the matrix Q is defined by equation 15 from the coordinates of three points a ', b', c 'obtained in step S105, and the matrix P is expressed by equation 14 from the coordinates of three points a, b, c obtained in step S102. Is defined.

In addition, as described with respect to Equation 16, in this embodiment, the matrix P is a regular matrix, and therefore, the calculation unit 202 may calculate the inverse matrix P ⁻¹ in step S106. Various methods are known for calculating the inverse matrix, and any method may be adopted.

The calculation unit 202 stores the data of the conversion matrix T thus created in a storage device such as a RAM or a hard disk, not shown in FIG. 2.

Finally, in step S107, the calculation unit 202 calculates the inverse transformation matrix T '(= T ^-1 ), which is the inverse matrix, from the transformation matrix T. Inverse transformation matrix T 'is an inverse transformation parameter which shows the inverse transformation of the transformation by the transformation matrix T as a transformation parameter. The calculator 202 also stores the data of the inverse transformation matrix T 'in the storage device.

In the above, the process of FIG. 5, ie, a calibration, is complete | finished. After the completion of the calibration, the irradiation of the laser beam from the laser oscillator 103 in which the adjustment according to the inverse transformation matrix T 'is performed is performed. In addition, since the inverse transformation matrix T 'is calculated from the transformation matrix T, it should be noted that the adjustment based on the inverse transformation matrix T' is indirectly an adjustment based on the transformation matrix T.

6 is a view for explaining an adjustment method in the first embodiment.

The irradiation pattern 310 of FIG. 6 and the data 320 for DMD transmission are the same as in FIG. 3. 6 is a figure explaining using the transformation matrix T like FIG.

In the first embodiment, the calculation unit 202 of FIG. 2 outputs the transformation matrix T and the inverse transformation matrix T 'which have already been calculated and stored in the storage device to the adjustment unit 203.

In addition, the adjustment unit 203 receives the irradiation pattern 310 from the operation unit 114 to generate the DMD transmission data 320. The adjustment unit 203 further converts the DMD transmission data 320 by the inverse transformation matrix T 'to generate the DMD transmission data 321, and outputs the data to the spatial modulation control unit 204.

The spatial modulation control unit 204 then designates the DMD transmission data 321 as an input pattern to the DMD 106, and controls the DMD 106. That is, the adjustment unit 203 has a function of designating the DMD transmission data 321 as an input pattern to the DMD 106 via the spatial modulation control unit 204.

In the example shown in FIG. 6, similarly to FIG. 3, the transformation matrix T represents a transformation obtained by combining the movement in the positive direction of the x-axis and the rotation of about 15 ° in the counterclockwise direction. Therefore, in FIG. 6, the DMD transmission data 321 transformed by the inverse transformation matrix T 'rotates the pattern of the DMD transmission data 320 clockwise by about 15 ° and moves in the negative direction of the x-axis. to be.

Here, when the selector 206 of FIG. 2 selects the laser oscillator 103 as the light source, the laser light is emitted from the laser oscillator 103. The laser beam is irradiated onto the workpiece 102 via the DMD 106 in which the data for transmission DMD 321 is designated as an input pattern. In this embodiment, the CCD camera 112 picks up the workpiece 102, and the adjusting unit 203 receives an image from the CCD camera 112. The image thus received is the live image 331 of FIG. 6.

As shown in FIG. 6, the output pattern shown in the live image 331 is the same pattern as the irradiation pattern 310 because the deformation by the inverse transformation matrix T 'and the deformation by the transformation matrix T cancel each other. In addition, "the output pattern on the live image 331 and the irradiation pattern 310 are the same" is exactly the same as "ignoring the error by the difference between the mathematical model and the conversion which actually occurs," It means. In the following descriptions, the term "identical" is used in this sense unless otherwise specified.

The fact that the output pattern on the live image 331 is the same as that of the irradiation pattern 310 means that the laser beam is precisely irradiated into the shape to be processed at the position to be processed by the adjustment by the adjustment unit 203. It means that the image was captured as the live image 331.

As can be seen from comparing the DMD transmission data 320 and 321, the white portion indicating that the micromirror should be turned on as a result of the conversion by the inverse transformation matrix T 'is the DMD transmission data 321. )

u <0 or 640≤u or v <0 or 480≤v

There is a possibility to exceed the range of. Therefore, in the present embodiment, the DMD 106 having more (e.g., 800x600) micromirrors than the number of pixels (e.g., 640x480 pixels) of the image representing the irradiation pattern 310 is Used. In this case, as shown in FIG. 3 or FIG. 6, the image showing the DMD transmission data 320 which is the input pattern designated to the DMD 106 is black (that is, the periphery of the image showing the irradiation pattern 310). The image surrounded by margins, indicating not to irradiate light.

Here, the transformation matrix T shows the influence of the nonuniformity and the deviation which exist in the laser processing apparatus 100. In addition, such a nonuniformity and a deviation fall in the range allowable by the specification of the laser processing apparatus 100. FIG. Therefore, the degree of deformation by the transformation matrix T is not extremely large. In other words, you do not need an extremely large margin. For example, the amount of margin required for experimentation may be estimated, and the number of minute mirrors required for the DMD 106 may be determined according to the estimated amount of margin.

Next, the second embodiment and the third embodiment will be described with reference to FIGS. 7 to 11. In the second embodiment and the third embodiment, the adjustment method for adjusting the irradiation of the laser light after acquiring the conversion parameters, that is, the operation of the adjustment unit 203 is different from the first embodiment. Since there are various adjustment methods for canceling the conversion indicated by the conversion parameters, it is preferable to adopt an appropriate adjustment method according to the embodiment.

FIG. 7 is a view for explaining an example of conversion from an input pattern to an output pattern as a premise for explaining the adjustment method in the second embodiment and the third embodiment. FIG. Although the contents of FIG. 7 are similar to those of FIG. 3, for convenience of description, the illustrated method is different from FIGS. 3 and 7.

Incidentally, in the second and third embodiments, as shown in FIGS. 8 and 10, the configuration of the control unit 113 is partially different from the configuration of FIG. 2 in the first embodiment, but with respect to FIG. 7. There is no influence by the difference from FIG.

The image 300 of FIG. 7 is an image which the CCD camera 112 image | photographed the to-be-processed object 102 mounted in the stage 101 in the state which only the illumination light from the illumination light source 111 was irradiated. In the example of FIG. 7, three linear circuit patterns exist on the workpiece 102.

When the image 300 is received by the take-up part 201 and output to the monitor 115, an operator designates a process target range via the operation part 114. FIG. The specified range is a range of rectangles painted with the image 300 points.

The spatial modulation control unit 204 receives the designation from the operation unit 114, and generates the irradiation pattern 311 based on the designation. As for the image which shows the irradiation pattern 311, the range of the rectangle designated on the image 300 is white, and the others are black images. Although not shown, the input pattern assigned to the DMD 106 corresponding to the irradiation pattern 311 can be represented by an image surrounding only the irradiation pattern 311 with only black margins. The spatial modulation control unit 204 also generates an input pattern to the DMD 106 corresponding to the irradiation pattern 311.

If the laser light spatially modulated by the DMD 106 is irradiated onto the workpiece 102 according to the instruction of the input pattern corresponding to the irradiation pattern 311, the workpiece 102 is transferred to the CCD camera 112. By imaging, the live image 332 can be obtained. In the example of FIG. 7, the range in which the laser light is actually irradiated in the live image 332 is a range of rectangles filled with dots, and is different from the range to be processed for the image 300.

When the image 300 and the live image 332 are compared, the position, direction, and shape of the circuit pattern are the same. However, it can be seen that the laser beam is irradiated in a pattern different from the input pattern designated in the image 300 and given to the DMD 106. The conversion of the output pattern from this input pattern is represented by the transformation matrix T. In addition, although the same letter "T" is used in FIGS. 3 and 7, specific values of individual elements of the transformation matrix T are different in FIGS. 3 and 7. In FIG. 7, for the sake of simplicity, the case where the transformation matrix T represents a rotation of about 30 ° in the counterclockwise direction centering around the center of the live image 332 is shown.

As mentioned above, on the premise that it demonstrated with reference to FIG. 7, a 2nd Example is demonstrated with reference to FIG. 8 and FIG.

8 is a functional block diagram showing the functions of the control unit 113 in the second embodiment. Compared with FIG. 2 showing the first embodiment, the control unit 113 includes the blowing unit 201, the calculating unit 202, the adjusting unit 203, the spatial modulation control unit 204, the stage control unit 205 and the selection unit ( 8 is the same as FIG. 2 in that 206 is provided.

The difference from FIG. 2 in FIG. 8 is the flow of data and / or control indicated by arrows. That is, since the adjustment method is different in the first embodiment and the second embodiment, the arrow directed toward the adjustment unit 203 and the arrow exiting from the adjustment unit 203 are different in FIGS. 2 and 8. The meaning of the arrow in FIG. 8 becomes clear from the adjustment method demonstrated below with reference to FIG.

9 is a view for explaining an adjustment method in the second embodiment.

As the stage control unit 205 shown in FIG. 8 controls the movement of the stage 101, the relative position between the optical system of the laser processing apparatus 100 and the stage 101 changes. The type of movement of the controllable stage 101 may be different depending on the embodiment, but in the second embodiment, the stage control unit 205 controls the movement of the following kinds of stages 101.

(a) vertical movement

(b) translation in a plane parallel to the vertical axis

(c) rotation in a plane parallel to the vertical axis

(d) a movement for changing the angle formed between the upper surface of the stage 101 and the vertical axis

That is, in the second embodiment, a drive motor and / or actuator (not shown) that enable these kinds of movements are mounted on the stage 101. The stage control unit 205 controls the drive motor and / or actuator to move the stage 101.

In the second embodiment, the workpiece 102 is fixed on the stage 101 with a stopper or the like as necessary, and even if the stage 101 is inclined by the movement of (d), Workpiece 102 does not slip and fall off.

In such a configuration, the calculation unit 202 outputs the data of the conversion matrix T already calculated and stored in the storage device to the adjustment unit 203. And the adjustment part 203 instructs the stage control part 205 to control the movement of the stage 101 based on the conversion matrix T. FIG. The stage control unit 205 moves the stage 101 in accordance with an instruction from the adjustment unit 203. As a result of this control, the relative position of the optical system of the laser processing apparatus 100 and the to-be-processed object 102 also changes with conversion matrix T. As shown in FIG.

At this point, for convenience of explanation, it is assumed that the CCD camera 112 captures the workpiece 102. Then, as shown in FIG. 9, the image 301 equivalent to the image in which the image 300 was transformed by the transformation matrix T is imaged. In FIG. 9, by the comparison of the circuit pattern on the workpiece 102 picked up in the images 300 and 301, respectively, deformation by the transformation matrix T can be visually confirmed.

On the other hand, the irradiation pattern 311 is specified based on the image 300 as described with reference to FIG. 7. Then, the spatial modulation control unit 204 designates the input pattern to the DMD 106 based on the designated irradiation pattern 311. Then, the selection unit 206 selects the laser oscillator 103 as the light source.

Then, the laser beam irradiated from the laser oscillator 103 is irradiated on the to-be-processed object 102 under the influence of the shift | offset | difference and the nonuniformity represented by the conversion matrix T. FIG. However, unlike the case of FIG. 7, in the second embodiment, as shown in the image 301, the state after the movement corresponding to the workpiece 102 itself or the transformation matrix T is performed at the time when the laser light is irradiated. . In this way, since the irradiated laser light and the workpiece 102 are both affected by the same conversion matrix T, the influence by the conversion matrix T is canceled out. That is, as a result of the adjustment, the laser beam is irradiated to the designated area accurately.

This is illustrated in FIG. 9 as follows. In the live image 333 in which the CCD camera 112 picks up the workpiece 102 in the state where the laser light is irradiated, the range where the laser light is actually irradiated is indicated by dots. In addition, when the image 300 and the live image 333 are compared, the directions of the lines of the three circuit patterns and the portions imprinted on the images are different, but the relative relationship between the lines of the three circuit patterns and the areas painted with the network is the same. In other words, the laser beam is precisely irradiated to the designated desired area.

As is apparent from the above description, in the second embodiment, the processing of step S107 of Fig. 5 can be omitted.

And the value of the control parameter required in order to move the stage 101 according to the conversion matrix T may be experimentally determined, and may be calculated by the specification of the laser processing apparatus 100, etc. As shown in FIG.

For example, about the movement of said (a), the value of the enlargement ratio or reduction ratio in the image image | photographed by CCD camera 112 when the stage 101 is moved 1 mm up or down along a vertical axis | shaft. May be experimentally reviewed in advance. The adjusting unit 203 calculates the amount of movement in the vertical direction from the factors of enlargement or reduction included in the transformation matrix T based on the values examined in advance, and uses the calculated amount of movement as the control parameter of the stage 101 to control the stage control unit 205. ) May be output. Similarly with respect to the motions of (b) to (d), the adjustment unit 203 can acquire the value of the control parameter.

In addition, although apparent from the above description, the adjustment method of the second embodiment is suitable when the mechanical precision of the mechanism for moving the stage 101 is high.

Next, with reference to FIG. 10 and FIG. 11, the adjustment method in a 3rd Example is demonstrated. In the third embodiment, the adjusting unit 203 adjusts by image processing.

10 is a functional block diagram showing the functions of the control unit 113 in the third embodiment. Compared with FIG. 2 showing the first embodiment, the control unit 113 includes the blowing unit 201, the calculating unit 202, the adjusting unit 203, the spatial modulation control unit 204, the stage control unit 205 and the selection unit ( 10 is the same as FIG. 2 in that 206 is provided.

The difference from FIG. 2 in FIG. 10 is the flow of data and / or control indicated by arrows. That is, since the adjustment method is different in the first embodiment and the third embodiment, the arrow directed toward the adjustment unit 203 and the arrow exiting from the adjustment unit 203 are different in FIGS. 2 and 10.

In addition, although FIG. 2 has an arrow from the taking-in part 201 to the monitor 115 which shows that the image read out from the CCD camera 112 is output to the monitor 115 in order to designate an irradiation pattern, FIG. There is not. As described below, in the third embodiment, the adjustment is performed from the step of specifying the irradiation pattern. The meanings of the other arrows also become apparent from the adjustment method described below with reference to FIG.

11 is a view for explaining an adjustment method in the third embodiment.

In FIG. 11, the image 302 is an image picked up by the CCD camera 112, and the take-up part 201 receives from the CCD camera 112. The lines of three circuit patterns similar to the image 300 of FIG. 7 or FIG. 10 are also imprinted on the image 302.

In the adjustment in the third embodiment, first, the calculation unit 202 outputs the data of the inverse transformation matrix T 'that is already calculated and stored in the storage device to the adjustment unit 203. Then, the adjusting unit 203 deforms the image 302 by the inverse transformation matrix T 'to perform image processing to generate the image 303, and outputs the image 303 to the monitor 115.

Also in FIG. 11 as in FIG. 7, the transformation matrix T represents a rotation of about 30 ° in the counterclockwise direction. Therefore, in the image 303, the lines of the three circuit patterns are inclined approximately 30 ° clockwise as compared with the image 302.

The operator looks at the image 303 displayed on the monitor 115, and designates the area to which the laser beam should be irradiated through the operation unit 114. In the image 304 of FIG. 11, the designated area is shown with the dot. The spatial modulation control unit 204 receives a designation from the operation unit 114, and generates the irradiation pattern 312 based on this designation. The irradiation pattern 312 corresponds to the area shaded by the points of the image 304.

The spatial modulation control unit 204 further generates an input pattern designated to the DMD 106 based on the irradiation pattern 312. The spatial modulation control unit 204 then assigns an input pattern to the DMDl 06. In addition, the selection unit 206 selects the laser oscillator 103 as a light source.

Then, the laser beam irradiated from the laser oscillator 103 is irradiated on the to-be-processed object 102 under the influence of the shift | offset | difference and the nonuniformity represented by the conversion matrix T. FIG. However, when the laser light is irradiated based on the irradiation pattern 312 designated on the basis of the image 304 deformed by the inverse transformation matrix T ', and this irradiation is affected by the transformation matrix T, the inverse transformation matrix T' The influence and the influence by the transformation matrix T cancel out. That is, as a result of the adjustment, the laser beam is irradiated to the designated desired area accurately.

This is illustrated in FIG. 11 as follows. In the live image 334 in which the CCD camera 112 picks up the workpiece 102 in the state where the laser light is irradiated, the range in which the laser light is actually irradiated is indicated by dots. When the image 304 and the live image 334 are compared, the directions of the lines of the three circuit patterns and the portions imprinted on the images are different, but the relative relationship between the lines of the three circuit patterns and the areas painted with dots is the same. That is, the laser beam is irradiated to the designated desired area correctly.

As mentioned above, although the case where the transformation matrix T shows the comparatively simple deformation | transformation was demonstrated and demonstrated about the 2nd Example and 3rd Example, the deformation by the transformation matrix T is parallel movement, rotation, shear deformation, and expansion. Or it could be a complex variant that includes all of the reductions.

Next, the fourth to sixth embodiments will be described. In the fourth to sixth embodiments, the mathematical model of the conversion from the input pattern to the output pattern is different from the first embodiment, except that the operation of the control unit 113 differs depending on the difference in the mathematical model. It is similar to the Example. Which mathematical model is preferable to be employed depends on the characteristics and degree of nonuniformity or misalignment in the actual laser processing apparatus 100.

In the fourth embodiment, a mathematical model in which only parallel movement (shift) and rotation are considered is adopted. The calibration pattern of the fourth embodiment only needs to be able to represent two points a and b that can be distinguished from each other. For example, in the fourth embodiment, a pattern composed of two circles having different diameters may be used instead of the calibration pattern 340 of FIG.

As in the first embodiment,

Set the coordinate of point a to (x _a , y _a ) ^T

Set the coordinates of point b to (x _b , y _b ) ^T

Coordinates of point a '(x _a ', y _a ') ^T

Coordinates of point b '(x _b ', y _b ') ^T

It is represented by the column vector to be. In the fourth embodiment, the calculating unit 202 uses these four coordinates,

The amount of translation in the x direction:

[Equation 18]

d ₁ = x _a '-x _a

The amount of translation in the y direction:

[Equation 19]

d ₂ = y _a '-y _a

Turnover:

[Equation 20]

θ = tan ^-1 {(y _b '-y _a ') / (x _b '-x _a ')}-tan ^-1 {(y _b -y _a ) / (x _b -x _a )}

Three conversion parameters are calculated. These transformation parameters can also be expressed in the form of the transformation matrix T of the expression 2 as in the first embodiment. In other words,

Formula 21

a ₁ = cosθ

Formula 22

b ₁ = -sinθ

Formula 23

a ₂ = sinθ

Formula 24

b ₂ = cosθ

Substituting into Equation 2 and In this manner, the operation of the laser processing apparatus 100 after the calculation unit 202 calculates the conversion matrix T is similar to that of the first embodiment.

In the fifth embodiment, a mathematical model in which only parallel movement (shift) is considered is adopted. The calibration pattern of the fifth embodiment only needs to represent one point a. For example, in the fifth embodiment, a pattern consisting of only one circle can be used instead of the calibration pattern 340 of FIG.

As in the first embodiment,

Set the coordinate of point a to (x _a , y _a ) ^T

Coordinates of point a '(x _a ', y _a ') ^T

Represented by the column vector to be In the fifth embodiment, the calculation unit 202 calculates, from these two coordinates, in the same manner as in the fourth embodiment, by the expressions 18 and 19, the parallel movements in both the d ₁ and y directions of the parallel movements in the x direction. Calculate two conversion parameters of both d ₂ . These transformation parameters can also be expressed in the form of the transformation matrix T of the expression 2 as in the first embodiment. In other words,

[Equation 25]

a ₁ = 1

Formula 26

b ₁ = 0

[Equation 27]

a ₂ = 0

[Equation 28]

b ₂ = 1

Substituting in Equation 2 In this manner, the operation of the laser processing apparatus 100 after the calculation unit 202 calculates the conversion matrix T is similar to that of the first embodiment.

In the sixth embodiment, pseudo affine transformation is employed as the mathematical model. In the pseudo affine transformation, trapezoidal deformation is also considered in addition to the parallelogram deformation (shear deformation) considered in the affine transformation. In the sixth embodiment, a calibration pattern indicating four points a, b, c, d that can be distinguished from each other is used. For example, in the sixth embodiment, a pattern consisting of four circles of different diameters may be used instead of the calibration pattern 340 of FIG.

As in the first embodiment,

Set the coordinate of point a to (x _a , y _a ) ^T

Set the coordinates of point b to (x _b , y _b ) ^T

Set the coordinates of point c to (x _c , y _c ) ^T

Coordinates of point a '(x _a ', y _a ') ^T

Coordinates of point b '(x _b ', y _b ') ^T

Coordinates of point c '(x _c ', y _c ') ^T

It is represented by the column vector to be. Likewise,

The coordinate of the point d (x _d , y _d ) ^T

Coordinates of point d '(x _d ', y _d ') ^T

It is represented by the column vector to be.

The pseudo affine transformation is modeled by equation 29.

Formula 29

The transformation matrix T is defined as in Equation 30.

Formula 30

Also, as in the first embodiment, using the coordinates of points a, b, c, d and points a ', b', c ', and d', matrices P and Q can be defined as in Equations 31 and 32. Can be.

Formula 31

Formula 32

Here, from the expression 29, the relationship between the four points a, b, c, d and the four points a ', b', c ', and d' can be represented by the following expression (33).

[Equation 33]

TP = Q

If the positions of the four points a, b, c, and d are appropriately selected, the matrix P becomes a regular matrix, and since the inverse matrix P ⁻¹ exists, equation 34 can be obtained from equation 33.

[Equation 34]

T = QP ^-1

Therefore, the calculation unit 202 can calculate the transformation matrix T from equation (34). The calculator 202 may also calculate an inverse transform matrix T 'from the transform matrix T.

As described in the first to sixth embodiments, the mathematical models of the conversion from the input pattern to the output pattern vary. As described above, the example in which at least the necessary number of points are indicated by the calibration pattern in order to calculate the conversion parameters in the adopted mathematical model has been described.

However, you may use the calibration pattern which shows more points. For example, similarly to the first to third embodiments, when the affine transformation is applied as a mathematical model, a correction pattern representing m points that can be distinguished from each other such that m≥4 may be used. In this case, for each i where 1 ≦ i ≦ m, as in Equation 35, for example, a _l , b _l , d _l , a ₂ , b ₂ , The calculation unit 202 may calculate the value of d ₂ .

Formula 35

(x _i ', y _i ', 1) ^T = T (x _i , y _i , 1) ^T

Here, (x _i , y _i ) ^T is a column vector indicating the coordinates of the i th point represented by the calibration pattern, and (x _i ', y _i ') ^T is the coordinate in the output pattern of this i th point. Is a column vector representing.

Next, a seventh embodiment will be described with reference to FIGS. 12 and 13. According to the seventh embodiment, even if the surface of the workpiece 102 has irregularities, the accuracy of the calibration does not deteriorate.

Generally, when a three-dimensional three-dimensional shape, ie, unevenness, is present on the surface of the workpiece 102, the accuracy of calibration may be lowered. This is because the shape of the output pattern corresponding to the calibration pattern may be skewed under the influence of the unevenness and the reflectance of the surface material.

For example, when the calibration pattern 340 of FIG. 4 is used, the contour of the circle which shows the point a may cross the uneven | corrugated part on the to-be-processed object 102 by chance. At this time, the shape representing the point a in the output pattern is skewed.

Therefore, the coordinate computed by the calculating part 202 as the position of the point a 'corresponding to the point a is the center coordinate of the nonuniform shape, and obviously contains an error. For example, the amount of error may be several pixels. In this case, since the transformation matrix T is calculated based on the coordinates containing the error, the accuracy of the calibration decreases. As a result, it becomes difficult to adjust to high precision.

For example, when the workpiece 102 is an FPD substrate, a laminated printed circuit board or the like, a three-dimensional circuit pattern is formed on the workpiece 102. The circuit pattern can be an obstacle that skews the shape when the calibration pattern is irradiated. Therefore, the precision of a correction may fall depending on the position to which a correction pattern is irradiated.

In order to prevent this problem and to calibrate with good precision, the margin area of the outer peripheral part of the board | substrate with which the circuit pattern is not formed or the board | substrate with which the circuit pattern is not formed may be used for a calibration. However, although details are mentioned later, it may be required to perform correction using the area | region of the process target of the actual to-be-processed object 102. FIG. According to the seventh embodiment, even in such a case, the deterioration of the accuracy of the calibration can be prevented.

12 is an example of an image picked up when the calibration pattern is irradiated in the seventh embodiment. The image 306 of FIG. 12 is an image which the CCD camera 112 image | photographed when the calibration pattern was irradiated on the board | substrate 401 which is the to-be-processed object 102. FIG. In the image 306, the circuit pattern 402 of the three-dimensional state formed on the board | substrate 401, and the circles 403, 404, 405 which comprise the output pattern corresponding to a calibration pattern are imprinted. In the image 306, since the circles 403, 404, and 405 do not all overlap the circuit pattern 402, the shape is not much skewed.

On the surface of the workpiece 102, if a flat portion having a relatively small unevenness is called a "background portion", the portion where the circuit pattern 402 is not formed in the substrate 401 is the background portion. By controlling the control unit 113 to irradiate the calibration pattern with the background portion, it is possible to prevent the deterioration of the calibration accuracy even if the surface of the workpiece 102 is uneven.

13 is a functional block diagram for explaining the functions of the control unit 113 in the seventh embodiment. 13 is different from FIG. 2 in that the creation unit 207 is added. The creation unit 207 creates a calibration pattern so that light is irradiated to the background portion of the workpiece 102 to avoid irregularities. Therefore, in the seventh embodiment, preliminary correction and preliminary adjustment are performed. Hereinafter, a pattern designated as an input pattern in preliminary calibration is referred to as a "preliminary calibration pattern".

Hereinafter, the operation of the laser processing apparatus 100 in the seventh embodiment will be described while comparing with the first embodiment.

First, the preparation unit 207 selects appropriate three points a to c, and creates a preliminary correction pattern having a shape in which points a to c can be distinguished from each other. Here, the coordinates of the points a to c are respectively

(x _a , y _a ) ^T and (x _b , y _b ) ^T and (x _c , y _c ) ^T

It is represented by the column vector to be. Then, preliminary calibration using this preliminary calibration pattern is performed.

That is, the selection unit 206 selects the LED light source 116 as a light source, the creation unit 207 outputs the preliminary calibration pattern to the spatial modulation control unit 204, and the space modulation control unit 204 outputs the preliminary calibration pattern. The DMD 106 is designated as an input pattern. Thereby, LED light irradiation according to a preliminary correction pattern is performed.

And the CCD camera 112 image | photographs the to-be-processed object 102 to which LED light was irradiated, and the taking-in part 201 receives an image.

The calculation unit 202 calculates the coordinates of the points a ', b', and c 'corresponding to the points a, b, and c on the output pattern generated on the image corresponding to the preliminary correction pattern. Each of the calculated coordinates,

(x _a ', y _a ) ^T and (x _b ', y _b ) ^T and (x _c ', y _c ) ^T

It is represented by the column vector to be. In addition, the coordinates of three points a, b, and c, which define the preliminary correction pattern, are output from the creation unit 207 to the calculation unit 202.

Here, by the same method as that in which the conversion matrix T is calculated in the first embodiment, the calculation unit 202,

(x _a , y _a ) ^T and (x _b , y _b ) ^T and (x _c , y _c ) ^T and

(x _a ', y _a ) ^T and (x _b ', y _b ) ^T and (x _c ', y _c ) ^T

The transformation matrix T ₁ is calculated on the basis of. In addition, the calculator 202 outputs the transformation matrix T ₁ to the generator 207.

Write unit 207 calculates a conversion inverse transformation matrix T ₁ '= T ₁ ^-1 of the matrix T _1. Alternatively, the calculator 202 may calculate the inverse transform matrix T ₁ ′ and output it to the creator 207.

The above process is a preliminary correction. In the preliminary correction, as described above, due to the unevenness on the workpiece 102, the error of the degree that cannot be ignored is calculated, the coordinates of the points a ', b', c ', the transformation matrix T ₁ , and In some cases, the inverse transformation matrix T ₁ ′ may be included. However, since the transformation matrix T ₁ is not much different from the transformation matrix to be finally obtained, it is effective enough to be used for preliminary adjustment.

Next, the CCD camera 112 captures the workpiece 102 that is only illuminated by the illumination light source 111 and is not irradiated with laser light or LED light. The taking-in unit 201 accepts the captured image (hereinafter referred to as "background detection image"), and the creation unit 207 performs background detection processing using the background detection image.

The background detection process is a process of detecting a region (hereinafter, referred to as a "background area") in which a background portion on the workpiece 102 is taken from the background detection image.

For example, the creation unit 207 applies a background detection image shading filter, removes an image of the unevenness (for example, a circuit pattern) on the workpiece 102 captured on the background detection image, and removes the background image. Acquire. The creating unit 207 calculates the difference between the pixel value in the background detection image and the pixel value in the background image for each pixel.

The absolute value of the difference is small in the background region, and the absolute value of the difference is large in the region where the irregularities on the workpiece 102 are stamped (hereinafter referred to as the "non-background region"). Thus, the creation unit 207 detects, for example, the area having a smaller absolute value of the difference than the predetermined threshold value as the background area.

In order to detect the background area, various image processing methods, such as edge extraction and feature point extraction, may be used in addition to the method of using the shadow filter as described above.

In addition, the creation unit 207 selects appropriate three points d ₁ , e ₁ , f ₁ belonging to the detected background region. 3 coordinates d ₁ , e ₁ , f ₁ ,

(x _d1 , y _d1 ) ^T and (x _e1 , y _e1 ) ^T and (x _f1 , y _f1 ) ^T

It is represented by the column vector to be.

Here, as the three points d ₁ , e ₁ , f ₁ , it is preferable to select a point located at a position far from the non-background area among the background areas. This is because it becomes easy to make a correction pattern in which light is not irradiated on the unevenness on the workpiece 102.

Next, the creation unit 207 transforms the coordinates of the three points d ₁ , e ₁ , f ₁ using the inverse transformation matrix T ₁ ′. The three points represented by the converted coordinates are called d, e, f. In the first embodiment, the adjusting unit 203 uses the inverse transform matrix T ₁ ′ from the processing and comparison of the DMD transmission data 320 shown in FIG. 6 to the inverse transform matrix T 'to obtain the DMD transmission data 321. It is understood that the process of obtaining the coordinates of d, e, and f by three points is a preliminary adjustment.

The creation unit 207 creates a calibration pattern that can distinguish the three points d, e, and f from each other based on the coordinates of the three points d, e, and f obtained by preliminary adjustment, and outputs them to the calculation unit 202. do. The coordinates of three points d, e, and f,

(x _d , y _d ) ^T and (x _e , y _e ) ^T and (x _f , y _f ) ^T

It is represented by the column vector to be. The calibration pattern is a pattern representing these three coordinates.

And the correction pattern in 7th Example is set based on the detected background area | region so that the range to which light is actually irradiated is included in a background part as much as possible, ie, so that light may not be irradiated as much as possible except the background part.

For example, when three points d, e, and f are represented by three circles of different diameters as shown in the calibration pattern 340 of FIG. 4, when an unnecessarily large diameter circle is used, the workpiece 102 may be placed on the workpiece 102. Light may be irradiated in a three-dimensional shape.

That is, in the image which image | photographed the to-be-processed object 102 in that state, the range to which the light was actually irradiated may overlap with the non-background area. Therefore, when employ | adopting the correction pattern which consists of three circles of different diameter, it is preferable that the creation part 207 determines the diameter of three circles according to the shape and position of a background area | region.

Similarly, in the case of employing the calibration patterns 341 or 342 of FIG. 4 or other types of calibration patterns, the creator 207 similarly adopts the calibration patterns so that the range where the light is actually irradiated is included in the background as much as possible. Write.

For example, the creation unit 207 may create a provisional pattern representing three points d1, e1, f1, and create a correction pattern based on the provisional pattern.

For example, the creation unit 207 creates a provisional pattern so that all the portions indicating the irradiation of light are included in the background area. In addition, the shape and position are determined by the creation unit 207 so that the potential pattern has a distance from the non-background area of the portion indicating the irradiation of light to be at least as large as possible.

As described above, although the transformation matrix T ₁ or the inverse transformation matrix T ₁ ′ may include an error, the transformation matrix T ₁ or the inverse transformation matrix T ₁ ′ is not much different from the transformation matrix to be finally obtained. Therefore, if the value of the threshold value is appropriate, when the pattern obtained by converting the temporary pattern into the inverse transformation matrix T ₁ ′ is used as the input pattern, it is expected that light is actually irradiated only on the background portion. Therefore, it is appropriate to use a pattern obtained by converting a tentative pattern into an inverse transformation matrix T ₁ ′ as a calibration pattern. Appropriate thresholds can be obtained, for example, by experiment.

Also, the shape in the tentative pattern may not be maintained in the calibration pattern. In this case, for example, if the point d1 is represented by the center of the circle, the point d in the calibration pattern is represented by a shape other than a circle, and there may be a problem in calculating the coordinates of the point d from the output pattern. However, for example, if the pattern represents the point d1 by the midpoint of one short line segment, the point e1 by the intersection of two short line segments, and the point f1 by the intersection of three short line segments, There is no problem even if the shape of is not maintained in the calibration pattern.

In any case, the creation unit 207 uses the inverse transformation matrix T ₁ ′ so that light is irradiated to only the background portion as much as possible, based on the three points d1, e1, f1 belonging to the background region, and the three points d, e, Create the calibration pattern defined by f. Processing after the calibration pattern has been created, that is, calibration and adjustment, is the same as in the first embodiment.

That is, the selection unit 206 selects the LED light source 116 as a light source, and the spatial modulation control unit 204 controls the DMD 106 based on the calibration pattern, so that the LED light is processed according to the calibration pattern ( 102). And the CCD camera 112 image | photographs the to-be-processed object 102 to which LED light was irradiated, and the taking-in part 201 receives an image.

When the correction pattern created as described above is irradiated, for example, as shown in FIG. 12, the portion to which light is irradiated is expected to be included in the background area in the received image. That is, the calibration pattern created as mentioned above is expected to prevent the fall of the precision of calibration.

The calculator 202 coordinates three points d ', e', and f 'respectively corresponding to the points d, e, and f from the output pattern generated corresponding to the calibration pattern on the received image.

(x _d ', y _d ') ^T and (x _e ', y _e ') ^T and (x _f ', y _f ') ^T

Calculate In addition, the calculation unit 202 performs the transformation matrix T ₂ and its inverse transformation matrix in the same manner as in the first embodiment from the coordinates of the points d, e, and f and the coordinates of the points d ', e', and f '. Calculate T ₂ '= T ₂ ^-1 . Correction ends by calculating the transformation matrix T ₂ and the inverse transformation matrix T ₂ ′.

After that, the adjustment unit 203 performs the same adjustment as in the first embodiment using the inverse transformation matrix T ₂ ′.

By the way, in 1st Example-7th Example mentioned above, LED light different from the laser beam for a process was used for calibration. The reason is that the workpiece 102 is not affected by irradiation of light for calibration.

Therefore, even if irradiated, the laser beam can be weakened to such an extent that the workpiece 102 is not affected. If the laser beam is light of a wavelength that can be picked up by the CCD camera 112, in another embodiment, the laser beam is corrected. You can also use In this case, the LED light source 116 and the half mirror 104 of FIG. 1 become unnecessary.

However, depending on the nature of the laser beam or the workpiece 102, it may not be possible to use the laser beam for calibration or to use the laser beam for calibration.

Therefore, when considering the effects of the light used for calibration and the light used for processing being different light from different light sources, the first to seventh embodiments described above have implicit assumptions. When the premises do not hold, there is room for more precise corrections.

This implicit premise is that the optical axis of the laser beam when the laser beam passes through the half mirror 104 and enters the mirror 105 in FIG. 1, and the LED light is reflected from the half mirror 104 to the mirror 105. It is assumed that the optical axes of the LED light at the time of incidence coincide. Or, even if the two do not coincide completely, it is assumed that there is only a slight misalignment that is negligible and there is no problem.

However, this tacit assumption cannot always be made. Therefore, in the eighth embodiment, when this assumption does not hold, due to the light source optical system composed of the laser oscillator 103, the half mirror 104, the mirror 105, and the LED light source 116 in FIG. Regarding the deformation that the output pattern receives, the correction amount is further refined as a correction target.

14 is a functional block diagram for explaining the functions of the control unit 113 in the eighth embodiment. 14 differs from FIG. 2 in that a second calculator 208 is added. The second calculator 208 corrects the misalignment between the optical axis of the LED light and the laser light.

In the eighth embodiment, the following mathematical model is adopted.

The conversion from the input pattern to the output pattern in the state where the LED light source 116 is selected as the light source is an affine transformation.

This transformation is represented by the transformation matrix T of the expression (2).

When the LED light source 116 is selected as the light source, the first output pattern corresponding to a certain input pattern is different from the second output pattern corresponding to the same input pattern while the laser oscillator 103 is selected as the light source. have. This shift is also modeled by the affine transformation.

The shift parameter representing the shift between the first output pattern and the second output pattern is represented by the transform matrix R shown in equation 36 in the same format as the transform matrix T. That is, the first output pattern is converted into the second output pattern by the transformation matrix R.

Formula 36

If no adjustment is made, the point at coordinates (x, y) ^T in the input pattern is converted to coordinates (x ", y") ^T in the output pattern when the laser oscillator 103 is selected as the light source. The relationship between these two coordinates is equation 37.

Formula 37

According to the mathematical model described above, in the eighth embodiment, the first calibration obtains the transformation matrix T and the inverse transformation matrix T ', the second calibration acquires the transformation matrix R and the inverse transformation matrix R' = R ^-1 , and the inverse transformation matrix. Adjustment using T 'and the inverse transformation matrix R' is performed.

The first correction for obtaining the transformation matrix T and the inverse transformation matrix T 'is the same as that of the first embodiment.

The second correction for obtaining the transform matrix R and the inverse transform matrix R 'is performed as follows. First, the second calculation unit 208 selects appropriate three points a, b, and c, and creates a calibration pattern that can distinguish the three points a, b, and c from each other. This calibration pattern may also be the same as the example of FIG. Hereinafter, in order to distinguish the calibration pattern in 2nd calibration from the calibration pattern in 1st calibration, it is called "test pattern."

The coordinates of three points a, b, and c,

(x _a , y _a ) ^T and (x _b , y _b ) ^T and (x _c , y _c ) ^T

It is represented by the column vector to be.

The second calculator 208 outputs the test pattern to the spatial modulation controller 204. And the DMD 106 is controlled by the spatial modulation control part 204 in the state in which the sample of the same kind as the to-be-processed object 102 is mounted on the stage 101, and irradiation of LED light based on a test pattern And irradiation with laser light is performed. The switching of the light source is performed by the selection unit 206. And the order of investigation is arbitrarily determined.

When the selection unit 206 selects the LED light source 116 as a light source, and the LED light is irradiated to the sample, the CCD camera 112 picks up the sample and the taking-in unit 201 receives the captured image. In the output pattern generated in the image corresponding to the test pattern, the points corresponding to the points a, b and c are called a ', b' and c ', and the coordinates of these three points a', b 'and c' are respectively

(x _a ', y _a ') ^T and (x _b ', y _b ') ^T and (x _c ', y _c ') ^T

It is represented by the column vector to be.

In addition, the selection unit 206 selects the laser oscillator 103 as a light source, when the laser light is irradiated onto the sample, the CCD camera 112 picks up the sample, and the receiving unit 201 receives the captured image. It is. In the output pattern generated in the image corresponding to the test pattern, the points corresponding to the points a, b and c are called a ", b", c ", and the coordinates of these three points a", b "and c" are respectively

(x _a ", y _a ") ^T and (x _b ", y _b ") ^T and (x _c ", y _c ") ^T

It is represented by the column vector to be.

In the first embodiment, the calculation unit 202 calculates the transformation matrix T from the matrix P and the matrix Q, and the second calculation unit 208 uses the three points a ', The transformation matrix R is calculated from the coordinates of b 'and c' and the coordinates of three points a ", b" and c ". The second calculation unit 208 calculates the inverse transformation matrix R 'from the transformation matrix R. By the above, 2nd calibration is complete | finished.

In the eighth embodiment, as in the first embodiment, the adjustment unit 203 converts the DMD transmission data, and the spatial modulation control unit 204 uses the converted DMD transmission data as an input pattern to perform the DMD. It is realized by controlling 106.

The adjusting unit 203 performs the transformation using the inverse transformation matrix T 'in the first embodiment, but performs the transformation using the matrix T' R 'of the inverse transformation matrix T' and the inverse transformation matrix R 'in the eighth embodiment. . It is confirmed as follows whether this laser beam was irradiated and processed correctly to a desired part by this conversion.

In the irradiation pattern specified by the operator from the operation unit 114 in the same manner as in the first embodiment, it is assumed that the point p of the coordinates (x _p1 , y _p1 ) ^T is included in the portion to be irradiated with light. As a result of the adjustment by the adjustment unit 203, in the input pattern that the spatial modulation control unit 204 instructs the DMD 106, the point p is converted into coordinates (x _p2 , y _p2 ) _T represented by the equation (38). .

Formula 38

(x _p2 , y _p2 , 1) ^T = T 'R' (x _p1 , y _p1 , 1) ^T

Here, when the laser oscillator 103 is selected as the light source, the coordinates of the points on the output pattern corresponding to the coordinates (x _p2 , y _p2 ) ^T in the input pattern are referred to as (x _p3 , y _p3 ) ^T. Then equation 39 is derived from equations 37 and 38.

Formula 39

(x _p3 , y _p3 , 1) ^T

= RT (x _p2 , y _p2 , 1) ^T

= RTT'R '(x _p1 , y _p1 , 1) ^T

= (x _p1 , y _p1 , 1) ^T

That is, as a result of the adjustment by the adjusting unit 203, the coordinate specified in the irradiation pattern that the laser light should be irradiated coincides with the coordinate on the output pattern indicating the position where the laser light is actually irradiated, and the laser light is irradiated accurately to the desired position It became.

Next, a ninth embodiment will be described. The ninth embodiment is an example in which the present invention is applied to a projector using a spatial modulation element. When adjusting the projection of light in a projector (lighting system) that spatially modulates light from a light source for projection with a spatial modulator such as a DMD and projects characters, symbols, pictures, images, etc. on walls and screens, Can be applied.

Due to the influence of misalignment and non-uniformity present in the optical system or the screen, light may not be projected to the shape as specified and the position as specified, and the movement, rotation, enlargement, reduction, non-uniformity, etc. may occur in the projected image. Thus, in the ninth embodiment, the projector described above includes an imaging section and a control section for imaging the screen. The imaging unit is, for example, a CCD camera. The control unit has the same functions as the intake unit 201, the calculation unit 202, the adjustment unit 203, and the spatial modulation control unit 204 in FIG. 2.

According to the projector comprised in this way, it can carry out calibration similarly to each Example mentioned above, and can perform the projection adjusted according to the result of calibration. In the ninth embodiment, the term "projection" is used because it is intended for a projector, but "projection" in the ninth embodiment of the present specification is equivalent to "irradiation" in the first to eighth embodiments. It means the same.

In addition, this invention is not limited to the above-mentioned embodiment, It can variously change. Some examples are described below.

The physical configuration of the laser processing apparatus 100 is not limited to the configuration illustrated in FIG. 1. For example, a transmissive spatial modulator using liquid crystal may be used instead of the DMD 106 which is a reflective spatial modulator. That is, the first light to be adjusted and irradiated, and the second light to be used for calibration to obtain data necessary for adjustment are spatially modulated with a spatial modulation element and irradiated onto the workpiece 102, and the workpiece 102 ), The specific configuration of the laser processing apparatus 100 may be different depending on the embodiment. In addition, a 1st light and a 2nd light may differ or may be the same.

In addition, for example, of each part shown in FIG. 2, only the spatial modulation control part 204, the stage control part 205, and the selection part 206 are mounted in the control part 113 of the laser processing apparatus 100 of FIG. 2 may be implemented by a computer external to the laser processing apparatus 100. The blowing unit 201, the calculating unit 202, and the adjusting unit 203 shown in FIG.

The adjustment method is also not limited to the above described example. For example, in the second embodiment, adjustment is made to cause the stage control unit 205 to move the stage 101 based on an instruction from the adjustment unit 203. In another embodiment, adjustment may be made by changing the position or angle of the DMD 106 instead of the stage 101.

That is, even if the actuator for changing an angle and a position is attached to DMD 106, and the structure which was modified so that the space modulation control part 204 also controls an actuator other than designation of an input pattern is employ | adopted in the structure of FIG. do. In this case, the adjustment unit 203 may instruct the spatial modulation control unit 204 to move the DMD 106 in accordance with the inverse transformation matrix T ', thereby performing the adjustment. By the movement of the DMD 106, the shot position of the laser light is shifted (shifted), rotated about a certain point, or the size or shape of the irradiated area is changed.

The plurality of embodiments described above can be arbitrarily combined as long as they do not contradict each other. For example, three or more embodiments may be combined as follows.

In the seventh embodiment of creating a calibration pattern that avoids irregularities on the workpiece 102,

A second calculation unit 208 similar to the eighth embodiment to be subjected to correction of the deviation of the optical axis of the laser light and the LED light,

Employing the pseudo affine transformation of the sixth example as a mathematical model,

Under the mathematical model, by the method similar to the eighth embodiment, the second calculation unit 208 calculates the transformation matrix R and the inverse transformation matrix R 'for considering the misalignment of the optical axes of the laser light and the LED light.

• The adjusting unit 203 adjusts the image for specifying the irradiation pattern in the same manner as in the third embodiment instead of adjusting the DMD transmission data to the spatial modulation control unit 204.

In addition, the timing for performing calibration varies depending on the embodiment. Therefore, in the description of each of the above-described embodiments, the timing of the calibration is not particularly mentioned except for the procedure of the adjustment after the calibration.

As an example of the first embodiment, the calibration may be performed only once when the laser processing apparatus 100 is used for the first time, and after that, the irradiation of the laser light may always be adjusted based on the same inverse transformation matrix T '. Or in order to respond to the change by the time progress of the laser processing apparatus 100, you may perform a calibration regularly.

Alternatively, one work may be calibrated once. Of course, when processing the several places of one to-be-processed object 102 with the laser processing apparatus 100, you may correct | amend every process object point.

For example, when the workpiece 102 is a large FPD substrate and the stage 101 is a floating stage using an air caster, the workpiece 102 may be bent. In this case, depending on the position of the object to be processed on the FPD substrate under the influence of the warpage, the object 102 and the optical system (for example, the objective lens 110) of the laser processing apparatus 100 are used. The distance is different.

Although the variation in the distance between the workpiece 102 and the optical system is very small, the magnification of the light irradiated through the DMD 106 and the magnitude of the deviation vary depending on the variation in the distance. Therefore, when the high precision adjustment which considered the influence of such a very small fluctuation | variation is calculated | required, you may correct | amend every process target object.

Moreover, the relationship between the area | region on the workpiece | work 102 with which a correction pattern is irradiated, and the area | region on the workpiece | work 102 with which the irradiation pattern adjusted for processing is irradiated also varies with an Example.

For example, the case where the to-be-processed object 102 is a board | substrate is demonstrated to an example. When performing calibration only once or periodically, it is preferable to perform calibration using arbitrary board | substrates of the same kind as the board | substrate of a process object.

When performing one calibration of one board | substrate, if a margin exists in the edge part of a board | substrate, you may use this margin for a calibration. That is, after the stage 101 is moved to the position where the LED light is irradiated to the margin, the control unit 113 performs the laser processing apparatus so as to perform the calibration and then irradiate the laser light adjusted according to the calibration result. You may control (100).

Alternatively, in the case where calibration is performed once or plural times with respect to one substrate, after the stage 101 is moved to the position where the laser beam is irradiated to the processing target point, the control unit 113 performs the laser processing apparatus so as to perform calibration. You may control (100). In this case, it is preferable to use LED light different from a laser beam for processing and a laser beam whose output is weakened so that the workpiece 102 may not be affected by the calibration.

In addition to this, the present invention can be modified in various ways. For example, the steps of the process shown in the flowchart of FIG. 5 can be changed in various ways.

For example, the process of step S102 and the process of step S103-step S105 can be performed independently and in parallel. Therefore, the processes of steps S103 to S105 may be executed simultaneously with the process of step S102, or the processes may be executed in the order of steps S103, S104, S105, and S102.

In addition, the same single calibration pattern may be used for multiple calibrations. In this case, the calculation unit 202 may store the calibration pattern in the storage device when the calibration pattern is created in step S10 of the first calibration. In step S101 of the second and subsequent calibrations, the calculation unit 202 may read the calibration pattern from the storage device.

In addition, a calibration pattern is created based on the coordinate of three points a, b, and c determined previously. Therefore, it is not necessary to acquire the coordinates of three points a, b, and c again in step S102, and step S102 can be omitted. That is, the calculation unit 202 may also store the coordinates of the three points a, b, and c together in the storage device when creating the calibration pattern, and read the coordinates of the three points from the storage device in step S106.

Also, as in the second embodiment, in the embodiment in which the inverse transformation matrix T 'is not used for adjustment, the last step S107 is unnecessary.

Although various embodiments have been described above, the effects common to the above embodiments will be described as follows.

Light may be irradiated onto the workpiece 102 in accordance with any calibration pattern using a spatial modulation element such as the DMD 106. That is, the positions of the plurality of points can be represented by one calibration pattern, and the calibration can be efficiently performed at once.

In addition, the mechanical movement of the optical system or the stage 101 and the irradiation of light need not be repeated for calibration. Thus, for example, the correction can be performed by excluding the influence of an error included in the operation of the actuator for mechanically moving the physical arrangement of the optical system.

Moreover, since the shape of a calibration pattern is arbitrary, it is easy to acquire the calibration pattern of an appropriate shape according to the property of the to-be-processed object 102 used for calibration. Here, "the property of the workpiece 102" refers to various properties such as a three-dimensional shape and a material. In addition, in order to acquire the correction pattern of an appropriate shape, you may select the appropriate correction pattern from the some correction pattern previously created and memorize | stored, or you may create an appropriate correction pattern on the spot.

For example, as described with respect to the seventh embodiment, in a region on the workpiece 102 to which light is to be irradiated in accordance with a certain calibration pattern, when there is a three-dimensional structure that skews the shape of the calibration pattern, the calibration pattern Is not recommended. In this case, it is preferable to use another calibration pattern that irradiates light away from the structure.

As in the seventh embodiment, even if no information is given in advance, a correction pattern of a suitable shape is in place so as to avoid a three-dimensional structure on the workpiece 102 based on the image picked up by the CCD camera 112. The creation unit 207 can also generate it.

Further, the seventh embodiment may be modified so as to perform preliminary calibration only when necessary without always performing preliminary calibration. For example, according to the seventh embodiment only when the calculation unit 202 detects a non-uniformity of an output pattern that is believed to be due to irregularities on the surface of the workpiece 102 during calibration, and the non-uniformity is detected. The calibration pattern may be set again.

Alternatively, in embodiments other than the seventh embodiment, the calculation unit 202 acquires information such as design data of the workpiece 102 in advance, extracts the range of the background portion from the design data, and provides light to the background portion. You may generate the calibration pattern which let it irradiate. In any case, since the calibration amount pattern is arbitrary, the preparation unit 207 or the calculation unit 202 can easily find the appropriate calibration pattern.

In addition, when the workpiece 102 is made from a plurality of materials having different reflectances of light, an appropriate correction pattern is obtained so that light is irradiated to avoid the area where a material having a low reflectance is used among the plurality of materials. You may use it. If it is based on an image or based on design data as in the seventh embodiment, an appropriate calibration pattern can be easily obtained.

In this way, even when the calibration is performed using the workpiece 102, which may lower the accuracy of the calibration, it is easy to obtain and use an appropriate calibration pattern according to the properties of the workpiece 102. Improvement can be aimed at.

In addition, in the conventional techniques described in Patent Literatures 1 to 3, the subject of calibration is limited, and for example, rotation, nonuniformity, or scale conversion may not be considered. However, in the embodiment of the present invention, calibration can be performed according to a mathematical model appropriately selected according to the required accuracy of calibration and the characteristics of the device to be calibrated (for example, the laser processing apparatus 100).

This is because various mathematical models can be employed compared to the prior art because the calibration pattern is arbitrary. Therefore, by employing a more precise mathematical model, various factors are taken into account, and more precise adjustment is performed.

The mathematical model for calibration may be other than the above-described example. For example, you may employ a mathematical model that is deformed differently by regions. That is, the image captured by the CCD camera 112 is divided into a plurality of regions, and the calculation unit 202 calculates the transformation matrix T and the inverse transformation matrix T 'for each region, and the adjusting unit based on the inverse transformation matrix T' different for each region. 203 may adjust.

1 is a schematic diagram showing the configuration of a laser processing apparatus in the first embodiment.

Fig. 2 is a functional block diagram showing the functions of the controller in the first embodiment.

It is a figure which illustrates the deformation | transformation of the irradiation pattern resulting from the shift | offset | difference and the nonuniformity which exist in a laser processing apparatus.

4 is a diagram illustrating an example of a calibration pattern.

Fig. 5 is a flowchart showing the calculating step of the conversion parameter in the first embodiment.

6 is a view for explaining an adjustment method in the first embodiment.

It is a figure explaining the example of the conversion from an input pattern to an output pattern.

8 is a functional block diagram showing the functions of the controller in the second embodiment.

9 is a view for explaining an adjustment method in the second embodiment.

Fig. 10 is a functional block diagram showing the functions of the controller in the third embodiment.

11 is a view for explaining an adjustment method in the third embodiment.

12 is an example of an image when the calibration pattern is irradiated in the seventh embodiment.

Fig. 13 is a functional block diagram showing the functions of the controller in the seventh embodiment.

Fig. 14 is a functional block diagram showing the functions of the controller in the eighth embodiment.

[Explanation of symbols on the main parts of the drawings]

100: laser processing apparatus 101: stage

102: workpiece 103: laser oscillator

104, 107, and 109: half mirror 105: mirror

106: DMD 108: imaging lens

110: objective lens 111: light source for illumination

112: CCD camera 113: control unit

114: control panel 115: monitor

116: LED light source 201: blowing in

202: calculating unit 203: adjusting unit

204: spatial modulation controller 205: stage controller

206: selection unit 207: creation unit

208: second output unit 300 to 304: image

310 to 312: irradiation pattern 320, 321: data for DMD transmission

330 to 334: live image 340 to 342: correction pattern

411: substrate 402: circuit pattern

403 to 405: Won

Claims (13)

An adjusting device for adjusting irradiation of an object on an object of space modulated by a spatial modulation element according to a designated input pattern, A taking-in part which receives an image which picked up the object to which the space-modulated light was irradiated by the said space modulation element, A calculation unit for calculating an output pattern generated corresponding to the input pattern on the image, a conversion parameter for converting the input pattern, and An adjusting unit that adjusts irradiation of light to the object according to a designated irradiation pattern based on the conversion parameter calculated by the calculating unit when the adjustment pattern is used as the input pattern Adjusting device comprising a. The method of claim 1, The conversion parameter is represented by a matrix The method of claim 1, And the adjustment unit calculates an inverse transform parameter indicating an inverse transform of the transform by the transform parameter and adjusts based on the inverse transform parameter. The method of claim 3, And the adjusting unit performs adjustment by designating a second irradiation pattern obtained by converting the irradiation pattern into the inverse conversion parameter as the input pattern. The method of claim 3, The adjusting unit adjusts by providing the second image as an image used to convert the first image photographing the object into the inverse transform parameter to obtain a second image, and to indicate a position for designating the irradiation pattern. Adjusting device. The method of claim 3, And the adjusting unit adjusts at least one of the position and the direction of the spatial modulation element based on the inverse transform parameter. The method of claim 1, And the adjusting unit adjusts at least one of the position and the direction of the object based on the conversion parameter. The method of claim 1, And a creation unit that creates the calibration pattern based on information on the surface of the object so that the light is irradiated to a background portion of the surface of the object when the calibration pattern is designated as the input pattern. The method of claim 8, The creation unit, A preliminary calibration pattern is designated as the input pattern, and a second conversion parameter is calculated in the calculator; Calculating a second inverse transform parameter representing an inverse transform of the transform represented by the second transform parameter, The correction amount pattern is created by using the second inverse transform parameter so as to detect a background area in which the background part is taken from a background detection image of the object image, and to irradiate light to the background part based on the background area. doing, Adjustment device. The method of claim 1, A selection unit for selecting one of the first light source and the second light source so that light emitted from one of the first light source and the second light source is incident on the spatial modulation element; When a test pattern is designated as the input pattern, the apparatus further includes a second calculator configured to calculate a misalignment parameter indicating a misalignment occurring in the output pattern depending on which one of the first light source and the second light source is selected. The selection unit selects the first light source as a light source of light to be irradiated according to the calibration pattern, In the state where the second light source is selected, the adjustment unit adjusts the irradiation of light according to the irradiation pattern from the second light source to the object based on both parameters of the conversion parameter and the misalignment parameter, Adjustment device. An optical system for guiding the laser light emitted from the laser light source onto the object, A spatial modulation element installed on the optical path to the object from the laser light source and spatially modulating the incident light; Including the said adjustment apparatus of Claim 1, According to the said irradiation pattern of Claim 1, using the said laser beam as light irradiated to the said object, The laser processing apparatus which processes the said object by adjusting the irradiation of the said laser beam with respect to the said target object by the said adjustment apparatus. Computer, According to the designated calibration pattern, the image which image | photographed the object to which the light which was spatially modulated by the space modulation element was irradiated is received, Calculating a pattern generated on the image corresponding to the correction pattern and a conversion parameter for converting the correction pattern; To adjust the irradiation of light to the object according to a designated irradiation pattern based on the conversion parameter Adjustment method. Accepting an image obtained by capturing an object to which light spatially modulated by the spatial modulation element is irradiated according to a designated calibration pattern; Calculating a pattern generated on the image corresponding to the correction pattern and a conversion parameter for converting the correction pattern; and Adjusting the irradiation of light onto the object according to a designated irradiation pattern based on the conversion parameter A computer-readable storage medium storing an adjustment program for causing a computer to run.

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